JPH11283288A - Method and device for pasting disk substrates - Google Patents
Method and device for pasting disk substratesInfo
- Publication number
- JPH11283288A JPH11283288A JP11017602A JP1760299A JPH11283288A JP H11283288 A JPH11283288 A JP H11283288A JP 11017602 A JP11017602 A JP 11017602A JP 1760299 A JP1760299 A JP 1760299A JP H11283288 A JPH11283288 A JP H11283288A
- Authority
- JP
- Japan
- Prior art keywords
- disk substrate
- adhesive sheet
- lower disk
- pressure
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1477—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
- B29C65/1483—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1429—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
- B29C65/1435—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5092—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like characterised by the tape handling mechanisms, e.g. using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
- B29C66/8362—Rollers, cylinders or drums moving relative to and tangentially to the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、ディスク基板の
貼り合わせ技術、更に詳しくは、粘着シートを使って2
枚のディスク基板を両者一体に貼り合わせる方法、及び
その方法を達成するための装置であって、粘着シート体
をディスク基板に貼り合わせる装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technology for laminating disk substrates,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for laminating two disk substrates together and an apparatus for achieving the method, and an apparatus for laminating an adhesive sheet body to a disk substrate.
【0002】[0002]
【従来の技術】近年、コンピュータ、取り分けパソコン
等の普及は目ざましく、それに使用する記憶媒体、特
に、記憶ディスクの容量は益々高密度化しており、その
種類も多くなってきている。記憶ディスクとしては、例
えば、磁気ディスク、光ディスク(例えば、CD−RO
M)、光磁気ディスク(例えば、MO)等があるが、そ
の中でも、最近、光ディスクの需要が増大している。2. Description of the Related Art In recent years, computers, especially personal computers, etc., have become remarkably widespread, and storage media used for them, particularly storage disks, have been increasing in density and type. As the storage disk, for example, a magnetic disk, an optical disk (for example, CD-RO
M), a magneto-optical disk (for example, MO) and the like. Among them, the demand for optical disks has recently been increasing.
【0003】DVDと呼ばれる光ディスクを例にとって
いうと、それを構成する単板であるディスク基板は、そ
の厚みが0.6mm、外形が120mm、その中心穴の
内径が15mm、と規格されている。このような薄いデ
ィスク基板一枚では、機械的強度が低く変形し易いこ
と、また記憶容量の点から、同じ厚み(0.6mm)の
ディスク基板を合体し貼り合わせて使用している。この
ように、DVDも含めて、一般に、高密度の光ディスク
は、単板ではなく上記のような合板構造として使用され
ることが多いので、その場合は、上ディスク基板と下デ
ィスク基板との相互の貼り合わせが当然必要となる。[0003] In the case of an optical disk called a DVD as an example, it is standardized that a single disk substrate constituting the DVD has a thickness of 0.6 mm, an outer diameter of 120 mm, and an inner diameter of a center hole of 15 mm. In such a thin disk substrate, disk substrates having the same thickness (0.6 mm) are combined and bonded in view of low mechanical strength and easy deformation and storage capacity. As described above, in general, high-density optical disks, including DVDs, are often used not as a single plate but as a plywood structure as described above. Of course is necessary.
【0004】単板を貼り合わせて一体化した光ディスク
にするために、次の一連の工程(step)が遂行され
る(図22参照)。 (1)載置台2Aに下ディスク基板D1を載置する工程 (2)下ディスク基板D1に紫外線硬化樹脂よりなる接
着剤Rを塗布する工程 (3)下ディスク基板D1の上に上ディスク基板D2を
載置して重ね合わせる工程 (4)載置台2Aを回転させて両ディスク基板D1,D
2の間に介在する接着剤Rを全体に延展する工程 (5)延展された紫外線硬化樹脂よりなる接着剤Rに紫
外線を照射してそれを硬化させる工程 以上の諸工程を経ることにより、2枚のディスク基板D
1,D2が貼り合わされ単独の一体となった光ディスク
が出来上がる。[0004] In order to form an integrated optical disk by laminating single plates, the following series of steps are performed (see FIG. 22). (1) Step of mounting lower disk substrate D1 on mounting table 2A (2) Step of applying adhesive R made of ultraviolet curable resin to lower disk substrate D1 (3) Upper disk substrate D2 on lower disk substrate D1 (4) Rotating the mounting table 2A to rotate both disk substrates D1 and D
(5) A step of irradiating ultraviolet rays to the spread adhesive R made of an ultraviolet curable resin to cure the adhesive R interposed therebetween. Disk substrates D
1 and D2 are bonded to each other to form a single integrated optical disk.
【0005】ところで、このような貼り合わせ方法は、
載置台を回転させることにより接着剤を広範囲に延展さ
せる方法を採用しているため、どうしても接着剤が遠心
力により外方に飛散する。そのため飛散によって周囲を
汚染したり、また接着剤が散逸して有効使用率が低下す
る。また、延展した接着剤の層の厚さが必ずしも均一に
ならないことがある。更にまた、接着剤を硬化するため
に紫外線を照射する工程が必要であることから、製造工
数が増え製造コストが嵩む。そのために上記のような接
着剤の延展工程を必要としない貼り合わせ方法、すなわ
ち、粘着剤を使った貼り合わせ方法が検討されている。[0005] By the way, such a bonding method is as follows.
Since the adhesive is spread over a wide area by rotating the mounting table, the adhesive is scattered outward by centrifugal force. For this reason, the surroundings are contaminated by the scattering, and the adhesive is dissipated, thereby lowering the effective use rate. Further, the thickness of the spread adhesive layer may not always be uniform. Further, since a step of irradiating ultraviolet rays is required to cure the adhesive, the number of manufacturing steps is increased and the manufacturing cost is increased. Therefore, a bonding method that does not require the adhesive spreading step as described above, that is, a bonding method using an adhesive is being studied.
【0006】この粘着剤による貼り合わせ方法において
は、貼り合わせようとする2枚のディスク基板のどちら
か一方に対して粘着剤を付着し、その後、他方のディス
ク基板をその上に重ねて貼り合わせる。一般に粘着剤
は、基材となるシートに付着された状態で使用される
が、その場合、シート基材に付与されているシート状の
粘着剤を一枚一枚人手により剥がしていき、下ディスク
基板の上に付着(転着)し直すことは、ディスク基板を
貼り合わせるうえで極めて効率が悪い。In this bonding method using an adhesive, an adhesive is attached to one of two disk substrates to be bonded, and then the other disk substrate is overlaid and bonded. . Generally, the pressure-sensitive adhesive is used in a state of being attached to a sheet serving as a base material. In this case, the sheet-shaped pressure-sensitive adhesive applied to the sheet base material is peeled off one by one by hand, and the lower disk is removed. Reattaching (transferring) onto the substrate is extremely inefficient in bonding the disk substrates.
【0007】その上、人手によると粘着剤と下ディスク
基板の間に空気の細かい気泡が入り易い。まして、ディ
スク基板の貼り合わせのラインに、このようなディスク
基板の表面に粘着剤を付着させる作業を組み込み、全体
としてシーケンス制御された一連の貼り合わせラインと
して構成するには、粘着剤の付着作業を、自動化しなけ
ればならない。つまり連続した貼り合わせラインにする
には、粘着剤をディスク基板に付着させる操作を自動化
することが必須条件である。In addition, manual air bubbles tend to enter manually between the adhesive and the lower disk substrate. Furthermore, the work of attaching an adhesive to the surface of such a disk substrate is incorporated into the bonding line of the disk substrate, and the adhesive bonding operation is performed in order to configure a series of bonding lines that are sequence-controlled as a whole. Must be automated. That is, in order to form a continuous bonding line, it is an essential condition to automate the operation of attaching the adhesive to the disk substrate.
【0008】[0008]
【発明が解決しようとする課題】本発明は、上記のよう
な問題点の解決を図ったものである。即ち、本発明の目
的は、ディスク基板の上に粘着剤を付与することが自動
化された、極めて効率のよい連続化された貼り合わせ方
法、及びそのための装置を提供することである。更に他
の目的は、このような粘着剤の付与に際して、空気が混
入しない貼り合わせ方法、及びそのための装置を提供す
ることである。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems. That is, an object of the present invention is to provide an extremely efficient continuous bonding method in which the application of an adhesive on a disk substrate is automated, and an apparatus therefor. Still another object is to provide a bonding method in which air is not mixed when applying such an adhesive, and an apparatus therefor.
【0009】[0009]
【課題を解決するための手段】しかして、本発明者等
は、このような課題に対して、鋭意研究を重ねた結果、
粘着シート体から剥離紙を剥離し、粘着剤の付着部分を
下にして下ディスク基板に対して圧接させることにより
連続的に粘着剤を付与することができることを見出し、
この知見によりこの発明を完成させたものである。Means for Solving the Problems The present inventors have conducted intensive studies on such problems, and as a result,
Peeling off the release paper from the pressure-sensitive adhesive sheet body, it has been found that the pressure-sensitive adhesive can be continuously applied by pressing against the lower disk substrate with the pressure-sensitive adhesive attached downward,
Based on this finding, the present invention has been completed.
【0010】即ち、本発明は、(1)、粘着シート体か
ら剥離紙を剥がし、剥離紙が剥がされた粘着シート体を
下ディスク基板の上方に位置決めし、前記粘着シート体
を圧接して下面の粘着剤を下ディスク基板表面に付着
(転着)させ、下ディスク基板に付着された粘着剤から
粘着シート体を剥離させた後、下ディスク基板の上に上
ディスク基板を載置し、下ディスク基板に対して上ディ
スク基板を押圧することにより両ディスク基板を貼り付
けるディスク基板の貼り合わせ方法に存する。That is, the present invention provides (1) peeling the release paper from the pressure-sensitive adhesive sheet, positioning the pressure-sensitive adhesive sheet from which the release paper has been peeled above the lower disk substrate, and pressing the pressure-sensitive adhesive sheet against the lower surface. Is adhered (transferred) to the surface of the lower disk substrate, and the adhesive sheet body is separated from the adhesive adhered to the lower disk substrate. Then, the upper disk substrate is placed on the lower disk substrate, The present invention resides in a method of bonding both disk substrates by pressing the upper disk substrate against the disk substrate.
