JPH1070222A - Packaged component cooling structure - Google Patents
Packaged component cooling structureInfo
- Publication number
- JPH1070222A JPH1070222A JP22540796A JP22540796A JPH1070222A JP H1070222 A JPH1070222 A JP H1070222A JP 22540796 A JP22540796 A JP 22540796A JP 22540796 A JP22540796 A JP 22540796A JP H1070222 A JPH1070222 A JP H1070222A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- cooling
- pressing
- fixing
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子機器が内蔵す
る制御基板等に実装される実装部品の冷却構造に関す
る。近年、電子機器の高機能化に伴い、使用される制御
基板の高密度実装、実装される半導体装置等の高集積化
が進んできている。そして、半導体装置の高集積化によ
る多ピン化が進んで端子強度が低下すると共に、発熱量
が増加する傾向にある。発熱量が増加すると、冷却する
ためにヒートシンク（冷却ファン、冷却コールドプレー
ト等の放熱器）が必要となり、実装部品に直接取り付け
られる。そのため、実装部品への荷重を緩和しつつ効果
的な冷却を行う構造のものが求められている。[0001] 1. Field of the Invention [0002] The present invention relates to a cooling structure for mounted components mounted on a control board or the like incorporated in an electronic device. 2. Description of the Related Art In recent years, as electronic devices have become more sophisticated, control boards to be used have been mounted at higher density, and semiconductor devices and the like to be mounted have been increasingly integrated. As the number of pins increases due to higher integration of semiconductor devices, the terminal strength tends to decrease and the amount of heat generated tends to increase. When the calorific value increases, a heat sink (a radiator such as a cooling fan or a cooling cold plate) is required for cooling, and is directly attached to the mounted component. Therefore, there is a demand for a structure having a structure that performs effective cooling while reducing the load on the mounted components.
【０００２】[0002]
【従来の技術】図９に、従来の冷却構造の構成図を示
す。図９（Ａ）は要部側面図、図９（Ｂ）は要部平面図
である。図９（Ａ），（Ｂ）に示す冷却構造１１は、プ
リント基板１２上に半導体素子１３がその入出力端子１
３ａをはんだ付け等を行って実装され、該半導体素子１
３上にヒートシンク１４が高熱伝導部材１５を介在させ
て位置される。2. Description of the Related Art FIG. 9 shows a configuration diagram of a conventional cooling structure. 9A is a side view of a main part, and FIG. 9B is a plan view of a main part. In the cooling structure 11 shown in FIGS. 9A and 9B, a semiconductor element 13
3a is mounted by soldering or the like.
The heat sink 14 is positioned on the heat sink 3 with the high heat conductive member 15 interposed therebetween.
【０００３】ヒートシンク１４は、水冷コールドプレー
トであり、内部に流路１４ａが形成されて配管口１４ｂ
1 ，１４ｂ2 より冷媒が供給されて循環される。また、
高熱伝導部材１５は、半導体素子１３の熱をヒートシン
ク１４に効率よく伝えるためのもので、接着剤として固
着したり、又はサーマルコンパウンドやサーマルシート
等として挟み込み、バネ等でヒートシンク１４を機械的
に加圧固定することが行われる。The heat sink 14 is a water-cooled cold plate, in which a flow path 14a is formed and a pipe port 14b is formed.
Refrigerant is supplied from 1 and 14b 2 and circulated. Also,
The high heat conductive member 15 is for efficiently transmitting the heat of the semiconductor element 13 to the heat sink 14, and is fixed as an adhesive or sandwiched as a thermal compound, a thermal sheet, or the like, and mechanically applies the heat sink 14 with a spring or the like. Pressure fixing is performed.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上述のよう
に、ヒートシンク１４は半導体素子１３にのみ荷重され
る構造であり、半導体素子１３が高速化、高機能化、Ｍ
ＣＭ（マルチチップモジュール）化による発熱量の増加
からヒートシンク１４が大型化して重量増加及び接合強
度増加してくると共に、ピン数の増加に伴う端子の強度
低下を生じて接合による荷重の増加に対処できなくな
り、効率よく冷却を行うことができないという問題があ
る。However, as described above, the heat sink 14 has a structure in which only the semiconductor element 13 is loaded.
The heat generated by the CM (multi-chip module) increases and the heat sink 14 increases in size to increase the weight and the joining strength. In addition, the strength of the terminals decreases with the increase in the number of pins, thereby coping with the increase in the load due to the joining. There is a problem that cooling cannot be performed efficiently.
【０００５】また、半導体素子１３上にヒートシンク１
４を接着剤で接着固定する場合、半導体素子１３のパッ
ケージ材質（セラミック等の低熱膨脹率のものが多い）
とヒートシンク１４の材質（銅、アルミニウム等の熱伝
導率の高い金属が一般的に用いられる）の熱膨脹差（接
着時から使用中の温度上昇）を吸収する必要性から、例
えばヒートシンク側の接着面を細分化する等ヒートシン
ク構造に制約を受けるという問題があると共に、半導体
素子１３の修理、交換に際して作業性からヒートシンク
１４を大型化することができないことから冷却性能に制
限が生じ、またはんだ溶解除去に際してヒートシンク１
４をも加熱する必要があって加熱時間の増加により実装
部品を劣化させることになるという問題がある。A heat sink 1 is provided on the semiconductor element 13.
In the case where 4 is bonded and fixed with an adhesive, the package material of the semiconductor element 13 (often a low thermal expansion coefficient such as ceramic).
In order to absorb the difference in thermal expansion (temperature rise during bonding and during use) between the material of the heat sink 14 and the material of the heat sink 14 (a metal having a high thermal conductivity such as copper or aluminum is generally used), for example, the bonding surface on the heat sink side In addition, there is a problem that the heat sink structure is restricted, for example, by subdividing the heat sink structure, and the cooling performance is limited because the heat sink 14 cannot be enlarged due to workability when repairing or replacing the semiconductor element 13, or the heat sink structure is removed. Heat sink 1
4 also needs to be heated, and there is a problem that the mounting component is deteriorated due to an increase in the heating time.
【０００６】そこで、本発明は上記課題に鑑みなされた
もので、実装部品への荷重を緩和しつつヒートシンクと
の接合を強化して冷却性能の向上を図り、また素子交換
等の容易性を図る実装部品の冷却構造を提供することを
目的とする。In view of the above, the present invention has been made in view of the above-mentioned problems, and aims at improving the cooling performance by strengthening the connection with the heat sink while reducing the load on the mounted components, and also facilitates element replacement and the like. An object of the present invention is to provide a cooling structure for mounted components.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、請求項１では、基板上に実装された所定数の素子に
対して冷却を行う冷却手段が設けられた実装部品の冷却
構造において、前記冷却手段を、前記素子に対して前記
基板側の垂直方向に押圧して固定する第１の押圧手段
と、該冷却手段を、前記素子に対して水平方向に押圧し
て固定する第２の押圧手段と、を有する実装部品の冷却
構造が構成される。In order to solve the above-mentioned problems, a first aspect of the present invention relates to a cooling structure of a mounted component provided with cooling means for cooling a predetermined number of elements mounted on a substrate. A first pressing unit that presses and fixes the cooling unit in a vertical direction on the substrate side with respect to the element, and a second pressing unit that presses and fixes the cooling unit in a horizontal direction with respect to the element. , And a cooling structure for a mounted component having the pressing means.
