JPH1111572A - Tray for housing semiconductor integrated circuit device - Google Patents
Tray for housing semiconductor integrated circuit deviceInfo
- Publication number
- JPH1111572A JPH1111572A JP9169741A JP16974197A JPH1111572A JP H1111572 A JPH1111572 A JP H1111572A JP 9169741 A JP9169741 A JP 9169741A JP 16974197 A JP16974197 A JP 16974197A JP H1111572 A JPH1111572 A JP H1111572A
- Authority
- JP
- Japan
- Prior art keywords
- bga
- tray
- supporting
- wall
- horizontal movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packaging Frangible Articles (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ボ−ルグリッドア
レイタイプの半導体集積回路装置（以下ＢＧＡという）
を収納するためのトレイに関する。具体的には、ＢＧＡ
を搭載し、積み重ねられたトレイについて、表裏反転作
業を繰り返し実施した際に、ＢＧＡの位置ズレの発生を
著しく低減でき、更にＢＧＡを基板に実装する時のトレ
イ移動の際に振動によりＢＧＡが収納部から飛び出す現
象を低減したＢＧＡ収納用トレイに関する。The present invention relates to a ball grid array type semiconductor integrated circuit device (hereinafter referred to as BGA).
The present invention relates to a tray for storing the information. Specifically, BGA
When the reversing work is repeatedly performed on the stacked trays, the occurrence of BGA misalignment can be significantly reduced, and the BGA is stored by vibration when the tray is moved when the BGA is mounted on the board. The present invention relates to a tray for storing BGA in which the phenomenon of jumping out of a part is reduced.
【０００２】[0002]
【従来の技術】半導体集積回路装置の１種であるＢＧＡ
が最近急速に生産数量の伸びを見せてきている。従来の
ＱＦＰ（クアドフラットパッケ−ジ）に比較して、ＢＧ
Ａは、電気ノイズの発生が少なく、高速動作が可能で、
かつ配線用の端子数を多くできる事から今後の伸びが期
待されるパッケ−ジの１つである。2. Description of the Related Art BGA, a kind of semiconductor integrated circuit device
Has been rapidly increasing production volume recently. Compared to conventional QFP (quad flat package), BG
A has a low generation of electric noise and can operate at high speed.
In addition, since the number of terminals for wiring can be increased, it is one of the packages expected to grow in the future.
【０００３】ＢＧＡは、図１に示すように、従来のＱＦ
Ｐとは異なり配線用の端子がリ−ドピンではなく、ＢＧ
Ａ底面に設けられている半田ボ−ル１である事が特徴と
なっている。そのため、ＱＦＰのリ−ドピンに異物が付
着して基板への実装不良を起こさないように、リ−ドピ
ンと収納用トレイとの接触が敬遠されているが、ＢＧＡ
においても同様に半田ボ−ル１と収納用トレイ２の接触
が敬遠されている。[0003] As shown in FIG. 1, a BGA is a conventional QF.
Unlike P, the wiring terminals are not lead pins, but BG
It is characterized in that it is a solder ball 1 provided on the bottom surface A. Therefore, contact between the lead pin and the storage tray is avoided to prevent foreign matter from adhering to the lead pin of the QFP and causing a mounting failure on the board.
Similarly, the contact between the solder ball 1 and the storage tray 2 is avoided.
【０００４】図３に従来のＢＧＡ収納用トレイの略表面
図を示す。従来のトレイでは、ＢＧＡを単数または、複
数収納するために区画された凹部からなる収納部３があ
り、又図４に示すように、ＢＧＡは、収納部３において
ＢＧＡを支持する面４およびＢＧＡの水平方向の動きを
規制する壁５を含む構成部よりなるＢＧＡ支持部６にＢ
ＧＡ外枠７とＢＧＡ底面の最外周にある半田ボ−ル１と
のすき間８が全周にわたり支持されるようになってい
る。FIG. 3 is a schematic front view of a conventional BGA storage tray. In the conventional tray, there is a storage section 3 composed of a concave section for storing one or a plurality of BGAs, and as shown in FIG. BGA supporting part 6 composed of a component including a wall 5 for restricting horizontal movement of B
A gap 8 between the GA outer frame 7 and the solder ball 1 on the outermost periphery of the BGA bottom surface is supported over the entire circumference.
