JPH11167357A - Display unit - Google Patents

Display unit

Info

Publication number
JPH11167357A
JPH11167357A JP36747197A JP36747197A JPH11167357A JP H11167357 A JPH11167357 A JP H11167357A JP 36747197 A JP36747197 A JP 36747197A JP 36747197 A JP36747197 A JP 36747197A JP H11167357 A JPH11167357 A JP H11167357A
Authority
JP
Japan
Prior art keywords
light
substrate
led chips
reflection frame
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP36747197A
Other languages
Japanese (ja)
Other versions
JP4082768B2 (en
Inventor
Mitsuo Nishide
光男 西出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keyence Corp
Original Assignee
Keyence Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keyence Corp filed Critical Keyence Corp
Priority to JP36747197A priority Critical patent/JP4082768B2/en
Publication of JPH11167357A publication Critical patent/JPH11167357A/en
Application granted granted Critical
Publication of JP4082768B2 publication Critical patent/JP4082768B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3023—Segmented electronic displays

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To effectively shield adjacent LED chips from each other even when the LED chips are packaged in high density on a substrate. SOLUTION: On a substrate 1, plural LED chips 2 coloring in two or more colors are packaged in plural predetermined patterns. For a shield sheet 5 constituted of an elastic and insulating material, insertion holes 5b are formed in a base body 5a corresponding to the positions of LED chips 2 on the substrate. A diameter of the insertion holes 5b is selected allowing individual LED chips to be inserted. When a reflecting frame 3 used for effectively reflecting forward the light emitted from the LED chips is fixed on the substrate 1, each LED chip is covered by the shield sheet 5, therefore, there is no leakage of light between adjacent LED chips 2. Consequently, a 7-segmented segment display part 4 displays high-contrast numerals.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、基板に実装される
複数の発光源を駆動することにより、数字や文字等のキ
ャラクターを表示する表示器に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a display for displaying characters such as numerals and characters by driving a plurality of light sources mounted on a substrate.

【０００２】[0002]

【従来の技術】各種の産業用機器、家庭用電気機器等の
民生用機器においては、これらの機器の動作状態等を発
光ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏ
ｄｅ，以下ＬＥＤと略称する）等の発光源を用いて７セ
グメントで数字を表示する表示器が使用されている。こ
のような発光源に用いられるＬＥＤは、基板にＬＥＤペ
レットを実装し、ワイヤボンデングを固着して電気的導
通をとり発光源とするものや、ＬＥＤチップを発光源と
するものが知られている。ＬＥＤを用いた表示器におい
ては、ＬＥＤから放射される光を効率良く前面に反射す
るように反射枠を設けてＬＥＤの表面に被着している。2. Description of the Related Art In various types of consumer equipment such as industrial equipment and household electrical equipment, the operating state and the like of these equipment are determined by using light emitting diodes (Light Emitting Diodes).
A display that displays a number in seven segments using a light emitting source such as de (hereinafter, abbreviated as LED) is used. As the LED used for such a light emitting source, an LED pellet is mounted on a substrate, a wire bond is fixed, and electrical conduction is performed by using an LED chip. I have. In a display using an LED, a reflection frame is provided so as to efficiently reflect light emitted from the LED to the front surface, and is attached to the surface of the LED.

【０００３】図４は、上記のようなＬＥＤチップと反射
枠を用いた表示器を分解して示す斜視図である。図１に
おいて、１はＬＥＤチップ２を実装する基板で両側面に
４個所の切欠き部１ａ〜１ｄが設けられている。複数の
ＬＥＤチップ２は、７セグメントの数字で所定の桁数を
表示するように、基板１上の所定の位置に所定のパター
ンで配列されている。FIG. 4 is an exploded perspective view showing a display device using the LED chip and the reflection frame as described above. In FIG. 1, reference numeral 1 denotes a substrate on which an LED chip 2 is mounted, and four notches 1a to 1d are provided on both side surfaces. The plurality of LED chips 2 are arranged in a predetermined pattern on a predetermined position on the substrate 1 so as to display a predetermined number of digits with a number of 7 segments.

【０００４】３は基板１に固定される反射枠で、表面に
は７セグメントで数字を表示するセグメント表示部４を
形成し、ポイント４ｘにより区分されて所定の桁数を表
示する。反射枠３には凸部３ａ、３ｂが設けられてお
り、図示されていない凸部３ｃ，３ｄと共に基板１に設
けられている切欠き部１ａ〜１ｄと嵌合されて反射枠３
を基板１に固定する。[0004] Reference numeral 3 denotes a reflection frame fixed to the substrate 1. A segment display section 4 for displaying numbers in seven segments is formed on the surface, and is divided by points 4x to display a predetermined number of digits. The reflection frame 3 is provided with convex portions 3a and 3b, and is fitted together with the notches 1a to 1d provided on the substrate 1 together with the convex portions 3c and 3d (not shown) to form the reflection frame 3.
Is fixed to the substrate 1.

