JPH11150176A - Method and equipment for substrate holding, and substrate processing method - Google Patents
Method and equipment for substrate holding, and substrate processing methodInfo
- Publication number
- JPH11150176A JPH11150176A JP9332288A JP33228897A JPH11150176A JP H11150176 A JPH11150176 A JP H11150176A JP 9332288 A JP9332288 A JP 9332288A JP 33228897 A JP33228897 A JP 33228897A JP H11150176 A JPH11150176 A JP H11150176A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- substrate
- members
- suction means
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は,例えば半導体ウェ
ハやLCD基板などといった基板を処理装置内で保持す
る基板保持方法,基板保持装置及び基板を保持した状態
で当該基板を処理する基板処理方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding method for holding a substrate such as a semiconductor wafer or an LCD substrate in a processing apparatus, a substrate holding apparatus, and a substrate processing method for processing a substrate while holding the substrate. .
【0002】[0002]
【従来の技術】一般に,液晶ディスプレイ(LCD)装
置や半導体デバイスなどの製造においては,LCD基板
や半導体ウェハの上面にレジスト膜パターンを形成させ
るために,いわゆるリソグラフィ処理が行われる。この
リソグラフィ処理は,LCD基板の洗浄,LCD基板の
乾燥,LCD基板の表面へのレジスト液の塗布,感光膜
の露光,現像など,種々の処理工程を含んでいる。例え
ば,LCD基板を洗浄した後,疎水化処理を施し,更に
冷却した後,フォトレジストとしてのレジスト液を塗布
してLCD基板の表面に感光膜を塗布形成する。加熱し
てべーキング処理を施した後,露光装置において感光膜
に所定のパターンを露光する。露光後のLCD基板の表
面に現像液を塗布して現像した後にリンス液により現像
液を洗い流し,現像処理を完了する。2. Description of the Related Art Generally, in the manufacture of a liquid crystal display (LCD) device or a semiconductor device, a so-called lithography process is performed to form a resist film pattern on an upper surface of an LCD substrate or a semiconductor wafer. This lithography processing includes various processing steps such as cleaning of the LCD substrate, drying of the LCD substrate, application of a resist solution to the surface of the LCD substrate, exposure and development of a photosensitive film. For example, after the LCD substrate is washed, it is subjected to a hydrophobic treatment, and further cooled, and then a resist solution as a photoresist is applied to form a photosensitive film on the surface of the LCD substrate. After heating and baking, a predetermined pattern is exposed on the photosensitive film in an exposure device. After developing and applying a developing solution to the surface of the LCD substrate after exposure, the developing solution is washed away with a rinsing solution to complete the developing process.
【0003】以上のようなリソグラフィ処理において,
通常,LCD基板を水平な載置台に保持しLCD基板を
固定した状態で処理を施す方法や,回転自在なスピンチ
ャックにLCD基板を保持させLCD基板を回転させな
がら処理を施す方法などが採用されている。特に従来の
載置台は,載置台の上面に吸着部材を設け,この吸着部
材でLCD基板の裏面を吸着することによりLCD基板
を載置台に保持させた状態で所定の処理を施すように構
成されている。In the above lithography process,
Usually, a method of performing processing while holding the LCD substrate on a horizontal mounting table and fixing the LCD substrate, and a method of holding the LCD substrate on a rotatable spin chuck and performing processing while rotating the LCD substrate are used. ing. In particular, the conventional mounting table is configured such that a suction member is provided on the upper surface of the mounting table, and a predetermined process is performed while the LCD substrate is held on the mounting table by sucking the back surface of the LCD substrate with the suction member. ing.
【0004】以上のような載置台が使用されてる処理と
しては,例えば,レジスト液を塗布する工程した後にL
CD基板の周縁部や裏面に形成された不要なレジスト膜
を除去する周縁除去処理がある。これは,載置台に保持
されたLCD基板の周縁部に沿ってノズルを移動させつ
つ,そのノズルから溶剤(例えばシンナ)を供給すると
同時に,この溶剤の供給によって溶解したレジスト液を
吸引除去するものであり,この処理中は常に載置台の吸
着部材は,LCD基板の裏面を吸着し続けている。As a process in which the mounting table is used as described above, for example, after a step of applying a resist solution,
There is a periphery removal process for removing an unnecessary resist film formed on the periphery and the back surface of the CD substrate. In this method, while moving a nozzle along the periphery of an LCD substrate held on a mounting table, a solvent (eg, thinner) is supplied from the nozzle, and at the same time, a resist solution dissolved by the supply of the solvent is suctioned and removed. During this process, the suction member of the mounting table always sucks the back surface of the LCD substrate.
【0005】[0005]
【発明が解決しようとする課題】ところで,従来の載置
台では,載置台の上面の所定の箇所に配置された複数の
吸着部材の全てが,LCD基板の裏面を吸着し処理が終
了するまでLCD基板の裏面の所定の箇所を継続的に吸
着し続けていた。このため,ある時間以上処理が行われ
た場合には,処理の終了後にLCD基板の裏面の所定の
箇所では吸着部材が吸着した跡,いわゆる転写跡が残っ
てしまう。この転写跡は,レジストに悪影響を及ぼし液
晶ディスプレー(LCD)装置の製造における歩留まり
を低下させる恐れがある。By the way, in the conventional mounting table, all of the plurality of suction members arranged at predetermined positions on the upper surface of the mounting table suck the back surface of the LCD substrate and the LCD is mounted until the processing is completed. A predetermined portion on the back surface of the substrate has been continuously sucked. Therefore, if the processing is performed for a certain period of time or more, after the processing is completed, a trace of the adsorption member adsorbed, that is, a so-called transfer trace remains at a predetermined position on the back surface of the LCD substrate. This transfer mark may adversely affect the resist and reduce the yield in manufacturing a liquid crystal display (LCD) device.
【0006】本発明はかかる点に鑑みてなされてもので
あり,基板の裏面に吸着手段の転写跡を残さず基板を保
持できる基板保持方法,及び基板保持方法を好適に実施
できる基板保持装置を提供して上記問題の解決を図るこ
とを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a substrate holding method capable of holding a substrate without leaving a transfer mark of a suction means on the back surface of the substrate, and a substrate holding device capable of suitably performing the substrate holding method. It is intended to solve the above problem by providing.
【0007】本発明の別の目的は,基板を保持しなが
ら,同時に基板の処理が好適に行える処理方法を提供す
ることである。It is another object of the present invention to provide a processing method capable of simultaneously processing a substrate while holding the substrate.
【0008】[0008]
【課題を解決するための手段】前記目的を達成するため
に,請求項1の発明は,基板載置部の上面に設けた複数
の吸着手段によって基板を吸着して保持する方法におい
て,基板を保持している間,吸着動作を行う吸着手段を
順次移行させることを特徴とする,基板保持方法を提供
する。かかる方法によれば,吸着動作を行う吸着手段を
順次移行させるため,基板載置部の上面に設けた全ての
吸着部材が一斉に処理の開始から終了まで継続的に吸着
動作を行うことがない。さらに処理中は,基板載置部の
上面に設けた何れかの吸着部材が適宜吸着動作を行い転
写跡が残る前に吸着動作を停止し,別の吸着部材に吸着
動作が移行していき,これを処理が終了するまで順次繰
り返すことができる。即ち,基板の裏面における吸着箇
所は固定されない。従って,処理の最初から終わりまで
基板を基板載置部が吸着・保持しても,基板の裏面に吸
着手段の転写跡が残ることを防止できる。なおこの場
合,順次移行の意味は,ある順番に従って吸着動作を行
う吸着手段を規則正しく移行させる場合に限定されず,
いわゆる不規則に移行させる場合も含んでいる。According to a first aspect of the present invention, there is provided a method of sucking and holding a substrate by a plurality of sucking means provided on an upper surface of a substrate mounting portion. Provided is a substrate holding method, wherein suction means for performing a suction operation is sequentially shifted during holding. According to this method, since the suction means for performing the suction operation is sequentially shifted, all the suction members provided on the upper surface of the substrate mounting portion do not continuously perform the suction operation from the start to the end of the processing at the same time. . Further, during processing, one of the suction members provided on the upper surface of the substrate mounting portion performs a suction operation appropriately, stops the suction operation before a transfer mark remains, and shifts to another suction member. This can be sequentially repeated until the processing is completed. That is, the suction location on the back surface of the substrate is not fixed. Therefore, even if the substrate mounting portion suctions and holds the substrate from the beginning to the end of the processing, it is possible to prevent the transfer trace of the suction means from remaining on the back surface of the substrate. In this case, the meaning of the sequential shift is not limited to the case where the suction means that performs the suction operation in accordance with a certain order is shifted regularly, and
This also includes the case of so-called irregular transition.
