JPH1050595A - Treating apparatus - Google Patents
Treating apparatusInfo
- Publication number
- JPH1050595A JPH1050595A JP22171096A JP22171096A JPH1050595A JP H1050595 A JPH1050595 A JP H1050595A JP 22171096 A JP22171096 A JP 22171096A JP 22171096 A JP22171096 A JP 22171096A JP H1050595 A JPH1050595 A JP H1050595A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holder
- processing apparatus
- solvent
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造におい
て感光性樹脂塗布後の基板表面の平坦化のために使用さ
れる処理装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus used for flattening a substrate surface after a photosensitive resin is applied in semiconductor manufacturing.
【０００２】[0002]
【従来の技術】従来、半導体製造工程においては、基板
に感光性樹脂を塗布した際に生ずる段差部を平坦化する
ために、感光性樹脂の塗布を行うカップ内を溶剤雰囲気
とする方式が、特開昭４９−１４０１７７号公報、特開
昭５１−６５８８２号公報に開示されている。2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, in order to flatten a step formed when a photosensitive resin is applied to a substrate, a method in which a cup for applying the photosensitive resin is made to have a solvent atmosphere is used. It is disclosed in JP-A-49-140177 and JP-A-51-65882.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら上述の従
来例のように、カップ内を溶剤雰囲気として平坦化を行
う方式では、実際上高精度で塗布を行うことは困難であ
り、特に温度や湿度の制御によってカップ内の溶剤雰囲
気を安定化することは非常に難しい。However, in the method of flattening the inside of the cup as a solvent atmosphere as in the above-described conventional example, it is difficult to perform coating with high precision in practice, and in particular, the temperature and humidity are not so high. It is very difficult to stabilize the solvent atmosphere in the cup by control.
【０００４】更に、基板自体に段差が存在し、その段差
が基板の法線方向と直角に位置する場合には、その段差
前後で感光性樹脂の塗布厚さに差が生じ、塗布膜厚さの
差が後工程で使用する露光機の重ね合わせ精度に影響を
与え、スピン塗布によっても解決することはできない。
また、感光性樹脂の塗布工程後に行うベーク処理工程前
に、基板を有機溶剤の雰囲気下に放置することによって
段差の改善を行っているが、このような放置するだけの
方式では、雰囲気管理、時間管理、温度管理等を定量的
に設定することは困難である。Further, when there is a step in the substrate itself, and the step is located at right angles to the normal direction of the substrate, a difference occurs in the coating thickness of the photosensitive resin before and after the step, and the coating film thickness becomes large. The difference affects the overlay accuracy of an exposure machine used in a subsequent process, and cannot be solved even by spin coating.
Also, before the baking process performed after the photosensitive resin coating process, the substrate is left in an atmosphere of an organic solvent to improve the level difference. It is difficult to quantitatively set time management, temperature management, and the like.
【０００５】本発明の目的は、上述の問題点を解消し、
感光性樹脂塗布後の基板を段差のない均一な表面とする
処理装置を提供することにある。An object of the present invention is to solve the above-mentioned problems,
It is an object of the present invention to provide a processing apparatus in which a substrate after applying a photosensitive resin has a uniform surface with no steps.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
の本発明に係る処理装置は、基板に対する感光性樹脂塗
布処理工程とベーク処理工程との間に行う基板表面の不
均一性を改善する処理装置であって、前記基板に近接し
て配置すると共に温度制御した加熱板と、前記基板を所
定速度で回転する駆動手段と、前記基板の半径以上の長
さの吐出幅を有し前記基板の表面に向けて溶剤蒸気を吐
出する吐出ノズルと、吐出処理を行う周囲を溶剤雰囲気
とするカバーを備えたことを特徴とする。SUMMARY OF THE INVENTION A processing apparatus according to the present invention for achieving the above object improves the non-uniformity of the substrate surface between a photosensitive resin coating process and a baking process on the substrate. A processing apparatus, comprising: a heating plate disposed in close proximity to the substrate and temperature-controlled; driving means for rotating the substrate at a predetermined speed; and a substrate having a discharge width equal to or longer than a radius of the substrate. A discharge nozzle for discharging a solvent vapor toward the surface of the substrate, and a cover for setting a periphery of the discharge processing to a solvent atmosphere.
