JPH11233314A - Variable resistor and manufacture thereof - Google Patents
Variable resistor and manufacture thereofInfo
- Publication number
- JPH11233314A JPH11233314A JP10026948A JP2694898A JPH11233314A JP H11233314 A JPH11233314 A JP H11233314A JP 10026948 A JP10026948 A JP 10026948A JP 2694898 A JP2694898 A JP 2694898A JP H11233314 A JPH11233314 A JP H11233314A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electrode
- forming
- resistor
- driver plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、一般電子機器に用
いられる可変抵抗器およびその製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable resistor used for general electronic equipment and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来のこの種の可変抵抗器としては、実
願昭４９−１９６７３６号（実開昭５１−１１４８０５
号）のマイクロフィルムに開示されたものが知られてい
る。2. Description of the Related Art A conventional variable resistor of this type is disclosed in Japanese Utility Model Application No. 49-196736 (Japanese Utility Model Application Laid-Open No. 51-114805).
) Is known.
【０００３】以下に、従来の可変抵抗器について、図面
を参照しながら説明する。図７は従来の可変抵抗器の側
断面図、図８は同上面図である。A conventional variable resistor will be described below with reference to the drawings. FIG. 7 is a side sectional view of a conventional variable resistor, and FIG. 8 is a top view of the same.
【０００４】図７、図８において、１はセラミック等の
絶縁材料からなる絶縁基板で、略中央に中空孔２を有し
ている。そしてこの絶縁基板１の表面には、絶縁基板１
の中空孔２との間に隙間部３を介して略円弧状の抵抗体
４を印刷により形成している。５は金属製のドライバー
プレートで、このドライバープレート５は前記絶縁基板
１の中空孔２に向かって突出する貫通孔６を設けた突出
部７を有するとともに、この突出部７の側方に前記絶縁
基板１の抵抗体４上を摺動する摺動子８を設け、さらに
上面に前記絶縁基板１と平行な切欠き９を設けている。
そして前記ドライバープレート５の突出部７の先端は前
記絶縁基板１の抵抗体４を設けた面と同一面上で当接し
ている。１０は金属製の中端子で、この中端子１０は前
記絶縁基板１の中空孔２とドライバープレート５の突出
部７に設けた貫通孔６とに挿通されてドライバープレー
ト５を回転可能に枢着する円筒部１１を一端に有すると
ともに、他端に前記絶縁基板１の底面の略中央から外方
へ向かって延出する延出部１２を設けている。１３は金
属の電極で、この電極１３は前記絶縁基板１の表面で抵
抗体４と電気的に接続されるとともに、絶縁基板１の表
面から側面にわたって設けられている。[0004] In FIGS. 7 and 8, reference numeral 1 denotes an insulating substrate made of an insulating material such as ceramic, and has a hollow hole 2 substantially at the center. On the surface of the insulating substrate 1, the insulating substrate 1
A substantially arc-shaped resistor 4 is formed by printing with a gap 3 between itself and the hollow hole 2. Reference numeral 5 denotes a metal driver plate. The driver plate 5 has a projecting portion 7 having a through hole 6 projecting toward the hollow hole 2 of the insulating substrate 1. A slider 8 that slides on the resistor 4 of the substrate 1 is provided, and a notch 9 parallel to the insulating substrate 1 is provided on the upper surface.
The tip of the protrusion 7 of the driver plate 5 is in contact with the surface of the insulating substrate 1 on which the resistor 4 is provided. Reference numeral 10 denotes a metal middle terminal. The middle terminal 10 is inserted through the hollow hole 2 of the insulating substrate 1 and the through hole 6 provided in the projecting portion 7 of the driver plate 5 so that the driver plate 5 is rotatably pivoted. A cylindrical portion 11 is provided at one end, and the other end is provided with an extending portion 12 extending outward from substantially the center of the bottom surface of the insulating substrate 1. Reference numeral 13 denotes a metal electrode. The electrode 13 is electrically connected to the resistor 4 on the surface of the insulating substrate 1 and is provided from the surface to the side surface of the insulating substrate 1.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記従
来の可変抵抗器においては、ドライバープレート５の突
出部７における絶縁基板１と接する面が絶縁基板１の抵
抗体４を設けた面と同一面上にあるため、抵抗体４と中
空孔２との間の隙間部３を大きく設定しないと、ドライ
バープレート５の突出部７と抵抗体４との間の電気的な
絶縁を適正に確保することができなくなり、これが可変
抵抗器自体の小型化を阻害してしまうという原因となっ
ていた。However, in the above-described conventional variable resistor, the surface of the projecting portion 7 of the driver plate 5 in contact with the insulating substrate 1 is flush with the surface of the insulating substrate 1 on which the resistor 4 is provided. Therefore, if the gap 3 between the resistor 4 and the hollow hole 2 is not set large, it is possible to properly secure electrical insulation between the protrusion 7 of the driver plate 5 and the resistor 4. This makes it impossible to reduce the size of the variable resistor itself.
【０００６】本発明は上記従来の課題を解決するもの
で、可変抵抗器自体の大型化を招くことなく、ドライバ
ープレートの突出部と抵抗体との間の電気的な絶縁を確
保することができる可変抵抗器およびその製造方法を提
供することを目的とするものである。The present invention solves the above-mentioned conventional problems, and can secure electrical insulation between the projecting portion of the driver plate and the resistor without increasing the size of the variable resistor itself. It is an object of the present invention to provide a variable resistor and a method for manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明の可変抵抗器は、表面に段差部を有しかつこの
段差部に中空孔を有するとともに、この段差部の外周と
略同径の内周を有する抵抗体を表面に設けた絶縁基板
と、この絶縁基板の段差部に向かって突出し、かつ貫通
孔を有する突出部を設けるとともに前記絶縁基板の表面
の抵抗体上を摺動する摺動子を有し、さらに切欠きを設
けたドライバープレートと、前記絶縁基板の裏面から前
記絶縁基板の中空孔と前記ドライバープレートの突出部
の貫通孔とに挿通されて前記ドライバープレートを枢着
する円筒部を一端に設けるとともに他端に前記絶縁基板
の底側の略中央から外方へ向かって延出する延出部を設
けた中端子と、前記絶縁基板の表面で前記抵抗体と電気
的に接続されるとともに前記絶縁基板の表面から側面に
わたって設けられた電極とを備えたもので、この構成に
よれば、可変抵抗器自体の大型化を招くことなく、ドラ
イバープレートの突出部と抵抗体との間の電気的な絶縁
を確保することができるものである。In order to achieve the above object, a variable resistor according to the present invention has a step on its surface, has a hollow hole in this step, and has substantially the same outer periphery as the step. An insulating substrate provided on the surface with a resistor having an inner periphery having a diameter, and a protruding portion projecting toward a step portion of the insulating substrate and having a through hole, and sliding on the resistor on the surface of the insulating substrate. A driver plate having a notch and a notch, and a driver plate inserted through a hollow hole of the insulating substrate and a through hole of a projecting portion of the driver plate from the back surface of the insulating substrate to pivot the driver plate. A middle terminal provided with a cylindrical portion to be attached at one end and an extension portion extending outward from a substantially center on the bottom side of the insulating substrate at the other end, and the resistor on the surface of the insulating substrate; When it is electrically connected And an electrode provided from the surface to the side surface of the insulating substrate. According to this configuration, the size of the variable resistor itself can be increased without causing an increase in the size of the variable resistor itself between the projecting portion of the driver plate and the resistor. Electrical insulation can be ensured.
