JPH1117310A - Manufacture of printed board - Google Patents

Manufacture of printed board

Info

Publication number
JPH1117310A
JPH1117310A JP18187697A JP18187697A JPH1117310A JP H1117310 A JPH1117310 A JP H1117310A JP 18187697 A JP18187697 A JP 18187697A JP 18187697 A JP18187697 A JP 18187697A JP H1117310 A JPH1117310 A JP H1117310A
Authority
JP
Japan
Prior art keywords
insulating plate
layers
conductive layer
holes
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18187697A
Other languages
Japanese (ja)
Inventor
Shizuo Satou
巳津夫 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daisho Denshi Co Ltd
Original Assignee
Daisho Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daisho Denshi Co Ltd filed Critical Daisho Denshi Co Ltd
Priority to JP18187697A priority Critical patent/JPH1117310A/en
Publication of JPH1117310A publication Critical patent/JPH1117310A/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the opening position errors of holes caused by the elongation/ contraction of materials in laser processing without requiring any image film by sequentially forming conductive layers and resist layers on both surfaces of an electric insulating plate and forming the holes with a laser processing, and then, removing the resist layers after circuits are formed by removing conductive parts in unnecessary sections. SOLUTION: After conductive layers 2 and resist layers are sequentially formed on both surfaces of an electric insulating plate 1, holes are formed to one of the conductive layers 2 through the insulating plate 1 with a laser beam in accordance with the design patterns of circuits. At this point, the laser beam projecting positions are corrected in conformity wit the expansion/contraction of the plate 1 and layer 2. After the parts of the layers 2 which are not protected with the resist layers are removed and circuits are formed on both surfaces of the plate 1, the resist layers are removed. In addition, groove holes 5 are formed to the conductive layer 2 on the opposite side through the parts of the insulating plate 1 corresponding to circuit connecting spots on both surfaces of the plate 1 with the laser processing and the surfaces of the layers 2 and holes 5 are plated with a conductive metal 6, and then the circuits formed on both surfaces of the plate 1 are electrically connected to each other.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント基板の製
造方法に関する。
The present invention relates to a method for manufacturing a printed circuit board.

【0002】[0002]

【従来の技術】電気絶縁板の両面に回路を形成し、両側
の回路を要所で電気的に接触させたプリント基板が公知
である。従来、このようなプリント基板は以下のような
工程で製造される。まず、電気絶縁板の両面に銅箔を付
着させ、その表面にパターン形成用の感光レジスト層を
設け、さらにその表面に回路のパターンに応じて孔が穿
設されたイメージフィルムを載せる。次に、イメージフ
ィルムの外面から紫外線を照射し、イメージフィルムの
孔の部分に相当する感光レジスト層を露光させた後、現
像処理を行って露光されない部分の感光レジスト層を除
去する。
2. Description of the Related Art A printed circuit board is known in which circuits are formed on both sides of an electric insulating plate, and the circuits on both sides are electrically contacted at important points. Conventionally, such a printed circuit board is manufactured by the following steps. First, copper foil is adhered to both sides of an electric insulating plate, a photosensitive resist layer for pattern formation is provided on the surface thereof, and an image film having holes formed thereon in accordance with a circuit pattern is placed on the surface. Next, the photosensitive resist layer corresponding to the holes of the image film is exposed by irradiating ultraviolet rays from the outer surface of the image film, and then subjected to a developing treatment to remove the unexposed portions of the photosensitive resist layer.

【0003】次いで、銅箔の感光レジスト層で保護され
ていない部分をエッチング液で取り除き、電気絶縁板の
両面に回路を形成する。さらに、感光レジスト層を剥離
した後、両側の回路を導通する箇所において、電気絶縁
板の表面から逆側の銅箔に達する溝穴を、レーザー加工
によって形成する。次に、銅箔及び溝穴の表面に銅鍍金
を施して、電気絶縁板の両面の回路を導通させる。
[0003] Next, portions of the copper foil that are not protected by the photosensitive resist layer are removed with an etchant to form circuits on both sides of the electrical insulating plate. Further, after the photosensitive resist layer is peeled off, a groove extending from the surface of the electrical insulating plate to the copper foil on the opposite side is formed by laser processing at a place where the circuits on both sides are conducted. Next, copper plating is applied to the surfaces of the copper foil and the slots, so that the circuits on both surfaces of the electric insulating plate are conducted.

