JPH11239009A - Band widening structure of irreversible circuit element - Google Patents
Band widening structure of irreversible circuit elementInfo
- Publication number
- JPH11239009A JPH11239009A JP10039882A JP3988298A JPH11239009A JP H11239009 A JPH11239009 A JP H11239009A JP 10039882 A JP10039882 A JP 10039882A JP 3988298 A JP3988298 A JP 3988298A JP H11239009 A JPH11239009 A JP H11239009A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- circuit device
- reciprocal circuit
- reciprocal
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Non-Reversible Transmitting Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＶＨＦ、ＵＨＦ、
ＳＨＦ帯等で使用される集中定数型サーキュレータ、ア
イソレータ等の非可逆回路素子に関し、その非可逆回路
素子の広帯域化を図った構造に関するものである。[0001] The present invention relates to VHF, UHF,
The present invention relates to a non-reciprocal circuit device such as a lumped-constant circulator and an isolator used in an SHF band or the like, and to a structure for widening the band of the non-reciprocal circuit device.
【０００２】[0002]
【従来の技術】一般に、集中定数型アイソレータ、サー
キュレータ等の非可逆回路素子は、信号の伝送方向には
ほとんど減衰がなく、かつ逆方向には減衰が大きくなる
ような機能を有しており、例えば携帯電話、自動車電話
等の移動体通信機器の送受信回路部に用いられている。2. Description of the Related Art Generally, non-reciprocal circuit devices such as lumped-constant isolators and circulators have a function of hardly attenuating in a signal transmission direction and increasing in a reverse direction. For example, it is used in a transmission / reception circuit of a mobile communication device such as a mobile phone and a car phone.
【０００３】図８に、従来例の集中定数型アイソレータ
の分解斜視図を示す。この従来例は、最下部に樹脂ケー
ス１がある。この樹脂ケース１は、３つの導電体板が樹
脂部分と一体に形成されている。この１つの導電体板
は、アース電極板２であり、樹脂ケース１の底部に広く
配置され、それと繋がるアース端子３が樹脂ケース１の
装着面となる裏面に導出されている。また、他の２つの
導電体板は、入出力端子用であり、内側の回路接続端子
４と外側の入出力端子５とが繋がったコ字状の導電体板
である。この内側回路接続端子４は、アース板電極２の
配置されている面に突起部６が形成され、その突起部６
の上に配置されている。このアース端子３、入出力端子
５は、それぞれ２個対向して形成されている。FIG. 8 is an exploded perspective view of a conventional lumped constant type isolator. In this conventional example, there is a resin case 1 at the bottom. In the resin case 1, three conductor plates are formed integrally with the resin portion. This one conductor plate is a ground electrode plate 2, which is widely disposed on the bottom of the resin case 1, and a ground terminal 3 connected to the ground electrode plate 2 is led out to a back surface serving as a mounting surface of the resin case 1. The other two conductive plates are used for input / output terminals, and are U-shaped conductive plates in which the inner circuit connection terminal 4 and the outer input / output terminal 5 are connected. The inner circuit connection terminal 4 has a projection 6 formed on the surface on which the ground plate electrode 2 is arranged.
Is placed on top. The ground terminal 3 and the input / output terminal 5 are formed to face each other.
【０００４】この樹脂ケース１の上に、金属ケース下７
が載せられる。この金属ケース下７は、樹脂ケース１の
突起部６に対応する切り欠き部８を有し、この樹脂ケー
ス１のアース電極板２と半田付けされる。On the resin case 1, a metal case 7
Is placed. The lower metal case 7 has a cutout 8 corresponding to the projection 6 of the resin case 1, and is soldered to the ground electrode plate 2 of the resin case 1.
