JPH11114741A - Combined machining center - Google Patents

Combined machining center

Info

Publication number
JPH11114741A
JPH11114741A JP9303374A JP30337497A JPH11114741A JP H11114741 A JPH11114741 A JP H11114741A JP 9303374 A JP9303374 A JP 9303374A JP 30337497 A JP30337497 A JP 30337497A JP H11114741 A JPH11114741 A JP H11114741A
Authority
JP
Japan
Prior art keywords
laser
spindle
tool
machining center
milling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9303374A
Other languages
Japanese (ja)
Inventor
Shigeru Yamada
滋 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitamura Machinery Co Ltd
Original Assignee
Kitamura Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitamura Machinery Co Ltd filed Critical Kitamura Machinery Co Ltd
Priority to JP9303374A priority Critical patent/JPH11114741A/en
Publication of JPH11114741A publication Critical patent/JPH11114741A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1482—Detachable nozzles, e.g. exchangeable or provided with breakaway lines

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a combined machining center that is capable of performing those of cutting, welding, heat treatment, laser marking and so on by means of laser beams together with the machining of a milling cutter, a drill and end mill or the like to be done by rotating the conventional spindle. SOLUTION: This combined machining center is so constituted as to perform its machining such as milling, drilling and end milling by rotating a spindle 15 after attaching each individual tool to this spindle 15 of a spindle head 14 free from detachment, and further a laser generator 21 is set up in the spindle head 14, and a laser beam machining tool 23 working together with this laser generator 21 is attached to the spindle 15 free from detachment, and thereby such machining operations as cutting, welding, heat treatment, laser marking and so on by means of laser beams, without rotating the spindle 15, are performed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】この発明は、複合マシニング
センタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a complex machining center.

【０００２】[0002]

【従来の技術】近年、レーザ光による切断、溶接、熱処
理等の加工が手軽に行われるようになってきた。2. Description of the Related Art In recent years, processing such as cutting, welding, and heat treatment by a laser beam has been easily performed.

【０００３】これは、レーザ技術の発展に伴い、レーザ
装置の出力が増大し、装置の小型化が進んでいるためで
ある。[0003] This is because the output of a laser device is increasing with the development of laser technology, and the device is being miniaturized.

【０００４】[0004]

【発明が解決しようとする課題】本発明は、前述のよう
なレーザ装置の小型化・高出力化を利用し、従来の主軸
を回転させて行うフライス加工、ドリル加工、エンドミ
ル加工等の加工と共に、レーザ光による切断、溶接、熱
処理、レーザマーキング等の加工が行える複合マシニン
グセンタを提供することを目的としている。SUMMARY OF THE INVENTION The present invention utilizes the miniaturization and high output of the laser device as described above, together with the conventional processes such as milling, drilling and end milling which are performed by rotating the main spindle. It is another object of the present invention to provide a composite machining center capable of performing processing such as cutting, welding, heat treatment, and laser marking by laser light.

【０００５】[0005]

【課題を解決するための手段】本願発明は、主軸ヘッド
（１４）の主軸（１５）にツールを着脱自在に取り付
け、主軸（１５）を回転させてフライス加工、ドリル加
工、エンドミル加工のような加工を行う構成にし、さら
に主軸ヘッド（１４）にレーザ発振器（２１）を配置
し、このレーザ発振器（２１）と協働するレーザ加工用
ツール（２３）を主軸（１５）に着脱自在に取り付け
て、主軸（１５）を回転させずに、レーザ光による切
断、溶接、熱処理、レーザマーキングのような加工を行
う構成にしたことを特徴とする複合マシニングセンタを
要旨としている。According to the present invention, a tool is detachably mounted on a spindle (15) of a spindle head (14), and the spindle (15) is rotated to perform milling, drilling, end milling or the like. A laser oscillator (21) is arranged on the spindle head (14), and a laser processing tool (23) cooperating with the laser oscillator (21) is detachably attached to the spindle (15). The gist of the present invention is a composite machining center characterized in that processing such as cutting by laser light, welding, heat treatment, and laser marking is performed without rotating the main shaft (15).

【０００６】[0006]

【発明の実施の形態】本発明の複合マシニングセンタ
は、主軸ヘッドの主軸にツールを着脱自在に取り付け、
主軸を回転させてフライス加工、ドリル加工、エンドミ
ル加工のような加工を行う構成にし、さらに主軸ヘッド
にレーザ発振器を配置し、このレーザ発振器と協働する
レーザ加工用ツールを主軸に着脱自在に取り付けて、主
軸を回転させずに、レーザ光による切断、溶接、熱処
理、レーザマーキングのような加工を行う構成になって
いる。DESCRIPTION OF THE PREFERRED EMBODIMENTS In a composite machining center according to the present invention, a tool is removably attached to a spindle of a spindle head.
The spindle is rotated to perform processing such as milling, drilling, and end milling.In addition, a laser oscillator is arranged on the spindle head, and a laser processing tool that cooperates with this laser oscillator is detachably attached to the spindle. Thus, processing such as cutting by laser light, welding, heat treatment, and laser marking is performed without rotating the main shaft.

