JPH11239980A - Silicon wafer working machine - Google Patents
Silicon wafer working machineInfo
- Publication number
- JPH11239980A JPH11239980A JP5569598A JP5569598A JPH11239980A JP H11239980 A JPH11239980 A JP H11239980A JP 5569598 A JP5569598 A JP 5569598A JP 5569598 A JP5569598 A JP 5569598A JP H11239980 A JPH11239980 A JP H11239980A
- Authority
- JP
- Japan
- Prior art keywords
- grinding wheel
- wheel holder
- grinding
- holder
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、シリコンウエハー（以
下単にウエハーとする）の加工機に係わるもので、特
に、ウエハーの研削後にウエハーをワークプレートより
外さず引き続いて研磨加工を施しうるようにしたウエハ
ー加工機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing machine for a silicon wafer (hereinafter simply referred to as a "wafer"), and more particularly, to a polishing machine capable of continuously performing polishing without removing the wafer from a work plate after grinding the wafer. To a processed wafer processing machine.
【０００２】[0002]
【従来の技術】ウエハーの表面加工機として研削盤が開
発使用されている。しかし、研削後でもウエハーの表面
は粗く、また、残留圧縮応力や加工変質層等によるその
表面性状も満足でなく、最終的には研磨加工を施す必要
がある。そして、研削は運動制御方式、つまり運動転写
の加工であり、研磨は圧力制御方式、つまり圧力転写の
加工であって、両者は加工原理が相違するものである。
このため、ー般には同一加工機上で研削と研磨の両加工
を行なうことはなく、研削終了後にウエハーをワークプ
レートより取り外し、別の研磨機に移送し、再びワーク
プレートにセツトして研磨している。このように、研削
と研磨とを切り離して行なうため、研削盤と研磨機の２
台の加工機を要すると共に、段取りに相当の時間と労力
を要していた。2. Description of the Related Art A grinder has been developed and used as a wafer surface processing machine. However, even after grinding, the surface of the wafer is rough, and its surface properties due to the residual compressive stress and the damaged layer are not satisfactory. Grinding is a movement control method, that is, movement transfer processing, and polishing is a pressure control method, that is, pressure transfer processing, and both have different processing principles.
For this reason, in general, both grinding and polishing are not performed on the same processing machine. After grinding, the wafer is removed from the work plate, transferred to another polishing machine, and set again on the work plate for polishing. doing. As described above, since the grinding and the polishing are performed separately, the grinding machine and the polishing machine are used.
In addition to the need for one processing machine, the setup required considerable time and labor.
【０００３】一部には同一盤、同一スピンドルを使用し
て研削と研磨とを連続加工する実験が行なわれ、報告
（雑誌 機械技術 第４４巻 第１０号 ７５〜８０
頁）もされているが、ここに発表されている方式では、
研削後に切替板を取り外して定切込み機構を切離し、ま
た、研削ホイールと取り替えられた研磨ディスクをウエ
ハ加工面に作用させて研磨するようになっており、ウエ
ハーを取り外し、移送しないでいいものの、やはり、段
取り替えに相当の労力と時間を要していた。[0003] Some experiments have been conducted in which grinding and polishing are continuously performed using the same disk and the same spindle, and reports have been made (Magazine Technology, Vol. 44, No. 10, 75-80).
Page), but in the method presented here,
After the grinding, the switching plate is removed and the constant cutting mechanism is separated, and the grinding disc replaced with the grinding wheel is made to act on the wafer processing surface, so that the wafer is removed and it is not necessary to remove and transfer the wafer, but It took a lot of effort and time to change the setup.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、ウエハー加
工において、研削終了後にウエハーを取り外し、移送す
ることなく、しかも、油圧制御すると云う簡単な作動だ
けで同一ワークテーブル上で、引き続いて研磨加工を施
すことができるウエハー加工機を得ることを目的とす
る。SUMMARY OF THE INVENTION According to the present invention, in the wafer processing, after the grinding is completed, the wafer is not removed and transferred, and the polishing is continuously performed on the same work table by a simple operation such as hydraulic control. It is an object of the present invention to obtain a wafer processing machine capable of performing the above.
