JPH11257884A - Temperature controller employing heat pipe - Google Patents

Temperature controller employing heat pipe

Info

Publication number
JPH11257884A
JPH11257884A JP10058529A JP5852998A JPH11257884A JP H11257884 A JPH11257884 A JP H11257884A JP 10058529 A JP10058529 A JP 10058529A JP 5852998 A JP5852998 A JP 5852998A JP H11257884 A JPH11257884 A JP H11257884A
Authority
JP
Japan
Prior art keywords
temperature
heat pipe
heat
temperature control
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10058529A
Other languages
Japanese (ja)
Inventor
Shigeru Yoshida
茂 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP10058529A priority Critical patent/JPH11257884A/en
Publication of JPH11257884A publication Critical patent/JPH11257884A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Abstract

PROBLEM TO BE SOLVED: To control the characteristics effectively even under the environment of satellite or high voltage electric apparatus by driving a thermoelectric conversion element actively such that the temperature at an objective part reaches a preset target level by heat being transmitted through a heat pipe. SOLUTION: A heat transmission element 2 converts externally supplied power into heat which is transmitted through a heat pipe 1 to an objective part OB. A temperature detector 3 detects heat at the objective part OB and delivers a feedback signal S1 to a temperature control section 4. The temperature control section 4 compares it with a preset target temperature and sets a quantity of current being fed to the heat transmission element 2 based on the temperature difference such that the temperature at the objective part OB is equal to the preset target level thus performing temperature control of the heat pipe 1. Consequently, a heat source can be subjected to active temperature control and the temperature can be made uniform among respective apparatus when this system is applied to a satellite.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、ヒートパイプを
用いた温度制御装置にかかり、特に人工衛星、高電圧電
気機器などの産業用機器及びその構成機器に対する冷却
および加熱制御の工夫に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature control apparatus using a heat pipe, and more particularly to a device for controlling cooling and heating of industrial equipment such as artificial satellites and high-voltage electrical equipment and components thereof.

【０００２】[0002]

【従来の技術】人工衛星用搭載機器や高電圧装置等の電
気機器では、温度環境の過酷な条件下で使用したり、運
転状態により温度変動が特定部位に集中したりするた
め、その温度対策として一般産業用電子機器の冷却及び
加熱やその温度制御に関する汎用仕様をそのまま適用す
ることは困難である。2. Description of the Related Art Electrical equipment such as on-board equipment for satellites and high-voltage equipment is used under severe conditions of the temperature environment, and temperature fluctuations are concentrated on specific parts depending on the operating conditions. It is difficult to directly apply general-purpose specifications relating to cooling and heating of general industrial electronic devices and temperature control thereof.

【０００３】たとえば人工衛星の場合には、搭載機器の
配置上その質量分布の均等性に関する制約があったり、
真空に晒されたり、太陽からの熱放射の影響を強く受け
たりするため、搭載すべき電子機器は低温から高温まで
の広範囲にわたる温度環境を考慮に入れて選定しなけれ
ばならず、装置全体がより複雑でかつ高価なものになる
といった不都合があった。For example, in the case of an artificial satellite, there are restrictions on the uniformity of the mass distribution due to the arrangement of the onboard equipment,
To be exposed to a vacuum or to be strongly affected by the heat radiation from the sun, the electronic devices to be mounted must be selected in consideration of a wide temperature environment from low to high temperatures. There has been a disadvantage that it becomes more complicated and expensive.

【０００４】また高電圧電気機器の場合には、電磁誘導
や電流等による加熱を抑制する方法として、一般には電
気絶縁油、空気を含む電気絶縁性ガス、または冷却水を
媒介して全体を平均的に冷却する手法が採用されている
が、運転状態によっては高電庄側の電気絶縁部が障害と
なって特定部位が発熱しやすく、この制約によって運転
が制限され、搭載機器の容量も制約を受けるといった問
題があった。この対案として平均冷却を多くする方法も
考えられるが、この場合には冷却に要する熱損失の増大
を招き、その効率が低下してしまう。In the case of high-voltage electrical equipment, as a method of suppressing heating by electromagnetic induction, electric current, or the like, generally, the entirety is averaged through electric insulating oil, an electric insulating gas containing air, or cooling water. Depending on the operating conditions, the electrical insulation on the high voltage side may cause a failure and specific parts may easily generate heat, which limits the operation and limits the capacity of the mounted equipment. There was a problem of receiving. As a countermeasure, a method of increasing the average cooling is conceivable, but in this case, the heat loss required for cooling is increased, and the efficiency is reduced.

