JPH1072602A - Production of sheet material having high thermal conductivity - Google Patents
Production of sheet material having high thermal conductivityInfo
- Publication number
- JPH1072602A JPH1072602A JP23224196A JP23224196A JPH1072602A JP H1072602 A JPH1072602 A JP H1072602A JP 23224196 A JP23224196 A JP 23224196A JP 23224196 A JP23224196 A JP 23224196A JP H1072602 A JPH1072602 A JP H1072602A
- Authority
- JP
- Japan
- Prior art keywords
- rolling
- powder
- plate
- thermal conductivity
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体基板のよう
に高熱伝導性が要求される用途に適した板材の製造に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the production of a plate material suitable for applications requiring high thermal conductivity, such as a semiconductor substrate.
【０００２】[0002]
【従来の技術】従来から、Ｃｕのように熱伝導性に優れ
た金属生地中にＭｏのような高融点金属粒子を分散させ
た板材は、放熱性に優れていることから半導体搭載用基
板のように高熱伝導性を要求される用途に用いられてい
る。2. Description of the Related Art Conventionally, a plate material in which high melting point metal particles such as Mo are dispersed in a metal material having excellent thermal conductivity, such as Cu, is excellent in heat dissipation, so that a substrate for mounting a semiconductor is used. Thus, it is used for applications requiring high thermal conductivity.
【０００３】このようなＣｕ−Ｍｏの板材の製造法とし
て、例えば特開平５−１２５４０７号公報に記載されて
いるように、Ｃｕ粉末とＭｏ粉末との混合粉末の圧粉体
を焼結し、圧延する方法がある。ところが、この焼結体
の圧延時には、以下の理由により歩留まりが低いという
問題がある。すなわち、Ｃｕ−Ｍｏ焼結体を圧延加工す
ると、Ｍｏは加工性に劣るために、この部分が低加工率
のうちに破断し、破壊の起源となって圧延材に圧延方向
と垂直なクラックが生じる。As a method for producing such a Cu-Mo plate material, for example, as described in JP-A-5-125407, a green compact of a mixed powder of Cu powder and Mo powder is sintered, There is a method of rolling. However, when this sintered body is rolled, there is a problem that the yield is low for the following reasons. That is, when the Cu-Mo sintered body is rolled, Mo is inferior in workability, so this portion is broken at a low working rate, and a crack perpendicular to the rolling direction is generated in the rolled material as a source of the fracture. Occurs.
【０００４】そこで、このような欠点を解消するため
に、特開平６−２１２３４０号公報には、Ｃｕ粉末とＭ
ｏ粉末の混合時に、Ｍｏ2Ｃ粉末や炭素粉末などの炭素
源粉末を同時に添加し、得られる焼結体の靭性を向上さ
せて圧延時の歩留まりを高めることが開示されている。
しかし、この対策では、半導体搭載用基板として使用す
るためにＮｉメッキ等の表面処理工程の際に、焼結体に
残留した未反応の炭素源粉末がＮｉメッキ皮膜とＣｕ−
Ｍｏ材との密着不良の原因となり、製品としての歩留ま
りを低下させる。[0004] In order to solve such a drawback, Japanese Unexamined Patent Publication No. Hei 6-212340 discloses that Cu powder and M
It is disclosed that at the time of mixing o powder, a carbon source powder such as Mo 2 C powder or carbon powder is added at the same time to improve the toughness of the obtained sintered body and increase the yield during rolling.
However, in this measure, unreacted carbon source powder remaining on the sintered body during a surface treatment step such as Ni plating for use as a substrate for mounting a semiconductor on the Ni plating film and Cu-
This causes poor adhesion to the Mo material and lowers the yield as a product.
【０００５】また、従来のＣｕ−Ｍｏ圧延板は一軸方向
圧延によって製造されており、その金属組織は圧延方向
にＭｏが繊維状に伸びたものであるため、圧延方向の熱
膨張係数が圧延方向と直角方向の熱膨張係数より小さい
という熱膨張係数の異方性を有している。そのため、半
導体素子と基板材料の熱膨張係数の近似が要求される半
導体素子と基板の接合工程において、半導体素子の破壊
に至る場合がある。[0005] Further, a conventional Cu-Mo rolled plate is manufactured by uniaxial rolling, and the metal structure thereof is such that Mo expands in a fiber shape in the rolling direction. And has an anisotropy of a thermal expansion coefficient that is smaller than a thermal expansion coefficient in a direction perpendicular to the direction. For this reason, in the bonding process between the semiconductor element and the substrate that requires approximation of the coefficient of thermal expansion between the semiconductor element and the substrate material, the semiconductor element may be broken.
