JPH1085975A - Laser beam machining method - Google Patents
Laser beam machining methodInfo
- Publication number
- JPH1085975A JPH1085975A JP8240249A JP24024996A JPH1085975A JP H1085975 A JPH1085975 A JP H1085975A JP 8240249 A JP8240249 A JP 8240249A JP 24024996 A JP24024996 A JP 24024996A JP H1085975 A JPH1085975 A JP H1085975A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- cutting
- hole
- point
- start point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、レーザビーム及
びアシストガスにより鋼板等の被加工材に丸穴や四角穴
等の穴を切断加工するレーザ切断の加工方法に係わり、
特にバーニング（異常燃焼）による製品への悪影響を無
くすことができるレーザ加工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting method for cutting a hole such as a round hole or a square hole in a workpiece such as a steel plate by using a laser beam and an assist gas.
In particular, the present invention relates to a laser processing method capable of eliminating adverse effects on products due to burning (abnormal combustion).
【０００２】[0002]
【従来の技術】レ−ザ光及びアシストガスを使用して、
鋼板等の被加工物を所定形状に切断加工する際の従来の
加工方法は、被加工物の材質と板厚から最適切断加工条
件を経験的に求め、その加工条件をもとにノズルを被加
工物の切断開始点に位置決めし、ノズルからレ−ザ光を
発し切断開始点から所定の切断速度で加工を開始してい
る。2. Description of the Related Art Using a laser beam and an assist gas,
In the conventional processing method for cutting a workpiece such as a steel plate into a predetermined shape, an optimum cutting condition is empirically obtained from the material and the thickness of the workpiece, and the nozzle is coated based on the processing condition. The workpiece is positioned at the cutting start point, laser light is emitted from the nozzle, and processing is started at a predetermined cutting speed from the cutting start point.
【０００３】厚い鋼板の穴形状の導入線部や***加工部
あるいは加工形状のコ−ナ部付近では、通常の加工速度
やレ−ザ出力の加工条件を変えて、材質や板厚毎に制御
装置に設定してある加工速度、レ−ザ出力、アシストガ
ス圧、パルスデュ−ティ等の加工条件に基づき加工を行
い、所定の長さを加工した後再び通常の加工条件に切り
替えて加工を行っている。特に、例えば９ｍｍ以上の厚
さの鋼板加工における***加工やコ−ナ部では加工形状
を確保するために、ノズルの移動速度やレーザ出力を低
下させている。[0003] In the vicinity of a lead portion of a hole shape of a thick steel plate, a small hole processing portion, or a corner portion of a processing shape, a normal processing speed and a processing condition of laser output are changed to control each material and plate thickness. Processing is performed based on processing conditions such as the processing speed, laser output, assist gas pressure, and pulse duty set in the apparatus. After processing a predetermined length, the processing is switched back to normal processing conditions and processing is performed again. ing. In particular, for example, in the processing of a small hole in a steel plate having a thickness of 9 mm or more and the corner portion, the moving speed of the nozzle and the laser output are reduced in order to secure the processed shape.
【０００４】鋼板よりなる被加工材１１の例えば***加
工においては、図１１に示すように加工開始のピアッシ
ングポイントＰ１から導入線Ｌ１に沿って穴加工線Ｌ３
上の加工開始点Ｐ２まで切り込みを行ない導入溝１４を
形成する。又、穴加工線Ｌ３に到達する部分では所定の
角度や直角又は小さい円弧軌跡で穴加工線Ｌ３へ入り加
工を行っている。そして、加工開始点Ｐ２から穴加工線
Ｌ３の矢印方向に、ノズルを移動させて前記加工開始点
Ｐ２までノズルを戻すことにより穴加工溝１６を形成
し、被加工材１１に所定の穴１７を形成している。[0004] In the case of, for example, small hole drilling of a workpiece 11 made of a steel plate, as shown in Fig. 11, a hole drilling line L3 extends from a piercing point P1 at the start of processing along an introduction line L1.
Cutting is performed up to the upper processing start point P2 to form the introduction groove 14. Further, in a portion reaching the hole processing line L3, the hole enters the hole processing line L3 at a predetermined angle, a right angle, or a small arc locus, and the processing is performed. Then, by moving the nozzle from the processing start point P2 in the direction of the arrow of the hole processing line L3 and returning the nozzle to the processing start point P2, a hole processing groove 16 is formed, and a predetermined hole 17 is formed in the workpiece 11. Has formed.
【０００５】[0005]
【発明が解決しようとする課題】ところが、前記穴加工
溝１６の加工終点Ｐ２（加工開始点Ｐ２と同じ点でもあ
る）の直前の点Ｐ４ではノズルから噴出するアシストガ
スの乱流が原因で、被加工材１１に熱が蓄積されるため
溶損が発生し、所望の加工形状が得られないという問題
があった。切断開始点Ｐ２付近の溝は、ノズルの移動が
ほぼ９０度方向転換されるので、その速度が一時的に遅
くなりレーザ加工条件を変えても他の加工部に比べカ−
フ幅（切断溝幅）が広くなっている。さらに穴加工線Ｌ
３の切断開始点Ｐ２では先の導入溝１４を含めるとカ−
フ幅は相当広く、前記加工終点直前の点Ｐ４において穴
加工の終了直前にはアシストガスがその導入溝１４に流
れ込んでしまい、アシストガスが乱流して通常のカ−フ
幅を保つことができず前記直前の点Ｐ４付近では次の問
題が生じる。However, at a point P4 immediately before the processing end point P2 of the hole processing groove 16 (also the same point as the processing start point P2), a turbulent flow of the assist gas ejected from the nozzle causes a problem. There is a problem in that heat is accumulated in the workpiece 11 to cause erosion and a desired processed shape cannot be obtained. Since the movement of the nozzle in the groove near the cutting start point P2 is changed by approximately 90 degrees, the speed is temporarily reduced, so that even if the laser processing conditions are changed, the groove is not as sharp as the other processing parts.
The width (cut groove width) is wide. Further drilling line L
At the cutting start point P2 of FIG.
