JPH11140564A - High elongation copper foil and its production - Google Patents
High elongation copper foil and its productionInfo
- Publication number
- JPH11140564A JPH11140564A JP31894397A JP31894397A JPH11140564A JP H11140564 A JPH11140564 A JP H11140564A JP 31894397 A JP31894397 A JP 31894397A JP 31894397 A JP31894397 A JP 31894397A JP H11140564 A JPH11140564 A JP H11140564A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- elongation
- high elongation
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Metal Rolling (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、伸び率の高い銅箔及び
その製造方法に関し、特に、電線被覆材料として使用す
るのに好適な高伸び銅箔及びその製造方法に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper foil having a high elongation and a method for producing the same, and more particularly to a high elongation copper foil suitable for use as a wire covering material and a method for producing the same.
【０００２】[0002]
【従来の技術】従来より、電線被覆材としては、合成樹
脂製フィルムと銅箔とを貼合した積層材が用いられてい
る。この積層材中における銅箔は、主として、電磁波シ
ールドのために用いられている。そして、この銅箔は、
一般的に純度が９９．９０％以上であるタフピッチ銅鋳
塊に、熱間圧延及び冷間圧延、更には中間焼鈍を施し、
厚さ９〜２５μｍ程度としたものが採用されている。2. Description of the Related Art Conventionally, as a wire covering material, a laminated material obtained by laminating a synthetic resin film and a copper foil has been used. The copper foil in this laminated material is mainly used for electromagnetic wave shielding. And this copper foil
Generally, the tough pitch copper ingot having a purity of 99.90% or more is subjected to hot rolling and cold rolling, and further to intermediate annealing,
Those having a thickness of about 9 to 25 μm are employed.
【０００３】しかし、従来用いられている銅箔は伸び率
が低く（厚さ９μｍの銅箔で伸び率３．５〜４％程
度）、被覆材として、電線に巻回する際に、破れが生じ
るということがあった。このため、銅箔に、高温で最終
焼鈍を施して、銅箔の軟化を進行させ、伸び率を高くす
ることが試みられている。また、中間焼鈍の時期や冷間
圧延時における圧下率などを調整することによって、伸
び率の高い銅箔を得ることも試みられている。However, the conventionally used copper foil has a low elongation (elongation of about 3.5 to 4% for a copper foil having a thickness of 9 μm). Sometimes happened. For this reason, it has been attempted to subject the copper foil to final annealing at a high temperature to promote the softening of the copper foil and increase the elongation. Also, attempts have been made to obtain a copper foil having a high elongation rate by adjusting the time of intermediate annealing, the rolling reduction during cold rolling, and the like.
【０００４】しかしながら、このような種々の工夫を施
しても、厚さ９μｍの銅箔で伸び率５〜６％程度とする
のが精一杯で、それ以上の伸び率を持つものを得ること
は困難であった。また、銅箔の厚さを厚くすれば、更に
伸び率の高いものが得られるが、銅箔を厚くすると、電
線被覆材料としては過剰品質になったり、取り扱いにく
くなるということがあった。[0004] However, even with such various contrivances, it is very difficult to obtain a copper foil having a thickness of 9 µm with an elongation of about 5 to 6%, and to obtain a copper foil having an elongation of more than 5%. It was difficult. Further, when the thickness of the copper foil is increased, a material having a higher elongation rate can be obtained. However, when the copper foil is thickened, the quality of the electric wire coating material may be excessive, or it may be difficult to handle.
【０００５】[0005]
【発明が解決しようとする課題】そこで、本発明者等
は、銅箔の元素組成を種々変更して研究していたとこ
ろ、特定の元素組成とした銅箔は、最終焼鈍することに
よって、比較的高い伸び率となることを見出し、本発明
に到達したのである。The inventors of the present invention have studied various changes in the element composition of the copper foil, and the copper foil having a specific element composition was subjected to a final annealing process. They found that the elongation rate was extremely high, and reached the present invention.
【０００６】[0006]
【課題を解決するための手段】即ち、本発明は、銅９
９．５５％以上，酸素０．０６％以下，銀０．０５〜
０．３５％及びその他不純物元素よりなることを特徴と
する高伸び銅箔及びその製造方法に関するものである。
なお、ここで、％は重量％の意味で用いられている。That is, according to the present invention, there is provided a copper 9
9.55% or more, oxygen 0.06% or less, silver 0.05 to
The present invention relates to a high elongation copper foil comprising 0.35% and other impurity elements and a method for producing the same.
In addition, here,% is used in the meaning of weight%.
