JPH11232415A - Ic card and its production - Google Patents
Ic card and its productionInfo
- Publication number
- JPH11232415A JPH11232415A JP2963598A JP2963598A JPH11232415A JP H11232415 A JPH11232415 A JP H11232415A JP 2963598 A JP2963598 A JP 2963598A JP 2963598 A JP2963598 A JP 2963598A JP H11232415 A JPH11232415 A JP H11232415A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- card
- circuit
- module
- layer member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非接触式ＩＣカ一
ドとその製造法に関する。The present invention relates to a non-contact type IC card and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】非接触式ＩＣカ一ドは、一般に、アンテ
ナ回路、無線通信機能と演算・記憶機能を有するＩＣと
ケーシングから構成されている。このような構成とする
には、通常、アンテナ回路とＩＣチップを接続するイン
ナーリード部を含む回路を形成した回路層部材に、直接
ＩＣチップを接続・実装し、その上に、表層材を重ねて
積層接着する。2. Description of the Related Art A non-contact type IC card generally includes an antenna circuit, an IC having a radio communication function and an operation / storage function, and a casing. To achieve such a configuration, an IC chip is usually directly connected and mounted on a circuit layer member on which a circuit including an inner lead portion connecting the antenna circuit and the IC chip is formed, and a surface material is laminated thereon. To laminate.
【０００３】このような構成とすると、ＩＣカードを薄
くするためには、ＩＣチップそのものも薄くしなければ
ならず、その結果、ＩＣチップが外力による破損を受け
易くなる。そこで、ＩＣチップを接続・実装した後に、
ＩＣチップが嵌合する孔をあけたスペーサを、ＩＣチッ
プを実装した回路部材の上に、ＩＣチップと孔とが嵌合
するように重ねて積層接着する方法が提案され、ＩＣカ
ードの表面を平坦にすることができ、かつ、ＩＣチップ
に加わる外力を抑制することができる。また、表層材
に、積層したときにＩＣチップを埋められる厚さのホッ
トメルト接着剤を塗布し、加熱・加圧して積層接着する
ことによって、ホットメルト接着剤が熱によって流動
し、ＩＣチップを埋める方法が提案され、この方法で
も、ＩＣカードの表面を平坦にすることができ、かつ、
ＩＣチップに加わる外力を抑制することができる。[0003] With such a configuration, in order to make the IC card thinner, the IC chip itself must be thinner, and as a result, the IC chip is easily damaged by external force. Therefore, after connecting and mounting the IC chip,
A method has been proposed in which a spacer having a hole into which an IC chip is fitted is overlaid and bonded on a circuit member on which the IC chip is mounted so that the IC chip and the hole are fitted. It can be made flat and the external force applied to the IC chip can be suppressed. Further, a hot-melt adhesive having a thickness enough to bury the IC chip when laminated is applied to the surface layer material, and the laminate is bonded by applying heat and pressure, whereby the hot-melt adhesive flows by heat, and the IC chip is removed. A filling method has been proposed, and this method can also flatten the surface of the IC card, and
External force applied to the IC chip can be suppressed.
【０００４】[0004]
【発明が解決しようとする課題】しかし、ＩＣチップが
嵌合する孔をあけたスペーサを用いる方法では、スペー
サ用の材料を追加しなければならないので経済的でない
という課題がある。また、ＩＣチップと孔とを正確に嵌
合させるためには、孔を大きくするか、正確に嵌合する
ための装置が必要であり、孔を大きくすれば、ＩＣカー
ドの表面に凹凸ができ、外力の抑制効果が低くなるとい
う課題もある。また、この外力の抑制には、ＩＣチップ
のＩＣカード中での厚さ方向の位置が、中心に近い方が
より有利であるので、スペーサの厚さの分を回路層部材
の裏面側を厚くすることが求められ、材料の増加、また
は異なる厚さの材料の使用により経済性が低下するとい
う課題もある。However, the method of using a spacer having a hole into which an IC chip fits has a problem that it is not economical since a material for the spacer must be added. Also, in order to accurately fit the IC chip and the hole, it is necessary to increase the size of the hole or a device for accurately fitting the hole. There is also a problem that the effect of suppressing external force is reduced. In order to suppress this external force, it is more advantageous that the position of the IC chip in the thickness direction of the IC card in the IC card is closer to the center. Therefore, the thickness of the spacer is increased on the back side of the circuit layer member. In addition, there is a problem that the economic efficiency is reduced by increasing the number of materials or using materials having different thicknesses.