At a point P4 immediately before the end point of the machining, the assist gas flows into the introduction groove 14 immediately before the end of the hole machining, and the assist gas is turbulent and the normal cuff width can be maintained. However, the following problem occurs near the point P4 immediately before.
【０００６】被加工材１１の板厚より小さい直径の穴１
７の加工においては、被加工材１１の表面では図１２
（ａ）に示すように表面側の穴１７１の形状はある程度
円形となり、内側のスクラップ部１９の外周縁もほぼ円
形状になり、特に問題はない。しかし、被加工材１１の
裏面では、前記直前の点Ｐ４において表から裏面を透視
した図１２（ｂ）に示すようにスクラップ部１９に欠落
部１９１が生じ、かつ裏面側の穴１７２のうち欠落部１
９１と対応する内周面１７２ａがいびつな形状になると
いう問題があった。又、前記欠落部１９１と前記内周面
１７２ａとの間に被加工材１１の溶融金属の残滓２０が
発生して、この残滓２０がスクラップ部１９と内周面１
７２ａとを溶着することになり、スクラップ部１９の穴
１７２からの落下が阻止され、穴加工を不能にするとい
う問題があった。特に、穴径が小さい場合には前記スク
ラップ部１９が小さくなり、その重量が軽くなるので、
前記溶着力によりスクラップ部１９の落下が生じ難くな
る。The hole 1 having a diameter smaller than the thickness of the workpiece 11
In the processing of FIG.
As shown in (a), the shape of the hole 171 on the front surface side is circular to some extent, and the outer peripheral edge of the inner scrap portion 19 is also substantially circular, and there is no particular problem. However, on the back surface of the workpiece 11, as shown in FIG. 12B in which the back surface is seen through from the front surface at the point P <b> 4 immediately before, a scrap portion 191 is formed in the scrap portion 19 and the hole 172 on the back surface side is missing. Part 1
There is a problem that the inner peripheral surface 172a corresponding to 91 has an irregular shape. Further, a residue 20 of the molten metal of the workpiece 11 is generated between the cutout portion 191 and the inner peripheral surface 172a.
Thus, there is a problem that the scrap portion 19 is welded to the scrap portion 19 to prevent the scrap portion 19 from dropping from the hole 172, thereby making the hole processing impossible. In particular, when the hole diameter is small, the scrap portion 19 becomes small and its weight becomes light.
The welding force makes it difficult for the scrap portion 19 to fall.
【０００７】上記の残滓２０の発生は、次のように説明
される。すなわち、図１３に示すように、ノズル１２か
ら被加工材１１に照射されるレーザビーム１３は、ノズ
ル１２が図１３の左方向へ移動されると、被加工材１１
の下端ほど右方に切断遅れが生じ、被加工材１１の下側
に未切断部１１１が生じる。そして、この状態を継続し
たままレーザビーム１３が前記直前の点Ｐ４から加工開
始点Ｐ２へ移動される過程でレーザビーム１３がアシス
トガスとともに導入溝１４に流出する。この結果、前記
未切断部１１１がアシストガスを含めた正規の切断条件
から外れるため、溶融して残滓２０となり、この残滓２
０によりスクラップ部１９が穴１７２の周面１７２ａに
溶着されて落下が阻止される。[0007] The generation of the residue 20 is explained as follows. That is, as shown in FIG. 13, when the nozzle 12 is moved to the left in FIG.
As the lower end of the workpiece 11 is cut to the right, an uncut portion 111 is generated below the workpiece 11. Then, while the laser beam 13 is moved from the immediately preceding point P4 to the processing start point P2 while maintaining this state, the laser beam 13 flows out into the introduction groove 14 together with the assist gas. As a result, the uncut portion 111 deviates from the normal cutting conditions including the assist gas, so that the uncut portion 111 is melted to form a residue 20, and this residue 2
With 0, the scrap portion 19 is welded to the peripheral surface 172a of the hole 172 to prevent the scrap portion 19 from dropping.
【０００８】従って、従来の加工方法では、裏面側の穴
１７２の加工形状が変形するばかりでなく、被加工材１
１の厚さと、穴１７の大きさとの関係が、図６の鎖線曲
線で示すように、制約されるという問題がある。すなわ
ち、図６は横軸に被加工材１１の厚さをとり、縦軸に穴
径をとり、適正な加工形状を得ることができる加工可能
な最***径と厚さとの関係を求めたものである。このグ
ラフによれば、例えば被加工材１１の材質ＳＳ４０、厚
さが１０ｍｍでは、穴径が８ｍｍ以上に、厚さが１５ｍ
ｍでは、穴径が１２ｍｍ以上に、厚さが２０ｍｍでは、
穴径が２２ｍｍ以上に、それぞれ制約されるという問題
があった。Therefore, according to the conventional processing method, not only the processing shape of the hole 172 on the rear surface side is deformed, but also
There is a problem in that the relationship between the thickness of No. 1 and the size of the hole 17 is restricted as shown by the chain line curve in FIG. That is, FIG. 6 shows the relationship between the minimum hole diameter and the thickness that can be processed to obtain an appropriate processing shape by taking the thickness of the workpiece 11 on the horizontal axis and the hole diameter on the vertical axis. It is. According to this graph, for example, when the material SS40 of the workpiece 11 has a thickness of 10 mm, the hole diameter is 8 mm or more and the thickness is 15 m.
m, the hole diameter is 12 mm or more, and the thickness is 20 mm,
There is a problem that the hole diameter is limited to 22 mm or more.
【０００９】本発明はこのような従来の技術に存在する
問題点に着目してなされたものであって、その第１の目
的は、被加工材の厚さと穴径との制約を緩和することが
できるとともに、被加工材への穴加工を確実かつ適正に
行うことができるレーザ加工方法を提供することにあ
る。The present invention has been made in view of the problems existing in the prior art, and a first object of the present invention is to alleviate the restrictions on the thickness of the workpiece and the hole diameter. It is another object of the present invention to provide a laser processing method capable of reliably and appropriately performing a hole drilling on a work material.
