JPH11103233A - Piezoelectric vibrator and its production - Google Patents
Piezoelectric vibrator and its productionInfo
- Publication number
- JPH11103233A JPH11103233A JP27795397A JP27795397A JPH11103233A JP H11103233 A JPH11103233 A JP H11103233A JP 27795397 A JP27795397 A JP 27795397A JP 27795397 A JP27795397 A JP 27795397A JP H11103233 A JPH11103233 A JP H11103233A
- Authority
- JP
- Japan
- Prior art keywords
- lower case
- hole
- piezoelectric
- piezoelectric vibrator
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は水晶振動子等の圧電
振動子の構成とその製造方法に関する。The present invention relates to a structure of a piezoelectric vibrator such as a quartz vibrator and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来の圧電振動子例えば水晶振動子の代
表的な構造を図７と図８に示す。図７は円筒形の容器を
有する周知の構造例の斜視図で一部を破断してある。水
晶振動片１はその両面に励振電極１１を有し、その水晶
引出電極１２は気密端子９１のガラス部分を貫通する２
本のリード線にハンダ付けされている。キャップ９２が
軟質金属を外周にコーティングした気密端子９１に真空
中で圧入され、内部が真空である気密容器を形成してい
る。2. Description of the Related Art A typical structure of a conventional piezoelectric vibrator such as a quartz vibrator is shown in FIGS. FIG. 7 is a perspective view of a known example of a structure having a cylindrical container, a part of which is cut away. The crystal vibrating piece 1 has excitation electrodes 11 on both surfaces thereof, and the crystal extraction electrode 12 extends through the glass portion of the hermetic terminal 91.
Soldered to book leads. A cap 92 is press-fitted in a vacuum into a hermetic terminal 91 having a soft metal coated on its outer periphery, forming an airtight container having a vacuum inside.
【０００３】図８は箱型の容器を有する他の周知の従来
例の構造を示し、一部を破断した斜視図である。気密容
器はセラミック製下ケース９３と、その上面であるメタ
ライズされた縁の部分にハンダでロウ付けされた蓋９５
（金属板あるいは下面周辺部に金属メッキが施されたガ
ラス板等）より成っている。水晶振動片１はその自由な
振動が妨げられないよう下ケース段差部９４上に一端を
載置し導電接着剤４１で接続かつ固定されている。導電
接着剤４１の下には図示しないスルーホール（気密保持
のためロウ材で充填されている）があって、圧電振動子
の端子となる側面電極９６に導通している。FIG. 8 is a perspective view, partially cut away, showing the structure of another known conventional example having a box-shaped container. The hermetic container is a ceramic lower case 93 and a lid 95 soldered to the upper surface of the metalized rim by soldering.
(Eg, a metal plate or a glass plate having a metal plating on the lower surface periphery). One end of the crystal vibrating reed 1 is placed on the lower case step 94 so that free vibration is not hindered, and the crystal vibrating reed 1 is connected and fixed by the conductive adhesive 41. A through hole (not shown) (filled with a brazing material for airtightness) is provided below the conductive adhesive 41 and is electrically connected to a side electrode 96 serving as a terminal of the piezoelectric vibrator.
【０００４】これらの従来例に共通して、容器内の真空
度を維持するため、容器または封止用の材料として金属
材料あるいは無機材料が用いられる。容器に用いられる
ガラスやセラミック等の無機材料は、脆性があるため割
れやすく加工性に乏しく、基本的に１個づつの製造とな
り、真に望ましい量産性に欠ける。また水晶発振器の一
部をなす他の電子部品をも振動子容器上に搭載して高度
にモジュール化をすることが望ましい場合もあるが、そ
のためには容器の構造あるいは配線が複雑になり、金属
や無機の材料では実現し難い。[0004] In common with these conventional examples, a metal material or an inorganic material is used as a container or a sealing material in order to maintain the degree of vacuum in the container. Inorganic materials such as glass and ceramic used for the container are brittle and are easily broken and have poor workability, and are basically manufactured one by one, and lack truly desirable mass productivity. In some cases, it is desirable to mount other electronic components that form a part of the crystal oscillator on the oscillator container to achieve a high degree of modularization.However, the structure or wiring of the container becomes complicated, and metal And it is difficult to realize with inorganic materials.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は、従来
の構成の圧電振動子における前記の欠点を解消し、容器
の材料として有機材料を用いて性能を維持しつつ低コス
トとし、かつ薄型・小型・軽量の特徴を保持あるいは改
善し、更にはＳＭＤ実装にも適していると共に、必要に
応じて他の電子素子をも搭載して高度の機能モジュール
化を進めることを容易にした圧電振動子の構成を提供
し、また例えば百個〜千個単位という多数個の容器を連
結したまま最終工程直前までの加工を可能にすることに
よって、一層の低コスト化を達成した圧電振動子の製造
方法を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks of the conventional piezoelectric vibrator, to reduce the cost while maintaining the performance by using an organic material as the material of the container, and to reduce the thickness. -Piezoelectric vibration that retains or improves the features of small size and light weight, and is suitable for SMD mounting, and facilitates the development of advanced functional modules by mounting other electronic elements as necessary. Manufacturing of a piezoelectric vibrator that achieves a further reduction in cost by providing a structure of a vibrator and enabling processing up to just before the final process while connecting a large number of containers, for example, in units of 100 to 1000 units. Is to provide a way.
