JPH11124555A - Preparation of wood adhesive - Google Patents
Preparation of wood adhesiveInfo
- Publication number
- JPH11124555A JPH11124555A JP29011697A JP29011697A JPH11124555A JP H11124555 A JPH11124555 A JP H11124555A JP 29011697 A JP29011697 A JP 29011697A JP 29011697 A JP29011697 A JP 29011697A JP H11124555 A JPH11124555 A JP H11124555A
- Authority
- JP
- Japan
- Prior art keywords
- formaldehyde
- molar ratio
- phenols
- adhesive
- phenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Veneer Processing And Manufacture Of Plywood (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は木材用フェノール・
ホルムアルデヒド樹脂接着剤（以下、フェノール・ホル
ムアルデヒド樹脂をフェノール樹脂という）の製造方法
に関し、詳しくは低温速硬化であり、低ホルムアルデヒ
ド臭化されたフェノール樹脂接着剤の製造方法に関す
る。TECHNICAL FIELD The present invention relates to a phenol for wood.
The present invention relates to a method for producing a formaldehyde resin adhesive (hereinafter, a phenol-formaldehyde resin is referred to as a phenol resin), and more particularly to a method for producing a phenol resin adhesive which is a low-temperature fast-curing and low-formaldehyde bromide.
【０００２】[0002]
【従来の技術】近年、広葉樹資源の入手難から、合板材
料として針葉樹資源の利用が考えられている。しかし、
メラミン・ホルムアルデヒド樹脂、尿素・ホルムアルデ
ヒド樹脂で代表されるアミノ系樹脂接着剤を接着剤とし
た針葉樹合板では、接着性、耐久性、安定性などの点で
不十分であり、針葉樹を原料とした合板の信頼性を高め
ていくためには接着性、耐久性、安定性に優れているフ
ェノール樹脂接着剤を用いるのが良いとされている。2. Description of the Related Art In recent years, utilization of softwood resources as a plywood material has been considered due to difficulty in obtaining hardwood resources. But,
Softwood plywood using an amino resin adhesive represented by melamine / formaldehyde resin or urea / formaldehyde resin as an adhesive is insufficient in terms of adhesiveness, durability, stability, etc., and plywood made from softwood It is said that in order to improve the reliability of the phenol resin, it is better to use a phenol resin adhesive having excellent adhesiveness, durability and stability.
【０００３】従来のフェノール樹脂接着剤は、アミノ系
樹脂接着剤と比較して、合板を製造する際の熱圧締（プ
レス）に際し、高温、長時間を要し、これがために作業
性の低下、プレスの際の製品の厚み減り、あるいは表面
劣化の原因となっている。Conventional phenolic resin adhesives require a high temperature and a long time for hot pressing (pressing) in the production of plywood as compared with amino resin adhesives, thereby reducing workability. This causes a reduction in the thickness of the product at the time of pressing or surface deterioration.
【０００４】また、ホルムアルデヒドの室内汚染による
健康被害の問題がクローズアップされ、合板に対するＪ
ＡＳ規格のホルムアルデヒド放散量の規格として、Ｆ−
１グレード（ホルムアルデヒド放散量（以下、Ｆ放散量
という。）：０．５ｐｐｍ以下）が要求されている。[0004] In addition, the problem of health damage due to indoor contamination of formaldehyde has been highlighted, and J
As standard of formaldehyde emission amount of AS standard, F-
One grade (formaldehyde emission (hereinafter referred to as F emission): 0.5 ppm or less) is required.
【０００５】フェノール樹脂接着剤の低温速硬化の方法
としては、ホルムアルデヒドとフェノールのモル比（以
下、Ｆ／Ｐモル比という。）を２．５〜３．０にし、レ
ゾルシノールを添加剤とすれば、ある程度効果の得られ
ることは知られているが、この方法では、生産した合板
のＦ放散量は２０ｐｐｍを越え、且つ、糊液の可使時間
が短く実用的ではない。[0005] A method of rapidly curing a phenolic resin adhesive at a low temperature is that the molar ratio of formaldehyde to phenol (hereinafter referred to as F / P molar ratio) is 2.5 to 3.0 and resorcinol is used as an additive. Although it is known that an effect can be obtained to some extent, in this method, the amount of F emitted from the produced plywood exceeds 20 ppm, and the potable liquid has a short pot life, which is not practical.
