JPH11198104A - Cooling device for planing machine - Google Patents
Cooling device for planing machineInfo
- Publication number
- JPH11198104A JPH11198104A JP601198A JP601198A JPH11198104A JP H11198104 A JPH11198104 A JP H11198104A JP 601198 A JP601198 A JP 601198A JP 601198 A JP601198 A JP 601198A JP H11198104 A JPH11198104 A JP H11198104A
- Authority
- JP
- Japan
- Prior art keywords
- motor
- semiconductor element
- air blow
- heat
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Milling, Drilling, And Turning Of Wood (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、切削刃物を回転さ
せるモータを半導体素子で制御を行うかんな盤の半導体
素子の冷却装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for cooling a semiconductor element of a planer board in which a motor for rotating a cutting blade is controlled by a semiconductor element.
【０００２】[0002]
【従来の技術】従来の装置は、例えば実公昭６２−３２
７８７号公報に記載のように、半導体素子をモータのフ
ィールドコアに取付け、該フィールドコアを半導体素子
の放熱部材として共用していた。また、その他に、半導
体素子専用の放熱器を設け、モータ冷却風入口側又は風
路中に放熱器を配置していた。2. Description of the Related Art A conventional apparatus is disclosed, for example, in Japanese Utility Model Publication No.
As described in Japanese Patent No. 787, a semiconductor element is attached to a field core of a motor, and the field core is commonly used as a heat radiating member of the semiconductor element. In addition, a radiator dedicated to the semiconductor element is provided, and the radiator is disposed on the motor cooling air inlet side or in the air path.
【０００３】[0003]
【発明が解決しようとする課題】前者の場合、モータの
フィールドコア自体が発熱部材であり冷却効果が低いば
かりでなく、モータのフィールドコアと半導体素子の発
熱は、モータに流れる電流に比例するため、電流が多く
半導体素子に流れたときは、多くの放熱を必要とする
が、モータも同時に高温となるため、半導体素子の冷却
効果はさらに低下していた。In the former case, not only is the field core of the motor itself a heat generating member and the cooling effect is low, but also the heat generated by the field core of the motor and the semiconductor element is proportional to the current flowing through the motor. When a large amount of current flows through the semiconductor element, a large amount of heat is required. However, the temperature of the motor also rises at the same time, so that the cooling effect of the semiconductor element is further reduced.
【０００４】後者の半導体素子の放熱器を専用に設ける
ものにあっては、半導体素子の消費電力が大きくなるに
従い、高価な放熱部材が必要とされるため、装置全体の
生産コストが大幅に上昇していた。さらに、冷却風を切
屑の排出風として使用しているものにあっては、風路上
にひだが多く非常に空気摩擦抵抗の大きい放熱器を特設
していることから、風量の減少、冷却風吸入時に入るゴ
ミで、放熱器やこれに取り付けた半導体素子の損傷を招
いていた。In the latter type, in which a radiator for a semiconductor element is provided exclusively, as the power consumption of the semiconductor element increases, an expensive radiating member is required, so that the production cost of the entire apparatus is greatly increased. Was. In addition, when the cooling air is used as the air for discharging chips, a radiator with many folds on the air path and extremely high air friction resistance is specially installed. Occasional dust caused damage to the radiator and the semiconductor element attached thereto.
【０００５】本発明の目的は、上記した従来技術の問題
点を解消し、半導体素子の冷却を安価な構成で、かつ効
率よく行うことである。An object of the present invention is to solve the above-mentioned problems of the prior art and to efficiently cool a semiconductor element with an inexpensive configuration.
【０００６】[0006]
【課題を解決するための手段】上記目的は、半導体素子
により制御されるモータで回転駆動する切削刃物と該モ
ータの冷却風を切削屑の排出風としているかんな盤にお
いて、前記モータの冷却風吸入口から切削屑の排出口ま
での間の送風路を形成する部材の全部もしくは一部に熱
伝導性の部材を用い、該熱伝導性の部材の風路側の反対
側に、前記半導体素子の発熱部を密着固定することによ
り達成される。SUMMARY OF THE INVENTION It is an object of the present invention to provide a cutting blade which is driven by a motor controlled by a semiconductor device and which is driven by a motor, and a cooling air for the motor which is used to discharge cutting dust. A heat conductive member is used for all or a part of a member forming an air passage from a mouth to an outlet for cutting chips, and heat generated by the semiconductor element is provided on the side opposite to the air passage side of the heat conductive member. This is achieved by tightly fixing the parts.
【０００７】[0007]
【発明の実施の形態】本発明に係るかんな盤の実施形態
を図１〜図３を用いて説明する。図1はかんな盤の斜視
図、図２は図1の背面図、図３は図２のＡ−Ａ線断面図
である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a planer according to the present invention will be described with reference to FIGS. 1 is a perspective view of a planer board, FIG. 2 is a rear view of FIG. 1, and FIG. 3 is a sectional view taken along line AA of FIG.