【０００６】[0006]
（１）上面に段差部を有し、該段差部の高所にスルーホ
ールを有し、該スルーホールの周囲直近部を除く前記上
面が金属メッキ層で覆われ、下面あるいは側面には前記
スルーホールの下面側と接続する端子電極が設けられた
立体成形基板より成る下ケースと、前記段差部の高所に
固着され、励振電極が前記スルーホールの上面側に個々
にハンダあるいは導電接着剤にて接続された圧電振動片
と、前記下ケースの上面の金属層の周縁部とロウ付けさ
れて前記圧電振動片を気密に覆う金属層を少なくとも内
面に有する蓋とより成ることを特徴とする圧電振動子。 （２）前記下ケースの上面には前記金属層の周縁部を除
いて凹部が形成されて該凹部内に前記段差部および圧電
振動片が収容されており、前記蓋は銅箔を下面に貼った
平板のプリント配線用基板であることを特徴とする
（１）の圧電振動子。 （３）前記圧電振動片の下面に膜状の金属枠を設け該金
属枠内に励振電極の端部が導びかれており、該励振電極
の端部を前記基板のスルーホールと接続せしめたとき、
前記金属枠もまた前記スルーホールの周囲にある前記金
属層とロウ付けされることを特徴とする（１）あるいは
（２）の圧電振動子。 （４）前記下ケースの下面または上面には、他の電子素
子を実装するに適した場所と、そのための配線とを更に
備えたことを特徴とする（１）ないし（３）のいずれか
の圧電振動子。 （５）前記他の電子素子は、前記下ケースの下面に設け
た凹部に実装され、前記配線にボンディングされた集積
回路チップであることを特徴とする（４）の圧電振動
子。(1) A stepped portion is provided on the upper surface, a through hole is provided at a height of the stepped portion, and the upper surface except for a portion immediately around the through hole is covered with a metal plating layer, and the through hole is provided on a lower surface or a side surface. A lower case made of a three-dimensional molded substrate provided with a terminal electrode connected to the lower surface side of the hole, and fixed to a high position of the stepped portion, and the excitation electrodes are individually soldered or conductive adhesive on the upper surface side of the through hole; And a lid having at least an inner surface of a metal layer brazed to the peripheral portion of the metal layer on the upper surface of the lower case and airtightly covering the piezoelectric vibrating piece. Vibrator. (2) A concave portion is formed on the upper surface of the lower case except for the peripheral portion of the metal layer, and the step portion and the piezoelectric vibrating reed are accommodated in the concave portion, and the lid is formed by attaching copper foil to the lower surface. The piezoelectric vibrator according to (1), which is a flat printed wiring board. (3) A film-like metal frame is provided on the lower surface of the piezoelectric vibrating reed, and an end of the excitation electrode is guided in the metal frame, and the end of the excitation electrode is connected to a through hole of the substrate. When
The piezoelectric vibrator according to (1) or (2), wherein the metal frame is also brazed to the metal layer around the through hole. (4) The lower case or the upper surface of the lower case is further provided with a place suitable for mounting another electronic element and a wiring for the place, in any one of (1) to (3). Piezoelectric vibrator. (5) The piezoelectric vibrator according to (4), wherein the other electronic element is an integrated circuit chip mounted on a concave portion provided on a lower surface of the lower case and bonded to the wiring.
【０００７】（６）上面に段差部を有し、該段差部の高
所にスルーホールを有し、該スルーホールの周囲直近部
を除く前記上面が金属メッキ層で覆われ、下面あるいは
側面には前記スルーホールの下面側と接続する端子電極
が設けられた立体成形基板より成る下ケース要素を多数
密接させ連続配列させた形状の下ケース集合体を作成す
る工程と、必要に応じて前記下ケース集合体の各下ケー
ス要素に女帝野電子部品を実装する工程と、前記下ケー
ス集合体における個々の前記基板要素の上面の段差部に
圧電振動片を供給して固着すると共に該圧電振動片の励
振電極を前記スルーホールと接続する工程と、前記下ケ
ース要素の配列に対応した位置に形成された多数の蓋要
素を相互に連結して成る蓋集合体を作成する工程と、圧
電振動片および必要に応じて他の電子部品を搭載した前
記下ケース集合体と前記蓋集合体とを位置合わせして重
ね、個々の下ケース要素と蓋要素とを同時に接合して連
結した多数の圧電振動子を形成する工程と、該連結した
多数の圧電振動子を切断分離して個々の圧電振動子を得
る工程とを含むことを特徴とする圧電振動子の製造方
法。 （７）前記蓋要素は平坦な金属板あるいは金属箔を下面
に貼った樹脂板であり、従って前記蓋集合体には一枚の
切れ目のない金属板あるいは金属箔を下面全面に貼った
樹脂板を用いることを特徴とする（６）の圧電振動子の
製造方法。(6) A step portion is provided on the upper surface, a through hole is provided at a height of the step portion, and the upper surface except for a portion immediately around the through hole is covered with a metal plating layer. Forming a lower case assembly having a shape in which a large number of lower case elements made of a three-dimensional molded substrate provided with terminal electrodes connected to the lower surface side of the through hole are closely arranged and continuously arranged; and Mounting the electronic components on each lower case element of the case assembly; and supplying and fixing a piezoelectric vibrating piece to a step portion on an upper surface of each of the substrate elements in the lower case assembly, and fixing the piezoelectric vibrating piece. Connecting the excitation electrode to the through hole, forming a lid assembly by interconnecting a number of lid elements formed at positions corresponding to the arrangement of the lower case elements, and a piezoelectric vibrating reed. And must A plurality of piezoelectric vibrators in which the lower case assembly and the lid assembly with other electronic components mounted thereon are aligned and overlapped, and the individual lower case elements and lid elements are simultaneously joined and connected. A method of manufacturing a piezoelectric vibrator, comprising a step of forming and a step of cutting and separating a large number of the connected piezoelectric vibrators to obtain individual piezoelectric vibrators. (7) The lid element is a resin plate having a flat metal plate or a metal foil stuck on the lower surface thereof. Therefore, the lid assembly has a single continuous metal plate or a resin plate having a metal foil stuck on the entire lower surface thereof. (6) The method for manufacturing a piezoelectric vibrator according to (6).
