JPH1123485A - Method and apparatus for inspecting substrate - Google Patents
Method and apparatus for inspecting substrateInfo
- Publication number
- JPH1123485A JPH1123485A JP18084597A JP18084597A JPH1123485A JP H1123485 A JPH1123485 A JP H1123485A JP 18084597 A JP18084597 A JP 18084597A JP 18084597 A JP18084597 A JP 18084597A JP H1123485 A JPH1123485 A JP H1123485A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light beam
- bright
- bright line
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板のは
んだ塗布状態等の検査装置に関する。[0001] 1. Field of the Invention [0002] The present invention relates to an apparatus for inspecting the state of solder application on a printed circuit board.
【０００２】[0002]
【従来の技術】現在、クリームはんだのプリント基板へ
の印刷精度が向上し、より細かなピッチでクリームはん
だが印刷されている。このクリームはんだの高さ、ひい
ては体積を正確に測定し制御すれば、プリント基板への
部品実装の歩留まりの向上が図れる。2. Description of the Related Art At present, printing accuracy of cream solder on a printed circuit board is improved, and cream solder is printed at a finer pitch. If the height and thus volume of the cream solder are accurately measured and controlled, the yield of component mounting on a printed circuit board can be improved.
【０００３】上記プリント基板のはんだの塗布状態の検
査法には光切断法がある。図３（ａ）〜（ｃ）により従
来の光切断法による基板検査の方法を説明する。As a method for inspecting the state of the solder applied to the printed circuit board, there is a light cutting method. 3 (a) to 3 (c), a conventional method of inspecting a substrate by a light cutting method will be described.
【０００４】通常、この光切断法は、レーザなどで作っ
た放射状の光を凸レンズ等で拡大し、レーザの放射面と
測定対象物の検査面に対しある角度をもって直接照射
し、光の照射方向に対し部品の高さによってできた輝線
の凹凸を２次元的に測定し高さを計算する。Generally, in this light cutting method, radial light generated by a laser or the like is magnified by a convex lens or the like, and is directly irradiated at a certain angle to a laser radiation surface and an inspection surface of an object to be measured. On the other hand, the unevenness of the bright line formed by the height of the part is measured two-dimensionally and the height is calculated.
【０００５】図３（ａ）において、図示しないレーザ光
源から放出されたレーザー光１０を、所定の方法で、細
く絞り扇状に開き、基板２０に載置されたはんだ３０に
照射する。In FIG. 3A, a laser beam 10 emitted from a laser light source (not shown) is thinly opened in a narrow fan shape by a predetermined method, and is irradiated on a solder 30 mounted on a substrate 20.
【０００６】すると、図３（ｂ）が示すように、はんだ
３０の高さの違いによるレーザー光１０の輝線の位置の
違いが生じる。このレーザー光１０の輝線の位置の違い
である輝線のシフトを上方からの光学センサー４０（例
えば、撮像管や、固体撮像素子である２次元ＣＣＤカメ
ラ、エリア型ＣＣＤカメラ、二次元センサー等）で撮像
し、この図形解析によってはんだ３０上の輝線と基板上
の輝線の差であるｘを測定する。Then, as shown in FIG. 3B, the difference in the position of the bright line of the laser beam 10 due to the difference in the height of the solder 30 occurs. The shift of the bright line, which is the difference in the position of the bright line of the laser beam 10, is detected by an optical sensor 40 (for example, an image pickup tube, a two-dimensional CCD camera that is a solid-state image sensor, an area CCD camera, a two-dimensional sensor, etc.) from above. An image is taken and x, which is the difference between the bright line on the solder 30 and the bright line on the substrate, is measured by this graphic analysis.
【０００７】次に、図３（ｃ）が示すように、レーザの
入射角度をθとすれば、求めるはんだ３０の高さｈは、
前記求めた測定結果ｘを用いて、 ｈ＝ｘ・ｔａｎθ…（１） で求めることができる。Next, as shown in FIG. 3C, if the incident angle of the laser is θ, the height h of the solder 30 to be obtained is:
Using the measurement result x obtained above, h = x · tan θ (1) can be obtained.