【０００５】この金属ケース下７の上に、誘電体板の上
下面に電極が形成された板状コンデンサ９とチップ抵抗
１０と、フェライトコア１１上に中心導体１２を互いに
絶縁状態で、１２０度の間隔で回転対称に配置された中
心導体部とを配置する。この３つの中心導体１２のう
ち、２つの中心導体１２の先端部１３ａ、１３ｂは、そ
れぞれ板状コンデンサ９と樹脂ケース１上の内側回路接
続端子４に接続され、他の一つの中心導体の先端部１３
ｃは、板状コンデンサ９とチップ抵抗１０に接続され
る。この中心導体部のフェライトコア１１の下部は、３
つの中心導体の共通部であり、この共通部は金属ケース
下７に接続され、アース接続される。又、板状コンデン
サ９も中心導体の先端部が接続される面の対向面側で金
属ケース下７に接続され、アース接続される。そして、
そのチップ抵抗１０の端子電極が金属ケース下７と接続
され、アース接続される。On the lower metal case 7, a plate-like capacitor 9 having electrodes formed on the upper and lower surfaces of a dielectric plate, a chip resistor 10, and a center conductor 12 on a ferrite core 11 are insulated from each other by 120 degrees. And the center conductor portion, which is arranged rotationally symmetrically at an interval of. Of the three center conductors 12, the tip portions 13a and 13b of the two center conductors 12 are connected to the plate-shaped capacitor 9 and the inner circuit connection terminal 4 on the resin case 1, respectively, and the tip ends of the other one of the center conductors Part 13
c is connected to the plate capacitor 9 and the chip resistor 10. The lower part of the ferrite core 11 of the center conductor is 3
Common part of the two center conductors, which is connected to the lower part 7 of the metal case and grounded. The plate capacitor 9 is also connected to the lower metal case 7 on the side opposite to the surface to which the tip of the center conductor is connected, and is also grounded. And
The terminal electrode of the chip resistor 10 is connected to the lower metal case 7 and grounded.
【０００６】次に、この中心導体部に樹脂モールド２０
を被せる。この樹脂モールド２０は、中央にフェライト
コア１１の外径とほぼ同じ大きさの貫通孔２１を有し、
下部にフェライトコア１１の外周部に当接するような爪
部２２が３ヶ所形成されている。この爪部２２は、フェ
ライトコアの側面の中心導体の部分に位置し、フェライ
トコアの位置決めを行っている。この樹脂モールド２０
は、外形が樹脂ケース１及び金属ケース下７の内側に収
納される大きさであり、上面に磁石２４を位置決めする
突出部２３が形成されている。そして、この突出部２３
で位置決めされる位置に磁石２４が配置される。そし
て、金属ケース上２５を被せ、金属ケース上２５と金属
ケース下７とを半田付けして集中定数型アイソレータを
構成している。Next, a resin mold 20 is formed on the center conductor.
Put on. The resin mold 20 has a through hole 21 having a size substantially equal to the outer diameter of the ferrite core 11 at the center,
At the lower part, three claw portions 22 are formed so as to contact the outer peripheral portion of the ferrite core 11. The claw portion 22 is located at the center conductor on the side surface of the ferrite core, and positions the ferrite core. This resin mold 20
Has a size such that the outer shape is accommodated inside the resin case 1 and the metal case lower part 7, and a protrusion 23 for positioning the magnet 24 is formed on the upper surface. Then, the protrusion 23
The magnet 24 is arranged at a position where the magnet 24 is positioned. Then, the metal case upper part 25 is covered, and the metal case upper part 25 and the metal case lower part 7 are soldered to form a lumped constant type isolator.
【０００７】[0007]
【発明が解決しようとする課題】従来の非可逆回路素子
が使用されている用途の一つに携帯電話がある。この携
帯電話の小型化はめざましく、それに使用される非可逆
回路素子も小型化が進んでいる。最近では、７ｍｍ角の
大きさの非可逆回路素子が使用されている。一方で、携
帯電話の使用周波数範囲が広帯域化する傾向に有る。One application in which a conventional non-reciprocal circuit device is used is a cellular phone. The size of the mobile phone has been remarkably reduced, and the size of the non-reciprocal circuit device used for the mobile phone has also been reduced. Recently, a non-reciprocal circuit element having a size of 7 mm square has been used. On the other hand, there is a tendency that the operating frequency range of mobile phones is widened.
