JPH11254270A - Device and method for unsealing sealed body - Google Patents
Device and method for unsealing sealed bodyInfo
- Publication number
- JPH11254270A JPH11254270A JP5206698A JP5206698A JPH11254270A JP H11254270 A JPH11254270 A JP H11254270A JP 5206698 A JP5206698 A JP 5206698A JP 5206698 A JP5206698 A JP 5206698A JP H11254270 A JPH11254270 A JP H11254270A
- Authority
- JP
- Japan
- Prior art keywords
- drilling
- excavation
- sealed body
- depth
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Automatic Control Of Machine Tools (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は封止体の開封装置お
よび封止体の開封方法に係わり、特に内部状態に製造バ
ラツキがある物体を掘削する開封装置および開封方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for opening a sealing body and a method for opening a sealing body, and more particularly to an opening device and an opening method for excavating an object having a manufacturing variation in an internal state.
【０００２】[0002]
【従来の技術】従来、樹脂封止半導体素子等の樹脂封止
体を掘削する場合、まず掘削位置（平面的な位置）及び
掘削深さを調べる方法として、 １） ダミーサンプルを開封して調べるか、 ２） 設計情報から求めるか、 ３） Ｘ線を用いて調べるか、 の方法があり、また掘削機としては、掘削位置及び掘削
深さを予めコンピュータに入力しておき自動掘削する方
法やハンド・ドリルを使う方法があり、これらの方法に
よる堀削機と上記掘削位置及び掘削深さを調べる方法と
を組合わせて掘削作業を行っている。2. Description of the Related Art Conventionally, when a resin-sealed body such as a resin-sealed semiconductor element is excavated, a method of first examining an excavation position (planar position) and an excavation depth is as follows: 1) Open and inspect a dummy sample. Or 2) obtain from design information, or 3) check using X-rays. For the excavator, the excavation position and the excavation depth are input to a computer in advance and automatic excavation is performed. There is a method using a hand drill, and the excavating operation is performed by combining the excavating machine by these methods and the method for checking the excavation position and the excavation depth.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、掘削位
置及び掘削深さを調べることと実際の掘削作業をするこ
とは分離されている（掘削位置及び掘削深さデータの受
け渡しが自動化されていない）ため、掘削位置及び掘削
深さを間違う欠点があった。However, checking the excavation position and excavation depth and performing the actual excavation work are separated (excavation position and excavation depth data transfer is not automated). There is a disadvantage that the excavation position and the excavation depth are wrong.
【０００４】また、半導体素子は個々の素子のバラツ
キ、例えばＩＣチップの傾きのバラツキやＨＩＣ内部基
板（基板上にＩＣや抵抗を実装し全体を樹脂封止した電
子部品）の傾きのバラツキなどがあるため、自動掘削し
た場合に、内部素子を傷つける欠点があった。[0004] In addition, semiconductor elements have variations in individual elements, for example, variations in the inclination of an IC chip and variations in the inclination of an HIC internal substrate (an electronic component in which an IC or a resistor is mounted on a substrate and the whole is resin-sealed). For this reason, there is a disadvantage that the internal element is damaged when automatic excavation is performed.
【０００５】本発明の目的は、被掘削物の製造バラッキ
があった場合でも、内部部材を傷付けることなく、しか
も正確に掘削できる開封装置および開封方法を提供する
ことにある。An object of the present invention is to provide an unsealing apparatus and an unsealing method which can excavate accurately without damaging an internal member even when there is a manufacturing variation of an object to be excavated.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明の封止体の開封装置は、封止体の内部観察を
して掘削位置及び掘削深さを決定する決定手段と、掘削
機を前記掘削位置に合わせる位置合わせ手段と、前記掘
削深さまで内部観察をしながら前記掘削機により前記封
止体を掘削する掘削手段と、を有することを特徴とす
る。In order to achieve the above object, a sealing body opening apparatus according to the present invention comprises: a deciding means for observing the inside of a sealed body to determine a digging position and a digging depth; And a digging means for digging the sealing body by the digging machine while observing the inside up to the digging depth.