【０００５】そこで上記のような人工衛星や高電圧電気
機器の温度仕様に関する対策として、近年、熱伝導率に
優れたヒートパイプを適用する技術が注目されている。
以下、このヒートパイプの一例を図７〜図９に基づいて
説明する。Therefore, as a measure against the temperature specification of artificial satellites and high-voltage electrical equipment as described above, in recent years, a technique of applying a heat pipe having excellent heat conductivity has been attracting attention.
Hereinafter, an example of the heat pipe will be described with reference to FIGS.

【０００６】図７及び図８に示すヒートパイプ１００
は、同形状の銅製の丸棒と比べて数百倍の熱伝導率を示
すものであり、筒内の加熱・冷却媒体（作動液）に水を
用いて例えば１５０℃で作動させることにより図示しな
い対象部を冷却または加熱するようになっている。具体
的にこのヒートパイプ１００は、真空の蒸気空間（蒸気
路炉）ＶＳをなす筒状容器（コンテナ）１０１と、この
筒状容器１０１内の内壁側に装着されるウィック１０２
とを備えている。The heat pipe 100 shown in FIGS. 7 and 8
Shows a thermal conductivity several hundred times higher than that of a copper round bar of the same shape, and is shown by operating at 150 ° C. using water as a heating / cooling medium (working fluid) in the cylinder. The target part is not cooled or heated. Specifically, the heat pipe 100 includes a cylindrical container (container) 101 forming a vacuum steam space (steam path furnace) VS, and a wick 102 mounted on the inner wall side of the cylindrical container 101.
And

【０００７】この内、筒状容器１０１は金属または電気
的絶縁物、あるいは両者を接続した組み合わせ等の材質
でなり、用途に応じて円筒形などのさまざま形状に構成
されている。この筒状容器１０１には、例えば高電圧環
境等の対策として必要に応じてその途中の所定区間の外
側表面をカバーするように絶縁筒１１０が設置される場
合もある（図７参照）。また、ウィック１０２はガラス
繊維、金網、発泡材、フェルト、及び焼結合金などの毛
管力を発揮可能な材質でなり、凹凸構造式やその他さま
ざまな構造で構成されている。[0007] Of these, the cylindrical container 101 is made of a material such as a metal or an electrical insulator, or a combination of both, and is formed into various shapes such as a cylindrical shape depending on the application. In some cases, the cylindrical container 101 is provided with an insulating tube 110 so as to cover the outer surface of a predetermined section in the middle as necessary as a measure against a high-voltage environment or the like (see FIG. 7). The wick 102 is made of a material capable of exerting a capillary force, such as a glass fiber, a wire net, a foam material, a felt, and a sintered alloy, and has a concavo-convex structure or various other structures.

【０００８】このような構成のヒートパイプ１００で
は、両端部の温度勾配による熱移動・伝達が水及びその
蒸気の流れを媒介にして行われる。すなわち、筒状容器
１０１内の蒸発部をなす一方の端部で熱を与えて適量の
水を蒸発させると、その蒸気流が真空下で断熱部をなす
蒸気空間ＶＳに沿ってその低圧側の凝縮部をなす他方の
端部に移動し、ここで冷えて凝縮する。この凝縮により
発生する水は、ウィック１０２中に浸透し、蒸気流とは
逆の経路に沿ってウィック１０２中をその毛管力により
還流して蒸発部に戻る。これ以後、同様の熱移動・伝達
が繰り返される。これは、ヒートパイプ１００の両端部
の温度差が解消され、平均温度に達するまで行われる。[0008] In the heat pipe 100 having such a configuration, heat transfer / transmission by the temperature gradient at both ends is performed through the flow of water and its steam. That is, when heat is applied at one end forming the evaporating portion in the cylindrical container 101 to evaporate an appropriate amount of water, the steam flow is moved along the steam space VS forming an adiabatic portion under vacuum to the low-pressure side. It moves to the other end of the condensing section, where it cools and condenses. The water generated by the condensation penetrates into the wick 102, returns along the path opposite to the vapor flow in the wick 102 by its capillary force, and returns to the evaporator. Thereafter, the same heat transfer / transmission is repeated. This is performed until the temperature difference between both ends of the heat pipe 100 is eliminated and the average temperature is reached.

【０００９】このようなヒートパイプ１００の熱伝達特
性を利用した冷却・加熱装置の一例を図８に示す。この
図に示す冷却・加熱装置は、上記と同様のヒートパイプ
１００の作動媒体の流量を補助的に制御する構成とし
て、筒状容器１０１内の途中箇所で加熱または冷却して
温度勾配を変化させることにより流量を制御する流量制
御部１２０を備えている。FIG. 8 shows an example of a cooling / heating apparatus utilizing the heat transfer characteristics of the heat pipe 100. The cooling / heating device shown in this figure is configured to supplementally control the flow rate of the working medium of the heat pipe 100 in the same manner as described above, and changes the temperature gradient by heating or cooling at an intermediate position in the cylindrical container 101. A flow control unit 120 for controlling the flow rate.