【０００８】従来の集中定数型非可逆回路素子の等価回
路を図５に示す。中心導体で構成されるＬ１、Ｌ２、Ｌ
３と板状コンデンサによるＣ１、Ｃ２、Ｃ３を有し、そ
れぞれの一端を接地し、他端を入出力端としている。こ
の例では、アイソレータを示しているので一つの入出力
端はチップ抵抗によるダミー抵抗Ｒに接続され、接地さ
れている。この従来の集中定数型非可逆回路素子は、単
峰特性であり、広帯域化するためには回路の変更が必要
であった。FIG. 5 shows an equivalent circuit of a conventional lumped constant type non-reciprocal circuit device. L1, L2, L composed of a center conductor
3 and C1, C2 and C3 formed by plate capacitors, one end of which is grounded and the other end is an input / output terminal. In this example, since an isolator is shown, one input / output terminal is connected to a dummy resistor R formed by a chip resistor and grounded. This conventional lumped-constant type nonreciprocal circuit element has a single-peak characteristic, and the circuit needs to be changed in order to widen the band.
【０００９】従来の非可逆回路素子を広帯域化するため
の回路構成として、図６に示す等価回路が知られてい
る。この例では、各入出力端に直列共振回路５１、５
２、５３を接続している。これにより、双峰特性が得ら
れ、広帯域化することができる。さらに、図６の例で
は、各入出力端に直列共振回路が必要な構造であるのに
対し、図７に示す等価回路も知られている。この図７に
示すものは、従来接地していた各アース接続端とアース
との間に直列共振回路５４を接続するものであり、直列
共振回路が一つで済むという利点がある。この従来例と
して、特開平９−２７０６０７号公報の図１０、１１に
記載されているものがある。この従来例は、共振回路を
３つの基板を積層した積層基板により構成し、磁性ヨー
クの下面に配置した構造である。これによれば、部品の
高さが大きくなる分だけ大型化、重量の増大化は避けら
れず、小型化、軽量化に対応出来ないという問題点が指
摘されている。An equivalent circuit shown in FIG. 6 is known as a circuit configuration for widening the bandwidth of a conventional nonreciprocal circuit device. In this example, the series resonance circuits 51, 5
2, 53 are connected. Thereby, a bimodal characteristic can be obtained, and the band can be widened. Further, in the example shown in FIG. 6, a series resonance circuit is required at each input / output terminal, whereas an equivalent circuit shown in FIG. 7 is also known. In the configuration shown in FIG. 7, the series resonance circuit 54 is connected between each ground connection terminal and the ground, which are conventionally grounded, and there is an advantage that only one series resonance circuit is required. As this conventional example, there is one disclosed in FIGS. 10 and 11 of JP-A-9-270607. This conventional example has a structure in which a resonance circuit is configured by a laminated substrate in which three substrates are laminated, and is arranged on a lower surface of a magnetic yoke. According to this, a problem has been pointed out that the increase in size and weight is inevitable due to the increase in the height of the parts, and it is not possible to cope with downsizing and weight reduction.
【００１０】従来では、これらの構造を利用し、集中定
数型非可逆回路素子の広帯域化が図られているが、いず
れも非可逆回路素子として直列共振回路を付加するもの
であり、素子の小型化を阻害する要因となっていた。Conventionally, the lumped-constant type nonreciprocal circuit element has been broadened by utilizing these structures. However, in each case, a series resonance circuit is added as the nonreciprocal circuit element, and the element is compact. It was a factor that hindered the conversion.
【００１１】本発明は、上記のことを鑑みて、素子の大
型化を招くこと無く、広帯域化を達成することができる
非可逆回路素子の広帯域化構造を提供するものである。In view of the above, the present invention provides a broadband structure of a non-reciprocal circuit device capable of achieving a wide band without increasing the size of the device.