【０００８】そして、このはんだ３０の高さｈと、はん
だ３０の底面積とから、はんだ３０の体積が測定でき
る。The volume of the solder 30 can be measured from the height h of the solder 30 and the bottom area of the solder 30.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、上記従
来の光切断法では、輝点の大きさはレーザー光１０のビ
ームの太さに依るので、測定するクリームはんだの高さ
精度を上げるためには、ビーム径を絞る必要があり、レ
ンズによってビーム径を絞ると焦点深度が下がり測定対
象物の位置や高さによって分解能が変化してしまう欠点
があった。又、光学センサーを使って分解能を高めよう
とすると、大きな画素数を持ったエリア型ＣＣＤカメラ
等を使わなくてはならず、これは高価であるという問題
点があった。又、上記エリア型ＣＣＤカメラ等を使用し
た場合でも、例えば、一次元ライン型ＣＣＤカメラを使
用した時に比べ分解能には限界があった。However, in the above-mentioned conventional light cutting method, the size of the luminescent spot depends on the thickness of the beam of the laser beam 10. Therefore, in order to increase the height accuracy of the cream solder to be measured, In addition, it is necessary to reduce the beam diameter, and when the beam diameter is reduced by the lens, there is a disadvantage that the depth of focus is reduced and the resolution changes depending on the position and height of the measurement object. Further, in order to increase the resolution by using an optical sensor, it is necessary to use an area type CCD camera having a large number of pixels, which is expensive. Further, even when the area-type CCD camera or the like is used, there is a limit in resolution as compared with, for example, the case where a one-dimensional line-type CCD camera is used.
【００１０】さらに、測定対象物に、正面からある角度
をもって、レーザー光１０を入射させ、更に入射方向と
異なる方向から測定対象物の上面より輝線のシフトを測
定しなければならないので、レーザ光源と光学センサー
をある程度離して設置する必要があり、基板検査装置自
体が厚くなってしまうという問題点があった。Further, the laser beam 10 must be incident on the object at a certain angle from the front, and the shift of the bright line must be measured from the upper surface of the object from a direction different from the incident direction. It is necessary to install the optical sensors at a certain distance from each other, and there is a problem that the board inspection apparatus itself becomes thick.
【００１１】そこで、本発明は安価な手段を用いて基板
上の測定対象物の寸法を分解能を上げて測定し、且つ、
基板検査装置自体をコンパクトにすることを目的とす
る。Therefore, the present invention measures the size of the object to be measured on the substrate by increasing the resolution using inexpensive means, and
An object of the present invention is to make a board inspection apparatus itself compact.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するため
に本願発明の請求項１に係る基板検査方法は、平面状の
広がりを持つ光束を、測定対象物上の輝線部分をも含め
て基板上で輝線が直線上に配されるよう前記基板に対し
て斜め上方より投射する光照射過程と、前記直線上の輝
線に沿って前記基板の上方から前記輝線の状態を撮影す
る撮像過程と、この撮像した輝線の状態を解析して前記
測定対象物の寸法を算出する画像解析過程と、を有する
ことを特徴とするものである。According to a first aspect of the present invention, there is provided a method for inspecting a substrate, comprising the steps of: applying a light beam having a planar spread to a substrate including a bright line portion on an object to be measured; A light irradiation step of projecting the substrate from obliquely above the substrate so that the bright lines are arranged on a straight line, and an imaging step of photographing the state of the bright line from above the substrate along the bright line on the straight line, Analyzing the state of the captured bright line to calculate the dimensions of the object to be measured.
【００１３】また、本願発明の請求項２に係る基板検査
方法は、請求項１記載の構成にあって、前記撮像過程
は、一次元センサを用いて前記直線上の輝線に沿って前
記基板の上方から前記輝線の状態を撮影することを特徴
とするものである。According to a second aspect of the present invention, in the substrate inspection method according to the first aspect of the present invention, the imaging step includes the step of using the one-dimensional sensor to scan the substrate along the bright line on the straight line. The state of the bright line is photographed from above.
【００１４】また、本願発明の請求項３に係る基板検査
方法は、請求項１〜２のいずれか１項記載の構成にあっ
て、前記画像解析過程は、輝線の切れ目の間隔を算出
し、前記基板に対する光照射角度を用いて前記測定対象
物の高さを算出することを特徴とするものである。According to a third aspect of the present invention, there is provided a substrate inspection method according to any one of the first to second aspects, wherein the image analysis step calculates a gap between bright lines. The height of the measurement object is calculated using a light irradiation angle with respect to the substrate.
