JPH1084199A - Collet with adhesive agent transferring function and bonding method of electronic part - Google Patents
Collet with adhesive agent transferring function and bonding method of electronic partInfo
- Publication number
- JPH1084199A JPH1084199A JP8237582A JP23758296A JPH1084199A JP H1084199 A JPH1084199 A JP H1084199A JP 8237582 A JP8237582 A JP 8237582A JP 23758296 A JP23758296 A JP 23758296A JP H1084199 A JPH1084199 A JP H1084199A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- acceleration sensor
- collet
- mounting
- adhesive agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車等の安全機
器の電子回路基板等に搭載される電子部品（加速度セン
サ等）の実装用コレットおよび接着方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet for mounting electronic components (acceleration sensor and the like) mounted on an electronic circuit board and the like of a safety device such as an automobile and a bonding method.
【０００２】[0002]
【従来の技術】従来の自動車の安全機器等の電子回路基
板（以下基板という）に搭載される加速度センサの表面
実装について図３および図４を用いて説明する。図３は
従来の接着剤転写ヘッド及び加速度センサ吸着コレット
を示す図で、（ａ）は接着剤転写ヘッドの平面図、
（ｂ）はＢ−Ｂ断面図、（ｃ）は加速度センサ吸着コレ
ットの平面図、（ｄ）はＣ−Ｃ断面図ある。2. Description of the Related Art A conventional surface mounting of an acceleration sensor mounted on an electronic circuit board (hereinafter, referred to as a board) of a safety device of an automobile will be described with reference to FIGS. 3A and 3B are views showing a conventional adhesive transfer head and a collet for accelerating an acceleration sensor, and FIG.
(B) is a BB sectional view, (c) is a plan view of the acceleration sensor suction collet, and (d) is a CC sectional view.
【０００３】図４は従来の加速度センサの表面実装工程
を示す側断面図で、（ａ）は接着剤付着状態、（ｂ）は
接着剤転写状態、（ｃ）は加速度センサ吸着状態、
（ｄ）は加速度センサ装着状態、（ｅ）は加速度センサ
接着状態である。１００は接着剤転写ヘッド（以下転写
ヘッドと言う）で、接着剤供給部（常に水平面上に接着
剤を一定の厚さに塗布している。図示省略）よりダイボ
ンド接着剤（以下接着剤と言う）７０を転写ヘッド１０
０の接着剤転写部５１に付着させ、基板９０の加速度セ
ンサ８０の実装位置に接着剤７０を転写させるものであ
る。転写ヘッド１００は、実装機（図示省略）に取り付
けるシャンク部５２と本体部５０から構成されており、
本体部５０の端面部には接着剤７０を転写させる接着剤
転写部５１が形成されている。接着剤転写部５１は方形
の環状をしており外周形状は加速度センサ８０の外周よ
りやや大きい方形をしており、内側には加速度センサ８
０のスリット８２の外周形状と略等しい方形の凹部５３
が形成されている。FIGS. 4A and 4B are side sectional views showing a surface mounting process of a conventional acceleration sensor, wherein FIG. 4A shows an adhesive-attached state, FIG. 4B shows an adhesive-transferred state, FIG.
(D) shows a state where the acceleration sensor is mounted, and (e) shows a state where the acceleration sensor is bonded. Reference numeral 100 denotes an adhesive transfer head (hereinafter, referred to as a transfer head). A die bond adhesive (hereinafter, referred to as an adhesive) is supplied from an adhesive supply unit (an adhesive is constantly applied on a horizontal surface to a constant thickness; not shown). ) 70 to transfer head 10
The adhesive 70 is attached to the adhesive transfer section 51 of the substrate 90, and the adhesive 70 is transferred to the mounting position of the acceleration sensor 80 on the substrate 90. The transfer head 100 is composed of a shank part 52 and a main body part 50 which are attached to a mounting machine (not shown).
An adhesive transfer portion 51 for transferring the adhesive 70 is formed on an end surface of the main body 50. The adhesive transfer portion 51 has a rectangular annular shape, and has an outer peripheral shape slightly larger than the outer periphery of the acceleration sensor 80, and has an acceleration sensor 8 inside.
Square concave portion 53 substantially equal to the outer peripheral shape of the slit 82
Are formed.