【０００８】[0008]
【発明の実施の形態】本発明の請求項１に記載の発明
は、表面に段差部を有しかつこの段差部に中空孔を有す
るとともに、この段差部の外周と略同径の内周を有する
抵抗体を表面に設けた絶縁基板と、この絶縁基板の段差
部に向かって突出し、かつ貫通孔を有する突出部を設け
るとともに前記絶縁基板の表面の抵抗体上を摺動する摺
動子を有し、さらに切欠きを設けたドライバープレート
と、前記絶縁基板の裏面から前記絶縁基板の中空孔と前
記ドライバープレートの突出部の貫通孔とに挿通されて
前記ドライバープレートを枢着する円筒部を一端に設け
るとともに他端に前記絶縁基板の底側の略中央から外方
へ向かって延出する延出部を設けた中端子と、前記絶縁
基板の表面で前記抵抗体と電気的に接続されるとともに
前記絶縁基板の表面から側面にわたって設けられた電極
とを備えたもので、この構成によれば、絶縁基板の表面
に段差部を設けているため、この段差部により確実にド
ライバープレートの突出部と抵抗体との電気的な絶縁を
確保することができ、その結果として抵抗体の内周を段
差部の外周と略同径にできるため、可変抵抗器の大きさ
を小さくすることができるという作用を有するものであ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has a step on the surface and a hollow hole in the step, and has an inner periphery having substantially the same diameter as the outer periphery of the step. An insulating substrate having a resistor provided on the surface thereof, and a slider protruding toward a step portion of the insulating substrate and having a projection having a through hole and sliding on the resistor on the surface of the insulating substrate. A driver plate further provided with a notch, and a cylindrical portion that is inserted from the back surface of the insulating substrate into a hollow hole of the insulating substrate and a through hole of a protrusion of the driver plate to pivotally mount the driver plate. A middle terminal provided at one end and provided at the other end with an extending portion extending outward from substantially the center of the bottom side of the insulating substrate, and electrically connected to the resistor at the surface of the insulating substrate; And the surface of the insulating substrate According to this configuration, since a step is provided on the surface of the insulating substrate, the step allows the electric connection between the protrusion of the driver plate and the resistor. Insulation can be ensured, and as a result, the inner circumference of the resistor can be made to have substantially the same diameter as the outer circumference of the step, so that the size of the variable resistor can be reduced. .
【０００９】請求項２に記載の発明は、個片の絶縁基板
の略中央に中空孔を有する段差部を設けるとともにこの
個片の絶縁基板の一側面に設けられた電極用突起が外向
きとなるように二列に並べてなる二列絶縁基板の複数枚
を前記電極用突起の箇所において一体的に連結するよう
にして多数個取り絶縁基板を形成する工程と、前記多数
個取り絶縁基板の電極用突起の表面に表面電極を形成す
るかまたは前記電極用突起の裏面に裏面電極を形成する
工程と、前記表面電極あるいは裏面電極を形成した多数
個取り絶縁基板の電極用突起の裏面に裏面電極を形成す
るかまたは前記電極用突起の表面に表面電極を形成する
工程と、前記多数個取り絶縁基板の表面に前記段差部の
外周と略同径の内周を有する抵抗体を前記表面電極と電
気的に接続されるように形成する工程と、前記表面電極
と前記裏面電極と前記抵抗体とを形成した多数個取り絶
縁基板を前記二列絶縁基板に分割する工程と、二列に分
割された前記二列絶縁基板の側面に前記表面電極と前記
裏面電極とに電気的に接続されるように側面電極を形成
する工程と、前記二列絶縁基板の抵抗体から段差部の内
側面にわたってメッキレジストを形成する工程と、前記
メッキレジストを形成した前記二列絶縁基板の表面電極
と裏面電極と側面電極とを覆うようにニッケルメッキを
形成した後にこのニッケルメッキを覆うように半田メッ
キを形成する工程と、前記半田メッキを形成した前記二
列絶縁基板の前記メッキレジストを除去する工程と、前
記メッキレジストを除去した二列絶縁基板を個片の絶縁
基板に分割する工程と、帯状のフープ材を打抜いて切欠
きを形成するとともにこの切欠きの間に位置して絞り加
工を施しながら打抜いて略中央に貫通孔を有する突出部
を形成する工程と、前記突出部の外周に摺動子を設けて
ドライバープレートを構成する工程と、個片の前記絶縁
基板の段差部に前記ドライバープレートの突出部を挿入
する工程と、前記絶縁基板の裏面から前記絶縁基板の中
空孔および前記ドライバープレートの貫通孔に前記中端
子の円筒部を挿入して枢着する工程とからなるもので、
この製造方法によれば、前記二列絶縁基板の抵抗体から
段差部の内側面にわたってメッキレジストを形成するよ
うにしているため、このメッキレジストにより段差部の
外周縁から外側に向かって設けられた抵抗体の内周側は
すべてにわたって覆われることになり、その結果として
容易に抵抗体の内周径を小さくすることができるという
作用を有するものである。According to a second aspect of the present invention, a stepped portion having a hollow hole is provided substantially at the center of the individual insulating substrate, and the electrode projection provided on one side surface of the individual insulating substrate is directed outward. Forming a multi-piece insulating substrate by integrally connecting a plurality of two-row insulating substrates arranged in two rows at the locations of the electrode projections; and forming electrodes on the multi-piece insulating substrate. Forming a front electrode on the surface of the projection for the electrode or forming a back electrode on the back of the projection for the electrode; and forming a back electrode on the back of the projection for the electrode of the multi-cavity insulating substrate on which the front electrode or the back electrode is formed. Or a step of forming a surface electrode on the surface of the electrode projections, and a resistor having an inner periphery having substantially the same diameter as the outer periphery of the step portion on the surface of the multi-cavity insulating substrate and the surface electrode. Electrically connected Forming, the step of dividing the multi-cavity insulating substrate on which the front surface electrode, the back surface electrode, and the resistor are formed into the two-row insulating substrate, and the step of dividing the two-row insulating substrate divided into two rows. A step of forming a side electrode so as to be electrically connected to the front surface electrode and the back electrode on the side surface, and a step of forming a plating resist from the resistor of the double-row insulating substrate to the inner surface of the step. Forming nickel plating so as to cover the front surface electrode, the back surface electrode, and the side surface electrode of the two-row insulating substrate on which the plating resist is formed, and then forming solder plating so as to cover the nickel plating; and Removing the plating resist from the formed two-row insulating substrate; dividing the two-row insulating substrate from which the plating resist has been removed into individual insulating substrates; Forming a notch by punching the material, forming a notch located between the notches, and punching while performing drawing, and forming a protrusion having a through hole substantially in the center; A step of providing a driver to form a driver plate; a step of inserting a projecting portion of the driver plate into a step portion of the individual insulating substrate; and a hollow hole of the insulating substrate and the driver from a back surface of the insulating substrate. Inserting the cylindrical portion of the middle terminal into the through-hole of the plate and pivotally connecting it,