【０００５】厚いホットメルト接着剤を用いる方法で
は、一般に、ホットメルト接着剤の弾性や耐熱性は、表
層材に比べて低いので、外力に対抗する効果が低くなっ
たり、耐熱性が低下するという課題がある。In a method using a thick hot-melt adhesive, the elasticity and heat resistance of the hot-melt adhesive are generally lower than those of the surface layer material, so that the effect against external force is reduced or the heat resistance is reduced. There are issues.
【０００６】本発明は、安価で信頼性の高い、特にＩＣ
チップに対する外力の抑制に優れたＩＣカードと、その
ようなＩＣカードを経済性に優れて製造する方法を提供
することを目的とする。The present invention provides an inexpensive and highly reliable IC,
It is an object of the present invention to provide an IC card excellent in suppressing external force on a chip and a method of manufacturing such an IC card with excellent economic efficiency.
【０００７】[0007]
【課題を解決するための手段】本発明のＩＣカードは、
図１に示すように、少なくとも片面に渦巻き状のアンテ
ナ回路１１とアンテナ回路１１の起点のランド部１１１
と終点のランド部１１２とが形成され、かつ、ＩＣチッ
プ収納孔１２を有する回路層部材１と、片面にＩＣチッ
プ９と接続されたインナーリード部２１とジャンパ線部
２２とアンテナ回路１１との接続端子２４とが形成さ
れ、かつ、このジャンパ線部２２が電気絶縁樹脂２３で
被覆されたモジュール３と、感圧性および／または感熱
性の接着剤を片面に塗布したカード表層材６とからな
り、回路層部材１のアンテナ回路１１の起点のランド部
１１１と終点のランド部１１２とがモジュール３の接続
端子２４に電気的に接続され、かつ、回路層部材１のＩ
Ｃチップ収納孔１２とＩＣチップ９の空隙がカード表層
材６に塗布した感圧性および／または感熱性の接着剤４
で充填されていることを特徴とする。The IC card according to the present invention comprises:
As shown in FIG. 1, a spiral antenna circuit 11 on at least one side and a land portion 111 at the starting point of the antenna circuit 11 are provided.
And a circuit layer member 1 having an IC chip receiving hole 12 and an inner lead portion 21 connected to the IC chip 9 on one side, a jumper wire portion 22, and the antenna circuit 11. The connection terminal 24 is formed, and the jumper line portion 22 is composed of the module 3 covered with the electric insulating resin 23 and the card surface material 6 coated with a pressure-sensitive and / or heat-sensitive adhesive on one surface. The land portion 111 at the starting point and the land portion 112 at the end point of the antenna circuit 11 of the circuit layer member 1 are electrically connected to the connection terminal 24 of the module 3.
The gap between the C chip housing hole 12 and the IC chip 9 is a pressure-sensitive and / or heat-sensitive adhesive 4 applied to the card surface material 6.
Characterized by being filled with.