【０００６】次に、Ｆ／Ｐモル比を２．０〜２．５とし
パラホルムアルデヒドを添加することにより速硬化化す
る試みがなされており、フェノール樹脂のモル比が高く
なればより速硬化となり、接着力が安定するが、上記の
モル比の範囲ではＦ放散量がＦ−１グレードを満たすの
は困難である。[0006] Next, attempts have been made to set the F / P molar ratio to 2.0 to 2.5 and to rapidly cure by adding paraformaldehyde. The higher the molar ratio of the phenol resin, the faster the curing. Although the adhesive strength is stable, it is difficult for the F emission amount to satisfy the F-1 grade in the above molar ratio range.
【０００７】一方、Ｆ／Ｐモル比を２．０以下とした場
合はＦ放散量はＦ−１グレードを満たすものの、アミノ
系樹脂接着剤と同等の加熱条件下では接着力の安定性に
欠ける。[0007] On the other hand, when the F / P molar ratio is 2.0 or less, the amount of F emission satisfies the F-1 grade, but lacks stability of adhesive strength under the same heating conditions as the amino resin adhesive. .
【０００８】また、硬化助剤として、レゾルシノール、
ホルムアミド、マロンニトリル、芳香族アミン、ノボラ
ックなどが提案されているが、多量に添加しないと効果
が小さく、多量に添加するとプレス前の糊液の粘度上昇
が速くなり、生産性の点で問題があった。Further, resorcinol, a curing aid,
Formamide, malononitrile, aromatic amine, novolak, etc. have been proposed, but if not added in large amounts, the effect will be small, and if added in large amounts, the viscosity of the size liquid before pressing will increase rapidly, which will cause problems in terms of productivity. there were.
【０００９】[0009]
【発明が解決しようとする課題】本発明は、生産性につ
いては従来の広葉樹材料に対するアミノ系接着剤の生産
性を維持しつつ、針葉樹単板に対する優れた接着性を発
現し、合板から発するホルムアルデヒド臭を低減した低
温速硬化性であり、低ホルムアルデヒド臭合板用として
好適なレゾール型フェノール樹脂接着剤を提供すること
にある。DISCLOSURE OF THE INVENTION The present invention relates to a method for producing formaldehyde from plywood, which exhibits excellent adhesion to softwood veneers while maintaining the productivity of amino-based adhesives to conventional hardwood materials. An object of the present invention is to provide a resol-type phenolic resin adhesive which has a low odor and has a low-temperature fast-curing property and is suitable for use in a low-formaldehyde odor plywood.
【００１０】[0010]
【課題を解決するための手段】本発明者らの知見による
と、合板のＦ放散量を低減するためには、フェノール樹
脂のＦ／Ｐモル比の低減が必要であり、且つ、硬化を促
進するためにホルムアルデヒドを後添加する必要があ
る。従って、低モル比の樹脂にホルムアルデヒドを添加
することにより、速硬化化が可能である。しかしなが
ら、低モル比の樹脂のみでアミノ系樹脂接着剤と同等の
加熱条件下ではは合板の接着性の安定性にかけるため
に、高分子量成分を混在させることが必要である。この
ために、反応を２段階に分け、第１段目にてアルカリ触
媒の存在下に高モル比で反応させ、所定の粘度に達した
後、フェノール類又はフェノール類とホルムアルデヒド
を添加し、モル比を下げ縮合反応させ、好ましくは、得
られたフェノール樹脂に更にホルムアルデヒドを添加し
配合することにより、フェノール樹脂の硬化促進が図
れ、接着性も安定することを見いだし、本発明に至った
ものである。According to the findings of the present inventors, in order to reduce the amount of F emitted from plywood, it is necessary to reduce the F / P molar ratio of the phenolic resin and to accelerate the curing. Requires the addition of formaldehyde. Therefore, rapid curing can be achieved by adding formaldehyde to a resin having a low molar ratio. However, under the same heating conditions as the amino resin adhesive with only a low molar ratio resin, it is necessary to mix a high molecular weight component in order to exert the stability of the adhesiveness of the plywood. For this purpose, the reaction is divided into two stages. In the first stage, the reaction is carried out at a high molar ratio in the presence of an alkali catalyst, and after reaching a predetermined viscosity, phenols or phenols and formaldehyde are added, and The condensation reaction is performed by lowering the ratio, preferably, by further adding formaldehyde to the obtained phenol resin and blending, the curing of the phenol resin can be promoted, and it has been found that the adhesiveness is also stabilized, and the present invention has been achieved. is there.