【０００８】請求項２では、請求項１記載の第２の押圧
手段は、前記基板上に植設された所定数のうち何れかの
固定部材に形成される突起部が前記素子を水平方向に押
圧してなる。請求項３では、請求項２において、請求項
１記載の第１の押圧手段は前記固定部材に固定された弾
性部材で前記素子を垂直方向に押圧してなる。According to a second aspect of the present invention, in the second pressing means, the protrusion formed on any one of a predetermined number of fixing members planted on the substrate horizontally moves the element. Press. According to a third aspect, in the second aspect, the first pressing means according to the first aspect is configured to vertically press the element with an elastic member fixed to the fixing member.
【０００９】請求項４では、請求項３記載の第１の押圧
手段は、前記弾性部材による前記素子に対する押圧力を
調整する調整手段が設けられる。請求項５では、請求項
２記載の固定部材は、該固定部材の取り付けに対して前
記基板を補強する補強部材を介して該基板に植設され
る。According to a fourth aspect, the first pressing means according to the third aspect is provided with an adjusting means for adjusting a pressing force of the elastic member against the element. In a fifth aspect, the fixing member according to the second aspect is implanted in the substrate via a reinforcing member that reinforces the substrate with respect to the attachment of the fixing member.
【００１０】請求項６では、請求項１記載の冷却手段
に、接触される前記素子を取り外すための素子分離部材
が設けられる。請求項７では、請求項１又は６記載の冷
却手段に、前記素子との接触面に所定数の溝が形成され
てなる。According to a sixth aspect of the present invention, the cooling means according to the first aspect is provided with an element separating member for detaching the contacted element. In a seventh aspect, the cooling means according to the first or sixth aspect has a predetermined number of grooves formed on a contact surface with the element.
【００１１】請求項８では、請求項１又は２記載の第２
の押圧手段は、複数の前記素子のそれぞれに対応する隣
接の前記冷却手段の少なくとも複数に対して前記水平方
向に押圧してなる。上述のように請求項１の発明では、
基板に実装された素子に設けられた冷却手段を、第１の
押圧手段で素子側の垂直方向に押圧し、第２の押圧手段
で水平方向に押圧して固定する。これにより、冷却手段
に加わる外力を第１及び第２の押圧手段で受けることに
なり、実装部品への荷重が緩和されると共に、実装部品
と冷却手段の接合が強化されて冷却性能の向上を図るこ
とが可能となる。[0011] According to claim 8, the second aspect according to claim 1 or 2 is provided.
The pressing means presses at least a plurality of adjacent cooling means corresponding to each of the plurality of elements in the horizontal direction. As described above, in the invention of claim 1,
The cooling means provided on the element mounted on the substrate is pressed by the first pressing means in the vertical direction on the element side, and is pressed by the second pressing means in the horizontal direction and fixed. As a result, the external force applied to the cooling means is received by the first and second pressing means, and the load on the mounted component is reduced, and the joining between the mounted component and the cooling means is strengthened, thereby improving the cooling performance. It becomes possible to plan.
【００１２】請求項２，５又は８の発明では、第２の押
圧手段は、基板に適宜補強部材を介して固定部材が植設
され、形成された突起部で対応する冷却手段又は適宜隣
接の冷却手段の何れか複数に対して押圧する。これによ
り、冷却手段を水平方向に容易、確実に固定することが
可能となり、外力の影響が緩和されて冷却性能の向上を
図ることが可能となる。According to the second, fifth or eighth aspect of the present invention, the second pressing means has a fixing member implanted on the substrate via a reinforcing member as appropriate, and the corresponding cooling means or a suitable adjoining member is formed by a projection formed. Pressing any one of the plurality of cooling means. This makes it possible to easily and reliably fix the cooling means in the horizontal direction, thereby alleviating the influence of external force and improving the cooling performance.
【００１３】請求項３又は４の発明では、第１の押圧手
段が弾性部材を固定部材に適宜調整手段で押圧力調整自
在に取り付けて冷却手段を垂直方向に押圧する。これに
より、冷却手段を実装部品への荷重を緩和しつつ垂直方
向に容易、確実に固定することが可能となって外力の影
響が緩和され、冷却性能の向上を図ることが可能とな
る。According to the third or fourth aspect of the invention, the first pressing means presses the cooling means in the vertical direction by attaching the elastic member to the fixing member so that the pressing force can be adjusted by an appropriate adjusting means. As a result, the cooling means can be easily and reliably fixed in the vertical direction while reducing the load on the mounted component, so that the influence of external force is reduced and cooling performance can be improved.
【００１４】請求項６又は７の発明では、冷却手段に素
子分離手段を設けて素子を取り外し、適宜素子接触面に
所定数の溝を形成する。これにより、素子と冷却手段と
の間に熱伝導部材が介在されたときに、余分な熱伝導部
材を溝内に廻り込ませて熱抵抗を均一にして冷却性能の
向上を図り、実装部品から熱伝導部材で密着状態の冷却
手段の取り外し作業を該実装部品に不要な力を加えるこ
となく行うことが可能となる。According to the sixth or seventh aspect of the present invention, the element is detached by providing the element separating means in the cooling means, and a predetermined number of grooves are formed on the element contact surface as appropriate. With this, when a heat conducting member is interposed between the element and the cooling means, an extra heat conducting member is wrapped around the groove to make the heat resistance uniform and improve the cooling performance, thereby improving the cooling performance. The work of removing the cooling means in close contact with the heat conducting member can be performed without applying unnecessary force to the mounted component.
【００１５】[0015]
【発明の実施の形態】図１に、本発明の一実施例の構成
図を示す。図１（Ａ）を本発明における実装部品の冷却
構造２１の側面図、図１（Ｂ）は図１（Ｂ）の要部部分
側面図である。図１（Ａ），（Ｂ）において、プリント
基板２２上に実装部品の例として半導体素子２３が入出
力端子２３ａをはんだ付けにより実装されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a configuration diagram of an embodiment of the present invention. 1A is a side view of a cooling structure 21 for a mounted component according to the present invention, and FIG. 1B is a side view of a main part of FIG. 1B. 1A and 1B, a semiconductor element 23 is mounted on a printed board 22 by soldering an input / output terminal 23a as an example of a mounted component.
【００１６】また、半導体素子２３の周囲であって四隅
に対応する部分に固定部材としての固定ピン２４1 〜２
４4 （２４3 ，２４4 は図示せず、図２参照）がプリン
ト基板２２上にネジ等により固定されて植設される。ま
た、固定ピン２４1 ，２４2には、図１（Ａ），（Ｂ）
に示すように、対応する板ばね２５1 ，２５2 がネジ止
めされるもので、板ばね２５1 ，２５2 は屈曲形状で突
起部として形成される。上記固定ピン２４1 〜２４4 及
び板ばね２５1 ，２５2 により第２の押圧手段が構成さ
れる。Further, the fixing pin 24 21 to as a fixed member in a portion corresponding to the four corners a periphery of the semiconductor element 23
4 4 (24 3 and 24 4 are not shown, see FIG. 2) are fixed on the printed circuit board 22 with screws or the like and implanted. Also, the fixing pins 24 1 and 24 2 have the structure shown in FIGS.
As shown in ( 1) , the corresponding leaf springs 25 1 and 25 2 are screwed, and the leaf springs 25 1 and 25 2 are formed as projections in a bent shape. The fixing pin 24 1-24 4 and the leaf spring 25 1, 25 2 by the second pressing means is constituted.