【0004】ところで、上記従来の方法では、回路のパ
ターンに応じて孔を形成したイメージフィルムが必要で
あり、通常、厚手の透明フィルムに乳剤を塗ったイメー
ジフィルムが使用される。しかし、このようなイメージ
フィルムは伸び縮みしやすいので、特に大型のプリント
基板の場合は、他の材料との伸縮率の差によって回路の
パターンに誤差が生じやすい。このため、イメージフィ
ルムの管理や検査に手間がかかるばかりか、イメージフ
ィルムを重ねる作業は、細心の注意を払いながら手作業
によって目視で行わなければならず、イメージフィルム
に皺がよらないようにエア抜きをしなければならない。
In the above-mentioned conventional method, an image film having holes formed in accordance with a circuit pattern is required. In general, an image film in which a thick transparent film is coated with an emulsion is used. However, since such an image film easily expands and contracts, especially in the case of a large-sized printed circuit board, an error is likely to occur in a circuit pattern due to a difference in expansion and contraction ratio with other materials. For this reason, it takes time and effort to manage and inspect the image film, and the work of layering the image film must be performed manually and visually, with the utmost care. I have to pull it out.

【0005】また、イメージフィルムを重ねた後も、感
光レジスト層の露光及び現像等の面倒な工程が必要であ
る。しかも、感光レジストとしてドライ・フィルムを用
いると、フィルム厚が比較的厚いので露光時にずれが生
じやすく、液状レジストを用いると、塗布むらによるピ
ンホールが発生しやすい。
Further, even after the image films are stacked, complicated steps such as exposure and development of the photosensitive resist layer are required. In addition, when a dry film is used as the photosensitive resist, the film thickness is relatively large, so that a shift is likely to occur at the time of exposure. When a liquid resist is used, pinholes due to uneven coating are likely to occur.

【0006】[0006]

【発明が解決しようとする課題】本発明は、精度が高
く、工程が簡単で部品管理等に手間がかからず、コスト
が低廉なプリント基板の製造方法を提供することを目的
とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a printed circuit board which has high accuracy, is simple in process, requires no trouble in parts management, and is inexpensive.

【0007】[0007]

【課題を解決するための手段】本発明のプリント基板の
製造方法は、上記課題を達成するために、電気絶縁板の
表面に導電層を形成し、その表面にレジスト層を形成
し、次に、前記レジスト層に導電層に達する穴を、回路
の設計パターンに合わせてレーザー加工により形成し、
次いで、該穴に相当する不要部分の導電層をエッチング
液で除去して回路を形成した後、レジスト層を除去す
る。レジスト層に直接レーザー加工により穴を形成する
ことにより、イメージフィルムが不要となり、イメージ
フィルムの貼着や感光レジスト層の露光及び現像の手間
が省ける。レーザー加工時に位置補正することにより、
材料の伸縮等に基づく穴開け位置の誤差を防ぐ。
According to a method of manufacturing a printed circuit board of the present invention, a conductive layer is formed on a surface of an electric insulating plate, a resist layer is formed on the surface, and A hole reaching the conductive layer in the resist layer is formed by laser processing in accordance with a circuit design pattern,
Next, an unnecessary portion of the conductive layer corresponding to the hole is removed with an etchant to form a circuit, and then the resist layer is removed. By forming a hole in the resist layer directly by laser processing, an image film is not required, and labor for attaching the image film and exposing and developing the photosensitive resist layer can be omitted. By correcting the position during laser processing,
Prevents errors in the drilling position due to expansion and contraction of the material.

【0008】電気絶縁板の両面に導電層を形成し、その
表面にレジスト層を形成し、次に、前記レジスト層に導
電層に達する穴を、回路の設計パターンに合わせてレー
ザー加工により形成し、次いで、該穴に相当する不要部
分の導電層をエッチング液で除去して回路を形成し、さ
らに、前記レジスト層を除去した後、前記電気絶縁板に
逆側の導電層に達する溝穴をレーザー加工により形成
し、次に、導電層及び溝穴の表面に鍍金処理して両面の
回路を導通することも可能である。
A conductive layer is formed on both sides of an electric insulating plate, a resist layer is formed on the surface thereof, and a hole reaching the conductive layer is formed in the resist layer by laser processing in accordance with a circuit design pattern. Then, an unnecessary portion of the conductive layer corresponding to the hole is removed with an etchant to form a circuit, and further, after removing the resist layer, a slot reaching the conductive layer on the opposite side of the electric insulating plate is formed. It is also possible to form by laser processing and then to perform plating on the surfaces of the conductive layer and the slots to conduct the circuits on both sides.