【００１１】即ち、第１段階反応としてＦ／Ｐモル比を
２．２〜３．０、好ましくは、２．２〜２．８として、
通常還流下もしくは８５℃以上で所定の粘度にまで反応
せしめ、その後、さらにフェノール類又はフェノール類
とホルムアルデヒドを添加し、全体のＦ／Ｐモル比を
１．２〜２．０，好ましくは、１．４〜１．８となる様
に調整し、通常還流下又は８０℃以上で所定の粘度まで
反応させ、所望のフェノール樹脂を得、さらに、好まし
くはホルムアルデヒドを所定量添加する。このような工
程を経ることにより、得られたフェノール樹脂はアミノ
樹脂系接着剤と同等の加熱条件で、且つ、アミノ樹脂系
接着剤では十分な耐久性が得られない針葉樹単板を使用
しても同等の接着性能を有し、Ｆ放散量がＦ−１グレー
ドを満たすことができる。That is, as the first stage reaction, the F / P molar ratio is set to 2.2 to 3.0, preferably 2.2 to 2.8.
The reaction is usually carried out under reflux or at a temperature of 85 ° C. or higher to a predetermined viscosity, and then phenols or phenols and formaldehyde are further added, and the total F / P molar ratio is 1.2 to 2.0, preferably 1 to 2.0. The reaction mixture is adjusted so as to have a viscosity of 0.4 to 1.8, and is usually reacted under reflux or at a temperature of 80 ° C. or higher to a predetermined viscosity to obtain a desired phenol resin, and more preferably, a predetermined amount of formaldehyde is added. Through such a process, the obtained phenolic resin is heated under the same heating conditions as the amino resin-based adhesive, and using a softwood veneer that does not provide sufficient durability with the amino resin-based adhesive. Have the same adhesive performance, and the amount of F emission can satisfy the F-1 grade.
【００１２】好ましくは、本発明は、Ｆ／Ｐモル比が
２．２〜３．０、フェノール樹脂の反応の容易さからよ
り好ましくはモル比が２．２〜２．８の範囲で、苛性ソ
ーダ等のアルカリ触媒を用いて縮合反応せしめ、Ｂ型粘
度計を用い２５℃での不揮発分５０〜６０％での粘度が
１．５〜４．５ｐｓのレゾール型フェノール樹脂を得る
（第１段階反応）。さらに続いてフェノール類又は、フ
ェノール類とホルムアルデヒドを添加し全体のＦ／Ｐモ
ル比が１．２〜２．０、ホルムアルデヒド放散量を尿素
塗布、水散布などの工程を経ることなく、Ｆ−１グレー
ドをクリアするためには、より好ましくは１．４〜１．
８の範囲で、さらに縮合反応せしめ、Ｂ型粘度計を用い
２５℃での不揮発分４８〜６０％での粘度が６．０〜１
５．０ｐｓのレゾール型フェノール樹脂接着剤を得る
（第２段階反応）。更に、パラホルムアルデヒド又はホ
ルムアルデヒド水溶液の添加によりＦ／Ｐモル比を０．
２〜０．５の範囲で調整することが好ましい。Preferably, the present invention provides a sodium hydroxide solution having an F / P molar ratio of 2.2 to 3.0, and more preferably a molar ratio of 2.2 to 2.8 for ease of reaction of the phenol resin. To obtain a resol type phenol resin having a viscosity of 1.5 to 4.5 ps at 25 ° C. and a non-volatile content of 50 to 60% using a B-type viscometer (first stage reaction). ). Subsequently, phenols or phenols and formaldehyde are added to give a total F / P molar ratio of 1.2 to 2.0, and the amount of formaldehyde emission is reduced to F-1 without passing through steps such as urea application and water spraying. In order to clear the grade, more preferably, 1.4 to 1.