【0011】そして、(2)、下記の1)〜6)の工程
よりなる、ディスク基板の貼り合わせ方法に存する。 1)粘着シート体から剥離紙を剥がす工程、 2)位置決め部材を使って下ディスク基板の上方に粘着
シート体の粘着剤部を位置決めする工程、 3)貼合わせ部材を下ディスク基板の一方端から他方端
に移動させることにより、前記剥離紙が剥がされた粘着
シート体を押圧して下面の粘着剤を下ディスク基板表面
に付着(転着)させる工程、 4)引き剥がし部材を使って下ディスク基板に付着され
た粘着剤から粘着シート体を剥離させる工程 5)下ディスク基板の上に上ディスク基板を載置する工
程、 6)下ディスク基板に対して上ディスク基板を押圧し
て、両者一体に貼り付ける工程、[0011] (2) A method of laminating a disk substrate comprising the following steps 1) to 6). 1) a step of peeling release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate using a positioning member; 3) a bonding member from one end of the lower disk substrate. A step of pressing the pressure-sensitive adhesive sheet body from which the release paper has been peeled off to cause the pressure-sensitive adhesive on the lower surface to adhere (transfer) to the surface of the lower disk substrate by moving to the other end; 4) a lower disk using a peeling member; 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and integrating the two. Process of pasting on
【0012】そしてまた、(3)、剥離紙を回収する工
程を更に有する上記(2)のディスク基板の貼り合わせ
方法に存する。The present invention also provides (3) the method of laminating a disk substrate according to the above (2), further comprising a step of collecting the release paper.
【0013】そしてまた、(4)、剥離紙の回収は、粘
着剤と剥離紙の付着力より大きい剥離紙に対する付着力
を有する接着テープを使って行う上記(3)のディスク
基板の貼り合わせ方法に存する。(4) The method of laminating a disk substrate according to (3) above, wherein the recovery of the release paper is performed using an adhesive and an adhesive tape having an adhesive force to the release paper which is larger than the adhesive force of the release paper. Exists.
【0014】そしてまた、(5)、上記(2)におい
て、工程2が、粘着シート体に弱い張力を与えた状態で
行われるディスク基板の貼り合わせ方法に存する。(5) In the above (2), the step 2 is a method of laminating a disk substrate, which is performed in a state where a low tension is applied to the pressure-sensitive adhesive sheet.
【0015】そしてまた、(6)、上記(2)におい
て、工程2が、位置決め部材である芯出しシャフトの先
端を粘着シート体の穴に挿入することにより行われる上
記(2)のディスク基板の貼り合わせ方法に存する。(6) In the above (2), in the step (2), the step 2 is performed by inserting the tip of a centering shaft as a positioning member into a hole of the adhesive sheet body. It depends on the bonding method.
【0016】そしてまた、(7)、上記(2)におい
て、工程2の下ディスク基板に対し前記粘着シート体を
僅かに傾斜して配置させるディスク基板の貼り合わせ方
法に存する。[0016] (7) In the above (2), the present invention resides in a method of bonding a disk substrate, wherein the pressure-sensitive adhesive sheet is slightly inclined with respect to the lower disk substrate in step 2.
【0017】そしてまた、(8)、上記(2)におい
て、工程3の貼合わせ部材が転動する貼合わせローラで
あるこディスク基板の貼り合わせ方法に存する。(8) In the above (2), the present invention resides in a method of bonding a disk substrate, wherein the bonding member in step 3 is a rolling roller that rolls.
【0018】そしてまた、(9)、上記(2)におい
て、工程4が、下ディスク基板の上方を横断移動する引
き剥がし部材により剥離を行うものであるディスク基板
の貼り合わせ方法に存する。(9) In the above (2), the step 4 is a method of laminating a disk substrate in which the peeling is performed by a peeling member which moves transversely above the lower disk substrate.
【0019】そしてまた、(10)、引き剥がし部材に
よって、粘着シート体をディスク基板上に接触しない状
態で僅かに間隙を保って支持しながら引き剥がすこと上
記(9)のディスク基板の貼り合わせ方法に存する。(10) The method for laminating a disk substrate according to the above (9), wherein the peeling member is peeled off while supporting the pressure-sensitive adhesive sheet body while keeping a small gap without contacting the disk substrate. Exists.
【0020】そしてまた、(11)、引き剥がし部材は
2又の支杆を持ちこの両支杆の間に粘着シート体を張架
するものである上記(9)のディスク基板の貼り合わせ
方法に存する。(11) The method for laminating a disk substrate according to the above (9), wherein the peeling member has a bifurcated rod and the adhesive sheet is stretched between the two rods. Exist.
【0021】そしてまた、(12)、引き剥がし部材は
下ディスク基板に対して鋭角の案内角で粘着シート体を
引き剥がしていく上記(9)のディスク基板の貼り合わ
せ方法に存する。Further, (12) the method for laminating a disk substrate according to the above (9), wherein the peeling member peels the adhesive sheet at an acute guide angle with respect to the lower disk substrate.
【0022】そしてまた、(13)、下記の1)〜6)
の工程よりなる、ディスク基板の貼り合わせ方法に存す
る。 1)粘着シート体から剥離紙を剥がす工程、 2)位置決め部材の先端を粘着シート体の穴に挿入する
ことにより下ディスク基板の上方に粘着シート体の粘着
剤部を位置決めする工程、 3)転動する貼合わせローラを下ディスク基板の一方端
から他方端に移動させることにより、前記剥離紙が剥が
された粘着シート体を押圧して下面の粘着剤を下ディス
ク基板表面に付着(転着)させる工程、 4)引き剥がし部材が粘着シート体をディスク基板上に
接触しない状態で僅かに間隙を保って支持し、該粘着シ
ート体を引き剥がすように横断移動して下ディスク基板
に付着された粘着剤から粘着シート体を剥離させる工程 5)下ディスク基板の上に上ディスク基板を載置する工
程、 6)下ディスク基板に対して上ディスク基板を押圧し
て、両者一体に貼り付ける工程、Also, (13), the following 1) to 6)
In the method of laminating the disk substrates. 1) a step of peeling the release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate by inserting the tip of a positioning member into a hole of the adhesive sheet body; By moving the moving laminating roller from one end of the lower disk substrate to the other end, the pressure-sensitive adhesive sheet body from which the release paper has been peeled is pressed, and the adhesive on the lower surface is attached (transferred) to the surface of the lower disk substrate. 4) The peeling member supports the pressure-sensitive adhesive sheet body with a slight gap in a state where the pressure-sensitive adhesive sheet body is not in contact with the disk substrate, and moves transversely to peel off the pressure-sensitive adhesive sheet body and adheres to the lower disk substrate. 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and Step of attaching to,
【0023】そしてまた、(14)、下ディスク基板D
1を載置する受け台2と、受け台より上方の一定の距離
位置に粘着シート体Sを張設する支持部材(テンション
ローラ)5A,5Bと、粘着シート体Sを位置決めする
芯出しシャフト3と、受け台2に載置された下ディスク
基板D1の一方の端から他方の端に移動しながら粘着シ
ート体Sを下ディスク基板D1に圧接して貼り付ける貼
り合わせローラ1と、下ディスク基板D1に貼り付けた
粘着シート体Sを下ディスク基板から引き剥がす引き剥
がし部材4とよりなるディスク基板に対する粘着シート
体Sの貼り合わせ装置に存する。(14) Lower disk substrate D
1, a supporting member (tension roller) 5A, 5B for stretching the adhesive sheet S at a predetermined distance above the receiving table, and a centering shaft 3 for positioning the adhesive sheet S. A laminating roller 1 for pressing the pressure-sensitive adhesive sheet S against the lower disk substrate D1 while moving the adhesive sheet body S from one end to the other end of the lower disk substrate D1 placed on the receiving table 2, and a lower disk substrate The adhesive sheet S attached to D1 is peeled off from the lower disk substrate.
【0024】そしてまた、(15)、芯出しシャフト3
は,受け台2のボス配設穴21に挿入される第2小径部
32と粘着シート体の穴Pに挿入される第1小径部31
と粘着シート体の裏面に接する大径部33を備える上記
(13)のディスク基板に対する粘着シート体Sの貼り
合わせ装置に存する。Also, (15) the centering shaft 3
Are the second small diameter portion 32 inserted into the boss arrangement hole 21 of the receiving stand 2 and the first small diameter portion 31 inserted into the hole P of the adhesive sheet body.
And the large-diameter portion 33 in contact with the back surface of the pressure-sensitive adhesive sheet body.
【0025】そしてまた、(16)、引き剥がし部材4
は、横移動と回転を行う基台41と該基台41の中心よ
り一定距離離れた位置に設けた先導支杆43及び角度規
制支杆42とよりなる上記(13)のディスク基板に対
する粘着シート体Sの貼り合わせ装置に存する。(16) The peeling member 4
Is a pressure-sensitive adhesive sheet for the disk substrate of the above (13), which comprises a base 41 which performs lateral movement and rotation, and a leading support rod 43 and an angle control support rod 42 provided at a fixed distance from the center of the base 41. It exists in the body S bonding apparatus.
【0026】そしてまた、(17)、引き剥がし部材4
の角度規制支杆42は、下ディスク基板D1に対して鋭
角の案内角αで粘着シート体Sを引き剥がしていく鋭角
部42Aを有する上記(16)のディスク基板に対する
粘着シート体Sの貼り合わせ装置に存する。(17) The peeling member 4
The angle regulating support rod 42 has an acute angle portion 42A for peeling off the adhesive sheet S at an acute guide angle α with respect to the lower disk substrate D1. Exists in the device.
【0027】[0027]
【作用】上記のような貼り合わせ方法を採用することに
より、粘着剤を下ディスク基板対して、連続的に且つ自
動的に付与することができ、効率のよい貼り合わせが可
能となる。また、気泡の発生しない貼り合わせが可能と
なる。By adopting the above-mentioned bonding method, the adhesive can be continuously and automatically applied to the lower disk substrate, and efficient bonding can be performed. Also, bonding without generating bubbles can be performed.
