JPH11274003A - Chip-type laminated solid electrolytic capacitor - Google Patents
Chip-type laminated solid electrolytic capacitorInfo
- Publication number
- JPH11274003A JPH11274003A JP7788198A JP7788198A JPH11274003A JP H11274003 A JPH11274003 A JP H11274003A JP 7788198 A JP7788198 A JP 7788198A JP 7788198 A JP7788198 A JP 7788198A JP H11274003 A JPH11274003 A JP H11274003A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- solid electrolytic
- electrolytic capacitor
- chip
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、チップ型積層固体
電解コンデンサに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type solid electrolytic capacitor.
【０００２】[0002]
【従来の技術】電子機器における回路の高周波化、高速
化および低電圧化が進む中で、コンデンサに関しては小
型大容量、低インピーダンス、低ＥＳＲ化が求められて
いる。現在、タンタルやアルミ、セラミックを用いたコ
ンデンサに関してはチップ型で特性が良好な製品が実現
されている。2. Description of the Related Art As circuits in electronic equipment have been increased in frequency, speed and voltage, there has been a demand for small and large capacitors, low impedance and low ESR for capacitors. At present, with respect to capacitors using tantalum, aluminum, and ceramic, products with chip-type and excellent characteristics have been realized.
【０００３】チップ型固体電解コンデンサとしては、こ
れまでに弁作用金属にタンタルやアルミを用いた製品が
実用化されている。タンタルを用いたコンデンサでは、
タンタルパウダーを焼結してリード線を取り付けて内部
素子を作製し、陽極酸化皮膜を形成後その上に固体電解
質層を形成する。この固体電解質層は、無機金属、導電
性高分子などの材料からなり、作製方法も様々である
が、この電解質層によって製品の電気特性が決定され
る。As a chip type solid electrolytic capacitor, a product using tantalum or aluminum as a valve metal has been put to practical use. For capacitors using tantalum,
The internal element is manufactured by sintering the tantalum powder and attaching a lead wire, forming an anodic oxide film, and then forming a solid electrolyte layer thereon. The solid electrolyte layer is made of a material such as an inorganic metal and a conductive polymer, and has various manufacturing methods. The electric characteristics of a product are determined by the electrolyte layer.
【０００４】更にコロイダルカーボンや銀ペーストなど
からなる陰極導電層を上部に重ねて素子を形成し、この
素子のリード線、陰極導電層からリードフレームへ電気
的接合を行い、絶縁樹脂によるモールド外装を施すこと
によってチップ型タンタル固体電解コンデンサが実現さ
れている。Further, an element is formed by superposing a cathode conductive layer made of colloidal carbon, silver paste, or the like on the upper part, and electrically connecting the lead wire and the cathode conductive layer of the element to a lead frame. By doing so, a chip-type tantalum solid electrolytic capacitor is realized.
【０００５】一方、弁作用金属にアルミを用いたコンデ
ンサでは、高純度アルミ箔に対してエッチング処理を施
して拡面化し、化成処理を施して酸化皮膜を形成する。
その後、タンタル固体電解コンデンサの場合と同様の方
法で固体電解質層、陰極導電層を順次形成したコンデン
サ素子とする。On the other hand, in a capacitor using aluminum as a valve metal, a high-purity aluminum foil is etched to enlarge the surface, and then subjected to a chemical conversion treatment to form an oxide film.
After that, a capacitor element in which a solid electrolyte layer and a cathode conductive layer are sequentially formed in the same manner as in the case of the tantalum solid electrolytic capacitor.
【０００６】ここで、アルミを用いたコンデンサに関し
ては、現在市販されているアルミ電解コンデンサ用電極
箔の厚さが１００μｍ程度であり、チップ型コンデンサ
を作製した際に単板での使用では十分な製品容量が実現
できない。このために、一般的にチップ型アルミ電解コ
ンデンサ製造の場合にはコンデンサ素子を積層すること
で製品容量を増やしている。Here, regarding a capacitor using aluminum, the thickness of the electrode foil for an aluminum electrolytic capacitor currently on the market is about 100 μm, and it is not sufficient to use a single plate when manufacturing a chip type capacitor. Product capacity cannot be realized. For this reason, generally, in the case of manufacturing a chip type aluminum electrolytic capacitor, the capacity of a product is increased by stacking capacitor elements.