【０００５】また、従来のトレイにおいては、トレイ表
面に設けられたＢＧＡ収納部３のＢＧＡを支持する面４
およびＢＧＡの水平方向の動きを規制する壁５を含む構
成部よりなるＢＧＡ支持部６とトレイ裏面に設けられ、
トレイを表裏反転させた際にＢＧＡを支持する面９およ
びＢＧＡの水平方向の動きを規制する壁１０を含む構成
部からなるＢＧＡ固定部１１、とは、嵌合または噛み合
わせの構造にはなっておらず、ＢＧＡ支持部最上面１２
とトレイ裏面に設けられたＢＧＡ固定部の最下面１４と
が接する形となっている。[0005] In the conventional tray, the surface 4 of the BGA accommodating portion 3 provided on the surface of the tray for supporting the BGA is provided.
And a BGA support 6 comprising a component including a wall 5 for regulating the horizontal movement of the BGA and a back surface of the tray,
The BGA fixing portion 11, which includes a surface 9 supporting the BGA when the tray is turned upside down and a wall 10 for restricting the horizontal movement of the BGA, has a fitting or engaging structure. No, BGA support top surface 12
And the lowermost surface 14 of the BGA fixing portion provided on the back surface of the tray.
【０００６】ＢＧＡ収納用トレイでは、従来のＱＦＰト
レイでは必要とされなかった性能が要求されている。Ｂ
ＧＡの場合、ＱＦＰとは異なり、配線用の端子つまり半
田ボ−ル１をＢＧＡ上面から観察する事が困難であるた
め、半田ボ−ル１の検査は図５に示す様に、ＢＧＡを搭
載し積み重ねられたトレイを表裏反転させた状態で行わ
れる。そのため、トレイ裏面に設けられ、トレイを表裏
反転した際にＢＧＡを支持する面９とＢＧＡの水平方向
の動きを規制する壁１０を含む構成部であるＢＧＡ固定
部１１にも、トレイ表面に設けられた収納部３において
ＢＧＡを支持する面４及びＢＧＡの水平方向の動きを規
制する壁５を含む構成部からなるＢＧＡ支持部６と同様
にＢＧＡを収納する機能が要求される。半田ボ−ル１の
検査を終了した後、再度トレイは重ねられ、表裏反転さ
せられる事になる。[0006] The BGA storage tray is required to have performance not required by the conventional QFP tray. B
In the case of the GA, unlike the QFP, it is difficult to observe the wiring terminals, that is, the solder ball 1 from the upper surface of the BGA, so that the solder ball 1 is mounted with the BGA as shown in FIG. This is performed with the stacked trays turned upside down. For this reason, the BGA fixing portion 11 which is provided on the back surface of the tray and includes the surface 9 for supporting the BGA when the tray is turned upside down and the wall 10 for restricting the horizontal movement of the BGA is also provided on the tray front surface. A function of accommodating the BGA is required in the same manner as the BGA support section 6 including the component 4 including the surface 4 supporting the BGA and the wall 5 for restricting the horizontal movement of the BGA in the accommodated section 3. After the inspection of the solder ball 1 is completed, the trays are stacked again and turned upside down.
【０００７】また、基板実装時のトレイ移動中にＢＧＡ
がトレイから飛び出さないように、ＢＧＡ支持部６の最
上面１２とＢＧＡを支持する面４との間の高さ寸法１
３、およびトレイ裏面に設けられたＢＧＡ固定部１１の
最下面１４とトレイを表裏反転した際にＢＧＡを支持す
る面９との間の高さ寸法１５はＢＧＡのパッケ−ジ厚み
１６よりも十分大きい事が要求される。[0007] In addition, the BGA
Height 1 between the top surface 12 of the BGA support 6 and the surface 4 supporting the BGA so that the
3, and the height 15 between the lowermost surface 14 of the BGA fixing portion 11 provided on the back surface of the tray and the surface 9 supporting the BGA when the tray is turned upside down is more than the package thickness 16 of the BGA. Big things are required.
【０００８】しかしなら、従来のトレイの場合には上述
の要求を十分に満たす事は出来ていない。通常、半導体
集積回路装置収納用トレイは、積み重ねた際に上下のト
レイが幾分水平方向に動くようにガタ（動きしろ）を設
ける事が要求される。従来のトレイにおいて、積み重ね
られたトレイがこのガタによりずれた際、図６に例示す
る様に、トレイ表面に設けられた収納部３においてＢＧ
Ａを支持する面４及びＢＧＡの水平方向の動きを規制す
る壁５を含む構成部からなるＢＧＡ支持部６と、トレイ
裏面に設けられトレイを表裏反転させた際にＢＧＡを支
持する面９及びＢＧＡの水平方向の動きを規制する壁１
０を含む構成部からなるＢＧＡ固定部１１に、ずれが発
生する事になる。このため、この状態のまま、半田ボ−
ル１の検査などのためにトレイが表裏反転された場合、
図７に例示するようにＢＧＡがＢＧＡ固定部１１に乗り
上げると言う問題生じ、作業性を著しく低下させる事に
なる。However, in the case of a conventional tray, the above requirements cannot be sufficiently satisfied. Normally, the trays for storing semiconductor integrated circuit devices are required to be provided with play (movement allowance) so that the upper and lower trays move in the horizontal direction when stacked. In the conventional tray, when the stacked trays are displaced by this play, as shown in FIG. 6, the BG is stored in the storage section 3 provided on the tray surface.