【0009】吸着動作を行う際には,請求項2に記載し
たように,基板載置部の中心を挟んで対向する,少なく
とも2つの吸着手段は同時にさせることが好ましく,さ
らに請求項3に記載したように,吸着手段は,少なくと
も基板載置部の裏面周縁部に沿って配置され,吸着動作
は時計回り又は反時計回りに移行させるようにしてもよ
い。かかる方法によれば,基本的な作用は請求項2及び
3とも請求項1と同様であるが,請求項2では基板の中
心を挟んで対向する,少なくとも2つの吸着手段同士が
適宜吸着動作をするので,基板の裏面における吸着箇所
が少なくとも基板の中心を挟んだ対向する位置の2箇所
に適宜設定されていく。従って,このような基板の中心
を挟んで対向した2箇所で裏面を吸着されている基板
は,処理中常に安定して基板載置部に保持される。一
方,請求項3では,基板の裏面における吸着箇所を規則
正しく移行させていく。従って,請求項2に請求項3の
発明を組み合わせれば,より安定した基板の保持が行え
る。Preferably, at the time of performing the suction operation, at least two suction means opposed to each other with the center of the substrate mounting portion interposed therebetween are simultaneously operated. As described above, the suction means may be arranged at least along the peripheral edge of the back surface of the substrate mounting portion, and the suction operation may be shifted clockwise or counterclockwise. According to this method, the basic operation is similar to that of claim 1 in both claim 2 and claim 3. However, in claim 2, at least two suction means opposed to each other with the center of the substrate interposed therebetween perform suction operation appropriately. Therefore, attraction points on the back surface of the substrate are appropriately set at least at two opposing positions across the center of the substrate. Therefore, such a substrate whose back surface is sucked at two positions opposed to each other with the center of the substrate therebetween is always stably held on the substrate mounting portion during processing. On the other hand, according to the third aspect, the suction locations on the back surface of the substrate are regularly shifted. Therefore, by combining the second aspect with the third aspect, the substrate can be held more stably.
【0010】請求項4の発明は,上面に複数の吸着手段
を備えた基板載置部を有する基板を保持する装置であっ
て,各吸着手段の吸着動作を,個々の吸着手段毎に又は
吸着手段群毎に,作動及び停止させる制御手段を備えた
ことを特徴とする,基板保持装置を提供する。かかる構
成によれば,請求項1〜3に記載の基板の保持方法を好
適に実施することができる。即ち,制御手段は,吸着動
作をさせる個々の吸着手段又は吸着手段群とそれ以外の
個々の吸着手段又は吸着手段群との選別を的確に行うの
で,吸着動作を行う吸着手段の移行プロセスを当初の計
画通りに進行させることが可能となる。According to a fourth aspect of the present invention, there is provided an apparatus for holding a substrate having a substrate mounting section provided with a plurality of suction means on an upper surface, wherein the suction operation of each suction means is performed for each suction means individually or individually. Provided is a substrate holding device, which is provided with control means for starting and stopping for each means group. According to this configuration, the method for holding a substrate according to the first to third aspects can be suitably performed. That is, since the control means accurately distinguishes the individual suction means or the group of suction means for performing the suction operation from the other individual suction means or the group of suction means, the transfer process of the suction means for performing the suction operation is initially performed. It is possible to proceed as planned.
【0011】また,請求項5の発明は,上面に複数の吸
着手段を備えた基板載置部を有する基板を保持する装置
であって,各吸着手段は,真空吸引手段によって基板を
吸着する構成を有し,真空吸引手段と各吸着手段とを結
ぶ吸引路と,各吸引路の途中に介装された吸引路の開閉
手段と,開閉手段の開閉を制御する制御手段とを備えた
ことを特徴とする,基板保持装置を提供する。かかる構
成によれば,開閉手段が開くと吸引路内が連通され真空
吸引手段の機能が作用し吸着手段は吸着動作する。一
方,開閉弁が閉まると吸引路内が遮断され,真空吸引手
段の機能が作用せず吸着手段は吸着動作しなくなる。そ
して,各吸着手段に応じて各吸引路の途中に開閉弁を介
装しているので,制御手段は,個々の吸着手段毎に又は
吸着手段群毎に吸着動作を正確に制御し,請求項5と同
様の効果を得ることができる。According to a fifth aspect of the present invention, there is provided an apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein each suction means sucks the substrate by vacuum suction means. A suction path connecting the vacuum suction means and each suction means, a suction path opening / closing means interposed in each suction path, and a control means for controlling the opening / closing of the opening / closing means. A substrate holding device is provided. According to this configuration, when the opening / closing means is opened, the inside of the suction path is communicated, and the function of the vacuum suction means acts, so that the suction means performs a suction operation. On the other hand, when the on-off valve is closed, the inside of the suction path is shut off, the function of the vacuum suction means does not work, and the suction means does not perform the suction operation. Since the on-off valve is interposed in the middle of each suction path according to each suction means, the control means controls the suction operation accurately for each suction means or each suction means group. The same effect as that of No. 5 can be obtained.
【0012】この場合,請求項6に記載したように,基
板載置部の中心を挟んで対向位置にある吸着手段の吸引
路は少なくとも一部が共有されていることが好ましい。
かかる構成によれば,請求項2に記載の基板載置方法を
好適に実施することができる。しかも吸引路を共有化し
て真空吸引手段と各吸着手段とを結ぶと,開閉弁の個数
が減ると共に各々の吸引路を真空吸引手段に接続する手
間が省ける。従って,制御手段の制御の負担軽減や基板
保持装置の簡素化などを図ることができる。In this case, it is preferable that at least a part of the suction path of the suction means located at a position opposed to the center of the substrate mounting portion is shared.
According to this configuration, the substrate mounting method according to the second aspect can be suitably performed. In addition, when the suction path is shared and the vacuum suction means is connected to each suction means, the number of on-off valves is reduced, and the labor for connecting each suction path to the vacuum suction means can be omitted. Therefore, it is possible to reduce the control load of the control means and simplify the substrate holding device.
【0013】請求項7の発明は,基板載置部の上面に設
けた複数の吸着手段によって基板を吸着して保持し,処
理液供給ノズルを当該基板の周縁部に沿って移動させつ
つこの処理液供給ノズルから処理液を供給して基板を処
理する方法において,処理液供給ノズルの移動に伴っ
て,吸着動作を行う吸着手段を順次移行させることを特
徴とする,基板処理方法を提供する。かかる処理方法に
よれば,基板の裏面における吸着箇所を,処理液供給ノ
ズルの移動に伴い順次移行させる。この場合,処理液供
給ノズルによって処理されている基板の周縁部近傍に対
向した裏面が吸着され安定した状態となるので,処理を
好適に行うことができる。また,吸着動作を行う吸着手
段を,処理液供給ノズルの移動とは逆方向から順次移行
させるようにしてもよい。According to a seventh aspect of the present invention, the substrate is sucked and held by a plurality of suction means provided on the upper surface of the substrate mounting portion, and the processing liquid supply nozzle is moved along the peripheral edge of the substrate to perform the processing. In a method of processing a substrate by supplying a processing liquid from a liquid supply nozzle, a substrate processing method is provided, in which suction means for performing a suction operation is sequentially shifted with movement of the processing liquid supply nozzle. According to this processing method, the suction location on the back surface of the substrate is sequentially shifted with the movement of the processing liquid supply nozzle. In this case, the back surface facing the periphery of the substrate being processed by the processing liquid supply nozzle is attracted to a stable state, so that the processing can be suitably performed. Further, the suction means for performing the suction operation may be sequentially shifted from the direction opposite to the movement of the processing liquid supply nozzle.
【0014】[0014]
【発明の実施の形態】以下,本発明の好ましい実施の形
態を添付図面に基いて説明する。図1は,LCD基板G
をフォトリソグラフィ技術を用いて処理する塗布現像処
理システム1の斜視図であり,この塗布現像処理システ
ムは本発明の実施の形態にかかる塗布・周縁部除去装置
24を備えている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows an LCD substrate G
FIG. 1 is a perspective view of a coating and developing system 1 that processes a coating by using a photolithography technique. The coating and developing system includes a coating / periphery removing device 24 according to an embodiment of the present invention.
【0015】この塗布現像処理システム1は,例えば矩
形状のLCD基板Gを搬入・搬出するローダ部2と,L
CD基板Gを処理する第1の処理部3と,この第1の処
理部3とインターフェイス部4を介して連設された第2
の処理部5と,この第2の処理部5と例えば露光装置6
等との間でLCD基板Gを授受するためのインターフェ
イス部7から構成されている。The coating and developing system 1 includes a loader unit 2 for loading / unloading a rectangular LCD substrate G, for example,
A first processing unit 3 for processing the CD substrate G, and a second processing unit 3 connected to the first processing unit 3 via the interface unit 4
Processing unit 5, the second processing unit 5, and the exposure device 6
And an interface unit 7 for exchanging the LCD substrate G with the other devices.
【0016】ローダ部2には,カセットステーション1
0が設けられており,このカセットステーション10に
は未処理のLCD基板Gを収納するカセット11と,処
理済みのLCD基板Gを収納するカセット12とがそれ
ぞれ複数個載置自在である。またローダ部2には,未処
理のLCD基板Gを搬入または搬出するためのサブ搬送
アーム13が備えられている。なお,サブ搬送アーム1
3はY,Z方向への移動とθ方向に回転可能に構成され
ている。The loader unit 2 has a cassette station 1
The cassette station 10 has a plurality of cassettes 11 for storing unprocessed LCD substrates G and a plurality of cassettes 12 for storing processed LCD substrates G. The loader unit 2 is provided with a sub-transport arm 13 for loading or unloading an unprocessed LCD substrate G. The sub-transfer arm 1
Reference numeral 3 is configured to be movable in the Y and Z directions and rotatable in the θ direction.
【0017】第1の処理部3には,LCD基板Gに対し
て所定の処理を施す各種の処理装置がメイン搬送アーム
15の搬送路16を挟んで両側に配置されている。搬送
路16の一方の側に,カセット11から取り出されたL
CD基板Gを洗浄するためのブラシ洗浄装置17,現像
装置18が並んで配置され,搬送路16を挟んで反対側
に,LCD基板Gに疎水化処理を施すアドヒージョン装
置19,加熱装置20,LCD基板Gを所定の温度に冷
却する冷却装置21が適宜多段に配置されている。In the first processing section 3, various processing devices for performing predetermined processing on the LCD substrate G are arranged on both sides of the transfer path 16 of the main transfer arm 15. On one side of the transport path 16, the L
A brush cleaning device 17 for cleaning the CD substrate G and a developing device 18 are arranged side by side, and an adhesion device 19 for performing hydrophobic treatment on the LCD substrate G, a heating device 20, and an LCD on the opposite side of the transport path 16 therebetween. Cooling devices 21 for cooling the substrate G to a predetermined temperature are appropriately arranged in multiple stages.