【００１０】本発明の第２の目的は、上記第１の目的に
加えて、切り込み溝の形成を適正に行うことができるレ
ーザ加工方法を提供することにある。本発明の第３の目
的は、上記第１又は２の目的に加えて、ノズルを加工開
始点まで復帰する動作を行い、加工能率を向上すること
ができるレーザ加工方法を提供することにある。A second object of the present invention is to provide a laser processing method capable of appropriately forming a cut groove in addition to the first object. A third object of the present invention, in addition to the first or second object, is to provide a laser processing method capable of performing an operation of returning a nozzle to a processing start point and improving processing efficiency.
【００１１】本発明の第４の目的は、上記第１〜第３の
いずれかの目的に加えて、楕円形又は複数の円弧をウエ
ブ状に形成した穴加工線に沿って被加工材を加工する
際、穴加工をより適正に行うことができるレーザ加工方
法を提供することにある。A fourth object of the present invention is to provide, in addition to any one of the first to third objects, a method of processing a workpiece along a hole processing line in which an oval or a plurality of circular arcs are formed in a web shape. It is therefore an object of the present invention to provide a laser processing method capable of performing hole processing more appropriately.
【００１２】本発明の第５の目的は、上記第１〜第３の
いずれかの目的に加えて、角形の穴の加工をより適正に
行うことができるレーザ加工方法を提供することにあ
る。本発明の第６の目的は、上記第１の目的に加えて、
加工能率を向上することができるレーザ加工方法を提供
することにある。A fifth object of the present invention is to provide, in addition to any one of the first to third objects, a laser processing method capable of processing a square hole more appropriately. According to a sixth object of the present invention, in addition to the first object,
An object of the present invention is to provide a laser processing method capable of improving processing efficiency.
【００１３】[0013]
【課題を解決するための手段】請求項１記載の発明は、
上記第１の目的を達成するために、ノズルから出力され
るレーザ光を被加工材に照射するとともに、前記レーザ
光に沿ってアシストガスを噴射して穴加工するレーザ加
工方法において、ピアッシングポイントから切断導入線
に沿って穴加工線上の加工開始点まで被加工材を切断し
た後、前記加工開始点から穴加工線に沿って被加工材を
切り込み終了点まで切断して切り込み溝を形成し、その
後、前記加工開始点にノズルを戻して、該加工開始点か
ら前記切り込み溝とは反対方向に前記穴加工線に沿って
前記切り込み終了点まで被加工材を切断するという手段
をとっている。According to the first aspect of the present invention,
In order to achieve the first object, in a laser processing method of irradiating a workpiece with laser light output from a nozzle and injecting an assist gas along the laser light to drill a hole, a piercing point is used. After cutting the workpiece to the processing start point on the hole processing line along the cutting introduction line, cut the workpiece from the processing start point to the cutting end point along the hole processing line to form a cutting groove, Thereafter, the nozzle is returned to the processing start point, and the workpiece is cut from the processing start point to the cut end point along the hole processing line in a direction opposite to the cut groove.
【００１４】請求項２記載の発明においては、上記第２
の目的を達成するために、請求項１において、前記加工
開始点から切り込み終了点までの被加工材の切り込み切
断は穴加工線に部分的に行われ、切り込み加工条件は通
常の切断加工速度より遅い速度、かつ、通常のレ−ザ出
力より低い条件で行われるものである。In the invention according to claim 2, the second
In order to achieve the above object, in claim 1, the incision cutting of the workpiece from the machining start point to the incision end point is partially performed on a hole machining line, and the incision machining condition is lower than a normal cutting speed. The operation is performed at a low speed and lower than the normal laser output.
【００１５】請求項３記載の発明は、上記第３の目的を
達成するために、請求項２において、切り込み切断を終
了した時点で一旦レ−ザ光及びアシストガスを停止さ
せ、ノズルを加工開始点まで戻し、該加工開始点におい
て通常の切断加工条件に切り替えるものである。According to a third aspect of the present invention, in order to achieve the third object, in the second aspect, the laser beam and the assist gas are temporarily stopped when the cutting and cutting are completed, and the processing of the nozzle is started. To a normal cutting condition at the processing start point.
【００１６】請求項４記載の発明は、上記第４の目的を
達成するために、請求項１〜３のいずれかにおいて、穴
加工線は楕円形又は複数の円弧をウエブ状に形成したも
のであって、切り込み終了点は該穴加工線の曲率が最も
大きい曲線上に設定されている。According to a fourth aspect of the present invention, in order to achieve the fourth object, in any one of the first to third aspects, the hole machining line is formed by forming an elliptical shape or a plurality of circular arcs into a web shape. The cut end point is set on the curve where the curvature of the hole processing line is the largest.
【００１７】請求項５記載の発明においては、上記第５
の目的を達成するために、請求項１〜３のいずれかにお
いて、切り込み終了点は角形の穴加工線の直線上に設定
されている。In the fifth aspect of the present invention, the fifth aspect is provided.
In order to achieve the above object, in any one of the first to third aspects, the cut end point is set on a straight line of a square hole processing line.
【００１８】請求項６記載の発明は、上記第６の目的を
達成するために、請求項１において、切り込み溝の切り
込み終了点は、加工開始点からの形成角が１８０度を越
えた点に設定され、切り込み溝の加工を通常の加工条件
で行った後、レーザ出力を停止した状態でノズルを、加
工開始点まで移動させ、該加工開始点で加工条件を通常
の切断加工速度よりも遅い加工条件に切り替えて、加工
開始点から前記切り込み終了点まで被加工材を切断する
という手段をとっている。According to a sixth aspect of the present invention, in order to achieve the sixth object, in the first aspect, the cut end point of the cut groove is defined as a point at which the forming angle from the processing start point exceeds 180 degrees. After performing the processing of the cut groove under the normal processing condition, the nozzle is moved to the processing start point in a state where the laser output is stopped, and the processing condition is slower than the normal cutting processing speed at the processing start point. Means is adopted in which the processing conditions are switched to cut the workpiece from the processing start point to the cutting end point.