【００１７】一方、半導体素子２３上にはサーマルコン
パウンド等の高熱伝導部材２６を介して冷却手段である
ヒートシンク２７が密着状態で配置される。このヒート
シンク２７は、固定ピン２４1 〜２４4 の板ばね２５1
〜２５4 により互いに対向する方向に付勢され、半導体
素子２３に対して水平方向に押圧されて固定される。な
お、ヒートシンク２７は、前述と同様に水冷コールドプ
レートであり、配管２７ａ，２７ｂより内部で連通する
流路が形成されたもので、配管２７ａ，２７ｂより冷媒
が供給されて該流路を循環されて半導体素子２３を冷却
するものである。On the other hand, on the semiconductor element 23, a heat sink 27 as a cooling means is disposed in close contact with a high thermal conductive member 26 such as a thermal compound. The heat sink 27 is fixed pin 24 1-24 4 of the leaf spring 25 1
Is biased in a direction opposite to each other by 25 4, it is fixed by being pressed in the horizontal direction with respect to the semiconductor element 23. The heat sink 27 is a water-cooled cold plate similarly to the above, and is formed with a flow path communicating internally with the pipes 27a and 27b. A refrigerant is supplied from the pipes 27a and 27b and circulated through the flow path. To cool the semiconductor element 23.
【００１８】また、各固定ピン２４1 〜２４4 の上端に
は、第１の押圧手段である弾性部材２８の取付部２８ａ
1 〜２８ａ4 がネジにより取り付けられる。この弾性部
材２８は押圧部２８ｂの四隅より屈曲させた取付部２８
ａ1 〜２８ａ4 （２８ａ3 ，２８ａ4 は図に表われず）
が延出するもので、板ばねとしての作用でヒートシンク
２７を半導体素子２３側の垂直方向に押圧する。Further, the upper end of the fixed pin 24 1-24 4, the mounting portion 28a of the elastic member 28 is a first pressing means
1 ~28a 4 is attached by a screw. The elastic member 28 is attached to the mounting portion 28 bent from four corners of the pressing portion 28b.
a 1 to 28a 4 (28a 3 and 28a 4 are not shown in the figure)
Extends, and presses the heat sink 27 in the vertical direction on the semiconductor element 23 side by the action of a leaf spring.
【００１９】ここで、図２に、図１のヒートシンクへの
押圧状態の説明図を示す。図２（Ａ）は固定ピン２４1
〜２４4 によるヒートシンク２７の押圧状態を示したも
ので、ヒートシンク２７は四隅を平面上切欠面２７1 〜
２７4 が形成され、一方で固定ピン２４3 ，２４4 が該
切欠面２７1 〜２７4 と当接する当接面が形成される。
そして、ヒートシンク２７の切欠面２７1 ，２７2 を固
定ピン２４1 ，２４2の板ばね２５1 ，２５2 で矢印方
向に押圧することで、切欠面２７3 ，２７4 を固定ピン
２４3 ，２４4 の当接面に押し付ける。Here, FIG. 2 is an explanatory view showing a state of pressing the heat sink of FIG. FIG. 2A shows the fixing pin 24 1.
24 4 shows the pressed state of the heat sink 27 by the heat sink 27 on a plane four corners notched surface 27 1 -
27 4 are formed, while the fixing pins 24 3, 24 4 is in contact with the notch surface 27 1-27 4 equivalent abutment surface is formed.
Then, the notched surfaces 27 1 , 27 2 of the heat sink 27 are pressed in the direction of the arrow by the leaf springs 25 1 , 25 2 of the fixing pins 24 1 , 24 2 so that the notched surfaces 27 3 , 27 4 are fixed to the fixing pins 24 3 , 24 3 . pressed against the abutment surface 24 4.
【００２０】これによって、ヒートシンク２７に加わる
半導体素子２３の水平方向の外力（重力、振動・衝撃荷
重、配管からの反力等）が主に固定ピン２４1 〜２４4
が受けるようになり、半導体素子２３の入出力端子２３
ａを機械的に保護することができ、端子接続の信頼性を
向上させることができる。また、半導体素子２３の入出
力端子２３ａへの必要強度が低減できることから、端子
のさらなる微細高密度化が可能になるものである。As a result, the horizontal external force (gravity, vibration / impact load, reaction force from the pipe, etc.) of the semiconductor element 23 applied to the heat sink 27 is mainly caused by the fixing pins 24 1 to 24 4.
And the input / output terminals 23 of the semiconductor element 23
a can be mechanically protected, and the reliability of terminal connection can be improved. Further, since the required strength of the input / output terminals 23a of the semiconductor element 23 can be reduced, the terminals can be further finely densified.
【００２１】また、図２（Ｂ）に示すように、第１の押
圧手段を構成する弾性部材２８が板状の押圧部２８ｂの
四隅より略段差状に取付部２８ａ1 〜２８ａ4 が一体的
に延出され、該取付部２８ａ1 〜２８ａ4 の先端が固定
ピン２４1 〜２４4 の上端にネジ２９1 〜２９4 でそれ
ぞれ固定される。なお、取付部２８ａ1 〜２８ａ4 は、
ヒートシンク２７の配管２７ａ，２７ｂに干渉しないよ
うに延出される。Further, as shown in FIG. 2 (B), integral mounting portion 28a 1 ~28a 4 within Ryakudan Sajo from four corners of the elastic member 28 constituting the first pressing means plate-like pressing portion 28b to extend the tip of the mounting portion 28a 1 ~28a 4 are respectively fixed with screws 29 1-29 4 on the upper end of the fixing pin 24 1-24 4. Incidentally, the attachment portion 28a 1 ~28a 4 is
It extends so that it may not interfere with piping 27a and 27b of heat sink 27.
【００２２】この弾性部材２８は、固定ピン２４1 〜２
４4 に取り付けられることによって、ヒートシンク２７
を半導体素子２３側の垂直方向に押圧して固定するもの
で、該ヒートシンク２７が半導体素子２３より引き離す
方向に外力が働いても垂直方向の加圧状態が維持される
ものである。The elastic member 28 includes fixing pins 24 1 to 24 2.
4 by being attached to the 4, the heat sink 27
Is pressed and fixed in the vertical direction on the semiconductor element 23 side, so that even if an external force acts in a direction in which the heat sink 27 is separated from the semiconductor element 23, the vertically pressed state is maintained.
【００２３】これにより、高熱伝導部材２６を介してヒ
ートシンク２７を半導体素子２３に接触状態を良好に密
着させることができ、安定した冷却性能を実現すること
ができるものである。また、ヒートシンク２７を半導体
素子２３に接着固定する必要がないことから、該ヒート
シンク２７の構造上の制約がなく、固定ピン２４1 〜２
４4 による押圧と相俟って重量制限においても緩和さ
れ、高性能化、大型化を容易とすることができ、大型化
しても容易に取り外すことができることから半導体素子
２３の修理、交換の作業の容易化かつ時間短縮化を図る
ことができるものである。As a result, the heat sink 27 can be brought into good contact with the semiconductor element 23 via the high thermal conductive member 26, and stable cooling performance can be realized. Further, since it is not necessary to bond the heat sink 27 to the semiconductor element 23, there is no restriction on the structure of the heat sink 27, and the fixing pins 24 1 to 24 2
4 4 is also relaxed in the weight limit I pressed coupled with by higher performance, it is possible to facilitate size, repair of the semiconductor element 23 because it can be easily removed even if large, the work of replacement And the time can be reduced.
【００２４】また、ヒートシンク２７の半導体素子２３
への垂直方向への押圧を固定ピン２４1 〜２４4 の上端
に固定することから、プリント基板２２に取り付ける必
要がなく、半導体素子２３の周辺の配線禁止エリアが減
少して、基板の信号層数の削減、コスト削減が可能とな
るものである。The semiconductor element 23 of the heat sink 27
Since the vertical pressing is fixed to the upper ends of the fixing pins 24 1 to 24 4 , it is not necessary to attach the printed circuit board 22 to the printed circuit board 22, and the wiring prohibited area around the semiconductor element 23 is reduced. The number and cost can be reduced.