According to this manufacturing method, since the plating resist is formed over the inner surface of the step from the resistor of the two-row insulating substrate, the plating resist is provided outward from the outer peripheral edge of the step. The inner peripheral side of the resistor is entirely covered, and as a result, the inner diameter of the resistor can be easily reduced.
【００１０】請求項３に記載の発明は、個片の絶縁基板
の略中央に中空孔を有する段差部を設けるとともにこの
個片の絶縁基板の一側面に設けられた電極用突起が外向
きとなるように二列に並べてなる二列絶縁基板の複数枚
を前記電極用突起の箇所において一体的に連結するよう
にして多数個取り絶縁基板を形成する工程と、前記多数
個取り絶縁基板の電極用突起の裏面に裏面電極を印刷す
る工程と、前記裏面電極を形成した多数個取り絶縁基板
の電極用突起の表面に表面電極を印刷する工程と、前記
多数個取り絶縁基板の表面に前記段差部の外周と同径の
内周を有する抵抗体を前記表面電極と電気的に接続され
るように印刷する工程と、前記表面電極と前記裏面電極
と前記抵抗体とを印刷した多数個取り絶縁基板を焼成す
る工程と、前記表面電極と前記裏面電極と前記抵抗体と
を形成した多数個取り絶縁基板を前記二列絶縁基板に分
割する工程と、二列に分割された前記二列絶縁基板の側
面に前記表面電極と前記裏面電極とに電気的に接続され
るように側面電極を形成する工程と、前記二列絶縁基板
の抵抗体から段差部の内側面にわたってメッキレジスト
を形成する工程と、前記メッキレジストを形成した前記
二列絶縁基板の表面電極と裏面電極と側面電極とを覆う
ようにニッケルメッキを形成した後にこのニッケルメッ
キを覆うように半田メッキを形成する工程と、前記半田
メッキを形成した前記二列絶縁基板の前記メッキレジス
トを除去する工程と、前記メッキレジストを除去した二
列絶縁基板を個片の絶縁基板に分割する工程と、帯状の
フープ材を打抜いて切欠きを形成するとともにこの切欠
きの間に位置して絞り加工を施しながら打抜いて略中央
に貫通孔を有する突出部を形成する工程と、前記突出部
の外周に摺動子を設けてドライバープレートを構成する
工程と、個片の前記絶縁基板の段差部に前記ドライバー
プレートの突出部を挿入する工程と、前記絶縁基板の裏
面から前記絶縁基板の中空孔および前記ドライバープレ
ートの貫通孔に中端子の円筒部を挿入して枢着する工程
とからなるもので、この製造方法によれば、前記表面電
極と前記裏面電極と前記抵抗体とを印刷した多数個取り
絶縁基板を一度に焼成するようにしているため、前記表
面電極と裏面電極と抵抗体を別々に焼成することが無く
なり、その結果として、可変抵抗器の製造時の焼成の回
数を削減できるという作用を有するものである。According to a third aspect of the present invention, a step having a hollow hole is provided substantially at the center of the individual insulating substrate, and the electrode projection provided on one side of the individual insulating substrate is directed outward. Forming a multi-piece insulating substrate by integrally connecting a plurality of two-row insulating substrates arranged in two rows at the locations of the electrode projections; and forming electrodes on the multi-piece insulating substrate. A step of printing a back electrode on the back surface of the multi-cavity insulating substrate, a step of printing a front electrode on the surface of the electrode protrusion of the multi-cavity insulating substrate on which the back electrode is formed, and a step on the surface of the multi-cavity insulating substrate. A step of printing a resistor having an inner periphery having the same diameter as the outer periphery of the portion so as to be electrically connected to the front surface electrode, and a multi-cavity insulation printed on the front electrode, the back surface electrode, and the resistor. Baking the substrate; A step of dividing the multi-cavity insulating substrate on which the electrode, the back electrode, and the resistor are formed into the two-row insulating substrate; and the front electrode and the back surface on the side surface of the two-row insulating substrate divided into two rows. Forming a side electrode so as to be electrically connected to the electrode; forming a plating resist from the resistor of the double-row insulating substrate to the inner surface of the stepped portion; A step of forming a nickel plating so as to cover the front surface electrode, the back surface electrode, and the side surface electrode of the column insulating substrate, and then forming a solder plating so as to cover the nickel plating; and A step of removing the plating resist, a step of dividing the two-row insulating substrate from which the plating resist is removed into individual insulating substrates, and a step of punching a band-shaped hoop material to form a notch. A step of forming a projection having a through hole substantially in the center by performing punching while performing drawing while being located between the notches, and forming a driver plate by providing a slider on the outer periphery of the projection. A step of inserting the projecting portion of the driver plate into a step portion of the individual insulating substrate, and a cylindrical portion of the middle terminal from a back surface of the insulating substrate to a hollow hole of the insulating substrate and a through hole of the driver plate. According to this manufacturing method, a multi-cavity insulating substrate on which the front electrode, the back electrode, and the resistor are printed is fired at a time. Therefore, the front electrode, the back electrode, and the resistor are not separately fired, and as a result, the number of firings at the time of manufacturing the variable resistor can be reduced.
