JPH11103092A - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
JPH11103092A
JPH11103092A JP26125897A JP26125897A JPH11103092A JP H11103092 A JPH11103092 A JP H11103092A JP 26125897 A JP26125897 A JP 26125897A JP 26125897 A JP26125897 A JP 26125897A JP H11103092 A JPH11103092 A JP H11103092A
Authority
JP
Japan
Prior art keywords
light
diffuser
resin package
emitting device
light diffuser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26125897A
Other languages
Japanese (ja)
Inventor
Mitsuteru Kakino
光照 垣野
Matsuyoshi Kikuchi
松義 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIKUCHI SHOKAI KK
Original Assignee
KIKUCHI SHOKAI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIKUCHI SHOKAI KK filed Critical KIKUCHI SHOKAI KK
Priority to JP26125897A priority Critical patent/JPH11103092A/en
Publication of JPH11103092A publication Critical patent/JPH11103092A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Led Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To lengthen a durable time, and to emit light at the wide angle of visibility, by forming an LED element in which a light-emitting diode is sealed into a resin package, in which a front end section has focussing properties, so as to be buried into a light diffuser, in which the whole of the resin package or a part of the front end side diffuses incident light. SOLUTION: A light-emitting device is formed in such a manner that two LED elements 3, in which light-emitting diodes 2 of red are sealed into columnar transparent resin packages 1, in which one ends are spherically worked and are made of an epoxy resin, and marketed generally, are buried into a cloudy semitransparent light diffuser 6 formed by filling the insides of red transparent vessels 4 molded in the hemispherical thin-film of polyvinyl chloride, etc., with a sealing material 5 made of a silicone rubber before the sealing material 5 is cured in each resin package 1. Both electrode leads 7, 8 of the anodes 7 and cathodes 8 of a pair of the LED elements 3 are connected in parallel electrically, and led out to the outside of the light diffuser 6.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発光ダイオードを
先端部が集光性を有する透明或いは半透明の樹脂パッケ
ージ内に封止してなるLED素子を応用した発光装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device using an LED element in which a light emitting diode is sealed in a transparent or translucent resin package having a light-collecting end.

【0002】[0002]

【従来の技術】従来より、発光ダイオードを先端部が集
光性を有する透明或いは半透明の樹脂パッケージ内に封
止してなるLED素子としては、前記樹脂パッケージが
一方端が球面加工された円柱形状のエポキシ樹脂製で、
他方端側から電極リードを取り出したものがある。ま
た、前記球面加工によって発光ダイオードからの発光が
前記樹脂パッケージの軸芯(以下、光軸という)方向に
集光され一定の視野角を有している。特に、前記樹脂パ
ッケージが透明の場合は、その視野角が狭く高輝度であ
るが、前記樹脂パッケージが半透明の場合は、発光ダイ
オードからの発光の一部または全部が前記樹脂パッケー
ジの内部で拡散し、前記視野角は広がるものの低輝度と
なる。また、かかるLED素子は、単体或いは集合体
で、表示用、照明用、または、光通信用の光源等に幅広
く利用されている。一方、表示用または照明用の光源と
しては、電球や蛍光灯がより一般的に使用されている
が、前記LED素子はこれらに比べ、耐用時間数が長
く、低消費電力であるという特長から、頻繁なメンテナ
ンスが困難な用途や、電源として電池を使用する用途等
に適している。因みに、電球や蛍光灯の耐用時間数が普
及品で2000時間〜4000時間程度であるのに対し
て、前記LED素子の耐用時間数は40000時間以上
と10倍以上長寿命である。
2. Description of the Related Art Conventionally, as an LED element in which a light emitting diode is sealed in a transparent or translucent resin package having a light-collecting end, a column in which one end of the resin package is spherically processed is used. Made of shaped epoxy resin,
There is an electrode lead taken out from the other end. Further, the light emitted from the light emitting diode is condensed in the direction of the axis of the resin package (hereinafter referred to as an optical axis) by the spherical processing, and has a certain viewing angle. In particular, when the resin package is transparent, the viewing angle is narrow and the brightness is high, but when the resin package is translucent, part or all of the light emitted from the light emitting diode diffuses inside the resin package. Although the viewing angle is wide, the brightness is low. In addition, such an LED element, alone or in an aggregate, is widely used as a light source for display, illumination, optical communication, or the like. On the other hand, as a light source for display or illumination, a light bulb or a fluorescent lamp is more commonly used, but the LED element has a longer service life and a lower power consumption compared to these. It is suitable for applications where frequent maintenance is difficult, or where batteries are used as a power source. By the way, the service life of the light bulb or the fluorescent lamp is about 2000 hours to 4000 hours in a popular product, whereas the service life of the LED element is 40000 hours or more, which is 10 times or more long life.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記L
ED素子は、一般に前記樹脂パッケージのままで使用さ
れ、単体使用の場合は、前記樹脂パッケージが透明、半
透明の如何にかかわらず小型であるため実質的に点光源
として振る舞うため、表示用または照明用の光源として
1次元的または2次元的に広がりを持たせる必要がある
場合は、特に、信号灯のように遠方からの視認性が要求
されるものに対しては、前記LED素子を多数集合させ
て使用しなければならなかった。従って、多数個を同時
に使用することで、消費電力が増加するという問題が生
じるとともに、多数の前記LED素子を一装置として配
置、結線しなければならず、製造手順が複雑化し、部品
コスト及び製造コストが増え、製品コストを高騰させる
結果となる。
However, the aforementioned L
The ED element is generally used as it is in the resin package. When used alone, the resin package is small regardless of whether the resin package is transparent or translucent, and thus behaves substantially as a point light source for display or illumination. When it is necessary to provide a one-dimensional or two-dimensional spread as a light source for the light source, a large number of the LED elements are assembled, especially for a signal light which requires visibility from a distance, such as a signal lamp. Had to use. Therefore, the use of a large number of devices at the same time causes a problem that power consumption increases, and a large number of the LED elements must be arranged and connected as one device, which complicates the manufacturing procedure, and reduces the component cost and the manufacturing cost. Costs increase, resulting in higher product costs.