【０００５】図５は、図４の反射枠３を基板１に固定し
た際に、反射枠３に形成されているセグメント表示部４
のセグメント４ａ，４ｂを矢視Ａ−Ｂ方向でみた断面図
である。ＬＥＤチップ２は半田２ａ，２ｂにより基板１
に固着される。３ｅ，３ｆは反射枠３の反射壁であり、
発光源のＬＥＤチップ２から放射される光は反射壁３
ｅ，３ｆで反射しながらセグメント表示部４に到る。３
ｇは隣接するＬＥＤチップ２からの光を相互に遮断する
隔壁である。FIG. 5 shows a segment display section 4 formed on the reflection frame 3 when the reflection frame 3 of FIG.
FIG. 4 is a cross-sectional view of the segments 4a and 4b of FIG. The LED chip 2 is mounted on the substrate 1 by solders 2a and 2b.
To be fixed. 3e and 3f are reflection walls of the reflection frame 3,
The light emitted from the LED chip 2 of the light emitting source is
The light reaches the segment display unit 4 while being reflected by e and 3f. 3
g denotes a partition wall that blocks light from adjacent LED chips 2 from each other.

【０００６】図４のセグメント４ａ，４ｂに対応したＬ
ＥＤチップ２の一方を駆動し、他方を停止している場合
に、光が他方のセグメントに漏れてしまうと本来暗色で
あるべきセグメントが明色となることにより、セグメン
ト間の明暗のコントラストがあいまいとなる。隔壁３ｇ
は、このように７セグメントで表示される数字が明確に
判別されなくなることを防止するために設けられてい
る。[0006] L corresponding to the segments 4a and 4b in FIG.
When one of the ED chips 2 is driven and the other is stopped, if light leaks to the other segment, the segment that should be dark will become bright, and the contrast between light and dark between the segments will be ambiguous. Becomes 3g of partition wall
Is provided in order to prevent the numbers displayed in the seven segments from being clearly discriminated.

【０００７】ところで、最近ではＬＥＤを用いた表示器
の表示機能を多様化する試みがなされている。例えば、
同じ７セグメントで数字を表示する場合でも、１つのセ
グメントに２色以上の複数色の発色機能を持たせ、色を
変えて数字を表示することにより同じ数字の表示に異な
る意味を付与する例や、速度や音量等の物理量の変化を
バーＬＥＤにより棒グラフ形式で直線状に表示する例等
がみられる。Recently, attempts have been made to diversify the display function of a display device using LEDs. For example,
Even when displaying numbers in the same seven segments, one segment may have a color developing function of two or more colors, and a different meaning may be given to the display of the same numbers by changing the colors and displaying the numbers. In addition, there is an example in which a change in a physical quantity such as speed or volume is linearly displayed in a bar graph format by a bar LED.

【０００８】図６は、７セグメントで２色以上の発色で
数字を表示する場合の図５に対応する断面図である。こ
の場合には、単色のＬＥＤ２ｃ，２ｄを併置して基板１
に半田２ａ、２ｂにより固着する。例えば一方のＬＥＤ
２ｃは赤色に発色させ、他方のＬＥＤ２ｄは緑色に発色
させる等により、表示器では７セグメントで２色の数字
を表示する。また、ＬＥＤ２ｃ、２ｄを同時に動作させ
ると、赤色と緑色の混合色の橙色で数字を表示する。FIG. 6 is a sectional view corresponding to FIG. 5 in a case where numerals are displayed in two or more colors in seven segments. In this case, the monochromatic LEDs 2c and 2d are juxtaposed and the substrate 1
Is fixed by solders 2a and 2b. For example, one LED
2c is colored red, and the other LED 2d is colored green, so that the display device displays two-color numbers in seven segments. When the LEDs 2c and 2d are operated at the same time, a number is displayed in orange of a mixed color of red and green.

【０００９】[0009]

【発明が解決しようとする課題】このように、基板に実
装されたＬＥＤチップにより１つのセグメントを２色以
上の発色で表示する構成では、単色を表示する場合より
もＬＥＤチップの大きさは増大する。しかしながら一方
では省スペース化を図る上からも機器全体を小型化する
要請もあるので、表示器のサイズは単色のＬＥＤチップ
を設ける場合と同じ大きさのものが用いられている。こ
のため、図６の隔壁３ｇはＬＥＤチップ間の位置３ｈの
部分では幅が極めて狭くなるか、スペースがないために
この隔壁が設けられない場合があるので、隣接するＬＥ
Ｄチップからの光が漏れ表示された数字の判別がしにく
くなるという問題があった。特に、セグメント表示部４
のセグメント４ａ、４ｂ間の角部Ｃのように、セグメン
ト間の間隔の狭い部分ではこのような問題が顕著とな
る。As described above, in the configuration in which one segment is displayed in two or more colors by the LED chip mounted on the substrate, the size of the LED chip is larger than that in the case of displaying a single color. I do. However, on the other hand, there is also a demand for reducing the size of the entire device in order to save space, and therefore, the size of the display is the same as that in the case where a single-color LED chip is provided. For this reason, the partition 3g in FIG. 6 may be extremely narrow at the position 3h between the LED chips, or the partition may not be provided due to lack of space.
There is a problem that it is difficult to determine the number displayed as the light leaked from the D chip. In particular, the segment display section 4
Such a problem is remarkable in a portion where the interval between the segments is narrow, such as a corner portion C between the segments 4a and 4b.