【０００７】[0007]
【発明の実施の形態】本発明を図示の実施例に基づいて
詳細に説明する。図１は実施例の処理装置の斜視図を示
し、基板Ａを保持する保持具１の周囲は歯車状とされ、
回転駆動源２に連結した歯車３に噛合されている。保持
具１の下側には加熱板４が設けられ、保持具１の上方に
は回転中の基板Ａに一様に蒸気を吐出するために基板Ａ
の半径以上の吐出幅を有し、短冊状又は直線多孔状を持
つ溶剤蒸気ノズル５が配置され、この溶剤蒸気ノズル５
には溶剤蒸気供給管６が連結されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the illustrated embodiment. FIG. 1 is a perspective view of a processing apparatus according to an embodiment, and a periphery of a holder 1 for holding a substrate A is formed in a gear shape.
The gear 3 is meshed with a gear 3 connected to the rotary drive source 2. A heating plate 4 is provided below the holder 1, and a substrate A is provided above the holder 1 to uniformly discharge steam to the rotating substrate A.
A solvent vapor nozzle 5 having a discharge width equal to or larger than the radius of the nozzle and having a strip shape or a linear porous shape.
Is connected to a solvent vapor supply pipe 6.
【０００８】図２は処理装置の配管接続を表す構成図を
示し、供給管６は三方弁７を介して、一方は窒素ガス供
給管８に接続され、他方は流量制御器９を介して溶剤飽
和蒸気発生源１０に接続されており、溶剤飽和蒸気発生
源１０には濃度制御器１１が接続されている。そして、
加熱板４、溶剤蒸気ノズル５などはカバー１２内に収納
され、カバー１２の下部には排気管１３が取り付けられ
ている。FIG. 2 is a block diagram showing a pipe connection of the processing apparatus. A supply pipe 6 is connected to a nitrogen gas supply pipe 8 via a three-way valve 7, and a supply pipe 6 is connected to a nitrogen gas supply pipe 8 via a flow controller 9. The concentration controller 11 is connected to the saturated vapor generation source 10, and the solvent saturation vapor generation source 10 is connected to the concentration controller 11. And
The heating plate 4, the solvent vapor nozzle 5, and the like are housed in a cover 12, and an exhaust pipe 13 is attached to a lower portion of the cover 12.
【０００９】図３は操作中の処理装置の斜視図を示し、
感光性樹脂が塗布された基板Ａは保持具１上に載置さ
れ、温度制御された加熱板４により下方から所定温度に
調節され、回転駆動源２により所定の速度で回転され
る。FIG. 3 shows a perspective view of the processing apparatus in operation.
The substrate A coated with the photosensitive resin is placed on the holder 1, adjusted to a predetermined temperature from below by a temperature-controlled heating plate 4, and rotated at a predetermined speed by the rotary drive source 2.
【００１０】溶剤蒸気は溶剤飽和蒸気発生源１０におい
て濃度制御器１１により濃度管理が行われた上で、流量
制御器９において使用流量が管理され、三方弁７を介し
て溶剤蒸気供給管６を通り、基板Ａの上部に近接した蒸
気ノズル５から基板Ａの上面に吐出される。そして、基
板Ａは予め規定された所定時間経過後に取り出され、ま
た溶剤蒸気ノズル５内の残留溶剤は、三方弁７の切換え
によって窒素ガス供給管８から供給された窒素ガスによ
って排気され、カバー１２に接続された排気管１３から
外部へ排出される。The concentration of the solvent vapor is controlled by a concentration controller 11 in a solvent saturated vapor generation source 10, a flow rate used is controlled by a flow controller 9, and a solvent vapor supply pipe 6 is connected through a three-way valve 7. As a result, the liquid is discharged onto the upper surface of the substrate A from the vapor nozzle 5 close to the upper portion of the substrate A. Then, the substrate A is taken out after a predetermined time elapses, and the residual solvent in the solvent vapor nozzle 5 is exhausted by the nitrogen gas supplied from the nitrogen gas supply pipe 8 by switching the three-way valve 7, and the cover 12 is removed. Is discharged from the exhaust pipe 13 connected to the outside.