【0004】また、前記LED素子を多数集合させて使
用しても、光軸方向前方から観察した場合の光源として
広がりを持たせることができても、前記LED素子単体
での視野角が狭いため、同時に全体としての視野角を広
げることが困難であり、光源として広がりを持っても前
記LED素子の光軸に対する斜め方向からの視認性は改
善されないという問題がある。特に、前記樹脂パッケー
ジが透明の場合に顕著である。更に、前記斜め方向から
の視認性を改善するためには、前記LED素子を光軸を
揃えて平面的に配列するのではなく、各光軸を変化させ
ながら立体的に配置する等の工夫が必要となり、更に製
造方法が複雑困難化する要因となる。
Even if a large number of the LED elements are assembled and used, or if the LED element can be widened as a light source when viewed from the front in the optical axis direction, the viewing angle of the LED element alone is narrow. At the same time, it is difficult to widen the viewing angle as a whole, and there is a problem that the visibility of the LED element from an oblique direction with respect to the optical axis of the LED element is not improved even if the light source has a widening. This is particularly noticeable when the resin package is transparent. Furthermore, in order to improve the visibility from the oblique direction, instead of arranging the LED elements in a plane with the optical axes aligned, a method of three-dimensionally disposing each LED while changing each optical axis has been devised. It becomes necessary and further complicates the manufacturing method.

【0005】また、前記LED素子は、単体使用、多数
使用にかかわらず、点光源として振る舞うため、観察者
の網膜に残像が強く生じ、長時間直視すると目が疲れる
という問題がある。
In addition, since the LED element behaves as a point light source regardless of whether it is used alone or in large numbers, there is a problem that afterimages are strongly generated on the retina of an observer, and eyes are tired when viewed directly for a long time.

【0006】本発明は、上記実情に鑑みてなされたもの
で、その目的は、上述の問題点を解消し、少ない個数の
LED素子を使用して、長耐用時間数と低消費電力を実
現するとともに、光源として広がりを持ち、且つ、広視
野角で発光する視認性に富んだ発光装置を提供する点に
ある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to solve the above-mentioned problems and realize a long service life and low power consumption by using a small number of LED elements. Another object of the present invention is to provide a light-emitting device that has a wide range of light sources and emits light at a wide viewing angle and has high visibility.

【0007】[0007]

【課題を解決するための手段】この目的を達成するため
の本発明による発光装置の第一の特徴構成は、特許請求
の範囲の欄の請求項1に記載した通り、発光ダイオード
を先端部が集光性を有する透明或いは半透明の樹脂パッ
ケージ内に封止してなるLED素子を、その樹脂パッケ
ージの全部または前記先端部側の一部が入射した光を拡
散する光拡散体内に埋入するように設けてなる点にあ
る。
According to a first aspect of the present invention, there is provided a light-emitting device according to the present invention. An LED element sealed in a transparent or translucent resin package having a light-collecting property is embedded in a light diffuser that diffuses light incident on the entirety of the resin package or a part of the tip side. The point is that it is provided as follows.