【００１０】その他の従来例としては、筒状容器内の媒
体に予め電磁性を有する材料を混合する一方、容器外部
に電磁コイルを配置し、この電磁コイルの駆動により媒
体流量を制御する装置や、熱源部に設けた温度センサに
よってガス溜め内のガス庄を変化させてヒートパイプ自
体を制御する装置が知られている。As another conventional example, there is an apparatus for mixing a medium having an electromagnetic property in advance into a medium in a cylindrical container, disposing an electromagnetic coil outside the container, and controlling the flow rate of the medium by driving the electromagnetic coil. There is known a device that controls a heat pipe itself by changing a gas pressure in a gas reservoir by a temperature sensor provided in a heat source unit.

【００１１】[0011]

【発明が解決しようとする課題】しかしながら、前述の
従来例のヒートパイプを人工衛星や高電圧電気機器等に
搭載する場合には、次のような新たな問題が想定され
る。However, when the above-described conventional heat pipe is mounted on an artificial satellite, a high-voltage electric device, or the like, the following new problems are expected.

【００１２】１）：人工衛星にヒートパイプを搭載した
装置として、例えば各電子機器の間をヒートパイプ単体
でつなぎ、そのヒートパイプを介して熱の流通を図るこ
とにより各電子機器の間の温度差を等温度に近い状態に
する事例（例えば、１９６８年米国ＧＥＯＳ−Ｂ参照）
があるが、この等温度自体は、人工衛星と他天体から受
ける熱輻射との関係で決まるため、搭載電子機器の温度
を能動的に制御できない。1): As an apparatus in which a heat pipe is mounted on an artificial satellite, for example, each electronic device is connected by a single heat pipe, and heat is circulated through the heat pipe to thereby control the temperature between the electronic devices. A case where the difference is close to an equal temperature (for example, see 1968 US GEOS-B)
However, since the temperature itself is determined by the relationship between the artificial satellite and the heat radiation received from other celestial bodies, the temperature of the onboard electronic device cannot be actively controlled.

【００１３】２）：高電圧電気機器の加熱部位にヒート
パイプを接触させ、その他の部位との間の温度差を利用
して熱拡散させることは可能であるが、他の部位の温度
が高い場合には熱拡散効果が低減し、その対象部位の温
度を能動的にかつ確実に制御できない。2): It is possible to bring a heat pipe into contact with a heated portion of the high-voltage electrical equipment and to perform heat diffusion by utilizing a temperature difference between other portions, but the temperature of other portions is high. In this case, the heat diffusion effect is reduced, and the temperature of the target portion cannot be actively and reliably controlled.

【００１４】上記１）および２）の問題は、ヒートパイ
プがそれ自体では熱の注入あるいは放熱を能動的に行う
要素でないために生じている。熱の注入・放熱を能動的
に行う要素としては熱電子素子が知られているが、この
場合の冷却・加熱はその素子に接触・近接する部分しか
行えず不十分である。The above problems 1) and 2) occur because the heat pipe itself is not an element for actively injecting or releasing heat. A thermoelectronic element is known as an element that actively injects and dissipates heat. However, in this case, cooling and heating can only be performed in a portion in contact with or in proximity to the element, which is insufficient.

【００１５】この発明は、このような従来技術の問題を
考慮に入れてなされたもので、人工衛星や高電圧電気機
器などの環境下であっても、ヒートパイプによる冷却・
加熱特性を生かしつつ、その特性をより効果的に制御す
る温度制御装置を提供することを目的とする。The present invention has been made in consideration of such problems of the prior art, and is capable of cooling by a heat pipe even in an environment such as a satellite or a high-voltage electric device.
An object of the present invention is to provide a temperature control device that controls heating characteristics more effectively while utilizing the heating characteristics.

【００１６】[0016]

【課題を解決するための手段】上記目的を達成するた
め、この発明にかかるヒートパイプを用いた温度制御装
置は、冷却または加熱を要する対象部の温度を制御する
装置であって、熱電変換素子と、この熱電変換素子およ
び前記対象部の間を熱伝達するヒートパイプと、このヒ
ートパイプによる熱伝達により前記対象部の温度が予め
設定された目標温度となるように能動的に前記熱電変換
素子を駆動する駆動手段とを備えたことを特徴とする。In order to achieve the above object, a temperature control device using a heat pipe according to the present invention is a device for controlling the temperature of a target portion requiring cooling or heating, and comprises a thermoelectric conversion element. And a heat pipe for transferring heat between the thermoelectric conversion element and the target section, and the thermoelectric conversion element actively so that the temperature of the target section becomes a preset target temperature by heat transfer by the heat pipe. And driving means for driving the.