【０００８】[0008]
【発明の実施の形態】図１は本発明の第１の実施の形態
である水晶振動子の構造を示す３面図であって、（ａ）
は蓋の一部を破断した平面図、（ｂ）はそのＡ−Ａ線断
面図、（ｃ）は下面図である。また図２は水晶振動片の
３面図で、（ａ）は平面図、（ｂ）は断面図、（ｃ）は
下面図である。両図を用いて構造を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a three-view drawing showing the structure of a quartz oscillator according to a first embodiment of the present invention.
Is a plan view in which a part of the lid is cut, (b) is a cross-sectional view taken along the line AA, and (c) is a bottom view. 2A and 2B are three views of the crystal resonator element, FIG. 2A is a plan view, FIG. 2B is a cross-sectional view, and FIG. 2C is a bottom view. The structure will be described with reference to both figures.
【０００９】図１において２は下ケースであって、立体
成形基板（ＭＩＤ＝Molded Interconnection Device ）
手法で作成される。これは例えばメッキ触媒を混入した
樹脂を立体的に成形し、成形体に全面メッキを施し、次
いでレジスト塗布とエッチングにより所望の導電パター
ンを表面に残す回路基板の作成手法であって、平面のみ
ならず斜面や側面、穴や凹部にも配線を立体的に行うこ
とができる耐熱性基板を提供する技術であり、本発明を
実現するに適している。本実施の形態の下ケース２にお
いては、図１（ａ）（ｂ）に示すように上面の周縁部の
内側に凹部２２を有し、該凹部の中には段差部２８があ
り、該段差部の頂上には下ケース底面に導通する２つの
スルーホール２４があり、上面は全面が銅メッキ部２３
で覆われている。但しスルーホール２４の上端部の近傍
のみは短絡を避けるため銅メッキ部を除いてあり、露出
部２７としている。少なくとも気密容器の内面になる上
面の銅箔部にはＡｕフラッシュメッキを施しておく。
（ｃ）に示すように下面に導出したスルーホール２４と
接続する下面引出電極２５の他、下ケースの両端の側面
および下面には端子電極２６およびそのリード線部があ
り、それらの配線に対して発振回路を含むＩＣチップ６
がフリップチップ（ＡＣＦ）ボンディングされている。
端子電極２６は集積回路の電源および信号の入出力等の
端子となっている。６３はＩＣ封止樹脂で、集積回路を
保護するために塗布する。In FIG. 1, reference numeral 2 denotes a lower case, which is a three-dimensional molded substrate (MID = Molded Interconnection Device).
Created by technique. This is a method of creating a circuit board, for example, by three-dimensionally molding a resin mixed with a plating catalyst, plating the molded body over the entire surface, and then applying a resist and etching to leave a desired conductive pattern on the surface. This is a technique for providing a heat-resistant substrate that can perform wiring three-dimensionally on slopes, side surfaces, holes, and recesses, and is suitable for realizing the present invention. In the lower case 2 of the present embodiment, as shown in FIGS. 1A and 1B, a concave portion 22 is provided inside a peripheral portion of the upper surface, and a step portion 28 is provided in the concave portion. There are two through holes 24 at the top of the part that are electrically connected to the bottom of the lower case, and the entire upper surface is a copper plated part 23.
Covered with. However, only in the vicinity of the upper end of the through hole 24, the copper plating portion is removed to avoid a short circuit, and the exposed portion 27 is formed. Au flash plating is applied to at least the copper foil portion on the upper surface serving as the inner surface of the airtight container.
As shown in (c), in addition to the lower surface extraction electrode 25 connected to the through hole 24 led out to the lower surface, a terminal electrode 26 and its lead wire portion are provided on the side surfaces and lower surface at both ends of the lower case. IC chip 6 including oscillator circuit
Are flip-chip (ACF) bonded.
The terminal electrodes 26 serve as terminals for the power supply of the integrated circuit and the input / output of signals. An IC sealing resin 63 is applied to protect the integrated circuit.
【００１０】図２において水晶振動片１は上面および下
面に励振電極１１を有し、それらからの水晶引出電極１
２は（ａ）に示すように上面において（下面の励振電極
からの引出線は水晶振動片の側面を回って）水晶スルー
ホール１３に接続し、（ｃ）に示すようにその導電経路
は水晶振動片１の下面に終わっている。下面には水晶ス
ルーホール１３を囲んで枠状金属パターン１４を設け
る。In FIG. 2, a quartz vibrating reed 1 has excitation electrodes 11 on the upper and lower surfaces, and a crystal extraction electrode 1 therefrom.
2 is connected to the crystal through-hole 13 on the upper surface as shown in (a) (a lead line from the excitation electrode on the lower surface goes around the side surface of the crystal vibrating piece), and its conductive path is crystal as shown in (c). It ends on the lower surface of the resonator element 1. A frame-shaped metal pattern 14 is provided on the lower surface so as to surround the crystal through hole 13.