【0028】[0028]
【発明の実施の形態】本発明の粘着剤S2の貼り合わせ
方法において、粘着剤S2がディスク基板に付着される
までの工程を図1〜図9を基に説明する。その前にま
ず、本発明を遂行するのに用意された粘着シート体Sに
ついて説明する。粘着シート体Sは、長尺状のもので土
台となるキャリヤS1と、該キャリヤ(薄いポリエチレ
ン等の合成樹脂テープでできている)に付着された粘着
剤S2と、該粘着剤S2の表面に仮付着された剥離紙S
3よりなる(図1参照)。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of bonding an adhesive S2 according to the present invention, steps until the adhesive S2 is attached to a disk substrate will be described with reference to FIGS. First, the pressure-sensitive adhesive sheet S prepared for carrying out the present invention will be described. The pressure-sensitive adhesive sheet S has a long carrier S1 serving as a base, a pressure-sensitive adhesive S2 adhered to the carrier (made of thin synthetic resin tape such as polyethylene), and a surface of the pressure-sensitive adhesive S2. Release paper S temporarily attached
3 (see FIG. 1).
【0029】ここで図20(A)は、粘着シート体Sの
正面図、図20(B)は側面図、また、図20(C)は
剥離紙S3を剥がした状態の側面図である。この粘着剤
S2は、後ほどに説明するように、ディスク基板同志を
合体させるための固着媒介となるもので、LP盤型(又
はドーナツ型)のシート状をしており(図21(A)参
照)、長尺状のキャリヤS1表面に一定の間隔をおいて
多数付着されている。粘着剤S2としては、例えば、ゴ
ム系粘着剤、アクリル系粘着剤、シリコーン系粘着剤、
ビニル系粘着剤等の感圧性の接着剤が採用される。FIG. 20 (A) is a front view of the pressure-sensitive adhesive sheet S, FIG. 20 (B) is a side view, and FIG. 20 (C) is a side view with the release paper S3 removed. As will be described later, the pressure-sensitive adhesive S2 serves as an adhesion medium for joining the disk substrates together, and is in the form of an LP board (or donut) sheet (see FIG. 21A). ), A large number of them are attached to the surface of the long carrier S1 at regular intervals. Examples of the adhesive S2 include a rubber-based adhesive, an acrylic-based adhesive, a silicone-based adhesive,
A pressure-sensitive adhesive such as a vinyl adhesive is used.
【0030】なお、粘着剤S2の層厚は、設計される光
ディスクの種類により最適な厚さのものを選択すること
ができる。剥離紙S3は、粘着剤S2の表面に仮付着さ
れて、この表面をカバーするもので、該粘着剤S2と同
じ形状をしている(図21(B)参照)。The thickness of the adhesive S2 can be selected to be optimal depending on the type of optical disk to be designed. The release paper S3 is temporarily attached to the surface of the adhesive S2 to cover the surface, and has the same shape as the adhesive S2 (see FIG. 21B).
【0031】粘着シート体Sは、製造する際、前記、キ
ャリヤS1、粘着剤S2、及び剥離紙S3を同時に貫通
する穴Pが設けられており、この穴Pが、後述するよう
な位置決め部材である芯出しシャフトを使った受け台2
に対する位置決めの時に利用される。なお、以下貼合わ
せローラ1と受け台2との間に供給される粘着シート体
Sは、粘着シート体Sからは剥離紙S3が取り除かれた
状態のものである。When the pressure-sensitive adhesive sheet S is manufactured, a hole P which penetrates the carrier S1, the pressure-sensitive adhesive S2, and the release paper S3 at the same time is provided. Cradle 2 using a certain centering shaft
It is used at the time of positioning with respect to. The adhesive sheet S supplied between the laminating roller 1 and the receiving table 2 is in a state where the release paper S3 has been removed from the adhesive sheet S.
【0032】次に、粘着剤S2が下ディスク基板D1に
付着される一連の流れを述べる。図1は、粘着剤S2の
付着方法、及び粘着シート体Sの貼り合わせ装置を示し
たもので、図のように、先ず、粘着シート体Sが供給ロ
ーラ8から開放されて繰り出されてくる。繰り出された
後は、例えばクリーニングローラ7により表面の塵等の
付着物が除去される。その後、ピッチ送りローラ6を通
って、テンションローラ5Aに送られる。テンションロ
ーラ5Aを通過した粘着シート体Sは、その後、受け台
2と貼り合わせ部材である貼合わせローラ1との間を通
って下流のテンションローラ5Bに渡される。ここで、
受け台は、回転テーブルTの上に設置されているもの
で、該回転テーブルの回転移動により、前もって芯出し
シャフト3の真下に移送されている。Next, a series of flows in which the adhesive S2 is attached to the lower disk substrate D1 will be described. FIG. 1 shows a method of attaching the pressure-sensitive adhesive S2 and a device for bonding the pressure-sensitive adhesive sheet S. First, as shown in the figure, the pressure-sensitive adhesive sheet S is released from the supply roller 8 and fed out. After being fed out, for example, the cleaning roller 7 removes attached matter such as dust on the surface. Thereafter, the paper is sent to the tension roller 5A through the pitch feed roller 6. The pressure-sensitive adhesive sheet S that has passed through the tension roller 5A is then passed to the downstream tension roller 5B through a space between the receiving table 2 and the bonding roller 1 as a bonding member. here,
The cradle is installed on the rotary table T, and has been transferred to immediately below the centering shaft 3 in advance by the rotational movement of the rotary table.
【0033】なお、受け台2には、既に下ディスク基板
D1が載置されている。粘着シート体Sは、この受け台
2と貼合わせローラ1との間で圧接力を受け、後述する
ように、支持部材であるテンションローラ5Aとテンシ
ョンローラ5Bとで張設された状態で受け台2の上に載
置された下ディスク基板D1の表面に対して粘着剤S2
が付着されることになる。粘着剤S2の付着が終わった
後、粘着シート体Sは、テンションローラ5Bを通っ
て、送り出しローラ11に送られる。送り出しローラ1
1は、積極的に駆動することにより、粘着シート体Sを
必要時に移動することができる。送り出しローラ11か
ら送出された粘着シート体Sは、吊り下げローラ12を
介して、巻取りローラ13により巻き取られる。The lower disk substrate D1 has already been placed on the receiving table 2. The pressure-sensitive adhesive sheet body S receives a pressing force between the receiving base 2 and the laminating roller 1 and, as will be described later, is supported by a tension roller 5A and a tension roller 5B which are supporting members. The adhesive S2 is applied to the surface of the lower disk substrate D1 placed on
Will be attached. After the adhesion of the adhesive S2 is completed, the adhesive sheet S is sent to the delivery roller 11 through the tension roller 5B. Delivery roller 1
1 can move the pressure-sensitive adhesive sheet S when necessary by actively driving it. The pressure-sensitive adhesive sheet S sent from the delivery roller 11 is taken up by a take-up roller 13 via a suspension roller 12.
【0034】この吊り下げローラ12は、粘着シート体
Sに吊り下げられているもので、送り出しローラ11か
ら粘着シート体Sが送り出されると下降する。この下降
位置を検知器12Aにより読み取って、その検知信号に
より巻取りローラ12を回転させて一定量巻き取る。以
上のような流れで、粘着剤S2は、下ディスク基板D1
に付着されることになる。The suspension roller 12 is suspended from the adhesive sheet S, and descends when the adhesive sheet S is sent out from the delivery roller 11. The lowered position is read by the detector 12A, and the winding roller 12 is rotated by a detection signal to wind a predetermined amount. In the flow described above, the adhesive S2 is removed from the lower disk substrate D1.
Will be adhered to.
【0035】ところで、粘着シート体Sは、受け台2と
貼合わせローラ1との間では、下側に粘着剤S2が露出
してその表面から剥離紙S3を除去された状態で供給さ
れることは既に述べた。このように粘着シート体Sから
剥離紙S3を取り除く手段として接着テープLが使用さ
れる。この接着テープLの役割について言及すると、図
1に示すように、当初、供給ローラ8から繰り出された
粘着シート体Sは、下面に粘着剤S2が付着されてお
り、該粘着剤S2の表面には剥離紙S3が付与された状
態となっている。The pressure-sensitive adhesive sheet S is supplied between the cradle 2 and the bonding roller 1 in a state where the pressure-sensitive adhesive S2 is exposed to the lower side and the release paper S3 is removed from the surface. Has already been mentioned. As described above, the adhesive tape L is used as a means for removing the release paper S3 from the adhesive sheet S. Referring to the role of the adhesive tape L, as shown in FIG. 1, the adhesive sheet S initially fed from the supply roller 8 has an adhesive S2 attached to the lower surface, and the adhesive S2 Is in a state where the release paper S3 is applied.
【0036】一方、供出ローラ9から供給された接着テ
ープLは、接着剤付与面が裏側に向いており(すなわ
ち、上面に向いており)、案内ローラ81のところで、
該接着剤付与面が粘着シート体Sの剥離紙S3と、相対
して接触する。接着テープLと粘着シート体Sとは、以
後、案内ローラ81、クリーニングローラ7、ピッチ送
りローラ6、テンションローラ5A等を通過することに
より、互いに圧着される。その結果、接着テープLの接
着剤付与面が粘着シート体Sの剥離紙S3に接着する。On the other hand, the adhesive tape L supplied from the supply roller 9 has the adhesive application surface facing the back side (ie, facing the upper surface), and
The adhesive-applied surface comes into contact with the release paper S3 of the pressure-sensitive adhesive sheet S. Thereafter, the adhesive tape L and the pressure-sensitive adhesive sheet S are pressed against each other by passing through the guide roller 81, the cleaning roller 7, the pitch feed roller 6, the tension roller 5A, and the like. As a result, the adhesive-applied surface of the adhesive tape L adheres to the release paper S3 of the pressure-sensitive adhesive sheet S.
【0037】テンションローラ5Aを通過した後は、接
着テープLの接着力により粘着シート体Sから剥離紙S
3が剥がされる。そして剥離紙S3を受け取った接着テ
ープLが、巻取りローラ10により巻き取られることに
より、剥離紙S3は回収される。このように、剥離紙S
3が接着テープLを使って、粘着シート体Sより分離さ
れることにより回収されるのは、剥離紙S3と粘着剤S
2との付着力より、接着テープLと剥離紙S3との付着
力の方が大きいことを条件とする。After passing through the tension roller 5A, the release sheet S is separated from the adhesive sheet S by the adhesive force of the adhesive tape L.