In the range of 8, a condensation reaction was further carried out, and the viscosity at 25 ° C. at a nonvolatile content of 48 to 60% was 6.0 to 1 using a B-type viscometer.
A 5.0 ps resol type phenol resin adhesive is obtained (second stage reaction). Furthermore, by adding paraformaldehyde or an aqueous formaldehyde solution, the F / P molar ratio is reduced to 0.1.
It is preferable to adjust in the range of 2 to 0.5.
【００１３】第１段階反応において、Ｆ／Ｐモル比が
２．２未満では速硬化の効果が十分に得られず、３．０
を越えると反応の制御が困難である。また、樹脂粘度が
１．５ｐｓ未満では第１段階反応が不十分で、４．５ｐ
ｓを越えると第２段階反応での見かけの粘度は上がるが
実際の反応は十分ではない。次に、第２段階反応におい
てＦ／Ｐモル比が１．２未満となると合板の接着力が十
分に得られず、２．０を越えるとＦ放散量がＦ−１グレ
ードを満たすことはできない。また、反応後の樹脂粘度
が６．０ｐｓ未満では合板の作成の際に仮接着性が劣
り、１５．０ｐｓを越えると、釜出しが容易でなく、適
当な粘度まで下げようとすれば水を多量に添加する必要
があり、接着性が低下することとなる。In the first-stage reaction, if the F / P molar ratio is less than 2.2, the effect of rapid curing cannot be sufficiently obtained, so that 3.0 is obtained.
If it exceeds, it is difficult to control the reaction. If the resin viscosity is less than 1.5 ps, the first-stage reaction is insufficient, and the
When the value exceeds s, the apparent viscosity in the second stage reaction increases, but the actual reaction is not sufficient. Next, if the F / P molar ratio is less than 1.2 in the second stage reaction, the adhesive strength of the plywood cannot be sufficiently obtained, and if it exceeds 2.0, the F emission amount cannot satisfy the F-1 grade. . If the viscosity of the resin after the reaction is less than 6.0 ps, the temporary adhesion is inferior in the production of plywood. It is necessary to add a large amount, so that the adhesiveness is reduced.
【００１４】フェノール樹脂に使用するフェノール類と
してはフェノール、クレゾール、キシレノール、レゾル
シノール等が使用可能である。As phenols used in the phenol resin, phenol, cresol, xylenol, resorcinol and the like can be used.
【００１５】本発明において製造されるフェノール樹脂
接着剤は、ホルムアルデヒドとフェノール類とをアルカ
リ触媒下で反応させたフェノール樹脂を主体とするもの
であるが、タンニン、リグニン、ボリビニルブチラー
ル、エチレングリコール、ジエチレングリコールなどで
一部変性した変性樹脂であってもよい。なお、これらの
変性剤は、通常縮合反応終了後、冷却時に配合される。The phenolic resin adhesive produced in the present invention is mainly composed of a phenolic resin obtained by reacting formaldehyde with phenols under an alkaline catalyst. Tannin, lignin, polyvinyl butyral, ethylene glycol, A modified resin partially modified with diethylene glycol or the like may be used. These modifiers are usually added at the time of cooling after the completion of the condensation reaction.