【0008】同第二の特徴構成は、特許請求の範囲の欄
の請求項2に記載した通り、前記第一の特徴構成に加え
て、前記光拡散体が、少なくとも光を出射する表面内側
に沿って半透明層を有し、屈折率が1より大きい点にあ
る。
[0008] In the second feature, as described in claim 2 of the claims, in addition to the first feature, the light diffuser has at least an inner surface on which light is emitted. Along with a translucent layer along with a refractive index greater than 1.

【0009】同第三の特徴構成は、特許請求の範囲の欄
の請求項3に記載した通り、前記第二の特徴構成に加え
て、前記光拡散体全体が半透明である点にある。
A third feature of the present invention is that, as described in claim 3 of the claims, in addition to the second feature, the entire light diffuser is translucent.

【0010】同第四の特徴構成は、特許請求の範囲の欄
の請求項4に記載した通り、前記第三の特徴構成に加え
て、前記光拡散体がシリコーン樹脂製である点にある。
尚、本明細書において、シリコーン樹脂はシリコーンゴ
ムを含む。
[0010] The fourth characteristic configuration is that, as described in claim 4 of the claims, in addition to the third characteristic configuration, the light diffuser is made of a silicone resin.
In the present specification, the silicone resin includes silicone rubber.

【0011】同第五の特徴構成は、特許請求の範囲の欄
の請求項5に記載した通り、前記第一、第二、第三また
は第四の特徴構成に加えて、前記光拡散体の表面の一部
に前記光拡散体の内側に面した光反射面を形成してある
点にある。
[0011] The fifth feature of the present invention is, in addition to the first, second, third or fourth feature of the present invention, as described in claim 5 of the claims. The point is that a light reflection surface facing the inside of the light diffuser is formed on a part of the surface.

【0012】同第六の特徴構成は、特許請求の範囲の欄
の請求項6に記載した通り、前記第一、第二、第三、第
四または第五の特徴構成に加えて、前記LED素子が少
なくとも3個設けられており、それらの発光色が少なく
ともRGB3原色を含む点にある。
The sixth feature of the present invention is the above-mentioned LED in addition to the first, second, third, fourth or fifth feature as described in claim 6 of the claims. At least three elements are provided, and their emission colors include at least three primary colors of RGB.

【0013】更に、本明細書において、透明或いは半透
明という場合、無色または着色の違いは問わない。ま
た、ある媒質が半透明であるという場合、透明と不透明
の中間の程度をいい、光は透過するものの、その光の一
部または全部がその媒質の表面または内部で拡散し、あ
る対象物をその媒質を介して観察した場合にその対象物
の輪郭を完全に確認できない程度から、鮮明ではないが
その輪郭を確認できる程度までを含む。
Further, in the present specification, the term “transparent” or “translucent” does not matter whether it is colorless or colored. Also, when a certain medium is translucent, it means an intermediate level between transparent and opaque.While light is transmitted, part or all of the light diffuses on the surface or inside the medium, and a certain object is diffused. The range from the degree in which the outline of the object cannot be completely confirmed when observed through the medium to the degree in which the outline is not clear but can be confirmed.

【0014】以下に作用並びに効果を説明する。第一の
特徴構成によれば、発光ダイオードを通電し発光させる
と、前記樹脂パッケージを透過した発光は、ビーム強度
が所定の視野角内に集中した状態で、前記光拡散体の内
部に直接入射し、その後、前記光拡散体で拡散して出射
するので、その前記光拡散体表面からの出射面積は、前
記樹脂パッケージの先端部より明らかに広がり、光源と
して広がりを持たせることができ、且つ、出射する光
は、前記光拡散体内で拡散しているため、視野角も大幅
に広がるのである。この結果として、少ない個数のLE
D素子を使用して、長耐用時間数と低消費電力を実現す
るとともに、光源として広がりを持ち、且つ、広視野角
で発光する視認性に富んだ発光装置を得ることができる
のである。また、観察者の目の疲れが生じ難い発光装置
を提供することができるのである。
The operation and effect will be described below. According to the first characteristic configuration, when the light emitting diode is energized and emits light, the light emitted through the resin package is directly incident on the inside of the light diffuser with the beam intensity concentrated within a predetermined viewing angle. Then, since the light is diffused and emitted by the light diffuser, the emission area from the surface of the light diffuser is clearly wider than the tip of the resin package, and can be expanded as a light source, and Since the emitted light is diffused in the light diffuser, the viewing angle is greatly widened. As a result, a small number of LEs
By using the D element, a long-life time and low power consumption can be realized, and a light-emitting device which has a wide range as a light source and which emits light with a wide viewing angle can be obtained. In addition, it is possible to provide a light-emitting device that does not easily cause fatigue of the eyes of the observer.