【０００４】１１０は加速度センサ吸着コレット（以下
吸着コレットと言う）で、加速度センサ供給部（図示省
略）より加速度センサ８０を吸着し、基板９０に転写さ
れた接着剤７０の上に位置決め載置するものである。吸
着コレット１１０は実装機に取り付けるシャンク部６４
と本体部６０から構成されており、本体部６０の端面部
には加速度センサ保持部（加速度センサ８０が嵌合する
凹部）６１が形成されており、加速度センサ保持部の端
面部には案内部（面取り）６２が施されている。また、
吸着コレット１１０の中心部には加速度センサ８０を真
空吸着（矢印方向へ吸引）するための吸引孔６３が貫通
しており、吸引孔６３の先端部は真空発生器（図示省
略）に接続されている。[0004] Reference numeral 110 denotes an acceleration sensor suction collet (hereinafter, referred to as a suction collet) which sucks the acceleration sensor 80 from an acceleration sensor supply unit (not shown) and positions and mounts the adhesive sensor 70 on the adhesive 70 transferred to the substrate 90. Things. The suction collet 110 is used to mount the shank 64 to the mounting machine.
The main body 60 is formed with an acceleration sensor holding portion (a concave portion into which the acceleration sensor 80 is fitted) 61, and a guide portion is provided on the end surface of the acceleration sensor holding portion. (Chamfering) 62 is performed. Also,
A suction hole 63 for vacuum suction (suction in the direction of the arrow) of the acceleration sensor 80 penetrates through the center of the suction collet 110, and the tip of the suction hole 63 is connected to a vacuum generator (not shown). I have.
【０００５】次に、加速度センサの実装について説明す
る。先ず、転写ヘッド１００を接着剤供給部（平面上に
接着剤を一定の厚さに塗布している。図示省略）に移動
させ、転写ヘッド１００の接着剤転写部５１を接着剤供
給部の接着剤塗布面に接触させて、接着剤転写部５１に
接着剤７０を付着させ、転写ヘッド１００を基板９０の
加速度センサ搭載位置に移動させ、下降させて基板９０
の表面に接着剤７０を転写する。次に、吸着コレット１
１０を加速度センサ８０の供給部に移動させ、吸着コレ
ット１１０を下降させて加速度センサ８０を真空吸着さ
せる。次に、吸着コレット１１０を基板９０に転写され
た接着剤７０の上（加速度センサ搭載位置）に移動さ
せ、下降させて加速度センサ８０の吸引（真空状態）を
解除し加速度センサ８０を所定の位置（接着剤７０の
上）に載置する。そして、この状態で昇温すると接着剤
７０が流動し、加速度センサ８０の底部および外周側面
と基板９０の表面とに接着部７１が形成され、加速度セ
ンサ８０が基板９０の表面に固定される。Next, mounting of the acceleration sensor will be described. First, the transfer head 100 is moved to an adhesive supply section (adhesive is applied to a predetermined thickness on a flat surface; not shown), and the adhesive transfer section 51 of the transfer head 100 is bonded to the adhesive supply section. The transfer head 100 is moved to a position on the substrate 90 where the acceleration sensor is mounted, and then moved down to bring the substrate 90 into contact with the adhesive application surface.
The adhesive 70 is transferred to the surface of. Next, adsorption collet 1
10 is moved to the supply unit of the acceleration sensor 80, and the suction collet 110 is lowered to cause the acceleration sensor 80 to be vacuum-sucked. Next, the suction collet 110 is moved onto the adhesive 70 transferred to the substrate 90 (acceleration sensor mounting position), and is lowered to release the suction (vacuum state) of the acceleration sensor 80 and move the acceleration sensor 80 to a predetermined position. (On the adhesive 70). When the temperature rises in this state, the adhesive 70 flows, and an adhesive portion 71 is formed on the bottom and outer peripheral side surfaces of the acceleration sensor 80 and on the surface of the substrate 90, and the acceleration sensor 80 is fixed to the surface of the substrate 90.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上述の加速度
センサ８０の表面実装では、転写ヘッド１００と吸着コ
レット１１０とから構成されており設備費が高くなり、
しかも転写ヘッド１００と吸着コレット１１０の移動に
むだが発生し、実装時間の効率も悪くなるおそれがあ
る。また、接着剤７０の上に加速度センサ８０を載置す
るので、加速度センサ８０が接着された時に加速度セン
サ８０の弾性支持された慣性部８１の底部角部８３とス
リット８２に、接着剤７０が付着し弾性支持された慣性
部８１が固定される不具合が発生するおそれがある。However, the surface mounting of the acceleration sensor 80 described above is composed of the transfer head 100 and the suction collet 110, so that the equipment cost increases.
