JPH11249759A - Cushion structure for electronic equipment - Google Patents
Cushion structure for electronic equipmentInfo
- Publication number
- JPH11249759A JPH11249759A JP10053223A JP5322398A JPH11249759A JP H11249759 A JPH11249759 A JP H11249759A JP 10053223 A JP10053223 A JP 10053223A JP 5322398 A JP5322398 A JP 5322398A JP H11249759 A JPH11249759 A JP H11249759A
- Authority
- JP
- Japan
- Prior art keywords
- storage device
- disk
- elastic body
- storage medium
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ディスク状記憶媒
体を有する記憶装置を備えた携帯用のノート型パソコン
などの電子機器の緩衝構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a buffer structure for an electronic device such as a portable notebook personal computer having a storage device having a disk-shaped storage medium.
【0002】[0002]
【従来の技術】従来、携帯用のノート型パソコンなどに
内蔵されているHDDなどのディスク状記憶媒体を有す
る記憶装置は、外部からの衝撃に弱く、弾性材を介して
取り付けたり、記憶装置の一部または全部を弾性体で包
囲するようにして電子機器本体内部に収納する緩衝構造
が用いられている。従来の電子機器のディスク状記憶媒
体を有する記憶装置を一体として組込むための構造を図
3及び図4に示す。図3において、ディスク状記憶媒体
を有する記憶装置1は電子機器11内部に組込むため、
弾性体12で包囲し、さらに、ケース13、ふた14で
包囲し、固定される。これらを一体化した形状で、図4
に示すように、電子機器11本体に着脱可能な状態で内
蔵される。これにより、外部から電子機器11に落下な
どによる衝撃が加わっても弾性体12が衝撃を吸収する
ため、記憶装置1に対する影響を少なくすることができ
る。2. Description of the Related Art Conventionally, a storage device having a disk-shaped storage medium such as an HDD built in a portable notebook personal computer or the like is vulnerable to an external impact, and can be mounted via an elastic material. 2. Description of the Related Art A buffer structure is used in which a part or the whole is surrounded by an elastic body and housed inside an electronic device main body. 3 and 4 show a structure for integrally incorporating a storage device having a disk-shaped storage medium of a conventional electronic device. In FIG. 3, a storage device 1 having a disk-shaped storage medium is incorporated in an electronic device 11.
It is surrounded by the elastic body 12, further surrounded by the case 13 and the lid 14, and fixed. Fig. 4
As shown in the figure, the electronic device 11 is built in a detachable state. As a result, even if an impact due to a drop or the like is applied to the electronic device 11 from outside, the elastic body 12 absorbs the impact, so that the influence on the storage device 1 can be reduced.
【0003】[0003]
【発明が解決しようとする課題】このような電子機器の
緩衝構造では、大きな衝撃の外力を緩和することはでき
るが、ディスク状記憶媒体を有する記憶装置が動作中に
発生する熱は、弾性体で包囲されているため、外に放熱
することが充分ではなかった。In such a shock absorbing structure for electronic equipment, the external force of a large impact can be reduced, but the heat generated during operation of the storage device having the disk-shaped storage medium is generated by the elastic material. , It was not enough to radiate heat to the outside.
【0004】さらに、記憶装置を包囲する弾性体が高密
度のゴムやゲル材で構成されている場合は、記憶装置か
ら発生する回転などの振動は吸収されにくく、むしろ振
動を増幅して、電子機器の外観表面にまで伝えることが
あるため、ディスク状記憶媒体を有する記憶装置を保護
する弾性体においては、放熱と振動吸収が要求されてい
る。Further, when the elastic body surrounding the storage device is made of a high-density rubber or gel material, vibrations such as rotation generated from the storage device are hardly absorbed, and rather, the vibration is amplified and the electronic device is amplified. Since the elastic body that protects the storage device having the disk-shaped storage medium may be transmitted to the external surface of the device, heat dissipation and vibration absorption are required.
【0005】本発明は、ディスク状記憶媒体を有する記
憶装置の動作中の発熱を外部に放熱させることができ、
さらに、動作中の記憶装置の振動を吸収し、外部に伝え
ない構造とした、ディスク状記憶媒体を有する記憶装置
を備えた電子機器の緩衝構造を提供することを目的とす
る。According to the present invention, heat generated during operation of a storage device having a disk-shaped storage medium can be radiated to the outside,
It is still another object of the present invention to provide a buffer structure for an electronic device including a storage device having a disk-shaped storage medium, which has a structure that absorbs vibration of the storage device during operation and does not transmit the vibration to the outside.
