JPH11195889A - Heat radiating part for printed board - Google Patents
Heat radiating part for printed boardInfo
- Publication number
- JPH11195889A JPH11195889A JP9368112A JP36811297A JPH11195889A JP H11195889 A JPH11195889 A JP H11195889A JP 9368112 A JP9368112 A JP 9368112A JP 36811297 A JP36811297 A JP 36811297A JP H11195889 A JPH11195889 A JP H11195889A
- Authority
- JP
- Japan
- Prior art keywords
- heat radiating
- heat
- circuit board
- printed circuit
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、プリント基板に
実装する電子部品の放熱を行うためのプリント基板用放
熱部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating component for a printed board for radiating heat of an electronic component mounted on the printed board.
【０００２】[0002]
【従来の技術】従来より、プリント基板に実装される電
子部品の放熱の手段として、図５に示すようなヒートシ
ンク１が一般に採用されている。すなわち、プリント基
板２に実装する例えばパワートランジスタ等の電子部品
３に近接してアルミ等によるヒートシンク（放熱板）１
をねじ４で固定し、このヒートシンク１に電子部品３の
ケース３ｂ部分を密着固定する。２ａは電子部品３のリ
ード３ａを挿入するリード挿入穴である。2. Description of the Related Art Conventionally, a heat sink 1 as shown in FIG. 5 has been generally employed as a means for radiating electronic components mounted on a printed circuit board. That is, a heat sink (radiator plate) 1 made of aluminum or the like is provided close to an electronic component 3 such as a power transistor mounted on the printed circuit board 2.
Is fixed with screws 4, and the case 3 b portion of the electronic component 3 is tightly fixed to the heat sink 1. Reference numeral 2a denotes a lead insertion hole into which the lead 3a of the electronic component 3 is inserted.
【０００３】[0003]
【発明が解決しようとする課題】上記のヒートシンク１
を取り付ける放熱手段は、プリント基板２の表面積を大
きく占めるので、近年のプリント基板の実装の高密度化
が進む中で、ヒートシンクのためのスペースを確保する
ことが困難になってきている。SUMMARY OF THE INVENTION The above-described heat sink 1
Since the heat dissipating means for occupying the printed circuit board occupies a large surface area of the printed circuit board 2, it has become difficult to secure a space for a heat sink in recent years as the mounting density of the printed circuit board increases.
【０００４】そこで、プリント基板のリード挿入穴の近
傍のはんだ面パターンにレジストカットを設け（はんだ
面パターンのレジスト（はんだレジスト）を一定範囲だ
け除去し）、このレジストカットした部分のパターン上
にはんだ盛りするレジストカット・はんだ盛り方式も行
われている。この場合、電子部品の熱はリードを経て前
記はんだ盛り部分に伝わり、このはんだ盛り部分から放
熱されることになる。しかし、この方式は、放熱部が基
板面に平面的に形成されたもので放熱の効率は良好でな
く、放熱効果は十分でない。Therefore, a resist cut is made on the solder surface pattern near the lead insertion hole of the printed circuit board (resist of the solder surface pattern (solder resist) is removed only to a certain extent). A resist-cut / solder-pumping method is also used. In this case, the heat of the electronic component is transmitted to the solder pile via the lead, and is radiated from the solder pile. However, in this method, since the heat radiating portion is formed in a plane on the substrate surface, the heat radiating efficiency is not good, and the heat radiating effect is not sufficient.
【０００５】本発明は上記従来の欠点を解消するために
なされたもので、プリント基板の表面積を広く占めずに
十分な放熱効果を得ることができるプリント基板用放熱
部品を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and an object of the present invention is to provide a heat radiating component for a printed circuit board which can obtain a sufficient heat radiating effect without occupying a large surface area of the printed circuit board. I do.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決する本発
明のプリント基板用放熱部品は、プリント基板に実装さ
れる電子部品の放熱を行うためにプリント基板に取り付
けられるプリント基板用放熱部品であって、プリント基
板のリード挿入穴に挿通され電子部品のリードとともに
プリント基板にはんだ付けされる取付部と、この取付部
と一体で基板面から立ち上がった放熱部とを備えたこと
を特徴とする。According to the present invention, there is provided a heat radiating component for a printed circuit board, which is mounted on the printed circuit board to radiate heat of electronic components mounted on the printed circuit board. A mounting portion that is inserted into the lead insertion hole of the printed circuit board and soldered to the printed circuit board together with the lead of the electronic component; and a heat radiating portion that rises from the substrate surface integrally with the mounting portion.