【０００７】また本発明の封止体の開封方法は、封止体
の内部観察をして掘削位置を決定し、掘削機を前記掘削
位置に合わせ、前記封止体の内部観察をして掘削深さを
決定し、該掘削深さまで内部観察をしながら前記掘削機
により前記封止体を掘削することを特徴とする。In the method for opening a sealed body according to the present invention, the inside of the sealed body is observed to determine a digging position, an excavator is adjusted to the digging position, and the inside of the sealed body is observed for digging. The sealing body is excavated by the excavator while determining the depth and observing the inside up to the excavation depth.
【０００８】なお封止体としては、樹脂封止体、メタ
ル，セラミックで封止した封止体（メタル封止体，セラ
ミック封止体）等が挙げられる。[0008] Examples of the sealing body include a resin sealing body, a sealing body sealed with metal or ceramic (metal sealing body, ceramic sealing body) and the like.
【０００９】上記構成において、内部観察をして掘削位
置および掘削深さを決定する決定手段（例えば、図１の
１，２，４，６，８の各部材）は、Ｘ線等を用い被掘削
物内部をモニタしながら、掘削位置（平面的な位置）お
よび掘削深さを、例えばＸＹＺ座標で、コンピュータに
記録するように動作する。In the above configuration, the determining means (for example, each of the members 1, 2, 4, 6, and 8 in FIG. 1) for determining the excavation position and the excavation depth by observing the inside is controlled by using X-rays or the like. It operates to record the excavation position (planar position) and the excavation depth in a computer, for example, in XYZ coordinates, while monitoring the inside of the excavation.
【００１０】また掘削機を掘削位置に合わせる位置合わ
せ手段は、例えば掘削機を被掘削物の平面方向であるＸ
Ｙ座標に移動するように動作する。The positioning means for aligning the excavator with the excavation position includes, for example, the X-axis which is the plane direction of the object to be excavated.
It operates to move to the Y coordinate.
【００１１】また掘削深さまで内部観察をしながら掘削
する掘削手段（例えば、図１の１，２，４，６，８，１
４の各部材）は、例えば掘削機を被掘削物の深さ方向で
あるＺ座標まで掘削した後停止するように動作する。Excavation means (for example, 1, 2, 4, 6, 8, 1 in FIG. 1) for excavating while observing the inside to the excavation depth.
4) operate so as to stop after excavating the excavator to the Z coordinate which is the depth direction of the object to be excavated, for example.
【００１２】なお、ここで内部観察とは、人間が観察を
行なうことのみを意味するものではなく、例えばＸ線等
を用い被掘削物内部をモニタし、画像解析を自動的に行
なって観察すること等も含まれる。すなわち、本発明に
係わる操作を自動化して行なうことも可能である。Here, the internal observation does not only mean that a human observes the object, but the inside of the excavated object is monitored using, for example, X-rays, and image analysis is automatically performed for observation. That is also included. That is, it is possible to automate the operation according to the present invention.
【００１３】[0013]
【実施例】以下、本発明の実施例について図面を用いて
詳細に説明する。なお、本発明の用途は特に樹脂封止半
導体素子に限定されるものではないが、樹脂封止半導体
素子の開封は精度が要求されるので本発明が好適に用い
られる。Embodiments of the present invention will be described below in detail with reference to the drawings. The application of the present invention is not particularly limited to the resin-sealed semiconductor element, but the present invention is preferably used because the precision of opening the resin-sealed semiconductor element is required.
【００１４】（第１の実施例）本発明の第１実施例につ
いて、図１を参照して説明する。図１は本発明による樹
脂封止半導体素子の開封装置の構成図である。(First Embodiment) A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a configuration diagram of an apparatus for opening a resin-sealed semiconductor element according to the present invention.
