JPH11266066A - Printed wiring board and its manufacture - Google Patents
Printed wiring board and its manufactureInfo
- Publication number
- JPH11266066A JPH11266066A JP6893998A JP6893998A JPH11266066A JP H11266066 A JPH11266066 A JP H11266066A JP 6893998 A JP6893998 A JP 6893998A JP 6893998 A JP6893998 A JP 6893998A JP H11266066 A JPH11266066 A JP H11266066A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- wiring board
- plating
- printed wiring
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は溶融金属球を搭載す
るための電極を有するプリント配線板及びその製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having electrodes for mounting molten metal spheres and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来の半田ボール搭載用電極を有する配
線板において、電極は半田ボール即ち溶融金属球の脱落
を防止するために絶縁樹脂のソルダレジストを電極の外
周部上に設けていた。2. Description of the Related Art In a conventional wiring board having electrodes for mounting solder balls, the electrodes are provided with a solder resist made of an insulating resin on the outer periphery of the electrodes in order to prevent the solder balls, that is, the molten metal balls from falling off.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記構
成のプリント配線板では、絶縁樹脂を設けるため、接続
に必要とする面積よりも大きな電極が必要となる。その
ため、電極間を通る配線を狭ピッチ化する必要があり、
結果的にプリント配線板の製造費が高くなるという問題
があった。However, in the printed wiring board having the above-described structure, an electrode larger than an area required for connection is required because the insulating resin is provided. Therefore, it is necessary to reduce the pitch of the wiring passing between the electrodes,
As a result, there has been a problem that the manufacturing cost of the printed wiring board is increased.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するた
め、本発明はプリント配線板の電極の中央部に空洞部を
設けたものである。In order to solve the above problems, the present invention provides a printed wiring board having a hollow portion at the center of an electrode.
【０００５】[0005]
【発明の実施の形態】図１は本発明の第１の実施形態を
示す斜視図で、基板１上に溶融金属球である半田ボール
を搭載するための電極２が形成されている。電極２の中
央部には、エッチングにより除去した空洞部３が設けら
れている。FIG. 1 is a perspective view showing a first embodiment of the present invention. An electrode 2 for mounting a solder ball, which is a molten metal sphere, on a substrate 1 is formed. At the center of the electrode 2, a cavity 3 removed by etching is provided.
【０００６】半田ボールの接合について説明すると、基
板１に形成された電極２上にフラックスを転写した後、
半田ボールを空洞部３に位置させて搭載する。[0006] The joining of the solder balls will be described. After transferring the flux onto the electrodes 2 formed on the substrate 1,
The solder balls are mounted on the cavity 3.
【０００７】次に半田ボールを加熱溶融させて電極２と
接合する。加熱時にフラックスは粘度が低下し、半田ボ
ールを保持できなくなるが、電極２の空洞部３に半田ボ
ールが入って保持されるため電極２から脱落することな
く接合される。Next, the solder ball is heated and melted and joined to the electrode 2. The flux loses viscosity during heating and cannot hold the solder ball. However, since the solder ball enters and is held in the cavity 3 of the electrode 2, it is joined without falling off from the electrode 2.
【０００８】以上のように第１の実施形態によれば、プ
リント配線板の電極２への半田ボールの搭載において、
電極２の中央部に空洞部３を設けることにより、電極上
に絶縁樹脂層を設けなくても設けた場合と同等の効果を
得ることができる。また、電極２を小さくできるので、
プリント配線板の電極間の配線が容易になる。As described above, according to the first embodiment, when the solder balls are mounted on the electrodes 2 of the printed wiring board,
By providing the cavity 3 in the center of the electrode 2, the same effect as when the insulating resin layer is not provided on the electrode can be obtained. Also, since the electrode 2 can be made smaller,
Wiring between the electrodes of the printed wiring board is facilitated.
【０００９】図２は本発明の第２の実施形態を示す斜視
図で、電極２の中央部に空洞部３を設けるとともに、電
極２の外周部にその一部を除去した外周除去部４を設け
たものである。FIG. 2 is a perspective view showing a second embodiment of the present invention, in which a hollow portion 3 is provided at the center of the electrode 2 and an outer peripheral removing portion 4 with a part thereof removed at the outer peripheral portion of the electrode 2. It is provided.
【００１０】外周除去部４は空洞部３と同様にエッチン
グにより除去されるが、半田ボールが脱落しない程度の
大きさであれば１つに限定されるものではない。The outer peripheral removing portion 4 is removed by etching similarly to the hollow portion 3, but is not limited to one as long as the solder ball does not fall off.