【０００６】[0006]
【発明が解決しようとする課題】本願発明が解決しよう
とする課題は、Ｃｕ−Ｍｏのような熱伝導性金属粉末と
高融点粉末との混合粉末の焼結板の圧延において、割
れ、不純物の析出がなく、さらには、その特性に異方性
のない健全な焼結圧延板の製造方法を得ることにある。An object of the present invention is to solve the problem of cracks and impurities in rolling a sintered plate of a mixed powder of a heat conductive metal powder such as Cu-Mo and a high melting point powder. It is another object of the present invention to provide a method for producing a sound sintered rolled sheet having no precipitation and no anisotropy in its properties.
【０００７】[0007]
【課題を解決するための手段】本発明は、それぞれを粒
度調整した熱伝導性金属粉末と高融点粉末との混合粉末
の焼結板材を多軸方向に圧延することによってその課題
を解決した。SUMMARY OF THE INVENTION The present invention has solved the problem by rolling a sintered plate of a mixed powder of a heat conductive metal powder and a high melting point powder, each of which has its particle size adjusted, in a multiaxial direction.
【０００８】熱伝導性金属粉末の生地中に粒子の集合体
として存在する高融点粉末からなる焼結板を多軸方向に
圧延することによって、高融点粉末粒子の集合体は多方
向に延在することになり、高融点粉末粒子の熱伝導性金
属粉末の生地中に分散により特性の異方性が低減する。[0008] By rolling in a multiaxial direction a sintered plate made of a high melting point powder present as an aggregate of particles in a dough of heat conductive metal powder, the aggregate of the high melting point powder particles extends in multiple directions. Therefore, the anisotropy of the characteristics is reduced by dispersing the high-melting-point powder particles in the dough of the heat conductive metal powder.
【０００９】[0009]
【発明の実施の形態】熱伝導性金属としては、Ｃｕ、Ａ
ｇ、Ｃｕ−Ａｇ合金などの熱伝導性に優れ、且つ、塑性
加工性に優れた金属を用いることができ、また、高融点
金属としては、Ｍｏ、Ｗのような低い熱膨張係数を有す
る金属を用いることができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS Cu, A
g, a metal having excellent thermal conductivity, such as a Cu-Ag alloy, and having excellent plastic workability, and a metal having a low coefficient of thermal expansion such as Mo or W as a high melting point metal. Can be used.
【００１０】Ｃｕ粉末のような熱伝導性金属粉末の粒度
は、平均粒子径が５０μｍより大きいと焼結性が低下し
て焼結体中に粗大なポアが残り、このポアが圧延時に破
壊の起源となって加工性が低下するので、その平均粒子
径は５０μｍ以下が好適である。When the average particle diameter of the heat conductive metal powder such as Cu powder is larger than 50 μm, the sinterability is reduced, and coarse pores remain in the sintered body. The average particle diameter is preferably 50 μm or less, since it becomes the origin and the processability is reduced.
【００１１】Ｍｏ粉末の粒度については、平均粒子径が
０．５μｍ未満ではＭｏ粉末同士が凝集しているため、
Ｃｕ−Ｍｏ焼結体中にＭｏとＭｏの接触点が存在するこ
とになり、この接触点が圧延時に破壊の起点となって加
工性が低下する。一方、Ｍｏ粉末の平均粒子径が８μｍ
より大きくなると、２個以上の結晶粒から構成される単
一のＭｏ粒子が含まれるようになる。この場合はＣｕ−
Ｍｏ焼結体中にＭｏとＭｏの結晶粒界が存在することに
なり、この結晶粒界が圧延時に破壊の起点となって加工
性が低下する。したがってＭｏ粉末の平均粒子径は０．
５から８μｍの範囲が好ましい。Regarding the particle size of the Mo powder, if the average particle size is less than 0.5 μm, the Mo powders are aggregated.
Mo-Mo contact points are present in the Cu-Mo sintered body, and these contact points serve as starting points of fracture during rolling, resulting in reduced workability. On the other hand, the average particle diameter of the Mo powder is 8 μm.