【００１６】アルカリ触媒としては苛性ソーダが一般的
であるが、苛性ソーダを使用する場合、その触媒量は特
に規定されないが、水溶性を良好とするため、苛性ソー
ダとフェノール類とのモル比（以下、苛性／Ｐモル比と
いう）が０．１以上が望ましく、さらに０．５を越えな
いことが望ましい。苛性／Ｐモル比が０．５を越えると
接着剤層の耐水性が低化するようになる。As an alkali catalyst, caustic soda is generally used. When caustic soda is used, the amount of the catalyst is not particularly limited. However, in order to improve the water solubility, the molar ratio of caustic soda to phenols (hereinafter referred to as caustic) is used. / P molar ratio) is preferably 0.1 or more, and more preferably not more than 0.5. When the caustic / P molar ratio exceeds 0.5, the water resistance of the adhesive layer is reduced.
【００１７】上記の様にして得たフェノール樹脂接着剤
に対して、Ｆ／Ｐモル比０．２〜０．５に相当する（重
量比にて２〜４％）パラホルムアルデヒド又はホルムア
ルデヒド水溶液を添加することにより、接着力がより向
上した樹脂を得る。To the phenolic resin adhesive obtained as described above, paraformaldehyde or an aqueous formaldehyde solution corresponding to an F / P molar ratio of 0.2 to 0.5 (2 to 4% by weight) is added. By doing so, a resin with improved adhesion is obtained.
【００１８】更に、硬化を促進する目的でレゾルシノー
ル、ホルムアミド、ジフェニルメタンジイソシアネート
などを少量添加することも可能である。本発明の接着剤
組成物には、充填剤、増量剤、水、硬化促進剤などを必
要に応じて添加混合することも可能である。Further, it is possible to add a small amount of resorcinol, formamide, diphenylmethane diisocyanate or the like for the purpose of accelerating the curing. The adhesive composition of the present invention can also be added and mixed with a filler, a bulking agent, water, a curing accelerator, and the like, if necessary.
【００１９】[0019]
【実施例】次に、本発明を実施例に基づき説明する。Next, the present invention will be described based on embodiments.
【００２０】接着剤製造例１ 予め、フェノール９４．１重量部と３７％ホルマリン２
１０．８重量部（Ｆ／Ｐモル比：２．６）及び３０％苛
性ソーダを６５重量部仕込み、還流条件下で、Ｂ型粘度
計にて２５℃における粘度が約３．０ｐｓとなるまで反
応させレゾール型フェノール樹脂接着剤を得た。更に、
７０℃まで冷却後フェノール６８．７重量部（Ｆ／Ｐモ
ル比：１．５）及び３０％苛性ソーダを３０重量部仕込
み、８５℃にてフェノール樹脂の粘度が約１０．０ｐｓ
となるまで反応させレゾール型フェノール樹脂接着剤を
得た。その後、水を添加し、フェノール樹脂のＢ型粘度
計による２５℃での粘度を約２．０ｐｓに調整した。Adhesive Production Example 1 94.1 parts by weight of phenol and 37% formalin 2
65 parts by weight of 10.8 parts by weight (F / P molar ratio: 2.6) and 30% caustic soda were charged, and reacted under a reflux condition until the viscosity at 25 ° C. became about 3.0 ps with a B-type viscometer. Then, a resol type phenol resin adhesive was obtained. Furthermore,
After cooling to 70 ° C., 68.7 parts by weight of phenol (F / P molar ratio: 1.5) and 30 parts by weight of 30% caustic soda were charged, and the viscosity of the phenol resin at 85 ° C. was about 10.0 ps.
The resole-type phenolic resin adhesive was obtained until the reaction was completed. Thereafter, water was added to adjust the viscosity of the phenol resin at 25 ° C. using a B-type viscometer to about 2.0 ps.