【0009】[0009]

【発明の実施の形態】図1乃至図6はプリント基板の製
造工程を示す。プリント基板を製造するには、まず、図
1に示すように、基体となる電気絶縁板1の表面に銅箔
よりなる導電層2を形成し、その表面にレジスト層3を
形成する。電気絶縁板1は、プリント基板の用途や必要
とする精度等に応じて、ポリイミド樹脂、エポキシ系樹
脂をガラス・合成繊維等に含浸させた素材、コンポジッ
ト材等から適宜選択する。また、レジスト層3は耐薬品
性を有する合成樹脂を素材とし、合成樹脂フィルムであ
っても、剥離可能なインクであっても良い。
1 to 6 show a manufacturing process of a printed circuit board. To manufacture a printed board, first, as shown in FIG. 1, a conductive layer 2 made of copper foil is formed on the surface of an electric insulating plate 1 serving as a base, and a resist layer 3 is formed on the surface. The electric insulating plate 1 is appropriately selected from a material obtained by impregnating glass, synthetic fiber, or the like with a polyimide resin, an epoxy resin, or the like, a composite material, or the like, according to the use of the printed circuit board, the required accuracy, and the like. The resist layer 3 is made of a synthetic resin having chemical resistance, and may be a synthetic resin film or a peelable ink.

【0010】次に、図2に示すように、回路の設計パタ
ーンに応じて、レジスト層3にレーザー加工により導電
層2に達する穴4を形成する。この穴4は、導電層2の
不要部分に対応して形成される。また、この時、電気絶
縁板1及び導電層2の伸縮に合わせて、レーザー加工す
る位置を補正する。
Next, as shown in FIG. 2, holes 4 reaching the conductive layer 2 are formed in the resist layer 3 by laser processing according to the circuit design pattern. The holes 4 are formed corresponding to unnecessary portions of the conductive layer 2. At this time, the laser processing position is corrected according to the expansion and contraction of the electric insulating plate 1 and the conductive layer 2.

【0011】次いで、図3に示すように、導電層2のレ
ジスト層3で保護されていない部分を塩化第二鉄等のエ
ッチング液で取り除いて、電気絶縁板1の両面に回路を
形成した後、図4に示すように、残ったレジスト層3を
除去する。さらに、両面の回路の接続箇所に相当する部
分に、図5に示すように、電気絶縁板1の表面から逆側
の導電層2に達する溝穴5をレーザー加工により形成す
る。
Next, as shown in FIG. 3, portions of the conductive layer 2 which are not protected by the resist layer 3 are removed with an etchant such as ferric chloride to form circuits on both surfaces of the electric insulating plate 1. Then, as shown in FIG. 4, the remaining resist layer 3 is removed. Further, as shown in FIG. 5, a slot 5 extending from the surface of the electric insulating plate 1 to the conductive layer 2 on the opposite side is formed in a portion corresponding to a connection portion of the circuit on both surfaces by laser processing.

【0012】次に、図6に示すように、導電層2及び溝
穴5の表面に、銅等の導電金属6を20〜30μ程度の
厚みで鍍金し、電気絶縁板1の両面の回路を導通する。
この時、導電層2による回路を壊さないように、鍍金し
ない部分には鍍金レジストを予め印刷しておく。以上、
両面に回路を有するプリント基板について説明したが、
片面基板としても良い。この場合は、当然、電気絶縁板
1に導通用の溝穴5を形成する必要はない。
Next, as shown in FIG. 6, a conductive metal 6 such as copper is plated on the surface of the conductive layer 2 and the slot 5 with a thickness of about 20 to 30 μm, and the circuit on both surfaces of the electric insulating plate 1 is formed. Conduct.
At this time, a plating resist is printed in advance on portions that are not plated so as not to break the circuit formed by the conductive layer 2. that's all,
I explained about a printed circuit board with circuits on both sides,
It may be a single-sided substrate. In this case, it is not necessary to form the conductive slot 5 in the electrical insulating plate 1.

【0013】[0013]

【発明の効果】本発明によれば、感光レジスト層に直接
レーザー加工によって穴を形成するので、イメージフィ
ルムが不要であり、このため、伸縮しやすいイメージフ
ィルムの管理・検査に手間がかからず、イメージフィル
ムの貼着や感光レジストの露光及び現像等の面倒な工程
を省略することが可能である。しかも、イメージフィル
ムの伸縮による加工誤差、感光レジストの露光時のずれ
による加工誤差及び感光レジストの塗布むらによる不良
の発生を防ぐことができるばかりか、レーザー加工を施
す際に、電気絶縁板及び導電層の伸縮に応じて穴開け位
置を補正することができるため、精度が非常に高い。
According to the present invention, since a hole is formed directly in the photosensitive resist layer by laser processing, an image film is not required, and therefore, management and inspection of an easily stretchable image film is not troublesome. It is possible to omit complicated steps such as attaching an image film and exposing and developing a photosensitive resist. In addition, processing errors due to expansion and contraction of the image film, processing errors due to misregistration during exposure of the photosensitive resist, and defects due to uneven application of the photosensitive resist can be prevented. Since the position of the hole can be corrected according to the expansion and contraction of the layer, the accuracy is extremely high.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のプリント基板の製造方法の第1工程を
示す断面図
FIG. 1 is a sectional view showing a first step of a method for manufacturing a printed circuit board according to the present invention.