As the size increases, a single Mo particle composed of two or more crystal grains is included. In this case, Cu-
Mo and Mo crystal grain boundaries will be present in the Mo sintered body, and these crystal grain boundaries will serve as starting points of fracture during rolling, resulting in reduced workability. Therefore, the average particle size of the Mo powder is 0.1.
A range from 5 to 8 μm is preferred.
【００１２】多軸圧延に供する板状焼結体としては、従
来の半導体搭載用基板の製造に供されている９０％以上
の密度を有するものが好ましい。As the plate-shaped sintered body to be subjected to the multiaxial rolling, one having a density of 90% or more used in the production of a conventional substrate for mounting a semiconductor is preferable.
【００１３】次に、多軸方向圧延の多軸方向としては、
焼結体の各辺に対して直角なクロスになっているのが、
その後の打ち抜きプレスエ程での材料歩留まりの点から
都合が良い。また、圧延の初期には熱間圧延を行う必要
があり、このときの加熱温度が６５０°Ｃより低い温度
では圧延材にクラックが発生するため加熱温度は６５０
°Ｃ以上でなければならない。さらに、圧延時の圧下率
が２５％より大きいとやはり圧延材にクラックが発生す
るため圧下率は２５％以下が望ましい。Next, as the multiaxial direction of the multiaxial rolling,
The cross at right angles to each side of the sintered body is
It is convenient from the viewpoint of the material yield in the subsequent punching and pressing process. Further, it is necessary to perform hot rolling at the beginning of rolling, and if the heating temperature at this time is lower than 650 ° C., cracks occur in the rolled material, so that the heating temperature is 650 ° C.
° C or higher. Further, if the rolling reduction at the time of rolling is larger than 25%, cracks will also occur in the rolled material, so the rolling reduction is desirably 25% or less.
【００１４】圧延材の熱膨張係数の異方性の点から、圧
延材の板面の組織を観察したときに、圧延した焼結体中
のＭｏのような高融点金属粉末粒子の短軸と長軸の比が
０．１以上かつ１以下の範囲内で加工する必要がある。
その理由は、高融点金属粉末粒子の短軸と長軸の比が
０．１以下では、短軸方向と長軸方向の熱膨張係数の差
が大きく、半導体搭載基板として使用した場合に半導体
素子が破壊してしまうためである。From the viewpoint of the anisotropy of the coefficient of thermal expansion of the rolled material, when observing the structure of the plate surface of the rolled material, the short axis of the high melting point metal powder particles such as Mo in the rolled sintered body was observed. It is necessary to work within a range of the ratio of the long axis of 0.1 or more and 1 or less.
The reason is that when the ratio of the short axis to the long axis of the refractory metal powder particles is 0.1 or less, the difference between the thermal expansion coefficients in the short axis direction and the long axis direction is large. Is to be destroyed.
【００１５】[0015]
【実施例】本発明を半導体搭載基板用として、熱伝導性
金属としてＣｕ、高融点金属としてＭｏを用いた例につ
いて示す。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention for a semiconductor mounting substrate using Cu as a heat conductive metal and Mo as a high melting point metal will be described.
【００１６】実施例１ Ｃｕ−Ｍｏ焼結体の圧延加工を行うに当たり、配合粉末
の平均粒子径が焼結体の圧延加工性に及ぼす影響を調べ
た。Example 1 In rolling a Cu-Mo sintered body, the effect of the average particle size of the compounded powder on the rolling workability of the sintered body was examined.
【００１７】平均粒子径が２０μｍの金属Ｃｕ粉末と平
均粒子径が０．５〜１３μｍの金属Ｍｏ粉末とをＭｏが
重量比で７０％となるように混合した後金型でプレス成
型し、寸法が２０×５０×５０ｍｍ3の圧粉体を得た。
これを温度１１００°Ｃから１２５０°Ｃの水素雰囲気
中で２時間焼結し、寸法が１６×４０×４０ｍｍ3で相
対密度が約９２％の焼結体とした。この焼結体を温度１
０５０°Ｃの窒素雰囲気中で２０分間保持し、圧下率約
２０％で厚さ３ｍｍまでは熱間圧延を行い、その後厚さ
０．５ｍｍまで圧下率約１０％で冷間圧延した。このと
きの圧延は焼結体の各辺に対して直角な多軸方向となる
ようにした。得られた圧延板から一辺が１０ｍｍの正方
形の平板を打ち抜いて圧延によるクラックの発生状況を
調べて良品率を算出した。図１にＭｏ粉末の平均粒子径
と良品率との関係として示す。A metal Cu powder having an average particle diameter of 20 μm and a metal Mo powder having an average particle diameter of 0.5 to 13 μm are mixed so that Mo becomes 70% by weight, and then press-molded with a metal mold. Was 20 × 50 × 50 mm 3 .