【００１１】水晶振動片１は下ケース２上に、そのスル
ーホール２４に水晶スルーホール１３が重なるように載
置され、両者は高温ハンダ材４にて加熱と加圧を行って
接続される。同時に枠状金属パターン１４もスルーホー
ル２４の周囲の銅メッキ部２３と接続される。高温ハン
ダ材４はあらかじめ段差部２８の上面にペースト状の材
料を印刷手法などで供給しハンダメッキしておく。水晶
スルーホール１３の下端面と枠状金属パターン１４にも
必要に応じてハンダ等のメッキを施しておく。蓋３は平
板状のプリント回路基板であり、下面全面に貼着された
蓋銅箔部３１を有する。蓋銅箔部３１の表面にも必要に
応じて適当なメッキ、例えばＡｕフラッシュメッキを施
しておく。蓋３は封入ハンダ材５により下縁を下ケース
２の周縁部の銅メッキ部２３にロウ付けされる。ロウ付
けは加熱・加圧用の治具を用いて真空中で行われ、容器
内部が真空である水晶振動子が完成する。The crystal vibrating piece 1 is mounted on the lower case 2 so that the crystal through hole 13 overlaps the through hole 24, and the two are connected by heating and pressurizing with a high-temperature solder material 4. At the same time, the frame-shaped metal pattern 14 is also connected to the copper plating 23 around the through hole 24. For the high-temperature solder material 4, a paste-like material is supplied to the upper surface of the step portion 28 in advance by a printing method or the like, and is subjected to solder plating. The lower end face of the crystal through hole 13 and the frame-shaped metal pattern 14 are also plated with solder or the like as necessary. The cover 3 is a flat printed circuit board, and has a cover copper foil portion 31 attached to the entire lower surface. Appropriate plating, for example, Au flash plating is also applied to the surface of the lid copper foil portion 31 as necessary. The lower edge of the lid 3 is brazed to the copper plating portion 23 on the peripheral edge of the lower case 2 by the enclosed solder material 5. The brazing is performed in a vacuum using a jig for heating and pressurization, and a quartz oscillator having a vacuum inside the container is completed.
【００１２】本実施の形態における容器の気密性につい
て検討する。下ケースの基体を構成する樹脂即ち有機材
料自体は無機材料、金属材料に比して空気や水分を透過
させやすい。しかしそのほとんどは容器内面全面に施し
た銅メッキ部２３によって阻止される。僅かにスルーホ
ール２４の周囲の小面積のケース材露出部２７を透過し
て来た外気は、枠状金属パターン１４、銅メッキ部２
３、高温ハンダ材４のロウ付け部で完全に遮断される。
蓋３も容器内面側の蓋銅箔部３１により外気遮断は完全
である。また実装性について検討する。ハンダリフロー
温度を例えば２４０°Ｃとすると、後工程での加熱に耐
えるため、封入ハンダ材５のロウ付け温度は例えば３０
０〜３４０°Ｃ、高温ハンダ材４のロウ付け温度は例え
ば３６０〜４００°Ｃに設定する。このような条件を与
えておけば、水晶振動子をＳＭＤ用部品としてユーザー
が他の電子部品と同時に回路基板への実装を行うことが
できる。The airtightness of the container in the present embodiment will be examined. The resin constituting the base of the lower case, that is, the organic material itself is easier to transmit air and moisture than the inorganic material and the metal material. However, most of them are prevented by the copper plating portion 23 applied to the entire inner surface of the container. The outside air that has slightly permeated the small-area case material exposed portion 27 around the through hole 24 is exposed to the frame-shaped metal pattern 14, the copper plating portion 2, and the like.
3. Completely shut off at the brazing portion of the high-temperature solder material 4.
The lid 3 is also completely shielded from the outside air by the lid copper foil portion 31 on the inner surface side of the container. Also, consider the mountability. If the solder reflow temperature is, for example, 240 ° C., the soldering temperature of the encapsulated solder material 5 is, for example, 30 in order to withstand the heating in the subsequent process.
The soldering temperature of the high-temperature solder material 4 is set to, for example, 360 to 400 ° C. By providing such conditions, the user can mount the crystal unit as an SMD component on the circuit board simultaneously with other electronic components.
【００１３】次に本実施の形態の水晶振動子を集合状態
で製造するプロセスについて述べる。図３は下ケースの
集合基板の平面図である。下ケース集合体２０は下ケー
ス２の要素を縦横に多数配列して、必要な凹部２２、ス
ルーホール２４等や下ケース要素の列を区切る長穴２０
２を設けた大型の立体成形集合基板である。集合体相互
を位置合わせするための位置決め穴２０１が対角部に設
けてある。全面に銅メッキされた後上下面パターンのエ
ッチングの加工がなされ、Ａｕメッキやハンダメッキが
施されている。更に図示しないが、裏面にはＩＣチップ
も実装し、樹脂コートも済ませておく。水晶振動片１は
唯一の個部品で、半導体部品のダイボンディングを基板
に対して行うのに似た感覚でマウントされる。水晶振動
片１は予めトレイ等の上に整列して並べられており、１
個づつピックアップして下ケース集合体２０の上面の所
定位置に順次載置し、個別に、あるいは有機接着剤を供
給して仮止めした後全数同時に、加圧・加熱を行ってス
ルーホール部と枠状金属パターン部とのロウ付けを完了
する。図３には左上に１個のみ水晶振動片１が載置され
た状態を示している。Next, a description will be given of a process of manufacturing the crystal unit of the present embodiment in an assembled state. FIG. 3 is a plan view of the collective substrate of the lower case. The lower case assembly 20 has a large number of elements of the lower case 2 arranged in rows and columns to form necessary recesses 22, through holes 24, etc., and slots 20 for separating rows of lower case elements.