【０００７】請求項２は、前記取付部がハトメ構造をな
すことを特徴とする。また、請求項３は、前記放熱部
が、電子部品と反対側でリードを囲む筒状をなし、かつ
周方向に間隔をあけた複数の縦スリットを持つことを特
徴とする。According to a second aspect of the present invention, the mounting portion has an eyelet structure. According to a third aspect of the present invention, the heat radiating portion has a cylindrical shape surrounding the lead on the side opposite to the electronic component and has a plurality of longitudinal slits spaced in the circumferential direction.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を図１
〜図４に示した一実施例を参照して説明する。図１は本
発明の一実施例の放熱部品１１を用いてパワートランジ
スタ等の電子部品３をプリント基板２に実装した状態を
示す図、図２は図１における放熱部品１１の部分の拡大
図、図３は図２における放熱部品１１のみを上下逆にし
て示した斜視図、図４は図３の平面図である。これらの
図に示すように、この放熱部品１１は、金属板をプレス
加工により製作したものであり、プリント基板２のリー
ド挿入穴２ａに挿通され電子部品３のリード３ａととも
にプリント基板２にはんだ付けされる取付部１３と、こ
の取付部１３と一体で基板２の外部に延出する放熱部１
４とを備えている。この実施例の取付部１３はハトメ構
造をなしており、筒状部１３ａとハトメの鍔になる放射
状部１３ｂとからなっている。また、放熱部１４は、電
子部品３と反対側でリード３ａを囲む大径の円筒状をな
し、かつ、周方向に間隔をあけて複数の縦スリット１４
ａを形成した構造である。この縦スリット１４ａは、は
んだ付けの際に、はんだが内部に侵入してリード３ａを
はんだ付けできるために形成したものである。なお、放
熱部品１１の取付部１３は、後述するプリント基板２へ
のハトメ取り付けの前には図３における先端の突片１３
ｃは存在しない。FIG. 1 is a block diagram showing an embodiment of the present invention.
A description will be given with reference to the embodiment shown in FIGS. FIG. 1 is a diagram showing a state in which an electronic component 3 such as a power transistor is mounted on a printed circuit board 2 using a heat radiating component 11 according to an embodiment of the present invention. FIG. 2 is an enlarged view of a portion of the heat radiating component 11 in FIG. FIG. 3 is a perspective view showing only the heat radiating component 11 in FIG. 2 upside down, and FIG. 4 is a plan view of FIG. As shown in these figures, the heat dissipating component 11 is formed by pressing a metal plate, is inserted into a lead insertion hole 2a of the printed board 2, and is soldered to the printed board 2 together with the lead 3a of the electronic component 3. Mounting portion 13, and heat radiating portion 1 extending outside of substrate 2 integrally with mounting portion 13.
4 is provided. The mounting portion 13 of this embodiment has an eyelet structure, and includes a cylindrical portion 13a and a radial portion 13b serving as a collar of the eyelet. The heat radiating portion 14 has a large-diameter cylindrical shape surrounding the lead 3a on the side opposite to the electronic component 3, and has a plurality of vertical slits 14 spaced apart in the circumferential direction.
This is a structure in which a is formed. The vertical slits 14a are formed so that the solder can penetrate inside and solder the leads 3a at the time of soldering. The mounting portion 13 of the heat dissipating component 11 has a protrusion 13 at the front end in FIG.
c does not exist.