【００１２】[0012]
【課題を解決するための手段】本発明の第１の発明は、
非可逆回路素子及びその他の回路素子が実装される回路
基板に共振回路が形成されており、前記非可逆回路素子
のアース端子は、前記共振回路を経由してアースに接続
される構造とすることにより、非可逆回路素子の広帯域
化を達成するものである。Means for Solving the Problems A first invention of the present invention is:
A resonance circuit is formed on a circuit board on which the non-reciprocal circuit element and other circuit elements are mounted, and a ground terminal of the non-reciprocal circuit element is connected to ground via the resonance circuit. Thus, the non-reciprocal circuit device can achieve a wider band.
【００１３】本発明の第２の発明は、前記非可逆回路素
子が単峰特性の集中定数型非可逆回路素子であることを
特徴とするものである。A second invention of the present invention is characterized in that the non-reciprocal circuit device is a lumped constant non-reciprocal circuit device having a single peak characteristic.
【００１４】本発明の第３の発明は、前記共振回路が、
ストリップラインインダクタと積層チップコンデンサか
ら構成されている直列共振回路であることを特徴とする
ものである。According to a third aspect of the present invention, the resonance circuit includes:
It is a series resonance circuit composed of a stripline inductor and a multilayer chip capacitor.
【００１５】本発明の第４の発明は、前記回路基板が多
層配線基板であり、前記共振回路が前記多層配線基板の
多層構造により形成されたＬＣ共振回路であることを特
徴とするものである。According to a fourth aspect of the present invention, the circuit board is a multilayer wiring board, and the resonance circuit is an LC resonance circuit formed by a multilayer structure of the multilayer wiring board. .
【００１６】本発明の第５の発明は、前記非可逆回路素
子が７ｍｍ角以下の小型集中定数型非可逆回路素子であ
ることを特徴とするものである。According to a fifth aspect of the present invention, the non-reciprocal circuit device is a small lumped constant type non-reciprocal circuit device having a size of 7 mm square or less.
【００１７】[0017]
【発明の実施の形態】本発明は、非可逆回路素子の広帯
域化を図るものであり、またその広帯域化のために、単
峰特性の非可逆回路素子を双峰特性にするものである。
その広帯域化を図るために、非可逆回路素子のアース端
子に、共振回路を接続してアース接続するものであり、
その共振回路を、非可逆回路素子及びその他の回路素子
が実装される回路基板に形成したものである。つまり、
非可逆回路素子としては、従来のものを特別に改良する
必要はなく、実装基板側で対応するものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention aims at widening the bandwidth of a non-reciprocal circuit device, and in order to widen the band, a non-reciprocal circuit device having a single peak characteristic has a bimodal characteristic.
In order to widen the band, a resonance circuit is connected to the ground terminal of the non-reciprocal circuit element and grounded,
The resonance circuit is formed on a circuit board on which a non-reciprocal circuit element and other circuit elements are mounted. That is,
As the non-reciprocal circuit device, there is no need to particularly improve the conventional device, and the non-reciprocal circuit device is compatible with the mounting substrate.
【００１８】本発明によれば、非可逆回路素子として、
特別な設計変更を必要としなく、広帯域用と狭帯域（通
常の帯域）用とを同一の非可逆回路素子を用いることが
出来、設計、製造メリットは多大なものがある。一方、
回路基板としては、各回路素子を実装し、配線するもの
であり、共振回路を付加することは、さほど大きな負荷
とはならない。よって、本発明によれば、非常に簡便な
構造により、非可逆回路素子の広帯域化を達成出来る。According to the present invention, as the non-reciprocal circuit device,
The same non-reciprocal circuit element can be used for a wide band and a narrow band (ordinary band) without any special design change, and there are significant design and manufacturing advantages. on the other hand,
As a circuit board, each circuit element is mounted and wired, and adding a resonance circuit does not result in a large load. Therefore, according to the present invention, it is possible to achieve a wide band of the nonreciprocal circuit device with a very simple structure.