【０００７】レーザ発振器は、主軸ヘッドの側部に固定
することができる。[0007] The laser oscillator can be fixed to the side of the spindle head.

【０００８】レーザ加工用ツールは、自動工具交換アー
ムによって主軸に取り付け、また、取り外しすることが
できる。[0008] The laser processing tool can be attached to and detached from the spindle by an automatic tool change arm.

【０００９】レーザ加工用ツールは、適宜集光レンズを
備えている。[0009] The laser processing tool is appropriately provided with a condenser lens.

【００１０】[0010]

【実施例】以下、図面を参照して本発明の実施例を説明
する。Embodiments of the present invention will be described below with reference to the drawings.

【００１１】図１は、本発明による複合マシニングセン
タの実施例を概念的に示す斜視図である。また、図２
は、主軸ヘッド、レーザ発振器、レーザ加工用ツールを
示す正面図である。FIG. 1 is a perspective view conceptually showing an embodiment of a composite machining center according to the present invention. FIG.
FIG. 2 is a front view showing a spindle head, a laser oscillator, and a laser processing tool.

【００１２】複合マシニングセンタ１０はベース１１を
備え、ベース１１の上にはワーク設定用のテーブル１２
が配置されている。テーブル１２は、水平面上を自在に
移動可能である。The complex machining center 10 has a base 11 and a work setting table 12 on the base 11.
Is arranged. The table 12 is freely movable on a horizontal plane.

【００１３】テーブル１２は、鉛直軸や水平軸の回りに
インデックス可能な構成にすることもできる。The table 12 may be configured to be indexable around a vertical axis or a horizontal axis.

【００１４】ベース１１の上方にはコラム１３が形成さ
れている。コラム１３には、主軸ヘッド１４が、上下方
向に移動可能に配置されている。A column 13 is formed above the base 11. A spindle head 14 is arranged on the column 13 so as to be movable in the vertical direction.

【００１５】主軸ヘッド１４には、主軸１５が高速回転
可能に配置されている。A spindle 15 is disposed on the spindle head 14 so as to be able to rotate at a high speed.

【００１６】フライス加工用、ドリル加工用、エンドミ
ル加工用などの通常のツールを主軸１５に設定した場合
には、主軸を回転させて加工を行う。一方、後述するレ
ーザ加工用ツールを主軸１５に設定する場合には、主軸
は回転させず固定状態で加工を行う。When a normal tool for milling, drilling, end milling, or the like is set on the spindle 15, machining is performed by rotating the spindle. On the other hand, when a laser processing tool, which will be described later, is set on the spindle 15, machining is performed in a fixed state without rotating the spindle.

【００１７】主軸ヘッド１４の隣には、自動工具交換ア
ーム１７が配置されている。Next to the spindle head 14, an automatic tool change arm 17 is arranged.

【００１８】その隣には、多数のツールをインデックス
可能に収容する構成のツールマガジン１８が配置されて
いる。ツールマガジン１８には、フライス加工用ツー
ル、ドリル加工用ツール、エンドミル加工用ツール等の
通常のツールの他に、後述するレーザ加工用ツールも待
機させておく。A tool magazine 18 having a configuration for accommodating a large number of tools in an indexable manner is arranged next to the tool magazine. In the tool magazine 18, in addition to ordinary tools such as a milling tool, a drilling tool, and an end milling tool, a laser processing tool, which will be described later, is also kept on standby.

【００１９】各ツールはツールホルダに固定されてお
り、主軸１５、ツールマガジン１８、及び自動工具交換
アーム１７はそのホルダ部をホールドするようになって
いる。Each tool is fixed to a tool holder, and the main shaft 15, the tool magazine 18, and the automatic tool change arm 17 hold the holder.

【００２０】コラム１３の他方側には、制御パネル１６
が配置されている。On the other side of the column 13, a control panel 16
Is arranged.

【００２１】主軸ヘッド１４の側部には、レーザ発振器
２１が設定されている。レーザ発振器２１はレーザ経路
２２を有し、レーザ経路２２に沿ってレーザ光を発射す
る構成になっている。On the side of the spindle head 14, a laser oscillator 21 is set. The laser oscillator 21 has a laser path 22 and emits laser light along the laser path 22.

【００２２】レーザ加工用ツール２３は、このレーザ発
振器２１と協働し、レーザ加工を行うためのツールであ
る。図面では、レーザ加工用ツール２３が主軸１５に取
り付けられている。The laser processing tool 23 is a tool for performing laser processing in cooperation with the laser oscillator 21. In the drawing, a laser processing tool 23 is attached to the main shaft 15.