【0015】第二の特徴構成によれば、前記光拡散体と
前記樹脂パッケージ先端部との屈折率差が、前記樹脂パ
ッケージ先端部と空気との屈折率差よりも小さくなるた
め、前記LED素子を直接空気中で使用する場合に比
べ、前記樹脂パッケージ先端部の持つ集光性が低下し、
先ず、前記光拡散体内における視野角が広がり、その広
がった視野角の光が前記半透明層で拡散して出射するの
で、前記第一の特徴構成と同様の作用効果を呈するので
ある。尚、前記光拡散体の屈折率が前記樹脂パッケージ
先端部より大きい場合は、集光性がなくなり、逆にビー
ム径が広がる方向に屈折し、視野角拡大により寄与す
る。
According to the second feature, the difference in the refractive index between the light diffuser and the tip of the resin package is smaller than the difference in the refractive index between the tip of the resin package and air. Compared to the case of using directly in the air, the light condensing property of the resin package tip portion is reduced,
First, the viewing angle in the light diffuser is widened, and the light with the widened viewing angle is diffused and emitted by the translucent layer, so that the same effect as the first characteristic configuration is exhibited. When the refractive index of the light diffuser is larger than the tip of the resin package, the light condensing property is lost, and the light is refracted in the direction in which the beam diameter increases, contributing to the expansion of the viewing angle.

【0016】第三の特徴構成によれば、単一の材質で前
記光拡散体を形成でき、前記光拡散体の形成工程を簡略
化できるとともに、前記光拡散体全体で光を拡散するた
め、前記光拡散体の厚みを薄くでき、発光装置全体の薄
型化が図れるのである。
According to the third characteristic configuration, the light diffuser can be formed of a single material, the process of forming the light diffuser can be simplified, and light is diffused throughout the light diffuser. The thickness of the light diffuser can be reduced, and the entire light emitting device can be reduced in thickness.

【0017】第四の特徴構成によれば、半透明で且つ任
意形状に加工容易な光拡散体を得ることができるのであ
る。
According to the fourth characteristic configuration, it is possible to obtain a light diffuser which is translucent and can be easily processed into an arbitrary shape.

【0018】第五の特徴構成によれば、前記光拡散体表
面の光を発光する面を任意に制限でき、且つ、発光させ
たくない表面からの不必要な光の放出を防ぐことができ
るため、輝度の低下が防げるのである。更に、前記LE
D素子が複数ある場合は、前記光反射面での内面反射
と、前記光拡散体による拡散との相乗効果によって、各
光源の発光が混ざり合って、前記光拡散体表面での発光
強度の分布をより均等化できるのである。特に、前記L
ED素子の各発光色が異なる場合は、前記光拡散体表面
での発光色も、より均等化できるのである。
According to the fifth characteristic configuration, the surface of the light diffuser that emits light can be arbitrarily limited, and unnecessary light emission from a surface that is not desired to emit light can be prevented. In addition, a decrease in luminance can be prevented. Further, the LE
When there are a plurality of D elements, the light emission of each light source is mixed due to a synergistic effect of the internal reflection on the light reflecting surface and the diffusion by the light diffuser, and the distribution of the light emission intensity on the surface of the light diffuser Can be more equalized. In particular, the L
When the emission colors of the ED elements are different, the emission colors on the surface of the light diffuser can be further equalized.

【0019】第六の特徴構成によれば、RGB3原色に
夫々対応する前記LED素子の電流値を各別に調整する
ことで、任意の発光色が得られ、しかも、前記RGB3
原色が前記光拡散体内部での拡散によって混合するた
め、前記光拡散体表面で発光スペクトルが前記RGB3
原色に分離せず、光源として広がりを持ったにもかかわ
らず近距離での観察が可能となるのである。
According to the sixth characteristic configuration, by adjusting the current values of the LED elements respectively corresponding to the three primary colors of RGB, an arbitrary luminescent color can be obtained.
Since the primary colors are mixed by diffusion inside the light diffuser, the emission spectrum of the RGB3
It is not separated into primary colors, and it is possible to observe at a short distance even though it has a spread as a light source.