A BGA support portion 6 including a surface 4 for supporting A and a wall 5 for restricting horizontal movement of the BGA, and a surface 9 provided on the back surface of the tray and supporting the BGA when the tray is turned over Wall 1 that regulates horizontal movement of BGA
A shift occurs in the BGA fixing unit 11 including the components including “0”. Therefore, in this state, the solder ball
If the tray is turned upside down for inspection of
As illustrated in FIG. 7, a problem arises in that the BGA rides on the BGA fixing portion 11, which significantly reduces workability.
【０００９】また、基板実装時のトレイ移動中にＢＧＡ
がトレイから飛び出さないように、ＢＧＡ支持部の最上
面１２とＢＧＡを支持する面４との間の高さ寸法１３、
およびトレイ裏面に設けられたＢＧＡ固定部１１の最下
面１４とトレイを表裏反転した際にＢＧＡを支持する面
９との間の高さ寸法１５をＢＧＡパッケ−ジ厚み１６よ
りも十分大きくすると、図６に例示するように収納部４
内の高さ方向のすき間が大きくなり、搬送時に収納部内
でのＢＧＡのガタつきが大きくなり、ＢＧＡに悪影響を
及ぼす事になる。[0009] In addition, when the BGA is
Height dimension 13 between the top surface 12 of the BGA support and the surface 4 supporting the BGA so that the
When the height 15 between the lowermost surface 14 of the BGA fixing portion 11 provided on the back surface of the tray and the surface 9 supporting the BGA when the tray is turned upside down is made sufficiently larger than the thickness 16 of the BGA package, As illustrated in FIG.
The clearance in the height direction of the inside becomes large, and the backlash of the BGA in the storage section at the time of conveyance increases, which adversely affects the BGA.
【００１０】[0010]
【発明が解決しようとする課題】本発明は、前記の問題
を改良した物であり、ＢＧＡを搭載し積み重ねられたト
レイにおいて、表裏反転作業を繰り返し実施した際に発
生するＢＧＡの位置ずれを著しく低減し、更に、ＢＧＡ
基板実装時のトレイ移動の際に振動によりＢＧＡがトレ
イ収納部から飛び出す現象を著しくを低減した半導体集
積回路装置収納用トレイを提供する物である。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and remarkably reduces the displacement of the BGA caused by repeatedly performing the reversal operation on the stacked trays. Reduced, and BGA
An object of the present invention is to provide a semiconductor integrated circuit device storage tray in which a phenomenon in which a BGA jumps out of a tray storage portion due to vibration when the tray is moved during board mounting is significantly reduced.
【００１１】[0011]
【課題を解決するための手段】すなわち、本発明は、半
導体集積回路装置収納用トレイ１７において、ＢＧＲを
単数、または複数収納するための区画された凹部からな
る収納部１８を有しており、該半導体集積回路装置を収
納／固定する方法として、トレイを重ねた際に、トレイ
表面に設けられた収納部１８においてＢＧＡを支持する
面１９及びＢＧＡの水平方向の動きを規制する壁２０を
含む構成部からなるＢＧＡ支持部２１、と、トレイ裏面
に設けられ、トレイを表裏反転させた際に、ＢＧＡを支
持する面２２及びＢＧＡの水平方向の動きを規制する壁
２３を含む構成部からなるＢＧＡ固定部２４、とが嵌合
または／および噛み合わさる様にした事を特徴とする半
導体集積回路収納用トレイである。That is, according to the present invention, a tray 17 for storing a semiconductor integrated circuit device has a storage portion 18 comprising a partitioned concave portion for storing one or a plurality of BGRs. As a method of storing / fixing the semiconductor integrated circuit device, when the trays are stacked, a surface 19 for supporting the BGA in a storage portion 18 provided on the tray surface and a wall 20 for restricting the horizontal movement of the BGA are included. A BGA support 21 comprising a component, a component provided on the back of the tray and supporting the BGA 22 when the tray is turned upside down, and a wall 23 for restricting the horizontal movement of the BGA. The semiconductor integrated circuit storage tray is characterized in that the BGA fixing part 24 is fitted or / and engaged with the BGA fixing part 24.