【０００７】本発明に係る高伸び銅箔の元素組成は、銅
９９．５５％以上，酸素０．０６％以下，銀０．０５〜
０．３５％及びその他不純物元素よりなる。この銅箔の
元素組成の特徴は、特定量の酸素と特定量の銀が含有さ
れていることである。酸素含有量が０．０６％を超える
と、導電性が低下するので、好ましくない。また、銀含
有量が０．０５％未満になると、伸び向上の効果が小さ
くなり、好ましくない。銀含有量が０．３５％を超える
と、冷間圧延しにくくなり、銅箔を製造しにくくなると
共に、得られる銅箔が高価になるので、好ましくない。
なお、不純物元素としては、銅箔中に不可避的に含有さ
れているもので、アンチモン，鉄，ビスマス，砒素，硫
黄，鉛，ニッケル等が、各々、０．００１０〜０．００
２７％程度含有されていることが多い。The high elongation copper foil according to the present invention has an elemental composition of not less than 99.55% of copper, not more than 0.06% of oxygen, and not more than 0.05% of silver.
0.35% and other impurity elements. A characteristic of the element composition of the copper foil is that it contains a specific amount of oxygen and a specific amount of silver. If the oxygen content exceeds 0.06%, the conductivity is undesirably reduced. On the other hand, if the silver content is less than 0.05%, the effect of improving elongation is undesirably reduced. When the silver content exceeds 0.35%, it is difficult to perform cold rolling, it is difficult to produce a copper foil, and the obtained copper foil becomes expensive.
The impurity element is an element inevitably contained in the copper foil, and includes antimony, iron, bismuth, arsenic, sulfur, lead, nickel, etc.
It is often contained at about 27%.
【０００８】本発明に係る高伸び銅箔の厚さは、５〜２
５μｍであるのが好ましい。高伸び銅箔を冷間圧延法に
よって製造する場合、厚さを５μｍ未満とすることは困
難である。一方、厚さが２５μｍを超える高伸び銅箔
は、一般的に電磁波シールド材として採用しにくい。ま
た、本発明に係る高伸び銅箔は、以下の式を満足する程
度の伸び率を持っているのが、好ましい。即ち、厚さを
ｔ（μｍ）とし、伸び率をｅ（％）としたとき、［ｅ≧
（１／３）ｔ＋３］なる式を満足するのが好ましい。具
体的には、銅箔の厚さが８μｍのときには、約６％以上
の伸び率を示すのが良く、厚さが１７μｍのときには、
約９％以上の伸び率を示すのが良く、厚さが２５μｍの
ときには、約１２％以上の伸び率を示すのが良い。ここ
で、伸び率は、幅１０ｍｍで長さ１２０ｍｍの試験片を
用いて、ＪＩＳ Ｚ ２２４１に記載された方法に準拠
して測定したものである。なお、試験片の長さ方向は、
圧延方向（機械方向）と一致するようにした。The thickness of the high elongation copper foil according to the present invention is 5 to 2
It is preferably 5 μm. When producing a high elongation copper foil by a cold rolling method, it is difficult to make the thickness less than 5 μm. On the other hand, a high elongation copper foil having a thickness exceeding 25 μm is generally difficult to adopt as an electromagnetic wave shielding material. Further, it is preferable that the high elongation copper foil according to the present invention has an elongation percentage that satisfies the following expression. That is, when the thickness is t (μm) and the elongation is e (%), [e ≧
(1/3) t + 3]. Specifically, when the thickness of the copper foil is 8 μm, it is preferable to show an elongation of about 6% or more, and when the thickness is 17 μm,
It is preferable to show an elongation percentage of about 9% or more, and it is preferable to show an elongation percentage of about 12% or more when the thickness is 25 μm. Here, the elongation is measured using a test piece having a width of 10 mm and a length of 120 mm in accordance with the method described in JIS Z 2241. The length direction of the test piece is
The rolling direction (machine direction) was made to coincide.