3 is peeled off. Then, the adhesive tape L that has received the release paper S3 is taken up by the take-up roller 10, so that the release paper S3 is collected. Thus, the release paper S
3 is separated from the pressure-sensitive adhesive sheet S by using the adhesive tape L, and is collected by the release paper S3 and the pressure-sensitive adhesive S.
The condition is that the adhesive force between the adhesive tape L and the release paper S3 is larger than the adhesive force between the adhesive tape L and the release paper S3.
【0038】すなわち、接着テープLは、粘着剤に対す
る剥離紙の剥離強度より大なる剥離紙に対する接着強度
を有することが必要である。このようにして、テンショ
ンローラ5Aを通って受け台2と貼合わせローラ1との
間に供給された粘着シート体Sは、接着テープLにより
剥離紙S3が取り除かれ下面に粘着剤S2が露出した状
態となる。ここで、本発明で重要な機能を有する貼り合
わせ部材である貼合わせローラ1について簡単に言及す
ると、貼合わせローラ1は、下ディスク基板D1に粘着
シート体Sを押し付けて具体的に貼り合わせを行う機能
を有する。That is, the adhesive tape L needs to have an adhesive strength to the release paper that is greater than the peel strength of the release paper to the adhesive. In this manner, the adhesive sheet S supplied between the receiving table 2 and the bonding roller 1 through the tension roller 5A has the release paper S3 removed by the adhesive tape L and the adhesive S2 is exposed on the lower surface. State. Here, when the laminating roller 1 which is a laminating member having an important function in the present invention is briefly mentioned, the laminating roller 1 presses the pressure-sensitive adhesive sheet S against the lower disk substrate D1 to specifically laminate. It has a function to perform.
【0039】そのため、貼合わせローラ1は、外周部が
可撓性を有する材料の層で形成されており、また、内部
にはヒータが組み込まれて全体的な加熱調整が可能とな
っていることが好ましい。また貼合わせローラ1の幅
は、下ディスク基板D1より幾分、幅広に設計されてい
る。そして、貼合わせローラ1は、図示しない駆動装置
により下ディスク基板D1の上を押圧した状態で転動し
ながら平行移動することができ、下ディスク基板の表面
全体への粘着シート体Sの貼り合わせが終了した後は、
下ディスク基板D1より離れて元の位置に戻る。For this reason, the bonding roller 1 has an outer peripheral portion formed of a layer of a flexible material, and a heater is incorporated in the inside to enable overall heating adjustment. Is preferred. The width of the laminating roller 1 is designed to be somewhat wider than the lower disk substrate D1. The laminating roller 1 can translate while being rolled while being pressed on the lower disk substrate D1 by a driving device (not shown), and laminating the adhesive sheet S on the entire surface of the lower disk substrate. After the
It returns from the lower disk substrate D1 to its original position.
【0040】さて、粘着シート体Sは、その下面にLP
盤型(ドーナツ型)のシート状をした粘着剤S2が露出
した状態で、受け台2と貼合わせローラ1の上流及び下
流に配置された各テンションローラ5A及びテンション
ローラ5B間に支持される。この時、上流のテンション
ローラ5Aの下端を下流のテンションローラ5Bの下端
より幾分か高くすると、後述するように貼り合わせがよ
り良く行える。この点も技術的に重要な部分である。粘
着シート体Sが移送される場合は、この2つのテンショ
ンローラ5A,5Bによって支持された粘着シート体S
は、図1に示すように、送り出しローラ11の駆動によ
って粘着シート体Sに一定の張力を与えられて緊張した
状態で送られる。次に、粘着シート体Sが停止すると、
下流のテンションローラ5Bが僅かに動いて粘着シート
体Sには、張力が殆どかかってない状態(初期状態)と
なる。The pressure-sensitive adhesive sheet S has an LP on its lower surface.
In a state where the pressure-sensitive adhesive S2 in the form of a board (a donut) is exposed, the pressure-sensitive adhesive S2 is supported between the tension roller 5A and the tension roller 5B disposed upstream and downstream of the receiving table 2 and the laminating roller 1. At this time, if the lower end of the upstream tension roller 5A is slightly higher than the lower end of the downstream tension roller 5B, the lamination can be performed better as described later. This is also a technically important part. When the pressure-sensitive adhesive sheet S is transferred, the pressure-sensitive adhesive sheet S supported by the two tension rollers 5A and 5B is set.
As shown in FIG. 1, a constant tension is applied to the adhesive sheet S by the driving of the feed roller 11, and the pressure-sensitive adhesive sheet S is fed in a tensioned state. Next, when the adhesive sheet body S stops,
The tension roller 5B on the downstream side slightly moves, so that the pressure-sensitive adhesive sheet S is in a state where almost no tension is applied (initial state).
【0041】次に、図3に示すように、位置決め部材で
ある芯出しシャフト3が下降して、その先端に設けられ
ている突出部(第1小径部31、第2小径部32)によ
り、粘着シート体Sの(詳しくは粘着剤部の)の下ディ
スク基板D1に対する位置決めが行われる。ところで、
芯出しシャフト3が下降して、その先の突出部が粘着シ
ート体Sの穴Pに入る瞬間に、上流のテンションローラ
5Aを僅かに後退させて、粘着シート体Sに少しく張力
を与える。尚、この時、下流のテンションローラ3Bは
元のままである。Next, as shown in FIG. 3, the centering shaft 3, which is a positioning member, is lowered, and the projecting portions (first small diameter portion 31, second small diameter portion 32) provided at the tip end thereof. The positioning of the pressure-sensitive adhesive sheet S with respect to the lower disk substrate D1 (specifically, of the pressure-sensitive adhesive portion) is performed. by the way,
At the moment when the centering shaft 3 is lowered and the protruding portion thereof enters the hole P of the pressure-sensitive adhesive sheet S, the tension roller 5A on the upstream side is slightly retracted to slightly apply tension to the pressure-sensitive adhesive sheet S. At this time, the tension roller 3B on the downstream side remains unchanged.
【0042】このように粘着シート体Sに僅かな張力を
与えることにより、該シート体が振れ動かず安定した状
態となるので、芯出しシャフト3の第1小径部31を的
確に粘着シート体Sの穴Pに挿入することができる。念
のため、芯出しシャフト3による位置決めについて更に
言及すると、先ず、芯出しシャフト3が下降すると、大
径部33の下端に設けた突出部(第小径部31)が、粘
着シート体Sの穴Pに挿入され、更に突出部の一部であ
る第2小径部が受け台2のボス配設穴21に嵌まり込む
(図10A参照)。この時、粘着シート体Sは、下ディ
スク基板D1とは同心化される。By applying a slight tension to the pressure-sensitive adhesive sheet S in this manner, the pressure-sensitive adhesive sheet S is stabilized without any swinging motion. Can be inserted into the hole P. To make sure, the positioning by the centering shaft 3 will be further described. First, when the centering shaft 3 is lowered, the projecting portion (the small-diameter portion 31) provided at the lower end of the large-diameter portion 33 becomes a hole of the adhesive sheet S. P, and a second small diameter portion which is a part of the protruding portion is fitted into the boss arrangement hole 21 of the receiving base 2 (see FIG. 10A). At this time, the adhesive sheet S is concentric with the lower disk substrate D1.
【0043】すなわち、芯出しシャフト3の先端の第1
小径部31が粘着シート体Sの穴Pに挿入され、更にそ
れより径の小さい第2小径部32が下ディスク基板D1
の中心穴Hに挿入され、且つボス配設穴21に嵌まり込
んだ状態となる。そのため、粘着シート体Sと下ディス
ク基板D1とは同心に位置決めされる。この時、粘着シ
ート体Sは、緊張しているため突出部の第1小径部31
の上端に位置し大径部33の下面に接する状態となって
いる。That is, the first end of the centering shaft 3
The small-diameter portion 31 is inserted into the hole P of the adhesive sheet S, and the second small-diameter portion 32 having a smaller diameter is further inserted into the lower disk substrate D1.
Is inserted into the center hole H and fitted into the boss arrangement hole 21. Therefore, the pressure-sensitive adhesive sheet S and the lower disk substrate D1 are positioned concentrically. At this time, since the pressure-sensitive adhesive sheet S is tensed, the first small diameter portion 31 of the protruding portion is formed.
And is in contact with the lower surface of the large diameter portion 33.
【0044】そのため、ディスク基板D1の表面には接
触することなく、粘着シート体Sの粘着剤部が下ディス
ク基板D1の真上に的確に位置決めされる。この時点
で、受け台2に設けられた図示しない小孔を通じての吸
引が行われ、下ディスク基板D1は、受け台2に位置決
めされたまま動かないように吸着保持される。また、上
流のテンションローラ5Aと下流のテンションローラ5
Bとの上下位置関係により、粘着シート体Sがやや傾斜
して配置されると、粘着シート体Sが傾斜状に緊張する
ため芯出しシャフト3の先端の第1小径部31が粘着シ
ート体Sの穴Pにより入り易い。Therefore, the pressure-sensitive adhesive portion of the pressure-sensitive adhesive sheet S is accurately positioned directly above the lower disk substrate D1 without contacting the surface of the disk substrate D1. At this time, suction is performed through a small hole (not shown) provided in the receiving table 2, and the lower disk substrate D 1 is suction-held so as not to move while being positioned on the receiving table 2. The upstream tension roller 5A and the downstream tension roller 5
When the pressure-sensitive adhesive sheet body S is arranged with a slight inclination due to the vertical positional relationship with the pressure-sensitive adhesive sheet B, the first small-diameter portion 31 at the tip end of the centering shaft 3 becomes tight because the pressure-sensitive adhesive sheet body S is inclined in an inclined manner. Hole P facilitates entry.