This was sintered in a hydrogen atmosphere at a temperature of 1100 ° C. to 1250 ° C. for 2 hours to obtain a sintered body having a size of 16 × 40 × 40 mm 3 and a relative density of about 92%. This sintered body was heated to
It was kept in a nitrogen atmosphere at 050 ° C. for 20 minutes, subjected to hot rolling at a rolling reduction of about 20% to a thickness of 3 mm, and then cold rolled to a thickness of 0.5 mm at a rolling reduction of about 10%. The rolling at this time was performed in a multiaxial direction perpendicular to each side of the sintered body. A square plate having a side of 10 mm was punched out from the obtained rolled plate, and the occurrence of cracks due to rolling was checked to calculate the yield rate. FIG. 1 shows the relationship between the average particle diameter of Mo powder and the yield rate.
【００１８】図１から、Ｍｏ粉末の平均粒子径が０．５
μｍ未満及び８μｍより大きい範囲では良品率が８０％
以下であり、圧延時にクラックが発生しやすいことがわ
かる。その原因を調べるため焼結体の組織を観察したと
ころ、平均粒子径が０．５μｍ未満の場合は、焼結体に
微細なＭｏ粒子の凝集体が多数観察された。このような
凝集体にはＭｏ粒子同士が直接接触する部分があり、圧
延加工の際にこの接触部が破壊の起源となって加工性が
低下することがわかった。一方、平均粒子径が８μｍ以
上の場合は、１個の粗大なＭｏ粒子の中に結晶粒界が存
在するものがあり、圧延中にその結晶粒界が破壊の起源
となって加工性が低下することがわかった。このことか
ら、Ｍｏ原料粉末の平均粒子径は０．５μｍから８μｍ
の範囲にあることが必要であることがわかる。FIG. 1 shows that the average particle diameter of the Mo powder is 0.5
80% non-defective rate in the range of less than μm and more than 8 μm
The following shows that cracks are likely to occur during rolling. When the structure of the sintered body was observed to investigate the cause, when the average particle diameter was less than 0.5 μm, many aggregates of fine Mo particles were observed in the sintered body. It has been found that there is a portion in which Mo particles are in direct contact with each other in such agglomerates, and the contact portion becomes a source of destruction during rolling, thereby reducing workability. On the other hand, when the average particle diameter is 8 μm or more, there is a grain boundary in one coarse Mo particle, and the grain boundary becomes a source of fracture during rolling, resulting in reduced workability. I found out. From this, the average particle diameter of the Mo raw material powder is 0.5 μm to 8 μm.
It is necessary to be within the range.
【００１９】実施例２ 次に、原料Ｃｕ粉末の平均粒子径が焼結体の圧延加工性
に及ぼす影響を調べた。Example 2 Next, the effect of the average particle size of the raw material Cu powder on the rolling workability of the sintered body was examined.
【００２０】平均粒子径が１．２〜７５μｍの金属Ｃｕ
粉末と平均粒子径が２．３μｍのＭｏ粉末とをＭｏが重
量比で３０％となるように混合した後金型でプレス成型
し、寸法が２０×５０×５０ｍｍ3の圧粉体を得た。こ
れを温度１０５０°Ｃの水素雰囲気中で２時間焼結し
た。これらの焼結体を温度１０５０°Ｃの窒素雰囲気中
で２０分間保持し、圧下率約２５％で厚さ３ｍｍまでは
熱間圧延を行い、その後厚さ０．５ｍｍまで圧下率約１
０％で冷間圧延した。このときの圧延は焼結体の各辺に
対して直角な多軸方向となるようにした。得られた圧延
板から一辺が１０ｍｍの正方形の平板を打ち抜いて圧延
によるクラックの発生状況を調べて良品率を算出し、図
２にＣｕ粉末の平均粒子径と良品率との関係として示し
た。Metal Cu having an average particle size of 1.2 to 75 μm
The powder was mixed with Mo powder having an average particle diameter of 2.3 μm so that the Mo content was 30% by weight, followed by press molding with a mold to obtain a compact having dimensions of 20 × 50 × 50 mm 3 . . This was sintered in a hydrogen atmosphere at a temperature of 1050 ° C. for 2 hours. These sintered bodies are held in a nitrogen atmosphere at a temperature of 1050 ° C. for 20 minutes, hot-rolled to a thickness of 3 mm at a rolling reduction of about 25%, and then reduced to a thickness of 0.5 mm by about 1 mm.