【０００９】本発明に係る高伸び銅箔は、任意の製造方
法で得ることができる。好ましい製造方法としては、特
定の元素組成よりなる銅合金鋳塊に、熱間圧延及び冷間
圧延、更には必要に応じて中間焼鈍を施して、所定厚さ
の銅箔を得た後、この銅箔に３５０〜４５０℃の温度で
焼鈍を施すという方法が挙げられる。熱間圧延，冷間圧
延及び中間焼鈍は、従来公知の手段で行なえば良い。最
終焼鈍（仕上げ焼鈍）は、従来公知の焼鈍温度よりも高
い方が好ましく、３５０〜４５０℃程度で行なうのが良
い。最終焼鈍の温度が３５０℃未満であると、伸び率の
高い銅箔を得られにくくなる傾向が生じる。また、最終
焼鈍の温度が４５０℃を超えると、銅箔を巻回してコイ
ルとして焼鈍する際に、コイル中の銅箔積層面で、銅箔
同士が接着（ブロッキング）を起こす恐れが生じる。The high elongation copper foil according to the present invention can be obtained by any production method. As a preferred production method, a copper alloy ingot having a specific elemental composition is subjected to hot rolling and cold rolling, and further, if necessary, to intermediate annealing to obtain a copper foil having a predetermined thickness. A method of performing annealing at a temperature of 350 to 450 ° C. on a copper foil is exemplified. Hot rolling, cold rolling and intermediate annealing may be performed by conventionally known means. The final annealing (finish annealing) is preferably higher than the conventionally known annealing temperature, and is preferably performed at about 350 to 450 ° C. If the temperature of the final annealing is lower than 350 ° C., it tends to be difficult to obtain a copper foil having a high elongation. If the temperature of the final annealing exceeds 450 ° C., when the copper foil is wound and annealed as a coil, there is a possibility that the copper foils may adhere to each other (blocking) on the copper foil laminated surface in the coil.
【００１０】本発明に係る高伸び銅箔は、そのままで、
従来公知の各種用途に使用することができる。特に、こ
の高伸び銅箔と合成樹脂製フィルムとを貼合した積層材
を、電線被覆材として、電線に被覆すると、合成樹脂製
フィルムの伸びに銅箔が良く追随し、銅箔に破れが生じ
にくい。従って、本発明に係る高伸び銅箔は、電線被覆
材の素材として、好適に使用することができる。[0010] The high elongation copper foil according to the present invention, as it is,
It can be used for various known applications. In particular, when an electric wire is coated with a laminated material obtained by laminating this high-elongation copper foil and a synthetic resin film as an electric wire covering material, the copper foil follows the elongation of the synthetic resin film well, and the copper foil is broken. It is unlikely to occur. Therefore, the high elongation copper foil according to the present invention can be suitably used as a material for a wire covering material.
【００１１】[0011]
【実施例】以下、実施例によって本発明を説明するが、
本発明は実施例に限定されるものではない。本発明は、
特定の元素組成を持つ銅箔には、高い伸び率を与えうる
という知見に基づくものであると、認識されるべきであ
る。Hereinafter, the present invention will be described with reference to Examples.
The present invention is not limited to the embodiments. The present invention
It should be recognized that copper foil having a specific elemental composition is based on the finding that it can give a high elongation.
【００１２】実施例１〜１０ タフピッチ銅に銀を０．１５％添加した銅合金鋳塊（厚
さ５０ｍｍ）を準備した。この銅合金鋳塊の元素組成
は、銅９９．７９％，酸素０．０３５％，銀０．１５
％，その他不可避不純物よりなるものであった。この銅
合金鋳塊に、熱間圧延及び冷間圧延を施して、厚さ０．
１ｍｍの箔地を得た。この箔地に、適宜中間焼鈍を施し
ながら、冷間圧延を施して、表１に示すように、各種厚
さの銅箔を得た。この銅箔に、表１に示した温度で最終
焼鈍を２時間施した。以上のようにして得られた高伸び
銅箔の伸び率を表１に示した。Examples 1 to 10 Copper alloy ingots (50 mm thick) were prepared by adding 0.15% of silver to tough pitch copper. The elemental composition of this copper alloy ingot is 99.79% copper, 0.035% oxygen, and 0.15% silver.
% And other unavoidable impurities. This copper alloy ingot is subjected to hot rolling and cold rolling to obtain a thickness of 0.1 mm.
A 1 mm foil ground was obtained. The foil was subjected to cold rolling while appropriately performing intermediate annealing to obtain copper foils of various thicknesses as shown in Table 1. This copper foil was subjected to final annealing at the temperature shown in Table 1 for 2 hours. Table 1 shows the elongation percentage of the high elongation copper foil obtained as described above.
【００１３】[0013]
【表１】 [Table 1]
【００１４】実施例１１及び１２ 銅合金鋳塊の元素組成中、銅含有量を９９．８９％に、
及び銀含有量を０．０５％に変更する他は、実施例３及
び７と同様にして、厚さ８μｍ及び１７μｍの高伸び銅
箔を得、この伸び率を表１に示した。Examples 11 and 12 In the elemental composition of a copper alloy ingot, the copper content was increased to 99.89%.