【０００５】[0005]
【課題を解決するための手段】本発明は、回転駆動さ
れ、定切り込み送り可能とされた主軸に研削ホイールホ
ルダーを固定し、該研削ホイールホルダーの外周に研磨
砥石ホルダーをシリンドリカルに嵌め合せ、研削ホイー
ルホルダーには外周に断面角状の円周溝を設け、研磨砥
石ホルダーには、前記研削ホイールホルダーの円周溝に
納まる庇状のフランジを設け、前記研削ホイールホルダ
ーの円周溝に油圧を供給して研磨砥石ホルダーを研削ホ
イールホルダーの外周面上を軸方向に摺動させ、研磨砥
石の砥石面を研削ホイールの研削面より突出させ得るよ
うにした。また、主軸の軸方向中心に設けた管路と、研
削ホイールホルダーの軸直角方向に設けた管路とを介し
て研削ホイールホルダーの円周溝に油圧を供給するよう
にした。SUMMARY OF THE INVENTION According to the present invention, a grinding wheel holder is fixed to a spindle which is driven to rotate and is capable of feeding at a constant cutting rate, and a grinding wheel holder is cylindrically fitted around the grinding wheel holder to perform grinding. The wheel holder is provided with a circumferential groove having a square cross section on the outer periphery, the grinding wheel holder is provided with an eave-shaped flange that fits in the circumferential groove of the grinding wheel holder, and hydraulic pressure is applied to the circumferential groove of the grinding wheel holder. The grinding wheel holder was supplied so that the grinding wheel holder was slid in the axial direction on the outer peripheral surface of the grinding wheel holder so that the grinding wheel surface of the grinding wheel could be protruded from the grinding surface of the grinding wheel. Further, the hydraulic pressure is supplied to the circumferential groove of the grinding wheel holder via a pipe provided at the axial center of the main shaft and a pipe provided at right angles to the axis of the grinding wheel holder.
【０００６】[0006]
【発明の実施の形態】以下本発明の実施の形態について
説明する。図１は本発明による研削ホイールと研磨砥石
の取り付け状態を示す断面図であって、図において上半
分は研削時において研削ホイールが突出した状態、下半
分は研磨時において研磨砥石が突出した状態を示してい
る。１は主軸台であって、主軸２を回転自在に、かつ、
定切り込み送り可能に支持している。３は、主軸２の軸
方向中心に形成された管路であって、回転カップリング
４を介して油圧が供給されるようになっている。Embodiments of the present invention will be described below. FIG. 1 is a cross-sectional view showing a mounted state of a grinding wheel and a grinding wheel according to the present invention. In the figure, the upper half shows a state in which the grinding wheel protrudes during grinding, and the lower half shows a state in which the grinding wheel protrudes during polishing. Is shown. Reference numeral 1 denotes a headstock, which allows the spindle 2 to rotate freely, and
It supports it so that it can feed at a constant cut. Reference numeral 3 denotes a pipeline formed at the center of the main shaft 2 in the axial direction, and the hydraulic pressure is supplied through a rotary coupling 4.