【００１２】[0012]
【発明の実施の形態】以下、本発明を詳細に説明する。
図８は、本発明ＢＧＡトレイの概略平面図を示し、ポケ
ット部の断面を図９、ポケット部の拡大図を図１０に例
示する。本発明の半導体集積回路装置収納用トレイ１７
は、ボ−ルグリッドアレイタイプの半導体集積回路装置
を単数、または複数収納するための区画された凹部から
なる収納部１８を有している。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
FIG. 8 is a schematic plan view of the BGA tray of the present invention. FIG. 9 illustrates a cross section of the pocket portion, and FIG. 10 illustrates an enlarged view of the pocket portion. Tray 17 for storing semiconductor integrated circuit device of the present invention
Has an accommodating portion 18 formed of partitioned recesses for accommodating one or more ball grid array type semiconductor integrated circuit devices.
【００１３】また、トレイ表面に設けられた収納部１８
においてＢＧＡを支持する面１９及びＢＧＡの水平方向
の動きを規制する壁２０を含む構成部からなるＢＧＡ支
持部２１、に、トレイ裏面に設けられ、トレイを表裏反
転させた際に、ＢＧＡを支持する面２２及びＢＧＡの水
平方向の動きを規制する壁２３を含む構成部からなるＢ
ＧＡ固定部２４、が嵌合される方法でＢＧＡを収納／固
定している。すなわち、図１１に明らかなように、収納
部１８の周囲に設けられたＢＧＡ支持部２１の間の裏面
にＢＧＡを支持する面２２及びＢＧＡの水平方向の動き
を規制する壁２３が位置している。そのためトレイを積
み重ねた場合ＢＧＡ支持部２１の間の四隅にＢＧＡを支
持する面２２及びＢＧＡの水平方向の動きを規制する壁
２３を含む構成部からなるＢＧＡ固定部２４が挿入され
る事となり、ＢＧＡ支持部２１とＢＧＡ固定部２４が嵌
合される状態となる。A storage section 18 provided on the tray surface
In the BGA supporting portion 21 including a surface 19 supporting the BGA and a wall 20 for restricting the horizontal movement of the BGA, the BGA is provided on the back surface of the tray and supports the BGA when the tray is turned upside down. B comprising a component including a surface 22 and a wall 23 for restricting the horizontal movement of the BGA.
The BGA is stored / fixed in such a manner that the GA fixing portion 24 is fitted. That is, as is apparent from FIG. 11, a surface 22 for supporting the BGA and a wall 23 for restricting the horizontal movement of the BGA are located on the back surface between the BGA support portions 21 provided around the storage portion 18. I have. Therefore, when the trays are stacked, a BGA fixing portion 24 including a component including a surface 22 for supporting the BGA and a wall 23 for restricting the horizontal movement of the BGA is inserted into the four corners between the BGA support portions 21. The BGA support portion 21 and the BGA fixing portion 24 are in a state of being fitted.
【００１４】図９において、トレイ表面に設けられてい
るＢＧＡ支持部２１は、ＢＧＡ外枠７とＢＧＡ底面の最
外周にある半田ボ−ル１とのすき間８を支持する面１９
と、ＢＧＡの平面方向の動きを規制する壁２０を有して
おり、図１１に示すようにＢＧＡは、ＢＧＡ支持部２１
の４箇所により、４辺の中央部を支持されている。一
方、トレイ裏面に設けられているＢＧＡ固定部２４は、
トレイを表裏反転した際にＢＧＡを支持する面２２と、
ＢＧＡの平面方向の動きを規制する壁２３を有してお
り、図１２に示す様にＢＧＡは、ＢＧＡ固定部２４の４
箇所により、４隅を固定されている。In FIG. 9, a BGA support 21 provided on the tray surface supports a gap 8 between the BGA outer frame 7 and the outermost solder ball 1 on the BGA bottom surface.
And a wall 20 for restricting the movement of the BGA in the plane direction. As shown in FIG.
Are supported at the center of the four sides. On the other hand, the BGA fixing part 24 provided on the back of the tray is
A surface 22 for supporting the BGA when the tray is turned upside down,
The BGA has a wall 23 for restricting the movement of the BGA in the plane direction. As shown in FIG.