【００１５】図１において、１８は被掘削物を固定する
台座、１２は台座１８を任意のＸＹＺ軸方向及び回転方
向へ移動させる駆動装置であり、回転軸の中心に座標の
原点をもつものである。１０は駆動装置１２を制御する
為のコントローラ、１はＸ線照射部、２はＸ線受光部、
１７は掘削するためのドリル、１６はドリル１７をＸＹ
Ｚ軸方向に移動させる駆動装置、１４は駆動装置１６を
制御する為のコントローラ、６はＸ線画像を投影する為
のモニタＴＶ、８は掘削位置および掘削深さを入力する
為の入力装置、４はコントローラ１０とコントローラ１
４を経由して掘削作業を制御すると共に掘削位置、掘削
深さやＸ線画像情報を記録する為のコンピュータ、３，
５，７，９，１１，１３，１５は各種信号を伝達する為
の信号伝送ケーブルである。In FIG. 1, reference numeral 18 denotes a pedestal for fixing an object to be excavated, and 12 denotes a driving device for moving the pedestal 18 in any of the XYZ-axis directions and the rotation direction, and has a coordinate origin at the center of the rotation axis. is there. 10 is a controller for controlling the driving device 12, 1 is an X-ray irradiator, 2 is an X-ray receiver,
17 is a drill for drilling, 16 is an XY drill 17
A drive device for moving in the Z-axis direction, 14 a controller for controlling the drive device 16, 6 a monitor TV for projecting an X-ray image, 8 an input device for inputting a digging position and a digging depth, 4 is a controller 10 and a controller 1
4, a computer for controlling the excavation work via the computer and recording the excavation position, excavation depth and X-ray image information;
5, 7, 9, 11, 13 and 15 are signal transmission cables for transmitting various signals.
【００１６】次に、上記構成において、チップ−オン−
ボード（ＩＣの表面を基板に向けて直接実装されたも
の。これ以降、ＣＯＢと呼ぶ）の掘削を例にこの装置の
動作を図２と図３を用いて説明する。Next, in the above configuration, the chip-on-
The operation of this device will be described with reference to FIGS. 2 and 3 by taking the excavation of a board (a device directly mounted with the surface of the IC facing the substrate, hereinafter referred to as COB).
【００１７】はじめに図２に示すように、ＣＯＢ１９を
台座１８に固定し、駆動装置１２をＸ線照射部１から照
射されるＸ線に対し垂直になるように（ＣＯＢ１９の面
がＸ線照射部１に対向するように）移動させた後、Ｘ線
を用いてＣＯＢ１９の裏面側から見た内部状態をコンピ
ュータ４に記録するとともにモニタＴＶ６に投影する。
このモニタＴＶ６を見ながら任意の掘削位置を入力装置
８を用いてコンピュータ４に記録する。First, as shown in FIG. 2, the COB 19 is fixed to the pedestal 18, and the driving device 12 is set to be perpendicular to the X-ray radiated from the X-ray irradiator 1 (the surface of the COB 19 is After being moved (to face 1), the internal state viewed from the back side of the COB 19 is recorded on the computer 4 and projected on the monitor TV 6 using X-rays.
An arbitrary excavation position is recorded in the computer 4 using the input device 8 while watching the monitor TV 6.
【００１８】次に図３のごとく駆動装置１２を用いＣＯ
Ｂ１９をＸ線照射部１から照射されるＸ線に対し水平に
なる様に移動させた後、駆動装置１６を用いてドリル１
７を掘削位置に移動する。次にＸ線を用いＣＯＢ１９を
側面から見た内部状態をコンピュータ４に記録するとと
もにモニタＴＶ６に投影する。次に任意の掘削深さを入
力装置８を用いてコンピュータ４に記録する。次にドリ
ル１７の先端部が掘削深さに達するまで掘削作業を行
う。Next, as shown in FIG.
After moving B19 so as to be horizontal with respect to the X-rays emitted from the X-ray irradiator 1, the driving device 16 is used to drive the drill 1
7 is moved to the excavation position. Next, the internal state of the COB 19 as viewed from the side is recorded in the computer 4 and projected on the monitor TV 6 using X-rays. Next, an arbitrary excavation depth is recorded in the computer 4 using the input device 8. Next, excavation work is performed until the tip of the drill 17 reaches the excavation depth.
【００１９】本実施例によれば、以下の効果を得ること
ができる。According to this embodiment, the following effects can be obtained.