【０００７】５は主軸２に固定された研削ホイールホル
ダー、６はホルダー５に取り付けられた研削ホイールで
ある。７は研削ホイールホルダー５の外周にシリンドリ
カルに嵌め合わされた研磨砥石ホルダーであり、８はホ
ルダー７に取り付けられた研磨砥石である。研削ホイー
ルホルダー５の外周面には断面角状の円周溝９が形成さ
れ、研磨砥石ホルダー７の内面側には庇状のフランジ１
０が形成されており、研削ホイールホルダー５に研磨砥
石ホルダー７を嵌め合わせた状態で、円周溝９はシリン
ダーとなり、フランジ１０はピストンとなるように構成
されている。１１は、研削ホイールホルダー５の軸直角
方向に形成された管路であって、放射状に複数本設けら
れており、夫々主軸２に形成された管路３に連通すると
共に、円周溝９に開口している。１２は押しばねであっ
て、研削ホイールホルダー５の円周溝９内に収納されて
おり、研磨砥石ホルダー７のフランジ１０に当接し、常
時は研磨砥石ホルダー７を研削ホイールホルダー５の研
削面と反対側、図示では左端に位置するよう付勢してい
る。なお、１３は、押しばね１２の位置決め用の穴であ
つて、前記円周溝９の研削側の側面に溝状に設けられて
いる。[0007] Reference numeral 5 denotes a grinding wheel holder fixed to the main shaft 2, and reference numeral 6 denotes a grinding wheel attached to the holder 5. Reference numeral 7 denotes a polishing wheel holder cylindrically fitted to the outer periphery of the grinding wheel holder 5, and reference numeral 8 denotes a polishing wheel mounted on the holder 7. A circumferential groove 9 having a square cross section is formed on the outer peripheral surface of the grinding wheel holder 5, and an eave-shaped flange 1 is formed on the inner surface side of the polishing wheel holder 7.
0 is formed, and in a state where the grinding wheel holder 7 is fitted to the grinding wheel holder 5, the circumferential groove 9 becomes a cylinder and the flange 10 becomes a piston. Numeral 11 denotes pipes formed in the direction perpendicular to the axis of the grinding wheel holder 5, and a plurality of pipes are radially provided, each of which communicates with the pipes 3 formed on the main shaft 2, and is formed in the circumferential groove 9. It is open. Reference numeral 12 denotes a pressing spring, which is housed in the circumferential groove 9 of the grinding wheel holder 5 and abuts on the flange 10 of the grinding wheel holder 7, and always holds the grinding wheel holder 7 in contact with the grinding surface of the grinding wheel holder 5. It is urged to be located on the opposite side, the left end in the figure. Reference numeral 13 denotes a positioning hole for the pressing spring 12, which is provided in a groove shape on the grinding-side surface of the circumferential groove 9.
【０００８】図２および図３には、研削ホイールホルダ
ー５と研磨砥石ホルダー７との間の回り止め構造を示し
ている。図２において回り止めピン１４は研削ホイール
ホルダー５の円周溝９の切削面側の側面に植設されてお
り、その先部は研磨砥石ホルダー７のフランジ１０に穿
孔されたピン孔１５に挿入されている。図３において回
り止めピン１６は研磨砥石ホルダー７に設けた長穴１７
を通して研削ホイールホルダー５にねじ込まれており、
何れの場合も研削ホイールホルダー５と研磨砥石ホルダ
ー７との間において両者の軸方向、図示左右方向の摺動
は自由にして、回転方向の摺動は阻止するようになって
いる。なお、図中１８はウエハーの加工面を示す。ま
た、図示していないが、研削面Ａおよび砥石面Ｂには夫
々研削金鋼粒および砥石粒が固着されている。FIGS. 2 and 3 show a detent structure between the grinding wheel holder 5 and the grinding wheel holder 7. FIG. In FIG. 2, a detent pin 14 is implanted on the side of the circumferential groove 9 of the grinding wheel holder 5 on the side of the cutting surface, and its tip is inserted into a pin hole 15 formed in a flange 10 of the grinding wheel holder 7. Have been. In FIG. 3, the non-rotating pin 16 is a slot 17 provided in the polishing wheel holder 7.
Is screwed into the grinding wheel holder 5 through
In any case, the sliding between the grinding wheel holder 5 and the polishing wheel holder 7 in the axial direction and the left and right direction in the drawing is free, and the sliding in the rotating direction is prevented. In the drawing, reference numeral 18 denotes a processed surface of the wafer. Although not shown, the grinding surface A and the grinding wheel surface B have a grinding metal steel grain and a grinding stone grain fixed thereto, respectively.