【００１１】以下、本発明の一実施の形態における可変
抵抗器について、図面を参照しながら説明する。Hereinafter, a variable resistor according to an embodiment of the present invention will be described with reference to the drawings.
【００１２】図１は本発明の一実施の形態における可変
抵抗器の分解斜視図、図２は同側断面図である。FIG. 1 is an exploded perspective view of a variable resistor according to an embodiment of the present invention, and FIG. 2 is a sectional side view of the same.
【００１３】図１、図２において、２１はセラミック等
の絶縁材料からなる直方体形状の絶縁基板で、この絶縁
基板２１は表面に段差部２２を有し、かつこの段差部２
２の略中央には中空孔２３を設け、さらに絶縁基板２１
の一側面には２つの電極用突起２４が設けられている。
またこの絶縁基板２１の表面には段差部２２の外周と略
同径の内周を有する抵抗体２５が設けられている。２６
は一枚の板からなるドライバープレートで、このドライ
バープレート２６は連結部２７で折り曲げられ、そして
下部には絶縁基板２１の段差部２２に向かって突出し、
かつ貫通孔２８を有する突出部２９を設けるとともに、
この突出部２９の外側には絶縁基板２１の抵抗体２５上
を摺動する摺動子３０が設けられている。そして前記絶
縁基板２１の表面には段差部２２を設けているため、こ
の段差部２２により確実にドライバープレート２６の突
出部２９と抵抗体２５との電気的な絶縁を確保すること
ができ、その結果として抵抗体２５の内周を段差部２２
の外周と略同径にできるため、可変抵抗器の大きさを小
さくすることができるものである。In FIGS. 1 and 2, reference numeral 21 denotes a rectangular parallelepiped insulating substrate made of an insulating material such as ceramic. The insulating substrate 21 has a step 22 on its surface.
2, a hollow hole 23 is provided substantially at the center, and
On one side surface, two electrode projections 24 are provided.
Further, on the surface of the insulating substrate 21, a resistor 25 having an inner periphery having substantially the same diameter as the outer periphery of the step portion 22 is provided. 26
Is a driver plate composed of a single plate, the driver plate 26 is bent at a connecting portion 27, and protrudes downward from the step portion 22 of the insulating substrate 21,
And a projection 29 having a through hole 28 is provided;
A slider 30 that slides on the resistor 25 of the insulating substrate 21 is provided outside the protrusion 29. Since the stepped portion 22 is provided on the surface of the insulating substrate 21, the stepped portion 22 can reliably ensure electrical insulation between the protruding portion 29 of the driver plate 26 and the resistor 25, and As a result, the inner periphery of the resistor 25 is
Since the diameter of the variable resistor can be made substantially the same as the outer circumference of the variable resistor, the size of the variable resistor can be reduced.
【００１４】また前記ドライバープレート２６の上部に
は相手側ドライバー（図示せず）が挿入される十字形状
の切欠き３１が設けられている。３２は金属製の中端子
で、この中端子３２は前記絶縁基板２１の裏面から絶縁
基板２１の中空孔２３とドライバープレート２６の貫通
孔２８とに挿通されてドライバープレート２６を回転可
能に枢着する円筒部３３を一端に有するとともに、他端
に前記絶縁基板２１の底面の略中央から外方へ向かって
延出する延出部３４を設けている。３５は銀で構成され
た電極で、この電極３５は絶縁基板２１の表面で抵抗体
２５と電気的に接続されるとともに、絶縁基板２１の電
極用突起２４の表面から側面にわたって設けられてい
る。そして前記絶縁基板２１には段差部２２が設けら
れ、この段差部２２でドライバープレート２６を前記中
端子３２の円筒部３３により回転可能に枢着しているた
め、段差部２２の高さ分だけ、可変抵抗器の高さを低く
することができるものである。A cross-shaped notch 31 into which a mating driver (not shown) is inserted is provided above the driver plate 26. Reference numeral 32 denotes a metal middle terminal. The middle terminal 32 is inserted from the back surface of the insulating substrate 21 into the hollow hole 23 of the insulating substrate 21 and the through hole 28 of the driver plate 26 so that the driver plate 26 is rotatably pivoted. A cylindrical portion 33 is provided at one end, and an extending portion 34 is provided at the other end, extending outward from substantially the center of the bottom surface of the insulating substrate 21. Reference numeral 35 denotes an electrode made of silver. The electrode 35 is electrically connected to the resistor 25 on the surface of the insulating substrate 21 and is provided from the surface to the side surface of the electrode projection 24 of the insulating substrate 21. The insulating substrate 21 is provided with a step 22, and the driver plate 26 is rotatably pivoted by the cylindrical section 33 of the middle terminal 32 at the step 22, so that the height is equal to the height of the step 22. And the height of the variable resistor can be reduced.
【００１５】以上のように構成された本発明の一実施の
形態における可変抵抗器について、次にその組立方法を
図面を参照しながら説明する。Next, a method for assembling the variable resistor according to the embodiment of the present invention will be described with reference to the drawings.
【００１６】図３〜図６は本発明の一実施の形態におけ
る可変抵抗器の製造方法を示す工程図である。FIGS. 3 to 6 are process diagrams showing a method for manufacturing a variable resistor according to an embodiment of the present invention.
【００１７】まず、図３（ａ）に示すように、個片の絶
縁基板２１の略中央に中空孔２３を有する段差部２２を
設けるとともに、個片の絶縁基板２１どうしの接続部に
分割溝４１を設けるように多数個取り絶縁基板４２を焼
成する。First, as shown in FIG. 3A, a step portion 22 having a hollow hole 23 is provided substantially at the center of an individual insulating substrate 21, and a dividing groove is formed at a connecting portion between the individual insulating substrates 21. The multi-piece insulating substrate 42 is baked so as to provide 41.