【００２０】１） 掘削位置を測定して直接コンピュー
タに記録するため正確であり、しかも被掘削物に掘削位
置を示す印をつける必要がなく作業性が良くなる。1) Since the excavation position is measured and recorded directly in the computer, it is accurate, and it is not necessary to put a mark indicating the excavation position on the object to be excavated, thereby improving workability.
【００２１】２） 従来はプログラムされた掘削深さを
自動掘削していたが、被掘削物は製造バラツキがあり、
削りすぎて内部を損傷することがあったが、Ｘ線で絶え
ずモニタしながら削る為、削り損なうことがなくなる。 （第２の実施例）本発明の第２の実施例についてその装
置の構成を図４を用いて説明する。本実施例では、Ｘ線
に変えて超音波探傷装置２２を、ドリル１７に変えてレ
ーザ照射装置２３を用いる。2) Conventionally, the programmed excavation depth was automatically excavated, but the excavated object has manufacturing variations,
There was a case where the inside was damaged due to excessive shaving. However, since the shaving is performed while constantly monitoring with X-rays, the shaving does not fail. (Second Embodiment) A second embodiment of the present invention will be described with reference to FIG. In this embodiment, an ultrasonic flaw detector 22 is used instead of X-rays, and a laser irradiation device 23 is used instead of drill 17.
【００２２】図４において、１８は被掘削物を固定する
台座、１２は台座１８を任意のＸＹＺ軸方向及び回転方
向へ移動させる駆動装置、１０は駆動装置１２を制御す
る為のコントローラ、２２は超音波探傷装置、１６は超
音波探傷装置２２をＸＹＺ軸方向へ移動させるための駆
動装置、１４は駆動装置１６を制御する為のコントロー
ラ、２３は掘削機としてのレーザ照射装置、６は超音波
による画像を投影する為のモニタＴＶ、８は掘削位置お
よび掘削深さを入力する為の入力装置、４はコントロー
ラ１０，コントローラ１４を通じて掘削作業を制御する
と共に掘削位置、掘削深さや超音波探傷装置からの画像
情報を記録する為のコンピュータ、５，７，９，１１，
１３，１５は各種信号を伝達する為の信号伝送ケーブル
である。In FIG. 4, reference numeral 18 denotes a pedestal for fixing an object to be excavated, 12 denotes a driving device for moving the pedestal 18 in arbitrary XYZ axis directions and rotation directions, 10 denotes a controller for controlling the driving device 12, and 22 denotes a controller. An ultrasonic flaw detector, 16 is a driving device for moving the ultrasonic flaw detector 22 in the XYZ axis directions, 14 is a controller for controlling the driving device 16, 23 is a laser irradiation device as an excavator, and 6 is an ultrasonic wave. A monitor TV 8 for projecting an image by a computer, 8 is an input device for inputting an excavation position and an excavation depth, and 4 is an excavation position, an excavation depth and an ultrasonic flaw detection device while controlling excavation work through a controller 10 and a controller 14. Computer for recording image information from a computer, 5, 7, 9, 11,
Reference numerals 13 and 15 are signal transmission cables for transmitting various signals.
【００２３】次に、上記構成において、ＩＣの掘削を例
にこの装置の動作を図５と図６を用いて説明する。Next, the operation of this apparatus in the above configuration will be described with reference to FIGS.
【００２４】はじめに図５のごとくＩＣ２６を台座１８
に固定する。次に超音波探傷装置２２に超音波反射防止
のため水２５入りのゴム風せん２４を取り付ける。この
ゴム風せん２４をＩＣ２６の表面にあて、超音波を照射
してＩＣ２６内部の状態をコンピュータ４に記録すると
ともにモニタＴＶ６に投影する。この画面を見ながら任
意の掘削位置を入力装置８を用いてコンピュータ４に入
力する。First, as shown in FIG.
Fixed to. Next, a rubber winder 24 containing water 25 is attached to the ultrasonic flaw detector 22 to prevent ultrasonic reflection. The rubber airbag 24 is applied to the surface of the IC 26, and the state of the inside of the IC 26 is recorded on the computer 4 and projected on the monitor TV 6 by irradiating ultrasonic waves. While viewing this screen, an arbitrary excavation position is input to the computer 4 using the input device 8.