【００１０】また、前記のように表示器の大きさが制限
されるので、２色以上を発色させるＬＥＤチップ間の間
隔も狭くしなければならず、ＬＥＤチップの基板実装作
業が困難になるという問題があった。更に、表示器の大
きさが制限される結果として前記反射枠の隔壁や反射壁
がＬＥＤチップと接触しやすくなっているために反射枠
を基板に固定する際の組立て作業が困難になり、この組
立て作業時に反射枠の隔壁によりＬＥＤチップを破損す
る恐れがあるという問題があった。In addition, since the size of the display is limited as described above, the interval between the LED chips for emitting two or more colors must be narrowed, which makes it difficult to mount the LED chips on the substrate. There was a problem. Furthermore, as a result of the size of the display being limited, the partition walls and the reflective walls of the reflective frame are more likely to come into contact with the LED chips, which makes assembly work when fixing the reflective frame to the substrate difficult. There has been a problem that the LED chip may be damaged by the partition of the reflection frame during the assembly operation.

【００１１】また、反射枠の材料として金属体を用いる
場合や、樹脂成形品に金属をメッキしたり金属を蒸着し
た部品を用いる場合には、図５のような単色又は２色以
上を発色させる表示器において、ＬＥＤチップ２を基板
１に固着する半田２ａと反射壁３ｅ間の絶縁性が損なわ
れることがあり、図５、図６の構成において、反射枠３
が基板１に形成されているパターンやスルーホールと接
触して絶縁性が損なわれるという問題があった。In the case where a metal body is used as the material of the reflection frame, or in the case where a metal part is plated or metal is deposited on a resin molded product, a single color or two or more colors as shown in FIG. In the display device, the insulation between the solder 2a for fixing the LED chip 2 to the substrate 1 and the reflection wall 3e may be impaired. In the configuration shown in FIGS.
However, there is a problem that the insulating property is impaired due to contact with a pattern or a through hole formed on the substrate 1.

【００１２】更に、表示器のサイズを大きくできないた
めに、図６において隣接するＬＥＤチップ間の位置３ｈ
にまで隔壁３ｇを延長して設けることができない場合が
ある。このような場合には、図６に対応する図７の断面
図で示すように隣接するＬＥＤチップ間にリブ３ｉを形
成して、ＬＥＤチップを基板１に実装する。このような
構成では、リブ３ｉの高さ方向の寸法を大きくして隣接
するＬＥＤチップとの遮光性を高めているが、リブ３ｉ
の高さ寸法を大きくするとリブ３ｉの先端が基板に接近
し、反射枠が基板から浮き上がり組立て精度が悪くなる
という問題がある。また、基板１とリブ３ｉの先端間に
は隙間が存在するために、この隙間から隣接するＬＥＤ
チップ間で相互に光が漏れるという問題があった。Further, since the size of the display cannot be increased, the position 3h between the adjacent LED chips in FIG.
In some cases, the partition wall 3g cannot be provided to be extended. In such a case, the ribs 3i are formed between adjacent LED chips as shown in the cross-sectional view of FIG. 7 corresponding to FIG. 6, and the LED chips are mounted on the substrate 1. In such a configuration, the height of the rib 3i in the height direction is increased to enhance the light shielding property with the adjacent LED chip.
When the height dimension of the rib 3i is increased, there is a problem that the tip of the rib 3i approaches the substrate, the reflecting frame rises from the substrate, and the assembling accuracy is deteriorated. Further, since there is a gap between the substrate 1 and the tip of the rib 3i, the adjacent LED
There is a problem that light leaks between chips.

【００１３】前記したようなバーＬＥＤを用いて種々の
物理量を棒グラフ状に直線的に表示する表示器において
も、表示器のサイズの大型化を避けるために隣接したＬ
ＥＤチップを密接して配置する必要がある。このため、
上記図６、図７に示したような隣接するＬＥＤチップ相
互間で光が漏れたり、ＬＥＤチップの基板への実装作業
や、反射枠を基板に固定する際の組立て作業の作業性が
悪くなる等の問題が発生する。[0013] Even in a display device which uses a bar LED as described above to linearly display various physical quantities in the form of a bar graph, an adjacent L is used to avoid an increase in the size of the display device.
It is necessary to arrange the ED chips closely. For this reason,
Light leaks between the adjacent LED chips as shown in FIGS. 6 and 7, and the workability of mounting the LED chips on the substrate and assembling the fixing frame to the substrate deteriorates. And other problems occur.