In addition, the movement of the transfer head 100 and the suction collet 110 is wasteful, and the efficiency of the mounting time may be reduced. In addition, since the acceleration sensor 80 is placed on the adhesive 70, the adhesive 70 is attached to the bottom corner 83 and the slit 82 of the elastically supported inertia 81 of the acceleration sensor 80 when the acceleration sensor 80 is bonded. There is a possibility that a problem in which the attached and elastically supported inertial portion 81 is fixed may occur.
【０００７】そこで、本発明は上述の問題を解決するも
ので、実装機の設備費が安く、実装効率がよく、しかも
実装品質のよい電子部品の表面実装を提供することを目
的とする。SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a surface mounting method of an electronic component having a low mounting equipment cost, a high mounting efficiency, and a high mounting quality.
【０００８】[0008]
【課題を解決するための手段】本発明は上述の目的を達
成するもので、電子部品を表面実装するコレットにおい
て、前記電子部品を位置決め吸着する凹部と、前記凹部
に接続され前記電子部品を真空吸着する吸引孔と、前記
凹部の外周端面部に前記接着剤を付着させ転写させる接
着剤転写部からなることを特徴とするものである。According to the present invention, there is provided a collet for surface mounting electronic components, a concave portion for positioning and sucking the electronic component, and a vacuum connecting the electronic component to the concave portion. It is characterized by comprising a suction hole to be adsorbed, and an adhesive transfer portion for attaching and transferring the adhesive to the outer peripheral end surface of the concave portion.
【０００９】また、基板の表面に接着剤を転写し該接着
剤にて電子部品を表面実装する電子部品の接着方法にお
いて、前記接着剤を前記電子部品の外周を囲むように転
写し、該電子部品の外周側面部と前記基板の表面とを該
接着剤にて接着固定するようにしたことを特徴とするも
のである。Further, in the method of bonding an electronic component, in which an adhesive is transferred to a surface of a substrate and the electronic component is surface-mounted with the adhesive, the adhesive is transferred so as to surround an outer periphery of the electronic component. The outer peripheral side surface of the component and the surface of the substrate are bonded and fixed with the adhesive.
【００１０】[0010]
【実施例】本発明の一実施例における加速度センサの表
面実装について図１および図２を用いて説明する。図１
は本発明の一実施例の接着剤転写機能付コレットを示す
図で、（ａ）は平面図、（ｂ）はＡ−Ａ断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Surface mounting of an acceleration sensor according to an embodiment of the present invention will be described with reference to FIGS. FIG.
1A is a diagram showing a collet with an adhesive transfer function according to an embodiment of the present invention, FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view along AA.