【００１８】次に、図３（ｂ）に示すように、多数個取
り絶縁基板４２の電極用突起２４の表面に表面電極４３
を印刷した後、約８５０℃で約３０分間焼成する。Next, as shown in FIG. 3B, a surface electrode 43 is formed on the surface of the electrode projection 24 of the multi-piece insulating substrate 42.
After printing, is baked at about 850 ° C. for about 30 minutes.
【００１９】次に、図３（ｃ）に示すように、表面電極
４３（図示せず）を形成した多数個取り絶縁基板４２の
電極用突起２４の裏面に裏面電極４４を印刷した後、約
８００℃で約３０分間焼成する。Next, as shown in FIG. 3C, after a back electrode 44 is printed on the back surface of the electrode projection 24 of the multi-cavity insulating substrate 42 on which the surface electrode 43 (not shown) is formed, Bake at 800 ° C. for about 30 minutes.
【００２０】次に、図３（ｄ）に示すように、多数個取
り絶縁基板４２の表面に段差部２２の外周と略同径の内
周を有する馬蹄形状の抵抗体２５を表面電極４３と電気
的に接続されるように印刷した後、約８５０℃で約３０
分間焼成する。Next, as shown in FIG. 3D, a horseshoe-shaped resistor 25 having an inner periphery substantially the same diameter as the outer periphery of the step 22 is formed on the surface of the multi-cavity insulating substrate 42 with the surface electrode 43. After printing to be electrically connected, about 850 ° C. for about 30
Bake for a minute.
【００２１】次に、図３（ｅ）に示すように、表面電極
４３、裏面電極４４（図示せず）、および抵抗体２５を
形成した多数個取り絶縁基板４２を電極３５が外側を向
くように、二列の二列絶縁基板４５に分割する。Next, as shown in FIG. 3E, the multi-cavity insulating substrate 42 on which the front surface electrode 43, the back surface electrode 44 (not shown), and the resistor 25 are formed is placed so that the electrode 35 faces outward. Then, the substrate is divided into two rows of two-row insulating substrates 45.
【００２２】次に、図４（ａ）に示すように、二列に分
割された二列絶縁基板４５の側面に表面電極４３と裏面
電極４４（図示せず）とに電気的に接続されるように側
面電極４６を印刷し、焼成する。Next, as shown in FIG. 4A, the front surface electrode 43 and the back surface electrode 44 (not shown) are electrically connected to the side surface of the two-row insulating substrate 45 divided into two rows. The side electrodes 46 are printed and fired as described above.
【００２３】次に、図４（ｂ）に示すように、二列絶縁
基板４５の抵抗体２５から段差部２２の内側面にわたっ
て、マスク４８およびスキージ４９により、メッキレジ
スト４７を印刷し、その後、紫外線照射装置（図示せ
ず）を用いて波長が１８４．９〜２６５．０ｎｍの紫外
線を照射しメッキレジスト４７を硬化させる。Next, as shown in FIG. 4B, a plating resist 47 is printed by a mask 48 and a squeegee 49 from the resistor 25 of the two-row insulating substrate 45 to the inner surface of the step 22, and thereafter, The plating resist 47 is cured by irradiating ultraviolet rays having a wavelength of 184.9 to 265.0 nm using an ultraviolet irradiation apparatus (not shown).
【００２４】この場合、前記二列絶縁基板４５の抵抗体
２５から段差部２２の内側面にわたってメッキレジスト
４７を形成するようにしているため、このメッキレジス
ト４７により段差部２２の外周縁から外側に向かって設
けられた抵抗体２５の内周側はすべてにわたって覆われ
ることになり、その結果として容易に抵抗体２５の内周
径を小さくすることができるものである。In this case, since the plating resist 47 is formed from the resistor 25 of the double-row insulating substrate 45 to the inner surface of the step 22, the plating resist 47 extends outward from the outer peripheral edge of the step 22. The inner peripheral side of the resistor 25 provided toward the entire surface is entirely covered, and as a result, the inner peripheral diameter of the resistor 25 can be easily reduced.
【００２５】次に、図４（ｃ）に示すように、メッキレ
ジスト４７を形成した二列絶縁基板４５の表面電極４３
と裏面電極４４と側面電極４６とを覆うようにニッケル
メッキ５０を設けた後、このニッケルメッキ５０を覆う
ように半田メッキ５１を形成する。Next, as shown in FIG. 4C, the surface electrode 43 of the two-row insulating substrate 45 on which the plating resist 47 is formed.
After the nickel plating 50 is provided so as to cover the back electrode 44 and the side electrode 46, a solder plating 51 is formed so as to cover the nickel plating 50.
【００２６】次に、図４（ｄ）に示すように、ニッケル
メッキ５０と半田メッキ５１とを形成した二列絶縁基板
４５のメッキレジスト４７を例えばＮａ3ＰＯ3等のアル
カリ溶液（図示せず）に浸漬し、除去する。Next, as shown in FIG. 4D, the plating resist 47 of the double-row insulating substrate 45 on which the nickel plating 50 and the solder plating 51 are formed is removed by using an alkaline solution such as Na 3 PO 3 (not shown). D) and remove.
【００２７】次に、図４（ｅ）に示すように、メッキレ
ジスト４７が除去された二列絶縁基板４５を個片の絶縁
基板２１に分割する。Next, as shown in FIG. 4E, the two-row insulating substrate 45 from which the plating resist 47 has been removed is divided into individual insulating substrates 21.
【００２８】次に、図５（ａ）に示すように、帯状の金
属のフープ材５２を打抜いて一対の切欠き３１を形成す
るとともにこの一対の切欠き３１の間に絞り加工を施し
ながら打抜いて略中央に貫通孔２８を有する突出部２９
を形成する。Next, as shown in FIG. 5A, a pair of notches 31 are formed by punching out a band-shaped metal hoop material 52, and a drawing process is performed between the pair of notches 31. A projection 29 having a through hole 28 at the approximate center thereof
To form
【００２９】次に、図５（ｂ）に示すように、突出部２
９の外周に摺動子３０を設けてドライバープレート２６
を形成する。Next, as shown in FIG.
9 is provided with a slider 30 around the driver plate 26 and
To form
【００３０】次に、図６（ａ）に示すように、絶縁基板
２１の裏面から絶縁基板２１の中空孔２３およびドライ
バープレート２６の貫通孔２８に中端子３２の円筒部３
３を挿入する。Next, as shown in FIG. 6A, the cylindrical portion 3 of the middle terminal 32 is inserted into the hollow hole 23 of the insulating substrate 21 and the through hole 28 of the driver plate 26 from the back surface of the insulating substrate 21.