【００１４】本発明はこのような問題に鑑みて、上記し
た１つのセグメントに対して２色以上を発色するＬＥＤ
チップを基板に装着する表示器やバーＬＥＤを用いる表
示器等のように、隣接するＬＥＤ間の間隔が狭い場合で
もＬＥＤチップ相互間での光の漏れを防止し、ＬＥＤチ
ップを破損することなく反射枠を基板に固定することが
できる表示器の提供を目的とするものである。In view of the above problems, the present invention provides an LED that emits two or more colors for one segment.
Even if the distance between adjacent LEDs is narrow, such as a display that mounts chips on a substrate or a display that uses bar LEDs, it prevents light leakage between the LED chips and does not damage the LED chips. It is an object of the present invention to provide a display device capable of fixing a reflection frame to a substrate.

【００１５】また、反射枠の材料として金属体を用いる
場合や、樹脂成形品に金属をメッキしたり金属を蒸着し
た部品を用いる場合にも、反射枠と基板間、および反射
枠と基板に実装されるＬＥＤチップとの絶縁性を損なわ
ない表示器の提供を目的とするものである。[0015] Also, when a metal body is used as a material of the reflection frame, or when a resin molded product is formed by plating a metal or depositing a metal, a component is mounted between the reflection frame and the substrate and between the reflection frame and the substrate. It is an object of the present invention to provide a display device that does not impair the insulation property of the LED chip.

【００１６】[0016]

【課題を解決するための手段】上記目的は、請求項１に
係る発明において、表示器を、基板に実装される複数の
発光源と、発光源の駆動に対応してキャラクターを表示
する表示部および隣接する発光源相互間の光の漏れを遮
断する隔壁を有する反射枠とを備え、基板上の各発光源
に対応する位置に発光源の挿通孔を形成した弾力性のあ
る絶縁性被覆部で発光源を被覆し、反射枠を基板に固定
する構成とすることにより達成される。The object of the present invention is to provide a display device, comprising: a plurality of light emitting sources mounted on a substrate; and a display unit for displaying a character corresponding to driving of the light emitting sources. And a reflective frame having a partition for blocking light leakage between adjacent light emitting sources, and a resilient insulating covering portion having a light emitting source insertion hole formed at a position on the substrate corresponding to each light emitting source. This is achieved by covering the light-emitting source with, and fixing the reflection frame to the substrate.

【００１７】請求項２に係る発明においては、前記被覆
部を前記反射枠の底部に形成している。In the invention according to claim 2, the covering portion is formed on the bottom of the reflection frame.

【００１８】また、上記目的は、請求項３に係る発明に
おいて、表示器を、基板に実装される複数の発光源と、
発光源の駆動に対応してキャラクターを表示する表示部
および隣接する発光源相互間の光の漏れを遮断する隔壁
を有する反射枠とを備え、弾力性のある絶縁性の部材か
らなり、基板上の各発光源に対応する位置に発光源の挿
通孔を形成した遮光シートを反射枠と基板間に設け、遮
光シートで発光源を被覆して反射枠を基板に固定する構
成とすることにより達成される。Further, the above object is achieved by the invention according to claim 3, wherein the display is provided with a plurality of light emitting sources mounted on a substrate;
A display portion for displaying a character corresponding to the driving of the light emitting source, and a reflective frame having a partition for blocking light leakage between adjacent light emitting sources, comprising a resilient insulating member; A light-shielding sheet having a light-emitting source insertion hole formed at a position corresponding to each light-emitting source is provided between the reflection frame and the substrate, and the light-emitting source is covered with the light-shielding sheet and the reflection frame is fixed to the substrate. Is done.

【００１９】上記請求項１，２の構成とすることによ
り、隣接するＬＥＤチップ間の外周側面は基板上で被覆
部により光学的に遮断されるので、１つのセグメントに
対して２色以上を発色するＬＥＤチップを基板に装着す
る表示器やバーＬＥＤを用いる表示器等のように、隣接
するＬＥＤ間の間隔が狭い場合でもＬＥＤチップ相互間
での光の漏れを防止できる。また、ＬＥＤチップを弾力
性のある絶縁性被覆部で被覆して隣接するＬＥＤチップ
間を遮光する構成としているので、反射枠を基板に固定
する際のＬＥＤチップの破損を防止できる。According to the structure of the first and second aspects, the outer peripheral side surface between the adjacent LED chips is optically cut off by the covering portion on the substrate, so that two or more colors are formed for one segment. Even if the distance between adjacent LEDs is narrow, such as a display that mounts an LED chip on a substrate or a display that uses bar LEDs, light leakage between the LED chips can be prevented. In addition, since the LED chips are covered with an elastic insulating covering portion to shield light between adjacent LED chips, it is possible to prevent the LED chips from being damaged when the reflective frame is fixed to the substrate.