【図2】本発明のプリント基板の製造方法の第2工程を
示す断面図
FIG. 2 is a sectional view showing a second step of the method for manufacturing a printed circuit board according to the present invention;

【図3】本発明のプリント基板の製造方法の第3工程を
示す断面図
FIG. 3 is a sectional view showing a third step of the method for manufacturing a printed circuit board according to the present invention.

【図4】本発明のプリント基板の製造方法の第4工程を
示す断面図
FIG. 4 is a sectional view showing a fourth step of the method for manufacturing a printed circuit board according to the present invention.

【図5】本発明のプリント基板の製造方法の第5工程を
示す断面図
FIG. 5 is a sectional view showing a fifth step of the method for manufacturing a printed circuit board according to the present invention.

【図6】本発明のプリント基板の製造方法の第6工程を
示す断面図
FIG. 6 is a sectional view showing a sixth step of the method for manufacturing a printed board according to the present invention;

【符号の説明】[Explanation of symbols]

1 電気絶縁板 2 導電層 3 レジスト層 4 穴 5 溝穴 6 導電金属 DESCRIPTION OF SYMBOLS 1 Electrical insulating plate 2 Conductive layer 3 Resist layer 4 Hole 5 Slot 6 Conductive metal

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 電気絶縁板の表面に導電層を形成し、そ
の表面にレジスト層を形成し、次に、前記レジスト層に
導電層に達する穴を、回路の設計パターンに合わせてレ
ーザー加工により形成し、次いで、該穴に相当する不要
部分の導電層をエッチング液で除去して回路を形成した
後、前記レジスト層を除去することを特徴するプリント
基板の製造方法。
1. A conductive layer is formed on a surface of an electric insulating plate, a resist layer is formed on the surface, and then holes formed in the resist layer reaching the conductive layer are formed by laser processing in accordance with a circuit design pattern. Forming a circuit, removing an unnecessary portion of the conductive layer corresponding to the hole with an etchant to form a circuit, and then removing the resist layer.
【請求項2】 電気絶縁板の両面に導電層を形成し、そ
の表面にレジスト層を形成し、次に、前記レジスト層に
導電層に達する穴を、回路の設計パターンに合わせてレ
ーザー加工により形成し、次いで、該穴に相当する不要
部分の導電層をエッチング液で除去して回路を形成し、
さらに、前記レジスト層を除去した後、前記電気絶縁板
に逆側の導電層に達する溝穴をレーザー加工により形成
し、次に、前記導電層及び溝穴の表面に鍍金処理して両
面の回路を導通することを特徴とする請求項1に記載の
プリント基板の製造方法。
2. A conductive layer is formed on both sides of an electric insulating plate, a resist layer is formed on the surface thereof, and a hole reaching the conductive layer is formed in the resist layer by laser processing in accordance with a circuit design pattern. Forming, and then removing unnecessary portions of the conductive layer corresponding to the holes with an etchant to form a circuit,
Further, after removing the resist layer, a slot reaching the conductive layer on the opposite side is formed in the electric insulating plate by laser processing, and then the surface of the conductive layer and the slot is plated to form a circuit on both sides. The method for manufacturing a printed circuit board according to claim 1, wherein
JP18187697A 1997-06-24 1997-06-24 Manufacture of printed board Pending JPH1117310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18187697A JPH1117310A (en) 1997-06-24 1997-06-24 Manufacture of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18187697A JPH1117310A (en) 1997-06-24 1997-06-24 Manufacture of printed board

Publications (1)

Publication Number Publication Date
JPH1117310A true JPH1117310A (en) 1999-01-22

Family

ID=16108414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18187697A Pending JPH1117310A (en) 1997-06-24 1997-06-24 Manufacture of printed board

Country Status (1)

Country Link
JP (1) JPH1117310A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008060504A (en) * 2006-09-04 2008-03-13 Nippon Mektron Ltd Method of manufacturing double-sided flexible printed wiring board
CN107770964A (en) * 2017-10-18 2018-03-06 开平依利安达电子第三有限公司 A kind of wiring board piercing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008060504A (en) * 2006-09-04 2008-03-13 Nippon Mektron Ltd Method of manufacturing double-sided flexible printed wiring board
CN107770964A (en) * 2017-10-18 2018-03-06 开平依利安达电子第三有限公司 A kind of wiring board piercing process

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