【００２１】接着剤製造例２ 予め、フェノール９４．１重量部と３７％ホルマリン２
１０．８重量部（Ｆ／Ｐモル比：２．６）及び３０％苛
性ソーダを６５重量部仕込み、還流条件下でフェノール
樹脂の粘度が約３．０ｐｓとなるまで反応させレゾール
型フェノール樹脂接着剤を得る。更に、７０℃まで冷却
後フェノール６８．７重量部（Ｆ／Ｐモル比：１．５）
及び３０％苛性ソーダを３０重量部仕込み、８５℃にて
フェノール樹脂のＢ型粘度計による２５℃での粘度が約
１０．０ｐｓとなるまで反応させレゾール型フェノール
樹脂接着剤を得た。その後、５０％ホルムアルデヒド水
溶液を１５重量部添加し、更に、水でフェノール樹脂の
Ｂ型粘度計による２５℃での粘度を約２．０ｐｓに調整
した。Adhesive Production Example 2 94.1 parts by weight of phenol and 37% formalin 2
10.8 parts by weight (F / P molar ratio: 2.6) and 65 parts by weight of 30% caustic soda were charged and reacted under reflux conditions until the viscosity of the phenolic resin became about 3.0 ps. Get. Further, after cooling to 70 ° C., 68.7 parts by weight of phenol (F / P molar ratio: 1.5)
And 30% by weight of 30% caustic soda were reacted at 85 ° C. until the viscosity of the phenol resin at 25 ° C. measured by a B-type viscometer at 25 ° C. became about 10.0 ps to obtain a resol type phenol resin adhesive. Thereafter, 15 parts by weight of a 50% aqueous formaldehyde solution were added, and the viscosity of the phenol resin at 25 ° C. measured with a B-type viscometer at 25 ° C. was adjusted to about 2.0 ps with water.
【００２２】接着剤製造例３ 予め、フェノール９４．１重量部と３７％ホルムアルデ
ヒド１４５．９重量部（Ｆ／Ｐモル比：１．８）及び３
０％苛性ソーダを５５重量部仕込み、還流条件下で４０
分反応させ、更に８５℃にてレジン粘度が約１０ｐｓと
なるまで反応させレゾール型フェノール樹脂接着剤を
得、水及びエチレングリコールを配合することによって
フェノール樹脂のＢ型粘度計による２５℃での粘度を約
２ｐｓに調整した。上記の各例において、水等の配合に
より樹脂の固形分は約５０％となる調整している。Adhesive Production Example 3 94.1 parts by weight of phenol and 145.9 parts by weight of 37% formaldehyde (F / P molar ratio: 1.8) and 3
55% by weight of 0% caustic soda was charged and 40% under reflux conditions.
The mixture is further reacted at 85 ° C until the resin viscosity becomes about 10 ps to obtain a resole type phenolic resin adhesive. The viscosity of the phenolic resin at 25 ° C by a B-type viscometer by mixing water and ethylene glycol is obtained. Was adjusted to about 2 ps. In each of the above examples, the solid content of the resin is adjusted to about 50% by blending water and the like.
【００２３】このようにして得たフェノール樹脂接着剤
を用い下記の実施例及び比較例に従い糊液を調製し、合
板を作成した。Using the phenolic resin adhesive thus obtained, a size liquid was prepared in accordance with the following Examples and Comparative Examples to prepare plywood.
【００２４】実施例１ 接着剤製造例１で得られたフェノール樹脂接着剤１００
重量部にパラホルムアルデヒドを４重量部添加し、増量
剤として小麦粉５重量部を配合し糊液を得た。この糊液
を使用して１．８ｍｍ厚のカラマツの単板を５ｐｌｙに
て合板を作成した。成形条件は糊塗工量：２８ｇ／尺、
冷圧条件：１０ｋｇ／ｃｍ2 、加熱条件：１０ｋｇ／ｃ
ｍ2 、１２０℃、２５秒／ｍｍで実施した。Example 1 The phenolic resin adhesive 100 obtained in Adhesive Production Example 1
4 parts by weight of paraformaldehyde was added to 5 parts by weight, and 5 parts by weight of flour was added as an extender to obtain a size liquid. A plywood of 1.8 mm thick larch veneers was prepared at 5 ply using the size liquid. The molding conditions were as follows: glue coating amount: 28 g / size,
Cold pressure condition: 10 kg / cm 2 , heating condition: 10 kg / c
m 2 , 120 ° C., 25 seconds / mm.