【００２０】また、請求項３の構成とすることにより、
反射枠と基板間に絶縁性の部材からなる遮光シートを配
置しているので、反射枠と基板間および反射枠とＬＥＤ
チップ間は電気的に絶縁される。このために、反射枠の
材料として金属体を用いる場合や、樹脂成形品に金属を
メッキした部材や金属を蒸着した部品を用いる場合に
も、反射枠を基板に固定する際に、基板や基板に実装さ
れるＬＥＤチップと反射枠との絶縁性を損う恐れのない
表示器が得られる。Further, by adopting the configuration of claim 3,
Since the light-shielding sheet made of an insulating member is arranged between the reflection frame and the substrate, the reflection frame and the substrate, and the reflection frame and the LED are arranged.
The chips are electrically insulated. For this reason, when using a metal body as a material of the reflection frame, or when using a metal-plated member or a metal-deposited component on a resin molded product, when fixing the reflection frame to the substrate, Thus, a display can be obtained which does not impair the insulation between the LED chip mounted on the substrate and the reflection frame.

【００２１】[0021]

【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。図１は本発明の表示器を分解して示す斜視
図である。図４の従来例と同一の部分または対応すると
ころには同一の符号を付して詳細な説明は省略する。図
１に示す表示器においては、基板１に所定のパターンで
実装された複数のＬＥＤチップ２と反射枠３との間に、
ＬＥＤチップ２を被覆する遮光シート５を配置する構成
としている。Embodiments of the present invention will be described below. FIG. 1 is an exploded perspective view showing the display device of the present invention. The same reference numerals are given to the same portions or corresponding portions as those in the conventional example of FIG. 4, and the detailed description is omitted. In the display device shown in FIG. 1, between a plurality of LED chips 2 mounted on a substrate 1 in a predetermined pattern and a reflection frame 3,
The light shielding sheet 5 that covers the LED chip 2 is arranged.

【００２２】遮光シート５は、基体５ａにＬＥＤチップ
を挿通する複数の円形の挿通孔５ｂを設けている。この
挿通孔５ｂは、基板上の各ＬＥＤチップ２の位置に対応
した位置に形成されている。各挿通孔５ｂの径は、基板
１に実装されたＬＥＤチップ２が挿通されるようにＬＥ
Ｄチップ２のサイズよりもやや大き目に選定されてい
る。各挿通孔５ｂの形状は、図示のように円形とするこ
とに代えて角形とすることもできる。The light-shielding sheet 5 is provided with a plurality of circular insertion holes 5b through which the LED chips are inserted through the base 5a. This insertion hole 5b is formed at a position corresponding to the position of each LED chip 2 on the substrate. The diameter of each insertion hole 5b is set so that the LED chip 2 mounted on the substrate 1 is inserted.
The size is selected to be slightly larger than the size of the D chip 2. The shape of each insertion hole 5b may be square instead of being circular as shown.

【００２３】図２は、図１に示した表示器の基板１に反
射枠３を固定した場合において、遮光シート５を除去し
て反射枠３の矢視Ａ−Ｂ方向でみた断面図である。図２
に示すように、反射枠３の隔壁３ｇには図６の従来例の
ような延長部も図７の従来例のようなリブも形成されて
いない。FIG. 2 is a cross-sectional view of the reflective frame 3 viewed from the direction of arrows AB when the reflective frame 3 is fixed to the substrate 1 of the display shown in FIG. . FIG.
As shown in FIG. 6, the partition wall 3g of the reflection frame 3 is not formed with the extended portions as in the conventional example of FIG. 6 and the ribs as in the conventional example of FIG.

【００２４】図３は、遮光シート５をＬＥＤチップ２に
被覆して図１に示した反射枠３を基板１に固定した場合
の反射枠３の矢視Ａ−Ｂ方向でみた断面図である。遮光
シート５は絶縁性で弾性力のあるシリコンゴム等で形成
されており、その厚みは基板上に実装されるＬＥＤチッ
プの基板上の高さよりも厚く選定されている。このた
め、ＬＥＤチップ２に遮光シート５を被覆した状態で
は、遮光シート５の表面はＬＥＤチップ２の上面よりも
上部に位置している。FIG. 3 is a cross-sectional view of the reflection frame 3 when the light-shielding sheet 5 is covered with the LED chip 2 and the reflection frame 3 shown in FIG. . The light-shielding sheet 5 is formed of an insulating and elastic silicon rubber or the like, and its thickness is selected to be larger than the height of the LED chip mounted on the substrate on the substrate. Therefore, when the light-shielding sheet 5 is covered with the LED chip 2, the surface of the light-shielding sheet 5 is located higher than the upper surface of the LED chip 2.