【００１１】図２は本発明の一実施例の加速度センサの
表面実装工程を示す側断面図で、（ａ）は接着剤付着状
態、（ｂ）は加速度センサ吸着状態、（ｃ）は接着剤転
写および加速度センサ装着状態、（ｄ）は加速度センサ
接着状態である。１は接着剤転写機能付コレット（以下
転写機能付コレットと言う）で、実装機（図示省略）に
取り付けるシャンク部１５と本体部１０から構成されて
おり、本体部１０には加速度センサ保持部（加速度セン
サ３０が嵌合する凹部）１３が形成されており、加速度
センサ保持部１３の端面部には全周にわたり案内部（面
取り）６２が施されている。また、転写機能付コレット
１の中心部には、加速度センサ３０を真空吸着（矢印方
向へ吸引）するための吸引孔１１が貫通しており、吸引
孔１１の先端部は真空発生器（図示省略）に接続されて
いる。また、本体部１０の端面部には、接着剤２０を基
板４０の表面に転写させる接着剤転写部１２が形成され
ている。接着剤転写部１２は加速度センサ３０の外周よ
りやや外側に方形の環状をしている。FIGS. 2A and 2B are side sectional views showing a surface mounting step of the acceleration sensor according to one embodiment of the present invention. FIG. 2A is a state in which an adhesive is adhered, FIG. 2B is a state in which the acceleration sensor is adsorbed, and FIG. The state where the transfer and the acceleration sensor are mounted is shown, and FIG. Reference numeral 1 denotes a collet with an adhesive transfer function (hereinafter, referred to as a collet with a transfer function), which is composed of a shank part 15 attached to a mounting machine (not shown) and a main body part 10, and the main body part 10 has an acceleration sensor holding part ( A recess (recess) 13 into which the acceleration sensor 30 is fitted is formed, and a guide portion (chamfer) 62 is provided on the end surface of the acceleration sensor holding portion 13 over the entire circumference. A suction hole 11 for vacuum suction (suction in the direction of the arrow) of the acceleration sensor 30 penetrates through the center of the collet 1 with a transfer function, and a tip of the suction hole 11 is a vacuum generator (not shown). )It is connected to the. An adhesive transfer section 12 for transferring the adhesive 20 to the surface of the substrate 40 is formed on an end surface of the main body 10. The adhesive transfer section 12 has a rectangular ring shape slightly outside the outer periphery of the acceleration sensor 30.
【００１２】接着剤２０は、例えばエポキシ樹脂系の絶
縁性の接着剤で比較的流動性があり、接着剤転写部に加
速度センサ３０を載置後は昇温し硬化させる。尚、導電
性を必要とする場合には、例えば銀配合のエポキシ樹脂
系の接着剤を用いればよい。加速度センサ３０は、方形
の立方体をしており外周より中央方向に向けてかぎ状の
スリット３２が厚み方向に貫通しており、弾性支持され
た慣性部（中央部）３１が形成されている。加速度セン
サ３０に加速度が加わると慣性部３１は加速度が加わわ
った逆方向へ移動する。そして、慣性部３１が移動する
とその移動量（移動による歪みの大きさ）に応じて加速
度センサ３０の抵抗値が変化するので、その変化する抵
抗値を端子部より取出し加速度に変換させる。加速度セ
ンサ３０は加速度を検出しようとする方向に慣性部３１
が作用するように用いられる。平常時には慣性部３１の
上下両面と加速度センサ３０の上下両面が面一となって
いる。加速度センサ３０を基板４０に直接実装すると、
慣性部３１の下面が基板４０の表面と密着した状態にな
り、慣性部３１が基板４０方向への移動が不能となるの
で、基板４０には加速度センサ３０の慣性部３１に対応
する大きさの凹部４１が形成されている。The adhesive 20 is, for example, an epoxy resin-based insulating adhesive having relatively fluidity, and is heated and hardened after the acceleration sensor 30 is mounted on the adhesive transfer portion. When conductivity is required, for example, an epoxy resin adhesive containing silver may be used. The acceleration sensor 30 has a rectangular cube shape, and has a key-shaped slit 32 penetrating in the thickness direction from the outer periphery toward the center, and has an elastically supported inertia portion (central portion) 31 formed therein. When acceleration is applied to the acceleration sensor 30, the inertia unit 31 moves in a direction opposite to the direction in which the acceleration is applied. Then, when the inertia part 31 moves, the resistance value of the acceleration sensor 30 changes according to the movement amount (the magnitude of the distortion due to the movement), and the changed resistance value is taken out from the terminal part and converted into acceleration. The acceleration sensor 30 has an inertia portion 31 in a direction in which acceleration is to be detected.
Is used to act. In normal times, the upper and lower surfaces of the inertia portion 31 and the upper and lower surfaces of the acceleration sensor 30 are flush. When the acceleration sensor 30 is directly mounted on the substrate 40,
Since the lower surface of the inertia portion 31 is in close contact with the surface of the substrate 40 and the inertia portion 31 cannot move in the direction of the substrate 40, the substrate 40 has a size corresponding to the inertia portion 31 of the acceleration sensor 30. A recess 41 is formed.