2 is a large three-dimensional molded assembly substrate. Positioning holes 201 for aligning the assemblies are provided at diagonal portions. After the entire surface is copper-plated, upper and lower patterns are etched, and Au plating and solder plating are applied. Although not shown, an IC chip is also mounted on the back surface, and resin coating is completed. The crystal resonator element 1 is the only individual component, and is mounted in a manner similar to performing die bonding of a semiconductor component to a substrate. The crystal vibrating reed 1 is preliminarily arranged on a tray or the like.
Each of them is picked up one by one and sequentially placed at a predetermined position on the upper surface of the lower case assembly 20, and individually or temporarily supplied by supplying an organic adhesive, and then all are simultaneously pressed and heated to form a through hole portion. Brazing with the frame-shaped metal pattern portion is completed. FIG. 3 shows a state in which only one quartz-crystal vibrating piece 1 is placed on the upper left.
【００１４】図４は枠状に打ち抜かれた封入ハンダ材５
のシートを多数連結したハンダシート集合体５０の平面
図である。位置決め穴２０１を備え、該穴を基準にして
下ケース集合体２０に重ねたとき、各ハンダシートは蓋
３のロウ付け部位に位置決めされる。封入ハンダ材５を
均一な厚さのシート状にしておくことによって、ろう材
に不均一な偏りがなく、欠陥のないロウ付けが達成され
る。FIG. 4 shows an enclosed solder material 5 punched in a frame shape.
FIG. 4 is a plan view of a solder sheet assembly 50 in which a number of sheets are connected. Each of the solder sheets is positioned at a brazing portion of the lid 3 when a positioning hole 201 is provided and the lower case assembly 20 is overlapped with the positioning hole 201 as a reference. By forming the encapsulating solder material 5 into a sheet having a uniform thickness, the brazing material is not unevenly biased, and a defect-free brazing is achieved.
【００１５】図５は蓋３の集合体である蓋集合体３０の
平面図である。これは下面に銅箔を貼った１枚の大型の
平面プリント基板でよい。メッキも必要ならば施してお
く。やはり位置決め穴２０１を備えている。FIG. 5 is a plan view of a lid assembly 30 which is an assembly of the lid 3. This may be a single large-sized flat printed circuit board having copper foil adhered to the lower surface. Apply plating if necessary. It also has a positioning hole 201.
【００１６】集合体を用いた振動子の組立は以下のよう
に行われる。水晶振動片１を実装済の下ケース集合体２
０の上にハンダシート集合体５０を位置決め穴２０１基
準で重ね、更に蓋集合体３０を同様に重ねて、全体を挟
持する治具を用いてすべての接合部を同時に均等に加圧
しかつ真空中で加熱すれば、蓋３のロウ付けが完了す
る。次いで図３に示すカットライン２０３において完成
した集合体を切断すれば、個々に分離した完成水晶振動
子が得られる。The assembling of the vibrator using the assembly is performed as follows. Lower case assembly 2 with crystal resonator element 1 mounted
0, the solder sheet assembly 50 is superimposed on the basis of the positioning hole 201, the lid assembly 30 is similarly superimposed, all the joints are simultaneously and evenly pressed using a jig for clamping the whole, and the , The brazing of the lid 3 is completed. Next, the completed assembly is cut along the cut line 203 shown in FIG. 3 to obtain individually separated completed crystal units.
【００１７】図６は本発明の第２の実施の形態の３面図
で、（ａ）は平面図、（ｂ）は中央断面図、（ｃ）は下
面図である。第１の実施の形態との相違点は、用いた水
晶振動片１が片持ちではなく両持ち型のものであること
である。その相違に従って、水晶スルーホール１３と、
下面側でそれらを個々に囲む枠状金属パターンは振動片
の両端に別れて存在する。それに対応して下ケースの段
差部２８も凹部２２の両側に設けられる。またＩＣチッ
プ６は下ケースの下面にダイボンディングされ、下面の
配線パターンとボンディングワイヤ６２で接続されてい
る。その他の点は第１の実施の形態と実質的に共通であ
る。FIGS. 6A and 6B are three views of a second embodiment of the present invention, wherein FIG. 6A is a plan view, FIG. 6B is a central sectional view, and FIG. 6C is a bottom view. The difference from the first embodiment is that the quartz vibrating reed 1 used is not a cantilever but a double-supported type. According to the difference, the crystal through hole 13 and
The frame-shaped metal patterns individually surrounding them on the lower surface side are separately provided at both ends of the resonator element. Correspondingly, step portions 28 of the lower case are also provided on both sides of the concave portion 22. The IC chip 6 is die-bonded to the lower surface of the lower case, and is connected to the wiring pattern on the lower surface by bonding wires 62. The other points are substantially common to the first embodiment.