【００１５】また、請求項４に係る発明の基板検査方法
は請求項１〜３のいずれか１項記載の構成にあって、前
記光照射過程は、光束を発し、この発せられた光束を拡
大し、この拡大した光束を平面状の広がりを持つ光束に
する、ことを特徴とするものである。According to a fourth aspect of the present invention, in the substrate inspection method according to any one of the first to third aspects, the light irradiation step emits a light beam, and the emitted light beam is enlarged. The expanded light beam is converted into a light beam having a planar spread.
【００１６】また、請求項５に係る発明の基板検査装置
は請求項１〜４のいずれか１項記載の構成にあって、前
記平面状の広がりを持つ光束の位相を変化させることを
特徴とするものである。According to a fifth aspect of the present invention, there is provided the substrate inspection apparatus according to any one of the first to fourth aspects, wherein the phase of the light beam having the planar spread is changed. Is what you do.
【００１７】また、本願発明の請求項６に係る基板検査
装置は、平面状の広がりを持つ光束を、測定対象物上の
輝線部分をも含めて基板上で輝線が直線上に配されるよ
う前記基板に対して斜め上方より投射する光照射手段
と、前記直線上の輝線に沿って前記基板の上方に配置さ
れ、前記輝線の状態を撮影する撮像手段と、この撮像手
段の撮った輝線の状態を解析して測定対象物の寸法を算
出する画像解析手段と、を備えたことを特徴とするもの
である。According to a sixth aspect of the present invention, there is provided the substrate inspection apparatus, wherein the luminous flux having a planar spread is arranged such that the bright lines are linearly arranged on the substrate including the bright line portion on the object to be measured. Light irradiating means for projecting the substrate obliquely from above, imaging means arranged above the substrate along the bright line on the straight line, and imaging the state of the bright line; Image analyzing means for analyzing the state and calculating the dimensions of the measurement object.
【００１８】また、請求項７に係る発明の基板検査方法
は請求項６記載の構成にあって、前記撮像手段は、一次
元センサであることを特徴とするものである。In a seventh aspect of the present invention, there is provided the board inspection method according to the sixth aspect, wherein the imaging means is a one-dimensional sensor.
【００１９】また、請求項８に係る発明の基板検査装置
は請求項６〜７のいずれか１項記載の構成にあって、前
記画像解析手段は、輝線の切れ目の間隔を算出し、前記
基板に対する光照射角度を用いて測定対象物の高さを算
出したことを特徴とするものである。According to an eighth aspect of the present invention, in the substrate inspection apparatus according to any one of the sixth to seventh aspects, the image analysis means calculates an interval between bright line breaks. The height of the object to be measured is calculated using the light irradiation angle with respect to.
【００２０】また、請求項９に係る発明の基板検査装置
は請求項６〜８のいずれか１項記載の構成にあって、前
記光照射手段は、光束を発する光源と、この発せられた
光束を拡大する手段と、この拡大した光束を平面状の広
がりを持つ光束にする手段と、を有することを特徴とす
るものである。A ninth aspect of the present invention is the substrate inspection apparatus according to any one of the sixth to eighth aspects, wherein the light irradiating means includes a light source that emits a light beam, and the emitted light beam. And means for converting the expanded light beam into a light beam having a planar spread.
【００２１】また、請求項１０に係る発明の基板検査装
置は請求項６〜９のいずれか１項記載の構成にあって、
前記平面状の広がりを持つ光束の位相を変化させる振動
手段を更に付加したことを特徴とするものである。According to a tenth aspect of the present invention, there is provided a substrate inspection apparatus according to any one of the sixth to ninth aspects.
Vibration means for changing the phase of the light beam having the planar spread is further added.
【００２２】従って、本願発明によれば、撮像手段は、
基板上に現れる直線上の輝線の状態を撮影出来ればよ
く、また、光照射手段は、基板の斜め上方より光束を投
射する構成であり、撮影手段は基板の輝線に沿って上方
位置に配置すれば良いため、光照射手段と撮影手段を離
して配置する必要は無い。Therefore, according to the present invention, the imaging means:
It suffices if the condition of the bright line on the straight line appearing on the substrate can be imaged, and the light irradiating means is configured to project the luminous flux from obliquely above the substrate, and the photographing means is arranged at an upper position along the bright line of the substrate. Therefore, it is not necessary to dispose the light irradiating means and the photographing means separately.