【００１９】[0019]
【発明の実施の形態】以下、この発明を具体化した一実
施形態を図１〜図６に従って説明する。この実施形態
は、被加工材１１に対し、所定半径の円形状の穴１７を
切断加工する加工方法である。図４は所定厚さの鋼板等
の被加工材１１の上面に近接するようにレーザビーム１
３及びアシストガスを照射するノズル１２を移動する経
路を示す。この経路及びレーザビームとアシストガスの
発生条件、レ−ザ出力、アシストガス圧、パルスデュ−
ティ及び加工速度等の加工条件は、被加工材１１の材質
や厚さあるいは穴径等に応じて予め適正な条件が図示し
ない制御装置のメモリーに記憶されている。そして、加
工しようとする被加工材１１の穴径に適した条件を選択
して、ノズル１２を移動することにより穴加工が適正な
条件で行われる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. This embodiment is a processing method for cutting a circular hole 17 having a predetermined radius in the workpiece 11. FIG. 4 shows a laser beam 1 so as to be close to the upper surface of a workpiece 11 such as a steel plate having a predetermined thickness.
3 and a path for moving the nozzle 12 for irradiating the assist gas. This path, laser beam and assist gas generation conditions, laser output, assist gas pressure, pulse duration
Processing conditions such as the tee and the processing speed are stored in advance in a memory of a control device (not shown) in accordance with the material, thickness, hole diameter, and the like of the workpiece 11. Then, by selecting a condition suitable for the hole diameter of the workpiece 11 to be machined and moving the nozzle 12, the hole machining is performed under appropriate conditions.
【００２０】そこで、穴１７の切断加工作業を図１〜図
３により説明する。図２（ａ）に示すように、まず被加
工材１１の所定位置、つまりピアッシングポイントＰ１
においてノズル１２からレーザビーム１３及びアシスト
ガスを出力し、ビーム径にほぼ等しい***を形成する。The cutting operation of the hole 17 will be described with reference to FIGS. As shown in FIG. 2A, first, a predetermined position of the workpiece 11, that is, the piercing point P1
Then, the laser beam 13 and the assist gas are output from the nozzle 12 to form a small hole substantially equal to the beam diameter.
【００２１】次に、図２（ｂ）に示すように、ピアッシ
ングポイントＰ１から穴加工線Ｌ３の特定点、つまり加
工開始点Ｐ２まで、穴形状導入線Ｌ１に沿ってノズル１
２を移動させ、導入溝１４を形成する。この工程では、
ノズル移動速度、レ−ザ出力の加工条件が通常の加工条
件より低く設定される。Next, as shown in FIG. 2B, the nozzle 1 extends along the hole shape introduction line L1 from the piercing point P1 to a specific point of the hole processing line L3, that is, the processing start point P2.
2 is moved to form the introduction groove 14. In this step,
The processing conditions for the nozzle moving speed and the laser output are set lower than the normal processing conditions.
【００２２】次に、前記加工開始点Ｐ２から円弧状の穴
加工線Ｌ３に沿って図２（ｃ）の時計回り方向、つまり
本来の加工方向とは反対方向へノズル１２を移動し、所
定長さの円弧状をなす切り込み溝１５を切断加工する。
この切り込み溝１５の先端部のノズル中心Ｐ３は切り込
み終了点となり、この点Ｐ３でレ−ザ光を一旦停止させ
る。この切り込み終了点Ｐ３は、後述するように穴１７
の加工が最終段階で終了する加工終了点にもなる。Next, the nozzle 12 is moved from the machining start point P2 in the clockwise direction in FIG. 2C, that is, in the direction opposite to the original machining direction, along the arc-shaped hole machining line L3, to a predetermined length. The cutting groove 15 having an arc shape is cut.
The nozzle center P3 at the tip of the cut groove 15 is the cut end point, and the laser light is temporarily stopped at this point P3. The cutting end point P3 is located at the hole 17 as described later.
This is also a processing end point where the processing of the above is completed in the final stage.
【００２３】次に、図２（ｃ）において、切り込み終了
点Ｐ３から切り込み加工線Ｌ２に沿ってノズル１２を戻
す。その後、加工開始点Ｐ２で通常の加工条件に切り替
えて穴加工線Ｌ３に沿って反時計回り方向に切断加工を
行い、図３に示すように円形状の穴加工溝１６を形成す
る。この穴加工溝１６は前記切り込み終了点Ｐ３へ向か
って形成され、図１に示すように穴加工溝１６の先端部
を加工するノズルの中心点Ｐ４は、前記終了点Ｐ３へ接
近する。Next, in FIG. 2C, the nozzle 12 is returned along the cutting line L2 from the cutting end point P3. Thereafter, the processing is switched to the normal processing conditions at the processing start point P2, and cutting is performed in the counterclockwise direction along the hole processing line L3, thereby forming a circular hole processing groove 16 as shown in FIG. The hole processing groove 16 is formed toward the cutting end point P3. As shown in FIG. 1, the center point P4 of the nozzle for processing the tip of the hole processing groove 16 approaches the end point P3.
【００２４】この接近状態から加工終了直前の点Ｐ４に
あるノズルが終了点Ｐ３へ移動されると、切り込み溝１
５に穴加工溝１６がつながる。この工程では、切り込み
溝１５は予め穴加工線Ｌ３に沿って所定のカ−フ幅に形
成されている。又、穴加工の場合はノズルの進行方向は
円弧に対して接線となっているため円弧半径が大きい程
ほぼ直線に近似する。従って、被加工材１１の穴加工の
終了点Ｐ３はアシストガスが所定幅のカ−フ部に直線的
に抜けるため、被加工材１１の表面側と裏面側のアシス
トガスの抜け方は直線的となり四方に分散することがな
い。なお、半径が大きい円弧の場合は一層条件が良くな
る。従って、切り込み溝１５に穴加工溝１６が同一のカ
ーフ幅をもって滑らかにつながる。When the nozzle at the point P4 immediately before the end of the processing is moved from the approach state to the end point P3, the cut groove 1
A hole 16 is connected to 5. In this step, the cut groove 15 is formed in advance with a predetermined cuff width along the hole processing line L3. In the case of drilling, the direction of travel of the nozzle is tangent to the arc, so that the larger the radius of the arc, the closer to a straight line. Accordingly, at the end point P3 of the hole drilling of the workpiece 11, the assist gas linearly escapes to the cuff portion having a predetermined width. It does not disperse in all directions. In the case of an arc having a large radius, the condition is further improved. Therefore, the hole processing groove 16 is smoothly connected to the cut groove 15 with the same kerf width.