【００２５】次に、図３に、図１の固定ピンの他の固定
方法の説明図を示す。図３（Ａ）は要部側面図、図３
（Ｂ）は要部底面図、図３（Ｃ）は部分斜視図である。
上述の図１の固定ピン２４1 〜２４4 はプリント基板２
２に直接取り付けた場合を示したが、図３（Ａ）〜
（Ｃ）は各固定ピン２４1 〜２４4 を、プリント基板２
２の裏面にネジ３０1 〜３０4 で取り付けた枠状の補強
部材３１に取り付けたものである。Next, FIG. 3 is an explanatory view of another fixing method of the fixing pin of FIG. FIG. 3A is a side view of a main part, and FIG.
FIG. 3B is a bottom view of a main part, and FIG. 3C is a partial perspective view.
Fixing pins 24 1-24 4 in the above Figure 1 printed circuit board 2
FIG. 3 (A) to FIG.
(C) is a respective fixing pins 24 1-24 4, the printed circuit board 2
2 of the back surface is formed by attaching the frame-like reinforcing member 31 attached with screws 30 1 to 30 4.
【００２６】すなわち、プリント基板２２には固定ピン
２４1 〜２４4 に対応する部分に貫通孔２２1 〜２２4
が形成され、この貫通孔２２1 〜２２4 に下部にネジ切
部２４ａが形成された各固定ピン２４1 〜２４4 が貫通
される。一方、枠状の補強部材３１の四隅部分には各固
定ピン２４1 〜２４4 の向きを合わせるための段差３１
ａがそれぞれ形成されると共に、各段差３１ａ部分に取
付孔３１ｂが形成される。[0026] That is, through the portion corresponding to the fixing pins 24 1-24 4 the printed circuit board 22 hole 22 1-22 4
There are formed, each of the fixed pin 24 1-24 4 thread cut portion 24a at the bottom is formed is penetrated into the through-holes 22 1 to 22 4. On the other hand, the step for the frame-shaped four corner portions of the reinforcing member 31 to adjust the orientation of each fixing pin 24 1-24 4 31
are formed, and a mounting hole 31b is formed in each step 31a.
【００２７】そこで、プリント基板２２の貫通孔２２1
〜２２4 を貫通した固定ピン２４1〜２４4 がさらに補
強部材３１の段差３１ａで向きが合わせられて貫通孔３
１ｂをネジ切部２４ａが貫通する。そして、補強部材３
１の裏面よりナット３２1 〜３２4 でそれぞれの該固定
ピン２４1 〜２４4 を固定するものである。Therefore, the through hole 22 1 of the printed circuit board 22
To 22 4 are combined faces at penetrating fixing pin 24 1-24 4 further step 31a of the reinforcing member 31 through hole 3
1b is threaded by a threaded portion 24a. And the reinforcing member 3
1 than in the nut 32 1-32 4 backside is intended to fix the respective said fixing pins 24 1-24 4.
【００２８】これにより、補強部材３１は、ヒートシン
ク２７の装着によって固定ピン２４ 1 〜２４4 の側面に
作用する横方向（水平方向）の力を直接受ける構造とな
ることから、半導体素子２３の周辺でのプリント基板２
２の反り変形が防止され、該半導体素子２３の入出力端
子２３ａの接続部分の信頼度を向上させることができる
ものである。Thus, the reinforcing member 31 is connected to the heat sink.
The fixing pin 24 is 1~ 24FourOn the side
A structure that directly receives the lateral (horizontal) force that acts
Therefore, the printed circuit board 2 around the semiconductor element 23
2 is prevented from being warped, and the input / output end of the semiconductor element 23 is prevented.
The reliability of the connection part of the child 23a can be improved.
Things.
【００２９】続いて、図４に、図１のヒートシンクの他
の構造例の説明図を示す。図１に示したヒートシンク２
７は水冷コールドプレートの場合を示したもので、図４
（Ａ），（Ｂ）は空冷フィンのヒートシンク４１，４２
を示したものである。図４（Ａ）に示すヒートシンク４
１は、半導体素子２３に当接する当接部４１ａ上に所定
数のフィン４１ｂが一体で形成されたもので、四隅に上
記固定ピン２４1 〜２４4 （一部は板ばね２５1 ，２５
2 ）と当接させるための切欠部４１ｃ1 〜４１ｃ4 が形
成されたものである。Next, FIG. 4 is an explanatory view of another example of the structure of the heat sink of FIG. Heat sink 2 shown in FIG.
FIG. 7 shows the case of a water-cooled cold plate.
(A) and (B) are heat sinks 41 and 42 of air cooling fins.
It is shown. Heat sink 4 shown in FIG.
Reference numeral 1 denotes a predetermined number of fins 41b integrally formed on a contact portion 41a that contacts the semiconductor element 23, and the fixing pins 24 1 to 24 4 (partly leaf springs 25 1 , 25
Notch 41c 1 ~41c 4 for abutting and 2) in which it is formed.
【００３０】また、図４（Ｂ）に示すヒートシンク４２
は、半導体素子２３に当接する当接部４２ａ上に所定数
のフィン４２が一体で形成されたもので、四隅に上記固
定ピン２４1 〜２４4 を貫通させるための貫通孔４２ｃ
1 〜４２ｃ4 が形成されたものである。この貫通孔４２
ｃ1 〜４２ｃ4 に固定ピン２４1 〜２４4 が貫通された
状態では、該貫通孔４２ｃ1 ，４２ｃ2 内で板ばね２５
1 ，２５2 が水平方向に押圧して、貫通孔４２ｃ3 ，４
２ｃ4 内で他の固定ピン２４3 ，２４4 に押し付けて固
定するものである。また、後述の図６で示す固定ピン自
体を屈曲させて突起部を形成し、突起部の押圧作用で押
圧固定させてもよい。The heat sink 42 shown in FIG.
It is intended that the fins 42 of a predetermined number are formed integrally on the abutting portion 42a abuts on the semiconductor element 23, through holes 42c for passing the fixing pins 24 1-24 4 at four corners
1 to 42c 4 are formed. This through hole 42
c 1 in a state where the fixing pin 24 1-24 4 is penetrating in ～42C 4, the leaf spring 25 in the through hole 42c 1, 42c within 2
1 and 25 2 are pressed in the horizontal direction, and the through holes 42 c 3 and 4 are pressed.
Other fixing pins 24 3 2c within 4 is for fixing against the 24 4. Alternatively, a projection may be formed by bending a fixing pin itself shown in FIG. 6 described later, and the projection may be pressed and fixed by a pressing action of the projection.
【００３１】なお、上記空冷式のヒートシンク４１，４
２は、例えばアルミニウム等の高熱伝導金属により一体
に形成されるものである。続いて、図５及び図６に、図
１の他の押圧方法の説明図を示す。図５（Ａ）及び図６
（Ａ）は要部側面図、図５（Ｂ）及び図６（Ｂ）はヒー
トシンクでの押圧部分の要部平面図を示したものであ
る。また、図６（Ｃ）は他の弾性部材の構成図を示した
ものである。The air-cooled heat sinks 41, 4
Numeral 2 is integrally formed of a high heat conductive metal such as aluminum. Next, FIGS. 5 and 6 are explanatory diagrams of another pressing method in FIG. FIGS. 5A and 6
(A) is a side view of a main part, and FIGS. 5 (B) and 6 (B) are plan views of a main part of a pressed portion of the heat sink. FIG. 6C shows a configuration diagram of another elastic member.