【０００８】このようなＩＣカードとするには、図２
（ａ）に示すように、回路層部材１に、複数のＩＣカー
ドとなる、少なくとも片面に渦巻き状のアンテナ回路１
１とアンテナ回路１１の起点のランド部１１１と終点の
ランド部１１２とを形成し、それぞれのＩＣカードとな
る回路層部材１にＩＣチップ収納孔１２をあけ、別途、
図２（ｂ）に示すように、複数のモジュール３をモジュ
ール基材２に形成し、図２（ｃ）に示すように、それぞ
れのモジュール３に、片面にＩＣチップ９と接続するた
めのインナーリード部２１とジャンパ線部２２とアンテ
ナ回路１１との接続端子２４とを形成し、図２（ｄ）に
示すように、このジャンパ線部２２を電気絶縁樹脂２３
で被覆し、図２（ｅ）に示すように、インナーリード部
２１とＩＣチップ９とを電気的に接続し、モジュール基
材２からそれぞれのモジュール３を切断・分離し、図２
（ｆ）に示すように、そのモジュール３上のＩＣチップ
９が回路層部材１のＩＣチップ収納孔１２に嵌合するよ
うに重ねると共に、回路層部材１のアンテナ回路１１の
起点のランド部１１１と終点のランド部１１２とをモジ
ュール３の接続端子２４に電気的に接続し、図１（ｂ）
に示すように、その上に感圧性および／または感熱性の
接着剤４を塗布したカード表層材６を重ね、加圧・加熱
して積層接着することによって製造することができる。To make such an IC card, FIG.
As shown in (a), a spiral antenna circuit 1 on at least one side, which becomes a plurality of IC cards, is provided on a circuit layer member 1.
1 and a land portion 111 at the starting point of the antenna circuit 11 and a land portion 112 at the ending point, and an IC chip housing hole 12 is formed in the circuit layer member 1 serving as an IC card.
As shown in FIG. 2 (b), a plurality of modules 3 are formed on the module substrate 2, and as shown in FIG. 2 (c), each module 3 has an inner surface for connecting to the IC chip 9 on one side. A lead 21, a jumper wire 22, and a connection terminal 24 for connecting the antenna circuit 11 are formed, and as shown in FIG.
As shown in FIG. 2E, the inner leads 21 and the IC chip 9 are electrically connected, and each module 3 is cut and separated from the module base material 2 as shown in FIG.
As shown in (f), the IC chip 9 on the module 3 is overlapped so as to fit into the IC chip receiving hole 12 of the circuit layer member 1 and the land portion 111 of the starting point of the antenna circuit 11 of the circuit layer member 1 is formed. And the land 112 at the end point are electrically connected to the connection terminal 24 of the module 3, and FIG.
As shown in (1), a card surface layer material 6 coated with a pressure-sensitive and / or heat-sensitive adhesive 4 is laminated thereon, and is pressed and heated to be laminated and bonded.
【０００９】[0009]
【発明の実施の形態】本発明の回路層部材１には、ポリ
エチレンテレフタレートフィルム（以下、ＰＥＴフィル
ムという。）などのプラスチックフィルムやプラスチッ
クフィルムにアルミニウム箔や銅箔を貼り合わせたフレ
キシブル回路基板や、ガラス布エポキシ樹脂含浸銅張り
積層板が使用できる。BEST MODE FOR CARRYING OUT THE INVENTION A circuit layer member 1 according to the present invention includes a plastic film such as a polyethylene terephthalate film (hereinafter referred to as a PET film) or a flexible circuit board in which an aluminum foil or a copper foil is bonded to a plastic film. Glass cloth epoxy resin impregnated copper clad laminates can be used.
【００１０】その回路層部材１の少なくとも片面に形成
する、渦巻き状のアンテナ回路１１、アンテナ回路１１
の起点のランド部１１１、および終点のランド部１１２
は、回路層部材１が、ＰＥＴフィルムなどのプラスチッ
クフィルムのときには、導電性粒子を樹脂に混入した銀
ペーストや銅ペーストを、シルクスクリーン印刷法によ
って形成したり、回路層部材１が、フレキシブル回路基
板や、ガラス布エポキシ樹脂含浸銅張り積層板のときに
は、アルミニウム箔や銅箔の不要な箇所をエッチング除
去することによって形成することができる。A spiral antenna circuit 11 and an antenna circuit 11 formed on at least one surface of the circuit layer member 1
Land portion 111 at the start of the program and land portion 112 at the end of the program
When the circuit layer member 1 is a plastic film such as a PET film, a silver paste or a copper paste in which conductive particles are mixed in a resin is formed by a silk screen printing method, or the circuit layer member 1 is formed of a flexible circuit board. In the case of a copper-clad laminate impregnated with a glass cloth epoxy resin, it can be formed by etching away unnecessary portions of an aluminum foil or a copper foil.