【0018】第2の処理部5には,メイン搬送アーム2
2の搬送路23の一方の側に,本実施の形態にかかる塗
布・周縁部除去装置24が配置され,搬送路22を挟ん
で反対側には,加熱装置20,冷却装置21が適宜多段
に配置されている。The second processing unit 5 includes a main transfer arm 2
The coating / periphery removing device 24 according to the present embodiment is disposed on one side of the second transport path 23, and the heating device 20 and the cooling device 21 are appropriately arranged in multiple stages on the opposite side across the transport path 22. Are located.
【0019】インターフェイス部7には,LCD基板G
を一時待機させるためのカセット25と,このカセット
25との間でLCD基板Gの出入れを行うサブ搬送アー
ム26と,LCD基板Gの受渡し台27が設けられてい
る。なお,これら第1の処理部3及び第2の処理部5の
構成,各種装置の配列等は適宜変更することが可能であ
る。The interface unit 7 includes an LCD substrate G
, A sub-transfer arm 26 for moving the LCD substrate G in and out of the cassette 25, and a transfer stand 27 for the LCD substrate G. The configurations of the first processing unit 3 and the second processing unit 5, the arrangement of various devices, and the like can be appropriately changed.
【0020】次に,上記のように構成される塗布現像処
理システム1に組み込まれた塗布・周縁部除去装置24
の構成について説明する。Next, the coating / peripheral part removing device 24 incorporated in the coating / developing processing system 1 configured as described above.
Will be described.
【0021】図2に示すように,塗布・周縁部除去装置
24内には,LCD基板Gの表面にレジスト液を塗布す
る塗布系30と,LCD基板Gの周縁部に塗布形成され
た不要なレジスト膜を除去する周縁部除去系31とを隣
接させ,塗布系30によってレジスト液が塗布されたL
CD基板Gを周縁部除去系31に搬送する搬送機構32
とを備えている。As shown in FIG. 2, a coating system 30 for coating a resist solution on the surface of the LCD substrate G and an unnecessary coating formed on the peripheral portion of the LCD substrate G are provided in the coating / periphery removing device 24. The edge removing system 31 for removing the resist film is adjacent to the resist film, and the coating solution 30
A transport mechanism 32 for transporting the CD substrate G to the peripheral edge removing system 31
And
【0022】図3は周縁部除去系31の断面図であり,
図4はその平面図である。図3に示すように,周縁部除
去系31の中央には,支柱33の上端において支持され
た基板載置部としての載置台34が配置されている。載
置台34の上面には,後に詳述する吸着部材35a〜3
5hが装着されており,これら吸着部材35a〜35h
でLCD基板Gの裏面を吸着することによって,LCD
基板Gを載置台34の上面に保持している。FIG. 3 is a sectional view of the peripheral edge removing system 31.
FIG. 4 is a plan view thereof. As shown in FIG. 3, a mounting table 34 as a substrate mounting portion supported at the upper end of the column 33 is disposed at the center of the peripheral edge removing system 31. On the upper surface of the mounting table 34, suction members 35a to 35
5h are attached, and these suction members 35a to 35h
By sucking the back surface of the LCD substrate G with the
The substrate G is held on the upper surface of the mounting table 34.
【0023】支柱33の下端は,装置フレーム36に固
定された軸受37を貫通しており,この軸受37内を支
柱33が摺動することにより,載置台34は支柱33と
共に昇降する。但し,支柱33は装置フレーム36に固
定されたシリンダ38のピストンロッド39に接続部材
40によって結合されており,また,軸受37およびシ
リンダ38を覆うカバー41がピストンロッド39に結
合されている。従って,シリンダ38が伸縮することに
よってカバー41と共に載置台34が昇降動作する。こ
れにより,周縁部除去系31へのLCD基板Gの搬入出
が行われる構成になっている。The lower end of the column 33 penetrates a bearing 37 fixed to the apparatus frame 36, and the column 33 slides in the bearing 37 so that the mounting table 34 moves up and down together with the column 33. However, the column 33 is connected to a piston rod 39 of a cylinder 38 fixed to the device frame 36 by a connecting member 40, and a cover 41 that covers the bearing 37 and the cylinder 38 is connected to the piston rod 39. Therefore, the mounting table 34 moves up and down together with the cover 41 as the cylinder 38 expands and contracts. Thus, the configuration is such that the LCD substrate G is carried in and out of the peripheral edge removing system 31.
【0024】載置台34に保持されたLCD基板Gの下
方には,LCD基板Gの周縁レジスト膜を除去する際に
使用した溶剤やレジスト液などが落下したときにそれら
溶剤やレジスト液を受け取るためのドレインパン45が
配置され,このドレインパン45内の雰囲気が外部に漏
れないようドレインパン45を囲むように側壁部材46
が設けられている。図示のドレインパン45は,先に説
明した軸受37やシリンダ38などといった載置台34
の駆動部分の周囲を囲むように配置されている。このド
レインパン45の底面47には,ドレインパン45に溜
まった溶剤を排液するためのドレイン管48が接続さ
れ,このドレイン管48には図示していない排気系統が
接続されている。周縁部除去系31内の雰囲気は,図示
しない排気手段によって排気される。さらに,別設のフ
ァインフィルタユニット(図示せず)からの給気により
LCD基板Gの周囲にダウンフローを形成させる。Under the LCD substrate G held by the mounting table 34, the solvent and the resist liquid used for removing the peripheral resist film of the LCD substrate G are dropped to receive the solvent and the resist liquid when dropped. And a side wall member 46 surrounding the drain pan 45 so that the atmosphere in the drain pan 45 does not leak outside.
Is provided. The illustrated drain pan 45 is mounted on the mounting table 34 such as the bearing 37 or the cylinder 38 described above.
Are arranged so as to surround the periphery of the driving part. A drain pipe 48 for draining the solvent accumulated in the drain pan 45 is connected to a bottom surface 47 of the drain pan 45, and an exhaust system (not shown) is connected to the drain pipe 48. The atmosphere in the peripheral edge removing system 31 is exhausted by exhaust means (not shown). Further, a downflow is formed around the LCD substrate G by air supply from a separately provided fine filter unit (not shown).
【0025】図3及び図4に示すように,載置台34に
保持されたLCD基板Gの周囲には,長方形をなすLC
D基板Gの四辺のそれぞれに沿って移動するノズル5
5,56,57,58が配置されている。本実施の形態
では,ノズル55,57をLCD基板Gの短辺L1,L
3に沿ってそれぞれ移動するように対向して配置し,ノ
ズル56,58をLCD基板Gの長辺L2,L4に沿っ
てそれぞれ移動するように対向して配置している。これ
らノズル55,56,57,58は,L字型をなす移動
部材60,61,62,63の先端にそれぞれ取り付け
られている。また,LCD基板Gの周囲を囲むようにし
てガイドレール65,66,67,68が配置されてお
り,これらガイドレール65,66,67,68は,装
置フレーム36に固定されている。そして,これら移動
部材60,61,62,63をガイドレール65,6
6,67,68のそれぞれに摺動自在に装着することに
より,ノズル55,56,57,58がLCD基板Gの
四辺L1,L2,L3,L4のそれぞれに沿って移動で
きるように構成されている。As shown in FIGS. 3 and 4, around the LCD substrate G held by the mounting table 34, a rectangular LC
Nozzle 5 that moves along each of the four sides of D substrate G
5, 56, 57, 58 are arranged. In the present embodiment, the nozzles 55, 57 are connected to the short sides L1, L of the LCD substrate G.
The nozzles 56 and 58 are opposed to each other so as to move along the long sides L2 and L4 of the LCD substrate G, respectively. These nozzles 55, 56, 57, 58 are attached to the tips of L-shaped moving members 60, 61, 62, 63, respectively. Further, guide rails 65, 66, 67, 68 are arranged so as to surround the periphery of the LCD substrate G, and these guide rails 65, 66, 67, 68 are fixed to the device frame 36. Then, these moving members 60, 61, 62, 63 are connected to guide rails 65, 6.
6, 67, 68, the nozzles 55, 56, 57, 58 are configured to be able to move along each of the four sides L1, L2, L3, L4 of the LCD substrate G. I have.
【0026】何れも同様な構成を有したノズル55,5
6,57,58において,例えばノズル55を代表とし
て説明する。ノズル55は,図5に示すように,LCD
基板Gの周縁部の上面を覆う上部水平片70と,上部水
平片70より外方に突出する下部水平片71とからなる
断面略コ字状の噴頭72を備えている。上部水平片70
には,上部水平片70内部を通るシンナ供給路73と,
このシンナ供給路73を介してLCD基板Gの周縁部上
面に向かってレジスト膜除去用の溶剤としてシンナが供
給される上吹き出し孔74とを設けている。下部水平片
71には,下部水平片71内部を通るシンナ供給路75
と,このシンナ供給路75を介してLCD基板Gの周縁
部下面に向かってレジスト膜除去用の溶剤としてシンナ
が供給される下吹き出し孔76とを設けている。更に,
噴頭72にはLCD基板Gの周縁部近傍を覆うように形
成された隙間77が設けられ,内部中央にはLCD基板
Gの周縁近傍の雰囲気を外側に吸引排気するための吸引
孔78が設けられている。なお,他のノズル56,5
7,58も,ノズル55と全く同様の構成を備えている
ので詳細な説明を省略する。Nozzles 55 and 5 having the same configuration
6, 57 and 58, for example, the nozzle 55 will be described as a representative. The nozzle 55 is, as shown in FIG.