【０００７】上記理由から、コンデンサ素子は複数個積
層されて、陰極導電層どうしが銀ペーストや陰極フレー
ムによって電気的に接合されることによりコンデンサ素
子が形成される。そして、この素子に対してタンタル電
解コンデンサと同様の方法でチップ型アルミ固体電解コ
ンデンサを実現する。For the above reason, a plurality of capacitor elements are stacked, and the cathode conductive layers are electrically connected to each other by a silver paste or a cathode frame to form the capacitor elements. Then, a chip-type aluminum solid electrolytic capacitor is realized for this element in the same manner as the tantalum electrolytic capacitor.
【０００８】[0008]
【発明が解決しようとする課題】しかし、従来の技術で
は、積層されたコンデンサ素子間の電気的接合は導電性
ペーストなどが主であり、厚さのバラツキや固有抵抗が
高いことからこの間の電気的接触が良好に行われず、余
分な抵抗が発生するために電気特性が悪化し、特に高周
波数領域においてインピーダンスが増大する原因となっ
ていた。However, in the prior art, the electrical connection between the laminated capacitor elements is mainly made of a conductive paste or the like. Good electrical contact is not made, and an extra resistance is generated, thereby deteriorating the electrical characteristics, and causing an increase in impedance particularly in a high frequency region.
【０００９】本発明はこの問題を解決するものであり、
チップ型積層固体電解コンデンサにおいて、高周波領域
でのインピーダンス、ＥＳＲ特性が優れたコンデンサを
提供することを目的とするものである。The present invention solves this problem,
An object of the present invention is to provide a chip type solid electrolytic capacitor having excellent impedance and ESR characteristics in a high frequency region.
【００１０】[0010]
【課題を解決するための手段】上記の問題を解決するた
めに本発明のチップ型積層固体電解コンデンサは、一方
の先端が断面櫛形形状でコンデンサ素子との接合面が良
導電性金属でメッキまたは蒸着された陰極リードフレー
ムにコンデンサ素子を配置することにより、各々のコン
デンサ素子と陰極リードフレームを低減し、製品の高周
波電気特性を改善しようとするものである。In order to solve the above-mentioned problems, a chip type solid electrolytic capacitor of the present invention has a comb-shaped cross section at one end, and a junction surface with a capacitor element is plated or plated with a good conductive metal. By arranging the capacitor elements on the deposited cathode lead frame, each capacitor element and the cathode lead frame are reduced to improve the high-frequency electrical characteristics of the product.
【００１１】すなわち、弁作用金属からなる陽極体上に
陽極酸化皮膜層、固体電解質層及び陰極導電層を順次形
成した複数個のコンデンサ素子を積層し絶縁性樹脂でモ
ールド外装したチップ型積層固体電解コンデンサにおい
て、良導電性金属で塗布、メッキまたは蒸着された一方
の先端が断面櫛形形状の陰極リードフレームの先端部
に、複数個のコンデンサ素子を配置し、接合するよう構
成したことを特徴とするチップ型積層固体電解コンデン
サである。That is, a chip-type laminated solid electrolyte in which a plurality of capacitor elements in which an anodic oxide film layer, a solid electrolyte layer, and a cathode conductive layer are sequentially formed on an anode body made of a valve metal and laminated with an insulating resin is provided. The capacitor is characterized in that a plurality of capacitor elements are arranged and joined to the tip of a cathode lead frame having one end coated, plated or vapor-deposited with a good conductive metal and having a comb-shaped cross section. This is a chip-type multilayer solid electrolytic capacitor.
【００１２】そして、上記陰極リードフレームが、鉄、
銅または鉄−ニッケル合金を母材としてなることを特徴
とするチップ型積層固体電解コンデンサである。The cathode lead frame is made of iron,
A chip-type multilayer solid electrolytic capacitor characterized by using copper or an iron-nickel alloy as a base material.
【００１３】また、上記の良導電性金属が、銀、金、白
金、ニッケル、パラジウム、錫、半田のうち少なくとも
１種であることを特徴とするチップ型積層固体電解コン
デンサである。[0013] Further, the chip-type solid electrolytic capacitor is characterized in that the above-mentioned good conductive metal is at least one of silver, gold, platinum, nickel, palladium, tin and solder.
【００１４】[0014]
【発明の実施の形態】本発明によれば、コンデンサ素子
を形成する際の各コンデンサ素子間での電気的接合が、
良導電性部材を介して行われるために、従来の導電性ペ
ーストやリードフレームの場合と比べて接触抵抗を低減
させることができ、結果として高周波領域でのインピー
ダンスを減少させることが可能となる。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, when forming a capacitor element, the electrical connection between each capacitor element is
Since the process is performed through the good conductive member, the contact resistance can be reduced as compared with the case of the conventional conductive paste or lead frame, and as a result, the impedance in a high frequency region can be reduced.