【００１１】回路層部材１にあける、ＩＣチップ収納孔
１２は、打ち抜き金型や刃型を用いて形成することがで
きる。The IC chip housing hole 12 in the circuit layer member 1 can be formed by using a punching die or a blade die.
【００１２】また、モジュール基材２としては、回路層
部材１と同様のものを使用することができ、さらにガラ
ス転移温度がｌ８０℃以上の絶縁性有機フィルムを選定
することは、フェイスダウン実装したＩＣチップ外周部
と、インナーリードの導通によるバンプに並列のバイパ
ス回路の発生の不具合を防止する効果があり好ましい。As the module substrate 2, the same material as the circuit layer member 1 can be used, and the selection of an insulative organic film having a glass transition temperature of 180 ° C. or more requires face-down mounting. This is preferable because it has an effect of preventing a problem of occurrence of a bypass circuit parallel to the bump due to conduction between the IC chip outer peripheral portion and the inner lead.
【００１３】このようなモジュール基材２の表面に形成
される、ＩＣチップ９と接続されたインナーリード部２
１とジャンパ線部２２とアンテナ回路１１との接続端子
２４は、回路層部材１に形成する回路と同じ方法で形成
することができる。The inner lead 2 formed on the surface of the module base 2 and connected to the IC chip 9
The connection terminal 24 between the circuit layer member 1, the jumper wire 22 and the antenna circuit 11 can be formed by the same method as the circuit formed on the circuit layer member 1.
【００１４】このジャンパ線部２２は、電気絶縁樹脂２
３で被覆することが必要で、このような電気絶縁樹脂２
３は、ソルダーレジストインクのように絶縁を目的とす
る樹脂を用いることが好ましい。この電気絶縁樹脂２３
は、モジュール上のジャンパ線部２２がアンテナ回路１
１と短絡するのを防ぐものである。The jumper wire portion 22 is made of an electrically insulating resin 2
It is necessary to cover with such an electrically insulating resin 2.
For 3, it is preferable to use a resin for the purpose of insulation, such as solder resist ink. This electric insulating resin 23
Indicates that the jumper wire section 22 on the module is the antenna circuit 1
This prevents a short circuit with 1.
【００１５】モジュール基材２の片面に形成されたＩＣ
チップ９を接続するためのインナーリード部２１と、Ｉ
Ｃチップ９とを電気的に接続するには、ワイヤボンディ
ングやギャングボンディング、ＩＣチップのバンプを押
しつける方法、異方導電性接着フィルム（８）または異
方導電性接着ペーストで接着接続する方法などを用いる
ことができ、さらに、この接続方法には、スポット溶
着、超音波溶着法等も条件を選べば利用できる。IC formed on one side of module substrate 2
An inner lead portion 21 for connecting the chip 9;
In order to electrically connect to the C chip 9, wire bonding, gang bonding, a method of pressing a bump of an IC chip, a method of bonding and connecting with an anisotropic conductive adhesive film (8) or an anisotropic conductive adhesive paste, or the like is used. A spot welding method, an ultrasonic welding method, or the like can be used as the connection method if conditions are selected.
【００１６】[0016]
【実施例】図２（ａ）に示すように、複数のＩＣカード
となる、回路層部材１として、厚さｌ８８μｍの二軸延
伸ポリエチレンテレフタレートフィルムの片面に、図２
（ｇ）に示すように、渦巻き状のアンテナ回路１１と、
アンテナ回路１１の起点のランド部１１１と終点のラン
ド部１１２とを、導電性銀ペーストをシルクスクリーン
印刷法で印刷し、乾燥・硬化して形成した。次に、それ
ぞれのＩＣカードとなる回路層部材１にＩＣチップ収納
孔１２をあけた。尚、回路層部材１は、製造コスト低減
のため、図２（ａ）に示すように、回路層部材１を多面
取りとした。As shown in FIG. 2 (a), as a circuit layer member 1 to be a plurality of IC cards, one side of a 188 μm-thick biaxially stretched polyethylene terephthalate film was formed on one surface.