【００１９】本発明に係る一実施例の分解斜視図を図１
に示す。この実施例は、従来の技術で説明した非可逆回
路素子４０を用い、その側面から底面かけて、２つの入
出力端子５と２つのアース端子３を有している。そし
て、その非可逆回路素子４０が実装される回路基板３１
には、その入出力端子５が接続されるパターン電極３２
と、アース端子３が接続されるパターン電極３３が形成
されている。そして、アース端子３が接続されるパター
ン電極３３は、ストリップラインインダクタ３４が接続
されている。このストリップラインインダクタ３４とア
ース電極３５との間に積層チップインダクタ３６が接続
されている。これにより、図７に示す等価回路と同等の
非可逆回路を得ることが出来、非可逆回路素子の広帯域
化を達成出来る。この実施例と従来例との挿入損失特性
を図２に示す。明らかに本発明のものは広帯域化されて
いることがわかる。FIG. 1 is an exploded perspective view of an embodiment according to the present invention.
Shown in This embodiment uses the non-reciprocal circuit device 40 described in the related art, and has two input / output terminals 5 and two ground terminals 3 from the side surface to the bottom surface. Then, the circuit board 31 on which the non-reciprocal circuit element 40 is mounted
Has a pattern electrode 32 to which the input / output terminal 5 is connected.
And a pattern electrode 33 to which the ground terminal 3 is connected is formed. The strip electrode 34 is connected to the pattern electrode 33 to which the ground terminal 3 is connected. A multilayer chip inductor 36 is connected between the stripline inductor 34 and the ground electrode 35. As a result, a non-reciprocal circuit equivalent to the equivalent circuit shown in FIG. 7 can be obtained, and a wider band of the non-reciprocal circuit device can be achieved. FIG. 2 shows the insertion loss characteristics of this embodiment and the conventional example. It is apparent that the band of the present invention is broadened.
【００２０】本発明に係る別の実施例の分解斜視図を図
３に示す。この実施例も、従来の技術で説明した非可逆
回路素子４０を用いた。そして、その非可逆回路素子４
０が実装される回路基板３１には、その入出力端子５が
接続されるパターン電極３２と、アース端子３が接続さ
れるパターン電極３７が形成されている。この回路基板
は、多層配線基板であり、その内部の構造を示す斜視図
を図４に示す。この内部は、まずパターン電極３７と対
向しコンデンサを構成するパターン電極３８が所定間隔
を開けて構成されている。そのパターン電極３８にはス
ルーホール３９が形成されており、さらに下側に構成さ
れているインダクタライン４２に接続されている。この
インダクタライン４２にはスルーホール３９に接続され
るランド部４１を有し、他端はアースライン４３に接続
されている。これにより、図７に示す等価回路と同等の
非可逆回路を得ることが出来、非可逆回路素子の広帯域
化を達成出来る。FIG. 3 is an exploded perspective view of another embodiment according to the present invention. This embodiment also uses the non-reciprocal circuit device 40 described in the related art. And the non-reciprocal circuit element 4
The pattern electrode 32 to which the input / output terminal 5 is connected and the pattern electrode 37 to which the ground terminal 3 is connected are formed on the circuit board 31 on which 0 is mounted. This circuit board is a multilayer wiring board, and a perspective view showing an internal structure thereof is shown in FIG. In the inside, first, a pattern electrode 38 facing the pattern electrode 37 and constituting a capacitor is formed at a predetermined interval. A through hole 39 is formed in the pattern electrode 38, and is connected to an inductor line 42 formed further below. The inductor line 42 has a land 41 connected to the through hole 39, and the other end is connected to the ground line 43. As a result, a non-reciprocal circuit equivalent to the equivalent circuit shown in FIG. 7 can be obtained, and a wider band of the non-reciprocal circuit device can be achieved.