Four corners are fixed depending on the location.
【００１５】上述の本発明のトレイを使用する事によ
り、トレイを表裏反転した際にもＢＧＡは、ＢＧＡ固定
部２４により収納及び固定される。また、図１０に示す
ように、トレイ表面に設けられ、ＢＧＡ支持部にトレイ
裏面に設けられているＢＧＡ固定部２４を嵌合させる事
により、上下のトレイがガタにより、ずれが生じた際に
トレイを表裏反転しても、ＢＧＡの水平方向の動きを固
定する壁２０もしくは同２３によりＢＧＡは誘導され
て、図７の時の様にＢＧＡがＢＧＡ固定部２４に乗り上
げると言う問題は生じにくい。By using the above-described tray of the present invention, the BGA is stored and fixed by the BGA fixing part 24 even when the tray is turned upside down. Further, as shown in FIG. 10, by fitting the BGA fixing portion 24 provided on the tray surface and provided on the back surface of the tray to the BGA support portion, when the upper and lower trays are displaced due to backlash, Even if the tray is turned upside down, the problem that the BGA is guided by the wall 20 or 23 that fixes the horizontal movement of the BGA and the BGA rides on the BGA fixing portion 24 as in FIG. .
【００１６】更に、ＢＧＡの飛び出しを防止するため
に、ＢＧＡ支持部最上面２５とＢＧＡを支持する面１９
との間の高さ２６、及びトレイ裏面に設けられたＢＧＡ
固定部の最下面２７とトレイを表裏反転した際にＢＧＡ
を支持する面２２との間の高さ２８を大きくしても、収
納部１８内でのＢＧＡの垂直方向のガタつきを低減する
事が可能となった。Further, in order to prevent the BGA from jumping out, the top surface 25 of the BGA support and the surface 19 for supporting the BGA are provided.
26, and a BGA provided on the back of the tray
When the bottom surface 27 of the fixed part and the tray are turned upside down, BGA
Even if the height 28 between the surface and the surface 22 for supporting the BGA is increased, it is possible to reduce the rattling of the BGA in the vertical direction in the storage portion 18.
【００１７】本発明のトレイにおいて、トレイ表面に設
けられているＢＧＡ支持部２１において、ＢＧＡ外枠７
とＢＧＡ底面の最外周にある半田ボ−ル１とのすき間８
を支持する面１９、及びＢＧＡの水平方向の動きを規制
する壁２０を有しておれば、ＢＧＡ支持部２１の形状、
位置、数量については、ＢＧＡの収納性を著しく低減さ
せない範囲で自由に設定する事ができる。In the tray of the present invention, the BGA outer frame 7 is provided on the BGA support 21 provided on the tray surface.
8 between the solder ball 1 and the outermost periphery of the BGA bottom surface
And a wall 20 for restricting the horizontal movement of the BGA, the shape of the BGA support 21
The position and quantity can be freely set within a range that does not significantly reduce the storage capacity of the BGA.
【００１８】また、トレイ裏面に設けられるＢＧＡ固定
部２４において、トレイを表裏反転させた際に、ＢＧＡ
を支持する面２２、及びＢＧＡの平面方向の動きを規制
する壁２３を有しておれば、ＢＧＡ固定部２４の形状、
位置、数量についてはＢＧＡの収納性を著しく低減させ
ない範囲で自由に設定する事が出来る。When the tray is turned upside down in the BGA fixing section 24 provided on the back of the tray,
And a wall 23 for restricting the movement of the BGA in the planar direction, the shape of the BGA fixing portion 24,
The position and quantity can be freely set within a range that does not significantly reduce the storage capacity of the BGA.
【００１９】また、トレイが積み重ねられた際の嵌合ま
たは噛みこみの深さについては、ＢＧＡの種類等によっ
て変動するが、基本的にはＢＧＡの収納性を著しく低減
しない範囲で、自由に設定する事ができる。The depth of fitting or biting when the trays are stacked varies depending on the type of BGA, etc., but is basically set freely within a range that does not significantly reduce the storage capacity of the BGA. You can do it.
【００２０】トレイ表面に設けられた収納部１８におい
てＢＧＡを支持する面１９及びＢＧＡの水平方向の動き
を規制する壁２０を含む構成部からなるＢＧＡ支持部２
１は、図９の様に隣接する収納部をつなぐ支持表面２５
高さよりも低い位置に存在（支持表面に対して凹なる形
状で存在）してもよいし、又、隣接する収納部をつなぐ
支持表面２５高さよりも高い位置に存在（支持表面に対
して凸なる形状で存在）してもよい。A BGA support 2 comprising a component 19 including a surface 19 for supporting the BGA in a storage portion 18 provided on the tray surface and a wall 20 for restricting the horizontal movement of the BGA.