【０００９】上記の放熱部品１１を用いて、電子部品３
をプリント基板２に実装する場合、プリント基板２に予
め放熱部品１１を取り付ける。この場合、プリント基板
２のリード挿入穴２ａに放熱部品１１の取付部１３の筒
状部１３ａを挿入し、先端側を押し潰すことにより、図
２の状態（ただし、はんだはなし）に取り付けられる。
そして、種々の電子部品とともに、当該電子部品３をそ
のリード３ａをプリント基板２のリード挿入穴２ａに挿
入して装着し、次いではんだ付け工程に送り、放熱部品
１１をパターン１７上のはんだレジスト１５にはんだ付
けする。１６ははんだを示す。このように、電子部品３
の実装と同時に放熱部品１１の取り付けが行われること
になる。[0009] By using the heat radiating component 11, the electronic component 3
Is mounted on the printed circuit board 2, the heat radiating component 11 is attached to the printed circuit board 2 in advance. In this case, the tubular portion 13a of the mounting portion 13 of the heat radiating component 11 is inserted into the lead insertion hole 2a of the printed circuit board 2 and the distal end side is crushed to be mounted in the state shown in FIG. 2 (but without solder).
Then, together with various electronic components, the electronic component 3 is mounted by inserting its leads 3 a into the lead insertion holes 2 a of the printed circuit board 2 and then sending it to the soldering process, where the heat radiating component 11 is placed on the solder resist 15 on the pattern 17. Solder to Reference numeral 16 denotes solder. Thus, the electronic component 3
The mounting of the heat radiating component 11 is performed at the same time as the mounting.
【００１０】上記のように実装された電子部品３に発生
した熱は、ケース３ｂから外部に放熱されるとともに、
リード３ａを経て放熱部品１１に伝わり、この放熱部品
１１の表面あるいはこれに接するはんだ面から放熱され
る。また、プリント基板２のパターンに生じた熱もこの
放熱部品１１により放熱される。The heat generated in the electronic component 3 mounted as described above is radiated to the outside from the case 3b.
The heat is transmitted to the heat radiating component 11 via the lead 3a, and is radiated from the surface of the heat radiating component 11 or a solder surface in contact with the heat radiating component 11. The heat generated in the pattern of the printed circuit board 2 is also radiated by the heat radiating component 11.
【００１１】上述のように、従来のヒートシンク１のよ
うな大きな放熱部品を必要とせずに、電子部品の放熱が
可能となる。そして、本発明の放熱部品は、部品自体が
簡単な構造で安価であるとともに、その取り付けのため
に、既存のプリント基板２に変更を加えることを必要と
しないので、簡便であり、安価な実装が可能となる。放
熱部品１１をプリント基板２に取り付ける作業について
は、はんだ付け工程前の基板加工工程のなかで同時に行
うことができるので、製造工程が煩雑になることはな
い。As described above, heat can be dissipated from the electronic components without requiring large heat dissipating components such as the conventional heat sink 1. The heat radiating component of the present invention is simple and inexpensive because the component itself has a simple structure and is inexpensive, and it is not necessary to change the existing printed circuit board 2 for mounting the component. Becomes possible. The work of attaching the heat radiating component 11 to the printed circuit board 2 can be performed simultaneously in the board processing step before the soldering step, so that the manufacturing process does not become complicated.
【００１２】なお、従来のヒートシンク方式を本発明の
放熱部品１１と併用することも可能である。この場合に
は、ヒートシンクを十分小形にして、広い表面積を占め
ないようにすることができる。The conventional heat sink system can be used together with the heat radiating component 11 of the present invention. In this case, the heat sink can be made sufficiently small so as not to occupy a large surface area.
【００１３】実施例の放熱部品１１は、取付部１３がハ
トメ構造であるが、必ずしもこれに限定されない。要す
るに、リード挿入穴に電子部品のリードとともに挿入さ
れ、はんだ付けされるものであればよい。In the heat radiating component 11 of the embodiment, the mounting portion 13 has an eyelet structure, but is not necessarily limited to this. In short, what is necessary is just to be inserted into the lead insertion hole together with the lead of the electronic component and soldered.
【００１４】また、実施例の放熱部品１１は、放熱部１
４が縦スリット１４ａを持つ円筒状であるが、これもこ
の形状に限定されない。要するに、取付部１３と一体に
形成されており、かつ、熱を効率良く発散させることの
できる形状であればよい。また、この放熱部１４は電子
部品と反対側に配置することが適切であるが、スペース
があれば、電子部品と同じ側に配置することも可能であ
る。この場合、放熱部を電子部品と反対側および同じ側
の両方に形成することも可能である。The heat radiating component 11 of the embodiment includes a heat radiating portion 1.