【００１５】[0015]
【実施例】以下、本発明について図面に基づき詳細に説
明する。図１は本発明によるチップ型固体電解コンデン
サの断面図である。公知の方法で高純度アルミ箔をエッ
チング・化成処理し、固体電解質層、陰極導電層を形成
してコンデンサ素子とした。一方の先端が断面櫛形形状
でコンデンサ素子との接合部が銀メッキされた４２アロ
イ製陰極リードフレームの先端部にコンデンサ素子を配
置して接合し、陽極リードフレームとコンデンサ素子と
を陽極導電層を介して接合し、外装を樹脂モールドして
コンデンサを作製した。従来例として、実施例と同じコ
ンデンサ素子を用い、図２に示す従来の陰極リードフレ
ームでコンデンサを作製した。作製したコンデンサの電
気特性を測定し、表１の結果を得た。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view of a chip type solid electrolytic capacitor according to the present invention. A high-purity aluminum foil was etched and chemically treated by a known method to form a solid electrolyte layer and a cathode conductive layer to obtain a capacitor element. A capacitor element is arranged at the tip of a 42-alloy cathode lead frame with one end having a comb-shaped cross-section and a silver-plated junction with the capacitor element. The anode lead frame and the capacitor element are joined together by an anode conductive layer. Then, the exterior was resin-molded to produce a capacitor. As a conventional example, using the same capacitor element as in the example, a capacitor was manufactured with the conventional cathode lead frame shown in FIG. The electrical characteristics of the manufactured capacitor were measured, and the results shown in Table 1 were obtained.
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１から明らかなように、本発明によるコ
ンデンサは従来技術のコンデンサに比較して電気特性が
向上しており、特に高周波領域でのインピーダンス、Ｅ
ＳＲが低減している。なお、陰極リードフレームは銀メ
ッキをしたものを用いたが、金、白金、ニッケル、パラ
ジウム、錫、半田のうち少なくとも１種をメッキした場
合でも同等の効果がある。また、陰極リードフレームに
上記金属のうち少なくとも１種を塗布または蒸着しても
同等の効果がある。As is clear from Table 1, the capacitor according to the present invention has improved electrical characteristics as compared with the prior art capacitor, and in particular, the impedance and E in the high frequency region.
SR is reduced. Although the cathode lead frame is silver-plated, the same effect can be obtained by plating at least one of gold, platinum, nickel, palladium, tin, and solder. The same effect can be obtained by coating or vapor-depositing at least one of the above metals on the cathode lead frame.
【００１８】[0018]
【発明の効果】以上のように本発明によれば、一方の先
端が断面櫛形形状でコンデンサ素子との接合部を導電性
の高い金属でメッキまたは蒸着した陰極リードフレーム
にコンデンサ素子を配置することにより、各コンデンサ
素子と陰極リードフレームとの接触抵抗を下げ、コンデ
ンサへ電流を印加した際に、各コンデンサ素子間や陰極
導電層から陰極端子への通電状態が改善され、高周波領
域において電気特性が優れたコンデンサを実現すること
ができる。As described above, according to the present invention, a capacitor element is disposed on a cathode lead frame having one end having a comb-shaped cross section and being plated or vapor-deposited with a highly conductive metal at a junction with the capacitor element. As a result, the contact resistance between each capacitor element and the cathode lead frame is reduced, and when a current is applied to the capacitor, the state of conduction between each capacitor element and from the cathode conductive layer to the cathode terminal is improved, and the electrical characteristics in the high frequency region are improved. An excellent capacitor can be realized.
【図１】本発明のチップ型積層固体電解コンデンサの一
実施例の断面図。FIG. 1 is a cross-sectional view of one embodiment of a chip-type multilayer solid electrolytic capacitor of the present invention.
【図２】従来の構造によるチップ型積層固体コンデンサ
の断面図。FIG. 2 is a sectional view of a chip-type multilayer solid capacitor having a conventional structure.