1 is a supporting surface 25 connecting adjacent storage parts as shown in FIG.
It may be present at a position lower than the height (existing in a concave shape with respect to the support surface), or may be present at a position higher than the height of the support surface 25 connecting the adjacent storage portions (projected with respect to the support surface). Existing in the form of
【００２１】ＢＧＡ支持部２１及びＢＧＡ固定部２４は
トレイを積み重ねた際に相互に嵌合または／および噛み
合わさる構造になっていれば、その個数を増やしても問
題ない。また、図１１でＢＧＡ支持部２１とＢＧＡ固定
部２４の位置を入れ替えても、相互に嵌合または／およ
び噛み合わされる構造であれば問題ない。なお、従来の
トレイにおいて行われている収納部１８に穴をあける事
については本発明においても問題なく適用することがで
きる。As long as the BGA support portions 21 and the BGA fixing portions 24 have a structure in which they are fitted or engaged with each other when the trays are stacked, there is no problem in increasing the numbers. Further, even if the positions of the BGA support portion 21 and the BGA fixing portion 24 in FIG. 11 are interchanged, there is no problem as long as the structures are fitted or engaged with each other. It is to be noted that the perforation of the storage section 18 performed in the conventional tray can be applied to the present invention without any problem.
【００２２】[0022]
【発明の効果】以上のように本発明は、ＢＧＡを搭載
し、積み重ねられたトレイについて、表裏反転作業を繰
り返し実施した際に、ＢＧＡの位置ずれの発生を著しく
低減でき、さらにＢＧＡ基板実装時のトレイ移動の際に
振動によりＢＧＡが収納部から飛び出す現象を低減した
ＢＧＡ収納用トレイを提供する物である。As described above, the present invention can significantly reduce the occurrence of BGA misalignment when the BGA is mounted and the stacking trays are repeatedly turned over, and the BGA board is mounted. It is an object of the present invention to provide a tray for storing a BGA in which the phenomenon that the BGA jumps out of the storage section due to vibration when the tray is moved is reduced.
【図１】ボ−ルグリッドアレイタイプの半導体集積回路
の側面図FIG. 1 is a side view of a ball grid array type semiconductor integrated circuit.
【図２】ボールグリップアレイタイプの半導体集積回路
の裏面図FIG. 2 is a back view of a ball grip array type semiconductor integrated circuit.
【図３】既存のＢＧＡトレイ概略表面図FIG. 3 is a schematic surface view of an existing BGA tray.
【図４】既存のＢＧＡトレイ重ね側面図FIG. 4 is a side view of an existing BGA tray stacked.
【図５】既存のＢＧＡトレイ表裏反転時の側面図FIG. 5 is a side view of the existing BGA tray when it is turned upside down.
【図６】既存のＢＧＡトレイ積み重ね時のガタによるズ
レFIG. 6: Gap due to backlash when stacking existing BGA trays
【図７】既存のＢＧＡトレイ表裏反転時の側面図／ＢＧ
Ａの乗上げFIG. 7 is a side view of the existing BGA tray when it is turned upside down / BG.
Ride A
【図８】本発明のＢＧＡトレイ概略表面図FIG. 8 is a schematic surface view of a BGA tray of the present invention.
【図９】本発明のＢＧＡトレイ積み重ね時の側面図FIG. 9 is a side view when the BGA trays of the present invention are stacked.
【図１０】本発明のＢＧＡトレイ積み重ね時の拡大側面
図FIG. 10 is an enlarged side view when a BGA tray according to the present invention is stacked.
【図１１】本発明のＢＧＡトレイ収納部の表面図（点線
部は裏面を示す）FIG. 11 is a front view of a BGA tray storage unit of the present invention (a dotted line indicates a back surface).
【図１２】本発明のＢＧＡトレイ収納部の裏面図FIG. 12 is a rear view of the BGA tray storage unit of the present invention.