4 is a cylindrical shape having a vertical slit 14a, but this is not limited to this shape. In short, any shape may be used as long as it is formed integrally with the mounting portion 13 and can efficiently dissipate heat. Further, it is appropriate that the heat radiating portion 14 is arranged on the side opposite to the electronic component, but if there is space, it can be arranged on the same side as the electronic component. In this case, the heat radiating portion can be formed on both the opposite side and the same side as the electronic component.
【００１５】本発明の放熱部品は、前述のパワートラン
ジスタに限らず、パワー抵抗その他種々の発熱電子部品
の実装に適用できる。The heat radiating component of the present invention is not limited to the above-described power transistor, and can be applied to mounting of a power resistor and various other heat generating electronic components.
【００１６】[0016]
【発明の効果】本発明の放熱部品は、リード挿入穴を利
用して設置するものであるから、従来のヒートシンク方
式のような大きな放熱部品を必要とせず、プリント基板
上に占める表面積も著しく狭く済むという効果が得られ
る。したがって、近年の高密度実装の要求に適合する。Since the heat radiating component of the present invention is installed using the lead insertion hole, it does not require a large heat radiating component as in the conventional heat sink system, and the surface area occupied on the printed circuit board is extremely small. The effect is obtained. Therefore, it meets the recent demand for high-density mounting.
【００１７】また、レジストカット・はんだ盛り方式の
ように基板面に平面的に放熱部が配置されたものでな
く、放熱部が基板面から立ち上がって設けられているの
で、放熱の効率が良くかつ十分な放熱面積を確保するこ
とが容易であり、したがって、十分な放熱効果を得るこ
とができるという効果を奏する。Further, the heat radiating portion is not provided in a plane on the substrate surface as in the case of the resist cut / soldering method, but is provided so as to rise from the substrate surface. It is easy to secure a sufficient heat radiation area, and therefore, it is possible to obtain a sufficient heat radiation effect.
【００１８】また、本発明の放熱部品は、部品自体が簡
単な構造で安価であるとともに、その取り付けのため
に、既存のプリント基板に変更を加えることを必要とし
ないので、簡便であり、安価な実装が可能となる。Further, the heat radiating component of the present invention is simple and inexpensive because the component itself has a simple structure and is inexpensive, and it is not necessary to change an existing printed circuit board for mounting the component. Implementation is possible.
【図１】本発明の一実施例のプリント基板用放熱部品を
用いて電子部品をプリント基板に実装した状態を示す図
である。FIG. 1 is a view showing a state in which an electronic component is mounted on a printed board using a printed board heat radiating component of one embodiment of the present invention.
【図２】図１における放熱部品部分の拡大図である。FIG. 2 is an enlarged view of a heat dissipating component in FIG.
【図３】図２における放熱部品を上下逆にして示した斜
視図である。FIG. 3 is a perspective view showing the heat radiating component in FIG. 2 upside down.
【図４】図３の平面図である。FIG. 4 is a plan view of FIG. 3;
【図５】従来の放熱部品（ヒートシンク）を用いて電子
部品をプリント基板に実装した状態を示す図である。FIG. 5 is a diagram showing a state in which electronic components are mounted on a printed circuit board using a conventional heat radiating component (heat sink).
２ プリント基板 ２ａ リード挿入穴 ３ 電子部品 ３ａ リード １１ 放熱部品 １３ 取付部 １３ａ 筒状部 １３ｂ 放射状部 １３ｃ 突片 １４ 放熱部 １４ａ 縦スリット １５ はんだレジスト １６ はんだ １７ パターン 2 Printed circuit board 2a Lead insertion hole 3 Electronic component 3a lead 11 Heat radiating component 13 Mounting portion 13a Cylindrical portion 13b Radial portion 13c Protrusion piece 14 Heat radiating portion 14a Vertical slit 15 Solder resist 16 Solder 17 Pattern
Claims (3)
熱を行うためにプリント基板に取り付けられるプリント
基板用放熱部品であって、 プリント基板のリード挿入穴に挿通され電子部品のリー
ドとともにプリント基板にはんだ付けされる取付部と、
この取付部と一体で基板面から立ち上がった放熱部とを
備えたことを特徴とするプリント基板用放熱部品。1. A heat radiating component for a printed circuit board mounted on a printed circuit board to radiate heat of an electronic component mounted on the printed circuit board. Mounting part to be soldered,
A heat dissipating component for a printed circuit board, comprising: a heat dissipating part which rises from the surface of the board integrally with the mounting part.