As shown in (g), a spiral antenna circuit 11;
The land portion 111 at the starting point and the land portion 112 at the end point of the antenna circuit 11 were formed by printing a conductive silver paste by a silk screen printing method, and drying and curing the paste. Next, an IC chip housing hole 12 was made in the circuit layer member 1 to be each IC card. In addition, as shown in FIG. 2A, the circuit layer member 1 was formed into a plurality of circuit layers in order to reduce the manufacturing cost.
【００１７】次に、図２（ｂ）に示すように、複数のモ
ジュール３を、製造コスト低減のため、多面取りとし、
それぞれのモジュール３には、図２（ｃ）に示すよう
に、厚さ２５μｍの二軸延伸ポリエチレンテレフタレー
トフィルムの片面に、ＩＣチップ９を接続するためのイ
ンナーリード部２１と、渦巻き状のアンテナ回路１１を
跨ぐジャンパ線部２２と、アンテナ回路１１と接続する
接続端子２４を、導電性銀ペーストをシルクスクリーン
印刷法により印刷し、乾燥・硬化して形成した。更に、
図２（ｄ）に示すように、このモジュール３のジャンパ
線部２２に、ソルダーレジストインクをシルクスクリー
ン印刷法により印刷し、乾燥・硬化して、電気絶縁樹脂
２３がアンテナ回路３を短絡しないように横断する絶縁
膜を形成した。次に、図２（ｅ）に示すように、ＩＣチ
ップ９とモジュ一ル基材表面のインナーリード部２１と
を異方導電性接着フィルム８により電気的に接続し、フ
エイスダウン実装した後に、多面取りしたモジュール基
材２を各モジュール３ごとに切り離し、モジュール３を
作製した。Next, as shown in FIG. 2B, a plurality of modules 3 are formed into a plurality of modules to reduce manufacturing costs.
As shown in FIG. 2C, each module 3 has an inner lead portion 21 for connecting the IC chip 9 to one surface of a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm, and a spiral antenna circuit. The jumper wire portion 22 straddling 11 and the connection terminal 24 connected to the antenna circuit 11 were formed by printing a conductive silver paste by a silk screen printing method, and drying and curing the paste. Furthermore,
As shown in FIG. 2D, a solder resist ink is printed on the jumper line portion 22 of the module 3 by a silk screen printing method, dried and cured, so that the electrically insulating resin 23 does not short-circuit the antenna circuit 3. Was formed across the insulating film. Next, as shown in FIG. 2E, the IC chip 9 and the inner lead portion 21 on the surface of the module substrate are electrically connected by the anisotropic conductive adhesive film 8, and after face down mounting, The module substrate 2 obtained by multi-face cutting was cut off for each module 3 to produce a module 3.
【００１８】続いて、図２（ｆ）に示すように、そのモ
ジュール３上のＩＣチップ９が回路層部材１のＩＣチッ
プ収納孔１２に嵌合するように重ねると共に、回路層部
材１のアンテナ回路１１の起点のランド部１１１と終点
のランド部１１２とを導電性接着剤でモジュール３の接
続端子２４に電気的・物理的に接続し、図１（ｂ）に示
すように、その上下面からそれぞれその上に感圧性およ
び感熱性の接着剤４を塗布したカード表層材６を重ね、
加圧・加熱して積層接着した。Subsequently, as shown in FIG. 2F, the IC chip 9 on the module 3 is overlapped so as to fit into the IC chip receiving hole 12 of the circuit layer member 1, and the antenna of the circuit layer member 1 is The land portion 111 at the start point of the circuit 11 and the land portion 112 at the end point are electrically and physically connected to the connection terminal 24 of the module 3 with a conductive adhesive, and as shown in FIG. And a card surface material 6 coated with a pressure-sensitive and heat-sensitive adhesive 4 thereon, respectively,
The laminate was bonded by pressing and heating.