【００２３】レーザ加工用ツール２３は、他のツールと
同様にツールマガジン１８に収容され、自動工具交換ア
ーム１７によって、主軸１５とマガジン１８の間を搬送
される。The laser processing tool 23 is housed in a tool magazine 18 like other tools, and is conveyed between the spindle 15 and the magazine 18 by the automatic tool changing arm 17.

【００２４】図２に示すように、レーザ加工用ツール２
３は、レーザ発振器２１から発射されたレーザ光を集光
して、ワークに向って主軸方向２８に照射する構成にな
っている。すなわち、レーザ加工用ツール２３は、レー
ザ用集光レンズアダプタとして機能する。As shown in FIG. 2, the laser processing tool 2
Reference numeral 3 denotes a configuration in which the laser light emitted from the laser oscillator 21 is condensed and irradiated toward the workpiece in the main axis direction 28. That is, the laser processing tool 23 functions as a laser condenser lens adapter.

【００２５】レーザ加工用ツール２３は、レーザ発振器
２１のレーザ通路２２と連通するレーザ通路２９を有し
ている。レーザ通路２９内には、反射鏡２４が配置され
ている。レーザ発振器２１から発射されたレーザ光は、
この反射鏡２４で直角に向きを変える。その先には、別
の反射鏡２５が配置され、レーザ光の向きを主軸方向２
８に偏向するようになっている。The laser processing tool 23 has a laser path 29 communicating with the laser path 22 of the laser oscillator 21. The reflecting mirror 24 is arranged in the laser path 29. The laser light emitted from the laser oscillator 21 is
The direction is changed at right angles by the reflecting mirror 24. In front of that, another reflecting mirror 25 is arranged, and the direction of the laser beam is
8 is deflected.

【００２６】そして、主軸方向２８に向きを変えたレー
ザ光は、レーザ光の進路上に配置された集光レンズ２６
と照射レンズ２７を介して、ワークに照射される。レン
ズ系の仕様は、レーザ加工の種類に応じて適宜選定する
ことができる。The laser light whose direction has been changed in the main axis direction 28 is condensed by a condenser lens 26 disposed on the path of the laser light.
The work is irradiated to the work through the irradiation lens 27. The specifications of the lens system can be appropriately selected according to the type of laser processing.

【００２７】レーザ加工用ツール２３を用いてレーザ加
工を行う場合には、前述したように主軸１５は回転させ
ない。When laser processing is performed using the laser processing tool 23, the main shaft 15 is not rotated as described above.

【００２８】レーザ加工用ツールを用いることによっ
て、レーザ光による切断、溶接、熱処理、レーザマーキ
ング等を自在に行うことができる。By using a laser processing tool, cutting, welding, heat treatment, laser marking, and the like using a laser beam can be performed freely.

【００２９】また、従来の主軸を回転させて行う他の加
工も、段取り替えせずに当該マシニングセンタで行うこ
とができるので、両方の加工を組み合わせた複合的な加
工が可能となる。[0029] Further, other conventional processing performed by rotating the main spindle can be performed by the machining center without changing the setup, so that a composite processing combining both processings can be performed.

【００３０】[0030]

【発明の効果】本発明の複合マシニングセンタによれ
ば、従来の主軸を回転させて行うフライス加工、ドリル
加工、エンドミル加工等の加工と共に、レーザ光による
切断、溶接、熱処理、レーザマーキング等を自在に行う
ことができる。According to the composite machining center of the present invention, cutting, welding, heat treatment, laser marking, and the like by laser light can be freely performed together with conventional processing such as milling, drilling, and end milling performed by rotating a main spindle. It can be carried out.

【００３１】なお、本発明は前述の実施例に限定されな
い。例えば、本発明のレーザ加工ヘッド付の複合マシニ
ングセンタは、実施例で示した以外の様々なタイプのマ
シニングセンタ、例えば横型マシニングセンタ等に適用
することも可能である。The present invention is not limited to the above embodiment. For example, the composite machining center with a laser processing head according to the present invention can be applied to various types of machining centers other than those shown in the embodiments, for example, horizontal machining centers.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明による複合マシニングセンタの実施例を
概念的に示す斜視図。FIG. 1 is a perspective view conceptually showing an embodiment of a composite machining center according to the present invention.

【図２】主軸ヘッド、レーザ発振器、レーザ加工用ツー
ルを示す正面図。FIG. 2 is a front view showing a spindle head, a laser oscillator, and a laser processing tool.