【0006】[0006]
【課題を解決するための手段】この課題を解決するため
に本発明は、ディスク状記憶媒体を有する記憶装置から
発生する熱を、弾性体に設けられた複数箇所の穴部から
外に放熱するように構成したものである。さらに、高密
度の弾性体の一部または、全部を包囲する弾性体をハニ
カム形状で構成したものである。SUMMARY OF THE INVENTION In order to solve this problem, the present invention radiates heat generated from a storage device having a disk-shaped storage medium through a plurality of holes provided in an elastic body. It is configured as follows. Further, the elastic body surrounding a part or the whole of the high-density elastic body is formed in a honeycomb shape.
【0007】これにより、動作中のディスク状記憶媒体
を有する記憶装置から発生する熱を放熱し、また、動作
中の回転振動を吸収、減勢させ、さらに、外力を受けた
場合、弾性体の変形で衝撃が吸収、減勢されることで、
発熱や振動、衝撃から記憶装置を保護するという効果が
得られる。Thus, the heat generated from the storage device having the disk-shaped storage medium during operation is radiated, the rotational vibration during operation is absorbed and decelerated, and when an external force is applied, the elastic body is deformed. By absorbing the shock and reducing the energy by the deformation,
An effect of protecting the storage device from heat, vibration, and impact can be obtained.
【0008】[0008]
【発明の実施の形態】本発明の請求項1に記載の発明
は、ディスク状記憶媒体を有する記憶装置と、前記記憶
装置の一部または全部を包囲し、複数箇所の穴部が設け
られた弾性体で構成されたことを特徴とする電子機器の
緩衝構造としたものであり、動作中のディスク状記憶媒
体を有する記憶装置から発生した熱を、複数箇所の穴部
から外部へ放熱させる作用と、さらに、穴部の間の隔壁
で、回転振動を吸収減勢させるという作用を有する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has a storage device having a disk-shaped storage medium and a plurality of holes surrounding part or all of the storage device. A buffer structure of an electronic device characterized by being constituted by an elastic body, and an action of radiating heat generated from a storage device having an active disk-shaped storage medium to the outside through a plurality of holes. Further, the partition wall between the holes has an effect of absorbing and reducing rotational vibration.
【0009】請求項2に記載の発明は、弾性体は、ディ
スク状記憶媒体を有する記憶装置の周囲に連なるハニカ
ム形状により構成されたことを特徴とする電子機器の緩
衝構造としたものであり、複数箇所の穴部から、動作中
の記憶装置から発生した熱を外部へ放熱させる作用と、
ハニカム形状に形成された隔壁で、回転振動を吸収減勢
させるという作用を維持し、さらに、弾性体としての外
力を吸収減勢させる作用を損なわないものである。According to a second aspect of the present invention, there is provided a buffer structure for an electronic device, wherein the elastic body has a honeycomb shape continuous with a storage device having a disk-shaped storage medium. An action of radiating heat generated from the operating storage device to the outside from the plurality of holes,
The partition wall formed in a honeycomb shape maintains the function of absorbing and decelerating rotational vibration and does not impair the function of absorbing and depressing external force as an elastic body.
【0010】請求項3に記載の発明は、ディスク状記憶
媒体を有する記憶装置と、前記記憶装置の一部または全
部を包囲する伝熱性の放熱材料からなる弾性体で構成さ
れたことを特徴とする電子機器の緩衝構造としたもの
で、放熱材料により、動作中のディスク状記憶媒体を有
する記憶装置から発生した熱を外部へ放熱させる作用を
有する。According to a third aspect of the present invention, there is provided a storage device having a disk-shaped storage medium, and an elastic body made of a heat conductive heat-radiating material surrounding a part or all of the storage device. The heat dissipation material has the function of radiating heat generated from a storage device having an active disk-shaped storage medium to the outside.
【0011】以下、本発明の実施の形態について、図
1、図2を用いて説明する。 (実施の形態1)図1は本発明の一実施の形態における
ディスク状記憶媒体を有する記憶装置を包囲する弾性体
を示す斜視図であり、図2はその緩衝構造を備えた電子
機器を示す斜視図である。図において、1はディスク状
記憶媒体を有する記憶装置で、弾性体2によって包囲さ
れている。弾性体2は、ハニカム形状になっており、蜂
の巣状の多数の穴部2aと、隣り合う穴部2a間の隔壁
2bにより構成されている。3は主回路基板4が収納さ
れる本体部、5はヒンジ部6で本体部3に回転可能に取
り付けられ、液晶表示装置7が収納される表示部であ
る。記憶装置1は本体部3に収納され固定されている。
記憶装置1は本体部3の主回路基板4と信号線8により
接続されている。また、本体部3には、動作中の発生す
る熱を冷却するファン9が設置され、放熱穴3aから外
部に熱が排出される。An embodiment of the present invention will be described below with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view showing an elastic body surrounding a storage device having a disk-shaped storage medium according to an embodiment of the present invention, and FIG. 2 shows an electronic apparatus having the buffer structure. It is a perspective view. In the figure, reference numeral 1 denotes a storage device having a disk-shaped storage medium, which is surrounded by an elastic body 2. The elastic body 2 has a honeycomb shape and is composed of a large number of honeycomb-shaped holes 2a and a partition wall 2b between adjacent holes 2a. Reference numeral 3 denotes a main body in which the main circuit board 4 is housed, and 5 denotes a hinge unit 6 which is rotatably attached to the main body 3 and in which a liquid crystal display device 7 is housed. The storage device 1 is housed and fixed in the main body 3.