【００１７】たとえば、ヒートパイプは、その一端を対
象部（被温度制御対象：固形、流体、ガスいずれでも良
い）に接触あるいは近傍に配置する一方、その他端を熱
電変換素子（電子冷却素子）の加熱端あるいは冷却端に
接触させる構成とする。このようにヒートパイプに熱供
給・放熱能動素子としての熱電変換素子を組み合わせる
ことにより、ヒートパイプに熱供給・放熱の制御機能を
備えた新規な冷却・加熱システムを簡素に構築でき、ヒ
ートパイプ近傍あるいは遠隔地点にある対象部の温度を
能動的に制御できる。For example, one end of a heat pipe is placed in contact with or near a target portion (a temperature controlled object: any of solid, fluid, and gas), and the other end of the heat pipe is a thermoelectric conversion element (electronic cooling element). It is configured to contact the heating end or the cooling end. By combining a heat pipe with a thermoelectric conversion element as an active element for supplying and dissipating heat, a new cooling and heating system with a function for controlling heat supply and heat dissipation can be simply constructed on the heat pipe, and the vicinity of the heat pipe Alternatively, the temperature of the target at a remote location can be actively controlled.

【００１８】この発明で好ましくは、前記ヒートパイプ
は、熱伝達通路をなす筒状本体と、この筒状本体の外側
表面の少なくとも一部に配置される絶縁体とを備えるも
のとする。この絶縁体により、たとえば高電圧環境下で
のヒートパイプ設置性をより高める利点がある。Preferably, in the present invention, the heat pipe includes a tubular main body forming a heat transfer passage, and an insulator disposed on at least a part of an outer surface of the tubular main body. This insulator has an advantage that the heat pipe installation property under a high voltage environment is further improved.

【００１９】この発明の他の構成として、前記ヒートパ
イプ内のガス圧を制御する手段をさらに備えた場合、前
記ヒートパイプが複数本のヒートパイプである場合、前
記複数本のヒートパイプを前記熱電変換素子の加熱側お
よび冷却側の少なくとも一方に配置した場合、前記駆動
手段は、前記対象部の温度を検出する温度検出器と、こ
の温度検出器による検出値と予め設定された目標値とを
比較する手段と、この比較手段による比較結果に基づい
て前記熱電変換素子に電気信号を供給する手段とを備え
た場合、前記温度検出器による検出信号を非接触状態で
伝送する手段をさらに備えた場合を挙げることができ
る。As another configuration of the present invention, when the apparatus further comprises means for controlling a gas pressure in the heat pipe, when the heat pipe is a plurality of heat pipes, the plurality of heat pipes are connected to the thermoelectric pipe. When disposed on at least one of the heating side and the cooling side of the conversion element, the driving unit includes a temperature detector that detects the temperature of the target portion, and a detection value detected by the temperature detector and a preset target value. In the case where there is provided a means for comparing, and a means for supplying an electric signal to the thermoelectric conversion element based on a comparison result by the comparing means, the apparatus further comprises means for transmitting a detection signal from the temperature detector in a non-contact state. Cases can be mentioned.

【００２０】[0020]

【発明の実施の形態】以下、この発明にかかるヒートパ
イプを用いた温度制御装置の実施の形態を図面を参照し
て説明する。ここでのヒートパイプは、特に断らない限
り前述の従来例と同一または同等の構造を有するため、
その説明を簡略または省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a temperature control device using a heat pipe according to the present invention will be described below with reference to the drawings. Since the heat pipe here has the same or equivalent structure as the above-mentioned conventional example unless otherwise specified,
The description is simplified or omitted.

【００２１】（第１の実施の形態）図１に示すヒートパ
イプ１を用いた温度制御装置ＴＣは、人工衛星ＤＶの外
被内に収納されるトランスポンダ等の対象部ＯＢの温度
を制御する装置に適用したものである。ここでの対象部
ＯＢは、冷却または加熱（以下の説明では便宜上「冷
却」に略称する）を要する「被温度制御対象区画」とし
て機器そのものに限らずその環境も含めた広い概念で使
用し、固形、流体、ガスなどのいずれの形態であっても
よい。(First Embodiment) A temperature control device TC using a heat pipe 1 shown in FIG. 1 is a device for controlling the temperature of a target portion OB such as a transponder housed in a jacket of an artificial satellite DV. It is applied to The target portion OB here is used as a “temperature controlled target section” requiring cooling or heating (hereinafter, abbreviated to “cooling” for convenience) in a broad concept including not only the device itself but also its environment, Any form of solid, fluid, gas, etc. may be used.