【００１１】以上のように第２の実施形態によれば、第
１の実施形態の効果に加えて、半田ボールの加熱溶融時
に電極２の外周除去部４からフラックス及び空気が排出
され、空洞部３に残留物が発生せず、高い接続信頼性が
得られる。As described above, according to the second embodiment, in addition to the effects of the first embodiment, when the solder ball is heated and melted, the flux and the air are discharged from the outer periphery removing portion 4 of the electrode 2, and the hollow portion is formed. No residue is generated in 3 and high connection reliability is obtained.
【００１２】図３は本発明の第３の実施形態を示す斜視
図で、電極５の外周部上に半田メッキを施して、電極５
の銅メッキ層６の上に重ねるようにメッキ金属層である
半田メッキ層７を形成している。FIG. 3 is a perspective view showing a third embodiment of the present invention.
A solder plating layer 7 which is a plating metal layer is formed so as to overlap on the copper plating layer 6 of FIG.
【００１３】従って、プリント配線板の電極５は銅メッ
キ層６と半田メッキ層７から構成される。半田メッキ層
７は銅メッキ層６の外周部分のみに重なるように形成さ
れており、電極５の中心付近における断面は凹形状にな
っている。Therefore, the electrode 5 of the printed wiring board is composed of the copper plating layer 6 and the solder plating layer 7. The solder plating layer 7 is formed so as to overlap only with the outer peripheral portion of the copper plating layer 6, and the cross section near the center of the electrode 5 is concave.
【００１４】この中央部の凹部８が図１の空洞部３と同
じ働きをする。また、銅メッキ層６の中央部が空洞にな
っていないので、図１の電極２に比べて広い接続面積が
確保できる。The recess 8 in the center has the same function as the cavity 3 in FIG. Further, since the central portion of the copper plating layer 6 is not hollow, a larger connection area can be secured as compared with the electrode 2 of FIG.
【００１５】以上のように第３の実施形態によれば、第
１の実施形態の効果に加えて、プリント配線板の電極５
の接続面積を広く取ることができ、高い接続信頼性が得
られる。As described above, according to the third embodiment, in addition to the effects of the first embodiment, the electrode 5 of the printed wiring board is provided.
Can have a large connection area, and high connection reliability can be obtained.
【００１６】図４は本発明の製造方法を示すフロー図
で、第３の実施形態のプリント配線板を製造する方法を
示しており、図５はその製造工程におけるプリント配線
板の斜視図である。FIG. 4 is a flow chart showing the manufacturing method of the present invention, showing a method of manufacturing the printed wiring board of the third embodiment, and FIG. 5 is a perspective view of the printed wiring board in the manufacturing process. .
【００１７】図４を参照しながら図５に基づいて製造方
法について説明する。（ａ）において、まず基板１に銅
箔９を接着し（フローＦ１）、ドリル加工（フローＦ
２）してスルーホール１０を形成する。ドリル加工した
ものに銅メッキでパネルメッキをし、銅メッキ層６を形
成する（フローＦ３）。The manufacturing method will be described with reference to FIGS. In (a), first, a copper foil 9 is adhered to the substrate 1 (flow F1) and drilled (flow F1).
2) to form a through hole 10. The drilled product is subjected to panel plating with copper plating to form a copper plating layer 6 (flow F3).
【００１８】（ｂ）において、銅メッキ後、ドライフィ
ルムを貼付け（フローＦ４）、露光（フローＦ５）、現
像（フローＦ６）処理により、電極５が形成される予定
領域の電極の外周部以外にメッキレジストを形成して半
田メッキを行い、電極５の外周部上に半田メッキ層７を
形成する（フローＦ７）。半田メッキ後、メッキレジス
トを除去する（フローＦ８）。In (b), after the copper plating, a dry film is adhered (flow F4), exposed (flow F5), and developed (flow F6) by a process other than the outer peripheral portion of the electrode where the electrode 5 is to be formed. A plating resist is formed and solder plating is performed to form a solder plating layer 7 on the outer peripheral portion of the electrode 5 (flow F7). After the solder plating, the plating resist is removed (flow F8).
【００１９】（ｃ）において、メッキレジスト除去後、
ドライフィルムを貼付け（フローＦ９）、露光（フロー
Ｆ１０）、現像（フローＦ１１）処理し、エッチング
（フローＦ１２）してパターン１１を形成し、ドライフ
ィルムを除去（フローＦ１３）して銅メッキ層６と半田
メッキ層７から成る電極５を形成し、プリント配線板を
製造することができる。In (c), after removing the plating resist,
A dry film is attached (flow F9), exposed (flow F10), developed (flow F11), etched (flow F12), and the pattern 11 is formed. The dry film is removed (flow F13) and the copper plating layer 6 is removed. And the electrode 5 composed of the solder plating layer 7 and the printed wiring board can be manufactured.