The storage device 1 is connected to the main circuit board 4 of the main body 3 by signal lines 8. Further, a fan 9 for cooling the heat generated during operation is installed in the main body 3, and the heat is discharged to the outside through the heat radiation holes 3a.
【0012】以上のように構成された電子機器の緩衝構
造について、以下その動作を説明する。電子機器を動作
させると、ディスク状記憶媒体を有する記憶装置1は、
ディスクを回転させるためのモーターにより、熱が発生
する。この発生した熱は、記憶装置1の表面に伝わる。
そこで、弾性体2の多数の穴部2aを通して、本体部3
の内部に放熱され、次に、ファン9により強制的に、放
熱穴3aを通して、本体部3の外部に熱が排出される。The operation of the cushioning structure of the electronic device configured as described above will be described below. When the electronic device is operated, the storage device 1 having the disk-shaped storage medium
Heat is generated by the motor that rotates the disk. The generated heat is transmitted to the surface of the storage device 1.
Therefore, the main body 3 is passed through the many holes 2 a of the elastic body 2.
Then, the heat is discharged to the outside of the main body 3 through the heat radiation holes 3a by the fan 9 forcibly.
【0013】これにより、記憶装置1が発生した熱によ
る、動作の不安定や、熱劣化といったことを防止するこ
とができる。As a result, unstable operation and thermal deterioration due to the heat generated by the storage device 1 can be prevented.
【0014】また、記憶装置1は、ディスクを回転させ
るためのモーターにより、振動を発生させる。この発生
した振動は、記憶装置1の表面に伝わり、本体部3の外
観表面にまで、弾性体2を経由して伝わる。弾性体2の
隣り合う穴部2a間の隔壁2bにより、記憶装置1に密
着している面積が少なくなっており、隔壁2bの厚さ方
向の弾性で振動を吸収減勢させることができる。Further, the storage device 1 generates vibration by a motor for rotating a disk. The generated vibration is transmitted to the surface of the storage device 1 and is transmitted to the external surface of the main body 3 via the elastic body 2. The partition 2b between the adjacent holes 2a of the elastic body 2 reduces the area in close contact with the storage device 1, and the elasticity in the thickness direction of the partition 2b can absorb and reduce vibration.
【0015】これにより、記憶装置1で発生した振動を
本体部3の外観表面にまで伝えることなく防止すること
ができる。Thus, the vibration generated in the storage device 1 can be prevented from being transmitted to the external surface of the main body 3.
【0016】さらに、弾性体2は、蜂の巣状の多数の穴
部2aと、隣り合う穴部2a間の隔壁2bで構成された
ハニカム形状になっており、弾性体の本来の目的であ
る、外部から大きな衝撃を受けた場合、ハニカム形状が
変形し、衝撃を吸収、減勢させる。Further, the elastic body 2 has a honeycomb shape composed of a number of honeycomb-shaped holes 2a and partition walls 2b between adjacent holes 2a. When a large shock is applied to the honeycomb, the honeycomb shape is deformed to absorb and reduce the shock.
【0017】なお、本発明の形態では、弾性体をハニカ
ム形状としたが、衝撃の吸収の程度によっては、弾性体
自身を伝熱性のシリコンゴムなどの放熱材料とすること
によって、穴を開けずに放熱を行うことができる。In the embodiment of the present invention, the elastic body has a honeycomb shape. However, depending on the degree of shock absorption, the elastic body itself may be made of a heat dissipating material such as heat-conductive silicone rubber so that holes are not formed. Heat can be dissipated.