【００２２】この温度制御装置ＴＣは、対象部ＯＢを冷
却するヒートパイプ１のほか、このヒートパイプ２に熱
的に接続される熱電素子２と、対象部ＯＢの温度を検出
する温度検出器３と、その検出信号に基づいて熱電素子
２を駆動させて対象部ＯＢの温度を制御する温度制御部
４とを備えている（温度制御部４と温度検出部３とがこ
の発明の駆動手段を成す）。The temperature control device TC includes a heat pipe 1 for cooling the target portion OB, a thermoelectric element 2 thermally connected to the heat pipe 2, and a temperature detector 3 for detecting the temperature of the target portion OB. And a temperature control unit 4 that drives the thermoelectric element 2 based on the detection signal to control the temperature of the target unit OB (the temperature control unit 4 and the temperature detection unit 3 serve as driving means of the present invention). Perform).

【００２３】ヒートパイプ１は、ここでは前述と同様の
図示しない筒状本体及びその蒸気路を臨む内壁側に装着
されるウィックを備えた標準ヒートパイプを適用してあ
るが、これに限定されず、凝縮液を蒸発部側に戻す方式
として、例えば重力を用いた熱サイフォン、遠心力を用
いた回転式ヒートパイプ、静電気力を用いた電気液体力
学式ヒートパイプ、磁力を用いた電磁流体力学式ヒート
パイプ、および浸透圧を用いた浸透式ヒートパイプ等を
適用したものでもよい。As the heat pipe 1, a standard heat pipe having a tubular body (not shown) similar to that described above and a wick mounted on the inner wall side facing the steam path is applied, but is not limited thereto. As a method of returning condensed liquid to the evaporating part side, for example, thermosiphon using gravity, rotary heat pipe using centrifugal force, electro-hydrodynamic heat pipe using electrostatic force, magneto-hydrodynamic type using magnetic force A heat pipe, an osmotic heat pipe using osmotic pressure, or the like may be applied.

【００２４】熱電素子２は、電流を熱に変換するペルチ
エ効果を発揮させる熱電交換素子（「電子冷却素子」と
も言う）であり、外部から電力供給（電流）を受けてこ
れを熱に変換し、その熱をヒートパイプ１を介して対象
部ＯＢに熱伝達する。The thermoelectric element 2 is a thermoelectric exchange element (also referred to as an “electronic cooling element”) that exerts a Peltier effect for converting current to heat, and receives power supply (current) from outside to convert it to heat. Then, the heat is transmitted to the target portion OB via the heat pipe 1.

【００２５】温度検出器３は、例えば熱電対などの温度
センサで構成され、対象部ＯＢの温度を検出し、その検
出信号をフィードバック温度信号Ｓ１として温度制御部
４に供給する。The temperature detector 3 is composed of, for example, a temperature sensor such as a thermocouple, detects the temperature of the target section OB, and supplies the detection signal to the temperature control section 4 as a feedback temperature signal S1.

【００２６】温度制御部４は、例えばマイクロプロセッ
サを搭載したコントローラおよび所定の電源回路等で構
成され、検出器３からのフィードバック信号Ｓ１と予め
設定された目標温度とを互いに比較し、その温度差に基
づく熱電素子２への電流供給量を設定し、その制御信号
Ｓ２を熱電素子２に供給することにより、対象部ＯＢの
温度が目標温度となるようにヒートパイプ１に対する温
度制御を行う。The temperature control section 4 is composed of, for example, a controller equipped with a microprocessor and a predetermined power supply circuit. The temperature control section 4 compares a feedback signal S1 from the detector 3 with a preset target temperature, and compares the temperature difference. By controlling the amount of current supplied to the thermoelectric element 2 based on the above, and supplying the control signal S2 to the thermoelectric element 2, the temperature of the heat pipe 1 is controlled so that the temperature of the target portion OB becomes the target temperature.

【００２７】従ってこの実施の形態によれば、熱電素子
からヒートパイプへの熱の注入あるいは熱の吸収（放
散）が可能になり、従来のヒートパイプ単独の制御やそ
の流量制御、ガス庄制御と比べて、熱源を制御する能動
的な温度制御が可能となる。特にこのシステムを人工衛
星に適用すれば、人工衛星の各収納機器の温度を均一化
し、特に電子機器に要求される使用温度範囲の幅を狭く
することが可能になり、電子機器に求められる幅広い温
度仕様を低減し、かつ太陽からの熱放射の影響による温
度ヒートサイクルも低減し、電子機器の寿命を延ばすこ
とが容易になるといった有利な利点がある。Therefore, according to this embodiment, it is possible to inject or absorb (dissipate) heat from the thermoelectric element to the heat pipe, and to perform conventional control of the heat pipe alone, flow rate control thereof, and gas pressure control. In comparison, active temperature control for controlling the heat source becomes possible. In particular, if this system is applied to an artificial satellite, it becomes possible to equalize the temperature of each storage device of the artificial satellite, and in particular, to narrow the range of the operating temperature range required for electronic devices, and the wide range required for electronic devices There are advantageous advantages that the temperature specification is reduced, the temperature heat cycle due to the influence of heat radiation from the sun is also reduced, and the life of the electronic device is easily extended.