A high elongation copper foil having a thickness of 8 μm and 17 μm was obtained in the same manner as in Examples 3 and 7, except that the silver content was changed to 0.05%, and the elongation was shown in Table 1.
【００１５】実施例１３及び１４ 銅合金鋳塊の元素組成中、銅含有量を９９．６９％に、
及び銀含有量を０．２５％に変更する他は、実施例３及
び７と同様にして、厚さ８μｍ及び１７μｍの高伸び銅
箔を得、この伸び率を表１に示した。Examples 13 and 14 In the elemental composition of the copper alloy ingot, the copper content was increased to 99.69%.
A high elongation copper foil having a thickness of 8 μm and 17 μm was obtained in the same manner as in Examples 3 and 7, except that the silver content was changed to 0.25%, and the elongation was shown in Table 1.
【００１６】実施例１５及び１６ 銅合金鋳塊の元素組成中、銅含有量を９９．５９％に、
及び銀含有量を０．３５％に変更する他は、実施例３及
び７と同様にして、厚さ８μｍ及び１７μｍの高伸び銅
箔を得、この伸び率を表１に示した。Examples 15 and 16 In the elemental composition of the copper alloy ingot, the copper content was increased to 99.59%.
Except that the silver content was changed to 0.35%, and high-strength copper foils having a thickness of 8 μm and 17 μm were obtained in the same manner as in Examples 3 and 7, and the elongation percentages are shown in Table 1.
【００１７】比較例１〜１０ 実施例１〜１０で用いた銅合金鋳塊に代えて、タフピッ
チ銅鋳塊を用いる他は、実施例１〜１０と同様の方法
で、各種厚さの銅箔を得た。この銅箔の伸び率を表２に
示した。なお、タフピッチ銅鋳塊の元素組成は、銅９
９．９４％，酸素０．０３５％，その他不可避不純物よ
りなるものであった。Comparative Examples 1 to 10 Copper foils of various thicknesses were produced in the same manner as in Examples 1 to 10 except that a tough pitch copper ingot was used instead of the copper alloy ingot used in Examples 1 to 10. I got Table 2 shows the elongation percentage of this copper foil. The elemental composition of the tough pitch copper ingot is copper 9
It consisted of 9.94%, 0.035% of oxygen and other unavoidable impurities.
【００１８】[0018]
【表２】 [Table 2]
【００１９】実施例１〜４と比較例１〜４、実施例５〜
８と比較例５〜８、実施例９及び１０と比較例９及び１
０とを、各々対比すれば明らかな通り、銀が含有されて
いる銅箔は、伸び率が向上していることが分かる。ま
た、実施例１１〜１６と比較例３及び７とを対比しても
明らかな通り、銀が含有されている銅箔は、伸び率が向
上していることが分かる。但し、実施例１や５の如く、
焼鈍温度が低い場合には、伸び率の向上は殆ど見られな
い。Examples 1-4, Comparative Examples 1-4, Examples 5
8 and Comparative Examples 5 to 8, Examples 9 and 10 and Comparative Examples 9 and 1
As is clear from the comparison of 0 with each other, it can be seen that the copper foil containing silver has improved elongation. Further, as is clear from comparison between Examples 11 to 16 and Comparative Examples 3 and 7, it can be seen that the copper foil containing silver has improved elongation. However, as in Examples 1 and 5,
When the annealing temperature is low, almost no improvement in elongation is observed.
【００２０】[0020]
【発明の効果】以上説明したように、本発明に係る高伸
び銅箔は、特定量の酸素及び特定量の銀を含有した元素
組成となっているので、高い伸び率を示すという効果を
奏する。特に、高温で焼鈍（最終焼鈍とも仕上げ焼鈍と
も言う。）した場合には、伸び率が顕著に高くなるとい
う格別の効果を奏するものである。従って、この高伸び
銅箔を合成樹脂製フィルムに貼合してなる電線被覆材
は、被覆時における伸びに良く対応し、銅箔が破れるこ
とが少ない。依って、電磁波シールドとしての機能を十
分に発揮しうる電線被覆材を提供することができる。As described above, the high elongation copper foil according to the present invention has an element composition containing a specific amount of oxygen and a specific amount of silver, and therefore has an effect of exhibiting a high elongation. . In particular, when annealing is performed at a high temperature (also referred to as final annealing or finish annealing), a particularly advantageous effect that the elongation is significantly increased is exhibited. Therefore, the wire covering material obtained by laminating this high-stretch copper foil to a synthetic resin film responds well to the elongation at the time of covering, and the copper foil is hardly broken. Accordingly, it is possible to provide a wire covering material that can sufficiently exhibit a function as an electromagnetic wave shield.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ２２Ｆ 1/00 ６６１ Ｃ２２Ｆ 1/00 ６６１Ｚ ６８３ ６８３ ６８５ ６８５Ｚ ６８６ ６８６Ａ ６９１ ６９１Ｂ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI C22F 1/00 661 C22F 1/00 661Z 683 683 685 685Z 686 686 686A 691 691B
Claims (3)
下、銀０．０５〜０．３５％及びその他不純物元素より
なることを特徴とする高伸び銅箔。1. A high elongation copper foil comprising 99.55% or more of copper, 0.06% or less of oxygen, 0.05 to 0.35% of silver and other impurity elements.