【００３２】図５（Ａ），（Ｂ）は、ヒートシンク２７
（ヒートシンク４１も同様）の四隅に切欠部２７1a（２
７2a〜２７4a）が形成されており、プリント基板２２に
実装された半導体素子２３の四隅外周に植設された固定
ピン５１1 （５１2 〜５１4）が、上記切欠部２７1a
（２７2a〜２７4a）に対応する位置に突起部としての中
太形状の押圧部５１ａが一体で形成される。また、固定
ピン５１1 （５１2 〜５１4 ）の上端及び下端にはボル
ト部５１ｂ，５１ｃが形成されると共に、プリント基板
２２上に位置されるフランジ５１ｄが形成される。FIGS. 5A and 5B show the heat sink 27.
The notches 271a (2
72A～274a) are formed, the fixing pins 51 1 implanted in the four corners periphery of the semiconductor element 23 mounted on the printed circuit board 22 (51 2-51 4), the notch 271a
At a position corresponding to (272a to 274a), a middle thick pressing portion 51a as a projection is integrally formed. The upper end and the bolt portion 51b at the lower end of the locking pin 51 1 (51 2 to 51 4), with 51c is formed, the flange 51d which is positioned on the printed circuit board 22 is formed.
【００３３】一方、プリント基板２２には固定ピン５１
1 （５１2 〜５１4 ）が植設される位置に貫通孔２２1
（２２2 〜２２4 ）が形成され、また枠状の補強部材３
１には固定ピン５１1 （５１2 〜５１4 ）のボルト部５
１ｃに螺合するネジ切り部３１ａが形成される。すなわ
ち、固定ピン５１1 （５１2 〜５１4 ）がプリント基板
２２の貫通孔２２1 （２２2 〜２２4 ）を貫通させて補
強部材３１のネジ切り部３１ａと螺合して固定され、押
圧部５１ａがヒートシンク２７の切欠部２７1a（２７2a
〜２７4a）を当接して水平方向に押圧する。On the other hand, fixing pins 51 are
1 (51 2 to 51 4) through holes 22 1 to the position is implanted
(22 2-22 4) is formed, also frame-shaped reinforcing member 3
The bolt portion of the locking pin 51 1 to 1 (51 2 to 51 4) 5
A threaded portion 31a to be screwed into 1c is formed. That is, the fixing pin 51 1 (51 2 to 51 4) is fixed screwed with the threaded portion 31a of the reinforcing member 31 by penetrating the through hole 22 1 of the printed circuit board 22 (22 2-22 4), pressing The portion 51a is a notch 271a (272a
To 274a) and pressed in the horizontal direction.
【００３４】また、固定ピン５１1 （５１2 〜５１4 ）
の上部のボルト部５１ｂには弾性部材２８における取付
部２８ａ1 （２８ａ2 〜２８ａ4 ）の取付孔が嵌合さ
れ、押圧力の調整手段としての加圧調整ネジ５２1 （５
２2 〜５２4 ）で弾性部材２８によるヒートシンク２７
への半導体素子２３側の垂直方向の押圧力を調整するも
のである。Further, the fixing pin 51 1 (51 2 to 51 4)
The mounting holes of the mounting portions 28a 1 (28a 2 to 28a 4 ) of the elastic member 28 are fitted to the bolt portions 51b at the upper part of the elastic member 28, and the pressure adjusting screw 52 1 (5) as the pressing force adjusting means.
22 2 to 52 4 ), the heat sink 27 by the elastic member 28
The vertical pressing force on the semiconductor element 23 side is adjusted.
【００３５】すなわち、ヒートシンク２７への水平方向
の押圧は、固定ピン５１1 （５１2〜５１4 ）が自身で
撓んでその弾性変位で行い、該ヒートシンクへの垂直方
向の押圧は加圧調整ネジ５２1 （５２2 〜５２4 ）によ
って適宜調整される。これにより、固定ピン５１1 （５
１2 〜５１4 ）の構造が簡易となりコスト削減を図るこ
とができる。また、固定ピン５１1 （５１2 〜５１4 ）
を補強部材３１に固定することから、プリント基板２２
上への固定手段が削減し、これによって半導体素子周辺
基板の配線禁止エリアが減少し、基板の信号層数削減、
コスト削減を図ることができるものである。[0035] That is, the horizontal direction of the pressing to the heat sink 27 is carried out in the elastically displaced deflected by fixing pins 51 1 (51 2 to 51 4) is itself vertical pressing pressurized adjustment screw to said heat sink 52 is appropriately adjusted by 1 (52 2 to 52 4). Thereby, the fixing pins 51 1 (5
Structure 1 2-51 4) can be achieved cost reduction becomes simple. The fixed pin 51 1 (51 2 to 51 4)
Is fixed to the reinforcing member 31, the printed circuit board 22
The number of fixing means on the top is reduced, thereby reducing the wiring-prohibited area of the semiconductor element peripheral board, reducing the number of signal layers on the board,
The cost can be reduced.
【００３６】続いて、図６（Ａ）〜（Ｃ）において、ヒ
ートシンク２７（図４（Ｂ）のヒートシンク４２も同
様）の四隅には貫通孔２７1b（２７2b〜２７4b）が形成
されており、プリント基板２２に実装された半導体素子
２３の四隅外周に植設された固定ピン５３1 （５３2 〜
５３4 ）が、上記貫通孔２７1b（２７2b〜２７4b）内に
対応する位置に突起部としての屈曲形状の押圧部５３ａ
が一体で形成される。また、固定ピン５３1 （５３2 〜
５３4 ）の上端にボルト部５３ｂが形成され、下方にプ
リント基板２２上面と当接するフランジ５３ｃが形成さ
れる。6 (A) to 6 (C), through holes 271b (272b to 274b) are formed at the four corners of the heat sink 27 (also the heat sink 42 of FIG. 4 (B)). Fixing pins 53 1 (53 2 to 53 2) planted around four corners of the semiconductor element 23 mounted on the substrate 22
53 4), the pressing portion 53a of the bent shape of the protruding portions at positions corresponding to the through hole 271b (272b~274b) in
Are integrally formed. Also, the fixing pins 53 1 (53 2 to
53 4) upper bolt portion 53b is formed on the printed circuit board 22 the upper surface abutting the flange 53c downward is formed.
【００３７】一方、プリント基板２２には固定ピン５３
1 （５３2 〜５３4 ）が植設される位置に貫通孔２２1
（２２2 〜２２4 ）が形成される。すなわち、固定ピン
５３ 1 （５３2 〜５３4 ）がプリント基板２２上にフラ
ンジ５３ｃを当接させる貫通孔２２1 （２２2 〜２
２4 ）を貫通させて、表面及び裏面でろう付けして固定
したときに、押圧部５３ａがヒートシンク２７の貫通孔
２７1b（２７2b〜２７4b）内で当接して水平方向に押圧
する。On the other hand, the fixing pins 53
1(53Two~ 53Four) Is planted at the position where the1
(22Two~ 22Four) Is formed. That is, the fixing pin
53 1(53Two~ 53Four) On the printed circuit board 22
Through hole 22 for contacting the nozzle 53c1(22Two~ 2
2Four), And fix it by brazing on the front and back sides
When the pressing portion 53a is
271b (272b-274b) abuts and presses horizontally
I do.
【００３８】また、固定ピン５３1 （５３2 〜５３4 ）
のボルト部５３ｂには第１の押圧手段としての弾性部材
５４1 （５４2 〜５４4 ）が中央の孔５２ａで嵌合さ
れ、かつ調整手段としての加圧調整ネジ５２1 （５２2
〜５２4 ）で弾性部材５４1 （５４2 〜５４4 ）による
ヒートシンク２７への半導体素子側の垂直方向の押圧力
を調整するものである。The fixing pins 53 1 (53 2 to 53 4 )
The bolt portion 53b the elastic member 54 1 (54 2 to 54 4) is fitted in the center hole 52a, and as an adjusting unit pressure adjusting screw 52 1 as a first pressing means (52 2
-52 4) it is to adjust the pressing force in the vertical direction of the semiconductor device side to the heat sink 27 by the elastic member 54 1 (54 2 to 54 4).