Cold rolled at 0%. The rolling at this time was performed in a multiaxial direction perpendicular to each side of the sintered body. From the obtained rolled plate, a square flat plate having a side of 10 mm was punched out, the occurrence of cracks due to rolling was examined, and the yield rate was calculated. FIG. 2 shows the relationship between the average particle diameter of the Cu powder and the yield rate.
【００２１】図２から、Ｃｕ粉末の平均粒子径が５０μ
ｍ以上では良品率が８０％以下であり、圧延時にクラッ
クが発生しやすい事がわかる。その原因を調べるため焼
結体の組織を観察したところ、平均粒子径が７５μｍの
場合は、焼結性が低下したため粗大なポアが多数存在
し、このポアが破壊の起源となってＣｕ−Ｍｏ材の加工
性が低下する事がわかった。従って、Ｃｕ原料粉末の平
均粒子径としては５０μｍ以下であることが必要であ
る。FIG. 2 shows that the average particle size of the Cu powder is 50 μm.
m or more, the non-defective rate is 80% or less, which indicates that cracks are likely to occur during rolling. Observation of the structure of the sintered body to investigate the cause revealed that, when the average particle diameter was 75 μm, a large number of coarse pores were present due to reduced sinterability, and these pores became the origin of fracture and Cu—Mo It was found that the workability of the material was reduced. Therefore, the average particle diameter of the Cu raw material powder needs to be 50 μm or less.
【００２２】実施例３ Ｃｕ−Ｍｏ焼結体の圧延加工における多軸圧延の有効性
を調べるため、まず最初に熱間圧延時の加熱温度を種々
変化させて実験を行った。Example 3 In order to examine the effectiveness of multiaxial rolling in rolling of a Cu—Mo sintered body, first, an experiment was conducted by changing the heating temperature during hot rolling in various ways.
【００２３】平均粒子径が２０μｍの金属Ｃｕ粉末と平
均粒子径が４μｍのＭｏ粉末とをＭｏが重量比で４０％
となるように混合した後金型でプレス成型し、寸法が２
０×５０×５０ｍｍ3の圧粉体を得た。これを温度１１
５０°Ｃの水素雰囲気中で２時間焼結し、寸法が１６×
４０×４０ｍｍ3で相対密度が約９２％の焼結体とし
た。この焼結体を温度５５０°Ｃから１０５０°Ｃの窒
素雰囲気中で２０分間保持し、圧下率約２０％で厚さ３
ｍｍまでは熱間圧延を行い、その後厚さ０．５ｍｍまで
圧下率約１０％で冷間圧延した。このときの圧延は焼結
体の各辺に対して直角な多軸方向となるようにした。得
られた圧延板から一辺が１０ｍｍの正方形の平板を打ち
抜いて圧延によるクラックの発生状況を調べて良品率を
算出し、図３に加熱温度と歩留まりの関係として示し
た。比較例として、他の条件は実施例と同一で、圧延の
みを１軸圧延とした場合の結果も図３に示した。A metal Cu powder having an average particle diameter of 20 μm and a Mo powder having an average particle diameter of 4 μm were mixed with Mo by 40% by weight.
After press-molding with a mold, the size is 2
A compact of 0 × 50 × 50 mm 3 was obtained. Temperature 11
Sintered in a hydrogen atmosphere at 50 ° C for 2 hours, the dimensions are 16 ×
A sintered body of 40 × 40 mm 3 and a relative density of about 92% was obtained. This sintered body was kept in a nitrogen atmosphere at a temperature of 550 ° C. to 1050 ° C. for 20 minutes, and a thickness of 3% with a reduction of about 20%.
mm, followed by cold rolling at a rolling reduction of about 10% to a thickness of 0.5 mm. The rolling at this time was performed in a multiaxial direction perpendicular to each side of the sintered body. From the obtained rolled plate, a square flat plate having a side of 10 mm was punched out, the occurrence of cracks due to rolling was checked, and the yield rate was calculated. FIG. 3 shows the relationship between the heating temperature and the yield. As a comparative example, other conditions were the same as those of the example, and the result when only the rolling was uniaxial rolling is also shown in FIG.