【００２３】また、請求項５又は請求項１０に係る発明
によれば、上記と同様な作用を有すると共に光束は振動
される為、位相が変化した光束が測定対象物に照射され
る。According to the fifth or tenth aspect of the present invention, since the light beam has the same function as described above and the light beam is vibrated, the light beam having a changed phase is irradiated on the object to be measured.
【００２４】[0024]
【発明の実施の形態】以下、本発明の実施形態例を図面
を用いて説明する。図１、図２（ａ）〜（ｃ）には、本
発明の一実施形態例が示されている。この実施形態例に
おいては測定対象物としてクリームはんだを対象とし
て、クリームはんだの高さ、体積を測定する場合を説明
する。Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2A to 2C show an embodiment of the present invention. In this embodiment, a case where the height and the volume of the cream solder are measured with the cream solder as the measurement object will be described.
【００２５】図１は、本実施形態例の基板検査装置の概
略斜視図である。図１において、本願発明の基板検査装
置は、基板６に印刷されたクリームはんだ５へ、図示し
ない光照射手段を用いて平面状の広がりを持つ光束を照
射し、撮像手段である一次元センサ４が、クリームはん
だ５の高さにより生じる輝線の切れ目を測定し、この測
定結果を用いて図示しない画像解析手段が、はんだ５の
寸法を算出する。FIG. 1 is a schematic perspective view of a substrate inspection apparatus according to this embodiment. In FIG. 1, the substrate inspection apparatus of the present invention irradiates a cream flux 5 printed on a substrate 6 with a light beam having a planar spread using a light irradiating means (not shown), and a one-dimensional sensor 4 serving as an imaging means. However, the break of the bright line caused by the height of the cream solder 5 is measured, and the image analysis means (not shown) calculates the size of the solder 5 using the measurement result.
【００２６】図２（ａ）は、本実施形態例の基板検査装
置の概略側面図である。図２（ａ）において、光照射手
段は、レーザ光源１、シリンドリカルレンズ、平凸レン
ズ２、ミラー３と、から構成されており、平面状の広が
りを持つ光束を、はんだ５上の輝線部分をも含めて基板
６上で輝線が直線上に配されるよう前記基板６に対して
斜め上方より投射する。FIG. 2A is a schematic side view of the substrate inspection apparatus of the present embodiment. In FIG. 2A, the light irradiating means is composed of a laser light source 1, a cylindrical lens, a plano-convex lens 2, and a mirror 3. The light is projected obliquely onto the substrate 6 so that the bright lines are arranged on the substrate 6 in a straight line.
【００２７】レーザ光源１は、位相のそろった光束を発
するものであり、下記する一次元センサ４と同一直線上
に配置されており、この実施形態例の場合は、レーザを
はんだ５に間接的に照射する。The laser light source 1 emits a light beam having a uniform phase. The laser light source 1 is arranged on the same straight line as a one-dimensional sensor 4 described below. In this embodiment, a laser is indirectly applied to the solder 5. Irradiation.
【００２８】図示しないシリンドリカルレンズは、例え
ば、レーザ光源１の先端に格納されており、レーザ光源
１から発せられた光束を拡大する。平凸レンズ２は、拡
大された光束を平面状の広がりを持つ平行光束にする。
ミラー３は、平面状の広がりを持つ平行光束を、はんだ
５に、ある一定の入射角度θをもって照射する。A cylindrical lens (not shown) is stored, for example, at the tip of the laser light source 1 and expands a light beam emitted from the laser light source 1. The plano-convex lens 2 converts the expanded light beam into a parallel light beam having a planar spread.
The mirror 3 irradiates the solder 5 with a parallel light beam having a planar spread at a certain incident angle θ.