【００２０】[0020]
【発明の効果】上記したように、本発明は電極の中央部
に空洞部を設けたので、絶縁樹脂を外周部に設けること
なく、安定的に溶融金属球を電極に搭載することができ
る。As described above, according to the present invention, since the hollow portion is provided at the center of the electrode, the molten metal sphere can be stably mounted on the electrode without providing the insulating resin on the outer peripheral portion.
【００２１】また、電極を小さくできるので、電極間の
配線が容易で、製造コストを低減させることができる。In addition, since the electrodes can be made smaller, wiring between the electrodes is easy, and the manufacturing cost can be reduced.
【図１】本発明の第１の実施形態を示す斜視図。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図２】本発明の第２の実施形態を示す斜視図。FIG. 2 is a perspective view showing a second embodiment of the present invention.
【図３】本発明の第３の実施形態を示す斜視図。FIG. 3 is a perspective view showing a third embodiment of the present invention.
【図４】本発明の製造方法を示すフロー図。FIG. 4 is a flowchart showing a manufacturing method of the present invention.
【図５】本発明の製造工程におけるプリント配線板の斜
視図。FIG. 5 is a perspective view of a printed wiring board in a manufacturing process according to the present invention.
１ 基板 ２，５ 電極 ３ 空洞部 ４ 外周除去部 ６ 銅メッキ層 ７ 半田メッキ層 ８ 凹部 ９ 銅箔 １０ スルーホール １１ パターン DESCRIPTION OF SYMBOLS 1 Substrate 2, 5 electrode 3 Cavity part 4 Periphery removal part 6 Copper plating layer 7 Solder plating layer 8 Depression 9 Copper foil 10 Through hole 11 Pattern
Claims (4)
るプリント配線板において、前記電極の中央部に空洞部
を設けたことを特徴とするプリント配線板。1. A printed wiring board having an electrode for mounting a molten metal ball, wherein a hollow portion is provided at a central portion of the electrode.
るプリント配線板において、前記電極の中央部に空洞部
を設け、前記電極の外周部にその一部を除去した外周除
去部を設けたことを特徴とするプリント配線板。2. A printed wiring board having an electrode for mounting a molten metal ball, wherein a hollow portion is provided in a central portion of the electrode, and an outer peripheral removing portion in which a part thereof is removed is provided in an outer peripheral portion of the electrode. A printed wiring board, characterized in that:
るプリント配線板において、前記電極の外周部上にメッ
キ金属層を重ねるように設けて中央部に凹部を形成した
ことを特徴とするプリント配線板。3. A printed wiring board having an electrode for mounting a molten metal ball, wherein a plated metal layer is provided on an outer peripheral portion of the electrode so as to overlap, and a concave portion is formed in a central portion. Wiring board.
スルーホールを形成したものに銅メッキする工程と、 ドライフィルムを貼付けて露光する工程と、 現像処理により電極の外周部以外にメッキレジストを形
成する工程と、 半田メッキを行って前記外周部上にメッキ金属層を形成
し、前記メッキレジストを除去する工程と、 更にドライフィルムを貼付けて露光する工程と、 現像処理によりパターンを形成する工程とを備えたこと
を特徴とするプリント配線板の製造方法。4. A step of bonding a copper foil to a substrate, drilling and forming a through hole by copper plating, attaching a dry film and exposing, and developing a portion other than the outer peripheral portion of the electrode. A step of forming a plating resist, a step of forming a plating metal layer on the outer peripheral portion by performing solder plating, and a step of removing the plating resist; a step of further attaching a dry film and exposing; Forming a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6893998A JPH11266066A (en) | 1998-03-18 | 1998-03-18 | Printed wiring board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6893998A JPH11266066A (en) | 1998-03-18 | 1998-03-18 | Printed wiring board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11266066A true JPH11266066A (en) | 1999-09-28 |
Family
ID=13388149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6893998A Pending JPH11266066A (en) | 1998-03-18 | 1998-03-18 | Printed wiring board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11266066A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7405479B2 (en) | 2004-09-14 | 2008-07-29 | Nitto Denko Corporation | Wired circuit board |
| US7732900B2 (en) | 2004-10-21 | 2010-06-08 | Nitto Denko Corporation | Wired circuit board |
-
1998
- 1998-03-18 JP JP6893998A patent/JPH11266066A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7405479B2 (en) | 2004-09-14 | 2008-07-29 | Nitto Denko Corporation | Wired circuit board |
| US7732900B2 (en) | 2004-10-21 | 2010-06-08 | Nitto Denko Corporation | Wired circuit board |
| US8015703B2 (en) | 2004-10-21 | 2011-09-13 | Nitto Denko Corporation | Method of manufacturing a wired circuit board |
| US8146246B2 (en) | 2004-10-21 | 2012-04-03 | Nitto Denko Corporation | Method of manufacturing a wired circuit board |
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