の高伸び銅箔。2. The high elongation copper foil according to claim 1, which has a thickness of 5 to 25 μm.
下，銀０．０５〜０．３５％及びその他不純物元素より
なる鋳塊に、熱間圧延及び冷間圧延を施して銅箔を得た
後、該銅箔に３５０〜４５０℃の温度で焼鈍を施すこと
を特徴とする高伸び銅箔の製造方法。3. An ingot made of 99.55% or more of copper, 0.06% or less of oxygen, 0.05 to 0.35% of silver and other impurity elements is subjected to hot rolling and cold rolling to form a copper foil. And then subjecting said copper foil to annealing at a temperature of 350 to 450 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31894397A JPH11140564A (en) | 1997-11-04 | 1997-11-04 | High elongation copper foil and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31894397A JPH11140564A (en) | 1997-11-04 | 1997-11-04 | High elongation copper foil and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11140564A true JPH11140564A (en) | 1999-05-25 |
Family
ID=18104730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31894397A Pending JPH11140564A (en) | 1997-11-04 | 1997-11-04 | High elongation copper foil and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11140564A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237048A (en) * | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | Copper-clad laminate having high flectural property and its manufacturing method |
-
1997
- 1997-11-04 JP JP31894397A patent/JPH11140564A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237048A (en) * | 2005-02-22 | 2006-09-07 | Nippon Steel Chem Co Ltd | Copper-clad laminate having high flectural property and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI502086B (en) | Copper alloy sheet and method for producing same | |
| EP0175183B1 (en) | Copper alloys having an improved combination of strength and conductivity | |
| EP1179606B1 (en) | Silver containing copper alloy | |
| JPH08503022A (en) | Copper alloy having high strength and electrical conductivity and method for producing the same | |
| KR20190028649A (en) | Aluminum alloy materials and conductive members, battery members, fastening parts, spring parts and structural parts using the same | |
| JPH0841612A (en) | Copper alloy and its preparation | |
| JP4056175B2 (en) | Copper alloy plate for lead frames, terminals, connectors, switches or relays with excellent press punchability | |
| WO2012132765A1 (en) | Cu-si-co-base copper alloy for electronic materials and method for producing same | |
| JP3383615B2 (en) | Copper alloy for electronic materials and manufacturing method thereof | |
| JP3800279B2 (en) | Copper alloy sheet with excellent press punchability | |
| JP2000080428A (en) | Copper alloy sheet excellent in bendability | |
| CA2346635A1 (en) | Copper alloy | |
| US5882442A (en) | Iron modified phosphor-bronze | |
| JP2000328157A (en) | Copper alloy sheet excellent in bending workability | |
| CA1064738A (en) | Aluminum-iron-nickel alloy electrical conductor | |
| CN1301026A (en) | Copper alloy with excellent surface characteristics for electronic materials and manufacture thereof | |
| JP6077755B2 (en) | Cu-Zn-Sn-Ni-P-based alloy and manufacturing method thereof | |
| JPS63140052A (en) | Oxygen-free copper-base dilute alloy having low-temperature softening characteristic and its use | |
| JPH11140564A (en) | High elongation copper foil and its production | |
| JP2907415B2 (en) | Manufacturing method of ultra-thin soft copper foil | |
| JP3302840B2 (en) | High-strength copper alloy for electric conduction excellent in elongation characteristics and bending characteristics, and method for producing the same | |
| JP3320455B2 (en) | Method for producing Cu-Ag alloy conductor | |
| JP5623960B2 (en) | Cu-Ni-Si based copper alloy strip for electronic materials and method for producing the same | |
| JPH0416534B2 (en) | ||
| JPH03294461A (en) | Production of high-strength and high-conductivity copper alloy thin wire |