【００２５】ＬＥＤチップ２に遮光シート５を被覆した
状態で反射枠３を基板１に固定すると、反射枠３に設け
られている隔壁３ｇの底面で遮光シート５の表面を押圧
し、遮光シート５の表面は図３に示すようにＬＥＤチッ
プの外枠の表面の位置と同じ高さに変形される。このと
きには遮光シート５の裏面が基板１に密着し、各ＬＥＤ
チップ２の外周側面は遮光シート５の基体５ａにより光
学的に遮断されるので、各ＬＥＤチップ２相互間では放
射される光の漏れは生じない。When the reflection frame 3 is fixed to the substrate 1 with the LED chip 2 covered with the light-shielding sheet 5, the surface of the light-shielding sheet 5 is pressed by the bottom surface of the partition wall 3 g provided on the reflection frame 3, and the light-shielding sheet 5 is pressed. Is deformed to the same height as the position of the surface of the outer frame of the LED chip as shown in FIG. At this time, the back surface of the light shielding sheet 5 is in close contact with the substrate 1 and each LED
Since the outer peripheral side surface of the chip 2 is optically shielded by the base 5a of the light-shielding sheet 5, there is no leakage of light emitted between the LED chips 2.

【００２６】このように、各ＬＥＤチップ２の外周側面
は遮光シート５の基体５ａにより光学的に遮断する構成
としており、従来例のように幅の狭い隔壁により各ＬＥ
Ｄチップ２の外周側面間を遮光する構成とはしていな
い。このため、反射枠３を基板１に固定する際に狭い隔
壁によりＬＥＤチップ２を破損するような事態は発生し
ない。As described above, the outer peripheral side surface of each LED chip 2 is optically shielded by the base 5a of the light shielding sheet 5, and each LE chip is formed by a narrow partition as in the conventional example.
It is not configured to shield between the outer peripheral side surfaces of the D chip 2. For this reason, when fixing the reflection frame 3 to the board | substrate 1, the situation which damages the LED chip 2 by a narrow partition does not generate | occur | produce.

【００２７】遮光シート５は、白色のような明るい色の
ものを用いるとＬＥＤチップ２から放射される光の反射
効率が良好になる。また、熱伝導率が良い材料を用いる
と、ＬＥＤチップ２の発熱を遮光シート５を介して反射
枠３に伝達し、反射枠３から放熱するので放熱効果が向
上する。特に、セグメント表示部を２色以上に発色させ
るＬＥＤチップやバーＬＥＤにおいてはＬＥＤの基板へ
の実装密度が高く、発熱量も多くなるので過熱を防止す
る上からも放熱効果の向上が要求されている。When a light-shielding sheet 5 of a bright color such as white is used, the reflection efficiency of light emitted from the LED chip 2 is improved. When a material having good thermal conductivity is used, heat generated by the LED chip 2 is transmitted to the reflection frame 3 via the light shielding sheet 5 and is radiated from the reflection frame 3, so that the heat radiation effect is improved. In particular, in LED chips and bar LEDs that cause the segment display portion to emit two or more colors, the mounting density of the LEDs on the substrate is high, and the amount of heat generated is large. Therefore, an improvement in the heat radiation effect is required in order to prevent overheating. I have.

【００２８】反射枠として金属体や、樹脂成形品に金属
をメッキしたものや金属を蒸着した材料を使用する場合
には反射枠の熱伝導率も良好となる。このために、遮光
シート５を熱伝導率が良い材料で構成すると、遮光シー
ト５と反射枠３との熱伝導率の相乗効果により、ＬＥＤ
チップ２が発熱した際の反射枠３からの放熱効果は更に
向上する。When a metal body, a resin-molded product plated with metal, or a metal-deposited material is used as the reflection frame, the heat conductivity of the reflection frame is also good. For this reason, if the light shielding sheet 5 is made of a material having a good thermal conductivity, the light shielding sheet 5 and the reflective frame 3 have a synergistic effect of the thermal conductivity, so that the LED is used.
The heat radiation effect from the reflection frame 3 when the chip 2 generates heat is further improved.

【００２９】遮光シート５は絶縁性の部材により形成さ
れているので、反射枠３と基板１間および反射枠３と基
板１に実装されるＬＥＤチップ２間は電気的に絶縁され
ている。したがって、ＬＥＤチップ２を基板１に固着す
る際に半田を用いた場合には、該半田と反射枠３との間
は絶縁性の遮光シート５で分離されることになる。この
ために、反射枠３として金属体を用いた場合や樹脂性形
品に金属メッキや金属を蒸着したものを用いた場合に
も、反射枠３と前記半田間の絶縁が損なわれる恐れはな
い。また、基板１と反射枠３との間も絶縁性の遮光シー
ト５で分離されるので、基板１に形成されているパター
ンやスルーホールと前記金属を用いた反射枠３とが接触
して絶縁性が損なわれるという問題も生じない。Since the light shielding sheet 5 is formed of an insulating member, the reflection frame 3 and the substrate 1 and the reflection frame 3 and the LED chip 2 mounted on the substrate 1 are electrically insulated. Therefore, when solder is used to fix the LED chip 2 to the substrate 1, the solder and the reflection frame 3 are separated by the insulating light shielding sheet 5. For this reason, even when a metal body is used as the reflection frame 3 or when metal plating or metal is vapor-deposited on a resin-shaped product, the insulation between the reflection frame 3 and the solder is not damaged. . Further, since the substrate 1 and the reflection frame 3 are also separated by the insulating light-shielding sheet 5, the pattern or through hole formed on the substrate 1 and the reflection frame 3 using the metal are insulated from each other. There is no problem that the performance is impaired.