An upper horizontal piece 70 covering the upper surface of the peripheral edge of the substrate G and a lower horizontal piece 71 projecting outward from the upper horizontal piece 70 are provided with a jet head 72 having a substantially U-shaped cross section. Upper horizontal piece 70
A thinner supply passage 73 passing through the upper horizontal piece 70;
An upper blowing hole 74 through which thinner is supplied as a solvent for removing a resist film is provided toward the upper surface of the peripheral portion of the LCD substrate G via the thinner supply path 73. The lower horizontal piece 71 has a thinner supply path 75 passing through the lower horizontal piece 71.
And a lower blowout hole 76 through which thinner is supplied as a solvent for removing a resist film toward the lower surface of the peripheral portion of the LCD substrate G via the thinner supply path 75. Furthermore,
A gap 77 formed to cover the vicinity of the periphery of the LCD substrate G is provided at the jetting head 72, and a suction hole 78 for sucking and exhausting the atmosphere near the periphery of the LCD substrate G to the outside is provided at the center of the inside. ing. The other nozzles 56 and 5
The nozzles 7 and 58 have exactly the same configuration as the nozzle 55, and a detailed description thereof will be omitted.
【0027】ここで,LCD基板Gを吸着する上記吸着
部材35a〜35hについて詳しく説明する。図6に示
すように,載置台34の四隅に吸着部材35a,35
c,35e,35gをそれぞれ配置すると共に,吸着部
材35aと35cとの間の中心に吸着部材35bを配置
し,吸着部材35cと35eとの間の中心に吸着部材3
5dを配置し,吸着部材35eと35gとの間の中心に
吸着部材35fを配置し,吸着部材35gと35aとの
間の中心に吸着部材35hを配置している。図示の例で
は,吸着部材35a〜35cをLCD基板Gの短辺L3
側に並べ,吸着部材35c〜35eをLCD基板Gの長
辺L2側に並べ,吸着部材35e〜35gをLCD基板
Gの長辺L1側に並べ,吸着部材35g〜35aをLC
D基板Gの長辺L4側に並べている。Here, the suction members 35a to 35h for sucking the LCD substrate G will be described in detail. As shown in FIG. 6, the suction members 35a, 35
c, 35e, and 35g, and a suction member 35b at the center between the suction members 35a and 35c, and the suction member 3 at the center between the suction members 35c and 35e.
5d, an adsorption member 35f is disposed at the center between the adsorption members 35e and 35g, and an adsorption member 35h is disposed at the center between the adsorption members 35g and 35a. In the illustrated example, the suction members 35a to 35c are connected to the short side L3 of the LCD substrate G.
The suction members 35c to 35e are arranged on the long side L2 side of the LCD substrate G, the suction members 35e to 35g are arranged on the long side L1 side of the LCD substrate G, and the suction members 35g to 35a are
The D substrates G are arranged on the long side L4 side.
【0028】吸着部材35a〜35hは何れも同様の構
成を有しており,例えば吸着部材35aは,図7に示す
ように載置台34に設けられたバキューム孔80と,こ
のバキューム孔80の外周の段付凹部81内においてパ
ッキン82を介し押えリングネジ83によって固定され
るオイルシール84を有しており,このオイルシール8
4の上面には上方に向かってラッパ状に広がっていくシ
ール部85が備えられている。さらに吸着部材35a
は,オイルシール84のシール部85に移動可能に嵌合
され中心部に吸引孔86を有するトップパッド87を有
している。なお,他の吸着部材35b〜35hも,吸着
部材35aと全く同様の構成を備えているので詳細な説
明を省略する。Each of the suction members 35a to 35h has the same configuration. For example, the suction member 35a includes a vacuum hole 80 provided in the mounting table 34 as shown in FIG. Has an oil seal 84 fixed by a holding ring screw 83 via a packing 82 in a stepped concave portion 81 of the oil seal 8.
The upper surface of 4 is provided with a seal portion 85 that spreads upward like a trumpet. Further, the suction member 35a
Has a top pad 87 movably fitted to a seal portion 85 of an oil seal 84 and having a suction hole 86 at the center. Note that the other suction members 35b to 35h have exactly the same configuration as the suction member 35a, and a detailed description thereof will be omitted.
【0029】さらに,図8に示すように,各吸着部材3
5a〜35hは,真空吸引手段90によってLCD基板
Gを吸着する構成を有しており,載置台34は,真空吸
引手段90と各吸着部材35a〜35hとを結ぶ各吸引
路91a〜91hと,各吸引路91a〜91hの途中に
介装された開閉弁92a〜92hと,開閉弁92a〜9
2hの開閉を制御する制御部93とを備えている。そし
て,各吸着部材35a〜35hが吸着動作する際には,
制御部93から出力された制御信号により開閉弁92a
〜92hを開かせる。これにより常時作動している真空
吸引手段90の機能が初めて作用し,トップバッド87
が吸引しLCD基板Gの傾斜や変形に追従して密着し,
LCD基板Gを確実に吸着できる構成になっている。Further, as shown in FIG.
5a to 35h have a configuration in which the LCD substrate G is sucked by the vacuum suction means 90. The mounting table 34 includes suction paths 91a to 91h connecting the vacuum suction means 90 and the suction members 35a to 35h. Opening / closing valves 92a to 92h provided in the middle of each of the suction passages 91a to 91h, and opening / closing valves 92a to 92h
And a control unit 93 for controlling the opening and closing of 2h. When the suction members 35a to 35h perform the suction operation,
On-off valve 92a according to a control signal output from control unit 93
Open ~ 92h. As a result, the function of the vacuum suction means 90 which is always operating operates for the first time, and the top pad 87 operates.
Is sucked and adheres following the inclination and deformation of the LCD substrate G,
The configuration is such that the LCD substrate G can be reliably sucked.
【0030】制御部93は,全ての吸着部材35a〜3
5hが同時に作動するように一斉に制御信号を全ての開
閉弁92a〜92hに出力するようには設定されておら
ず,開閉弁92a〜92hの何れかに制御信号を出力
し,8個の吸着部材35a〜35hのうち8個の吸着部
材をそれぞれ個々に又は吸着手段35a〜35hのうち
2個以上の吸着手段を組合わせたグループ毎に吸着動作
を行うか否かを制御するように構成されている。本実施
の形態では,載置台34の中心を挟んで対向する2つの
吸着部材35a,35eと,吸着部材35b,35e
と,吸着部材35c,35gと,吸着部材35d,35
hとを組合わせ,吸着動作を行うこれら各吸着部材35
a〜35hの各グループを,所定の時間ごとに順次移行
させる構成になっている。The control unit 93 includes all the suction members 35a to 35a.
The control signal is not set to be output to all of the on-off valves 92a to 92h at the same time so that 5h operates simultaneously, but the control signal is output to any of the on-off valves 92a to 92h, and the eight suction valves are output. It is configured to control whether or not to perform the suction operation on each of the eight suction members among the members 35a to 35h individually or for each group in which two or more suction members among the suction members 35a to 35h are combined. ing. In the present embodiment, two suction members 35a, 35e opposed to each other with the center of the mounting table 34 interposed therebetween, and suction members 35b, 35e.
And the suction members 35c and 35g, and the suction members 35d and 35
h to perform the suction operation.
The groups a to 35h are sequentially shifted at predetermined time intervals.
【0031】以上,本実施の形態にかかる塗布・周縁部
除去装置24および載置台34は以上のように構成され
ており,次に上記処理システム1に備えられた塗布・周
縁部除去装置24におけるLCD基板Gの保持動作につ
いて説明する。As described above, the coating / peripheral portion removing device 24 and the mounting table 34 according to the present embodiment are configured as described above. Next, the coating / peripheral portion removing device 24 provided in the processing system 1 will be described. The holding operation of the LCD substrate G will be described.
【0032】まず,カセット11内に収容された未処理
のLCD基板Gはローダ部2のサブ搬送アーム13によ
って取出された後,第1の処理部3のメイン搬送アーム
15に受け渡され,そして,ブラシ洗浄装置17内に搬
送される。このブラシ洗浄装置17内にてブラシ洗浄さ
れたLCD基板Gは,この後,アドヒージョン装置19
にて疎水化処理が施され,冷却装置21にて冷却され
る。その後,塗布・周縁部除去装置24の塗布系30に
搬入され,レジスト液がLCD基板Gの表面に塗布さ
れ,引き続きLCD基板Gは隣接する周縁部除去系31
に搬送機構32によって搬入され周縁部に付着した不要
なレジスト膜を除去する工程に移行する。First, the unprocessed LCD substrate G accommodated in the cassette 11 is taken out by the sub-transport arm 13 of the loader unit 2 and then transferred to the main transport arm 15 of the first processing unit 3. , And is transported into the brush cleaning device 17. The LCD substrate G, which has been brush-cleaned in the brush cleaning device 17, is thereafter subjected to an adhesion device 19.
, And is cooled by the cooling device 21. Thereafter, the substrate is carried into the coating system 30 of the coating / periphery removing device 24, and the resist solution is applied to the surface of the LCD substrate G.
Then, the process proceeds to a step of removing an unnecessary resist film carried in by the transport mechanism 32 and adhered to the peripheral portion.