Insert 3.
【００３１】最後に、図６（ｂ）に示すように、ドライ
バープレート２６の貫通孔２８に挿入された中端子３２
の円筒部３３をかしめて、ドライバープレート２６を絶
縁基板２１の段差部２２に回転可能に枢着する。Finally, as shown in FIG. 6B, the middle terminal 32 inserted into the through hole 28 of the driver plate 26
And the driver plate 26 is rotatably pivoted to the step 22 of the insulating substrate 21.
【００３２】以上のように構成された本発明の一実施の
形態における可変抵抗器について、次にその動作を説明
する。The operation of the variable resistor configured as described above according to an embodiment of the present invention will now be described.
【００３３】この可変抵抗器は、電極３５およびドライ
バープレート２６と接続されている中端子３２により外
部回路と接続され、そしてドライバープレート２６の切
欠き３１に調整用ドライバー（図示せず）等を挿入して
回転させることにより、任意の抵抗値に設定することが
できるものである。なお、本発明の一実施の形態におけ
る可変抵抗器の製造方法においては、表面電極４３を印
刷して焼成した後に裏面電極４４を印刷して焼成する工
程としたが、裏面電極４４を印刷して焼成した後に表面
電極４３を印刷して焼成してもよいものである。このよ
うに、裏面電極４４を印刷して焼成した後に表面電極４
３を印刷すると、多数個取り絶縁基板４２を載置して送
る金属ベルト（図示せず）の錆が表面電極４３に付着
し、抵抗体２５との境界に内在するということがないた
め、可変抵抗器の抵抗値の特性が安定するという効果を
有するものである。The variable resistor is connected to an external circuit by a middle terminal 32 connected to the electrode 35 and the driver plate 26, and an adjustment driver (not shown) or the like is inserted into the notch 31 of the driver plate 26. By rotating it, it is possible to set an arbitrary resistance value. In the manufacturing method of the variable resistor according to the embodiment of the present invention, the process of printing and firing the front surface electrode 43 and then printing and firing the back electrode 44 is adopted. After firing, the surface electrode 43 may be printed and fired. After printing and firing the back electrode 44 in this manner, the front electrode 4
When printing No. 3, the rust of the metal belt (not shown) on which the multi-cavity insulating substrate 42 is placed and sent does not adhere to the surface electrode 43 and is not present inside the boundary with the resistor 25, so that it is variable. This has the effect of stabilizing the characteristics of the resistance value of the resistor.
【００３４】また、本発明の一実施の形態における可変
抵抗器の製造方法においては、表面電極４３を焼成した
後に、裏面電極４４を焼成し、さらにその後に抵抗体２
５を焼成するようにしていたが、表面電極４３と裏面電
極４４と抵抗体２５を印刷した多数個取り絶縁基板４２
を一度に焼成するようにしてもよいものである。この場
合、前記表面電極４３と裏面電極４４と抵抗体２５を印
刷した多数個取り絶縁基板４２を一度に焼成するため、
前記表面電極４３と裏面電極４４と抵抗体２５を別々に
焼成することが無くなり、その結果として、可変抵抗器
の製造時の焼成の回数を削減できるという効果を有する
ものである。In the method of manufacturing a variable resistor according to one embodiment of the present invention, the back electrode 44 is fired after the front electrode 43 is fired, and then the resistor 2 is fired.
5 was fired, but a multi-cavity insulating substrate 42 on which a front electrode 43, a back electrode 44, and a resistor 25 were printed.
May be fired at once. In this case, since the multi-cavity insulating substrate 42 on which the front electrode 43, the back electrode 44, and the resistor 25 are printed is fired at a time,
The front electrode 43, the back electrode 44, and the resistor 25 are not separately fired, and as a result, the number of firings in manufacturing the variable resistor can be reduced.
【００３５】[0035]
【発明の効果】以上のように本発明の可変抵抗器は、表
面に段差部を有しかつこの段差部に中空孔を有するとと
もにこの段差部の外周と略同径の内周を有する抵抗体を
表面に設けられた絶縁基板と、この絶縁基板の段差部に
向かって突出する貫通孔を有する突出部を設けられると
ともに前記絶縁基板の表面の抵抗体上を摺動する摺動子
を有しかつ前記絶縁基板と平行な切欠きを設けられたド
ライバープレートと、一端に前記絶縁基板の裏面から前
記絶縁基板の中空孔と前記ドライバープレートの貫通孔
とに挿通され前記ドライバープレートを枢着する円筒部
を有するとともに他端に前記絶縁基板の底側の略中央か
ら外方へ向かって延出する延出部を有する中端子と、少
なくとも前記絶縁基板の表面で前記抵抗体と電気的に接
続されるとともに前記絶縁基板の表面から側面にわたっ
て設けられた電極とを備えたもので、絶縁基板の表面に
段差部を設けているため、この段差部により確実にドラ
イバープレートの突出部と抵抗体との電気的な絶縁を確
保することができ、その結果として抵抗体の内周を段差
部の外周と略同径にできるため、可変抵抗器の大きさを
小さくすることができるという効果を有するものであ
る。As described above, the variable resistor according to the present invention has a stepped portion on its surface, a hollow hole in the stepped portion, and an inner periphery having substantially the same diameter as the outer periphery of the stepped portion. An insulating substrate provided on the surface thereof, and a slider provided with a protrusion having a through hole projecting toward a step portion of the insulating substrate and sliding on a resistor on the surface of the insulating substrate. A driver plate provided with a notch parallel to the insulating substrate, and a cylinder which is inserted into the hollow hole of the insulating substrate and the through hole of the driver plate at one end from the back surface of the insulating substrate, and pivotally mounts the driver plate. A middle terminal having an extension portion extending outward from a substantially center on the bottom side of the insulating substrate at the other end, and electrically connected to the resistor at least on the surface of the insulating substrate. Together with The electrode is provided from the surface of the insulating substrate to the side surface. Since the step portion is provided on the surface of the insulating substrate, the step portion ensures the electrical connection between the protruding portion of the driver plate and the resistor. Insulation can be ensured, and as a result, the inner circumference of the resistor can be made substantially the same diameter as the outer circumference of the step, so that the size of the variable resistor can be reduced.
【図１】本発明の一実施の形態における可変抵抗器の分
解斜視図FIG. 1 is an exploded perspective view of a variable resistor according to an embodiment of the present invention.