【００３０】上記の例では、反射枠３とＬＥＤチップを
被覆する遮光シート５とは別個の部材で構成している
が、これを一体化した部材としてＬＥＤチップ２に被着
する構成とすることも可能である。この場合には、弾力
性のある絶縁物からなり、白色等の明るい色で形成した
光の反射効率が良好な部材を使用する。この一体化した
部材の底面に図１の遮光シート５に形成している挿通孔
５ｂに相当するＬＥＤチップ挿通用の孔を設けて、基板
１に実装されているＬＥＤチップ２を被覆する。In the above example, the reflection frame 3 and the light-shielding sheet 5 for covering the LED chips are constituted by separate members. However, the reflection frame 3 and the light-shielding sheet 5 are attached to the LED chips 2 as an integrated member. Is also possible. In this case, a member made of an elastic insulator and formed of a bright color such as white and having good light reflection efficiency is used. An LED chip insertion hole corresponding to the insertion hole 5b formed in the light shielding sheet 5 of FIG. 1 is provided on the bottom surface of the integrated member to cover the LED chip 2 mounted on the substrate 1.

【００３１】この反射枠とＬＥＤチップの被覆部を一体
化した部材に、図２の断面図に示すような隣接するＬＥ
Ｄチップを相互に遮光するための隔壁を設ける。上記一
体化した部材にこのようなＬＥＤチップ挿通孔や遮光用
の隔壁を設けることは、金型の形状を適宜設定すること
により実施が可能である。The member in which the reflection frame and the covering portion of the LED chip are integrated is attached to the adjacent LE as shown in the sectional view of FIG.
Partition walls for mutually shielding the D chips are provided. Providing such an LED chip insertion hole or a light-shielding partition in the integrated member can be performed by appropriately setting the shape of the mold.

【００３２】また、上記の例ではＬＥＤチップにより７
セグメントで数字のキャラクターを表示する例について
説明したが、隣接するＬＥＤチップ相互間の上記遮光機
構は、基板上に実装された複数のＬＥＤチップを実装
し、所定のＬＥＤチップを駆動して放射される光により
アルファベット等の文字や図形等のキャラクターをセグ
メント表示部で表示する表示器にも適用できる。Also, in the above example, the LED chip
Although an example of displaying a numeric character in a segment has been described, the light-shielding mechanism between adjacent LED chips mounts a plurality of LED chips mounted on a substrate, and drives a predetermined LED chip to emit light. The present invention can also be applied to a display device that displays characters such as alphabets and characters such as figures on a segment display unit using light.

【００３３】[0033]

【発明の効果】以上のように、本発明の表示器は、隣接
するＬＥＤチップ間の外周側面は基板上で被覆部により
光学的に遮断されるので、１つのセグメントに対して２
色を発色するＬＥＤチップを基板に装着する表示器やバ
ーＬＥＤを用いる表示器等のように、隣接するＬＥＤ間
の間隔が狭い場合でもＬＥＤチップ相互間での光の漏れ
を防止することができる。また、ＬＥＤチップを弾力性
のある絶縁性被覆部で被着して隣接するＬＥＤチップ間
を遮光する構成としているので、反射枠を基板に固定す
る際のＬＥＤチップの破損を防止できる。As described above, in the display device of the present invention, the outer peripheral side surface between the adjacent LED chips is optically cut off by the covering portion on the substrate.
Light leakage between LED chips can be prevented even when the distance between adjacent LEDs is narrow, such as a display that mounts an LED chip that emits a color on a substrate or a display that uses a bar LED. . In addition, since the LED chips are covered with the elastic insulating covering portion to shield the space between the adjacent LED chips, the LED chips can be prevented from being damaged when the reflection frame is fixed to the substrate.