【００２５】次に図６のごとく駆動装置１２を用いてＩ
Ｃ２６が超音波探傷装置２２から放出される超音波と水
平になる様に回転させ、レーザ照射装置２３が掘削位置
になるよう移動する。Next, as shown in FIG.
C26 is rotated so as to be horizontal with the ultrasonic waves emitted from the ultrasonic flaw detector 22, and the laser irradiation device 23 is moved to the excavation position.
【００２６】次に駆動装置１６を用いて超音波探傷装置
２２をＩＣ２６の側面に移動する。次に超音波を照射
し、ＩＣ２６の側面から見た内部状態をコンピュータ４
に記録するとともにモニタＴＶ６に投影する。この画面
を見ながら、任意の掘削深さを入力装置８を用いてコン
ピュータ４に入力する。次に掘削深さが所定の深さにな
る手前でレーザ照射装置２３のパワーを随時下げ、掘削
深さに達した時点で掘削作業を終了する。Next, the ultrasonic flaw detector 22 is moved to the side surface of the IC 26 using the driving device 16. Next, an ultrasonic wave is applied, and the internal state viewed from the side of the IC 26 is
And project it on the monitor TV6. While viewing this screen, an arbitrary excavation depth is input to the computer 4 using the input device 8. Next, before the excavation depth reaches a predetermined depth, the power of the laser irradiation device 23 is reduced as needed, and when the excavation depth is reached, the excavation work is terminated.
【００２７】本実施例によれば、以下の効果を得ること
ができる。According to this embodiment, the following effects can be obtained.
【００２８】１） 実施例１のＸ線に比べ掘削時の空間
分解能がよい為、掘削精度を上げることができる。1) Since the spatial resolution at the time of excavation is better than that of the X-ray of the first embodiment, the excavation accuracy can be improved.
【００２９】２） レーザのパワーを弱めることで、Ｉ
Ｃ２６内のチップ２７表面にレーザがあたっても、チッ
プ２７を損傷することがない。2) By reducing the power of the laser, I
Even if the laser hits the surface of the chip 27 in C26, the chip 27 is not damaged.
【００３０】[0030]
【発明の効果】以上説明したように、本発明によれば、
個々の樹脂封止体の樹脂厚のバラツキ、フレームの傾き
のバラツキ等の製造バラツキがあっても掘削状態を観察
しながら掘削できるため、内部部材を傷付けずに掘削作
業が行える。しかも、掘削位置や掘削深さのデータの受
け渡しが自動化されているため、正確に掘削できる。As described above, according to the present invention,
Excavation can be performed while observing the state of excavation even if there is variation in manufacturing such as variation in resin thickness of individual resin sealing bodies and variation in inclination of the frame, so that excavation work can be performed without damaging internal members. In addition, since the data of the excavation position and the excavation depth are automatically transferred, excavation can be performed accurately.
【図１】本発明の第１の実施例に係る装置の構成を説明
する図である。FIG. 1 is a diagram illustrating a configuration of an apparatus according to a first embodiment of the present invention.
【図２】本発明の第１の実施例に係る装置の動作を説明
する図である。FIG. 2 is a diagram for explaining the operation of the device according to the first embodiment of the present invention.
【図３】本発明の第１の実施例に係る装置の動作を説明
する図である。FIG. 3 is a diagram for explaining the operation of the device according to the first embodiment of the present invention.
【図４】本発明の第２の実施例に係る装置の構成を説明
する図である。FIG. 4 is a diagram illustrating a configuration of an apparatus according to a second embodiment of the present invention.
【図５】本発明の第２の実施例に係る装置の動作を説明
する図である。FIG. 5 is a diagram for explaining the operation of the device according to the second embodiment of the present invention.
【図６】本発明の第２の実施例に係る装置の動作を説明
する図である。FIG. 6 is a diagram for explaining the operation of the device according to the second embodiment of the present invention.