【0045】なお、受け台2に設けられたボス配設穴2
1について説明すると、この中には、図示しないボス体
が上下摺動可能に装備されている。そのため、図示しな
い前工程において、受け台2に下ディスク基板D1が載
置される際に、受け台上に、ボス体がその配設穴21か
ら突出状態となり、下ディスク基板D1の受け台に対す
る予備的位置決めが行われる。また、受け台2に下ディ
スク基板D1が載置された後は、ボス体は、ボス配置穴
21の奥に引っ込んで待機するため、受け台上での粘着
シート体Sの貼り合わせ操作を妨害することはない。The boss mounting hole 2 provided in the receiving table 2
In the first embodiment, a boss (not shown) is provided so as to be vertically slidable. Therefore, when the lower disk substrate D1 is placed on the receiving table 2 in a pre-process (not shown), the boss body protrudes from the mounting hole 21 on the receiving table, and the lower disk substrate D1 is placed on the receiving table. Preliminary positioning is performed. Further, after the lower disk substrate D1 is placed on the pedestal 2, the boss body is retracted into the boss arrangement hole 21 and stands by, so that the sticking operation of the adhesive sheet S on the pedestal is obstructed. I will not do it.
【0046】さて、次に、上方に待機していた貼合わせ
ローラ1が下降し、位置決めされた下ディスク基板D1
の一方端に接地する(図4参照)。この時点で、芯出し
シャフト3の役目は終了するので、速やかに上昇して元
の位置に戻る(図5参照)。Next, the laminating roller 1 which has been waiting above is lowered, and the positioned lower disk substrate D1 is positioned.
(See FIG. 4). At this point, the role of the centering shaft 3 ends, so that the shaft 3 quickly ascends and returns to the original position (see FIG. 5).
【0047】次に、図6に示すように、貼合わせローラ
1が下ディスク基板D1の上を(詳しくは下ディスク基
板上の粘着シート体Sの上を)、図の矢印方向に転動す
る。この転動作用により、下ディスク基板D1に対して
粘着シート体Sは押し付けられ、徐々に両者の接触面積
が拡大していく。最終的に、貼合わせローラ1が、下デ
ィスク基板D1の他方端を過ぎ去ると、粘着シート体S
が下ディスク基板D1の表面全体に完全に貼り付けられ
る。このような独特の圧接手法により、粘着シート体S
の下面に付着されている粘着剤S2が、空気泡等が混入
しない状態、また皺が発生しない状態で下ディスク基板
D1の表面に付着(いわゆる転着)されるのである。Next, as shown in FIG. 6, the laminating roller 1 rolls on the lower disk substrate D1 (specifically, on the adhesive sheet S on the lower disk substrate) in the direction of the arrow in the figure. . Due to this rolling operation, the pressure-sensitive adhesive sheet S is pressed against the lower disk substrate D1, and the contact area between the two gradually increases. Finally, when the bonding roller 1 has passed the other end of the lower disk substrate D1, the adhesive sheet S
Is completely stuck on the entire surface of the lower disk substrate D1. The pressure-sensitive adhesive sheet S
Is adhered (so-called transfer) to the surface of the lower disk substrate D1 in a state where air bubbles and the like are not mixed in and a state where no wrinkles are generated.
【0048】ここで、芯出しシャフト3と貼合わせロー
ラ1の作用を更に詳しく述べる。図10は、その作用を
説明した図である。図10(A)に示すように、粘着シ
ート体Sが位置決めされた状態では、芯出しシャフト3
の突出部(第2小径部32)が受け台2に嵌まり込み、
粘着シート体は、突出部の第1小径部31の上端に位置
することになる。すわなち粘着シート体Sは、芯出しシ
ャフト3の大径部33に接触した状態となる。また粘着
シート体Sには、少しく張力がかかっているため、粘着
シート体Sがディスク基板D1の表面には接触すること
はない点は既に述べた。Here, the operation of the centering shaft 3 and the bonding roller 1 will be described in more detail. FIG. 10 is a diagram illustrating the operation. As shown in FIG. 10A, in a state where the pressure-sensitive adhesive sheet S is positioned, the centering shaft 3
The protrusion (the second small-diameter portion 32) of the
The adhesive sheet body is located at the upper end of the first small diameter portion 31 of the protruding portion. That is, the pressure-sensitive adhesive sheet S comes into contact with the large-diameter portion 33 of the centering shaft 3. Also, as described above, since the adhesive sheet S is slightly tensioned, the adhesive sheet S does not come into contact with the surface of the disk substrate D1.
【0049】次に、図10(B)に示すように、貼合わ
せローラ1が、下降して下ディスク基板D1の一方端に
接地する。この時、粘着シート体Sの一部が下ディスク
基板D1の端部に圧着されるが、この時点で、芯出しシ
ャフト3による位置決めは完了しているので、芯出しシ
ャフト3の働きは終わり、速やかに下ディスク基板D1
を離れる。Next, as shown in FIG. 10B, the laminating roller 1 descends and grounds to one end of the lower disk substrate D1. At this time, a part of the pressure-sensitive adhesive sheet S is pressed against the end of the lower disk substrate D1. At this point, since the positioning by the centering shaft 3 has been completed, the function of the centering shaft 3 ends. Immediately lower disk substrate D1
Leave.
【0050】次に、図10(C)に示すように、貼合わ
せローラ1が、下ディスク基板D1に対して粘着シート
体を押圧しながらその上を転動する。そしてLP盤型
(又はドーナツ型)のシート状の粘着剤S2が、一方端
から他方端に向けて着領域が徐々に拡大するように下デ
ィスク基板D1に付着されて行くのである。この時、粘
着シート体Sは傾斜した状態で、空気を押し除くように
順次押し付けられて行くので、粘着剤S2と下ディスク
基板D1との間に空気泡等が入ることがなく、また皺も
起生しない。その結果、粘着剤S2は下ディスク基板D
1の表面に均一に付着される。以上が、作用説明であ
る。Next, as shown in FIG. 10C, the bonding roller 1 rolls on the lower disk substrate D1 while pressing the pressure-sensitive adhesive sheet against the lower disk substrate D1. Then, the LP disk type (or donut type) sheet-like adhesive S2 is attached to the lower disk substrate D1 such that the attachment area gradually increases from one end to the other end. At this time, since the pressure-sensitive adhesive sheet S is sequentially pressed so as to remove air in an inclined state, no air bubbles or the like enter between the pressure-sensitive adhesive S2 and the lower disk substrate D1, and wrinkles are not generated. Does not arise. As a result, the adhesive S2 is applied to the lower disk substrate D
1 is uniformly attached to the surface. The above is the description of the operation.
【0051】次に、図7に戻って説明すると、ディスク
基板D1に対して粘着シート体Sの付着が完全に終わ
り、図に示すように、貼合わせローラ1は上昇して元の
位置(二点鎖線の位置)に戻る。この時、粘着剤S2
は、粘着シート体Sと下ディスク基板D1の両方に付着
されている状態、すなわち、粘着剤S2が粘着シート体
SのキャリヤS1と下ディスク基板D1の表面の両面に
付着されている状態にある。Next, returning to FIG. 7, the adhesion of the pressure-sensitive adhesive sheet S to the disk substrate D1 is completely completed, and as shown in FIG. Return to the position indicated by the dotted line). At this time, the adhesive S2
Is a state in which the adhesive S2 is attached to both the carrier S1 of the adhesive sheet S and the lower disk substrate D1 on both surfaces of the adhesive sheet S and the lower disk substrate D1. .
【0052】次に、図8に示すように、受け台2の下流
側に位置していた引き剥がし部材である剥離部材4が、
受け台2に載置された下ディスク基板D1の上方を横断
するように移動する。下ディスク基板D1の表面と粘着
剤S2の粘着力が、キャリアS1と粘着剤S2の粘着力
より大きいために、このような剥離部材4の移動によ
り、粘着シート体Sと粘着剤S2(詳しくはキャリアS
1と粘着剤S2)とは、確実に引き剥がされていく。
尚、下ディスク基板D1は、先述したように、受け台2
に吸引保持されているので、引き剥がしは的確に行われ
る。Next, as shown in FIG. 8, the peeling member 4, which is a peeling member located downstream of the receiving table 2,
It moves so as to cross over the lower disk substrate D1 placed on the receiving table 2. Since the adhesive force between the surface of the lower disk substrate D1 and the adhesive S2 is larger than the adhesive force between the carrier S1 and the adhesive S2, such movement of the release member 4 causes the adhesive sheet S and the adhesive S2 (in detail, Carrier S
1 and the adhesive S2) are surely peeled off.
In addition, the lower disk substrate D1 is, as described above,
, The peeling is performed accurately.
【0053】剥離部材4が横断し終わった時点で、粘着
シート体Sは、下ディスク基板D1(詳しくは下ディス
ク基板上の粘着剤S2)から引き剥がされフリーとな
る。ところで、この剥離部材4について、ここでその機
能を説明する。剥離部材4は、回転(自転)する基部4
1と、それに固定された2つの支杆(先導支杆43及び
角度規制支杆42)を備えたもので、受け台2の上を横
切るように(横断するように)往復移動が可能となって
いる。When the peeling member 4 has finished traversing, the adhesive sheet S is peeled off from the lower disk substrate D1 (specifically, the adhesive S2 on the lower disk substrate) and becomes free. The function of the peeling member 4 will be described here. The peeling member 4 includes a base 4 that rotates (rotates).
1 and two supporting rods (leading supporting rod 43 and angle restricting supporting rod 42) fixed thereto, so that reciprocating movement can be performed across the pedestal 2. ing.
【0054】この2つの支杆のうち、角度規制支杆42
は、例えば、断面略扇形の棒体で、先導支杆43は断面
細円径の棒体となっている。尚、扇形の弧は、半径部の
長さに対応して形成される形に、必ずしも一致していな
い。この先導支杆43及び角度規制支杆42は、基台4
1の中心より一定距離離れた位置に設けられている。角
度規制支杆42は、粘着シート体Sを下ディスク基板D
1に対して接触させず僅かに間隙を保った状態で支持す
る。そして角度規制支杆42は、下ディスク基板D1に
対して鋭角(90度以下)の案内角αを保って粘着シー
ト体Sを引き剥がしていくための鋭角部42Aを備えて
いる。この鋭角部42Aを備えるものであれば、角度規
制支杆42の形は限定されるものではない。Of these two supports, the angle regulating support 42
Is, for example, a rod having a substantially fan-shaped cross section, and the leading support rod 43 is a rod having a small circular cross section. Note that the fan-shaped arc does not always match the shape formed corresponding to the length of the radius portion. The leading support rod 43 and the angle regulating support rod 42 are
It is provided at a position separated by a certain distance from the center of 1. The angle regulating support rod 42 is used to move the adhesive sheet S to the lower disk substrate D.