【００１９】この実施例の効果として、安価で信頼性の
高い、特にＩＣチップの割れを防止したＩＣカードを得
た。ＩＣチップを回路層部材のＩＣチップ収納孔に入れ
て、カード曲げ変形が直接ＩＣチップに伝わらない方法
としたことが割れを防止する効果があった。また、モジ
ュール基材を極薄とし、その両面を低弾性の接着剤でく
るむ方式としたことによっても、ＩＣチップ割れ防止の
効果があった。即ち、ＩＣチップは比較的剛性の高い回
路層部材の中に、比較的柔較な接着剤に包まれて配置さ
れるため、ＩＣカードに作用する外力を緩和する効果が
ある。カードが外力で曲げられた時、ＩＣチップに作用
する応力は、カードの中立層にＩＣチップを配置したと
きが最小になることは材料力学上の常識である。本法に
よれば、ＩＣチップをカードの中立層に容易に配置で
き、かつ、表裏のスキン層を同一にできる。As an effect of this embodiment, an inexpensive and highly reliable IC card in which cracking of an IC chip is prevented is obtained. Putting the IC chip into the IC chip housing hole of the circuit layer member so that the card bending deformation is not directly transmitted to the IC chip has an effect of preventing cracking. Also, by making the module base material extremely thin and wrapping both sides with a low-elasticity adhesive, there is also an effect of preventing IC chip cracking. That is, since the IC chip is arranged in the relatively high rigidity of the circuit layer member while being wrapped in the relatively soft adhesive, there is an effect of reducing the external force acting on the IC card. It is common sense in material mechanics that when the card is bent by an external force, the stress acting on the IC chip is minimized when the IC chip is arranged on the neutral layer of the card. According to this method, the IC chip can be easily arranged on the neutral layer of the card, and the front and back skin layers can be made the same.
【００２０】[0020]
【発明の効果】以上に説明したとおり、本発明によっ
て、安価で信頼性の高い、特にＩＣチップに対する外力
の抑制に優れたＩＣカードと、そのようなＩＣカードを
経済性に優れて製造する方法を提供することができる。As described above, according to the present invention, an inexpensive and highly reliable IC card which is excellent in suppressing external force to an IC chip, and a method of manufacturing such an IC card with excellent economic efficiency. Can be provided.
【図１】（ａ）は、本発明の一実施例を示す回路層部材
の上面図であり、（ｂ）はその断面図である。FIG. 1A is a top view of a circuit layer member showing one embodiment of the present invention, and FIG. 1B is a cross-sectional view thereof.
【図２】（ａ）〜（ｆ）は、本発明の方法を説明するた
めの各工程における上面図であり、（ｇ）は（ａ）の一
部拡大図である。2 (a) to 2 (f) are top views in each step for explaining the method of the present invention, and FIG. 2 (g) is a partially enlarged view of FIG. 2 (a).
１．回路層部材 １１．アンテナ
回路 １１１．起点のランド部 １１２．終点の
ランド部 １２．ＩＣチップ収納孔 ２．モジュール基材 ２１．インナー
リード部 ２２．ジャンパ線部 ２３．電気絶縁
樹脂 ２４．接続端子 ３．モジュール ４．接着剤 ６．カード表層材 ８．異方導電性接着フィルム ９．ＩＣチップ1. Circuit layer member 11. Antenna circuit 111. Land part of starting point 112. Land part at the end point 12. IC chip storage hole 2. Module base material 21. Inner lead part 22. Jumper wire section 23. Electrical insulating resin 24. Connection terminal 3. Module 4. Adhesive 6. 7. Card surface material 8. Anisotropic conductive adhesive film IC chip
Claims (4)
（１１）とアンテナ回路（１１）の起点のランド部（１
１１）と終点のランド部（１１２）とが形成され、か
つ、ＩＣチップ収納孔（１２）を有する回路層部材
（１）と、片面にＩＣチップ（９）と接続されたインナ
ーリード部（２１）とジャンパ線部（２２）とアンテナ
回路（１１）との接続端子（２４）とが形成され、か
つ、このジャンパ線部（２２）が電気絶縁樹脂（２３）
で被覆されたモジュール（３）と、感圧性および／また
は感熱性の接着剤を片面に塗布したカード表層材（６）
とからなり、回路層部材（１）のアンテナ回路（１１）
の起点のランド部（１１１）と終点のランド部（１１
２）とがモジュール（３）の接続端子（２４）に電気的
に接続され、かつ、回路層部材（１）のＩＣチップ収納
孔（１２）とＩＣチップ（９）の空隙がカード表層材
（６）に塗布した感圧性および／または感熱性の接着剤
（４）で充填されていることを特徴とするＩＣカード。A spiral antenna circuit (11) on at least one side and a land (1) at the starting point of the antenna circuit (11).