１ 陽極体 ２ 固体電解質層 ３ 陰極導電層 ５ 導電性金属 ６ 陽極導電層 ７ 陽極リードフレーム ８ 陰極リードフレーム ９ 外装樹脂層 １０ 導電性ペースト Reference Signs List 1 anode body 2 solid electrolyte layer 3 cathode conductive layer 5 conductive metal 6 anode conductive layer 7 anode lead frame 8 cathode lead frame 9 exterior resin layer 10 conductive paste
Claims (3)
皮膜層、固体電解質層及び陰極導電層を順次形成した複
数個のコンデンサ素子を積層し絶縁性樹脂でモールド外
装したチップ型積層固体電解コンデンサにおいて、良導
電性金属で塗布、メッキまたは蒸着された一方の先端が
断面櫛形形状の陰極リードフレームの先端部に、複数個
のコンデンサ素子を配置し、接合するよう構成したこと
を特徴とするチップ型積層固体電解コンデンサ。1. A chip type solid electrolytic capacitor comprising a plurality of capacitor elements in which an anodic oxide film layer, a solid electrolyte layer, and a cathode conductive layer are sequentially formed on an anode body made of a valve action metal and molded with an insulating resin. The capacitor is characterized in that a plurality of capacitor elements are arranged and joined to the tip of a cathode lead frame having one end coated, plated or vapor-deposited with a good conductive metal and having a comb-shaped cross section. Chip-type multilayer solid electrolytic capacitor.
鉄、銅または鉄−ニッケル合金を母材としてなることを
特徴とするチップ型積層固体電解コンデンサ。2. The cathode lead frame according to claim 1,
A chip type solid electrolytic capacitor comprising iron, copper or an iron-nickel alloy as a base material.
金、白金、ニッケル、パラジウム、錫、半田のうち少な
くとも１種であることを特徴とするチップ型積層固体電
解コンデンサ。3. The method according to claim 1, wherein the highly conductive metal is silver,
A chip type solid electrolytic capacitor comprising at least one of gold, platinum, nickel, palladium, tin and solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7788198A JPH11274003A (en) | 1998-03-25 | 1998-03-25 | Chip-type laminated solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7788198A JPH11274003A (en) | 1998-03-25 | 1998-03-25 | Chip-type laminated solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11274003A true JPH11274003A (en) | 1999-10-08 |
Family
ID=13646428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7788198A Pending JPH11274003A (en) | 1998-03-25 | 1998-03-25 | Chip-type laminated solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11274003A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001052288A1 (en) * | 2000-01-07 | 2001-07-19 | Kemet Electronics Corporation | Solid electrolytic capacitor with low esr and high humidity resistance |
| JP2002170742A (en) * | 2000-09-22 | 2002-06-14 | Nippon Chemicon Corp | Chip-type solid electrolytic capacitor |
| DE10222405A1 (en) * | 2002-05-21 | 2003-12-18 | Epcos Ag | Chip capacitor and method for its production |
| KR20050071731A (en) * | 2004-01-02 | 2005-07-08 | 삼성전기주식회사 | A solid electrolytic condenser having multiple condenser elements |
| US20130314845A1 (en) * | 2010-05-26 | 2013-11-28 | Kemet Electronics Corporation | Method of Improving Electromechanical Integrity of Cathode Coating to Cathode Termination Interfaces in Solid Electrolytic Capacitors |
-
1998
- 1998-03-25 JP JP7788198A patent/JPH11274003A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001052288A1 (en) * | 2000-01-07 | 2001-07-19 | Kemet Electronics Corporation | Solid electrolytic capacitor with low esr and high humidity resistance |
| US6304427B1 (en) | 2000-01-07 | 2001-10-16 | Kemet Electronics Corporation | Combinations of materials to minimize ESR and maximize ESR stability of surface mount valve-metal capacitors after exposure to heat and/or humidity |
| JP2002170742A (en) * | 2000-09-22 | 2002-06-14 | Nippon Chemicon Corp | Chip-type solid electrolytic capacitor |
| DE10222405A1 (en) * | 2002-05-21 | 2003-12-18 | Epcos Ag | Chip capacitor and method for its production |
| US7190571B2 (en) | 2002-05-21 | 2007-03-13 | Kemet Electronics Corporation | Chip capacitor and method for the production thereof |
| DE10222405B4 (en) * | 2002-05-21 | 2007-09-27 | Epcos Ag | Chip capacitor and method for its production |
| KR20050071731A (en) * | 2004-01-02 | 2005-07-08 | 삼성전기주식회사 | A solid electrolytic condenser having multiple condenser elements |
| US20130314845A1 (en) * | 2010-05-26 | 2013-11-28 | Kemet Electronics Corporation | Method of Improving Electromechanical Integrity of Cathode Coating to Cathode Termination Interfaces in Solid Electrolytic Capacitors |
| US9748043B2 (en) * | 2010-05-26 | 2017-08-29 | Kemet Electronics Corporation | Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors |
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