It is supported in a state in which a slight gap is maintained without contacting the first member. The angle regulating support 42 has an acute angle portion 42A for peeling off the adhesive sheet S while maintaining a guide angle α of an acute angle (90 degrees or less) with respect to the lower disk substrate D1. The shape of the angle restricting support rod 42 is not limited as long as it has the acute angle portion 42A.
【0055】粘着シート体Sを下ディスク基板D1から
引き剥すには、図11に示すように、先ず、角度規制支
杆42と先導杆43の間に粘着シート体Sを介在させた
状態(図11A参照)で剥離部材4を約180度近く回
転して、粘着シート体Sを逆Z字状に形成する(図11
B参照)。先導支杆43は、角度規制支杆42の鋭角部
42Aが案内角αを保てるような位置にややオーバに回
転するとよい。この時、粘着シート体Sは角度規制支杆
42と先導杆43の間に張架された状態となる。To peel off the adhesive sheet S from the lower disk substrate D1, first, as shown in FIG. 11, the adhesive sheet S is interposed between the angle regulating support rod 42 and the leading rod 43 (see FIG. 11). 11A), the peeling member 4 is rotated by about 180 degrees to form the adhesive sheet S in an inverted Z-shape (FIG. 11).
B). The leading support rod 43 may be rotated slightly over to a position where the acute angle portion 42A of the angle regulating support rod 42 can maintain the guide angle α. At this time, the pressure-sensitive adhesive sheet S is in a state of being stretched between the angle regulating support rod 42 and the leading rod 43.
【0056】次に、剥離部材4を受け台2の上を横切る
ように平行移動させると、剥離部材4の角度規制支杆4
2は、粘着シート体を下ディスク基板D1に対して接触
しない状態で僅かに間隙を保って支持し、且つ先導杆4
3によって引っ張り上げるように作用し横断移動してい
く。この場合、角度規制支杆42の斜面Uにより、粘着
シート体Sは下ディスク基板D1の表面から鋭角状態で
引き剥がされて行く(図11C参照)。ここで、角度規
制支杆42としては、 鋭角部42Aを備えているもの
であれば、その形は限定されるものではなく、図12
は、角度規制支杆42の変形例を示すものである。Next, when the peeling member 4 is translated so as to cross over the receiving table 2, the angle regulating support rod 4 of the peeling member 4 is moved.
Reference numeral 2 denotes a support for supporting the pressure-sensitive adhesive sheet body with a slight gap in a state in which the pressure-sensitive adhesive sheet is not in contact with the lower disk substrate D1;
3 acts to pull up and move across. In this case, the adhesive sheet S is peeled off from the surface of the lower disk substrate D1 at an acute angle by the slope U of the angle regulating support rod 42 (see FIG. 11C). Here, the shape of the angle restricting support rod 42 is not limited as long as it has an acute angle portion 42A.
Shows a modified example of the angle regulating support rod 42.
【0057】図12は、角度規制支杆42と先導杆43
の間に粘着シート体Sを介在させた状態を簡略的に示
し、また(A)は、簡略正面図、(B)は簡略側面図を
示す。図13は、剥離部材4が回転して粘着シート体S
が逆Z字状に形成された状態を簡略的に示し、また
(A)は、簡略正面図、(B)は簡略側面図を示す。こ
の例の場合、角度規制支杆42は鋭角部42Aを備え断
面3角形に形成されている。FIG. 12 shows the angle regulating support rod 42 and the leading rod 43.
(A) is a simplified front view, and (B) is a simplified side view. FIG. 13 shows that the peeling member 4 rotates and the adhesive sheet S
Schematically show a state formed in an inverted Z-shape, (A) shows a simplified front view, and (B) shows a simplified side view. In this example, the angle regulating support rod 42 has an acute angle portion 42A and is formed in a triangular cross section.
【0058】ここで、粘着シート体Sの案内角αが図に
示すように鋭角であると、粘着シート体Sの粘着剤S2
が粘着シート体SのキャリヤS1に粘着することなく均
一に引き剥がされる。例えば、案内角αが鈍角(90度
以上)であると粘着シート体SのキャリヤS1に粘着剤
S2の一部が一緒に付着することが多い。なお、剥離が
極めてスムースに行われることを、本発明者等は実験で
確認している。Here, if the guide angle α of the pressure-sensitive adhesive sheet S is an acute angle as shown in FIG.
Is uniformly peeled off without adhering to the carrier S1 of the adhesive sheet S. For example, when the guide angle α is an obtuse angle (90 degrees or more), a part of the adhesive S2 often adheres to the carrier S1 of the adhesive sheet S together. The present inventors have confirmed through experiments that the peeling is performed extremely smoothly.
【0059】粘着シート体Sが下ディスク基板D1から
引き剥がされた後、受け台2が据えつけられた回転テー
ブルTは回転し、受け台2を速やかに次のステーション
に移送させる。すなわち、今まで説明してきた剥離紙S
2を付与するステーションであるところの第1ステーシ
ョンXから、次のステーション(第2のステーション
Y)に移送される(図14参照)。その後、剥離部材4
が元の位置に戻り、図2に示すように初期状態となる。
以上で、下ディスク基板D1に対する粘着剤S2の付与
工程は完了し、その結果、図15に示すように、上ディ
スク基板D2の上に粘着剤S2が均一に付与されること
になる。After the adhesive sheet S is peeled off from the lower disk substrate D1, the rotary table T on which the receiving table 2 is mounted is rotated, and the receiving table 2 is immediately transferred to the next station. That is, the release paper S described so far.
The second station is transferred from the first station X, which is a station to which the second station is assigned (see FIG. 14). Then, the peeling member 4
Returns to the original position, and is in the initial state as shown in FIG.
Thus, the step of applying the adhesive S2 to the lower disk substrate D1 is completed. As a result, as shown in FIG. 15, the adhesive S2 is uniformly applied on the upper disk substrate D2.
【0060】以後、先程の第2のステーションでは、粘
着剤S2が付与された下ディスク基板D1の上に別の上
ディスク基板D2が重ねて載置される(図16参照)。
重ねて置かれた2枚のディスク基板D1,D2は、まだ
両者とも圧接作用を受けていないので強固に貼り合わさ
れた状態とはなっていない。そのため、次に第3のステ
ーションZ(図14参照)に移動され、2枚のディスク
基板D1,D2が加圧されて完全に貼り付けられる。Thereafter, in the second station, another upper disk substrate D2 is placed on the lower disk substrate D1 to which the adhesive S2 has been applied (see FIG. 16).
Since the two disk substrates D1 and D2 placed one on top of the other have not yet been subjected to the pressing action, they are not firmly bonded. Therefore, it is moved to the third station Z (see FIG. 14), and the two disk substrates D1 and D2 are pressed and completely adhered.
【0061】図17は、受け台2に置かれた2枚のディ
スク基板D1,D2が押圧部材100により互いに圧接
される状態を示すものである(この例では受け台が上昇
した場合を示す)。ここで使用される押圧部材100は
可撓性の材質により、ほぼ半球状に形成されている。こ
のように重ねて置かれた2枚のディスク基板D1,D2
が、押圧部材100と受け台2との間で圧接力を受ける
ことにより、両ディスク基板は、互いに強く貼り付く。FIG. 17 shows a state where the two disk substrates D1 and D2 placed on the pedestal 2 are pressed against each other by the pressing member 100 (in this example, the pedestal is raised). . The pressing member 100 used here is formed in a substantially hemispherical shape by a flexible material. The two disk substrates D1 and D2 thus placed one above the other
However, by receiving a pressing force between the pressing member 100 and the receiving base 2, the two disk substrates are strongly adhered to each other.
【0062】ここで、貼合わせローラ1は、上ディスク
基板D2を中心部から徐々に外側に(半径方向に)向け
て接触部が拡大するように圧接することができる。その
ため上ディスク基板D2が中心部から徐々に外側に(半
径方向に)向けて下ディスク基板との接触部(圧接部)
が拡大するように圧接され、両ディスク基板間に気泡等
が包含されることはない。以上で、2枚のディスク基板
の貼り合わせは終了し、高品位な光ディスクDができあ
がる(図18参照)。Here, the laminating roller 1 can be pressed against the upper disk substrate D2 such that the contact portion is gradually expanded outward (in the radial direction) from the center portion. For this reason, the upper disk substrate D2 gradually contacts outward (in the radial direction) from the central portion and contacts (presses) with the lower disk substrate.
Is pressed so as to expand, and no air bubbles or the like are included between the two disk substrates. Thus, the bonding of the two disk substrates is completed, and a high-quality optical disk D is completed (see FIG. 18).
【0063】図19は、ディスク基板の主な貼り合わせ
工程(ステップ1〜6)を参考までにブロック図で示し
たものである。FIG. 19 is a block diagram showing main laminating steps (steps 1 to 6) of a disk substrate for reference.
【0064】以上、本発明を述べてきたが、本発明は実
施例にのみ限定されるものではなく、その本質から逸脱
しない範囲で、他の色々な変形例が可能であることはい
うまでもない。本発明であるディスク基板を貼り合わせ
る方法に使用する具体的な手段は、図示したものに限ら
ない。Although the present invention has been described above, the present invention is not limited to the embodiment, and it goes without saying that various other modifications can be made without departing from the essence of the present invention. Absent. The specific means used in the method of bonding the disk substrates according to the present invention is not limited to the illustrated one.
【0065】例えば、本発明で使用される貼合わせロー
ラの構造は、内部に加熱手段がなくても適用可能であ
る。粘着シート体をディスク基板に圧接するための、貼
合わせローラの移動方向は、図6でいう右→左でも左→
右でもどちらでもよい。For example, the structure of the laminating roller used in the present invention can be applied without a heating means inside. The direction of movement of the laminating roller for pressing the pressure-sensitive adhesive sheet body against the disk substrate can be changed from right to left or left to right in FIG.
Either right or both.