【図２】同可変抵抗器の側断面図FIG. 2 is a side sectional view of the variable resistor.
【図３】（ａ）〜（ｅ）同可変抵抗器の製造方法を示す
工程図FIGS. 3A to 3E are process diagrams showing a method of manufacturing the same variable resistor.
【図４】（ａ）〜（ｅ）同可変抵抗器の製造方法を示す
工程図4 (a) to 4 (e) are process diagrams showing a method for manufacturing the same variable resistor.
【図５】（ａ），（ｂ）同可変抵抗器の製造方法を示す
工程図FIGS. 5A and 5B are process diagrams showing a method of manufacturing the same variable resistor. FIGS.
【図６】（ａ），（ｂ）同可変抵抗器の製造方法を示す
工程図FIGS. 6A and 6B are process diagrams showing a method for manufacturing the same variable resistor.
【図７】従来の可変抵抗器の側断面図FIG. 7 is a side sectional view of a conventional variable resistor.
【図８】同可変抵抗器の上面図FIG. 8 is a top view of the variable resistor.
２１ 絶縁基板 ２２ 段差部 ２３ 中空孔 ２５ 抵抗体 ２６ ドライバープレート ２８ 貫通孔 ２９ 突出部 ３０ 摺動子 ３１ 切欠き ３２ 中端子 ３３ 円筒部 ３５ 電極 ４２ 多数個取り絶縁基板 ４３ 表面電極 ４４ 裏面電極 ４５ 二列絶縁基板 ４６ 側面電極 ４７ メッキレジスト ５０ ニッケルメッキ ５１ 半田メッキ ５２ フープ材 DESCRIPTION OF SYMBOLS 21 Insulating substrate 22 Step part 23 Hollow hole 25 Resistor 26 Driver plate 28 Through hole 29 Projecting part 30 Slider 31 Notch 32 Middle terminal 33 Cylindrical part 35 Electrode 42 Multi-piece insulating substrate 43 Front surface electrode 44 Back surface electrode 45 Two Column insulating substrate 46 Side electrode 47 Plating resist 50 Nickel plating 51 Solder plating 52 Hoop material
Claims (3)
空孔を有するとともに、この段差部の外周と略同径の内
周を有する抵抗体を表面に設けた絶縁基板と、この絶縁
基板の段差部に向かって突出し、かつ貫通孔を有する突
出部を設けるとともに前記絶縁基板の表面の抵抗体上を
摺動する摺動子を有し、さらに切欠きを設けたドライバ
ープレートと、前記絶縁基板の裏面から前記絶縁基板の
中空孔と前記ドライバープレートの突出部の貫通孔とに
挿通されて前記ドライバープレートを枢着する円筒部を
一端に設けるとともに他端に前記絶縁基板の底側の略中
央から外方へ向かって延出する延出部を設けた中端子
と、前記絶縁基板の表面で前記抵抗体と電気的に接続さ
れるとともに前記絶縁基板の表面から側面にわたって設
けられた電極とを備えた可変抵抗器。1. An insulating substrate having a stepped portion on the surface, a hollow hole in the stepped portion, and a resistor provided on the surface having an inner periphery substantially the same diameter as the outer periphery of the stepped portion. A driver plate that protrudes toward a step portion of the substrate and has a slider that slides on a resistor on the surface of the insulating substrate while providing a protruding portion having a through hole, and further includes a notch; A cylindrical portion which is inserted from the back surface of the insulating substrate into the hollow hole of the insulating substrate and the through hole of the projecting portion of the driver plate to pivotally mount the driver plate is provided at one end, and the other end is provided at the bottom side of the insulating substrate. A middle terminal provided with an extending portion extending outward from substantially the center, and an electrode which is electrically connected to the resistor on the surface of the insulating substrate and is provided from the surface of the insulating substrate to a side surface. With Variable resistor.
る段差部を設けるとともにこの個片の絶縁基板の一側面
に設けられた電極用突起が外向きとなるように二列に並
べてなる二列絶縁基板の複数枚を前記電極用突起の箇所
において一体的に連結するようにして多数個取り絶縁基
板を形成する工程と、前記多数個取り絶縁基板の電極用
突起の表面に表面電極を形成するかまたは前記電極用突
起の裏面に裏面電極を形成する工程と、前記表面電極あ
るいは裏面電極を形成した多数個取り絶縁基板の電極用
突起の裏面に裏面電極を形成するかまたは前記電極用突
起の表面に表面電極を形成する工程と、前記多数個取り
絶縁基板の表面に前記段差部の外周と略同径の内周を有
する抵抗体を前記表面電極と電気的に接続されるように
形成する工程と、前記表面電極と前記裏面電極と前記抵
抗体とを形成した多数個取り絶縁基板を前記二列絶縁基
板に分割する工程と、二列に分割された前記二列絶縁基
板の側面に前記表面電極と前記裏面電極とに電気的に接
続されるように側面電極を形成する工程と、前記二列絶
縁基板の抵抗体から段差部の内側面にわたってメッキレ
ジストを形成する工程と、前記メッキレジストを形成し
た前記二列絶縁基板の表面電極と裏面電極と側面電極と
を覆うようにニッケルメッキを形成した後にこのニッケ
ルメッキを覆うように半田メッキを形成する工程と、前
記半田メッキを形成した前記二列絶縁基板の前記メッキ
レジストを除去する工程と、前記メッキレジストを除去
した二列絶縁基板を個片の絶縁基板に分割する工程と、
帯状のフープ材を打抜いて切欠きを形成するとともにこ
の切欠きの間に位置して絞り加工を施しながら打抜いて
略中央に貫通孔を有する突出部を形成する工程と、前記
突出部の外周に摺動子を設けてドライバープレートを構
成する工程と、個片の前記絶縁基板の段差部に前記ドラ
イバープレートの突出部を挿入する工程と、前記絶縁基
板の裏面から前記絶縁基板の中空孔および前記ドライバ
ープレートの貫通孔に前記中端子の円筒部を挿入して枢
着する工程とからなる可変抵抗器の製造方法。2. A step portion having a hollow hole is provided substantially at the center of the individual insulating substrate, and the electrode projections provided on one side surface of the individual insulating substrate are arranged in two rows so as to face outward. Forming a multi-cavity insulating substrate by integrally connecting a plurality of double-row insulating substrates at the locations of the electrode projections; and forming a surface electrode on the surface of the multi-cavity insulating substrate. Forming a back surface electrode on the back surface of the electrode protrusion, and forming a back surface electrode on the back surface of the electrode protrusion of the multi-cavity insulating substrate on which the front surface electrode or the back surface electrode is formed. Forming a surface electrode on the surface of the projection for use, and electrically connecting a resistor having an inner circumference substantially the same diameter as the outer circumference of the step portion on the surface of the multi-cavity insulating substrate to the surface electrode. And the process of forming A step of dividing the multi-cavity insulating substrate on which the front electrode, the back electrode, and the resistor are formed into the two-row insulating substrate, and the front electrode on a side surface of the two-row insulating substrate divided into two rows. Forming a side electrode so as to be electrically connected to the back electrode, forming a plating resist over the inner surface of the step portion from the resistor of the double-row insulating substrate, and forming the plating resist. Forming nickel plating so as to cover the front surface electrode, the back surface electrode, and the side surface electrode of the two-row insulating substrate, and then forming solder plating so as to cover the nickel plating; and Removing the plating resist of the substrate, and dividing the double-row insulating substrate from which the plating resist has been removed into individual insulating substrates,
A step of forming a notch by punching a band-shaped hoop material and forming a notch located between the notches while performing drawing processing to form a protrusion having a through hole substantially in the center; and A step of providing a driver plate by providing a slider on the outer periphery; a step of inserting a projecting portion of the driver plate into a step portion of the individual insulating substrate; and a hollow hole of the insulating substrate from a back surface of the insulating substrate. And a step of inserting the cylindrical portion of the middle terminal into the through hole of the driver plate and pivotally connecting the same to the through hole of the driver plate.