【００２５】穴加工の加工終了点ではアシストガスが直
線的に抜けるため、溶融物も直線的にカ−フ部に抜け、
溶融物が残滓となって穴加工溝１６内に残ることはな
い。従って、スクラップ部１９の穴１７からの落下も円
滑に行われる。又、切断終了部Ｐ３、特に被加工材１１
の裏面側の欠落が解消され、常に安定した高品質な穴加
工形状を得ることができる。At the end point of drilling, the assist gas escapes linearly, so that the molten material also escapes linearly to the cuff.
The melt does not remain in the drilled groove 16 as a residue. Therefore, the scrap portion 19 is smoothly dropped from the hole 17. Further, the cutting end portion P3, particularly, the workpiece 11
Of the back surface side is eliminated, and a stable and high-quality drilled shape can always be obtained.
【００２６】又、従来レ−ザ加工の課題とされていた小
穴加工において、板厚寸法の直径より小さい例えば板厚
の約１／３の直径の***を明けることができるようにな
った。これは図６のグラフから明らかである。すなわ
ち、図６の実線で示す加工限界曲線に示すように、板厚
が例えば１９ｍｍの場合に、穴径が約７ｍｍとなり、従
来と比較して小径の穴加工が可能となる。Further, in the processing of small holes, which has conventionally been regarded as a problem of laser processing, small holes having a diameter smaller than the diameter of the plate thickness, for example, about 1/3 of the plate thickness, can be formed. This is clear from the graph of FIG. That is, as shown by a processing limit curve indicated by a solid line in FIG. 6, when the plate thickness is, for example, 19 mm, the hole diameter becomes about 7 mm, and a hole with a smaller diameter can be formed as compared with the related art.
【００２７】ところで、図１に示す前記切り込み溝１５
のピアッシングポイントＰ１に関する加工開始点Ｐ２か
ら終了点Ｐ３までの形成角をαとすると、この形成角α
は、穴１７の直径、被加工材１１の厚さ等により適宜に
設定される。例えば、穴の径が小さい場合には、９０
度、大きい場合には３０度というように設定される。
又、前記厚さが薄い場合には形成角αが小さく、大きい
場合には形成角αが大きく設定されている。The cut groove 15 shown in FIG.
Assuming that the formation angle from the processing start point P2 to the end point P3 with respect to the piercing point P1 is α, this formation angle α
Is appropriately set depending on the diameter of the hole 17, the thickness of the workpiece 11, and the like. For example, if the diameter of the hole is small, 90
Degrees, and 30 degrees if larger.
When the thickness is small, the formation angle α is set small, and when the thickness is large, the formation angle α is set large.
【００２８】ここで、前記実施形態における各構成に基
づく作用効果を以下に説明する。 （ａ）前記実施形態では、前記加工開始点Ｐ２から切り
込み終了点Ｐ３までの被加工材１１の切り込み切断を部
分的に行い、切り込み条件は通常の切断加工速度より遅
い速度、かつ、通常のレ−ザ出力より低い条件で行うよ
うにしたので、切り込み溝１５の形成を確実かつ適正に
行うことができる。 （ｂ）前記実施形態では、切り込み切断を終了した時点
で一旦レ−ザ光及びアシストガスを停止させ、ノズルを
加工開始点Ｐ２まで戻し、該加工点において通常の切断
加工条件に切り替えるようにしたので、ノズルを加工開
始点まで復帰する動作を迅速に行い、加工能率を向上す
ることができる。Here, the operation and effect based on each configuration in the above embodiment will be described below. (A) In the above embodiment, the cutting and cutting of the workpiece 11 from the processing start point P2 to the cut end point P3 is partially performed, and the cutting conditions are a speed lower than a normal cutting speed and a normal cutting speed. Since the cutting is performed under a condition lower than the output, formation of the cut groove 15 can be performed reliably and appropriately. (B) In the above-described embodiment, the laser beam and the assist gas are temporarily stopped at the time when the cutting and cutting are completed, the nozzle is returned to the processing start point P2, and the normal cutting processing conditions are switched at the processing point. Therefore, the operation of returning the nozzle to the processing start point can be quickly performed, and the processing efficiency can be improved.
【００２９】なお、この発明は前記実施形態に限定され
るものではなく、以下のように具体化することも可能で
ある。 （１）図７に示すように加工しようとする穴１７が四角
形状の場合において、通常の加工条件よりも低い条件で
ピアッシングポイントＰ１から直線状の穴加工線Ｌ３の
加工開始点Ｐ２へ向かって導入溝１４を形成し、該点か
ら切り込み終了点Ｐ３へ所定長さ直線状の切り込み溝１
５を同じく通常の加工条件よりも低い条件で形成する。
その後、前記加工開始点Ｐ２へノズルを戻し、通常の加
工条件に切り替えて、穴加工線Ｌ３に沿って四角形状の
穴加工溝１６を加工する。The present invention is not limited to the above embodiment, but can be embodied as follows. (1) As shown in FIG. 7, when the hole 17 to be machined has a square shape, from the piercing point P1 toward the machining start point P2 of the straight hole machining line L3 under conditions lower than the normal machining conditions. An introduction groove 14 is formed, and a linear cut groove 1 having a predetermined length is formed from this point to a cut end point P3.
5 is also formed under conditions lower than normal processing conditions.
After that, the nozzle is returned to the processing start point P2, the normal processing conditions are switched, and the square hole 16 is formed along the hole processing line L3.