11) and a land portion (112) at the end point, a circuit layer member (1) having an IC chip receiving hole (12), and an inner lead portion (21) connected to an IC chip (9) on one surface. ), A jumper wire portion (22) and a connection terminal (24) for connecting the antenna circuit (11), and the jumper wire portion (22) is formed of an electrically insulating resin (23).
(3) coated with a pressure-sensitive and / or heat-sensitive adhesive on one side of a card surface material (6)
And an antenna circuit (11) of the circuit layer member (1)
The land (111) at the starting point and the land (11) at the end
2) is electrically connected to the connection terminal (24) of the module (3), and the gap between the IC chip receiving hole (12) of the circuit layer member (1) and the IC chip (9) is formed by the card surface material ( An IC card which is filled with a pressure-sensitive and / or heat-sensitive adhesive (4) applied to 6).
ＩＣチップ（９）を接続するためのインナーリード部
（２１）と、ＩＣチップ（９）とが、異方導電性接着フ
ィルム（８）または異方導電性接着ペーストにより電気
的に接続したことを特徴とする請求項１に記載のＩＣカ
ード。2. An anisotropic conductive adhesive film (2), wherein an inner lead portion (21) for connecting an IC chip (9) formed on the surface of a module substrate (2) and an IC chip (9) are formed. 8) The IC card according to claim 1, wherein the IC card is electrically connected by an anisotropic conductive adhesive paste.
なる、少なくとも片面に渦巻き状のアンテナ回路（１
１）とアンテナ回路（１１）の起点のランド部（１１
１）と終点のランド部（１１２）とを形成し、それぞれ
のＩＣカードとなる回路層部材（１）にＩＣチップ収納
孔（１２）をあけ、別途、複数のモジュール（３）をモ
ジュール基材（２）に形成し、それぞれのモジュール
（３）に、片面にＩＣチップ（９）と接続するためのイ
ンナーリード部（２１）とジャンパ線部（２２）とアン
テナ回路（１１）との接続端子（２４）とを形成し、こ
のジャンパ線部（２２）を電気絶縁樹脂（２３）で被覆
し、インナーリード部（２１）とＩＣチップ（９）とを
電気的に接続し、モジュール基材（２）からそれぞれの
モジュール（３）を切断・分離し、そのモジュール
（３）上のＩＣチップ（９）が回路層部材（１）のＩＣ
チップ収納孔（１２）に嵌合するように重ねると共に、
回路層部材（１）のアンテナ回路（１１）の起点のラン
ド部（１１１）と終点のランド部（１１２）とをモジュ
ール（３）の接続端子（２４）に電気的に接続し、その
上に感圧性および／または感熱性の接着剤（４）を塗布
したカード表層材（６）を重ね、加圧・加熱して積層接
着することを特徴とするＩＣカードの製造法。3. A spiral antenna circuit (1) having a plurality of IC cards on at least one side, which is provided on a circuit layer member (1).
1) and the land (11) at the starting point of the antenna circuit (11).