【0020】[0020]

【発明の実施の形態】以下に本発明の実施の形態を図面
に基づいて説明する。図1に示すように,本発明の発光
装置は、一方端が球面加工された円柱形状の透明のエポ
キシ樹脂製の樹脂パッケージ1に赤色の発光ダイオード
2を封止してなる一般に市販されているLED素子3を
2個、ポリ塩化ビニル等の半球面状薄膜に成形された赤
色の透明容器4内にシリコーンゴム製のシーリング材5
を充填して形成される白濁半透明の光拡散体6内に、夫
々の前記樹脂パッケージ1を前記シーリング材5が硬化
する前に埋入させて形成される。尚、前記一対のLED
素子3のアノード7及びカソード8の両電極リード7、
8は電気的に並列接続され、前記光拡散体6外に引き出
されている。
Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, a light-emitting device of the present invention is generally commercially available in which a red light-emitting diode 2 is sealed in a columnar transparent resin package 1 made of a transparent epoxy resin having one end processed into a spherical surface. A sealing material 5 made of silicone rubber is provided in a red transparent container 4 formed of two LED elements 3 in a hemispherical thin film of polyvinyl chloride or the like.
Are formed by embedding the respective resin packages 1 in the translucent translucent light diffuser 6 formed before filling the sealing material 5. The pair of LEDs
Both electrode leads 7 of the anode 7 and the cathode 8 of the element 3;
Numerals 8 are electrically connected in parallel and are drawn out of the light diffuser 6.

【0021】図2に示すように、前記一対のLED素子
3を発光させるために、電流制限抵抗Rを介して、各別
に所定の発光強度を得るのに十分な電流を得るのに必要
な適正電圧を前記両電極リード7、8間に印加すると、
前記一対のLED素子3の前記各発光ダイオード2が発
光する。前記各LED素子3が空気中にある場合は、図
3に示すように、球面加工された前記樹脂パッケージ1
の先端部3aの集光作用により前記各発光ダイオード2
からの発光ビームは相対強度50%以上のものが、前記
各LED素子3の光軸9を中心とする視野角φ内に集中
するが、本実施形態の構成では、前記先端部3aの周囲
がシリコーンゴムであり、前記樹脂パッケージ1との屈
折率差は、前記樹脂パッケージ1と空気との屈折率差よ
り小さいため、前記樹脂パッケージ1が本来有する前記
集光作用が抑制され、前記各発光ダイオード2からの発
光は広い視野角で前記光拡散体6内に入射する。前記光
拡散体6内に入射した光は、前記光拡散体6内部で拡散
され、前記光拡散体6の半球面状の表面から前記赤色の
透明容器4を通過して外部空間に180°以上の視野角
で出射する。この結果、前記光拡散体6の半球面状の表
面全体が広がりを持った光源として見えるのである。以
上より、本発明の発光装置は、信号灯に応用することが
でき、電球等を使用したものに比べ、消費電力の低減と
メンテナンス期間の長期化を実現できるのである。特
に、メンテナンスが困難な場所に設置されてある、電池
を電源とする機器類の信号灯の発光装置に好適である。
As shown in FIG. 2, in order to cause the pair of LED elements 3 to emit light, an appropriate current necessary to obtain a predetermined light emission intensity is obtained through a current limiting resistor R. When a voltage is applied between the two electrode leads 7 and 8,
Each of the light emitting diodes 2 of the pair of LED elements 3 emits light. When each of the LED elements 3 is in the air, as shown in FIG.
Each light emitting diode 2
Although the light beam emitted from the light source has a relative intensity of 50% or more, the light beam is concentrated within a viewing angle φ centered on the optical axis 9 of each of the LED elements 3. Since the difference in refractive index between the resin package 1 and the resin package 1 is smaller than the difference in refractive index between the resin package 1 and air, the light condensing action inherent in the resin package 1 is suppressed, and The light emitted from 2 enters the light diffuser 6 at a wide viewing angle. The light that has entered the light diffuser 6 is diffused inside the light diffuser 6, passes through the red transparent container 4 from the hemispherical surface of the light diffuser 6, and enters the external space by 180 ° or more. At a viewing angle of. As a result, the entire hemispherical surface of the light diffuser 6 can be seen as a light source having a spread. As described above, the light-emitting device of the present invention can be applied to a signal light, and can reduce power consumption and prolong a maintenance period as compared with a device using a light bulb or the like. In particular, the present invention is suitable for a light-emitting device of a signal lamp of a battery-powered device installed in a place where maintenance is difficult.