【０００９】本発明の構成は以上の通りであって、次
に、このウエハー加工機の作用について説明する。 ま
ず、研削ホイールホルダー５の円周溝９に油圧を供給し
ないときは、研磨砥石ホルダー７は押しばね１２によっ
て研削ホイールホルダー５の図示左端の位置まで押され
ており、このとき研削面Ａは図１の上半分に示すように
研磨砥石８の端部より突出した状態となっている。この
状態で研削ホイール６を回転しながら、定切込み送りを
与えウエハ加工面１８の研削加工を行なう。The configuration of the present invention is as described above. Next, the operation of the wafer processing machine will be described. First, when the hydraulic pressure is not supplied to the circumferential groove 9 of the grinding wheel holder 5, the grinding wheel holder 7 is pushed to the position on the left end of the grinding wheel holder 5 in the drawing by the pressing spring 12, and the grinding surface A As shown in the upper half of FIG. 1, it is in a state of protruding from the end of the polishing grindstone 8. While rotating the grinding wheel 6 in this state, a constant cutting feed is given to grind the wafer processing surface 18.
【００１０】次いで、研削加工が終了したら、管路３及
び管路１１を介して研削ホイールホルダー５の円周溝９
に油圧を供給する。この油圧の供給により研磨砥石ホル
ダー７は押しばね１２の抗力に打ち勝って図示右方に押
され、最終的には研削ホイールホルダー５の図示右端ま
で押される。このとき砥石面Ｂは図１の下半分に示すよ
うに研削ホイール６の端部より突出した状態となってい
る。この状態で研磨砥石８を研削ホイール５と共に回転
させ、ウエハ加工面１８の研磨加工を施す。研磨加工す
る際、油圧が押しばね１２のばね圧に打ち勝った分が研
磨圧となるので、油圧調整することにより研磨圧力を調
整することができる。Next, when the grinding is completed, the circumferential groove 9 of the grinding wheel holder 5 is connected through the pipes 3 and 11.
Supply hydraulic pressure to By the supply of the hydraulic pressure, the grinding wheel holder 7 is pushed rightward in the figure overcoming the resistance of the pressing spring 12 and finally pushed to the right end in the figure of the grinding wheel holder 5. At this time, the grinding wheel surface B is in a state of protruding from the end of the grinding wheel 6 as shown in the lower half of FIG. In this state, the polishing grindstone 8 is rotated together with the grinding wheel 5, and the wafer processing surface 18 is polished. At the time of polishing, the polishing pressure is equal to the pressure overcoming the spring pressure of the compression spring 12, so that the polishing pressure can be adjusted by adjusting the hydraulic pressure.
【００１１】図４には本発明による研削ホイールと研磨
砥石の他の取り付け例を示す。１９はホルダーを一体と
した研削ホイールであり、２０はホルダーを一体とした
研磨砥石である。その他の構成は図１に示した例と同じ
である。このように構成することも可能であって、同等
の作用、効果を得ることができる。なお、図中１２ａは
コイル径が小さな押しばね、１３ａは、押しばね１２ａ
を保持するばね穴であって、このようにコイルが小さな
押しばね１２ａを、多数研削ホイール５の円周溝９に収
納することも可能であり、図１、図４何れの例において
も大径の押しばね１２と小径の押しばね１２ａは任意に
選択し得る。FIG. 4 shows another example of mounting the grinding wheel and the grinding wheel according to the present invention. 19 is a grinding wheel with an integrated holder, and 20 is a grinding wheel with an integrated holder. Other configurations are the same as the example shown in FIG. Such a configuration is possible, and the same operation and effect can be obtained. In the drawing, 12a is a compression spring having a small coil diameter, and 13a is a compression spring 12a.
It is also possible to accommodate the pressing spring 12a having such a small coil in the circumferential groove 9 of the multi-grinding wheel 5 as shown in FIG. 1 and FIG. And the small-diameter push spring 12a can be arbitrarily selected.