【0066】[0066]
【発明の効果】粘着シート体から分離された粘着剤が、
空気泡等を含むことなく、且つ皺も生ずることなく、下
ディスク基板の表面に均一に付着される。従来の紫外線
硬化樹脂を使った貼り合わせの場合と異なり、接着剤の
延展工程や紫外線照射工程が不要となり製造工数が減少
する。粘着シート体に付着された粘着剤の厚みを変更す
るだけで、光ディスクとして完成した場合、2枚のディ
スク基板の間の中間層(粘着剤層)の厚さを容易に変更
することができる。ディスク基板の上に粘着剤を付与す
ることが自動化され、極めて効率のよい連続した貼り合
わせ方法が可能となった。The pressure-sensitive adhesive separated from the pressure-sensitive adhesive sheet is
It is uniformly attached to the surface of the lower disk substrate without containing air bubbles or the like and without wrinkles. Unlike the case of bonding using a conventional ultraviolet curable resin, the step of spreading the adhesive and the step of irradiating ultraviolet light are not required, and the number of manufacturing steps is reduced. When the optical disc is completed only by changing the thickness of the pressure-sensitive adhesive attached to the pressure-sensitive adhesive sheet, the thickness of the intermediate layer (pressure-sensitive adhesive layer) between the two disk substrates can be easily changed. The application of the adhesive on the disk substrate was automated, and an extremely efficient continuous bonding method became possible.
【図1】図1は、ディスク基板を貼り合わせる際におけ
る粘着剤の付与方法を示した図である。FIG. 1 is a diagram illustrating a method of applying an adhesive when a disk substrate is bonded.
【図2】図2は、粘着剤の付与方法(初期状態)を示す
図である。FIG. 2 is a diagram illustrating a method of applying an adhesive (initial state).
【図3】図3は、粘着剤の付与方法(位置決め時)を示
す図である。FIG. 3 is a diagram showing a method of applying an adhesive (at the time of positioning).
【図4】図4は、粘着剤の付与方法(貼合わせローラの
接地時)を示す図である。FIG. 4 is a diagram illustrating a method of applying an adhesive (when a bonding roller is grounded).
【図5】図5は、粘着剤の付与方法(芯出しローラ離反
時)を示す図である。FIG. 5 is a diagram illustrating a method of applying an adhesive (when the centering roller is separated).
【図6】図6は、粘着剤の付与方法(貼合わせローラの
移動時)を示す図である。FIG. 6 is a diagram illustrating a method of applying an adhesive (when a laminating roller is moved).
【図7】図7は、粘着剤の付与方法(貼合わせローラの
離反時)を示す図である。FIG. 7 is a diagram illustrating a method of applying an adhesive (when a laminating roller is separated).
【図8】図8は、粘着剤の付与方法(剥離部材の作動開
始時)を示す図である。FIG. 8 is a diagram illustrating a method of applying a pressure-sensitive adhesive (at the time of starting operation of a peeling member).
【図9】図9は、粘着剤の付与方法(剥離部材の作動終
了時)を示す図である。FIG. 9 is a diagram illustrating a method of applying an adhesive (at the end of the operation of a peeling member).
【図10】図10は、芯出しシャフト及び貼合わせロー
ラの作用を示す図である。(A)は位置決め時、(B)
は貼合わせローラ接地時、(C)は貼合わせローラの移
動時を示す。FIG. 10 is a diagram illustrating the operation of a centering shaft and a laminating roller. (A) is for positioning, (B)
Indicates the time when the bonding roller is grounded, and (C) indicates when the bonding roller is moving.
【図11】図11は、剥離部材の作用を示す図であり、
(A)は粘着シート体を張架する前の状態、(B)は粘
着シート体を張架した後の状態、(C)は粘着シート体
による引き離し状態を示す。FIG. 11 is a view showing an operation of a peeling member;
(A) shows a state before the adhesive sheet is stretched, (B) shows a state after the adhesive sheet is stretched, and (C) shows a state of being separated by the adhesive sheet.
【図12】図12は、角度規制支杆と先導杆の間に粘着
シート体を介在させた状態を簡略的に示し、また(A)
は、簡略正面図、(B)は簡略側面図を示す。FIG. 12 schematically shows a state in which an adhesive sheet is interposed between an angle regulating support rod and a leading rod, and FIG.
Shows a simplified front view, and (B) shows a simplified side view.
【図13】図13は、剥離部材が回転して粘着シート体
が逆Z字状に形成された状態を簡略的に示し、また
(A)は、簡略正面図、(B)は簡略側面図を示す。FIGS. 13A and 13B schematically show a state in which a peeling member is rotated to form an adhesive sheet body in an inverted Z-shape. FIG. 13A is a simplified front view, and FIG. 13B is a simplified side view. Is shown.
【図14】図14は、各ステーションの位置を示す図で
ある。FIG. 14 is a diagram illustrating positions of respective stations.
【図15】図15は、粘着剤が付着された下ディスク基
板を示す図で、(A)は側面図、(B)は平面図であ
る。FIGS. 15A and 15B are views showing a lower disk substrate to which an adhesive is attached, wherein FIG. 15A is a side view and FIG. 15B is a plan view.
【図16】図16は、受け台に載置された上ディスク基
板の上に別の下ディスク基板が載置される方法を示す。FIG. 16 shows a method in which another lower disk substrate is placed on an upper disk substrate placed on a receiving table.
【図17】図17は、受け台に載置された2枚のディス
ク基板が圧接力を受ける状態を示す。FIG. 17 shows a state where two disk substrates placed on a receiving table receive a pressing force;
【図18】図18は、2枚の上ディスク基板が貼り合わ
された光ディスクを示す。FIG. 18 shows an optical disk on which two upper disk substrates are bonded.
【図19】図19は、ディスク基板の貼り合わせ方法の
工程を示したブロック図である。FIG. 19 is a block diagram showing steps of a method of attaching a disk substrate.
【図20】図20は、粘着シート体を示す図であり、
(A)は正面図、(B)は側面図、(C)は剥離紙を取
り除いた状態の側面図である。FIG. 20 is a view showing an adhesive sheet body;
(A) is a front view, (B) is a side view, and (C) is a side view with the release paper removed.
【図21】図21(A)は、粘着剤の形を示した図、図
21(B)は、剥離紙の形を示した図である。FIG. 21A is a diagram showing a shape of an adhesive, and FIG. 21B is a diagram showing a shape of a release paper.
【図22】図22は、従来の接着剤を使った貼り合わせ
方法を示す工程概略図である。FIG. 22 is a process schematic diagram showing a conventional bonding method using an adhesive.
1…貼合わせローラ(位置決め部材) 2…受け台 21…ボス配設穴 3…芯出しシャフト 31…第1小径部 32…第2小径部 4…剥離部材(引き剥がし部材) 41…基台 42…角度規制支杆 42A…鋭角部 43…先導支杆 5…テンションローラ 5A…上流のテンションローラ 5B…上流のテンションローラ 5A1…ストッパ 6…ピッチ送りローラ 7…クリーニングローラ 8…供出ローラ 81…案内ローラ 9…供出りローラ 10…巻取りローラ 11…送り出しローラ 12…吊り下げローラ 12A…検知器 13…巻取りローラ 100…押圧部材 S…粘着シート体 S1…キャリヤ S2…粘着剤 S3…剥離紙 D…光ディスク D1…下ディスク基板 D2…上ディスク基板 H…中心穴 L…接着テープ R…接着剤(紫外線硬化樹脂) T…回転テーブル U…斜面 P…穴 2A…載置台 DESCRIPTION OF SYMBOLS 1 ... Lamination roller (positioning member) 2 ... Receiving stand 21 ... Boss arrangement hole 3 ... Centering shaft 31 ... 1st small diameter part 32 ... 2nd small diameter part 4 ... Peeling member (peeling member) 41 ... Base 42 ... Angle regulating support rod 42A ... Acute angle part 43 ... Lead support rod 5 ... Tension roller 5A ... Upstream tension roller 5B ... Upstream tension roller 5A1 ... Stopper 6 ... Pitch feed roller 7 ... Cleaning roller 8 ... Discharge roller 81 ... Guide roller Reference Signs List 9 delivery roller 10 take-up roller 11 delivery roller 12 hanging roller 12A detector 13 take-up roller 100 pressure member S pressure-sensitive adhesive sheet S1 carrier S2 pressure-sensitive adhesive S3 release paper D Optical disk D1 Lower disk substrate D2 Upper disk substrate H Central hole L Adhesive tape R Adhesive (ultraviolet curable resin) ... turntable U ... slope P ... hole 2A ... loading table
Claims (17)
紙が剥がされた粘着シート体を下ディスク基板の上方に
位置決めし、前記粘着シート体を圧接して下面の粘着剤
を下ディスク基板表面に付着(転着)させ、下ディスク
基板に付着された粘着剤から粘着シート体を剥離させた
後、下ディスク基板の上に上ディスク基板を載置し、下
ディスク基板に対して上ディスク基板を押圧することに
より両ディスク基板を貼り付けることを特徴とするディ
スク基板の貼り合わせ方法。1. A release paper is peeled off from an adhesive sheet body, the adhesive sheet body from which the release paper is peeled is positioned above a lower disk substrate, and the pressure-sensitive adhesive sheet body is pressed against the lower disk substrate so that an adhesive on the lower surface is brought into contact with the lower disk substrate surface. After the adhesive sheet is separated from the adhesive adhered to the lower disk substrate, the upper disk substrate is placed on the lower disk substrate, and the upper disk substrate is placed on the lower disk substrate. A disk substrate bonding method, wherein both disk substrates are bonded by pressing the disk substrate.