【００２４】１軸圧延の場合、加熱温度が９５０°Ｃ以
上では平板の歩留まりが８０％以上であるが、加熱温度
が８５０°Ｃ以下では圧延中にＣｕ−Ｍｏ板に圧延方向
と垂直なクラックが発生し、これが拡大して板材が破断
するため圧延が不可能となった。クラックが発生した直
後の圧延材の、圧延方向及び圧延方向と直角方向の組織
を観察すると、Ｍｏ粒子が繊維状に細長く伸びており、
ところどころで破断している様子が見られた。In the case of uniaxial rolling, when the heating temperature is 950 ° C. or more, the yield of the flat plate is 80% or more, but when the heating temperature is 850 ° C. or less, cracks perpendicular to the rolling direction are formed on the Cu—Mo plate during rolling. Occurred, and this expanded to break the sheet material, making it impossible to roll. Observation of the rolling direction and the structure in the direction perpendicular to the rolling direction of the rolled material immediately after the occurrence of cracks shows that the Mo particles are elongated in a fibrous form,
Some parts were broken.
【００２５】一方、多軸圧延の場合は加熱温度が６５０
°Ｃ以上であれば平板の歩留まりは８０％以上であり、
Ｃｕ−Ｍｏの加工に有効であることがわかる。しかし、
加熱温度が５５０°Ｃ以下では１軸圧延の場合と同様Ｃ
ｕ−Ｍｏ板材が破断するため、圧延時の加熱温度は６５
０°Ｃ以上とする必要がある。また、１軸圧延でクラッ
クが発生した場合と同じ加工率の圧延材において、圧延
方向の組織を観察したところ、Ｍｏ粒子はどちらの圧延
軸に関しても均等に伸びており、偏平状に加工されてい
ることがわかった。このように、多軸圧延を行うとＭｏ
粒子が繊維状とならず偏平状となって破断しにくくなる
ため、結果として加工性が向上するものと思われる。On the other hand, in the case of multiaxial rolling, the heating temperature is 650.
° C or more, the yield of the flat plate is 80% or more,
It turns out that it is effective for processing of Cu-Mo. But,
When the heating temperature is 550 ° C. or lower, C is the same as in the case of uniaxial rolling.
Since the u-Mo plate material breaks, the heating temperature during rolling is 65
The temperature must be 0 ° C. or higher. In addition, when the microstructure in the rolling direction was observed in a rolled material having the same working ratio as that when cracks occurred in uniaxial rolling, the Mo particles were uniformly stretched in both rolling shafts, and were processed into a flat shape. I knew it was there. Thus, when multi-axis rolling is performed, Mo
Since the particles are not fibrous but flat and hard to break, it is thought that the processability is improved as a result.
【００２６】実施例４ 次に、多軸圧延時の最適な圧下率を調べるため、実施例
３において加熱温度を８５０°Ｃと一定として、圧下率
を種々変化させて実験を行ない、得られた平板の歩留ま
りと圧下率の関係を図４に示した。Example 4 Next, in order to investigate the optimum rolling reduction in the multiaxial rolling, an experiment was carried out by changing the rolling reduction variously in Example 3 while keeping the heating temperature constant at 850 ° C. FIG. 4 shows the relationship between the yield of the flat plate and the rolling reduction.
【００２７】図４から、１軸圧延の場合圧下率が１０％
以下では平板の歩留まりが９０％以上である事がわか
る。また、圧下率が１５％以上では圧延中にＣｕ−Ｍｏ
板に圧延方向と垂直なクラック発生し、これが拡大して
板材が破断するため圧延が不可能となった。一方、多軸
圧延の場合は圧下率が２５％以下であれば平板の良品率
は８０％以上であり、多軸圧延によりＣｕ−Ｍｏの加工
が効率的に行えることがわかる。しかし、圧下率が２５
％以上より大きくなると１軸圧延の場合と同様Ｃｕ−Ｍ
ｏ板材が破断するため、圧延時の圧下率は２５％以下と
する必要がある。 実施例５ さらに、圧延方法が基板材料の熱膨張係数の異方性に及
ぼす影響を調べるため、以下の実験を行った。Ｍｏの含
有量が重量比で８０％で、相対密度が９０％であるＣｕ
−Ｍｏ焼結体に実施例３と同様の多軸圧延を行った。た
だし、加熱温度は１０５０°Ｃ、圧下率は５％であっ
た。また、多軸圧延を行う場合に、焼結体の各辺に対す
る圧延回数を変化させてＣｕ−Ｍｏ中のＭｏ粒子の短軸
と長軸の比を変化させた。圧延板から試料を採取し、各
圧延方向の熱膨張係数を測定すると共に、圧延板の組織
観察を行って次式によりＭｏ粒子の短軸と長軸の比（軸
比）を算出し、軸比と熱膨張係数の関係を図５に示し
た。FIG. 4 shows that the rolling reduction is 10% in the case of uniaxial rolling.