【００２８】なお、熱電素子と温度制御部との間の距離
は比較的遠方でもよく、またヒートパイプは直線状のも
のに限定されず、曲線状のものを使えば対象部を収納す
る機器全体の中の配置性をより一層高めることができ
る。The distance between the thermoelectric element and the temperature control section may be relatively long, and the heat pipe is not limited to a straight pipe, but a curved pipe may be used to accommodate the entire equipment for housing the target section. Can be further improved.

【００２９】（第２の実施の形態）図２に示す温度制御
装置ＴＣは、前記構成に加え、ヒートパイプ１の外側表
面の所定区間をカバーする電気絶縁手段として筒状の絶
縁体５を備えたものである。この場合には、上記効果に
加え、対象部ＯＢが高電圧環境下に存在する場合であっ
ても、絶縁体５を介してヒートパイプ１を電気的に絶縁
できることから、高電圧電気機器へのヒートパイプ適用
がより一層安全かつ容易に可能になる利点がある。具体
的には、このように絶縁体を設けたシステムを高電圧電
気機器に搭載すれば、その運転状態に応じてより効果的
に冷却を行うことができ、被冷却部位の温度を低減した
運転により機器の容量制限を軽減できる。また、温度の
上下変動によるヒートサイクルの温度幅を狭く抑制でき
ることから機器の寿命を延ばすことが可能になるといっ
た利点もある。(Second Embodiment) A temperature control device TC shown in FIG. 2 is provided with a cylindrical insulator 5 as an electrical insulating means for covering a predetermined section on the outer surface of the heat pipe 1 in addition to the above-mentioned structure. It is a thing. In this case, in addition to the above-described effects, even when the target portion OB exists in a high-voltage environment, the heat pipe 1 can be electrically insulated via the insulator 5, so There is an advantage that the heat pipe application can be more safely and easily made. Specifically, if a system provided with such an insulator is mounted on a high-voltage electrical device, cooling can be performed more effectively in accordance with the operation state, and an operation in which the temperature of a portion to be cooled is reduced. Thus, the capacity limitation of the device can be reduced. Further, since the temperature width of the heat cycle due to the fluctuation of the temperature can be suppressed to be narrow, there is an advantage that the life of the device can be extended.

【００３０】（第３の実施の形態）図３に示す温度制御
装置ＴＣは、図２と同様の構成に加え、温度検出器３か
ら温度制御部３への信号伝送を電気的に非接触でかつ絶
縁状態で行う構成を付加したものである。具体的には、
温度検出器３を赤外線センサと温度計測部とで構成す
る。その他、検出信号を発光素子および受光素子を用い
て非接触で光伝送する構成などであってもよい。この場
合には、上記と同様の効果に加え、電気的な絶縁状態が
必要とされる等の環境の制約を受けずにどのような設置
状況であって対象部の温度計測とそのフィードバック制
御を実現できるといった利点がある。(Third Embodiment) The temperature control device TC shown in FIG. 3 has the same configuration as that of FIG. 2 and also transmits signals from the temperature detector 3 to the temperature control unit 3 in an electrically non-contact manner. In addition, a configuration for performing the operation in an insulating state is added. In particular,
The temperature detector 3 includes an infrared sensor and a temperature measurement unit. In addition, a configuration in which a detection signal is transmitted in a non-contact manner using a light emitting element and a light receiving element may be employed. In this case, in addition to the same effects as described above, the temperature measurement of the target part and the feedback control thereof can be performed in any installation condition without being restricted by the environment such as the need for an electrical insulation state. There is an advantage that it can be realized.

【００３１】（第４の実施の形態）図４に示す温度制御
装置ＴＣは、熱電素子２への温度制御に加え、複数本の
ヒートパイプ１…１の途中にガス圧制御方式による温度
制御機能、すなわちガス圧制御部６を付加し、このガス
圧制御部６への温度制御用ガス圧制御信号Ｓ３を温度制
御部４で生成するように構成したものである。この場合
には、上記と同様の効果に加え、多数箇所の温度制御を
同時に実施できるといった利点がある。(Fourth Embodiment) A temperature control device TC shown in FIG. 4 has a temperature control function by a gas pressure control method in the middle of a plurality of heat pipes 1. That is, a gas pressure control unit 6 is added, and a temperature control gas pressure control signal S3 to the gas pressure control unit 6 is generated by the temperature control unit 4. In this case, in addition to the same effects as described above, there is an advantage that the temperature control at many points can be performed simultaneously.