【００２９】撮像手段である一次元センサ４は、センサ
ーが一次元に並んだ一次元のラインセンサー型ＣＣＤで
あり、前記直線上の輝線に沿って前記基板６上に配置さ
れている。そして、図２（ｂ）に示すような直線状に並
んだ輝線ａの状態を撮像する。The one-dimensional sensor 4 serving as an image pickup means is a one-dimensional line sensor type CCD in which the sensors are arranged one-dimensionally, and is arranged on the substrate 6 along the linear bright line. Then, the state of the bright line a arranged in a straight line as shown in FIG.
【００３０】図示しない画像解析手段は、上記撮像した
輝線の状態を画像形成し、図２（ｂ）に示す直線状に並
んだ輝線ａの切れ目ｂの長さｘを読み取る。そして、平
行光束の入射角度をθ、はんだ５の高さをｈとすれば、 ｈ＝ｘ・ｔａｎθ ではんだ５の高さをｈ求め、更にこの測定結果と、予め
分かっているはんだ３０の面積から体積を演算する。An image analysis means (not shown) forms an image of the state of the captured bright line, and reads the length x of the cut line b of the bright line a arranged in a straight line as shown in FIG. 2B. Then, assuming that the incident angle of the parallel light beam is θ and the height of the solder 5 is h, the height of the solder 5 is obtained by h = x · tan θ, and the measurement result and the area of the solder 30 which are known in advance are obtained. Calculate volume from.
【００３１】ここで、上記平凸レンズ２で入射する光を
平行光束にする理由を説明する。入射する光が平行光束
でないと、対象物の位置によって分解能が変わってしま
うと共に、平行光束にすることで光のビームに対する条
件が緩和され、光ビームを測定対象範囲より太くできる
という利点も発生するからである。Here, the reason why the light incident on the plano-convex lens 2 is converted into a parallel light beam will be described. If the incident light is not a parallel light beam, the resolution will vary depending on the position of the object, and the parallel light beam will ease the conditions for the light beam, thereby providing the advantage that the light beam can be made wider than the measurement target range. Because.
【００３２】上記構成において、レーザ光源１から発光
された光束は、シリンドリカルレンズにて拡大され、こ
の拡大された光束は平凸レンズ２により面上且つ平行光
束にされる。この面上且つ平行光束にされた光束は、ミ
ラー３によって反射され、はんだ５に、ある一定の角度
θをもって照射され、図２（ｂ）に示すように輝線ａが
直線状に並ぶと共に、はんだ５の高さにより生じる輝線
の切れ目ｂが表れる。In the above configuration, the light beam emitted from the laser light source 1 is expanded by a cylindrical lens, and the expanded light beam is converted into a plane and parallel light beam by the plano-convex lens 2. The luminous flux converted into a parallel luminous flux on this surface is reflected by the mirror 3 and irradiates the solder 5 at a certain angle θ, and the bright lines a are arranged in a straight line as shown in FIG. A break b in the bright line caused by the height of 5 appears.
【００３３】そして、直線状に並んだ輝線ａの状態を一
次元センサ４によって撮像し、画像解析手段が、撮像し
た輝線の状態を画像形成し、はんだ５の高さをｈ求め、
更にこの測定結果と、予め分かっているはんだ５の面積
から体積を演算する。Then, the state of the bright lines a arranged in a straight line is imaged by the one-dimensional sensor 4, and the image analyzing means forms an image of the state of the bright lines thus captured, and obtains the height h of the solder 5.
Further, the volume is calculated from the measurement result and the area of the solder 5 known in advance.
【００３４】従って、本願発明によれば、撮像手段は、
基板６上に現れる直線上の輝線ａの状態を撮影出来れば
よいので、一次元センサで足りる。Therefore, according to the present invention, the imaging means:
It is only necessary to be able to image the state of the bright line a on the straight line appearing on the substrate 6, so a one-dimensional sensor is sufficient.
【００３５】また、光照射手段は、基板６の斜め上方よ
り光束を投射する構成であり、一次元センサ４は基板６
の輝線に沿って上方位置に配置すれば良いため、光照射
手段と一次元センサ４は離して配置しなくて済み、装置
のコンパクト化に供する。The light irradiating means projects a light beam from obliquely above the substrate 6.
The light irradiation means and the one-dimensional sensor 4 do not need to be separated from each other, so that the apparatus can be made compact.