【００１８】次に本発明の実施の形態における各種の変
形例を考察しておく。まず水晶振動子は、上述の実施例
では片持ち形のＡＴ板等の平板状振動片を用いたが、こ
れはコンベックスあるいはベベル付きの振動板でもよ
く、また音叉形の振動片を用いてもよい。また振動片は
水晶に限らず、他の圧電結晶や圧電性磁器で構成しても
よい。高温ハンダ材に代えて導電接着剤を用いてもよ
い。また圧電振動片に設けたスルーホールと下面に設け
た枠状金属パターンとを省略し、水晶引出電極を下面に
引き回して下ケースのスルーホールと直接ハンダまたは
導電接着剤で接続し、その周囲を絶縁性の接着剤で固着
することにより簡略化することもできる。また下ケース
や金属皮膜の材質やメッキも適宜変更が可能である。蓋
にも金属板（蓋集合体は単なる平板でもよいが、大部分
の形状が切り抜かれた１個づつの蓋要素を細いブリッジ
で連結した形状にしてもよい）や無機材料を用いること
が可能なことは自明である。またＩＣのみならず他の電
子素子や回路、例えば周波数調整用の回路を適宜実装搭
載することも可能である。またそれら付加装置をケース
の上面側に実装することも可能である。その他本発明の
主旨の範囲内で種々の変化を構成あるいは製造方法に与
えることができることはもちろんである。Next, various modifications of the embodiment of the present invention will be considered. First, as the quartz oscillator, in the above-described embodiment, a plate-shaped vibrating piece such as a cantilevered AT plate was used, but this may be a convex or a beveled vibrating piece, or a tuning fork-shaped vibrating piece. Good. The vibrating reed is not limited to quartz, but may be made of another piezoelectric crystal or piezoelectric porcelain. A conductive adhesive may be used instead of the high-temperature solder material. In addition, the through hole provided in the piezoelectric vibrating piece and the frame-shaped metal pattern provided on the lower surface are omitted, the crystal extraction electrode is routed to the lower surface, and connected directly to the through hole of the lower case with solder or conductive adhesive, and the surrounding area is It can also be simplified by fixing with an insulating adhesive. Also, the material and plating of the lower case and the metal film can be appropriately changed. The lid can be made of a metal plate (the lid assembly may be a simple flat plate, but most of the cut-out lid elements may be connected to each other with a thin bridge) or an inorganic material. What is self-evident. In addition to the IC, other electronic elements and circuits, for example, a circuit for adjusting the frequency can be appropriately mounted. Further, these additional devices can be mounted on the upper surface side of the case. Of course, various changes can be made to the configuration or the manufacturing method within the scope of the present invention.
【００１９】[0019]
【発明の効果】本発明においては、内面を金属層で覆っ
た樹脂性の容器を用いたので、気密性を始めとする諸特
性を良好に保ったまま、低コストで薄型・小型・軽量構
造の圧電振動子を実現し、また回路の同時実装による高
度のモジュール化も可能となっった。更に製造方法にお
いて大部分の主要な加工を多数の集合状態のままで可能
として一層の低コスト化を達成できた効果がある。According to the present invention, since a resin container whose inner surface is covered with a metal layer is used, a low-cost, thin, small, and lightweight structure is maintained while maintaining various properties including airtightness. And a high degree of modularization by mounting circuits simultaneously. Furthermore, in the manufacturing method, most of the main processing can be performed in a large number of assembled states, so that the cost can be further reduced.
【図１】本発明の第１の実施の形態である水晶振動子の
構造を示す３面図で、（ａ）は蓋の一部を破断した平面
図、（ｂ）はＡ−Ａ線断面図（ｃ）は下面図である。FIGS. 1A and 1B are three side views showing the structure of a crystal unit according to a first embodiment of the present invention, in which FIG. 1A is a plan view in which a part of a lid is cut off, and FIG. Figure (c) is a bottom view.
【図２】水晶振動片の３面図であって、（ａ）は平面
図、（ｂ）は断面図、（ｃ）は下面図である。FIGS. 2A and 2B are three views of the crystal vibrating piece, wherein FIG. 2A is a plan view, FIG. 2B is a cross-sectional view, and FIG.
【図３】下ケースの集合基板の平面図である。FIG. 3 is a plan view of a collective substrate of a lower case.
【図４】ハンダシート集合体５０の平面図である。FIG. 4 is a plan view of the solder sheet assembly 50.
【図５】蓋集合体３０の平面図である。5 is a plan view of the lid assembly 30. FIG.
【図６】本発明の第２の実施の形態の３面図であって、
（ａ）は平面図、（ｂ）は中央断面図、（ｃ）は下面図
である。FIG. 6 is a three-sided view of the second embodiment of the present invention,
(A) is a plan view, (b) is a central sectional view, and (c) is a bottom view.
【図７】円筒形の容器を有する従来例の斜視図である。FIG. 7 is a perspective view of a conventional example having a cylindrical container.
【図８】箱型の容器を有する他の従来例の斜視図であ
る。FIG. 8 is a perspective view of another conventional example having a box-shaped container.