【００１３】次に、加速度センサの実装について説明す
る。先ず、転写機能付コレット１が接着剤供給部（平面
上に接着剤を一定の厚さに塗布している。図示省略）に
移動させ、転写機能付コレット１の接着剤転写部１２を
接着剤供給部の接着剤塗布面に接触させて、接着剤転写
部１２に接着剤２０を付着させる。次に、転写機能付コ
レット１を加速度センサ３０の供給部に移動させ、転写
機能付コレット１を下降させて加速度センサ３０を吸着
させる。次に、基板４０の加速度センサ搭載位置に移動
させ、転写機能付コレット１を下降させて基板４０の表
面に接着剤２０を転写すると同時に、加速度センサ３０
の吸引（真空状態）を解除し加速度センサ３０を所定の
位置に載置する。そして、この状態で昇温すると接着剤
２０が流動し、加速度センサ３０の外周側面と基板４０
の表面とに接着部２１が形成され、加速度センサ３０が
基板４０の表面に固定される。Next, mounting of the acceleration sensor will be described. First, the collet 1 with a transfer function is moved to an adhesive supply unit (adhesive is applied to a predetermined thickness on a flat surface; not shown), and the adhesive transfer unit 12 of the collet 1 with a transfer function is moved to the adhesive. The adhesive 20 is adhered to the adhesive transfer unit 12 by contacting the adhesive application surface of the supply unit. Next, the collet 1 with the transfer function is moved to the supply unit of the acceleration sensor 30, and the collet 1 with the transfer function is lowered so that the acceleration sensor 30 is sucked. Next, it is moved to the position where the acceleration sensor is mounted on the substrate 40 and the transfer function-equipped collet 1 is lowered to transfer the adhesive 20 onto the surface of the substrate 40, and at the same time,
Is released (vacuum state), and the acceleration sensor 30 is placed at a predetermined position. When the temperature rises in this state, the adhesive 20 flows, and the outer peripheral side surface of the acceleration sensor 30 and the substrate 40
The adhesion part 21 is formed on the surface of the substrate 40 and the acceleration sensor 30 is fixed to the surface of the substrate 40.
【００１４】以上説明したように本実施例によれば、接
着剤２０の転写部と加速度センサ３０のコレット（真空
吸着）部が一体に形成されているので、設備費が安くな
り、しかも一体化された転写機能付コレット１の動きに
むだがなくなり加速度センサ３０の実装効率が向上す
る。また、加速度センサ３０の外周側面と基板４０の表
面とに接着部２１が形成されるので、加速度センサ３０
の弾性支持された慣性部３１に、接着剤２０が付着し固
定される不具合の発生が防止できる。As described above, according to the present embodiment, since the transfer portion of the adhesive 20 and the collet (vacuum suction) portion of the acceleration sensor 30 are formed integrally, the equipment cost is reduced and the integration is reduced. The movement of the transferred collet 1 with transfer function is wasted, and the mounting efficiency of the acceleration sensor 30 is improved. Further, since the bonding portion 21 is formed on the outer peripheral side surface of the acceleration sensor 30 and the surface of the substrate 40, the acceleration sensor 30
The problem that the adhesive 20 adheres to the elastically supported inertia portion 31 and is fixed can be prevented.
【００１５】[0015]
【発明の効果】以上説明したように本発明によれば、電
子部品（加速度センサ等）の実装設備費が安くなり、し
かも実装効率が向上する。また、電子部品の表面実装品
質の向上を図ることができる。As described above, according to the present invention, the cost of mounting equipment for electronic components (acceleration sensors and the like) is reduced, and the mounting efficiency is improved. Further, the surface mounting quality of the electronic component can be improved.
【図１】本発明の一実施例の接着剤転写機能付コレット
を示す図で、（ａ）は平面図、（ｂ）はＡ−Ａ断面図あ
る。FIG. 1 is a diagram showing a collet with an adhesive transfer function according to one embodiment of the present invention, wherein (a) is a plan view and (b) is a cross-sectional view along AA.
【図２】本発明の一実施例の加速度センサの表面実装工
程を示す側断面図で、（ａ）は接着剤付着状態、（ｂ）
は加速度センサ吸着状態、（ｃ）は接着剤転写および加
速度センサ装着状態、（ｄ）は加速度センサ接着状態で
ある。FIGS. 2A and 2B are side sectional views showing a surface mounting process of the acceleration sensor according to one embodiment of the present invention, wherein FIG.