【００２５】実施例２ 接着剤製造例２で得られたフェノール樹脂接着剤を使用
し、パラホルムアルデヒドを無添加とする以外は実施例
１と同様にして合板を作成した。Example 2 A plywood was prepared in the same manner as in Example 1 except that the phenolic resin adhesive obtained in Adhesive Production Example 2 was used and paraformaldehyde was not added.
【００２６】比較例１ 接着剤製造例３で得られたフェノール樹脂接着剤を使用
し、糊液を調整する際に、全Ｆ／Ｐモル比が２．１とな
るようにフェノール樹脂接着剤１００重量部に対してパ
ラホルムアルデヒドを３．２重量部添加すること以外は
実施例１と同様にして合板を作成した。Comparative Example 1 Using the phenolic resin adhesive obtained in Adhesive Production Example 3, when adjusting the size liquid, the phenolic resin adhesive 100 was adjusted so that the total F / P molar ratio was 2.1. A plywood was prepared in the same manner as in Example 1 except that 3.2 parts by weight of paraformaldehyde was added to parts by weight.
【００２７】比較例２ 接着剤製造例３で得られたフェノール樹脂接着剤１００
重量部に、増量剤として小麦粉を１０重量部配合し糊液
を得ること以外は実施例１と同様にして合板を作成し
た。Comparative Example 2 The phenolic resin adhesive 100 obtained in Adhesive Production Example 3
A plywood was prepared in the same manner as in Example 1, except that 10 parts by weight of flour as a bulking agent was added to parts by weight to obtain a size liquid.
【００２８】比較例３ ホルムアルデヒドとメラミンのモル比が０．６のメラミ
ン樹脂系接着剤（住友ベークライト株式会社製「ＭＡ−
２０９」）１００重量部に、小麦粉を１０重量部配合
し、糊液を得、以下実施例１と同様にし合板を得た。Comparative Example 3 A melamine resin-based adhesive having a molar ratio of formaldehyde to melamine of 0.6 ("MA-Made" manufactured by Sumitomo Bakelite Co., Ltd.)
209 "), 100 parts by weight of flour and 10 parts by weight of flour were blended to obtain a size liquid, and a plywood was obtained in the same manner as in Example 1.
【００２９】糊液を調製するための配合を表１にまとめ
た。The formulations for preparing the size liquid are summarized in Table 1.
【表１】 [Table 1]
【００３０】得られた各合板について、常態及び特類の
接着力と放散ホルムアルデヒド量の評価を実施した。そ
の結果は表２の通りであった。Each of the obtained plywoods was evaluated for normal and special adhesive strength and the amount of formaldehyde emitted. Table 2 shows the results.
【表２】 [Table 2]
【００３１】[0031]
【発明の効果】本発明により得られた木材用フェノール
樹脂接着剤は、合板製造時、従来のアミノ系樹脂接着剤
と同様の良好な生産性を維持しつつ、アミノ系接着剤で
は達成し得なかった特類合板の接着強度を発現する。そ
して、ホルムアルデヒド放散量においては、ＪＡＳ規格
のＦ−１グレードを満たす合板が得られる木材用接着剤
である。The phenolic resin adhesive for wood obtained according to the present invention can be achieved with an amino-based adhesive while maintaining the same good productivity as a conventional amino-based resin adhesive during plywood production. Expresses the adhesive strength of special plywood that did not exist. And it is a wood adhesive from which a plywood satisfying the JAS standard F-1 grade can be obtained in the formaldehyde emission amount.