【００３９】ここで、弾性部材５４1 （５４2 〜５
４4 ）は、図６（Ｃ）に示すように平面十字状に形成さ
れて中央に孔５４ａが形成されると共に、その十字方向
にそれぞれ屈曲形状の押圧部５４ｂ1 〜５４ｂ4 が一体
に形成されたものである。すなわち、ヒートシンク２７
への水平方向の押圧は押圧部５３ａにより固定ピン５３
1 （５３2 〜５３4 ）が自身で撓んでその弾性変位で行
い、該ヒートシンク２７への垂直方向の押圧は弾性部材
５４1 （５４2 〜５４4 ）に対する加圧調整ネジ５２1
（５２2 〜５２4 ）によって適宜調整されるものであ
る。これにより、固定ピン５３1 （５３2 〜５３4 ）の
構造が簡易となり、コスト削減を図ることができるもの
である。Here, the elastic members 54 1 (54 2 to 5)
4 4 ) is formed in a plane cross shape as shown in FIG. 6C to form a hole 54 a in the center, and bent pressing portions 54 b 1 to 54 b 4 are integrally formed in the cross direction. It was done. That is, the heat sink 27
The horizontal pressing on the fixing pin 53 is performed by the pressing portion 53a.
1 (53 2 to 53 4) performs its elastic displacement deflected by itself, pressure adjusting screw 52 1 for pressing the vertical elastic member 54 1 (54 2 to 54 4) to said heat sink 27
It shall be adjusted appropriately by (52 2 to 52 4). This simplifies the structure of the fixing pins 53 1 (53 2 to 53 4 ), and can reduce costs.
【００４０】次に、図７に、本発明の他の実施例におけ
る要部説明図を示す。図７（Ａ）は、ヒートシンク２７
の断面図が示されており、半導体素子２３との当接面と
反対面側にネジ切り部２７ｄが形成され、その周囲に例
えば４つの貫通孔２７ｅ1 〜２７ｅ4 が形成される。ま
た、半導体素子２３との当接面には図７（Ｃ）の底面図
に示すように格子状の溝２７ｆが形成される。なお、２
７ｃは配管に連通する冷媒流路である。Next, FIG. 7 is an explanatory view of a main part in another embodiment of the present invention. FIG. 7A shows the heat sink 27.
There is shown a cross-sectional view of, the threaded portion 27d on the opposite side the contact surface is formed between the semiconductor element 23, at its periphery, for example, four through holes 27e 1 ~27e 4 is formed. Further, a lattice-shaped groove 27f is formed on the contact surface with the semiconductor element 23 as shown in the bottom view of FIG. 7C. In addition, 2
Reference numeral 7c denotes a refrigerant flow passage communicating with the pipe.
【００４１】一方、素子分離部材としてのピン押し部材
６１が用意される。このピン押し部材６１の略中央には
貫通孔６１ａが形成され、貫通孔６１ａの周囲であって
ヒートシンク２７の貫通孔２７ｅ1 〜２７ｅ4 に対応す
るピン６１1 〜６１4 が植設される。貫通孔６１ａには
ピン押しネジ６２が貫通して上記ヒートシンク２７のネ
ジ切り部２７ｄと螺合する。On the other hand, a pin pushing member 61 as an element separating member is prepared. The substantially at the center of the pin pushing member 61 through hole 61a is formed, a pin 61 1-61 4 a periphery of the through-hole 61a corresponding to the through-holes 27e 1 ~27e 4 of the heat sink 27 is implanted. A pin pushing screw 62 penetrates the through hole 61a and is screwed with the threaded portion 27d of the heat sink 27.
【００４２】そこで、上記ヒートシンク２７はサーマル
コンパウンド等の高熱伝導部材２６を介在させて半導体
素子２３に密着させたときに、余分な高熱伝導部材２６
が溝２７ｆに追い出され、少ない加圧力で薄く均一な厚
さの熱伝導層が形成される。すなわち、半導体素子２３
の上面とヒートシンク２７の間の接触面積が広い場合で
あっても、全面に亘って熱抵抗が均一で小な良好な接触
状態を容易に実現することができ、冷却性能が向上され
るものである。Therefore, when the heat sink 27 is brought into close contact with the semiconductor element 23 with a high heat conducting member 26 such as a thermal compound interposed therebetween,
Is expelled by the groove 27f, and a thin and uniform heat conductive layer is formed with a small pressing force. That is, the semiconductor element 23
Even when the contact area between the upper surface of the heat sink 27 and the heat sink 27 is large, it is possible to easily realize a small and favorable contact state with uniform thermal resistance over the entire surface and improve the cooling performance. is there.
【００４３】そして、半導体素子２３の修理、交換等で
ヒートシンク２７を分離する場合、ピン押し部材６１の
ピン６１1 〜６１4 をヒートシンク２７の貫通孔２７ｅ
1 〜２７ｅ2 に挿入させ、ピン押しネジ６２をピン押し
部材６１の貫通孔６１ａを貫通させてヒートシンク２７
のネジ切り部２７ｄに螺合させてネジ締めすると、ヒー
トシンク２７がピン押し部材６１側に引き寄せられて半
導体素子２３より分離する。[0043] Then, the repair of the semiconductor device 23, when separating the heat sink 27 in replacement, the through hole of the pin 61 1-61 4 pin pushing member 61 heat sink 27 27e
1 to 27 e 2 , and the pin pushing screw 62 is passed through the through hole 61 a of the pin pushing member 61, and the heat sink 27 is inserted.
When the screw is screwed into the threaded portion 27d, the heat sink 27 is drawn toward the pin pushing member 61 and separated from the semiconductor element 23.
【００４４】これにより、半導体素子２３の入出力端子
２３ａに不要な力を加えることなく、確実かつ容易にヒ
ートシンク２７を分離することができ、半導体素子２３
の信頼度を向上させることができるものである。次に、
図８に、本発明の複数素子に対するヒートシンクの適用
例の説明図を示す。図８は、プリント基板２２上に実装
された例えば４つの半導体素子２３にそれぞれ図１及び
図２に示すヒートシンク２７A 〜２７D が２×２配列で
設けられた場合を示している。そして、各ヒートシンク
２７A 〜２７D の四隅に対応して四角柱状の固定ピン７
１1 〜７１9 が配置される。Thus, the heat sink 27 can be reliably and easily separated without applying unnecessary force to the input / output terminals 23a of the semiconductor element 23.
Reliability can be improved. next,
FIG. 8 is an explanatory diagram of an application example of a heat sink to a plurality of elements of the present invention. Figure 8 shows a case where the heat sink 27 A ~ 27 D shown in FIGS. 1 and 2, respectively on the printed circuit board has been, for example, four mounting on the 22 semiconductor devices 23 are provided in the 2 × 2 array. The square cylindrical fixing pin 7 in correspondence with the four corners of the heat sinks 27 A ~ 27 D
1 1-71 9 are arranged.