【００１２】また、これ等の実施例では、研削ホイール
５に設けた管路１１を研削ホイールホルダー５の円周溝
９の研削面と反対側の側面に開口させ、押しばね１２を
前記円周溝９の研削面側の側面に穿孔した孔１３に収納
して研磨砥石ホルダー７のフランジ１０に当接させた
が、これを逆に、すなわち、管路１１を円周溝９の研削
面側の側面に開口させ、押しばね１２を円周溝９の研削
面と反対側の側面に穿孔した孔に収納するようにして、
常態では研磨砥石８を突出させ、油圧を送給して研削ホ
イール６が突出するように構成しても同効である。Further, in these embodiments, a pipe 11 provided in the grinding wheel 5 is opened on the side surface of the grinding wheel holder 5 opposite to the grinding surface of the circumferential groove 9, and the pressing spring 12 is moved in the circumferential direction. The groove 9 was housed in a hole 13 formed in the side of the grinding surface on the grinding surface side and was brought into contact with the flange 10 of the grinding wheel holder 7. So that the pressing spring 12 is housed in a hole formed in the side surface of the circumferential groove 9 opposite to the ground surface,
In the normal state, the same effect can be obtained even if the grinding wheel 8 is projected and the hydraulic pressure is supplied so that the grinding wheel 6 is projected.
【００１３】[0013]
【発明の効果】本発明は、研磨砥石のホルダーを研削ホ
イールのホルダーの外周面にシリンドリカルに嵌め合わ
せ、該外周面上を軸方向に摺動可能とし、油圧操作によ
り研磨砥石のホルダーを摺動させて、砥石面を研削ホイ
ールの端部より突出させ得るようにしたので、ウエハー
の研削終了後に、油圧操作だけでウエハーを取り外すこ
となく、そのままの状態で、続けて研磨加工を施すこと
ができると云う効果を有する。According to the present invention, the holder of the grinding wheel is cylindrically fitted to the outer peripheral surface of the holder of the grinding wheel, and the outer peripheral surface is slidable in the axial direction, and the holder of the grinding wheel is slid by hydraulic operation. As a result, the grinding wheel surface can be made to protrude from the end of the grinding wheel. Therefore, after the grinding of the wafer is completed, the grinding process can be continuously performed without removing the wafer only by the hydraulic operation without removing the wafer. The effect is as follows.
【図１】本発明の研削ホイールと研磨砥石の取り付けを
示す断面図。FIG. 1 is a cross-sectional view showing attachment of a grinding wheel and a grinding wheel of the present invention.
【図２】回り止め構造を示す概略図。FIG. 2 is a schematic view showing a rotation preventing structure.
【図３】他の回り止め構造を示す概略図。FIG. 3 is a schematic diagram showing another detent structure.
【図４】本発明の研削ホイールと研磨砥石の別の取り付
けを示す断面図。FIG. 4 is a cross-sectional view showing another attachment of the grinding wheel and the grinding wheel of the present invention.