【００３６】次に、本実施形態例の変形例を説明する。
この実施形態例では、レーザの可干渉性特有の粗面から
のスペックルノイズをさけるため、図示しない振動装置
を付加する。例えば、振動装置としては、前記ミラー３
に圧電ブザーを取り付け、所定の振動数で振動させる。Next, a modification of this embodiment will be described.
In this embodiment, a vibration device (not shown) is added in order to avoid speckle noise from a rough surface peculiar to the coherence of the laser. For example, as the vibration device, the mirror 3
A piezoelectric buzzer is attached to the device and vibrated at a predetermined frequency.
【００３７】従って、はんだ５に入射される光束の位相
はバラバラとなるためスペックルノイズを避けることが
できると共に、時間的平均化、空間的平均化が行われ、
使用する光学部品、ミラー等の面精度の条件が緩和さ
れ、安価な素子の使用が可能になり、経済効果が更に図
られる。Therefore, the phase of the light beam incident on the solder 5 varies, so that speckle noise can be avoided, and time averaging and spatial averaging are performed.
The conditions of the surface accuracy of the optical components and mirrors to be used are relaxed, so that inexpensive elements can be used, and the economic effect is further improved.
【００３８】尚、上記実施形態例は、ミラー３を使用し
光を折り曲げてはんだ５に光束を入射したが、ミラー３
を介さずにはんだ５に平面上の広がりを持つ光束を直接
照射してもよい。In the above embodiment, the light is bent by using the mirror 3 and the light flux is incident on the solder 5.
Alternatively, the solder 5 may be directly irradiated with a light beam having a spread on a plane without passing through.
【００３９】又、上記実施形態例は、はんだ５の面積は
予め分かっているとしたが、例えば、基板６を移動し
て、面として表れた一次元センサの測定結果からはんだ
５の面積を求めるようにしてもい。In the above embodiment, the area of the solder 5 is known in advance. For example, the area of the solder 5 is obtained from the measurement result of the one-dimensional sensor expressed as a surface by moving the substrate 6. You can do it.
【００４０】又、はんだ５とはんだ５のピッチに応じて
入射する光束の入射角度を変えるようにしてもよい。Further, the incident angle of the incident light beam may be changed according to the pitch between the solders 5.
【００４１】又、上記実施形態例ではプリント基板に塗
布されたはんだの高さを測定したが、これ以外にも、高
さの必要な基板、例えば、太陽電池のパターンの高さ、
ハイビジョンの格子状にできているガラスの隔壁の高さ
にも本発明を適用できる。In the above embodiment, the height of the solder applied to the printed circuit board was measured. However, other than this, the height of the board required for the height, for example, the height of the pattern of the solar cell,
The present invention can also be applied to the height of a glass partition wall formed in a high-definition lattice.
【００４２】[0042]
【発明の効果】以上説明したように、本発明によれば、
撮像手段は、基板上に現れる直線上の輝線の状態を撮影
出来ればよいので、例えば、一次元センサで足りる。
又、光照射手段は、基板の斜め上方より光束を投射する
構成であり、撮影手段は基板の輝線に沿って上方位置に
配置すれば良いため、光照射手段と撮影手段を離して配
置する必要は無くて済み装置のコンパクト化に供する。As described above, according to the present invention,
The imaging means only needs to be able to image the state of the bright line on the straight line appearing on the substrate. For example, a one-dimensional sensor is sufficient.
Further, the light irradiating means is configured to project a light beam from obliquely above the substrate, and the photographing means may be arranged at an upper position along the bright line of the substrate. No need to provide a compact device.
【００４３】また、本発明の請求項２又は請求項７に記
載の発明によれば、上記効果を有すると共に、一次元セ
ンサは、高い分解能でも安価であるので、測定精度を高
めると共に、経済効果が図れるという効果を奏する。According to the second or seventh aspect of the present invention, the one-dimensional sensor has the above-mentioned effects, and the one-dimensional sensor is inexpensive even at a high resolution. This has the effect of achieving
【００４４】また、本発明の請求項５又は請求項１０に
記載の発明に係る発明によれば、上記効果を有すると共
に、例えば、レーザの可干渉性特有の粗面からのスペッ
クルノイズをさけることができると共に、使用する光学
部品、ミラー等の面精度の条件が緩和され、安価な素子
の使用が可能であるという効果を奏する。Further, according to the invention according to claim 5 or claim 10 of the present invention, while having the above effects, for example, speckle noise from a rough surface peculiar to the coherence of a laser is prevented. In addition to this, the conditions of the surface accuracy of the optical components, mirrors, and the like to be used are relaxed, so that it is possible to use inexpensive elements.