【００４５】この場合、固定ピン７１2 ，７１3 ，７１
8 ，７１9 には各１個の板ばね２５が取り付けられ、固
定ピン７１5 ，７１6 には各２個の板ばね２５が取り付
けられる。そして、ヒートシンク２７A は固定ピン７１
2 ，７１5 の各板ばね２５で固定ピン７１1 ，７１4 に
押し付けられて水平方向に押圧され、ヒートシンク２７
B は固定ピン７１3 ，７１6 の各板ばね２５で固定ピン
７１2 ，７１5 に押し付けられて水平方向に押圧され
る。また、ヒートシンク２７C は固定ピン７１5，７１
8 の各板ばね２５で固定ピン７１4 ，７１7 に押し付け
られて水平方向に押圧され、ヒートシンク２７D は固定
ピン７１6 ，７１9 の各板ばね２５で固定ピン７１5 ，
７１8 に押し付けられて水平方向に押圧される。In this case, the fixing pins 71 2 , 71 3 , 71
8, 71 9 each one of the leaf spring 25 in the mounted, each two plate springs 25 is attached to the fixed pin 71 5, 71 6. Then, the heat sink 27 A fixed pin 71
2, 71 in the plate spring 25 of the 5 pressed against the fixed pin 71 1, 71 4 are pressed in a horizontal direction, the heat sink 27
B is pushed in the horizontal direction is pressed against the fixing pin 71 2, 71 5 in the plate spring 25 of the fixing pin 71 3, 71 6. The heat sink 27 C fixed pins 71 5, 71
8 fixing pins 71 4 in the plate springs 25 of, pressed against the 71 7 is pressed in the horizontal direction, the heat sink 27 D fixed pins 71 5 in the plate spring 25 of the fixing pin 71 6, 71 9,
Pressed against the 71 8 is pressed in the horizontal direction.
【００４６】すなわち、固定ピン７１2 ，７１4 ，７１
5 ，７１6 ，７１8 は隣接するヒートシンク２７A 〜２
７D の複数個で共用されて水平方向に押圧を行うもので
ある。これにより、プリント基板２２に植設される固定
ピン数を削減することができ、該プリント基板２２の実
装・配線領域の拡大、コスト削減を図ることができるも
のである。That is, the fixing pins 71 2 , 71 4 , 71
5, 71 6, 71 8 adjacent heat sinks 27 A to 2
It is shared by a plurality of 7 D and performs a pressing horizontally. As a result, the number of fixing pins implanted on the printed circuit board 22 can be reduced, so that the mounting / wiring area of the printed circuit board 22 can be expanded and the cost can be reduced.
【００４７】[0047]
【発明の効果】以上のように請求項１の発明によれば、
基板に実装された素子に設けられた冷却手段を、第１の
押圧手段で素子側の垂直方向に押圧し、第２の押圧手段
で水平方向に押圧して固定することにより、冷却手段に
加わる外力を第１及び第２の押圧手段で受けることにな
り、実装部品への荷重が緩和されると共に、実装部品と
冷却手段の接合が強化されて冷却性能の向上を図ること
ができる。As described above, according to the first aspect of the present invention,
The cooling means provided on the element mounted on the substrate is pressed by the first pressing means in the vertical direction on the element side, and is pressed by the second pressing means in the horizontal direction and fixed, whereby the cooling means is added to the cooling means. Since the external force is received by the first and second pressing means, the load on the mounted component is reduced, and the joining between the mounted component and the cooling means is strengthened, so that the cooling performance can be improved.
【００４８】請求項２，５又は８の発明によれば、第２
の押圧手段は、基板に適宜補強部材を介して固定部材が
植設され、形成された突起部で対応する冷却手段又は適
宜隣接の冷却手段の何れか複数に対して押圧することに
より、冷却手段を水平方向に容易、確実に固定すること
が可能となり、外力の影響が緩和されて冷却性能の向上
を図ることができる。According to the second, fifth or eighth aspect of the present invention, the second
The pressing means is formed by implanting a fixing member on the substrate via a reinforcing member as appropriate, and pressing the corresponding cooling means or a plurality of adjacent cooling means as appropriate with the formed projections, thereby providing a cooling means. Can be easily and reliably fixed in the horizontal direction, the effect of external force is reduced, and the cooling performance can be improved.
【００４９】請求項３又は４の発明によれば、第１の押
圧手段が弾性部材を固定部材に適宜調整手段で押圧力調
整自在に取り付けて冷却手段を垂直方向に押圧すること
により、冷却手段を実装部品への荷重を緩和しつつ垂直
方向に容易、確実に固定することが可能となって外力の
影響が緩和され、冷却性能の向上を図ることができる。According to the third or fourth aspect of the present invention, the first pressing means attaches the elastic member to the fixed member so that the pressing force can be adjusted by an appropriate adjusting means, and presses the cooling means in the vertical direction. Can be easily and reliably fixed in the vertical direction while reducing the load on the mounted component, the influence of external force is reduced, and the cooling performance can be improved.
【００５０】請求項６又は７の発明によれば、冷却手段
に素子分離手段を設けて素子を取り外し、適宜素子接触
面に所定数の溝を形成することにより、素子と冷却手段
との間に熱伝導部材が介在されたときに、余分な熱伝導
部材を溝内に廻り込ませて熱抵抗を均一にして冷却性能
の向上を図り、実装部品から熱伝導部材で密着状態の冷
却手段の取り外し作業を該実装部品に不要な力を加える
ことなく行うことができる。According to the sixth or seventh aspect of the present invention, the element is removed by providing the element separating means in the cooling means, and a predetermined number of grooves are formed in the element contact surface as appropriate, so that the cooling means is provided between the element and the cooling means. When a heat conducting member is interposed, extra heat conducting members are wrapped around the groove to improve the cooling performance by making the heat resistance uniform and removing the cooling means in close contact with the heat conducting member from the mounted components. The work can be performed without applying unnecessary force to the mounted component.
【図１】本発明の一実施例の構成図である。FIG. 1 is a configuration diagram of an embodiment of the present invention.
【図２】図１のヒートシンクへの押圧状態の説明図であ
る。FIG. 2 is an explanatory view of a pressed state of the heat sink of FIG. 1;
【図３】図１の固定ピンの他の固定方法の説明図であ
る。FIG. 3 is an explanatory view of another fixing method of the fixing pin of FIG. 1;
【図４】図１のヒートシンクの他の構造例の説明図であ
る。FIG. 4 is an explanatory diagram of another structural example of the heat sink in FIG. 1;
【図５】図１の他の押圧方法の説明図（１）である。FIG. 5 is an explanatory view (1) of another pressing method in FIG. 1;
【図６】図１の他の押圧方法の説明図（２）である。FIG. 6 is an explanatory view (2) of another pressing method in FIG. 1;
【図７】本発明の他の実施例における要部説明図であ
る。FIG. 7 is an explanatory view of a main part in another embodiment of the present invention.
【図８】本発明の複数素子に対するヒートシンクの適用
例の説明図である。FIG. 8 is an explanatory diagram of an application example of a heat sink to a plurality of elements of the present invention.
【図９】従来の冷却構造の構成図である。FIG. 9 is a configuration diagram of a conventional cooling structure.
２１ 冷却構造 ２２ プリント板 ２３ 半導体素子 ２３ａ 入出力端子 ２４1 〜２４4 ，５１1 〜５１4 ，５３1 〜５３4 ，７
１1 〜７１9 固定ピン ２５1 ，２５2 板ばね ２６ 高熱伝導部材 ２７，４１，４２ ヒートシンク ２８，５４1 〜５４4 弾性部材 ３１ 補強部材 ５２1 〜５２4 加圧調整ネジ ６１ ピン押し部材 ６２ ピン押しネジReference Signs List 21 cooling structure 22 printed board 23 semiconductor element 23a input / output terminal 24 1 to 24 4 , 51 1 to 51 4 , 53 1 to 53 4 , 7
1 1-71 9 fixed pins 25 1, 25 2 plate spring 26 high thermal conductivity member 27,41,42 sink 28, 54 1 to 54 4 elastic member 31 reinforcing member 52 1-52 4 pressure adjusting screw 61 pin press member 62 Pin push screw
Claims (8)
て冷却を行う冷却手段が設けられた実装部品の冷却構造
において、 前記冷却手段を、前記素子に対して前記基板側の垂直方
向に押圧して固定する第１の押圧手段と、 該冷却手段を、前記素子に対して水平方向に押圧して固
定する第２の押圧手段と、 を有することを特徴とする実装部品の冷却構造。1. A cooling structure for a mounted component provided with cooling means for cooling a predetermined number of elements mounted on a substrate, wherein the cooling means is provided in a direction perpendicular to the substrate with respect to the elements. A first pressing means for pressing and fixing the cooling means, and a second pressing means for pressing and fixing the cooling means in a horizontal direction with respect to the element. .