FIG. 3C shows an acceleration sensor suction state, FIG. 3C shows an adhesive transfer and acceleration sensor mounting state, and FIG.
【図３】従来の接着剤転写ヘッド及び加速度センサ吸着
コレットを示す図で、（ａ）は接着剤転写ヘッドの平面
図、（ｂ）はＢ−Ｂ断面図、（ｃ）は加速度センサ吸着
コレットの平面図、（ｄ）はＣ−Ｃ断面図ある。3A and 3B are views showing a conventional adhesive transfer head and an acceleration sensor suction collet, wherein FIG. 3A is a plan view of the adhesive transfer head, FIG. 3B is a BB cross-sectional view, and FIG. (D) is a cross-sectional view taken along the line CC.
【図４】従来の加速度センサの表面実装工程を示す側断
面図で、（ａ）は接着剤付着状態、（ｂ）は接着剤転写
状態、（ｃ）は加速度センサ吸着状態、（ｄ）は加速度
センサ装着状態、（ｅ）は加速度センサ接着状態であ
る。4A and 4B are side sectional views showing a surface mounting step of a conventional acceleration sensor, wherein FIG. 4A is a state in which an adhesive is attached, FIG. 4B is a state in which the adhesive is transferred, FIG. (E) is an acceleration sensor attached state, in which the acceleration sensor is attached.
１０・・・・・転写機能付コレット １１・・・・・吸引孔 １２・・・・・接着剤転写部 １３・・・・・加速度センサ保持部 １４・・・・・案内部 １５・・・・・シャンク ２０・・・・・接着剤 ２１・・・・・接着部 ３０・・・・・加速度センサ ３１・・・・・慣性部 ３２・・・・・スリット ４０・・・・・基板 ４１・・・・・凹部 10 Collet with transfer function 11 Suction hole 12 Adhesive transfer part 13 Acceleration sensor holding part 14 Guide part 15 ··· Shank 20 ····· Adhesive 21 ······················ Accelerometer 31 ······· Inertia part 32 ······ Slit 40 ····· Substrate 41 .... Recesses
Claims (2)
て、 前記電子部品を位置決め吸着する凹部と、 前記凹部に接続され前記電子部品を真空吸着する吸引孔
と、 前記凹部の外周端面部に前記接着剤を付着させ転写させ
る接着剤転写部からなることを特徴とする接着剤転写機
能付コレット。1. A collet for surface-mounting an electronic component, a concave portion for positioning and adsorbing the electronic component, a suction hole connected to the concave portion for vacuum adsorbing the electronic component, and an adhesive on an outer peripheral end surface of the concave portion. A collet with an adhesive transfer function, comprising an adhesive transfer section for attaching and transferring the adhesive.
て電子部品を表面実装する電子部品の接着方法におい
て、 前記接着剤を前記電子部品の外周を囲むように転写し、
該電子部品の外周側面部と前記基板の表面とを該接着剤
にて接着固定するようにしたことを特徴とする電子部品
の接着方法。2. An electronic component bonding method in which an adhesive is transferred to a surface of a substrate and the electronic component is surface-mounted with the adhesive, wherein the adhesive is transferred so as to surround an outer periphery of the electronic component.
A method for bonding electronic components, wherein an outer peripheral side surface of the electronic component and a surface of the substrate are bonded and fixed with the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8237582A JPH1084199A (en) | 1996-09-09 | 1996-09-09 | Collet with adhesive agent transferring function and bonding method of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8237582A JPH1084199A (en) | 1996-09-09 | 1996-09-09 | Collet with adhesive agent transferring function and bonding method of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1084199A true JPH1084199A (en) | 1998-03-31 |
Family
ID=17017462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8237582A Withdrawn JPH1084199A (en) | 1996-09-09 | 1996-09-09 | Collet with adhesive agent transferring function and bonding method of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1084199A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5299546B1 (en) * | 2012-08-24 | 2013-09-25 | 富士ゼロックス株式会社 | Holding device, mounting device, mounting method, and manufacturing method of substrate device |
-
1996
- 1996-09-09 JP JP8237582A patent/JPH1084199A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5299546B1 (en) * | 2012-08-24 | 2013-09-25 | 富士ゼロックス株式会社 | Holding device, mounting device, mounting method, and manufacturing method of substrate device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20031202 |