【００３０】この実施形態では加工終了部において切り
込み終了点Ｐ３に対し、穴加工溝１６の先端が直線状に
向き合うので、穴加工溝１６の最終加工時に前記実施形
態の円弧状の加工線上で向き合う方法と比較して加工作
業をより確実かつ適正に行うことができる。 （２）図８に示すようにピアッシング後の穴加工導入線
Ｌ１が穴１７の外側より切り込む場合については、四角
形状の穴加工線Ｌ３の一辺に対し前記導入線Ｌ１が方向
と一致するようにして通常の加工条件より低い加工条件
により導入溝１４を形成する。次に、加工開始点Ｐ２か
ら他の辺の切り込み線Ｌ２に沿って通常の加工条件より
低い加工条件により切り込み溝１５を形成し、ノズルが
切り込み終了点Ｐ３まで移動した時、レーザ出力を停止
する。次に、ノズルを切り込み終了点Ｐ３から加工開始
点Ｐ２まで戻す。最後に、該点Ｐ２において通常の加工
条件に切り替えてノズルを穴加工線Ｌ３の矢印方向に沿
って加工開始点Ｐ２から加工終了点Ｐ３に向かって移動
し、穴加工溝１６を形成する。In this embodiment, since the tip of the hole 16 is linearly opposed to the cut end point P3 at the processing end portion, the hole 16 faces the arc-shaped processing line of the embodiment at the time of the final processing of the hole 16. The processing operation can be performed more reliably and appropriately as compared with the method. (2) As shown in FIG. 8, in the case where the hole processing introduction line L1 after piercing cuts from outside the hole 17, the introduction line L1 is made to coincide with the direction of one side of the square hole processing line L3. Thus, the introduction groove 14 is formed under processing conditions lower than normal processing conditions. Next, a cutting groove 15 is formed from the processing start point P2 along a cutting line L2 on the other side under processing conditions lower than normal processing conditions, and when the nozzle moves to the cutting end point P3, the laser output is stopped. . Next, the nozzle is returned from the cutting end point P3 to the processing start point P2. Finally, at the point P2, the normal processing conditions are switched, and the nozzle is moved from the processing start point P2 to the processing end point P3 along the arrow direction of the hole processing line L3 to form the hole processing groove 16.
【００３１】この実施形態においても、加工終了部にお
いて切り込み溝１５と加工溝１６とが直線状に対向して
いるので、図７に示す実施形態と同様の効果がある。 （３）図９に示すように、通常の加工条件より低い加工
条件により導入溝１４を形成した後、通常の加工条件に
より切り込み溝１５を形成角αが１８０度以上となるよ
うに形成する。その後に、切り込み終了点Ｐ３において
ノズルからのレーザ出力を停止する。その後、ノズルを
加工開始点Ｐ２へ前進させ、該点Ｐ２からノズルを前記
点Ｐ３に向かって移動し、通常の加工条件より低い加工
条件により穴加工溝１６を形成する。Also in this embodiment, since the cut groove 15 and the processing groove 16 are linearly opposed at the processing end portion, the same effect as in the embodiment shown in FIG. 7 is obtained. (3) As shown in FIG. 9, after the introduction groove 14 is formed under processing conditions lower than normal processing conditions, the cut groove 15 is formed under normal processing conditions so that the formation angle α becomes 180 degrees or more. Thereafter, the laser output from the nozzle is stopped at the cutting end point P3. Thereafter, the nozzle is advanced to the machining start point P2, and the nozzle is moved from the point P2 toward the point P3 to form the hole machining groove 16 under machining conditions lower than normal machining conditions.
【００３２】この実施形態では切り込み終了点Ｐ３まで
ノズルを停止することなく、その後レーザ及びアシスト
ガスの出力を停止した後、加工開始点Ｐ２まで移動する
ことができるので、加工能率を向上することができる。 （４）図１０に示すように、六角形状の穴１７を加工す
る場合には、導入溝１４を六角形の角部の加工開始点Ｐ
２に設定する。又、加工終了部は六角形の辺に設定す
る。なお、図１０の左側に示すように六角形の角部に切
り込み終了点Ｐ３´を設定した場合、切り込み溝１５と
穴加工溝１６の傾き角θが六角形の場合、１２０度とな
るため、９０度以下の傾き角を有する点を切り込み終了
点にする場合と比較して被加工材の厚さと穴径との制約
を緩和することができるとともに、被加工材への穴加工
を適正に行うことができる。 （５）前記図９に示す実施形態以外の各実施形態の加工
方法において、前記切り込み溝１５を形成した後、点Ｐ
３でレ−ザ光を停止させずにそのまま通常の加工方向に
ノズルを低速で移動し、加工開始点Ｐ２で通常の加工条
件に切り替えて加工する。 （６）例えば、楕円形の穴、その他滑らかな曲線により
変則的に形成された穴加工線のうち曲率が最も大きい曲
線上に切り込み終了点を設定する。In this embodiment, the laser can be moved to the processing start point P2 after stopping the output of the laser and the assist gas without stopping the nozzle until the cutting end point P3, so that the processing efficiency can be improved. it can. (4) As shown in FIG. 10, when the hexagonal hole 17 is machined, the introduction groove 14 is formed at the machining start point P of the hexagonal corner.
Set to 2. The processing end portion is set to a hexagonal side. When the cut end point P3 'is set at the hexagonal corner as shown on the left side of FIG. 10, the inclination angle θ between the cut groove 15 and the hole processing groove 16 becomes 120 degrees when the inclination angle θ is hexagonal. Compared to the case where a point having an inclination angle of 90 degrees or less is set as the cut end point, the restrictions on the thickness and the hole diameter of the work material can be relaxed, and the hole processing on the work material is appropriately performed. be able to. (5) In the processing method of each embodiment other than the embodiment shown in FIG.
At 3, the nozzle is moved at a low speed in the normal processing direction without stopping the laser beam, and processing is switched to normal processing conditions at the processing start point P2. (6) For example, an incision end point is set on an elliptical hole or a curve having the largest curvature among hole processing lines irregularly formed by a smooth curve.
【００３３】この場合には、被加工材への穴加工をより
適正に行うことができる。In this case, it is possible to more appropriately form a hole in the workpiece.