【0022】以下に別実施形態を説明する。 〈1〉前記光拡散体6は必ずしも全体が半透明である必
要はない。例えば、図4に示すように、前記光拡散体6
の半球面状の表面内側部分が半透明層6aで、その内側
で前記各LED素子3を覆う部分が透明な2層構造であ
っても構わない。この場合、その透明部分の屈折率を前
記樹脂パッケージ1の屈折率より大きくすることで、前
記先端部3aで前記各発光ダイオード2からの発光ビー
ムを光軸から外側に向けて拡散させることができ、広視
野角実現に寄与するのである。
Another embodiment will be described below. <1> The light diffuser 6 does not need to be entirely translucent. For example, as shown in FIG.
The inside of the hemispherical surface may be a translucent layer 6a, and the portion that covers each LED element 3 inside may be a transparent two-layer structure. In this case, by making the refractive index of the transparent portion larger than the refractive index of the resin package 1, the light-emitting beams from each of the light-emitting diodes 2 can be diffused outward from the optical axis at the front end portion 3a. This contributes to realizing a wide viewing angle.

【0023】〈2〉図5に示すように、前記光拡散体6
の表面の一部に前記光拡散体6の内側に面した光反射面
10を形成するのも好ましい。前記光反射面10は光を
透過吸収せず高効率で反射する面であれば鏡面であって
も白色であってもよい。また、発光色に合わせて着色さ
れていても構わない。また、前記光反射面10は前記光
拡散体6の表面と一体に形成しても構わないし、分離可
能に接触していても構わない。簡単な実施例としては、
例えば、前記光拡散体6の表面の一部を白色の紙で外側
から覆っても構わない。
<2> As shown in FIG. 5, the light diffuser 6
It is also preferable to form a light reflection surface 10 facing the inside of the light diffuser 6 on a part of the surface of the light diffuser 6. The light reflecting surface 10 may be a mirror surface or a white surface as long as it reflects light with high efficiency without transmitting and absorbing light. Further, it may be colored according to the emission color. Further, the light reflecting surface 10 may be formed integrally with the surface of the light diffuser 6 or may be in contact with the light diffuser 6 in a separable manner. As a simple example,
For example, a part of the surface of the light diffuser 6 may be covered with white paper from the outside.

【0024】〈3〉前記各LED素子3の前記樹脂パッ
ケージ1は、半透明であっても同様の効果を得ることが
できる。また、前記樹脂パッケージ1は、無色でも、特
定の色に着色されてあっても構わない。前記各LED素
子3は、1個、または、3個以上であっても構わない。
また、それらは、電気的に並列接続、直列接続、また
は、直並列接続であってもよく、また、各別に独立して
給電されるように構成されていても構わない。また、前
記各LED素子3の発光色は、赤色に限らず、現実に発
光可能なものであれば、特定の色に限定されない。前記
LED素子3が複数個の場合、全ての発光色が同色で
も、また、一部または全部が異なる色であっても構わな
い。また、相互の相対位置関係も適宜変更可能である。
特に、図5に示すように、各発光色がRGB3原色を含
むように複数設けられ、前記各LED素子3の電流値を
各別に調整できる電流調整手段11を設けることで、前
記光拡散体6の表面からの発光色を任意に調整できるの
である。この場合、前記光拡散体6は白色で、前記光反
射面10も無色鏡面または白色が好ましい。かかる構成
で信号灯を構成すると、同一製品で任意の発光色が得ら
れるので、例えば、国によって発光色の規格が異なる信
号機等の応用も、同一製品で国別に対応できるのであ
る。更に、上記実施形態では、前記LED素子3は単体
の発光ダイオードを各別に樹脂封止した形態のものであ
るが、複数の発光ダイオードを樹脂封止したものであっ
ても構わない。
<3> Similar effects can be obtained even if the resin package 1 of each of the LED elements 3 is translucent. Further, the resin package 1 may be colorless or colored to a specific color. Each of the LED elements 3 may be one or three or more.
In addition, they may be electrically connected in parallel, in series, or in series-parallel, or may be configured to be supplied with power independently. The color of light emitted from each of the LED elements 3 is not limited to red, and is not limited to a specific color as long as it can actually emit light. When there are a plurality of the LED elements 3, all the emission colors may be the same color, or some or all may be different colors. Further, the mutual relative positional relationship can be appropriately changed.
In particular, as shown in FIG. 5, a plurality of light-emitting colors are provided so as to include the three primary colors RGB, and a current adjusting means 11 that can individually adjust the current value of each of the LED elements 3 is provided. The color of light emitted from the surface can be arbitrarily adjusted. In this case, the light diffuser 6 is preferably white, and the light reflecting surface 10 is preferably a colorless mirror or white. When a signal light is configured in such a configuration, an arbitrary emission color can be obtained with the same product, so that, for example, an application of a traffic light having a different emission color standard depending on a country can be applied to each country with the same product. Furthermore, in the above embodiment, the LED element 3 has a form in which a single light emitting diode is individually resin-sealed, but a plurality of light emitting diodes may be resin-sealed.