【００３２】（第５の実施の形態）図５に示す温度制御
装置ＴＣは、前記構成に加え、熱電素子１の互いに反対
の極性を有する両面（加熱側および冷却側）にそれぞれ
ヒートパイプ１、１を接触させ配置したものである。こ
の両ヒートパイプ１、１により加熱と冷却の逆の動作を
行えば、対象部ＯＢの近傍以外の箇所についても熱の放
散・加熱を積極的に実施できるといった利点がある。(Fifth Embodiment) In addition to the above configuration, the temperature control device TC shown in FIG. 5 has heat pipes 1 and 2 on both sides (heating side and cooling side) of the thermoelectric element 1 having opposite polarities. 1 are arranged in contact with each other. If the operations opposite to the heating and cooling are performed by the two heat pipes 1 and 1, there is an advantage that heat can be actively dissipated and heated even in a portion other than the vicinity of the target portion OB.

【００３３】（第６の実施の形態）図６に示すヒートパ
イプ１を用いた温度制御装置ＴＣは、熱電素子の両面に
それぞれ複数本のヒートパイプ１…１を接触させて配置
した構成で、熱放散あるいは加熱を対象部ＯＢの近傍以
外の箇所から積極的に実施する。また、この各ヒートパ
イプ１…１毎に個別に複数のガス圧制御部６…６を配置
する。この場合には、前記第５の実施の形態の場合の効
果をより一層高め、対象部の近傍以外の箇所での熱放散
・加熱についても十分管理できるといった利点がある。(Sixth Embodiment) A temperature control device TC using a heat pipe 1 shown in FIG. 6 has a structure in which a plurality of heat pipes 1... Heat dissipation or heating is actively performed from a location other than the vicinity of the target portion OB. Further, a plurality of gas pressure controllers 6... 6 are individually arranged for each of the heat pipes 1. In this case, there is an advantage that the effect of the fifth embodiment is further enhanced, and the heat dissipation / heating at a portion other than the vicinity of the target portion can be sufficiently managed.

【００３４】[0034]

【発明の効果】以上説明したように、この発明によれ
ば、人工衛星や高電圧電気機器などの環境下であって
も、熱源としてヒートパイプの高熱伝導性を生かして熱
供給あるいは吸熱すると共に、その熱供給・吸熱の温度
制御を能動的に行う温度制御装置を提供できる。とくに
絶縁体を付加した構成により、高電圧環境下に機器があ
ってもより一層容易に適用できるといった利点がある。As described above, according to the present invention, heat can be supplied or absorbed by utilizing the high thermal conductivity of a heat pipe as a heat source even in an environment such as an artificial satellite or high-voltage electrical equipment. In addition, it is possible to provide a temperature control device that actively controls the temperature of heat supply and heat absorption. In particular, the configuration to which an insulator is added has an advantage that the device can be more easily applied even in the presence of a device under a high voltage environment.

【図面の簡単な説明】[Brief description of the drawings]

【図１】第１の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 1 is a conceptual diagram showing a system configuration of a temperature control device according to a first embodiment.

【図２】第２の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 2 is a conceptual diagram showing a system configuration of a temperature control device according to a second embodiment.

【図３】第３の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 3 is a conceptual diagram showing a system configuration of a temperature control device according to a third embodiment.

【図４】第４の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 4 is a conceptual diagram showing a system configuration of a temperature control device according to a fourth embodiment.

【図５】第５の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 5 is a conceptual diagram showing a system configuration of a temperature control device according to a fifth embodiment.

【図６】第６の実施の形態にかかる温度制御装置のシス
テム構成を示す概念図。FIG. 6 is a conceptual diagram showing a system configuration of a temperature control device according to a sixth embodiment.

【図７】従来例のヒートパイプの主要構造を説明する概
略軸方向断面図。FIG. 7 is a schematic axial sectional view illustrating a main structure of a conventional heat pipe.

【図８】図７のＡ−Ａ線に沿った概略横断面。FIG. 8 is a schematic cross section taken along line AA of FIG. 7;

【図９】従来例のヒートパイプ内の流量制御を行う装置
を説明する概念図。FIG. 9 is a conceptual diagram illustrating a conventional apparatus for controlling a flow rate in a heat pipe.