基板上に植設された所定数のうち何れかの固定部材に形
成される突起部が前記素子を水平方向に押圧してなるこ
とを特徴とする実装部品の冷却構造。2. The second pressing means according to claim 1, wherein a projection formed on one of a predetermined number of fixing members planted on the substrate presses the element in a horizontal direction. A cooling structure for a mounted component.
の押圧手段は前記固定部材に固定された弾性部材で前記
素子を垂直方向に押圧してなることを特徴とする実装部
品の冷却構造。3. The method according to claim 2, wherein
Wherein the pressing means presses the element in a vertical direction with an elastic member fixed to the fixing member.
弾性部材による前記素子に対する押圧力を調整する調整
手段が設けられることを特徴とする実装部品の冷却構
造。4. The cooling structure for a mounted component according to claim 3, wherein the first pressing means includes an adjusting means for adjusting a pressing force of the elastic member on the element.
の取り付けに対して前記基板を補強する補強部材を介し
て該基板に植設されることを特徴とする実装部品の冷却
構造。5. The cooling structure for mounting components according to claim 2, wherein the fixing member is implanted in the substrate via a reinforcing member for reinforcing the substrate with respect to the attachment of the fixing member.
前記素子を取り外すための素子分離部材が設けられるこ
とを特徴とする実装部品の冷却構造。6. A cooling structure for a mounted component, wherein the cooling means according to claim 1 is provided with an element separating member for removing said element to be contacted.
素子との接触面に所定数の溝が形成されてなることを特
徴とする実装部品の冷却構造。7. A cooling structure for a mounted component, wherein a predetermined number of grooves are formed on a contact surface with the element in the cooling means according to claim 1.
は、複数の前記素子のそれぞれに対応する隣接の前記冷
却手段の少なくとも複数に対して前記水平方向に押圧し
てなることを特徴とする実装部品の冷却構造。8. The second pressing unit according to claim 1, wherein the second pressing unit presses at least a plurality of adjacent cooling units corresponding to each of the plurality of elements in the horizontal direction. And the cooling structure of the mounted components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22540796A JP3725257B2 (en) | 1996-08-27 | 1996-08-27 | Mounting component cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22540796A JP3725257B2 (en) | 1996-08-27 | 1996-08-27 | Mounting component cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1070222A true JPH1070222A (en) | 1998-03-10 |
| JP3725257B2 JP3725257B2 (en) | 2005-12-07 |
Family
ID=16828891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22540796A Expired - Fee Related JP3725257B2 (en) | 1996-08-27 | 1996-08-27 | Mounting component cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3725257B2 (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000035012A1 (en) * | 1998-12-10 | 2000-06-15 | Unisys Corporation | Mechanical assembly for regulating the temperature of an electronic device |
| WO2000035010A1 (en) * | 1998-12-10 | 2000-06-15 | Unisys Corporation | Heat exchanger that contacts an entire planar face of an electronic device except for its corners |
| EP1020910A2 (en) * | 1999-01-16 | 2000-07-19 | Elsa AG | Heat sink attachment |
| US6621707B2 (en) | 1998-08-11 | 2003-09-16 | Fujitsu Limited | Liquid-cooled electronic apparatus |
| WO2004076952A1 (en) * | 2003-02-27 | 2004-09-10 | Laserfront Technologies, Inc. | Heat sunk, laser module, laser device, and laser-processing device |
| JP2008004667A (en) * | 2006-06-21 | 2008-01-10 | Nec Corp | Cooling structure, and manufacturing method thereof |
| WO2010050972A1 (en) * | 2008-10-31 | 2010-05-06 | Hewlett-Packard Development Company, L.P. | Assembly-supporting spring between rigid connectors |
| JP2010118606A (en) * | 2008-11-14 | 2010-05-27 | Daikin Ind Ltd | Installing structure of cooling member |
| JP2011103728A (en) * | 2009-11-11 | 2011-05-26 | Denso Corp | Power conversion device |
| JP2011171583A (en) * | 2010-02-19 | 2011-09-01 | Tetsuji Kataoka | Mechanism for adjusting placement load of heat sink, and the heat sink to which the same is applied |
| JP2016018953A (en) * | 2014-07-10 | 2016-02-01 | 株式会社フジクラ | Cold plate |
| JP2017174894A (en) * | 2016-03-22 | 2017-09-28 | 日本電気株式会社 | Cooling device, electronic device, and heat sink mounting method |
Families Citing this family (1)
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|---|---|---|---|---|
| US9913361B2 (en) | 2016-01-06 | 2018-03-06 | International Business Machines Corporation | Integrated circuit device assembly |
-
1996
- 1996-08-27 JP JP22540796A patent/JP3725257B2/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6621707B2 (en) | 1998-08-11 | 2003-09-16 | Fujitsu Limited | Liquid-cooled electronic apparatus |
| WO2000035012A1 (en) * | 1998-12-10 | 2000-06-15 | Unisys Corporation | Mechanical assembly for regulating the temperature of an electronic device |
| WO2000035010A1 (en) * | 1998-12-10 | 2000-06-15 | Unisys Corporation | Heat exchanger that contacts an entire planar face of an electronic device except for its corners |
| EP1020910A2 (en) * | 1999-01-16 | 2000-07-19 | Elsa AG | Heat sink attachment |
| EP1020910A3 (en) * | 1999-01-16 | 2001-05-02 | Elsa AG | Heat sink attachment |
| WO2004076952A1 (en) * | 2003-02-27 | 2004-09-10 | Laserfront Technologies, Inc. | Heat sunk, laser module, laser device, and laser-processing device |
| JP2008004667A (en) * | 2006-06-21 | 2008-01-10 | Nec Corp | Cooling structure, and manufacturing method thereof |
| JP4586772B2 (en) * | 2006-06-21 | 2010-11-24 | 日本電気株式会社 | COOLING STRUCTURE AND COOLING STRUCTURE MANUFACTURING METHOD |
| WO2010050972A1 (en) * | 2008-10-31 | 2010-05-06 | Hewlett-Packard Development Company, L.P. | Assembly-supporting spring between rigid connectors |
| JP2010118606A (en) * | 2008-11-14 | 2010-05-27 | Daikin Ind Ltd | Installing structure of cooling member |
| JP2011103728A (en) * | 2009-11-11 | 2011-05-26 | Denso Corp | Power conversion device |
| JP2011171583A (en) * | 2010-02-19 | 2011-09-01 | Tetsuji Kataoka | Mechanism for adjusting placement load of heat sink, and the heat sink to which the same is applied |
| JP2016018953A (en) * | 2014-07-10 | 2016-02-01 | 株式会社フジクラ | Cold plate |
| JP2017174894A (en) * | 2016-03-22 | 2017-09-28 | 日本電気株式会社 | Cooling device, electronic device, and heat sink mounting method |
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|---|---|
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