【図１】基板検査装置の概略斜視図（実施形態例）FIG. 1 is a schematic perspective view of a board inspection apparatus (an embodiment).
【図２】（ａ）は基板検査装置の概略側面図（実施形態
例）、（ｂ）は上記基板検査装置を用いて光切断を行
い、はんだ部分を含めた基板の平面図（実施形態例）、
（ｃ）は上記基板検査装置を用いて光切断を行い、はん
だ部分を含めた基板の側面図（実施形態例）FIG. 2 (a) is a schematic side view of a substrate inspection apparatus (embodiment example), and FIG. 2 (b) is a plan view of a substrate including a solder portion by performing optical cutting using the substrate inspection apparatus (embodiment example). ),
(C) is a side view of the substrate including the solder portion by performing optical cutting using the above-described substrate inspection apparatus (embodiment example).
【図３】（ａ）は基板検査装置の概略斜視図（従来
例）、（ｂ）は上記基板検査装置を用いて光切断を行
い、はんだ部分を含めた基板の平面図（従来例）、
（ｃ）は上記基板検査装置を用いて光切断を行い、はん
だ部分を含めた基板の側面図（従来例）3A is a schematic perspective view of a board inspection apparatus (conventional example), FIG. 3B is a plan view of a board including a solder portion by performing optical cutting using the board inspection apparatus (conventional example),
(C) is a side view of a substrate including a solder portion, which is subjected to light cutting using the above-described substrate inspection apparatus (conventional example)
１…光源（光照射手段） ２…平凸レンズ（光照射手段） ３…ミラー（光照射手段） ４…一次元センサ（撮像手段） ５…はんだ（測定対象物） DESCRIPTION OF SYMBOLS 1 ... Light source (light irradiation means) 2 ... Plano-convex lens (light irradiation means) 3 ... Mirror (light irradiation means) 4 ... One-dimensional sensor (imaging means) 5 ... Solder (object to be measured)
Claims (10)
物上の輝線部分をも含めて基板上で輝線が直線上に配さ
れるよう前記基板に対して斜め上方より投射する光照射
過程と、 前記直線上の輝線に沿って前記基板の上方から前記輝線
の状態を撮影する撮像過程と、 この撮像した輝線の状態を解析して前記測定対象物の寸
法を算出する画像解析過程と、 を有することを特徴とする基板検査方法。1. A light irradiation process in which a light beam having a planar spread is projected obliquely upward onto a substrate, including a bright line portion on a measurement object, such that bright lines are arranged in a straight line on the substrate. An imaging step of capturing the state of the bright line from above the substrate along the bright line on the straight line; an image analyzing step of analyzing the state of the captured bright line to calculate a dimension of the measurement object; A substrate inspection method, comprising:
板の上方から前記輝線の状態を撮影することを特徴とす
る請求項１に記載の基板検査方法。2. The substrate inspection method according to claim 1, wherein in the imaging step, a state of the bright line is photographed from above the substrate along the bright line on the straight line using a one-dimensional sensor. .
角度を用いて前記測定対象物の高さを算出することを特
徴とする請求項１又は請求項２に記載の基板検査方法。3. The image analysis process according to claim 1, wherein an interval between the bright lines is calculated, and a height of the measurement object is calculated using a light irradiation angle with respect to the substrate. 3. The substrate inspection method according to 2.
基板検査方法。4. The light irradiation process according to claim 1, wherein the light irradiating step emits a light beam, expands the emitted light beam, and converts the expanded light beam into a light beam having a planar spread. The substrate inspection method according to claim 1.
変化させることを特徴とする請求項１〜４のいずれか１
項に記載の基板検査方法。5. The method according to claim 1, wherein the phase of the light beam having the planar spread is changed.
The substrate inspection method according to the above section.