【０００８】図において、ベース１上に４本のコラム２
により支持されているヘッド３が設けられている。ベー
ス１とヘッド３の間にコラム２を案内として上下動する
テーブル１３が設けられ、このテーブル１３は、ハンド
ル２０を回すことにより回転方向切換手段１５を介し
て、ベース１の膨部１ａの螺条孔と螺合する螺合部１６
ａを有するフィードスクリュ１６の螺合関係によって上
下動する。In the figure, four columns 2 are provided on a base 1.
Is provided. A table 13 is provided between the base 1 and the head 3 and moves up and down by using the column 2 as a guide. Threaded part 16 to be screwed with the strip hole
It moves up and down due to the screwing relationship of the feed screw 16 having a.
【０００９】ヘッド３にはモータ４が設けられ、このモ
ータ４にはモータ４の冷却風５と切屑６の排出風７を発
生させるファン８が設けられている。冷却風５は、熱伝
導部材を材料として風路を形成するモータハウジング９
の吸入口Ｂから入り、モータハウジング９により冷却風
５がモータ４に案内され、また、モータ４を冷却した排
出風７は、熱伝導部材を材料として風路を形成するかん
な胴ハウジング１０により案内され、排出口Ｃより切屑
６とともに排出される。なお、熱伝導部材を材料を使用
するモータハウジング９、かんな胴ハウジング１０は、
主にアルミ、板金等を使用している。The head 3 is provided with a motor 4, and the motor 4 is provided with a fan 8 for generating a cooling air 5 for the motor 4 and an exhaust air 7 for discharging chips 6. The cooling air 5 is supplied to a motor housing 9 that forms an air path using a heat conducting member as a material.
The cooling air 5 is guided to the motor 4 by the motor housing 9, and the discharged air 7 that has cooled the motor 4 is guided by the planer trunk housing 10 that forms an air path using a heat conducting member as a material. Is discharged together with the chips 6 from the discharge port C. In addition, the motor housing 9 and the planer trunk housing 10 using the heat conductive member as a material are:
It mainly uses aluminum and sheet metal.
【００１０】かんな胴ハウジング１０内側にモータ４に
よりベルト１４を介して回転駆動する切削刃物１１を有
するかんな胴１２がかんな胴ハウジング１０の下側に切
削刃物１１を露出する形で設けられている。A planer cylinder 12 having a cutting blade 11 rotationally driven by a motor 4 via a belt 14 inside a planer trunk housing 10 is provided below the planer trunk housing 10 so as to expose the cutting blade 11.
【００１１】モータハウジング９の風路の反対側に半導
体素子となる双方向サイリスタ１７の発熱部１７ａを密
着固定させている。本実施形態では、モータハウジング
９に双方向サイリスタ１７の発熱部１７ａを取付けてい
るが、風路を形成するかんな胴ハウジング１０に密着固
定しても構わない。双方向サイリスタ１７は、制御回路
１８により制御され、モータ４の回転数を制御する。A heat generating portion 17a of a bidirectional thyristor 17 serving as a semiconductor element is closely fixed to the motor housing 9 on the side opposite to the air path. In the present embodiment, the heat generating portion 17a of the bidirectional thyristor 17 is attached to the motor housing 9, but it may be fixed to the planer trunk housing 10 that forms an air path. The bidirectional thyristor 17 is controlled by the control circuit 18 and controls the rotation speed of the motor 4.
【００１２】上記構成において、ハンドル２０を回し、
テーブル１３とヘッド３の間隔を被切削材１９の高さと
同じにする。次に、制御回路１８により双方向サイリス
タ１７をオン状態とし、モータ４を回転させる。次に、
被切削材１９をかんな胴１２側より挿入する。モータ４
の回転と同時にファン８が回転し、モータハウジング９
の吸入口Ｂから冷却風５が入り、モータハウジング９及
びかんな胴ハウジング１０を案内として排出口Ｃから排
出される。モータハウジング９の内側にモータ４の冷却
風５が流れるため、モータハウジング９が冷却され、モ
ータハウジング９に設けられている双方向サイリスタ１
７の発熱部１７ａも同時に冷却される。また、双方向サ
イリスタ１７の発熱部１７ａをかんな胴ハウジング１０
に密着固定しても、風路上の反対側に双方向サイリスタ
１７が設けられているので、切屑６の排出風７の流れを
妨げることがなく、双方向サイリスタ１７を冷却するこ
とができる。In the above configuration, the handle 20 is turned,
The distance between the table 13 and the head 3 is made equal to the height of the workpiece 19. Next, the bidirectional thyristor 17 is turned on by the control circuit 18 and the motor 4 is rotated. next,
The workpiece 19 is inserted from the planer barrel 12 side. Motor 4
The fan 8 rotates simultaneously with the rotation of the motor housing 9.