Claims (3)
ホルムアルデヒドを縮合させて得られるレゾール型フェ
ノール類・ホルムアルデヒド樹脂において、ホルムアル
デヒドとフェノール類のモル比が２．０〜３．０にて第
１段階の反応を行った後、フェノール類又はフェノール
類とホルムアルデヒドを添加しホルムアルデヒドとフェ
ノール類のモル比を１．２〜１．８に低下させ第２段階
の反応を行うことを特徴とする木材用接着剤の製造方
法。1. A resol type phenol / formaldehyde resin obtained by condensing a phenol and formaldehyde in the presence of an alkali catalyst, wherein the molar ratio of formaldehyde to phenol is 2.0 to 3.0 and the first step Characterized by adding phenols or phenols and formaldehyde to reduce the molar ratio of formaldehyde to phenols to 1.2 to 1.8, and performing a second-stage reaction. Method of manufacturing the agent.
デヒド樹脂を得るために、第１段階の反応を不揮発分５
０〜６０％で２５℃におけるＢ型粘度計で測定した粘度
が１．５〜４．５ｐｓの時点で終了させ、第２段階の反
応を不揮発分４８〜６０％での２５℃におけるＢ型粘度
計で測定した粘度を６．０ｐｓ〜１５．０ｐｓの時点で
終了させる請求項１記載の木材用接着剤の製造方法。2. In order to obtain said resole-type phenol-formaldehyde resin, the reaction of the first stage is carried out by a non-volatile
When the viscosity measured by a B-type viscometer at 25 ° C. at 0 to 60% is 1.5 to 4.5 ps, the second-stage reaction is completed at a non-volatile content of 48 to 60%. The method for producing a wood adhesive according to claim 1, wherein the viscosity measured by the meter is terminated at a time point of 6.0 ps to 15.0 ps.
ゾール型フェノール・ホルムアルデヒド樹脂に更に、全
配合のフェノール類とのモル比が０．２から０．５とな
る量のホルムアルデヒドを添加する請求項１又は２記載
の木材用接着剤の製造方法。3. After the completion of the second-stage reaction, formaldehyde is added to the resole-type phenol-formaldehyde resin in an amount such that the molar ratio of the phenols to the total blend is 0.2 to 0.5. The method for producing a wood adhesive according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29011697A JPH11124555A (en) | 1997-10-22 | 1997-10-22 | Preparation of wood adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29011697A JPH11124555A (en) | 1997-10-22 | 1997-10-22 | Preparation of wood adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11124555A true JPH11124555A (en) | 1999-05-11 |
Family
ID=17752016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29011697A Pending JPH11124555A (en) | 1997-10-22 | 1997-10-22 | Preparation of wood adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11124555A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001254066A (en) * | 2000-03-13 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Phenol resin adhesive |
| JP2001254065A (en) * | 2000-03-13 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Wood adhesive composition |
| JP2001279214A (en) * | 2000-03-31 | 2001-10-10 | Sumitomo Bakelite Co Ltd | Phenolic resin based adhesive composition |
| JP2017048349A (en) * | 2015-09-04 | 2017-03-09 | Dic株式会社 | Bisphenol f-modified resol type phenol resin for fiber-reinforced composite material, resin composition and cured product thereof, fiber-reinforced composite material, fiber-reinforced composite molded product, and method for producing bisphenol f-modified resol type phenol resin for fiber-reinforced composite material |
-
1997
- 1997-10-22 JP JP29011697A patent/JPH11124555A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001254066A (en) * | 2000-03-13 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Phenol resin adhesive |
| JP2001254065A (en) * | 2000-03-13 | 2001-09-18 | Sumitomo Bakelite Co Ltd | Wood adhesive composition |
| JP2001279214A (en) * | 2000-03-31 | 2001-10-10 | Sumitomo Bakelite Co Ltd | Phenolic resin based adhesive composition |
| JP2017048349A (en) * | 2015-09-04 | 2017-03-09 | Dic株式会社 | Bisphenol f-modified resol type phenol resin for fiber-reinforced composite material, resin composition and cured product thereof, fiber-reinforced composite material, fiber-reinforced composite molded product, and method for producing bisphenol f-modified resol type phenol resin for fiber-reinforced composite material |
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