【００２１】このような回路基板においては、多層配線
基板は広く利用されており、その多層配線基板の内部に
上記した共振回路を構成することは容易である。また、
上記した２つの実施例において、パターン電極の形状は
適宜設計できるものであり、共振回路の構成も適宜変更
可能である。非可逆回路素子のアース端子（従来構造で
アースに接続されていた端子）に接続される共振回路を
構成し、その共振回路をアース接続する構成とした回路
基板であれば、本発明を実施出来る。もちろん、この回
路基板には、他の回路素子も実装され、例えば、携帯電
話の回路基板として使用されるものである。In such a circuit board, a multilayer wiring board is widely used, and it is easy to configure the above-described resonance circuit inside the multilayer wiring board. Also,
In the above two embodiments, the shape of the pattern electrode can be appropriately designed, and the configuration of the resonance circuit can be appropriately changed. The present invention can be implemented as long as the circuit board is configured to form a resonance circuit connected to the ground terminal of the non-reciprocal circuit element (terminal connected to the ground in the conventional structure) and to connect the resonance circuit to the ground. . Of course, other circuit elements are also mounted on this circuit board, and are used, for example, as circuit boards for mobile phones.
【００２２】本発明に係る非可逆回路素子は、上記実施
例に記載されたものに限られないことは明らかである。
本発明に係る非可逆回路素子は、特に広帯域化を考慮し
たものでなくても良く、通常品を使用出来る。また、本
発明に係る非可逆回路素子は、単峰特性のものが利用出
来る。また、上記実施例は、アイソレータで説明した
が、サーキュレータでも同様の効果を得ることができ
る。サーキュレータとするには、抵抗に接続されている
端子を、他の入出力端と同様にすれば良い。It is clear that the non-reciprocal circuit device according to the present invention is not limited to those described in the above embodiments.
The non-reciprocal circuit device according to the present invention does not need to particularly consider a wide band, and a normal product can be used. The nonreciprocal circuit device according to the present invention may have a single-peak characteristic. In the above embodiment, the isolator has been described. However, a similar effect can be obtained with a circulator. To make it a circulator, the terminal connected to the resistor may be made the same as the other input / output terminals.
【００２３】本発明に係る非可逆回路素子は、磁性体
と、その磁性体に密接して配置された３つの中心導体
と、各中心導体に接続されるコンデンサ成分と、磁性体
に直流磁界を印加する永久磁石とを有する構成であるこ
とが好ましい。The non-reciprocal circuit device according to the present invention comprises a magnetic material, three central conductors arranged closely to the magnetic material, a capacitor component connected to each central conductor, and a DC magnetic field applied to the magnetic material. It is preferable to have a configuration having a permanent magnet to be applied.
【００２４】本発明によれば、非可逆回路素子の広帯域
化を達成することができる。しかも、非可逆回路素子は
従来構造と同様で良く、大型化することはなく、重量の
増大もない。このため、非可逆回路素子の小型化を阻害
することがない。本発明は、小型の非可逆回路素子にお
いて特に有効であり、７ｍｍ角以下の大きさの非可逆回
路素子において、特に有効である。また、薄型化も阻害
するものではなく、薄型の非可逆回路素子において特に
有効であり、２．５ｍｍ以下の高さの非可逆回路素子に
おいて、特に有効である。さらに、２．０ｍｍ以下の高
さの非可逆回路素子において、特に有効である。According to the present invention, it is possible to achieve a wide band of the nonreciprocal circuit device. In addition, the non-reciprocal circuit element may have the same structure as the conventional structure, and does not increase in size or increase in weight. Therefore, the miniaturization of the non-reciprocal circuit device is not hindered. The present invention is particularly effective in a small non-reciprocal circuit device, and particularly effective in a non-reciprocal circuit device having a size of 7 mm square or less. Further, it does not hinder the reduction in thickness, and is particularly effective in a thin non-reciprocal circuit device, and is particularly effective in a non-reciprocal circuit device having a height of 2.5 mm or less. Further, it is particularly effective for a non-reciprocal circuit device having a height of 2.0 mm or less.