【0033】周縁部除去系31では,搬送機構32によ
って内部に搬入したLCD基板Gをシリンダ38の伸張
稼働によって上昇した載置台34の上面で突き上げ,吸
着部材34でLCD基板Gの裏面を吸着することによ
り,LCD基板Gを載置台34の上面に保持する。この
保持後,搬送機構32が周縁部除去系31から退避する
と,シリンダ38の短縮稼働によって載置台34が下降
し,図3に示したように,周縁部除去系31内にLCD
基板Gが搬入される。In the peripheral edge removing system 31, the LCD substrate G carried into the inside by the transport mechanism 32 is pushed up on the upper surface of the mounting table 34 which is raised by the extension operation of the cylinder 38, and the back surface of the LCD substrate G is sucked by the suction member 34. Thus, the LCD substrate G is held on the upper surface of the mounting table 34. After the holding, when the transport mechanism 32 retreats from the peripheral edge removing system 31, the mounting table 34 is lowered by the shortening operation of the cylinder 38, and as shown in FIG.
The substrate G is loaded.
【0034】次いで,各ノズル55,56,57,58
がLCD基板Gの四辺L1,L2,L3,L4のそれぞ
れに沿って移動を開始する。この移動により,図5に示
したように,LCD基板Gの周縁部が非接触の状態で各
ノズル55,56,57,58の隙間77に嵌入され,
上吹き出し孔74および下吹き出し孔76からの溶剤と
してのシンナの吹き出しを開始する。そして,吸引孔7
8からの吸引排気も開始され,LCD基板Gの周縁部に
付着している不要なレジスト膜がシンナによって溶解さ
れ,その溶解したレジスト液を吸引孔78から吸引排気
することによって,LCD基板Gの周縁部の不要なレジ
スト膜が除去される。Next, each of the nozzles 55, 56, 57, 58
Starts moving along each of the four sides L1, L2, L3, L4 of the LCD substrate G. By this movement, as shown in FIG. 5, the periphery of the LCD substrate G is fitted into the gap 77 between the nozzles 55, 56, 57, 58 in a non-contact state,
The blowing of thinner as a solvent from the upper blowing hole 74 and the lower blowing hole 76 is started. And the suction hole 7
8, the unnecessary resist film adhering to the peripheral portion of the LCD substrate G is dissolved by the thinner, and the dissolved resist solution is sucked and exhausted from the suction holes 78 to thereby discharge the LCD substrate G. Unnecessary resist film on the periphery is removed.
【0035】こうしてLCD基板Gの周縁部に付着して
いる不要なレジスト膜が除去された後,載置台34が上
昇され,塗布現像処理システム1のメイン搬送アーム2
2が塗布・周縁部除去装置24内に進入しLCD基板G
を受け取る。これにより,塗布・周縁部除去装置24か
らLCD基板Gが搬出される。次いで,加熱装置20内
に搬入されレジスト膜に対してべーキング処理が施され
た後,露光装置6にて所定のパターンが露光される。そ
して,露光後のLCD基板Gは現像装置18内へ搬送さ
れ,現像液により現像された後にリンス液により現像液
を洗い流し,現像処理を完了する。現像処理された処理
済みのLCD基板Gは,ローダ部2のカセット12内に
収納された後に搬出され,次の処理工程に向けて移送さ
れる。After the unnecessary resist film adhering to the peripheral portion of the LCD substrate G is removed in this way, the mounting table 34 is raised, and the main transfer arm 2 of the coating and developing system 1 is moved.
2 enters the coating / periphery removing device 24 and the LCD substrate G
Receive. As a result, the LCD substrate G is carried out from the coating / peripheral part removing device 24. Next, after being carried into the heating device 20 and subjected to a baking process on the resist film, a predetermined pattern is exposed by the exposure device 6. Then, the exposed LCD substrate G is transported into the developing device 18, and after being developed by the developing solution, the developing solution is washed away by the rinsing solution, and the developing process is completed. The processed LCD substrate G that has been subjected to the development processing is housed in the cassette 12 of the loader unit 2 and then carried out and transferred to the next processing step.
【0036】以上のような周縁レジスト膜除去工程にお
いて,LCD基板Gの裏面に転写跡を残さないようにす
るための重要な役割を担うのは載置台34に設けられた
吸着部材35a〜hであり,全ての吸着部材35a〜3
5hが処理中終始一貫して吸着動作を行うのではなく,
これら吸着部材35a〜35hの中から順次選ばれたも
のが適宜吸着動作を行い,転写後が残る前に吸着動作を
停止させて,LCD基板Gの裏面における吸着箇所をそ
の都度移行させることによりLCD基板Gを載置台34
に保持するものである。例えば以下のような吸着動作が
行われている。In the above-described peripheral resist film removing step, the suction members 35a to 35h provided on the mounting table 34 play an important role in preventing transfer marks from remaining on the back surface of the LCD substrate G. Yes, all suction members 35a-3
5h does not perform the suction operation consistently throughout the processing,
One of these suction members 35a to 35h sequentially performs an appropriate suction operation, stops the suction operation before the transfer is left, and shifts the suction portion on the back surface of the LCD substrate G in each case. Place the substrate G on the mounting table 34
Is to be held. For example, the following suction operation is performed.
【0037】まず,吸着部材35a〜35hにおいて,
基板の中心を挟んで対向するもの同士が同時に動作が行
えるように,吸着部材35a,35eと,吸着部材35
b,35fと,吸着部材35c,35gと,吸着部材3
5d,35hとがグループとして設定され,吸着部材3
5a,35eが吸着動作する場合には開閉弁92a,9
2eに,吸着部材35b,35fが吸着動作する場合に
は開閉弁92b,92fに,吸着部材35c,35gが
吸着動作する場合には開閉弁92c,92gに,吸着部
材35d,35hが吸着動作する場合には開閉弁92
d,92hに制御部93がそれぞれ制御信号を出力す
る。このようなLCD基板Gの中心を挟んで対向した2
箇所で裏面を吸着されているLCD基板Gは,処理中常
に安定して基板載置台34に保持されることになる。First, in the suction members 35a to 35h,
The suction members 35a and 35e and the suction members 35
b, 35f, suction members 35c, 35g, and suction member 3
5d and 35h are set as a group, and the suction members 3
When the suction operation is performed on the valves 5a and 35e, the on-off valves 92a and 9
2e, when the suction members 35b and 35f perform the suction operation, the attraction members 35d and 35h perform the suction operation at the on-off valves 92b and 92f, and when the suction members 35c and 35g perform the suction operation, at the on-off valves 92c and 92g. In case of on-off valve 92
The control unit 93 outputs control signals to d and 92h, respectively. 2 facing each other across the center of such an LCD substrate G
The LCD substrate G whose back surface is sucked at the location is always stably held on the substrate mounting table 34 during processing.
【0038】吸着部材35a,35eと,吸着部材35
b,35fと,吸着部材35c,35gと,吸着部材3
5d,35hとは何れも同様に吸着動作するので,代表
して吸着部材35a,35eの吸着動作について述べる
と以下のようになる。制御部93から制御信号が開閉弁
92a,92eに出力された場合には,開閉弁92a,
92eが共に開き吸引路91a,91e内が連通され真
空吸引手段90の機能が作用し吸着部材35a,35e
は吸着動作する。一方,制御部93から制御信号が開閉
弁92a,92eに出力されない場合には,開閉弁92
a,92eが閉じ吸引路91a,91e内が遮断され,
真空吸引手段90の機能が作用せず吸着手段35a,3
5eは吸着動作しない。このように吸着部材35a,3
5eは制御部93によって吸着動作を正確に制御され
る。なお,吸着部材35b,35fと,吸着部材35
c,35gと,吸着部材35d,35hも 吸着部材3
5a,35eと同様に制御部93によって吸着動作を正
確に制御される。The suction members 35a and 35e and the suction member 35
b, 35f, suction members 35c, 35g, and suction member 3
Since the suction operation is performed similarly for 5d and 35h, the suction operation of the suction members 35a and 35e will be described below as a representative. When a control signal is output from the control unit 93 to the on-off valves 92a and 92e, the on-off valves 92a and 92e
The suction passages 92e are both opened, and the insides of the suction passages 91a and 91e are communicated with each other, and the function of the vacuum suction means 90 is operated to operate the suction members 35a and 35e.
Performs the suction operation. On the other hand, when the control signal is not output from the control unit 93 to the on-off valves 92a and 92e,
a, 92e are closed and the inside of the suction passages 91a, 91e is shut off,
The function of the vacuum suction means 90 does not work and the suction means 35a, 3
5e does not perform the suction operation. Thus, the suction members 35a, 3
In step 5e, the suction operation is accurately controlled by the control unit 93. The suction members 35b and 35f and the suction members 35
c, 35g and the suction members 35d, 35h are also suction members 3.
As in 5a and 35e, the suction operation is accurately controlled by the control unit 93.
【0039】さらに吸着部材35a〜35hの吸着時間
は,LCD基板Gに対する処理を施す時間より短くなる
ように所定時間以下に設定されており,所定時間を越え
てもなお吸着部材35a〜35hが吸着動作を行いLC
D基板Gの裏面に転写跡が残るのを未然に防止してい
る。この場合,制御部93は所定の時間ごとに,開閉弁
92a〜92h内のあるグループに出力しそれ以外のグ
ループには制御信号を出力せず,吸着部材35a〜35
h内では所定の時間ごとに,吸着動作を行うグループと
それ以外のグループとに選別される。そして,吸着部材
35a〜35h内から適宜選別されたグループが所定の
時間吸着動作を行い,このグループの吸着動作が終了す
ると共に吸着部材35a〜35h内の別のグループに吸
着動作が移行していき,同様に所定の時間吸着動作を行
い,以後処理が終了するまでこれを順次繰り返すので,
LCD基板Gの裏面における吸着箇所は固定されない。
こうしてLCD基板Gの裏面に吸着部材35a〜35h
の転写跡を残さずともLCD基板Gを処理中常に載置台
34に保持させることができる。なお,一度所定の時間
動作した吸着部材35a〜35h内のグループは二度と
動作を行えないわけではなく,吸着動作が完了した後に
ある程度休止すれば再び吸着動作を行うことが可能であ
る。Further, the suction time of the suction members 35a to 35h is set to be equal to or shorter than a predetermined time so as to be shorter than the time for performing the processing on the LCD substrate G. Operate and LC
Transfer marks are prevented from remaining on the back surface of the D substrate G. In this case, the control unit 93 outputs the control signal to a certain group in the on-off valves 92a to 92h at predetermined time intervals and does not output a control signal to the other groups.