スク基板の貼り合わせ方法。 1)粘着シート体から剥離紙を剥がす工程、 2)位置決め部材を使って下ディスク基板の上方に粘着
シート体の粘着剤部を位置決めする工程、 3)貼合わせ部材を下ディスク基板の一方端から他方端
に移動させることにより、前記剥離紙が剥がされた粘着
シート体を押圧して下面の粘着剤を下ディスク基板表面
に付着(転着)させる工程、 4)引き剥がし部材を使って下ディスク基板に付着され
た粘着剤から粘着シート体を剥離させる工程 5)下ディスク基板の上に上ディスク基板を載置する工
程、 6)下ディスク基板に対して上ディスク基板を押圧し
て、両者一体に貼り付ける工程、2. A method of bonding a disk substrate, comprising the following steps 1) to 6). 1) a step of peeling release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate using a positioning member; 3) a bonding member from one end of the lower disk substrate. A step of pressing the pressure-sensitive adhesive sheet body from which the release paper has been peeled off to cause the pressure-sensitive adhesive on the lower surface to adhere (transfer) to the surface of the lower disk substrate by moving to the other end; 4) a lower disk using a peeling member; 5) a step of placing the upper disk substrate on the lower disk substrate, 6) pressing the upper disk substrate against the lower disk substrate, and integrating the two. Process of pasting on
を特徴とする請求項2記載のディスク基板の貼り合わせ
方法。3. The method according to claim 2, further comprising the step of collecting the release paper.
力より大きい剥離紙に対する付着力を有する接着テープ
を使って行うことを特徴とする請求項3記載のディスク
基板の貼り合わせ方法。4. The method according to claim 3, wherein the recovery of the release paper is performed using an adhesive tape and an adhesive tape having an adhesive force to the release paper which is larger than the adhesive force of the adhesive and the release paper. .
シート体に弱い張力を与えた状態で行われることを特徴
とするディスク基板の貼り合わせ方法。5. The method according to claim 2, wherein step 2 is performed with a low tension applied to the pressure-sensitive adhesive sheet.
決め部材である芯出しシャフトの先端を粘着シート体の
穴に挿入することにより行われることを特徴とする請求
項2記載のディスク基板の貼り合わせ方法。6. The disk substrate according to claim 2, wherein the step 2 is performed by inserting a tip of a centering shaft as a positioning member into a hole of the adhesive sheet body. Lamination method.
スク基板に対し前記粘着シート体を僅かに傾斜して配置
させることを特徴とするディスク基板の貼り合わせ方
法。7. The method according to claim 2, wherein the pressure-sensitive adhesive sheet is slightly inclined with respect to the lower disk substrate in Step 2.
せ部材が転動する貼合わせローラであることを特徴とす
るディスク基板の貼り合わせ方法。8. The method according to claim 2, wherein the bonding member of step 3 is a rolling roller that rolls.
ィスク基板の上方を横断移動する引き剥がし部材により
剥離を行うものであることを特徴とするディスク基板の
貼り合わせ方法。9. The method of laminating disk substrates according to claim 2, wherein in step 4, the peeling is performed by a peeling member traversing above the lower disk substrate.
体をディスク基板上に接触しない状態で僅かに間隙を保
って支持しながら引き剥がすことを特徴とする請求項9
記載のディスク基板の貼り合わせ方法。10. The pressure-sensitive adhesive sheet body is peeled off by a peeling member while supporting the pressure-sensitive adhesive sheet body with a slight gap in a state of not contacting the disk substrate.
The method of bonding the disk substrate described in the above.
の両支杆の間に粘着シート体を張架するものであること
を特徴とする請求項9記載のディスク基板の貼り合わせ
方法。11. The method according to claim 9, wherein the peeling member has two supporting rods, and the adhesive sheet is stretched between the two supporting rods.
して鋭角の案内角で粘着シート体を引き剥がしていくこ
とを特徴とする請求項9記載のディスク基板の貼り合わ
せ方法。12. The method according to claim 9, wherein the peeling member peels off the adhesive sheet at an acute guide angle with respect to the lower disk substrate.
ィスク基板の貼り合わせ方法。 1)粘着シート体から剥離紙を剥がす工程、 2)位置決め部材の先端を粘着シート体の穴に挿入する
ことにより下ディスク基板の上方に粘着シート体の粘着
剤部を位置決めする工程、 3)転動する貼合わせローラを下ディスク基板の一方端
から他方端に移動させることにより、前記剥離紙が剥が
された粘着シート体を押圧して下面の粘着剤を下ディス
ク基板表面に付着(転着)させる工程、 4)引き剥がし部材が粘着シート体をディスク基板上に
接触しない状態で僅かに間隙を保って支持し、該粘着シ
ート体を引き剥がすように横断移動して下ディスク基板
に付着された粘着剤から粘着シート体を剥離させる工程 5)下ディスク基板の上に上ディスク基板を載置する工
程、 6)下ディスク基板に対して上ディスク基板を押圧し
て、両者一体に貼り付ける工程、13. A method of laminating a disk substrate, comprising the following steps 1) to 6). 1) a step of peeling the release paper from the adhesive sheet body; 2) a step of positioning the adhesive portion of the adhesive sheet body above the lower disk substrate by inserting the tip of a positioning member into a hole of the adhesive sheet body; By moving the moving laminating roller from one end of the lower disk substrate to the other end, the pressure-sensitive adhesive sheet body from which the release paper has been peeled is pressed, and the adhesive on the lower surface is attached (transferred) to the surface of the lower disk substrate. 4) The peeling member supports the pressure-sensitive adhesive sheet body with a slight gap in a state where the pressure-sensitive adhesive sheet body is not in contact with the disk substrate, and moves transversely to peel off the pressure-sensitive adhesive sheet body and adheres to the lower disk substrate. 5) a step of placing the upper disk substrate on the lower disk substrate, and 6) pressing the upper disk substrate against the lower disk substrate. Step of attaching to,
2と、受け台より上方の一定の距離位置に粘着シート体
Sを張設する支持部材(テンションローラ)5A,5B
と、粘着シート体Sを位置決めする芯出しシャフト3
と、受け台2に載置された下ディスク基板D1の一方の
端から他方の端に移動しながら粘着シート体Sを下ディ
スク基板D1に圧接して貼り付ける貼り合わせローラ1
と、下ディスク基板D1に貼り付けた粘着シート体Sを
下ディスク基板から引き剥がす引き剥がし部材4とより
なることを特徴とするディスク基板に対する粘着シート
体Sの貼り合わせ装置。14. A receiving table 2 on which the lower disk substrate D1 is placed, and supporting members (tension rollers) 5A and 5B for stretching the adhesive sheet S at a predetermined distance above the receiving table.
And a centering shaft 3 for positioning the adhesive sheet S
And a bonding roller 1 for pressing the pressure-sensitive adhesive sheet S against the lower disk substrate D1 while moving from one end to the other end of the lower disk substrate D1 placed on the receiving table 2.
And a peeling member 4 for peeling off the pressure-sensitive adhesive sheet S attached to the lower disk substrate D1 from the lower disk substrate.
配設穴21に挿入される第2小径部32と粘着シート体
の穴Pに挿入される第1小径部31と粘着シート体の裏
面に接する大径部33を備えることを特徴とする請求項
13記載のディスク基板に対する粘着シート体Sの貼り
合わせ装置。15. The centering shaft 3 includes a second small-diameter portion 32 inserted into the boss arrangement hole 21 of the receiving table 2, a first small-diameter portion 31 inserted into the hole P of the adhesive sheet body, and an adhesive sheet body. 14. The apparatus for bonding an adhesive sheet S to a disk substrate according to claim 13, further comprising a large-diameter portion 33 in contact with the back surface.
行う基台41と該基台41の中心より一定距離離れた位
置に設けた先導支杆43及び角度規制支杆42とよりな
ることを特徴とする請求項13記載のディスク基板に対
する粘着シート体Sの貼り合わせ装置。16. The peeling member 4 comprises a base 41 for performing lateral movement and rotation, and a leading support rod 43 and an angle regulating support rod 42 provided at a predetermined distance from the center of the base 41. 14. The apparatus for bonding an adhesive sheet S to a disk substrate according to claim 13, wherein:
は、下ディスク基板D1に対して鋭角の案内角αで粘着
シート体Sを引き剥がしていく鋭角部42Aを有するこ
とを特徴とする請求項16記載のディスク基板に対する
粘着シート体Sの貼り合わせ装置。17. The angle regulating support rod 42 of the peeling member 4.
17. The device for bonding an adhesive sheet S to a disk substrate according to claim 16, wherein the device has an acute angle portion 42A for peeling off the adhesive sheet S at a guide angle α of an acute angle with respect to the lower disk substrate D1. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11017602A JP3076793B2 (en) | 1998-01-27 | 1999-01-26 | Disc substrate bonding method and apparatus therefor |
Applications Claiming Priority (3)
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JP10-30509 | 1998-01-27 | ||
JP3050998 | 1998-01-27 | ||
JP11017602A JP3076793B2 (en) | 1998-01-27 | 1999-01-26 | Disc substrate bonding method and apparatus therefor |
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JPH11283288A true JPH11283288A (en) | 1999-10-15 |
JP3076793B2 JP3076793B2 (en) | 2000-08-14 |
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JP11017602A Expired - Fee Related JP3076793B2 (en) | 1998-01-27 | 1999-01-26 | Disc substrate bonding method and apparatus therefor |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001040296A (en) * | 1999-07-19 | 2001-02-13 | Three M Innovative Properties Co | Sheet-pasting apparatus |
KR100910751B1 (en) * | 2001-11-07 | 2009-08-05 | 린텍 가부시키가이샤 | Laminating apparatus for optical disc |
CN117382203A (en) * | 2023-08-30 | 2024-01-12 | 昆山晨鼎嘉电子科技有限公司 | Plastic sucking box adjusting mechanism matched with dispensing machine |
-
1999
- 1999-01-26 JP JP11017602A patent/JP3076793B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001040296A (en) * | 1999-07-19 | 2001-02-13 | Three M Innovative Properties Co | Sheet-pasting apparatus |
KR100910751B1 (en) * | 2001-11-07 | 2009-08-05 | 린텍 가부시키가이샤 | Laminating apparatus for optical disc |
CN117382203A (en) * | 2023-08-30 | 2024-01-12 | 昆山晨鼎嘉电子科技有限公司 | Plastic sucking box adjusting mechanism matched with dispensing machine |
CN117382203B (en) * | 2023-08-30 | 2024-04-30 | 昆山晨鼎嘉电子科技有限公司 | Plastic sucking box adjusting mechanism matched with dispensing machine |
Also Published As
Publication number | Publication date |
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JP3076793B2 (en) | 2000-08-14 |
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