【符号の説明】 １ 水晶振動片 １１ 励振電極 １２ 水晶引出電極 １３ 水晶スルーホール １４ 枠状金属パターン ２ 下ケース ２０ 下ケース集合体 ２０１ 位置決め穴 ２０２ 長穴 ２０３ カットライン ２２ 凹部 ２３ 銅メッキ部 ２４ スルーホール ２５ 下面引出電極 ２６ 端子電極 ２７ ケース材露出部 ３ 蓋 ３０ 蓋集合体 ４ 高温ハンダ材 ５ 封入ハンダ材 ５０ ハンダシート集合体 ６ ＩＣチップ ６２ ボンディングワイヤ ６３ ＩＣ封止樹脂 ９１ 気密端子 ９２ キャップ ９３ セラミック製下ケース ９４ 下ケース段差部 ９５ 蓋 ９６ 側面電極[Description of Signs] 1 Crystal vibrating piece 11 Excitation electrode 12 Crystal extraction electrode 13 Crystal through hole 14 Frame-shaped metal pattern 2 Lower case 20 Lower case assembly 201 Positioning hole 202 Long hole 203 Cut line 22 Recess 23 Copper plating 24 Through Hole 25 Lower surface extraction electrode 26 Terminal electrode 27 Case material exposed portion 3 Lid 30 Lid assembly 4 High temperature solder material 5 Enclosed solder material 50 Solder sheet aggregate 6 IC chip 62 Bonding wire 63 IC sealing resin 91 Airtight terminal 92 Cap 93 Ceramic Lower case 94 Lower case step 95 Lid 96 Side electrode
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０３Ｈ 9/02 Ｈ０３Ｈ 9/02 Ｋ Ｌ Continued on the front page (51) Int.Cl. 6 Identification code FI H03H 9/02 H03H 9/02 KL
Claims (7)
スルーホールを有し、該スルーホールの周囲直近部を除
く前記上面が金属メッキ層で覆われ、下面あるいは側面
には前記スルーホールの下面側と接続する端子電極が設
けられた立体成形基板より成る下ケースと、前記段差部
の高所に固着され、励振電極が前記スルーホールの上面
側に個々にハンダあるいは導電接着剤にて接続された圧
電振動片と、前記下ケースの上面の金属層の周縁部とロ
ウ付けされて前記圧電振動片を気密に覆う金属層を少な
くとも内面に有する蓋とより成ることを特徴とする圧電
振動子。1. A stepped portion on an upper surface, a through hole at a high position of the stepped portion, the upper surface except a portion immediately adjacent to the through hole is covered with a metal plating layer, and a lower surface or a side surface is A lower case made of a three-dimensional molded substrate provided with a terminal electrode connected to the lower surface side of the through hole, and an excitation electrode fixed to a high position of the step portion, and an excitation electrode individually soldered or conductively bonded to the upper surface side of the through hole; A piezoelectric vibrating reed connected by an agent, and a lid having at least an inner surface of a metal layer brazed to the peripheral edge of the metal layer on the upper surface of the lower case to hermetically cover the piezoelectric vibrating reed. Piezoelectric vibrator.
縁部を除いて凹部が形成されて該凹部内に前記段差部お
よび圧電振動片が収容されており、前記蓋は銅箔を下面
に貼った平板のプリント配線用基板であることを特徴と
する請求項１の圧電振動子。2. A concave portion is formed on an upper surface of the lower case except for a peripheral portion of the metal layer, and the step portion and the piezoelectric vibrating reed are accommodated in the concave portion. 2. The piezoelectric vibrator according to claim 1, wherein the piezoelectric vibrator is a flat printed wiring board attached to the substrate.
設け該金属枠内に励振電極の端部が導びかれており、該
励振電極の端部を前記基板のスルーホールと接続せしめ
たとき、前記金属枠もまた前記スルーホールの周囲にあ
る前記金属層とロウ付けされることを特徴とする請求項
１あるいは２の圧電振動子。3. A film-shaped metal frame is provided on a lower surface of the piezoelectric vibrating reed, and an end of an excitation electrode is guided in the metal frame, and the end of the excitation electrode is connected to a through hole of the substrate. The piezoelectric vibrator according to claim 1, wherein the metal frame is also brazed to the metal layer around the through hole when the metal frame is pressed.
の電子素子を実装するに適した場所と、そのための配線
とを更に備えたことを特徴とする請求項１ないし３のい
ずれかの圧電振動子。4. The lower case or the upper surface of the lower case further includes a place suitable for mounting another electronic element, and a wiring therefor. Piezoelectric vibrator.
面に設けた凹部に実装され、前記配線にボンディングさ
れた集積回路チップであることを特徴とする請求項４の
圧電振動子。5. The piezoelectric vibrator according to claim 4, wherein said another electronic element is an integrated circuit chip mounted on a concave portion provided on a lower surface of said lower case and bonded to said wiring.
スルーホールを有し、該スルーホールの周囲直近部を除
く前記上面が金属メッキ層で覆われ、下面あるいは側面
には前記スルーホールの下面側と接続する端子電極が設
けられた立体成形基板より成る下ケース要素を多数密接
させ連続配列させた形状の下ケース集合体を作成する工
程と、必要に応じて前記下ケース集合体の各下ケース要
素に所定の電子部品を実装する工程と、前記下ケース集
合体における個々の前記ケース要素の上面の段差部に圧
電振動片を供給して固着すると共に該圧電振動片の励振
電極を前記スルーホールと接続する工程と、前記下ケー
ス要素の配列に対応した位置に形成された多数の蓋要素
を相互に連結して成る蓋集合体を作成する工程と、圧電
振動片および必要に応じて他の電子部品を搭載した前記
下ケース集合体と前記蓋集合体とを位置合わせして重
ね、個々の下ケース要素と蓋要素とを同時に接合して連
結した多数の圧電振動子を形成する工程と、該連結した
多数の圧電振動子を切断分離して個々の圧電振動子を得
る工程とを含むことを特徴とする圧電振動子の製造方
法。6. A stepped portion on an upper surface, a through hole at a high position of the stepped portion, the upper surface excluding a portion immediately around the through hole is covered with a metal plating layer, and a lower surface or a side surface is A step of creating a lower case assembly having a shape in which a large number of lower case elements made of a three-dimensional molded substrate provided with terminal electrodes connected to the lower surface side of the through hole are closely arranged and continuously arranged, and if necessary, the lower case Mounting a predetermined electronic component on each lower case element of the assembly; and supplying and fixing a piezoelectric vibrating piece to a step portion on the upper surface of each of the case elements in the lower case assembly, and fixing the piezoelectric vibrating piece. A step of connecting an excitation electrode to the through hole, a step of forming a lid assembly formed by interconnecting a number of lid elements formed at positions corresponding to the arrangement of the lower case elements, and a piezoelectric vibrating reed and Necessary Accordingly, the lower case assembly on which other electronic components are mounted and the lid assembly are aligned and overlapped to form a large number of piezoelectric vibrators in which individual lower case elements and lid elements are simultaneously joined and connected. And a step of cutting and separating the plurality of connected piezoelectric vibrators to obtain individual piezoelectric vibrators.