【符号の説明】[Explanation of symbols]

１ ヒートパイプ ２ 熱電素子 ３ 温度検出器 ４ 温度制御部 ５ 絶縁体 ６ ガス圧制御部 ＴＣ 温度制御装置 ＤＶ 人工衛星または高電圧電気機器 ＯＢ 対象部 DESCRIPTION OF SYMBOLS 1 Heat pipe 2 Thermoelectric element 3 Temperature detector 4 Temperature control part 5 Insulator 6 Gas pressure control part TC Temperature control device DV Artificial satellite or high voltage electric equipment OB Target part

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】 冷却または加熱を要する対象部の温度を
制御する装置であって、熱電変換素子と、この熱電変換
素子および前記対象部の間を熱伝達するヒートパイプ
と、このヒートパイプによる熱伝達により前記対象部の
温度が予め設定された目標温度となるように能動的に前
記熱電変換素子を駆動する駆動手段とを備えたことを特
徴とするヒートパイプを用いた温度制御装置。1. An apparatus for controlling the temperature of a target part requiring cooling or heating, comprising: a thermoelectric conversion element; a heat pipe for transferring heat between the thermoelectric conversion element and the target part; A temperature control device using a heat pipe, comprising: driving means for actively driving the thermoelectric conversion element so that the temperature of the target portion becomes a preset target temperature by transmission. 【請求項２】 請求項１記載の発明において、前記ヒー
トパイプは、熱伝達通路をなす筒状本体と、この筒状本
体の外側表面の少なくとも一部に配置される絶縁体とを
備えたことを特徴とするヒートパイプを用いた温度制御
装置。2. The invention according to claim 1, wherein the heat pipe includes a tubular main body forming a heat transfer passage, and an insulator disposed on at least a part of an outer surface of the tubular main body. A temperature control device using a heat pipe. 【請求項３】 請求項１または２記載の発明において、
前記ヒートパイプ内のガス圧を制御する手段をさらに備
えたことを特徴とするヒートパイプを用いた温度制御装
置。3. The method according to claim 1, wherein
A temperature control device using a heat pipe, further comprising means for controlling a gas pressure in the heat pipe. 【請求項４】 請求項１から３までのいずれか１項に記
載の発明において、前記ヒートパイプは、複数本のヒー
トパイプであることを特徴とするヒートパイプを用いた
温度制御装置。4. The temperature control device using a heat pipe according to claim 1, wherein the heat pipe is a plurality of heat pipes. 【請求項５】 請求項４記載の発明において、前記複数
本のヒートパイプは、前記熱電変換素子の加熱側および
冷却側の少なくとも一方に配置されることを特徴とする
ヒートパイプを用いた温度制御装置。5. The temperature control using a heat pipe according to claim 4, wherein the plurality of heat pipes are arranged on at least one of a heating side and a cooling side of the thermoelectric conversion element. apparatus. 【請求項６】 請求項１から５までのいずれか１項に記
載の発明において、前記駆動手段は、前記対象部の温度
を検出する温度検出器と、この温度検出器による検出値
と予め設定された目標値とを比較する手段と、この比較
手段による比較結果に基づいて前記熱電変換素子に電気
信号を供給する手段とを備えたことを特徴とするヒート
パイプを用いた温度制御装置。6. The invention according to claim 1, wherein said driving means includes a temperature detector for detecting a temperature of said target portion, and a value detected by said temperature detector and preset. A temperature control device using a heat pipe, comprising: means for comparing the set value with a set target value; and means for supplying an electric signal to the thermoelectric conversion element based on a comparison result by the comparison means. 【請求項７】 請求項６記載の発明において、前記温度
検出器による検出信号を非接触状態で伝送する手段をさ
らに備えたことを特徴とするヒートパイプを用いた温度
制御装置。7. A temperature control device using a heat pipe according to claim 6, further comprising: means for transmitting a detection signal from said temperature detector in a non-contact state.
JP10058529A 1998-03-10 1998-03-10 Temperature controller employing heat pipe Pending JPH11257884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10058529A JPH11257884A (en) 1998-03-10 1998-03-10 Temperature controller employing heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10058529A JPH11257884A (en) 1998-03-10 1998-03-10 Temperature controller employing heat pipe

Publications (1)

Publication Number Publication Date
JPH11257884A true JPH11257884A (en) 1999-09-24

Family

ID=13086967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10058529A Pending JPH11257884A (en) 1998-03-10 1998-03-10 Temperature controller employing heat pipe

Country Status (1)

Country Link
JP (1) JPH11257884A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016204A (en) * 2000-06-28 2002-01-18 Ts Heatronics Co Ltd Heat-receiving and radiating structure
CN104807897A (en) * 2014-01-29 2015-07-29 罗斯蒙特分析公司 Process analysis device of improved thermal stability
US10225953B2 (en) 2014-10-31 2019-03-05 Thermal Corp. Vehicle thermal management system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002016204A (en) * 2000-06-28 2002-01-18 Ts Heatronics Co Ltd Heat-receiving and radiating structure
CN104807897A (en) * 2014-01-29 2015-07-29 罗斯蒙特分析公司 Process analysis device of improved thermal stability
US10225953B2 (en) 2014-10-31 2019-03-05 Thermal Corp. Vehicle thermal management system
US10932392B2 (en) 2014-10-31 2021-02-23 Aavid Thermal Corp. Vehicle thermal management system

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