The cooling air 5 enters from the suction port B of FIG. Since the cooling air 5 of the motor 4 flows inside the motor housing 9, the motor housing 9 is cooled, and the bidirectional thyristor 1 provided in the motor housing 9 is provided.
7 is also cooled at the same time. Further, the heat generating portion 17a of the bidirectional thyristor 17 is connected to the plane
Even if the two-way thyristor 17 is provided on the opposite side of the air path, the two-way thyristor 17 can be cooled without obstructing the flow of the exhaust air 7 from the chips 6.
【００１３】[0013]
【発明の効果】本発明によれば、半導体素子により制御
されるモータの冷却風を切屑の排出風に利用するかんな
盤において、風路を形成する部材の一部もしくは全部を
熱伝導性の部材を用い、この熱伝導性の部材の風路の反
対側に半導体素子を設置するようにしたので、モータの
冷却風、切屑の排出風の風量を減少させることがなく、
かつ、従来、半導体素子の別に設けた放熱器やこの放熱
器に取付けた半導体素子がゴミにより損傷するのを防ぐ
ことができる。また、半導体素子の専用の放熱器を必要
としないため、装置全体のコストを安価にできる。According to the present invention, in a planer board utilizing cooling air of a motor controlled by a semiconductor device for air for discharging chips, a part or all of a member forming an air path is made of a heat conductive member. The semiconductor element is installed on the opposite side of the air path of the heat conductive member, so that the cooling air of the motor and the amount of air discharged from the chips are not reduced,
Further, it is possible to prevent the radiator provided separately from the semiconductor element and the semiconductor element attached to the radiator from being damaged by dust. Further, since a dedicated radiator for the semiconductor element is not required, the cost of the entire apparatus can be reduced.
【図１】本発明の実施形態を示すかんな盤の斜視図であ
る。FIG. 1 is a perspective view of a planing board showing an embodiment of the present invention.
【図２】図１の背面図である。FIG. 2 is a rear view of FIG.
【図３】図２のＡ−Ａ線断面図である。FIG. 3 is a sectional view taken along line AA of FIG. 2;
３はヘッド、４はモータ、８はファン、９はモータハウ
ジング、１０はかんな胴ハウジング、１７は双方向サイ
リスタ。3 is a head, 4 is a motor, 8 is a fan, 9 is a motor housing, 10 is a planer trunk housing, and 17 is a bidirectional thyristor.
Claims (1)
転駆動する切削刃物と該モータの冷却風を切削屑の排出
風としているかんな盤において、前記モータの冷却風吸
入口から切削屑の排出口までの間の送風路を形成する部
材の全部もしくは一部に熱伝導性の部材を用い、該熱伝
導性の部材の風路側の反対側に、前記半導体素子の発熱
部を密着固定したことを特徴とするかんな盤の冷却装
置。1. A cutting blade which is rotationally driven by a motor controlled by a semiconductor element and a cutting board which uses a cooling air of the motor as a discharge air of cutting chips, from a cooling air suction port of the motor to a discharge port of cutting chips. A heat conductive member is used for all or a part of a member forming an air passage between the heat conductive members, and a heat generating portion of the semiconductor element is tightly fixed to a side of the heat conductive member opposite to an air path side. And planer board cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00601198A JP4165917B2 (en) | 1998-01-14 | 1998-01-14 | Planer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00601198A JP4165917B2 (en) | 1998-01-14 | 1998-01-14 | Planer board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11198104A true JPH11198104A (en) | 1999-07-27 |
| JP4165917B2 JP4165917B2 (en) | 2008-10-15 |
Family
ID=11626784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00601198A Expired - Fee Related JP4165917B2 (en) | 1998-01-14 | 1998-01-14 | Planer board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4165917B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018180896A1 (en) * | 2017-03-31 | 2018-10-04 | 株式会社マキタ | Electric power tool |
| CN112223431A (en) * | 2019-07-15 | 2021-01-15 | 株式会社牧田 | Automatic planer |
| CN112223433A (en) * | 2019-07-15 | 2021-01-15 | 株式会社牧田 | Automatic planer |
-
1998
- 1998-01-14 JP JP00601198A patent/JP4165917B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018180896A1 (en) * | 2017-03-31 | 2018-10-04 | 株式会社マキタ | Electric power tool |
| JPWO2018180896A1 (en) * | 2017-03-31 | 2020-03-12 | 株式会社マキタ | Electric tool |
| CN112223431A (en) * | 2019-07-15 | 2021-01-15 | 株式会社牧田 | Automatic planer |
| CN112223433A (en) * | 2019-07-15 | 2021-01-15 | 株式会社牧田 | Automatic planer |
| US11396111B2 (en) | 2019-07-15 | 2022-07-26 | Makita Corporation | Thickness planer |
| US11504876B2 (en) | 2019-07-15 | 2022-11-22 | Makita Corporation | Thickness planer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4165917B2 (en) | 2008-10-15 |
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