徴とする請求項１記載のプリント基板用放熱部品。2. The heat radiating component for a printed circuit board according to claim 1, wherein the mounting portion has an eyelet structure.
ドを囲む筒状をなし、かつ周方向に間隔をあけた複数の
縦スリットを持つことを特徴とする請求項１記載のプリ
ント基板用放熱部品。3. The printed circuit board according to claim 1, wherein the heat radiating portion has a cylindrical shape surrounding the lead on the side opposite to the electronic component, and has a plurality of longitudinal slits spaced in the circumferential direction. Heat dissipating parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9368112A JPH11195889A (en) | 1997-12-27 | 1997-12-27 | Heat radiating part for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9368112A JPH11195889A (en) | 1997-12-27 | 1997-12-27 | Heat radiating part for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11195889A true JPH11195889A (en) | 1999-07-21 |
Family
ID=18491003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9368112A Pending JPH11195889A (en) | 1997-12-27 | 1997-12-27 | Heat radiating part for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11195889A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008034873A (en) * | 2004-05-25 | 2008-02-14 | Kitani Denki Kk | Terminal box for solar cell module |
| JP2008060551A (en) * | 2006-07-20 | 2008-03-13 | Power Integrations Inc | Thermal conduit |
| JP2008130757A (en) * | 2006-11-20 | 2008-06-05 | Daikin Ind Ltd | Electrical circuit device |
| US7414228B2 (en) | 2003-04-11 | 2008-08-19 | Matsushita Electric Industrial Co., Ltd. | High frequency heating apparatus |
| CN101888168A (en) * | 2010-07-30 | 2010-11-17 | 中国北车股份有限公司大连电力牵引研发中心 | Current-variable controller cabinet |
| US8330035B2 (en) | 2004-05-25 | 2012-12-11 | Kitani Electric Co., Ltd. | Terminal box for solar cell modules |
| EP2648492A3 (en) * | 2012-04-04 | 2014-01-08 | Tellabs Oy | A system provided with a solder joint |
| US9271386B2 (en) | 2010-12-28 | 2016-02-23 | Stumitomo Electric Industries, Ltd. | Electrical apparatus and method for producing electrical apparatus |
-
1997
- 1997-12-27 JP JP9368112A patent/JPH11195889A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7414228B2 (en) | 2003-04-11 | 2008-08-19 | Matsushita Electric Industrial Co., Ltd. | High frequency heating apparatus |
| KR100989329B1 (en) * | 2003-04-11 | 2010-10-25 | 파나소닉 주식회사 | High frequency heating apparatus |
| JP2008034873A (en) * | 2004-05-25 | 2008-02-14 | Kitani Denki Kk | Terminal box for solar cell module |
| US8330035B2 (en) | 2004-05-25 | 2012-12-11 | Kitani Electric Co., Ltd. | Terminal box for solar cell modules |
| JP2008060551A (en) * | 2006-07-20 | 2008-03-13 | Power Integrations Inc | Thermal conduit |
| JP2008130757A (en) * | 2006-11-20 | 2008-06-05 | Daikin Ind Ltd | Electrical circuit device |
| CN101888168A (en) * | 2010-07-30 | 2010-11-17 | 中国北车股份有限公司大连电力牵引研发中心 | Current-variable controller cabinet |
| US9271386B2 (en) | 2010-12-28 | 2016-02-23 | Stumitomo Electric Industries, Ltd. | Electrical apparatus and method for producing electrical apparatus |
| EP2648492A3 (en) * | 2012-04-04 | 2014-01-08 | Tellabs Oy | A system provided with a solder joint |
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