箔を下面に貼った樹脂板であり、従って前記蓋集合体に
は一枚の切れ目のない金属板あるいは金属箔を下面全面
に貼った樹脂板を用いることを特徴とする請求項６の圧
電振動子の製造方法。7. The lid element is a resin plate having a flat metal plate or a metal foil stuck on a lower surface thereof. Therefore, a single continuous metal plate or a metal foil is stuck on the entire lower surface of the lid assembly. The method for manufacturing a piezoelectric vibrator according to claim 6, wherein a resin plate is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27795397A JP3926001B2 (en) | 1997-09-26 | 1997-09-26 | Piezoelectric vibrator and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27795397A JP3926001B2 (en) | 1997-09-26 | 1997-09-26 | Piezoelectric vibrator and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11103233A true JPH11103233A (en) | 1999-04-13 |
| JP3926001B2 JP3926001B2 (en) | 2007-06-06 |
Family
ID=17590581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27795397A Expired - Lifetime JP3926001B2 (en) | 1997-09-26 | 1997-09-26 | Piezoelectric vibrator and manufacturing method thereof |
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| Country | Link |
|---|---|
| JP (1) | JP3926001B2 (en) |
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|---|---|---|---|---|
| JP2002359522A (en) * | 2001-05-31 | 2002-12-13 | Kinseki Ltd | Piezoelectric oscillation and method for manufacturing the same |
| JP2009065205A (en) * | 2003-10-30 | 2009-03-26 | Kyocera Corp | Method of manufacturing electronic apparatus |
| JP2009105422A (en) * | 2003-10-30 | 2009-05-14 | Kyocera Corp | Method for manufacturing electronic device |
| US20110074250A1 (en) * | 2005-03-01 | 2011-03-31 | Seiko Epson Corporation | Manufacturing method for electronic component, electronic component, and electronic equipment |
| JP2011188308A (en) * | 2010-03-09 | 2011-09-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric resonator, and method of manufacturing the same |
| JP2012142683A (en) * | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | Piezoelectric device |
| JP2013232736A (en) * | 2012-04-27 | 2013-11-14 | Kyocera Crystal Device Corp | Crystal device |
| US8749123B2 (en) | 2010-03-29 | 2014-06-10 | Kyocera Kinseki Corporation | Piezoelectric device |
| JP2017212509A (en) * | 2016-05-24 | 2017-11-30 | 日本電波工業株式会社 | Piezoelectric device |
| JP2020184654A (en) * | 2019-04-26 | 2020-11-12 | セイコーエプソン株式会社 | Vibration device, electronic apparatus and moving body |
| JP2020191574A (en) * | 2019-05-23 | 2020-11-26 | セイコーエプソン株式会社 | Vibration device, electronic apparatus, and movable body |
| CN112687631A (en) * | 2020-12-25 | 2021-04-20 | 杭州耀芯科技有限公司 | SIP packaging device and preparation method |
-
1997
- 1997-09-26 JP JP27795397A patent/JP3926001B2/en not_active Expired - Lifetime
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| JP2002359522A (en) * | 2001-05-31 | 2002-12-13 | Kinseki Ltd | Piezoelectric oscillation and method for manufacturing the same |
| JP2009065205A (en) * | 2003-10-30 | 2009-03-26 | Kyocera Corp | Method of manufacturing electronic apparatus |
| JP2009105422A (en) * | 2003-10-30 | 2009-05-14 | Kyocera Corp | Method for manufacturing electronic device |
| US20110074250A1 (en) * | 2005-03-01 | 2011-03-31 | Seiko Epson Corporation | Manufacturing method for electronic component, electronic component, and electronic equipment |
| US8664730B2 (en) * | 2005-03-01 | 2014-03-04 | Seiko Epson Corporation | Manufacturing method for electronic component, electronic component, and electronic equipment |
| US8604675B2 (en) | 2010-03-09 | 2013-12-10 | Nihon Dempa Kogyo Co., Ltd. | Piezoelectric resonator and method of manufacturing piezoelectric resonator |
| JP2011188308A (en) * | 2010-03-09 | 2011-09-22 | Nippon Dempa Kogyo Co Ltd | Piezoelectric resonator, and method of manufacturing the same |
| US8749123B2 (en) | 2010-03-29 | 2014-06-10 | Kyocera Kinseki Corporation | Piezoelectric device |
| JP2012142683A (en) * | 2010-12-28 | 2012-07-26 | Kyocera Crystal Device Corp | Piezoelectric device |
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| JP2017212509A (en) * | 2016-05-24 | 2017-11-30 | 日本電波工業株式会社 | Piezoelectric device |
| JP2020184654A (en) * | 2019-04-26 | 2020-11-12 | セイコーエプソン株式会社 | Vibration device, electronic apparatus and moving body |
| JP2020191574A (en) * | 2019-05-23 | 2020-11-26 | セイコーエプソン株式会社 | Vibration device, electronic apparatus, and movable body |
| CN112687631A (en) * | 2020-12-25 | 2021-04-20 | 杭州耀芯科技有限公司 | SIP packaging device and preparation method |
| CN112687631B (en) * | 2020-12-25 | 2024-04-26 | 杭州耀芯科技有限公司 | SIP packaging device and preparation method |
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