Within h, a group that performs the suction operation and another group are selected at predetermined time intervals. Then, a group appropriately selected from among the suction members 35a to 35h performs the suction operation for a predetermined time, and the suction operation of this group ends, and the suction operation shifts to another group in the suction members 35a to 35h. Similarly, the suction operation is performed for a predetermined period of time, and this operation is sequentially repeated until the processing is completed.
The suction location on the back surface of the LCD substrate G is not fixed.
Thus, the suction members 35a to 35h are provided on the rear surface of the LCD substrate G.
, The LCD substrate G can be always held on the mounting table 34 during processing without leaving a transfer mark. It is to be noted that the group in the suction members 35a to 35h that have operated once for a predetermined time cannot be operated again, and the suction operation can be performed again if the operation is stopped to some extent after the suction operation is completed.
【0040】ここで本実施の形態では,吸着部材35a
〜hの吸着動作の移行は,時計回りに基板の周縁部に沿
って順次切り換えられていくプロセスが採用されてい
る。図9(a)〜(d)に示したように,一方は吸着部
材35aから吸着動作の移行プロセスが開始し,他方で
は吸着部材35eから吸着動作の移行プロセスが開始す
る。この場合,吸着部材35a及び吸着部材35eは同
時に吸着動作の開始→所定の時間が経過して吸着部材3
5a及び吸着部材35eは同時に吸着動作を停止(図9
(a))→吸着部材35b及び吸着部材35fは同時に
吸着動作の開始→所定の時間が経過して吸着部材35b
及び吸着部材35fは同時に吸着動作を停止(図9
(b))→吸着部材35c及び吸着部材35gは同時に
吸着動作の開始→所定の時間が経過して吸着部材35c
及び吸着部材35gは同時に吸着動作を停止(図9
(c))→吸着部材35d及び吸着部材35hは同時に
吸着動作の開始→所定の時間が経過して吸着部材35d
及び吸着部材35hは同時に吸着動作を停止(図9
(d))という,移行プロセスを経て最初の状態に戻
る。そして,再び同じ移行プロセスを開始する。このプ
ロセスは,LCD基板Gの周縁部除去系31内の搬入,
周縁レジスト膜の除去,周縁部除去系31内からの搬入
という一連の工程において,繰り返されることになる。
このようにLCD基板Gの中心を挟んで対向した2箇所
でLCD基板Gの裏面を吸着し,しかもこれら吸着部材
35a〜35hを規則正しく移行させていくので,より
安定したLCD基板Gの保持が行われる。Here, in the present embodiment, the suction member 35a
The process of sequentially shifting the suction operation of (h) to (h) is sequentially switched along the periphery of the substrate in the clockwise direction. As shown in FIGS. 9A to 9D, the transfer process of the suction operation starts from the suction member 35 a on one side, and the transfer process of the suction operation starts from the suction member 35 e on the other side. In this case, the suction members 35a and 35e start the suction operation at the same time.
9a and the suction member 35e simultaneously stop the suction operation (FIG. 9).
(A)) → Suction member 35b and suction member 35f start suction operation at the same time → Suction member 35b
The suction member 35f simultaneously stops the suction operation (FIG. 9).
(B)) → The suction member 35c and the suction member 35g start the suction operation at the same time → After a predetermined time elapses, the suction member 35c
And the suction member 35g simultaneously stops the suction operation (FIG. 9).
(C)) The suction member 35d and the suction member 35h start the suction operation at the same time → After a predetermined time elapses, the suction member 35d
And the suction member 35h simultaneously stops the suction operation (FIG. 9).
(D)), which returns to the initial state through the transition process. Then, the same transition process is started again. This process involves loading the LCD substrate G into the peripheral edge removing system 31,
The process is repeated in a series of steps of removing the peripheral resist film and carrying in from the peripheral portion removing system 31.
As described above, the back surface of the LCD substrate G is sucked at two places opposed to each other with the center of the LCD substrate G interposed therebetween, and the sucking members 35a to 35h are regularly shifted. Will be
【0041】この移行プロセスにおいて,先に吸着動作
を行っている吸着部材35a〜35h内のグループと次
に吸着動作を行っている吸着部材35a〜35h内のグ
ループとの移行のタイミングは,先に吸着動作を行って
いる吸着部材35a〜35h内のグループが吸着動作を
停止すると同時に次に吸着動作を行っている吸着部材3
5a〜35h内のグループが吸着動作を開始するように
してもよいし,先に吸着動作を行っている吸着部材35
a〜35h内のグループが吸着動作を停止する直前から
次に吸着動作を行っている吸着部材35a〜35h内の
グループが吸着動作を開始するようにしてよい。いずれ
にしても,処理の種類に応じて自由に設定できる。In this transition process, the timing of transition between the group in the suction members 35a to 35h performing the suction operation first and the group in the suction members 35a to 35h performing the suction operation next is determined in advance. The group in the suction members 35a to 35h performing the suction operation stops the suction operation, and at the same time, the suction member 3 performing the next suction operation.
The group within 5a to 35h may start the suction operation, or the suction member 35 that has performed the suction operation first.
Immediately before the group in a to 35h stops the suction operation, the group in the suction members 35a to 35h performing the next suction operation may start the suction operation. In any case, it can be set freely according to the type of processing.
【0042】かくして,本実施の形態によれば,吸着動
作を行う吸着部材35a〜35hを順次移行させ,LC
D基板Gの裏面における吸着箇所を所定時間以上に渡り
固定させない。従って,処理の最初から終わりまでLC
D基板Gを載置台34が吸着・保持してもLCD基板G
の裏面に吸着部材35a〜35hの転写跡が残ることを
防止できる。その結果,LCD基板Gの製品不良を解決
することができ,歩留まりを向上させることが可能とな
る。なお,吸着部材35a〜35h内のグループ分け
は,2個の吸着部材の組合わせに限らず,3個,4個及
びそれ以上を組合わせてグループを形成してもよい。極
端な例として,吸着部材35a〜35hうち単に1個の
吸着部材を停止させ,この停止している吸着部材を順次
移行させるといったものが考えられる。Thus, according to the present embodiment, the suction members 35a to 35h performing the suction operation are sequentially shifted, and
The suction location on the back surface of the D substrate G is not fixed for more than a predetermined time. Therefore, LC from the beginning to the end of the process
Even if the mounting table 34 sucks and holds the D substrate G, the LCD substrate G
The transfer marks of the suction members 35a to 35h can be prevented from remaining on the back surface of the recording medium. As a result, product defects of the LCD substrate G can be resolved, and the yield can be improved. Note that the grouping of the suction members 35a to 35h is not limited to the combination of two suction members, and a group may be formed by combining three, four or more members. As an extreme example, it is conceivable to simply stop one of the suction members 35a to 35h and sequentially shift the stopped suction members.
【0043】なお,本発明の実施の形態の一例について
説明したが,本発明はこの例に限定されるものでなく,
種々の様態を採りうるものである。例えば,図10に示
すように,載置台100において,載置台100の中心
を挟んで対向位置にある吸引部材35aの吸引路91a
と吸引部材35eの吸引路91eの一部が共通接続さ
れ,同様に吸引部材35bの吸引路91bと吸引部材3
5fの吸引路91fの一部が共通接続され,同様に吸引
部材35cの吸引路91cと吸引部材35gの吸引路9
1gの一部が共通接続され,同様に吸引部材35dの吸
引路91dと吸引部材35hの吸引路91hの一部が共
通接続されるようにしてもよい。この場合,吸引路91
aと吸引路91eとを接続点N1で共通接続させ,接続
点N1と真空吸引手段90との間を接続している吸引路
101aの途中に開閉弁102aを介装する。同様に,
吸引路91bと吸引路91fを接続点N2で共通接続さ
せ,接続点N2と真空吸引手段90との間を接続してい
る吸引路101bの途中に開閉弁102bを介装する。Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example.
It can take various aspects. For example, as shown in FIG. 10, in the mounting table 100, the suction path 91 a of the suction member 35 a at a position facing the center of the mounting table 100.
And a part of the suction passage 91e of the suction member 35e is commonly connected, and similarly, the suction passage 91b of the suction member 35b and the suction member 3 are connected.
A part of the suction path 91f of 5f is connected in common, and similarly, the suction path 91c of the suction member 35c and the suction path 9 of the suction member 35g are similarly connected.
A part of 1g may be commonly connected, and similarly, a part of the suction path 91d of the suction member 35d and a part of the suction path 91h of the suction member 35h may be commonly connected. In this case, the suction path 91
a and the suction passage 91e are commonly connected at a connection point N1, and an on-off valve 102a is interposed in the suction passage 101a connecting the connection point N1 and the vacuum suction means 90. Similarly,
The suction path 91b and the suction path 91f are commonly connected at a connection point N2, and an on-off valve 102b is interposed in the suction path 101b connecting the connection point N2 and the vacuum suction means 90.