【００２５】本発明の配線基板は、プリント基板、フレ
キシブル基板、多層配線基板など種々の基板が利用出来
る。近年は、多層基板が多く使用されており、多層基板
であれば、スペース的にも従来と全く同じスペースで構
成出来る。また、多層基板の厚さは特に厚くする必要も
ない。As the wiring board of the present invention, various substrates such as a printed board, a flexible board, and a multilayer wiring board can be used. In recent years, a multi-layer substrate has been widely used, and a multi-layer substrate can be configured in exactly the same space as in the related art. Further, the thickness of the multilayer substrate does not need to be particularly large.
【００２６】[0026]
【発明の効果】本発明によれば、非可逆回路素子を新た
に設計し、構成する必要はなく、従来と同様の構成の非
可逆回路素子を用い、配線基板に共振回路を構成するこ
とにより、非可逆回路素子の広帯域化を可能とするもの
である。極めて簡便な構成により、広帯域化を可能とす
るものであり、携帯電話などの非可逆回路素子を使用し
た通信機器などにおいて、極めて有益なものである。According to the present invention, it is not necessary to newly design and construct a non-reciprocal circuit device, and it is possible to use a non-reciprocal circuit device having the same configuration as that of the related art and construct a resonance circuit on the wiring board. This enables the nonreciprocal circuit device to have a wider band. An extremely simple configuration enables a wide band, and is extremely useful in communication equipment using a non-reciprocal circuit device such as a mobile phone.
【図１】本発明に係る一実施例の分解斜視図である。FIG. 1 is an exploded perspective view of an embodiment according to the present invention.
【図２】本発明に係る一実施例と従来例の挿入損失特性
である。FIG. 2 shows insertion loss characteristics of one embodiment according to the present invention and a conventional example.
【図３】本発明に係る別の実施例の分解斜視図である。FIG. 3 is an exploded perspective view of another embodiment according to the present invention.
【図４】本発明に係る別の実施例の回路基板の内部構造
図である。FIG. 4 is an internal structural view of a circuit board according to another embodiment of the present invention.
【図５】従来の非可逆回路素子の等価回路図である。FIG. 5 is an equivalent circuit diagram of a conventional non-reciprocal circuit device.
【図６】非可逆回路素子の広帯域化回路の一例の等価回
路図である。FIG. 6 is an equivalent circuit diagram of an example of a broadband circuit of a non-reciprocal circuit device.
【図７】非可逆回路素子の広帯域化回路の別の例の等価
回路図である。FIG. 7 is an equivalent circuit diagram of another example of the broadband circuit of the non-reciprocal circuit device.
【図８】従来の非可逆回路素子の分解斜視図である。FIG. 8 is an exploded perspective view of a conventional non-reciprocal circuit device.
３１ 回路基板 ３２、３３、３７、３８ パターン電極 ３４ ストリップラインインダクタ ３５、４３ アースパターン ３６ 積層チップコンデンサ ３９ スルーホール ４２ インダクタライン DESCRIPTION OF SYMBOLS 31 Circuit board 32, 33, 37, 38 Pattern electrode 34 Stripline inductor 35, 43 Ground pattern 36 Multilayer chip capacitor 39 Through hole 42 Inductor line
Claims (5)
実装される回路基板に共振回路が形成されており、前記
非可逆回路素子のアース端子は、前記共振回路を経由し
てアースに接続されることを特徴とする非可逆回路素子
の広帯域化構造。1. A resonance circuit is formed on a circuit board on which a non-reciprocal circuit element and other circuit elements are mounted, and a ground terminal of the non-reciprocal circuit element is connected to ground via the resonance circuit. A broadband structure of a non-reciprocal circuit device.
定数型非可逆回路素子であることを特徴とする請求項１
記載の非可逆回路素子の広帯域化構造。2. The non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is a lumped constant type non-reciprocal circuit device having a single peak characteristic.
A broadband structure of the non-reciprocal circuit device according to the above.