【００３４】[0034]
【実施例】以下、本発明の実施例を説明する。被加工材
１１の材質ＳＳ４００、厚さ１６ｍｍに対し、直径が６
ｍｍの穴を明ける場合には、次のレーザ加工条件によ
る。前述した通常の加工条件として、レーザ出力：２０
００Ｗ、切断速度：８００ｍｍ／ｍｉｎ、アシストガス
（酸素ガス）圧：０．４Ｋｇ／ｃｍ2 を用いた。Embodiments of the present invention will be described below. The diameter is 6 with respect to the material SS400 of the workpiece 11 and the thickness of 16 mm.
When drilling a hole of mm, it depends on the following laser processing conditions. As the normal processing conditions described above, a laser output: 20
00 W, cutting speed: 800 mm / min, and assist gas (oxygen gas) pressure: 0.4 kg / cm 2 .
【００３５】又、前述した通常より低い加工条件とし
て、レーザ出力：９００Ｗ、切断速度：１００ｍｍ／ｍ
ｉｎ、アシストガス（酸素ガス）圧：０．４Ｋｇ／ｃｍ
2 を用いた。Further, as processing conditions lower than usual as described above, laser output: 900 W, cutting speed: 100 mm / m
in, assist gas (oxygen gas) pressure: 0.4 kg / cm
2 was used.
【００３６】[0036]
【発明の効果】以上説明したように、請求項１記載の発
明は、被加工材の厚さと穴径との制約を緩和することが
できるとともに、被加工材への穴加工を確実かつ適正に
行うことができるという優れた効果を奏する。As described above, according to the first aspect of the present invention, the restrictions on the thickness and the hole diameter of the workpiece can be alleviated, and the drilling of the workpiece can be performed reliably and properly. It has an excellent effect that it can be performed.
【００３７】請求項２記載の発明は、請求項１記載の発
明の効果に加えて切り込み溝の形成を確実かつ適正に行
うことができる。請求項３記載の発明は、請求項２記載
の発明の効果に加えてノズルを加工開始点まで復帰する
動作を行い、加工能率を向上することができる。According to the second aspect of the present invention, in addition to the effect of the first aspect, the formation of the cut groove can be performed reliably and appropriately. According to the third aspect of the invention, in addition to the effect of the second aspect of the invention, the operation of returning the nozzle to the processing start point can be performed, and the processing efficiency can be improved.
【００３８】請求項４記載の発明は、請求項１〜３のい
ずれかに記載の発明の効果に加えて楕円形又は複数の円
弧をウエブ状に形成した穴加工線に沿って被加工材への
穴加工をより適正に行うことができる。According to a fourth aspect of the present invention, in addition to the effects of the first to third aspects of the present invention, an elliptical or a plurality of circular arcs are formed on a workpiece along a hole forming line formed in a web shape. Can be performed more appropriately.
【００３９】請求項５記載の発明は、請求項１〜３のい
ずれかに記載の発明の効果に加えて角形の穴の加工をよ
り適正に行うことができる。請求項６記載の発明は、請
求項１記載の発明の効果に加えて加工能率を向上するこ
とができる。According to the fifth aspect of the invention, in addition to the effects of the first to third aspects, it is possible to more appropriately process a rectangular hole. The invention according to claim 6 can improve the processing efficiency in addition to the effect of the invention according to claim 1.
【図１】 この発明を具体化したレーザ加工方法の一実
施形態を示す平面図。FIG. 1 is a plan view showing an embodiment of a laser processing method embodying the present invention.
【図２】 （ａ），（ｂ），（ｃ）は、それぞれ導入溝
及び切り込み溝の加工工程を説明する平面図。FIGS. 2A, 2B, and 2C are plan views illustrating processing steps of an introduction groove and a cut groove, respectively.
【図３】 穴加工溝の加工工程を説明する平面図。FIG. 3 is a plan view illustrating a processing step of forming a hole processing groove.
【図４】 穴加工方法を説明する斜視図。FIG. 4 is a perspective view illustrating a hole drilling method.
【図５】 （ａ），（ｂ）は、それぞれ溝の加工工程を
示す断面図。FIGS. 5A and 5B are cross-sectional views each showing a groove processing step.
【図６】 被加工材の厚さと穴径との関係を示すグラ
フ。FIG. 6 is a graph showing a relationship between a thickness of a workpiece and a hole diameter.
【図７】 この発明の別の実施形態を示す平面図。FIG. 7 is a plan view showing another embodiment of the present invention.
【図８】 この発明の別の実施形態を示す平面図。FIG. 8 is a plan view showing another embodiment of the present invention.
【図９】 本発明の別の実施形態を示す平面図。FIG. 9 is a plan view showing another embodiment of the present invention.
【図１０】 本発明の別の実施形態を示す平面図。FIG. 10 is a plan view showing another embodiment of the present invention.
【図１１】 従来の穴の加工方法を示す平面図。FIG. 11 is a plan view showing a conventional hole processing method.
【図１２】 （ａ）は従来の加工方法により形成された
穴上部の形状を示す面図、（ｂ）は同じく穴下部の形状
を示す平面図。12A is a plan view showing the shape of the upper part of a hole formed by a conventional processing method, and FIG. 12B is a plan view showing the shape of the lower part of the hole.
【図１３】 レーザ加工方法により形成された溝の形状
を示す断面図。FIG. 13 is a sectional view showing the shape of a groove formed by a laser processing method.
１１…被加工材、１４…切断導入溝、１５…切り込み
溝、１６…穴加工溝、Ｐ１…ピアッシングポイント、Ｐ
２…切り込み開始点、Ｐ３…切り込み終了点、Ｐ４…切
り込み終了点Ｐ３の直前の点、Ｌ１…切断導入線、Ｌ２
…切り込み加工線、Ｌ３…穴加工線。11: Workpiece material, 14: Cutting introduction groove, 15: Cut groove, 16: Hole processing groove, P1: Piercing point, P
2: Cut start point, P3: Cut end point, P4: Point immediately before cut end point P3, L1: Cutting introduction line, L2
… Cut processing line, L3… hole processing line.