In the following, it is understood that the yield of the flat plate is 90% or more. When the rolling reduction is 15% or more, Cu-Mo
Cracks were generated in the sheet perpendicular to the rolling direction, and the cracks were enlarged and the sheet material was broken, so that rolling was impossible. On the other hand, in the case of multiaxial rolling, if the rolling reduction is 25% or less, the non-defective rate of the flat plate is 80% or more, and it can be seen that the processing of Cu-Mo can be efficiently performed by the multiaxial rolling. However, the rolling reduction is 25
% Or more, Cu-M as in the case of uniaxial rolling.
oSince the sheet material breaks, the rolling reduction during rolling needs to be 25% or less. Example 5 Further, the following experiment was conducted in order to investigate the effect of the rolling method on the anisotropy of the thermal expansion coefficient of the substrate material. Cu having a Mo content of 80% by weight and a relative density of 90%
The same multiaxial rolling as in Example 3 was performed on the -Mo sintered body. However, the heating temperature was 1050 ° C. and the rolling reduction was 5%. In addition, when performing multiaxial rolling, the ratio of the short axis to the long axis of Mo particles in Cu-Mo was changed by changing the number of times of rolling on each side of the sintered body. A sample is taken from the rolled sheet, the coefficient of thermal expansion in each rolling direction is measured, the structure of the rolled sheet is observed, and the ratio of the short axis to the long axis of Mo particles (axis ratio) is calculated by the following equation. FIG. 5 shows the relationship between the ratio and the coefficient of thermal expansion.
【００２８】軸比＝Ｍｏ粒子の短軸方向の長さ／Ｍｏ粒
子の長軸方向の長さ また、比較例として１軸圧延を行った場合の結果も同時
に示した。図５から、１軸圧延の場合は軸比が小さく熱
膨張係数の異方性が大であり、多軸圧延を行う事によ
り、軸比が１に近づくとともに熱膨張係数の異方性が小
さくなることがわかる。Axial ratio = length of Mo particle in the short axis direction / length of Mo particle in the long axis direction The results of uniaxial rolling as a comparative example are also shown. From FIG. 5, in the case of uniaxial rolling, the axial ratio is small and the anisotropy of the thermal expansion coefficient is large. By performing multiaxial rolling, the axial ratio approaches 1 and the anisotropy of the thermal expansion coefficient is reduced. It turns out that it becomes.
【００２９】次に、熱膨張係数の異方性が半導体搭載用
基板としての特性に及ぼす影響を調べたところ、プラス
チックパッケージにおいては軸比が０．１以上、セラミ
ックパッケージにおいては軸比が０．５以上であれば半
導体搭載用基板として十分使用可能である事がわかっ
た。Next, the effect of the anisotropy of the coefficient of thermal expansion on the characteristics of the substrate for mounting a semiconductor was examined. The axial ratio of the plastic package was 0.1 or more, and the axial ratio of the ceramic package was 0.1. It has been found that if it is 5 or more, it can be sufficiently used as a semiconductor mounting substrate.
【００３０】[0030]
【発明の効果】本発明によって以下の効果を奏する。According to the present invention, the following effects can be obtained.
【００３１】（１）Ｃｕ−Ｍｏ焼結体の圧延加工におい
て、圧延時のクラックの発生を抑制し、歩留まりが向上
する。(1) In rolling processing of a Cu—Mo sintered body, generation of cracks during rolling is suppressed, and the yield is improved.
【００３２】（２）圧延軸方向による熱膨張係数の異方
性がなくなり、とくに、半導体搭載基板として使用した
場合に、信頼性が向上する。(2) The anisotropy of the thermal expansion coefficient in the rolling axis direction is eliminated, and the reliability is improved especially when used as a semiconductor mounting substrate.