る段差部を設けるとともにこの個片の絶縁基板の一側面
に設けられた電極用突起が外向きとなるように二列に並
べてなる二列絶縁基板の複数枚を前記電極用突起の箇所
において一体的に連結するようにして多数個取り絶縁基
板を形成する工程と、前記多数個取り絶縁基板の電極用
突起の裏面に裏面電極を印刷する工程と、前記裏面電極
を形成した多数個取り絶縁基板の電極用突起の表面に表
面電極を印刷する工程と、前記多数個取り絶縁基板の表
面に前記段差部の外周と同径の内周を有する抵抗体を前
記表面電極と電気的に接続されるように印刷する工程
と、前記表面電極と前記裏面電極と前記抵抗体とを印刷
した多数個取り絶縁基板を焼成する工程と、前記表面電
極と前記裏面電極と前記抵抗体とを形成した多数個取り
絶縁基板を前記二列絶縁基板に分割する工程と、二列に
分割された前記二列絶縁基板の側面に前記表面電極と前
記裏面電極とに電気的に接続されるように側面電極を形
成する工程と、前記二列絶縁基板の抵抗体から段差部の
内側面にわたってメッキレジストを形成する工程と、前
記メッキレジストを形成した前記二列絶縁基板の表面電
極と裏面電極と側面電極とを覆うようにニッケルメッキ
を形成した後にこのニッケルメッキを覆うように半田メ
ッキを形成する工程と、前記半田メッキを形成した前記
二列絶縁基板の前記メッキレジストを除去する工程と、
前記メッキレジストを除去した二列絶縁基板を個片の絶
縁基板に分割する工程と、帯状のフープ材を打抜いて切
欠きを形成するとともにこの切欠きの間に位置して絞り
加工を施しながら打抜いて略中央に貫通孔を有する突出
部を形成する工程と、前記突出部の外周に摺動子を設け
てドライバープレートを構成する工程と、個片の前記絶
縁基板の段差部に前記ドライバープレートの突出部を挿
入する工程と、前記絶縁基板の裏面から前記絶縁基板の
中空孔および前記ドライバープレートの貫通孔に中端子
の円筒部を挿入して枢着する工程とからなる可変抵抗器
の製造方法。3. A step portion having a hollow hole is provided substantially at the center of the individual insulating substrate, and the electrode projections provided on one side surface of the individual insulating substrate are arranged in two rows so as to face outward. Forming a multi-cavity insulating substrate by integrally connecting a plurality of two-row insulating substrates at the locations of the electrode projections; and forming a back electrode on the back surface of the electrode projections of the multi-cavity insulating substrate. Printing a surface electrode on the surface of the electrode projections of the multi-cavity insulating substrate on which the back electrode is formed, and having the same diameter as the outer periphery of the stepped portion on the surface of the multi-cavity insulating substrate. A step of printing a resistor having an inner periphery so as to be electrically connected to the front electrode, and a step of firing a multi-cavity insulating substrate on which the front electrode, the back electrode, and the resistor are printed, The front electrode, the back electrode, and the front A step of dividing the multi-cavity insulating substrate on which the resistor is formed into the two-row insulating substrate, and electrically connecting the front electrode and the back electrode to the side surfaces of the two-row insulating substrate divided into two rows. Forming a side electrode so as to be connected, forming a plating resist over the inner surface of the step from the resistor of the two-row insulating substrate, and forming a surface electrode of the two-row insulating substrate on which the plating resist is formed. Forming nickel plating so as to cover the back electrode and the side electrode, and then forming solder plating so as to cover the nickel plating, and removing the plating resist of the two-row insulating substrate on which the solder plating is formed. Process and
A step of dividing the two-row insulating substrate from which the plating resist has been removed into individual insulating substrates, and forming a notch by punching a band-shaped hoop material and forming a notch between the notches while performing drawing. A step of punching to form a projecting portion having a through hole at substantially the center, a step of providing a slider on the outer periphery of the projecting portion to form a driver plate, and a step of forming the driver on a step portion of the individual insulating substrate. A step of inserting a protruding portion of a plate, and a step of inserting a cylindrical portion of a middle terminal into a hollow hole of the insulating substrate and a through hole of the driver plate from the back surface of the insulating substrate and pivotally connecting the same. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026948A JPH11233314A (en) | 1998-02-09 | 1998-02-09 | Variable resistor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10026948A JPH11233314A (en) | 1998-02-09 | 1998-02-09 | Variable resistor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11233314A true JPH11233314A (en) | 1999-08-27 |
Family
ID=12207388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10026948A Pending JPH11233314A (en) | 1998-02-09 | 1998-02-09 | Variable resistor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11233314A (en) |
-
1998
- 1998-02-09 JP JP10026948A patent/JPH11233314A/en active Pending
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