１ ＢＧＡ半田ボ−ル ２ 既存のＢＧＡ収納用トレイ ３ ＢＧＡ収納部 ４ 収納部においてＢＧＡを支持する面 ５ 収納部においてＢＧＡの平面方向の動きを規制する
壁 ６ トレイ表面に設けられるＢＧＡ支持部 ７ ＢＧＡ外枠 ８ ＢＧＡ外枠７とＢＧＡ底面の最外周に位置する半田
ボ−ル１とのすき間 ９ トレイを表裏反転した際にＢＧＡの底面を支持する
面 １０ トレイを表裏反転した際にＢＧＡ平面方向の動き
を規制する壁 １１ トレイ裏面に設けられるＢＧＡ固定部 １２ ＢＧＡ支持部最上面 １３ ＢＧＡ支持部最上面とＢＧＡを支持する面との間
の高さ １４ トレイ裏面に設けられたＢＧＡ固定部の最下面 １５ トレイ裏面に設けられたＢＧＡ固定部の最下面と
トレイを表裏反転した際にＢＧＡを支持する面との間の
高さ １６ ＢＧＡパッケ−ジの厚み １７ 本発明のＢＧＡトレイ １８ 本発明のＢＧＡトレイ収納部 １９ 本発明のトレイ収納部においてＢＧＡを支持する
面 ２０ 本発明のトレイ収納部においてＢＧＡの平面方向
の動きを規制する壁 ２１ 本発明のトレイ表面に設けられるＢＧＡ支持部 ２２ 本発明のトレイを表裏反転した際にＢＧＡを支持
する面 ２３ 本発明のトレイを表裏反転した際にＢＧＡ平面方
向の動きを規制する壁 ２４ 本発明のトレイ裏面に設けられるＢＧＡ固定部 ２５ 本発明のＢＧＡ支持部最上面 ２６ 本発明のＢＧＡ支持部最上面とＢＧＡを支持する
面との間の高さ ２７ 本発明のトレイ裏面に設けられたＢＧＡ固定部の
最下面 ２８ 本発明の、トレイ裏面に設けられたＢＧＡ固定部
の最下面とトレイを表裏反転した際にＢＧＡを支持する
面との間の高さREFERENCE SIGNS LIST 1 BGA solder ball 2 Existing BGA storage tray 3 BGA storage part 4 Surface supporting BGA in storage part 5 Wall for restricting BGA movement in storage part in plane direction 6 BGA support part provided on tray surface 7 BGA outer frame 8 Clearance between BGA outer frame 7 and solder ball 1 located at the outermost periphery of BGA bottom surface 9 Surface to support BGA bottom surface when tray is turned upside down 10 BGA plane when tray is turned upside down Wall for restricting movement in direction 11 BGA fixing part provided on tray back surface 12 BGA support top surface 13 Height between BGA support top surface and BGA supporting surface 14 BGA fixing unit provided on tray back surface 15 The height between the lowermost surface of the BGA fixing portion provided on the back surface of the tray and the surface supporting the BGA when the tray is turned upside down 16 BGA package B Thickness 17 BGA Tray of the Present Invention 18 BGA Tray Storage Unit of the Present Invention 19 Surface Supporting BGA in Tray Storage Unit of the Present Invention 20 Walls Restricting BGA Planar Movement in Tray Storage Unit of the Present Invention BGA support portion provided on the surface of the tray of the present invention 22 A surface for supporting the BGA when the tray of the present invention is turned upside down 23 A wall for regulating the movement in the BGA plane direction when the tray of the present invention is turned upside down 24 BGA fixing portion provided on back surface of tray 25 Top surface of BGA support portion of the present invention 26 Height between top surface of BGA support portion of the present invention and surface supporting BGA 27 BGA fixing provided on back surface of tray of the present invention Lower surface of unit 28 Height between the lowermost surface of the BGA fixing unit provided on the back surface of the tray and the surface supporting the BGA when the tray is turned over
Claims (3)
７）において、ボ−ルグリッドアレイタイプの半導体集
積回路装置を単数、または複数収納するための、区画さ
れた凹部からなる収納部（１８）を有しており、該半導
体集積回路装置を収納／固定する方法として、トレイを
重ねた際に、トレイ表面に設けられた収納部（１８）に
おいてＢＧＡを支持する面（１９）及びＢＧＡの水平方
向の動きを規制する壁（２０）を含む構成部からなるＢ
ＧＡ支持部（２１）、と、トレイ裏面に設けられ、トレ
イを表裏反転させた際に、ＢＧＡを支持する面（２２）
及びＢＧＡの水平方向の動きを規制する壁（２３）を含
む構成部からなるＢＧＡ固定部（２４）、とが嵌合また
は／および噛み合わさる様にした事を特徴とする半導体
集積回路収納用トレイ（１７）。A tray for storing a semiconductor integrated circuit device;
In 7), there is provided a storage section (18) composed of partitioned recesses for storing a single or a plurality of ball grid array type semiconductor integrated circuit devices. As a fixing method, when the trays are stacked, a component including a surface (19) for supporting the BGA in a storage portion (18) provided on the surface of the tray and a wall (20) for restricting horizontal movement of the BGA. B consisting of
GA support (21), and a surface (22) provided on the back of the tray and supporting the BGA when the tray is turned upside down
And a BGA fixing part (24) comprising a component including a wall (23) for restricting the horizontal movement of the BGA. (17).