【図１】 圧延焼結体中の高融点金属粉末粒子の平均粒
子径と良品率との関係を示す。FIG. 1 shows the relationship between the average particle size of refractory metal powder particles in a rolled sintered body and the yield rate.
【図２】 高熱伝導金属粉末粒子の平均粒子径と良品率
との関係を示す。FIG. 2 shows the relationship between the average particle size of high thermal conductive metal powder particles and the yield rate.
【図３】 多軸圧延時の平板の歩留まりと加熱温度の関
係を示す。FIG. 3 shows the relationship between the yield of a flat plate and the heating temperature during multiaxial rolling.
【図４】 得られた平板の歩留まりと圧下率の関係を示
す。FIG. 4 shows the relationship between yield and rolling reduction of the obtained flat plate.
【図５】 圧延焼結体中の高融点粒子の短軸と長軸との
軸比と熱膨張係数の関係を示す。FIG. 5 shows the relationship between the axial ratio of the short axis and the long axis of the high melting point particles in the rolled sintered body and the coefficient of thermal expansion.
Claims (6)
末と高融点金属粉末との混合粉末を板状圧粉体とし、こ
れを焼結後、この焼結板材を多軸方向に圧延することを
特徴とする高熱伝導性を有する板材の製造方法。1. A mixed powder of a heat conductive metal powder and a high melting point metal powder, each having a controlled particle size, is made into a plate-shaped green compact, and after sintering, the sintered plate is rolled in a multiaxial direction. The manufacturing method of the board | plate material which has high thermal conductivity characterized by the above-mentioned.
性金属粉末と高融点粉末が、それぞれの平均粒子径が５
０μｍ以下と、０．５から８μｍであることを特徴とす
る高熱伝導性を有する板材の製造方法。2. The heat conductive metal powder and the high melting point powder whose particle size has been adjusted according to claim 1 have an average particle diameter of 5
A method for producing a plate material having high thermal conductivity, which is 0 μm or less and 0.5 to 8 μm.
９０％以上の密度を有することを特徴とする高熱伝導性
を有する板材の製造方法。3. A method for producing a plate having high thermal conductivity, wherein the sintered plate according to claim 1 has a density of 90% or more of the theoretical density.
ｕであり、且つ、高融点粉末がＭｏであることを特徴と
する高熱伝導性を有する板材の製造方法。4. The heat conductive metal powder according to claim 1, wherein
u, and the high melting point powder is Mo, a method for producing a plate material having high thermal conductivity.
件が、圧延の初期においては、加熱温度が６５０°Ｃ以
上、圧下率が２５％以下での熱間圧延であり、かつ、圧
延板内のＭｏ粒子の短軸と長軸の比が０．１以上、１以
下となるように圧延することを特徴とする高熱伝導性を
有する板材の製造方法。5. The condition for rolling in the multiaxial direction according to claim 1, wherein in the initial stage of rolling, hot rolling is performed at a heating temperature of 650 ° C. or more and a rolling reduction of 25% or less, and A method for producing a plate having high thermal conductivity, characterized in that rolling is performed so that the ratio of the short axis to the long axis of Mo particles in a rolled sheet is 0.1 or more and 1 or less.
高熱伝導性を有する板材が半導体搭載用基板であること
を特徴とする高熱伝導性を有する板材の製造方法。6. A method for manufacturing a plate having high thermal conductivity, wherein the plate having high thermal conductivity according to any one of claims 1 to 5 is a semiconductor mounting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23224196A JPH1072602A (en) | 1996-09-02 | 1996-09-02 | Production of sheet material having high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23224196A JPH1072602A (en) | 1996-09-02 | 1996-09-02 | Production of sheet material having high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1072602A true JPH1072602A (en) | 1998-03-17 |
Family
ID=16936190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23224196A Withdrawn JPH1072602A (en) | 1996-09-02 | 1996-09-02 | Production of sheet material having high thermal conductivity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1072602A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012132489A1 (en) * | 2011-03-25 | 2012-10-04 | 株式会社アライドマテリアル | Molybdenum material |
-
1996
- 1996-09-02 JP JP23224196A patent/JPH1072602A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012132489A1 (en) * | 2011-03-25 | 2012-10-04 | 株式会社アライドマテリアル | Molybdenum material |
| JP2012201930A (en) * | 2011-03-25 | 2012-10-22 | Allied Material Corp | Molybdenum material |
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