ダクタと積層チップコンデンサから構成されている直列
共振回路であることを特徴とする請求項１記載の非可逆
回路素子の広帯域化構造。3. The non-reciprocal circuit device according to claim 1, wherein the resonance circuit is a series resonance circuit including a strip line inductor and a multilayer chip capacitor.
記共振回路は、前記多層配線基板の多層構造により形成
されたＬＣ共振回路であることを特徴とする請求項１記
載の非可逆回路素子の広帯域化構造。4. The non-reciprocal circuit device according to claim 1, wherein the circuit board is a multilayer wiring board, and the resonance circuit is an LC resonance circuit formed by a multilayer structure of the multilayer wiring board. Broadband structure.
小型集中定数型非可逆回路素子であることを特徴とする
請求項１記載の非可逆回路素子の広帯域化構造。5. The broadband structure of a non-reciprocal circuit device according to claim 1, wherein the non-reciprocal circuit device is a small lumped constant type non-reciprocal circuit device of 7 mm square or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10039882A JPH11239009A (en) | 1998-02-23 | 1998-02-23 | Band widening structure of irreversible circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10039882A JPH11239009A (en) | 1998-02-23 | 1998-02-23 | Band widening structure of irreversible circuit element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11239009A true JPH11239009A (en) | 1999-08-31 |
Family
ID=12565360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10039882A Pending JPH11239009A (en) | 1998-02-23 | 1998-02-23 | Band widening structure of irreversible circuit element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11239009A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2358291A (en) * | 1999-12-09 | 2001-07-18 | Murata Manufacturing Co | Nonreciprocal circuit device and communication device |
| GB2369501A (en) * | 2000-06-30 | 2002-05-29 | Murata Manufacturing Co | Nonreciprocal circuit device and mounting structure |
| US6657511B2 (en) * | 2000-05-17 | 2003-12-02 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication apparatus including the same |
| US6861922B2 (en) | 2000-03-02 | 2005-03-01 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device including two series resonant circuits having differing resonant frequencies |
| US7057471B2 (en) | 2003-11-28 | 2006-06-06 | Tdk Corporation | Non-reciprocal device |
| JP2008085981A (en) * | 2006-08-31 | 2008-04-10 | Ntt Docomo Inc | Irreversible circuit element |
| CN114865256A (en) * | 2022-07-11 | 2022-08-05 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | Ultra-wideband lumped parameter circulator/isolator with multi-layer dielectric strip line structure |
-
1998
- 1998-02-23 JP JP10039882A patent/JPH11239009A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2358291A (en) * | 1999-12-09 | 2001-07-18 | Murata Manufacturing Co | Nonreciprocal circuit device and communication device |
| GB2358291B (en) * | 1999-12-09 | 2002-02-27 | Murata Manufacturing Co | Nonreciprocal circuit device and communication device using same |
| US6639485B2 (en) | 1999-12-09 | 2003-10-28 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication device using same |
| US6861922B2 (en) | 2000-03-02 | 2005-03-01 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device including two series resonant circuits having differing resonant frequencies |
| US6657511B2 (en) * | 2000-05-17 | 2003-12-02 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication apparatus including the same |
| GB2369501A (en) * | 2000-06-30 | 2002-05-29 | Murata Manufacturing Co | Nonreciprocal circuit device and mounting structure |
| GB2369501B (en) * | 2000-06-30 | 2002-11-20 | Murata Manufacturing Co | Nonreciprocal circuit device and mounting structure of the same |
| US6677537B2 (en) | 2000-06-30 | 2004-01-13 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and mounting structure of the same |
| US7057471B2 (en) | 2003-11-28 | 2006-06-06 | Tdk Corporation | Non-reciprocal device |
| JP2008085981A (en) * | 2006-08-31 | 2008-04-10 | Ntt Docomo Inc | Irreversible circuit element |
| CN114865256A (en) * | 2022-07-11 | 2022-08-05 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | Ultra-wideband lumped parameter circulator/isolator with multi-layer dielectric strip line structure |
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