【００３４】また、本発明の表示器は、反射枠と基板間
に絶縁性の部材からなる遮光シートを配置しているの
で、反射枠と基板間および反射枠とＬＥＤチップ間は電
気的に絶縁される。このために、反射枠の材料として金
属体を用いる場合や、樹脂成形品に金属をメッキした部
材または金属を蒸着した部品を用いる場合にも、反射枠
を基板に固定する際に基板や基板に実装されるＬＥＤチ
ップと反射枠との絶縁性が損なわれる恐れはない。Further, in the display of the present invention, since the light-shielding sheet made of an insulating member is disposed between the reflection frame and the substrate, the reflection frame and the substrate and the reflection frame and the LED chip are electrically insulated. Is done. For this reason, when using a metal body as a material of the reflection frame, or when using a metal-plated member or a metal-deposited component on a resin molded product, when fixing the reflection frame to the substrate, There is no possibility that the insulation between the mounted LED chip and the reflective frame is impaired.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る表示器の実施の形態における構成
を示す分解斜視図である。FIG. 1 is an exploded perspective view showing a configuration of an embodiment of a display device according to the present invention.

【図２】図１の矢視Ａ−Ｂ方向でみて遮光シートを除去
して示す断面図である。FIG. 2 is a cross-sectional view showing the light-shielding sheet removed when viewed in the direction of arrows AB in FIG. 1;

【図３】図１の矢視Ａ−Ｂ方向でみて遮光シートを被覆
して示す断面図である。FIG. 3 is a cross-sectional view showing a light-shielding sheet covered when viewed in the direction of arrows AB in FIG. 1;

【図４】従来例の表示器の構成を示す分解斜視図であ
る。FIG. 4 is an exploded perspective view showing a configuration of a conventional display.

【図５】図４の矢視Ａ−Ｂ方向でみて示す断面図であ
る。FIG. 5 is a cross-sectional view as viewed in the direction of arrows AB in FIG. 4;

【図６】別の従来例の図４の矢視Ａ−Ｂ方向でみて示す
断面図である。FIG. 6 is a cross-sectional view of another conventional example viewed in the direction of arrows AB in FIG. 4;

【図７】別の従来例の図４の矢視Ａ−Ｂ方向でみて示す
断面図である。FIG. 7 is a cross-sectional view of another conventional example viewed in the direction of arrows AB in FIG.

【符号の説明】[Explanation of symbols]

１ 基板 ２ ＬＥＤチップ ３ 反射枠 ３ｇ 隔壁 ４ セグメント表示部 ５ 遮光シート ５ａ 基体 ５ｂ 挿通孔 DESCRIPTION OF SYMBOLS 1 Substrate 2 LED chip 3 Reflection frame 3g Partition wall 4 Segment display part 5 Light shielding sheet 5a Substrate 5b Insertion hole

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 基板に実装される複数の発光源と、発光
源の駆動に対応してキャラクターを表示する表示部およ
び隣接する発光源相互間の光の漏れを遮断する隔壁を有
する反射枠とを備え、基板上の各発光源に対応する位置
に発光源の挿通孔を形成した弾力性のある絶縁性被覆部
で発光源を被覆し、反射枠を基板に固定してなる表示
器。A reflection frame having a plurality of light emitting sources mounted on a substrate, a display unit for displaying a character corresponding to driving of the light emitting sources, and a partition for blocking light leakage between adjacent light emitting sources; A display comprising: a light-emitting source covered by a resilient insulating coating portion having a light-emitting source insertion hole formed at a position corresponding to each light-emitting source on a substrate; and a reflection frame fixed to the substrate. 【請求項２】 前記被覆部を前記反射枠の底部に形成し
てなる請求項１に記載の表示器。2. The display according to claim 1, wherein the covering portion is formed on a bottom portion of the reflection frame. 【請求項３】 基板に実装される複数の発光源と、発光
源の駆動に対応してキャラクターを表示する表示部およ
び隣接する発光源相互間の光の漏れを遮断する隔壁を有
する反射枠とを備え、弾力性のある絶縁性の部材からな
り、基板上の各発光源に対応する位置に発光源の挿通孔
を形成した遮光シートを反射枠と基板間に設け、遮光シ
ートで発光源を被覆して反射枠を基板に固定してなる表
示器。3. A reflection frame having a plurality of light sources mounted on a substrate, a display unit for displaying a character corresponding to driving of the light sources, and a partition for blocking light leakage between adjacent light sources. A light-shielding sheet made of a resilient insulating material and having a light-emitting source insertion hole formed at a position corresponding to each light-emitting source on the substrate is provided between the reflection frame and the substrate, and the light-emitting source is provided by the light-shielding sheet. A display that is covered and has a reflective frame fixed to a substrate.
JP36747197A 1997-12-04 1997-12-04 display Expired - Fee Related JP4082768B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36747197A JP4082768B2 (en) 1997-12-04 1997-12-04 display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36747197A JP4082768B2 (en) 1997-12-04 1997-12-04 display

Publications (2)

Publication Number Publication Date
JPH11167357A true JPH11167357A (en) 1999-06-22
JP4082768B2 JP4082768B2 (en) 2008-04-30

Family

ID=18489388

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP4082768B2 (en)

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