【0025】〈4〉前記光拡散体6の材質、形状、色、
及び、形成方法は、必ずしも本実施形態に限定されるも
のではない。形状に関しては、例えば、円盤状、円柱
状、半円柱状等であってもよく、更に、内部に中空部分
を有していても構わない。また、前記透明容器4の材
質、形状、及び、色は、必ずしも本実施形態に限定され
るものではない。色に関しては、赤色以外に、例えば、
無色でもよく、前記各LED素子3の発光色に合わせて
適宜変更可能である。更に、前記透明容器4は必ずしも
設けなくても構わない。
<4> Material, shape and color of the light diffuser 6
And the forming method is not necessarily limited to this embodiment. The shape may be, for example, a disk shape, a column shape, a semi-cylindrical shape, or the like, and may have a hollow portion inside. Further, the material, shape, and color of the transparent container 4 are not necessarily limited to the present embodiment. Regarding color, besides red, for example,
It may be colorless, and can be appropriately changed according to the emission color of each LED element 3. Further, the transparent container 4 may not necessarily be provided.

【0026】〈5〉本発明の発光装置は、信号灯以外に
も、一般の照明装置等に応用しても構わない。更に、図
5に示す発光装置を複数個マトリックス状に配列して広
視野角、大画面、且つ、薄型のカラー表示装置を構成す
るのも好ましい実施の形態である。この場合、画素面積
及びマトリックスの配列数を適当に調整することで、画
面サイズとして映画スクリーン程度の大画面の実現も可
能である。
<5> The light emitting device of the present invention may be applied to general lighting devices and the like, in addition to signal lights. Further, it is also a preferred embodiment that a plurality of light emitting devices shown in FIG. 5 are arranged in a matrix to form a thin color display device having a wide viewing angle, a large screen, and a thin screen. In this case, a large screen such as a movie screen can be realized as the screen size by appropriately adjusting the pixel area and the number of matrix arrangements.

【0027】[0027]

【発明の効果】以上説明したように、本発明によれば、
少ない個数のLED素子を使用して、長耐用時間数と低
消費電力を実現するとともに、光源として広がりを持
ち、且つ、広視野角で発光する視認性に富んだ発光装置
を提供することができる。
As described above, according to the present invention,
By using a small number of LED elements, it is possible to provide a light-emitting device that achieves a long service life and low power consumption, has a wide spread as a light source, and emits light with a wide viewing angle and high visibility. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る発光装置の一実施形態を示す縦断
面図
FIG. 1 is a longitudinal sectional view showing one embodiment of a light emitting device according to the present invention.

【図2】本発明に係る発光装置の一実施形態の発光状態
を説明する縦断面図
FIG. 2 is a longitudinal sectional view illustrating a light emitting state of an embodiment of the light emitting device according to the present invention.

【図3】LED素子の発光状態を説明する縦断面図FIG. 3 is a longitudinal sectional view illustrating a light emitting state of an LED element.

【図4】本発明に係る発光装置の別実施形態を示す縦断
面図
FIG. 4 is a longitudinal sectional view showing another embodiment of the light emitting device according to the present invention.

【図5】本発明に係る発光装置の他の別実施形態を示す
縦断面図
FIG. 5 is a longitudinal sectional view showing another embodiment of the light emitting device according to the present invention.