１ Ｘ線照射部 ２ Ｘ線受光部 ３，５，７，９，１１，１３，１５ 信号伝送ケーブル ４ コンピュータ ６ モニタＴＶ ８ 入力装置 １０ コントローラ １２ 駆動装置 １４ コントローラ １６ 駆動装置 １７ ドリル １８ 台座 ２２ 超音波探傷装置 ２３ レーザ照射装置 DESCRIPTION OF SYMBOLS 1 X-ray irradiation part 2 X-ray receiving part 3,5,7,9,11,13,15 Signal transmission cable 4 Computer 6 Monitor TV 8 Input device 10 Controller 12 Drive device 14 Controller 16 Drive device 17 Drill 18 Pedestal 22 Ultra Ultrasonic testing equipment 23 Laser irradiation equipment
Claims (5)
削深さを決定する決定手段と、掘削機を前記掘削位置に
合わせる位置合わせ手段と、前記掘削深さまで内部観察
をしながら前記掘削機により前記封止体を掘削する掘削
手段と、を有することを特徴とする封止体の開封装置。1. A deciding means for observing the inside of a sealed body to determine a digging position and a digging depth, a positioning means for adjusting a digging machine to the digging position, and performing the inside observation to the digging depth. An excavating means for excavating the sealed body by an excavator, wherein the sealing body opening device is provided.
し、該移動手段は前記封止体を前記決定手段に対向させ
て前記掘削位置を決定した後に、前記掘削機に対向させ
るように前記封止体を移動させる手段であることを特徴
とする請求項１に記載の封止体の開封装置。2. A moving means for moving the sealing body, wherein the moving means faces the excavator after the sealing body is opposed to the determining means to determine the excavation position. The device for unsealing a sealed body according to claim 1, wherein the device is a means for moving the sealed body.
封止体、メタル封止体のいずれかであることを特徴とす
る請求項１又は請求項２に記載の封止体の開封装置。3. The unsealing of the sealed body according to claim 1, wherein the sealed body is one of a resin sealed body, a ceramic sealed body, and a metal sealed body. apparatus.
し、掘削機を前記掘削位置に合わせ、前記封止体の内部
観察をして掘削深さを決定し、該掘削深さまで内部観察
をしながら前記掘削機により前記封止体を掘削すること
を特徴とする封止体の開封方法。4. An excavation position is determined by observing the inside of the sealed body, and an excavator is adjusted to the excavation position, and an excavation depth is determined by observing the inside of the sealed body. A method for unsealing a sealed body, wherein the sealed body is excavated by the excavator while observing inside.
封止体、メタル封止体のいずれかであることを特徴とす
る請求項４に記載の封止体の開封方法。5. The method according to claim 4, wherein the sealing body is one of a resin sealing body, a ceramic sealing body, and a metal sealing body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206698A JPH11254270A (en) | 1998-03-04 | 1998-03-04 | Device and method for unsealing sealed body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5206698A JPH11254270A (en) | 1998-03-04 | 1998-03-04 | Device and method for unsealing sealed body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11254270A true JPH11254270A (en) | 1999-09-21 |
Family
ID=12904449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5206698A Pending JPH11254270A (en) | 1998-03-04 | 1998-03-04 | Device and method for unsealing sealed body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11254270A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007534930A (en) * | 2003-07-15 | 2007-11-29 | コントロール・システメーション・インコーポレーテッド | Method and system for failure analysis |
| WO2009069577A1 (en) * | 2007-11-26 | 2009-06-04 | National Institute Of Advanced Industrial Science And Technology | Mold removing method |
| JP2011096694A (en) * | 2009-10-27 | 2011-05-12 | National Institute Of Advanced Industrial Science & Technology | Mold removing method and mold removing device |
-
1998
- 1998-03-04 JP JP5206698A patent/JPH11254270A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007534930A (en) * | 2003-07-15 | 2007-11-29 | コントロール・システメーション・インコーポレーテッド | Method and system for failure analysis |
| WO2009069577A1 (en) * | 2007-11-26 | 2009-06-04 | National Institute Of Advanced Industrial Science And Technology | Mold removing method |
| US8309882B2 (en) | 2007-11-26 | 2012-11-13 | National Institute Of Advanced Industrial Science And Technology | Mold removing method |
| JP2011096694A (en) * | 2009-10-27 | 2011-05-12 | National Institute Of Advanced Industrial Science & Technology | Mold removing method and mold removing device |
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