【0018】[0018]
【発明の効果】以上のように本発明によれば、ディスク
状記憶媒体を有する記憶装置と、前記記憶装置を包囲す
る弾性体を具備し、前記弾性体は、蜂の巣状の多数の穴
部と、隣り合う穴部間の隔壁で構成されたハニカム形状
で構成されることにより、外部から大きな衝撃を受けた
場合、弾性体が変形して外力を吸収し、かつ、動作中の
回転振動を吸収減勢させ、本体部の外観表面に伝わる不
快な振動を防ぐことができるとともに、前記記憶装置の
動作中に発生した熱を放熱することで、記憶装置の破
損、熱による動作不安定や熱劣化を防ぐことができると
いう有利な効果が得られる。As described above, according to the present invention, a storage device having a disk-shaped storage medium and an elastic body surrounding the storage device are provided, and the elastic body has a plurality of honeycomb-shaped holes. In the case of a large external impact, the elastic body deforms to absorb external force and absorb rotational vibration during operation by being configured in a honeycomb shape composed of partition walls between adjacent holes The energy can be reduced to prevent unpleasant vibration transmitted to the external surface of the main body, and the heat generated during the operation of the storage device can be dissipated, thereby causing damage to the storage device, unstable operation due to heat, and thermal deterioration. The advantageous effect that it can prevent is obtained.
【図1】本発明の一実施の形態による電子機器の緩衝構
造におけるディスク状記憶媒体を有する記憶装置を包囲
する弾性体を示す斜視図FIG. 1 is a perspective view showing an elastic body surrounding a storage device having a disk-shaped storage medium in a buffer structure of an electronic device according to an embodiment of the present invention;
【図2】本発明の一実施の形態による緩衝構造を備えた
電子機器を示す斜視図FIG. 2 is a perspective view showing an electronic apparatus having a buffer structure according to the embodiment of the present invention;
【図3】従来のディスク状記憶媒体を有する記憶装置の
斜視部品構成図FIG. 3 is a perspective view illustrating a configuration of a storage device having a conventional disk-shaped storage medium.
【図4】従来のディスク状記憶媒体を有する記憶装置を
電子機器に挿入する状態を示す斜視図FIG. 4 is a perspective view showing a state where a storage device having a conventional disk-shaped storage medium is inserted into an electronic device.
1 記憶装置 2 弾性体 2a 穴部 2b 隔壁 3 本体部 DESCRIPTION OF SYMBOLS 1 Storage device 2 Elastic body 2a Hole part 2b Partition wall 3 Main part
Claims (3)
前記記憶装置の一部または全部を包囲し、複数箇所の穴
部が設けられた弾性体で構成されたことを特徴とする電
子機器の緩衝構造。A storage device having a disk-shaped storage medium;
A buffer structure for an electronic device, wherein the buffer structure surrounds a part or the entirety of the storage device and is formed of an elastic body provided with a plurality of holes.
憶装置の周囲に連なるハニカム形状により構成されたこ
とを特徴とする請求項1記載の電子機器の緩衝構造。2. The cushioning structure for an electronic device according to claim 1, wherein the elastic body has a honeycomb shape connected to a periphery of a storage device having a disk-shaped storage medium.
前記記憶装置の一部または全部を包囲する伝熱性の放熱
材料からなる弾性体で構成されたことを特徴とする電子
機器の緩衝構造。3. A storage device having a disk-shaped storage medium,
A buffer structure for an electronic device, comprising: an elastic body made of a heat conductive heat radiating material surrounding a part or the whole of the storage device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10053223A JPH11249759A (en) | 1998-03-05 | 1998-03-05 | Cushion structure for electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10053223A JPH11249759A (en) | 1998-03-05 | 1998-03-05 | Cushion structure for electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11249759A true JPH11249759A (en) | 1999-09-17 |
Family
ID=12936837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10053223A Pending JPH11249759A (en) | 1998-03-05 | 1998-03-05 | Cushion structure for electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11249759A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002352575A (en) * | 2001-05-24 | 2002-12-06 | Matsushita Electric Ind Co Ltd | Information processor having heat dissipation and buffer structure of housing unit |
JP2008059652A (en) * | 2006-08-30 | 2008-03-13 | Teac Corp | Hard disk device |
US8502928B2 (en) | 2011-09-01 | 2013-08-06 | Kabushiki Kaisha Toshiba | Television receiver and electronic device |
-
1998
- 1998-03-05 JP JP10053223A patent/JPH11249759A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002352575A (en) * | 2001-05-24 | 2002-12-06 | Matsushita Electric Ind Co Ltd | Information processor having heat dissipation and buffer structure of housing unit |
JP4706125B2 (en) * | 2001-05-24 | 2011-06-22 | パナソニック株式会社 | Information processing device with heat dissipation buffer structure for functional unit |
JP2008059652A (en) * | 2006-08-30 | 2008-03-13 | Teac Corp | Hard disk device |
US8502928B2 (en) | 2011-09-01 | 2013-08-06 | Kabushiki Kaisha Toshiba | Television receiver and electronic device |
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