【符号の説明】 1 樹脂パッケージ 1a 先端部 2 発光ダイオード 3 LED素子 4 透明容器 5 シーリング材 6 光拡散体 6a 半透明層 7 電極リード(アノード) 8 電極リード(カソード) 9 光軸 10 光反射面 11 電流調整手段 R 電流制限抵抗[Description of Signs] 1 Resin package 1a Tip 2 Light emitting diode 3 LED element 4 Transparent container 5 Sealing material 6 Light diffuser 6a Semi-transparent layer 7 Electrode lead (anode) 8 Electrode lead (cathode) 9 Optical axis 10 Light reflecting surface 11 Current adjusting means R Current limiting resistor

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 発光ダイオードを先端部が集光性を有す
る透明或いは半透明の樹脂パッケージ内に封止してなる
LED素子を、その樹脂パッケージの全部または前記先
端部側の一部が入射した光を拡散する光拡散体内に埋入
するように設けてなる発光装置。
1. An LED element in which a light emitting diode is sealed in a transparent or translucent resin package having a light-collecting end, and the entirety of the resin package or a part of the front end is incident. A light emitting device provided so as to be embedded in a light diffuser that diffuses light.
【請求項2】 前記光拡散体が、少なくとも光を出射す
る表面内側に沿って半透明層を有し、屈折率が1より大
きい請求項1記載の発光装置。
2. The light emitting device according to claim 1, wherein the light diffuser has a translucent layer at least along the inside of the surface from which light is emitted, and has a refractive index of more than 1.
【請求項3】 前記光拡散体全体が半透明である請求項
2記載の発光装置。
3. The light emitting device according to claim 2, wherein the entire light diffuser is translucent.
【請求項4】 前記光拡散体がシリコーン樹脂製である
請求項3記載の発光装置。
4. The light emitting device according to claim 3, wherein said light diffuser is made of a silicone resin.
【請求項5】 前記光拡散体の表面の一部に前記光拡散
体の内側に面した光反射面を形成してある請求項1、
2、3または4記載の発光装置。
5. A light reflection surface facing the inside of the light diffuser is formed on a part of the surface of the light diffuser.
The light emitting device according to 2, 3, or 4.
【請求項6】 前記LED素子は少なくとも3個設けら
れており、それらの発光色が少なくともRGB3原色を
含むことを特徴とする請求項1、2、3、4または5記
載の発光装置。
6. The light emitting device according to claim 1, wherein at least three LED elements are provided, and their emission colors include at least three primary colors of RGB.
JP26125897A 1997-09-26 1997-09-26 Light-emitting device Pending JPH11103092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26125897A JPH11103092A (en) 1997-09-26 1997-09-26 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26125897A JPH11103092A (en) 1997-09-26 1997-09-26 Light-emitting device

Publications (1)

Publication Number Publication Date
JPH11103092A true JPH11103092A (en) 1999-04-13

Family

ID=17359340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26125897A Pending JPH11103092A (en) 1997-09-26 1997-09-26 Light-emitting device

Country Status (1)

Country Link
JP (1) JPH11103092A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344296B1 (en) * 1999-08-03 2002-07-19 알에프코어 주식회사 Method of Manufacturing High Power LED Package
JP2003511824A (en) * 1999-10-14 2003-03-25 カラレイ・ディジタル・テクノロジー・(シェンツェン)・カンパニー・リミテッド Numerical control color light source system
JP2006525648A (en) 2003-05-05 2006-11-09 ゲルコアー リミテッド ライアビリティ カンパニー LED light bulb
JP2008124518A (en) * 2004-07-02 2008-05-29 Samsung Electro-Mechanics Co Ltd Rgb light-emitting diode package with improved color mixing properties
JP2008536146A (en) * 2005-04-11 2008-09-04 ファロ テクノロジーズ インコーポレーテッド 3D coordinate measuring device
GB2545279A (en) * 2015-12-09 2017-06-14 Dongguan Chen Cai Illuminating Tech Co Ltd LED Lamp beads with multiple light-emitting points

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100344296B1 (en) * 1999-08-03 2002-07-19 알에프코어 주식회사 Method of Manufacturing High Power LED Package
JP2003511824A (en) * 1999-10-14 2003-03-25 カラレイ・ディジタル・テクノロジー・(シェンツェン)・カンパニー・リミテッド Numerical control color light source system
JP2006525648A (en) 2003-05-05 2006-11-09 ゲルコアー リミテッド ライアビリティ カンパニー LED light bulb
JP2008124518A (en) * 2004-07-02 2008-05-29 Samsung Electro-Mechanics Co Ltd Rgb light-emitting diode package with improved color mixing properties
JP2008536146A (en) * 2005-04-11 2008-09-04 ファロ テクノロジーズ インコーポレーテッド 3D coordinate measuring device
GB2545279A (en) * 2015-12-09 2017-06-14 Dongguan Chen Cai Illuminating Tech Co Ltd LED Lamp beads with multiple light-emitting points

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