【0044】同様に,吸引路91cと吸引路91gを接
続点N3で共通接続させ,接続点N3と真空吸引手段9
0との間を接続している吸引路101cの途中に開閉弁
102cを介装する。同様に,吸引路91dと吸引路9
1hを接続点N4で共通接続させ,接続点N4と真空吸
引手段90との間を接続している吸引路101dの途中
に開閉弁102dを介装する。かかる構成によれば,開
閉弁102a〜102dの中から一つの開閉弁を開閉切
換えするだけで吸着部材35a〜35hの中の二つ吸着
部材の吸着動作を同時に制御できる。例えば,開閉弁1
02aを開閉切換すると,吸引路90a,90eが真空
吸引手段90から連通,遮断されて吸着部材35a,3
5eの吸着動作が制御される。従って,載置台100に
おける吸着手段35a〜35hの制御動作を通常どおり
に行いながらも開閉弁の個数が減るので,これら開閉弁
102a〜102dを制御する制御部93の負担が軽く
なると共に,載置台100にかかる構成要素の簡素化も
図ることができる。Similarly, the suction path 91c and the suction path 91g are commonly connected at the connection point N3, and the connection point N3 and the vacuum suction means 9 are connected.
An on-off valve 102c is interposed in the middle of the suction path 101c connecting between the valve 102 and the zero. Similarly, the suction path 91d and the suction path 9
1h is commonly connected at a connection point N4, and an on-off valve 102d is interposed in the middle of a suction path 101d connecting the connection point N4 and the vacuum suction means 90. According to such a configuration, the suction operation of the two suction members among the suction members 35a to 35h can be simultaneously controlled only by switching the opening and closing of one of the open / close valves 102a to 102d. For example, on-off valve 1
02a, the suction passages 90a and 90e are communicated with and blocked by the vacuum suction means 90, and the suction members 35a and 3e are closed.
The suction operation of 5e is controlled. Accordingly, the number of on-off valves is reduced while the operation of controlling the suction means 35a to 35h in the mounting table 100 is performed as usual, so that the load on the control unit 93 for controlling these on-off valves 102a to 102d is reduced, and the mounting table is reduced. It is possible to simplify the components related to 100.
【0045】また,図11に示すように,吸引路91a
〜91hの全てを接続点N5で共通接続させ,これら吸
引路91a〜91hを接続点N5と真空吸引手段90と
の間を接続している吸引路104を介して真空吸引手段
90に接続させるようにしてもよい。かかる構成によれ
ば,吸引路91a〜91hを真空吸引手段90にそれぞ
れ接続する手間が省ける。As shown in FIG. 11, the suction path 91a
To 91h are commonly connected at a connection point N5, and these suction paths 91a to 91h are connected to the vacuum suction means 90 via a suction path 104 connecting the connection point N5 and the vacuum suction means 90. It may be. According to such a configuration, the labor for connecting the suction paths 91a to 91h to the vacuum suction means 90 can be omitted.
【0046】上記移行プロセスにおいても種々の様態を
採りうることが可能である。例えば,移行プロセスにお
いて,吸着動作の切り換えの順番を反時計回りになるよ
うにしてもよい。また,時計回り又は反時計回りといっ
た規則正しい吸着部材35a〜35hの移行プロセスに
限らず,いわゆる不規則な移行プロセスを採用すること
も可能である。Various aspects can be adopted in the above transition process. For example, in the transition process, the order of switching the suction operation may be set to be counterclockwise. In addition, not only the transfer process of the regular suction members 35a to 35h such as clockwise or counterclockwise, but also a so-called irregular transfer process can be adopted.
【0047】さらに,図12〜図16に示すように,ノ
ズル55,57,57,58をLCD基板Gの周縁部に
沿って移動させつつにLCD基板Gにレジスト液を供給
する際に,これらノズル55,57,57,58の移動
に伴って,吸着動作を行う吸着部材105a〜100p
を順次移行させるようにしてもよい。この場合,載置台
34の四隅に吸着部材105a,105e,105i,
105mをそれぞれ配置し,吸着部材105aと105
eとの間に吸着部材105b,105c,105dを適
宜間隔を置いて配置し,同様に吸着部材105eと10
5iとの間に吸着部材105f,105g,105hを
適宜間隔を置いて配置し,同様に吸着部材105iと1
05mとの間に吸着部材105j,105k,105l
を適宜間隔を置いて配置し,同様に吸着部材105mと
105aとの間に吸着部材105n,105o,105
pを適宜間隔を置いて配置している。図示の例では,吸
着部材105a〜105eはLCD基板Gの短辺L3側
に並べられ,吸着部材105e〜105iはLCD基板
Gの長辺L2側に並べられ,吸着部材105i〜105
mはLCD基板Gの長辺L1側に並べられ,吸着部材1
05m〜105aはLCD基板Gの長辺L4側に並べら
れている。Further, as shown in FIGS. 12 to 16, when the resist liquid is supplied to the LCD substrate G while the nozzles 55, 57, 57, 58 are moved along the periphery of the LCD substrate G, Suction members 105a to 100p that perform a suction operation as the nozzles 55, 57, 57, 58 move.
May be sequentially shifted. In this case, the suction members 105a, 105e, 105i,
105m, and adsorbing members 105a and 105m
e, the suction members 105b, 105c, and 105d are disposed at appropriate intervals, and similarly, the suction members 105e and
5i, the suction members 105f, 105g, and 105h are disposed at appropriate intervals, and similarly,
05m and the adsorbing members 105j, 105k, 105l
Are arranged at appropriate intervals, and similarly, the adsorbing members 105n, 105o, and 105 are provided between the adsorbing members 105m and 105a.
p are arranged at appropriate intervals. In the illustrated example, the suction members 105a to 105e are arranged on the short side L3 side of the LCD substrate G, the suction members 105e to 105i are arranged on the long side L2 side of the LCD substrate G, and the suction members 105i to 105e are arranged.
m are arranged on the long side L1 side of the LCD substrate G,
05m to 105a are arranged on the long side L4 side of the LCD substrate G.
【0048】以上のような構成において,図12〜図1
6に示すように,短辺L1側ではノズル55がLCD基
板Gの短辺L1に沿って移動するのに伴い,吸着部材1
05i→吸着部材105j→吸着部材105k→吸着部
材105l→吸着部材105mといった順番で移行プロ
セスが行われる。短辺L2側ではノズル56がLCD基
板Gの短辺L2に沿って移動するのに伴い,吸着部材1
05e→吸着部材105f→吸着部材105g→吸着部
材105h→吸着部材105iといった順番で移行プロ
セスが行われる。短辺L3側ではノズル57がLCD基
板Gの短辺L3に沿って移動するのに伴い,吸着部材1
05a→吸着部材105b→吸着部材105c→吸着部
材105d→吸着部材105eといった順番で移行プロ
セスが行われる。短辺L4側ではノズル58がLCD基
板Gの短辺L4に沿って移動するのに伴い,吸着部材1
05m→吸着部材105n→吸着部材105o→吸着部
材105p→吸着部材105aといった順番で移行プロ
セスが行われる。かかる移行プロセスによれば,ノズル
55,56,57,58によってレジスト膜が除去され
ているLCD基板Gの周縁部近傍に対向した裏面が吸着
され安定した状態となるので,周縁レジスト膜の除去を
円滑に行うことができる。また,吸着動作を行う吸着手
段105a〜105pを,ノズルの移動とは逆方向から
順次移行させるようにしてもよい。In the above configuration, FIGS.
As shown in FIG. 6, on the short side L1 side, as the nozzle 55 moves along the short side L1 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05i → adsorption member 105j → adsorption member 105k → adsorption member 105l → adsorption member 105m. On the short side L2 side, as the nozzle 56 moves along the short side L2 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05e → adsorption member 105f → adsorption member 105g → adsorption member 105h → adsorption member 105i. On the short side L3 side, as the nozzle 57 moves along the short side L3 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05a → adsorption member 105b → adsorption member 105c → adsorption member 105d → adsorption member 105e. On the short side L4 side, as the nozzle 58 moves along the short side L4 of the LCD substrate G, the suction member 1
The transition process is performed in the order of 05m → adsorption member 105n → adsorption member 105o → adsorption member 105p → adsorption member 105a. According to this transition process, the back surface facing the periphery of the LCD substrate G, from which the resist film has been removed by the nozzles 55, 56, 57, 58, is attracted and brought into a stable state. It can be done smoothly. Further, the suction means 105a to 105p performing the suction operation may be sequentially shifted from the direction opposite to the movement of the nozzle.
【0049】なお,基板は上記した本実施の形態のよう
にLCD基板Gに限るものでなく,半導体ウェハ,ガラ
ス基板,CD基板,フォトマスク,プリント基板,セラ
ミック基板等でもあってもよい。The substrate is not limited to the LCD substrate G as in the above-described embodiment, but may be a semiconductor wafer, a glass substrate, a CD substrate, a photomask, a printed substrate, a ceramic substrate, or the like.
【0050】[0050]
【発明の効果】請求項1に記載の発明によれば,基板の
裏面における吸着箇所を順次移行させることができるの
で,処理の最初から終わりまで基板を載置台が吸着し保
持しても,基板の裏面に吸着手段の転写跡が残ることを
防止できる。従って,基板の保持を好適に実施して基板
の製品不良を解決でき,歩留まりの向上を図ることが可
能である。According to the first aspect of the present invention, since the suction position on the back surface of the substrate can be sequentially shifted, even if the mounting table sucks and holds the substrate from the beginning to the end of the processing, Transfer marks of the suction means can be prevented from remaining on the back surface of the substrate. Therefore, it is possible to solve the product defect of the substrate by suitably holding the substrate and improve the yield.