１ 主軸台 ２ 主軸 ３ 管路 ４ 回転ジョイント ５ 研削ホイールホルダー ６ 研削ホイール ７ 研磨砥石ホルダー ８ 研磨砥石 ９ 円周溝 １０ フランジ １１ 管路 １２、１２ａ 押しばね １３、１３ａ ばね穴 １４ １６ 回り止めピン １５ ピン孔 １７ 長穴 １８ ウエハー加工面 １９ 研削ホイール ２０ 研磨砥石 Ａ 研削面 Ｂ 砥石面 DESCRIPTION OF SYMBOLS 1 Spindle stand 2 Spindle 3 Pipe line 4 Rotary joint 5 Grinding wheel holder 6 Grinding wheel 7 Polishing grindstone holder 8 Polishing grindstone 9 Circumferential groove 10 Flange 11 Pipeline 12, 12a Press spring 13, 13a Spring hole 14 16 Lock pin 15 Pin hole 17 Slotted hole 18 Wafer processing surface 19 Grinding wheel 20 Polishing grindstone A Grinding surface B Grinding stone surface
───────────────────────────────────────────────────── フロントページの続き (72)発明者 真崎 隆三 愛媛県新居浜市惣開町５番２号 住友重機 械工業株式会社新居浜製造所内 (72)発明者 原 一敬 神奈川県平塚市夕陽ケ丘63番30号 住友重 機械工業株式会社平塚事業所内 (72)発明者 冨田 良幸 神奈川県平塚市夕陽ゲ丘63番30号 住友重 機械工業株式会社平塚事業所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Ryuzo Masaki 5-2 Sokai-cho, Niihama-shi, Ehime Sumitomo Heavy Industries, Ltd. Inside Niihama Works (72) Inventor Kazutaka Hara 63-30 Yuyogaoka, Hiratsuka-shi, Kanagawa Prefecture Sumitomo Heavy Industries Machinery Co., Ltd. Hiratsuka Works (72) Inventor Yoshiyuki Tomita 63-30 Yuyogeoka, Hiratsuka-shi, Kanagawa Prefecture
Claims (2)
研削ホイールホルダーの外周に研磨砥石ホルダーをシリ
ンドリカルに嵌め合わせ、研削ホイールホルダーには外
周に断面角状の円周溝を形成し、研磨砥石ホルダーには
内径側に、前記研削ホイールホルダーの円周溝に納まる
庇状のフランジを設け、前記研削ホイールホルダーの円
周溝に油圧を供給して研磨砥石ホルダーを研削ホイール
ホルダーの外周面上を軸方向に摺動させ得るようにした
ことを特徴とするシリコンウエハー加工機。1. A grinding wheel holder is fixed to a main spindle, and a grinding wheel holder is cylindrically fitted on the outer periphery of the grinding wheel holder. A circumferential groove having a square cross section is formed on the outer circumference of the grinding wheel holder. On the inner diameter side of the holder, an eave-shaped flange that fits in the circumferential groove of the grinding wheel holder is provided, and hydraulic pressure is supplied to the circumferential groove of the grinding wheel holder, and the polishing wheel holder is moved on the outer peripheral surface of the grinding wheel holder. A silicon wafer processing machine characterized in that it can slide in the axial direction.
イールホルダーの軸直角方向に、放射状に設けた管路と
を介して研削ホイールホルダーの円周溝に油圧を供給す
ることを特徴とする請求項１記載のシリコンウエハー加
工機。2. A method for supplying hydraulic pressure to a circumferential groove of a grinding wheel holder via a pipe provided at an axial center of a spindle and a pipe provided radially in a direction perpendicular to the axis of the grinding wheel holder. 2. The silicon wafer processing machine according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05569598A JP3373422B2 (en) | 1998-02-23 | 1998-02-23 | Silicon wafer processing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP05569598A JP3373422B2 (en) | 1998-02-23 | 1998-02-23 | Silicon wafer processing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11239980A true JPH11239980A (en) | 1999-09-07 |
| JP3373422B2 JP3373422B2 (en) | 2003-02-04 |
Family
ID=13006041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP05569598A Expired - Fee Related JP3373422B2 (en) | 1998-02-23 | 1998-02-23 | Silicon wafer processing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3373422B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227523A (en) * | 2013-06-19 | 2014-12-24 | 晶科能源有限公司 | Silicon wafer grinding process and equipment |
| JP2018192533A (en) * | 2017-05-12 | 2018-12-06 | 株式会社ディスコ | Spindle unit |
-
1998
- 1998-02-23 JP JP05569598A patent/JP3373422B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104227523A (en) * | 2013-06-19 | 2014-12-24 | 晶科能源有限公司 | Silicon wafer grinding process and equipment |
| JP2018192533A (en) * | 2017-05-12 | 2018-12-06 | 株式会社ディスコ | Spindle unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3373422B2 (en) | 2003-02-04 |
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