【符号の説明】[Explanation of symbols]

１０ 複合マシニングセンタ １１ ベース １２ テーブル １３ コラム １４ 主軸ヘッド １５ 主軸 １６ 制御盤 １７ 自動工具交換アーム １８ ツールマガジン ２１ レーザ発振器 ２２、２９ レーザ通路 ２３ レーザ加工用ツール ２４、２５ 反射鏡 ２６ 集光レンズ ２７ 照射レンズ ２８ 主軸方向 DESCRIPTION OF SYMBOLS 10 Composite machining center 11 Base 12 Table 13 Column 14 Spindle head 15 Spindle 16 Control panel 17 Automatic tool change arm 18 Tool magazine 21 Laser oscillator 22, 29 Laser path 23 Laser processing tool 24, 25 Reflector 26 Condenser lens 27 Irradiation lens 28 Spindle direction

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 主軸ヘッド（１４）の主軸（１５）にツ
ールを着脱自在に取り付け、主軸（１５）を回転させて
フライス加工、ドリル加工、エンドミル加工のような加
工を行う構成にし、さらに主軸ヘッド（１４）にレーザ
発振器（２１）を配置し、このレーザ発振器（２１）と
協働するレーザ加工用ツール（２３）を主軸（１５）に
着脱自在に取り付けて、主軸（１５）を回転させずにレ
ーザ光による切断、溶接、熱処理、レーザマーキングの
ような加工を行う構成にしたことを特徴とする複合マシ
ニングセンタ。A tool is detachably attached to a spindle (15) of a spindle head (14), and the spindle (15) is rotated to perform processing such as milling, drilling, and end milling. A laser oscillator (21) is arranged on the head (14), and a laser processing tool (23) cooperating with the laser oscillator (21) is detachably attached to the spindle (15), and the spindle (15) is rotated. A composite machining center that performs processing such as cutting, welding, heat treatment, and laser marking without using a laser beam. 【請求項２】 レーザ発振器（２１）が主軸ヘッド（１
４）の側部に固定されることを特徴とする請求項１に記
載の複合マシニングセンタ。2. A laser oscillator (21) comprising: a spindle head (1);
The composite machining center according to claim 1, wherein the composite machining center is fixed to a side portion of (4). 【請求項３】 自動工具交換アーム（１７）を設け、自
動工具交換アーム（１７）によってレーザ加工用ツール
（２３）を主軸（１５）に取り付け、また、取り外しす
る構成にしたことを特徴とする請求項１に記載の複合マ
シニングセンタ。3. An automatic tool changing arm (17) is provided, and the laser processing tool (23) is attached to and removed from the main shaft (15) by the automatic tool changing arm (17). The composite machining center according to claim 1. 【請求項４】 レーザ加工用ツール（２３）が集光レン
ズ（２６）を備えていることを特徴とする請求項１に記
載の複合マシニングセンタ。4. The composite machining center according to claim 1, wherein the laser processing tool (23) includes a condenser lens (26).
JP9303374A 1997-10-20 1997-10-20 Combined machining center Pending JPH11114741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9303374A JPH11114741A (en) 1997-10-20 1997-10-20 Combined machining center

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9303374A JPH11114741A (en) 1997-10-20 1997-10-20 Combined machining center

Publications (1)

Publication Number Publication Date
JPH11114741A true JPH11114741A (en) 1999-04-27

Family

ID=17920241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9303374A Pending JPH11114741A (en) 1997-10-20 1997-10-20 Combined machining center

Country Status (1)

Country Link
JP (1) JPH11114741A (en)

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US7292352B2 (en) * 2005-07-01 2007-11-06 Hsin Fung Peng Laser index device on tool shaft of machine
JP2009255177A (en) * 2009-07-27 2009-11-05 Yamazaki Mazak Corp Laser hardening tool
JP2010264508A (en) * 2009-04-13 2010-11-25 Nippon Sharyo Seizo Kaisha Ltd Machining device
JP4599475B2 (en) * 2000-03-22 2010-12-15 福岡県 Welding systems on machine tools
CN102000918A (en) * 2010-11-08 2011-04-06 武汉法利莱切割***工程有限责任公司 Laser bevel cutting head
CN103358126A (en) * 2012-04-09 2013-10-23 桂林广陆数字测控股份有限公司 Cutting machining and laser machining combined sheet-metal machining center
KR101384766B1 (en) * 2012-05-03 2014-04-24 계명대학교 산학협력단 machining center for CNC laser machining
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WO2016138676A1 (en) * 2015-03-02 2016-09-09 东台精机股份有限公司 Combined type computer numerical control processing machine and processing method therefor
US9673185B2 (en) 2014-04-28 2017-06-06 Samsung Electronics Co., Ltd. Method of manufacturing stacked semiconductor package
US9687938B2 (en) 2014-09-03 2017-06-27 Mitsubishi Electric Corporation Laser machining apparatus
US20170216964A1 (en) * 2014-10-20 2017-08-03 Red Steel Ltd Machine for processing of volumetric metal objects
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