【0051】さらに請求項2又は3に記載の発明によれ
ば,さらに安定して基板を載置台に保持することができ
る。According to the second or third aspect of the present invention, the substrate can be more stably held on the mounting table.
【0052】請求項4及び5に記載の発明によれば,請
求項1〜3に記載の基板保持方法を好適に実施すること
ができる。特に請求項5によれば,制御手段は吸着動作
をさせる吸着手段とそれ以外の吸着手段との選別を的確
に行えるので,吸着動作を行う吸着手段の移行プロセス
を当初の計画通りに進行させることが可能となる。According to the fourth and fifth aspects of the present invention, the substrate holding method according to the first to third aspects can be suitably implemented. In particular, according to the fifth aspect, the control means can accurately select the suction means for performing the suction operation and the other suction means, so that the transition process of the suction means for performing the suction operation proceeds as originally planned. Becomes possible.
【0053】さらに,請求項6に記載の発明によれば,
開閉弁の個数が減るので制御手段における制御機能の負
担が軽減し,吸引手段によって基板を吸引する構成を簡
素化することができる。Further, according to the invention described in claim 6,
Since the number of on-off valves is reduced, the load on the control function of the control means is reduced, and the structure for sucking the substrate by the suction means can be simplified.
【0054】請求項7に記載の発明によれば,処理液供
給ノズルによって処理されている基板の周縁部近傍に対
向した裏面が吸着され安定した状態となり,好適に処理
を行うことができる。According to the seventh aspect of the present invention, the back surface opposed to the vicinity of the periphery of the substrate being processed by the processing liquid supply nozzle is attracted to a stable state, so that the processing can be suitably performed.
【図1】本発明の実施の形態にかかる載置台及び塗布・
周縁部除去装置を備えた塗布現像処理システムの斜視図
である。FIG. 1 is a view showing a mounting table and a coating and coating apparatus according to an embodiment of the present invention.
1 is a perspective view of a coating and developing system including a peripheral edge removing device.
【図2】本発明の実施の形態にかかる塗布・周縁部除去
装置の平面図である。FIG. 2 is a plan view of a coating / periphery removing device according to the embodiment of the present invention.
【図3】本発明の実施の形態にかかる塗布・周縁部除去
装置の縁部除去系側の断面図である。FIG. 3 is a cross-sectional view of the coating / periphery removing apparatus according to the embodiment of the present invention, on an edge removing system side;
【図4】周縁部除去系の平面図である。FIG. 4 is a plan view of a peripheral edge removing system.
【図5】ノズルの断面図である。FIG. 5 is a sectional view of a nozzle.
【図6】載置台の斜視図である。FIG. 6 is a perspective view of a mounting table.
【図7】吸着部材の斜視図である。FIG. 7 is a perspective view of a suction member.
【図8】載置台に接続される吸引系統の回路を示す説明
図である。FIG. 8 is an explanatory diagram showing a circuit of a suction system connected to a mounting table.
【図9】吸着動作を行う吸着部材の移行プロセスを示す
工程図である。FIG. 9 is a process chart showing a transfer process of a suction member performing a suction operation.
【図10】載置台に接続される吸引系統の回路の他の例
を示す説明図である。FIG. 10 is an explanatory diagram showing another example of a suction system circuit connected to the mounting table.
【図11】載置台に接続される吸引系統の回路の他の例
の要部を示す説明図である。FIG. 11 is an explanatory diagram showing a main part of another example of a suction system circuit connected to the mounting table.
【図12】ノズルの移動に伴いを吸着動作を行う吸着部
材を順次移行させた場合の様子を示す説明図である。FIG. 12 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
【図13】ノズルの移動に伴いを吸着動作を行う吸着部
材を順次移行させた場合の様子を示す説明図である。FIG. 13 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
【図14】ノズルの移動に伴いを吸着動作を行う吸着部
材を順次移行させた場合の様子を示す説明図である。FIG. 14 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted with movement of a nozzle.
【図15】ノズルの移動に伴いを吸着動作を行う吸着部
材を順次移行させた場合の様子を示す説明図である。FIG. 15 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
【図16】ノズルの移動に伴いを吸着動作を行う吸着部
材を順次移行させた場合の様子を示す説明図である。FIG. 16 is an explanatory diagram illustrating a state in which suction members that perform a suction operation are sequentially shifted as the nozzle moves.
1 処理システム 24 塗布・周縁部除去装置 31 周縁部除去系 34 載置台 35a〜35h 吸着部材 55,56,57,58 ノズル 90 真空吸引手段 91a〜91h 吸引路 92a〜92h 開閉弁 93 制御部 G LCD基板 DESCRIPTION OF SYMBOLS 1 Processing system 24 Coating / peripheral part removing device 31 Peripheral part removing system 34 Mounting table 35a-35h Suction member 55,56,57,58 Nozzle 90 Vacuum suction means 91a-91h Suction path 92a-92h On-off valve 93 Control part G LCD substrate
Claims (7)
段によって基板を吸着して保持する方法において,基板
を保持している間,吸着動作を行う吸着手段を順次移行
させることを特徴とする,基板保持方法。In a method of sucking and holding a substrate by a plurality of suction means provided on an upper surface of a substrate mounting portion, the suction means for performing a suction operation is sequentially shifted while holding the substrate. The substrate holding method.
なくとも2つの吸着手段は同時に吸着動作を行わせるこ
とを特徴とする,請求項1に記載の基板保持方法。2. The substrate holding method according to claim 1, wherein at least two suction means opposed to each other with the center of the substrate mounting portion interposed therebetween perform the suction operation at the same time.
縁部に沿って配置され,吸着動作は時計回り又は反時計
回りに移行させることを特徴とする,請求項1又は2に
記載の基板保持方法。3. The substrate according to claim 1, wherein the suction means is arranged at least along a peripheral edge of the substrate mounting portion, and the suction operation is shifted clockwise or counterclockwise. Retention method.
部を有する基板を保持する装置であって,各吸着手段の
吸着動作を,個々の吸着手段毎に又は吸着手段群毎に,
作動及び停止させる制御手段を備えたことを特徴とす
る,基板保持装置。4. An apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein the suction operation of each suction means is performed for each suction means or each suction means group.
A substrate holding device comprising control means for starting and stopping.
部を有する基板を保持する装置であって,各吸着手段
は,真空吸引手段によって基板を吸着する構成を有し,
前記真空吸引手段と各吸着手段とを結ぶ吸引路と,各吸
引路の途中に介装された吸引路の開閉手段と,前記開閉
手段の開閉を制御する制御手段とを備えたことを特徴と
する,基板保持装置。5. An apparatus for holding a substrate having a substrate mounting portion provided with a plurality of suction means on an upper surface, wherein each suction means has a structure for sucking the substrate by vacuum suction means,
A suction path connecting the vacuum suction means and the suction means; opening and closing means for a suction path interposed in each suction path; and control means for controlling opening and closing of the opening and closing means. Substrate holding device.
る吸着手段の吸引路は少なくとも一部が共有されている
ことを特徴とする,請求項5に記載の基板保持装置。6. The substrate holding device according to claim 5, wherein at least a part of a suction path of the suction unit located at a position facing the center of the substrate mounting portion is shared.
段によって基板を吸着して保持し,処理液供給ノズルを
当該基板の周縁部に沿って移動させつつこの処理液供給
ノズルから処理液を供給して基板を処理する方法におい
て,前記処理液供給ノズルの移動に伴って,前記吸着動
作を行う吸着手段を順次移行させることを特徴とする,
基板処理方法。7. A processing liquid supply nozzle which holds a substrate by sucking and holding the substrate by a plurality of suction means provided on an upper surface of the substrate mounting portion and moves the processing liquid supply nozzle along a peripheral portion of the substrate. In the method of processing a substrate by supplying a liquid, the suction means for performing the suction operation is sequentially shifted with the movement of the processing liquid supply nozzle.
Substrate processing method.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33228897A JP3590250B2 (en) | 1997-11-18 | 1997-11-18 | Substrate processing method and substrate processing apparatus |
TW087114080A TW459266B (en) | 1997-08-27 | 1998-08-26 | Substrate processing method |
US09/141,721 US6306455B1 (en) | 1997-08-27 | 1998-08-27 | Substrate processing method |
KR10-1998-0034926A KR100505023B1 (en) | 1997-08-27 | 1998-08-27 | Substrate treatment method |
US09/940,612 US6682777B2 (en) | 1997-08-27 | 2001-08-29 | Substrate processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33228897A JP3590250B2 (en) | 1997-11-18 | 1997-11-18 | Substrate processing method and substrate processing apparatus |
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JPH11150176A true JPH11150176A (en) | 1999-06-02 |
JP3590250B2 JP3590250B2 (en) | 2004-11-17 |
Family
ID=18253287
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JP33228897A Expired - Fee Related JP3590250B2 (en) | 1997-08-27 | 1997-11-18 | Substrate processing method and substrate processing apparatus |
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Cited By (4)
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JP2008066595A (en) * | 2006-09-08 | 2008-03-21 | Tokyo Electron Ltd | Liquid treatment equipment, liquid treatment method, and storage medium |
JP2013207268A (en) * | 2012-03-29 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | Substrate processing device and substrate processing method |
JP2020061443A (en) * | 2018-10-09 | 2020-04-16 | 東京エレクトロン株式会社 | Coating, development apparatus and coating, and development method |
CN116078625A (en) * | 2023-04-13 | 2023-05-09 | 三河建华高科有限责任公司 | Ultra-thin substrate adsorption structure and even machine of gluing |
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