物上の輝線部分をも含めて基板上で輝線が直線上に配さ
れるよう前記基板に対して斜め上方より投射する光照射
手段と、 前記直線上の輝線に沿って前記基板の上方に配置され、
前記輝線の状態を撮影する撮像手段と、 この撮像手段の撮った輝線の状態を解析して測定対象物
の寸法を算出する画像解析手段と、 を備えたことを特徴とする基板検査装置。6. A light irradiating means for projecting a light beam having a planar spread from an obliquely upward direction onto a substrate, including a bright line portion on an object to be measured, such that bright lines are arranged in a straight line on the substrate. And disposed above the substrate along the bright line on the straight line,
A board inspection apparatus, comprising: an imaging unit that captures the state of the bright line; and an image analysis unit that analyzes the state of the bright line captured by the imaging unit to calculate the dimension of the measurement target.
基板検査装置。7. The board inspection apparatus according to claim 6, wherein the imaging unit is a one-dimensional sensor.
角度を用いて測定対象物の高さを算出したことを特徴と
する請求項６又は請求項７に記載の基板検査装置。8. The image analysis means according to claim 6, wherein the distance between the breaks of the bright line is calculated, and the height of the object to be measured is calculated using the light irradiation angle with respect to the substrate. A substrate inspection apparatus according to item 1.
段と、 を有することを特徴とする請求項６〜８のいずれか１項
に記載の基板検査装置。9. The light irradiating means includes: a light source for emitting a light beam; a means for expanding the emitted light beam; and a means for converting the expanded light beam to a light beam having a planar spread. The substrate inspection apparatus according to any one of claims 6 to 8, wherein
を変化させる振動手段を更に付加したことを特徴とする
請求項６〜９のいずれか１項に記載の基板検査装置。10. The substrate inspection apparatus according to claim 6, further comprising a vibration unit for changing a phase of the light beam having the planar spread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18084597A JPH1123485A (en) | 1997-07-07 | 1997-07-07 | Method and apparatus for inspecting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18084597A JPH1123485A (en) | 1997-07-07 | 1997-07-07 | Method and apparatus for inspecting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1123485A true JPH1123485A (en) | 1999-01-29 |
Family
ID=16090371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18084597A Pending JPH1123485A (en) | 1997-07-07 | 1997-07-07 | Method and apparatus for inspecting substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1123485A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004226319A (en) * | 2003-01-24 | 2004-08-12 | Saki Corp:Kk | Visual inspection apparatus and image acquisition method |
| CN100449359C (en) * | 2006-02-06 | 2009-01-07 | 友达光电股份有限公司 | Method and apparatus for measuring angle of metal wire of liquid crystal display panel |
| GB2487620A (en) * | 2010-11-18 | 2012-08-01 | Twenty Twenty Vision Ltd | Apparatus and method for testing PCB-mounted integrated circuits |
| EP3939591A1 (en) | 2016-06-27 | 2022-01-19 | Achillion Pharmaceuticals, Inc. | Quinazoline and indole compounds to treat medical disorders |
-
1997
- 1997-07-07 JP JP18084597A patent/JPH1123485A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004226319A (en) * | 2003-01-24 | 2004-08-12 | Saki Corp:Kk | Visual inspection apparatus and image acquisition method |
| CN100449359C (en) * | 2006-02-06 | 2009-01-07 | 友达光电股份有限公司 | Method and apparatus for measuring angle of metal wire of liquid crystal display panel |
| GB2487620A (en) * | 2010-11-18 | 2012-08-01 | Twenty Twenty Vision Ltd | Apparatus and method for testing PCB-mounted integrated circuits |
| US20140043033A1 (en) * | 2010-11-18 | 2014-02-13 | Twenty Twenty Vision Limited | Apparatus and method for inspecting pcb-mounted integrated circuits |
| GB2487620B (en) * | 2010-11-18 | 2016-03-02 | Twenty Twenty Vision Ltd | Apparatus and method for inspecting pcb-mounted integrated circuits |
| US10107853B2 (en) * | 2010-11-18 | 2018-10-23 | Twenty Twenty Vision Limited | Apparatus and method for inspecting PCB-mounted integrated circuits |
| EP3939591A1 (en) | 2016-06-27 | 2022-01-19 | Achillion Pharmaceuticals, Inc. | Quinazoline and indole compounds to treat medical disorders |
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