れた収納部（１８）においてＢＧＡを支持する面（１
９）及びＢＧＡの水平方向の動きを規制する壁（２０）
を含む構成部からなるＢＧＡ支持部（２１）が、隣接す
る収納部をつなぐ支持平面（２５）に対して凸なる形状
である事を特徴とする半導体集積回路装置収納用トレ
イ。2. A surface (1) for supporting a BGA in a storage section (18) provided on a surface of a tray according to claim 1.
9) and a wall (20) for restricting the horizontal movement of the BGA
A BGA supporting portion (21) comprising a component including: a tray for storing a semiconductor integrated circuit device, wherein the BGA supporting portion (21) has a shape that is convex with respect to a supporting plane (25) connecting adjacent storing portions.
れた収納部（１８）においてＢＧＡを支持する面（１
９）及びＢＧＡの水平方向の動きを規制する壁（２０）
を含む構成部からなるＢＧＡ支持部（２１）が、隣接す
る収納部をつなぐ支持平面（２５）に対して凹なる形状
である事を特徴とする半導体集積回路装置収納用トレ
イ。3. A surface (1) for supporting a BGA in a storage section (18) provided on a surface of a tray according to claim 1.
9) and a wall (20) for restricting the horizontal movement of the BGA
A BGA support portion (21) comprising a component including: a tray integrated with a semiconductor integrated circuit device, wherein the BGA support portion (21) is concave with respect to a support plane (25) connecting adjacent storage portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16974197A JP3314918B2 (en) | 1997-06-26 | 1997-06-26 | Tray for storing semiconductor integrated circuit devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16974197A JP3314918B2 (en) | 1997-06-26 | 1997-06-26 | Tray for storing semiconductor integrated circuit devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1111572A true JPH1111572A (en) | 1999-01-19 |
| JP3314918B2 JP3314918B2 (en) | 2002-08-19 |
Family
ID=15891992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16974197A Expired - Fee Related JP3314918B2 (en) | 1997-06-26 | 1997-06-26 | Tray for storing semiconductor integrated circuit devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3314918B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002370744A (en) * | 2001-06-15 | 2002-12-24 | Fujitsu Kasei Kk | Transport tray |
| WO2008050442A1 (en) * | 2006-10-27 | 2008-05-02 | Advantest Corporation | Electronic component testing apparatus |
| US7374970B2 (en) | 2004-03-12 | 2008-05-20 | Renesas Technology Corp. | Manufacturing method of a tray, a socket for inspection, and a semiconductor device |
| JP2017178354A (en) * | 2016-03-29 | 2017-10-05 | 株式会社城南村田 | Support tray |
| CN109335214A (en) * | 2018-11-30 | 2019-02-15 | 安庆华璟电子科技有限公司 | A kind of general vacuum formed box of FPC and processing method |
-
1997
- 1997-06-26 JP JP16974197A patent/JP3314918B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002370744A (en) * | 2001-06-15 | 2002-12-24 | Fujitsu Kasei Kk | Transport tray |
| US7374970B2 (en) | 2004-03-12 | 2008-05-20 | Renesas Technology Corp. | Manufacturing method of a tray, a socket for inspection, and a semiconductor device |
| US7915057B2 (en) | 2004-03-12 | 2011-03-29 | Renesas Electronics Corporation | Manufacturing method of a tray, a socket for inspection, and a semiconductor device |
| US8093073B2 (en) | 2004-03-12 | 2012-01-10 | Renesas Electronics Corporation | Manufacturing method of a tray, a socket for inspection, and a semiconductor device |
| WO2008050442A1 (en) * | 2006-10-27 | 2008-05-02 | Advantest Corporation | Electronic component testing apparatus |
| JP2017178354A (en) * | 2016-03-29 | 2017-10-05 | 株式会社城南村田 | Support tray |
| CN109335214A (en) * | 2018-11-30 | 2019-02-15 | 安庆华璟电子科技有限公司 | A kind of general vacuum formed box of FPC and processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3314918B2 (en) | 2002-08-19 |
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