1) and a land portion (112) at the end point are formed, an IC chip housing hole (12) is opened in the circuit layer member (1) to be each IC card, and a plurality of modules (3) are separately provided on a module base material. (2) Each module (3) has, on one surface, a connection terminal for connecting an inner lead (21), a jumper wire (22), and an antenna circuit (11) for connection to an IC chip (9). (24), the jumper wire portion (22) is covered with an electrically insulating resin (23), the inner lead portion (21) and the IC chip (9) are electrically connected to each other, and the module base material ( Each module (3) is cut and separated from 2), and the IC chip (9) on the module (3) is used as the IC of the circuit layer member (1).
While overlapping so as to fit in the chip storage hole (12),
The land (111) at the starting point and the land (112) at the ending point of the antenna circuit (11) of the circuit layer member (1) are electrically connected to the connection terminal (24) of the module (3). A method for manufacturing an IC card, comprising: stacking a card surface material (6) coated with a pressure-sensitive and / or heat-sensitive adhesive (4), and applying pressure and heat to laminate.
ＩＣチップ（９）を接続するためのインナーリード部
（２１）と、ＩＣチップ（９）とを、異方導電性接着フ
ィルム（８）または異方導電性接着ペーストにより電気
的に接続することを特徴とする請求項３に記載のＩＣカ
ードの製造法。4. An IC chip (9) and an inner lead portion (21) for connecting the IC chip (9) formed on the surface of the module substrate (2) are connected to an anisotropic conductive adhesive film ( 8) The method of manufacturing an IC card according to claim 3, wherein the connection is made electrically by an anisotropic conductive adhesive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2963598A JP3951409B2 (en) | 1998-02-12 | 1998-02-12 | IC card and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2963598A JP3951409B2 (en) | 1998-02-12 | 1998-02-12 | IC card and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11232415A true JPH11232415A (en) | 1999-08-27 |
| JP3951409B2 JP3951409B2 (en) | 2007-08-01 |
Family
ID=12281552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2963598A Expired - Fee Related JP3951409B2 (en) | 1998-02-12 | 1998-02-12 | IC card and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3951409B2 (en) |
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| WO2000025264A1 (en) * | 1998-10-22 | 2000-05-04 | Henkel Kommanditgesellschaft Auf Aktien | Hot-melt adhesive component layers for smart cards |
| JP2001319203A (en) * | 2000-05-08 | 2001-11-16 | Dainippon Printing Co Ltd | Non-contact data carrier |
| JP2002008067A (en) * | 2000-06-20 | 2002-01-11 | Toshiba Corp | Wireless ticket-issuing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000025264A1 (en) * | 1998-10-22 | 2000-05-04 | Henkel Kommanditgesellschaft Auf Aktien | Hot-melt adhesive component layers for smart cards |
| JP2001319203A (en) * | 2000-05-08 | 2001-11-16 | Dainippon Printing Co Ltd | Non-contact data carrier |
| JP2002008067A (en) * | 2000-06-20 | 2002-01-11 | Toshiba Corp | Wireless ticket-issuing machine |
| JP4528421B2 (en) * | 2000-06-20 | 2010-08-18 | 株式会社東芝 | Wireless ticket issuing machine |
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| JP2002298107A (en) * | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | Contactless ic medium and manufacturing method thereof |
| JP2002298108A (en) * | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | Interposer for contactless ic medium and manufacturing method thereof |
| JP2003006601A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Method for forming rf-id media by using insulating adhesive |
| JP2003006594A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using both-side tape |
| JP2003006600A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Formation method for rf-id medium using conductive staple |
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| JP2003006602A (en) * | 2001-06-22 | 2003-01-10 | Toppan Forms Co Ltd | Method for forming rf-id media |
| JP2003044809A (en) * | 2001-07-30 | 2003-02-14 | Toppan Forms Co Ltd | Security ic label of interposer type |
| JP2003044818A (en) * | 2001-07-31 | 2003-02-14 | Toppan Forms Co Ltd | Method for manufacturing combination type ic card |
| JP2007280343A (en) * | 2006-02-10 | 2007-10-25 | Fujitsu Ltd | Rfid tag manufacturing method and rfid tag |
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