Claims (6)
材に照射するとともに、前記レーザ光に沿ってアシスト
ガスを噴射して穴加工するレーザ加工方法において、ピ
アッシングポイントから切断導入線に沿って穴加工線上
の加工開始点まで被加工材を切断した後、前記加工開始
点から穴加工線に沿って被加工材を切り込み終了点まで
切断して切り込み溝を形成し、その後、前記加工開始点
にノズルを戻して、該加工開始点から前記切り込み溝と
は反対方向に前記穴加工線に沿って前記切り込み終了点
まで被加工材を切断するレーザ加工方法。1. A laser processing method for irradiating a laser beam output from a nozzle onto a workpiece and injecting an assist gas along the laser beam to drill a hole, wherein the laser beam is emitted along a cutting introduction line from a piercing point. After cutting the work material to the processing start point on the hole processing line, the work material is cut from the processing start point along the hole processing line to the cutting end point to form a cut groove, and then the processing start point A laser processing method of returning a nozzle to the workpiece and cutting the workpiece from the processing start point to the cut end point along the hole processing line in a direction opposite to the cut groove.
切り込み終了点までの被加工材の切り込み切断は穴加工
線に部分的に行われ、切り込み加工条件は通常の切断加
工速度より遅い速度、かつ、通常のレ−ザ出力より低い
条件で行われるレーザ加工方法。2. The cutting method according to claim 1, wherein the incision and cutting of the workpiece from the machining start point to the incision end point are partially performed on a hole machining line, and the incision machining conditions are a speed lower than a normal cutting speed, Also, a laser processing method performed under conditions lower than a normal laser output.
した時点で一旦レ−ザ光及びアシストガスを停止させ、
ノズルを加工開始点まで戻し、該加工開始点において通
常の切断加工条件に切り替えるレーザ加工方法。3. The laser beam and the assist gas according to claim 2, wherein the laser beam and the assist gas are temporarily stopped when the cutting and cutting are completed.
A laser processing method in which a nozzle is returned to a processing start point and normal cutting processing conditions are switched at the processing start point.
工線は楕円形又は複数の円弧をウエブ状に形成したもの
であって、切り込み終了点は該穴加工線の曲率が最も大
きい曲線上に設定されているレーザ加工方法。4. The hole processing line according to claim 1, wherein the hole processing line is formed by forming an elliptical shape or a plurality of circular arcs into a web shape, and the cutting end point is a curve having the largest curvature of the hole processing line. The laser processing method set above.
込み終了点は角形の穴加工線の直線上に設定されている
レーザ加工方法。5. The laser processing method according to claim 1, wherein the cut end point is set on a straight line of a rectangular hole processing line.
み終了点は、加工開始点からの形成角が１８０度を越え
た点に設定され、切り込み溝の加工を通常の加工条件で
行った後、レーザ出力を停止した状態でノズルを、加工
開始点まで移動させ、該加工開始点で加工条件を通常の
切断加工速度よりも遅い加工条件に切り替えて、加工開
始点から前記切り込み終了点まで被加工材を切断するレ
ーザ加工方法。6. A cutting end according to claim 1, wherein the cutting end point of the cutting groove is set to a point at which the forming angle from the processing start point exceeds 180 degrees, and after processing the cutting groove under normal processing conditions, With the laser output stopped, the nozzle is moved to the processing start point, and at the processing start point, the processing conditions are switched to processing conditions lower than the normal cutting processing speed, and the processing is performed from the processing start point to the cutting end point. Laser processing method for cutting materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24024996A JP3516560B2 (en) | 1996-09-11 | 1996-09-11 | Laser processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24024996A JP3516560B2 (en) | 1996-09-11 | 1996-09-11 | Laser processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1085975A true JPH1085975A (en) | 1998-04-07 |
| JP3516560B2 JP3516560B2 (en) | 2004-04-05 |
Family
ID=17056685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24024996A Expired - Lifetime JP3516560B2 (en) | 1996-09-11 | 1996-09-11 | Laser processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3516560B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009134381A3 (en) * | 2008-04-30 | 2010-01-21 | Corning Incorporated | Laser scoring with curved trajectory |
| JP2015226916A (en) * | 2014-05-30 | 2015-12-17 | 株式会社アマダホールディングス | Laser processing method and laser processing head, and device |
| DE102015211403A1 (en) | 2015-06-22 | 2016-12-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method of reducing neck marks during laser cutting of workpiece parts |
| WO2018077762A1 (en) * | 2016-10-24 | 2018-05-03 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for cutting a workpiece using a laser beam |
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-
1996
- 1996-09-11 JP JP24024996A patent/JP3516560B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009134381A3 (en) * | 2008-04-30 | 2010-01-21 | Corning Incorporated | Laser scoring with curved trajectory |
| CN102066034A (en) * | 2008-04-30 | 2011-05-18 | 康宁股份有限公司 | Laser scoring with curved trajectory |
| US8035901B2 (en) | 2008-04-30 | 2011-10-11 | Corning Incorporated | Laser scoring with curved trajectory |
| JP2015226916A (en) * | 2014-05-30 | 2015-12-17 | 株式会社アマダホールディングス | Laser processing method and laser processing head, and device |
| DE102015211403A1 (en) | 2015-06-22 | 2016-12-22 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method of reducing neck marks during laser cutting of workpiece parts |
| DE102015211403B4 (en) | 2015-06-22 | 2022-01-27 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Process for reducing attachment marks when laser cutting workpiece parts |
| WO2018077762A1 (en) * | 2016-10-24 | 2018-05-03 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for cutting a workpiece using a laser beam |
| CN109862993A (en) * | 2016-10-24 | 2019-06-07 | 通快机床两合公司 | For the method by laser beam cutting workpiece |
| WO2020059533A1 (en) * | 2018-09-21 | 2020-03-26 | 株式会社アマダホールディングス | Laser cutting method and machine, and automatic programming device |
| JP2020044573A (en) * | 2018-09-21 | 2020-03-26 | 株式会社アマダホールディングス | Laser cutting method and device, and automatic programming device |
| US11813698B2 (en) | 2018-09-21 | 2023-11-14 | Amada Co., Ltd. | Laser cutting method and machine, and automatic programing apparatus |
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| Publication number | Publication date |
|---|---|
| JP3516560B2 (en) | 2004-04-05 |
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