【００１１】[0011]
【発明の効果】以上説明したように本発明に係る処理装
置は、溶剤濃度を被処理基板上で一定にすることによ
り、基板各葉毎の処理の変動を抑え、温度及び濃度管理
を行うことにより、溶剤蒸気処理に必要な時間を基板各
葉毎に一定にすることができるので、高品質の基板を計
画的に生産することができる。As described above, in the processing apparatus according to the present invention, the solvent concentration is kept constant on the substrate to be processed, thereby suppressing the fluctuation of the processing for each leaf of the substrate and controlling the temperature and the concentration. Thus, the time required for the solvent vapor treatment can be made constant for each leaf of the substrate, so that a high-quality substrate can be produced systematically.
【図１】実施例の斜視図である。FIG. 1 is a perspective view of an embodiment.
【図２】蒸気吐出部及びその配管の構成図である。FIG. 2 is a configuration diagram of a steam discharge unit and a pipe thereof.
【図３】処理操作中の蒸気吐出部の斜視図である。FIG. 3 is a perspective view of a steam discharge unit during a processing operation.
【符号の説明】 １ 保持具 ２ 回転駆動源 ４ 加熱板 ５ 溶剤蒸気ノズル ７ 三方弁 ８ 窒素供給管 ９ 流量制御器 １０ 溶剤飽和蒸気発生源 １１ 濃度制御器 １２ カバー １３ 排気管[Description of Signs] 1 Holder 2 Rotary drive source 4 Heating plate 5 Solvent vapor nozzle 7 Three-way valve 8 Nitrogen supply pipe 9 Flow controller 10 Solvent saturated vapor generation source 11 Concentration controller 12 Cover 13 Exhaust pipe
Claims (4)
ベーク処理工程との間に行う基板表面の不均一性を改善
する処理装置であって、前記基板に近接して配置すると
共に温度制御した加熱板と、前記基板を所定速度で回転
する駆動手段と、前記基板の半径以上の長さの吐出幅を
有し前記基板の表面に向けて溶剤蒸気を吐出する吐出ノ
ズルと、吐出処理を行う周囲を溶剤雰囲気とするカバー
を備えたことを特徴とする処理装置。1. A processing apparatus for improving non-uniformity of a substrate surface performed between a photosensitive resin coating processing step and a baking processing step on a substrate, wherein the heating apparatus is disposed close to the substrate and controlled in temperature. A plate, a driving unit for rotating the substrate at a predetermined speed, a discharge nozzle having a discharge width longer than a radius of the substrate and discharging solvent vapor toward a surface of the substrate, and a periphery for performing a discharge process. A processing apparatus, comprising: a cover in which a solvent atmosphere is provided.
とした請求項１に記載の処理装置。2. The processing apparatus according to claim 1, wherein the discharge nozzle has a strip shape or a linear porous shape.
う請求項１に記載の処理装置。3. The processing apparatus according to claim 1, wherein the substrate is placed on a holder for processing.
１に記載の処理装置。4. The processing apparatus according to claim 1, wherein an exhaust pipe is connected to the cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22171096A JPH1050595A (en) | 1996-08-05 | 1996-08-05 | Treating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22171096A JPH1050595A (en) | 1996-08-05 | 1996-08-05 | Treating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1050595A true JPH1050595A (en) | 1998-02-20 |
Family
ID=16771062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22171096A Pending JPH1050595A (en) | 1996-08-05 | 1996-08-05 | Treating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1050595A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004109779A1 (en) | 2003-06-06 | 2004-12-16 | Tokyo Electron Limited | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| WO2010053125A1 (en) * | 2008-11-05 | 2010-05-14 | 株式会社 東芝 | Film-forming apparatus, film-forming method and semiconductor device |
| JP2010186929A (en) * | 2009-02-13 | 2010-08-26 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| US7819076B2 (en) | 2004-04-20 | 2010-10-26 | Tokyo Electron Limited | Substrate treatment method and substrate treatment apparatus |
-
1996
- 1996-08-05 JP JP22171096A patent/JPH1050595A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004109779A1 (en) | 2003-06-06 | 2004-12-16 | Tokyo Electron Limited | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| EP1632992A1 (en) * | 2003-06-06 | 2006-03-08 | Tokyo Electron Limited | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| EP1632992A4 (en) * | 2003-06-06 | 2008-02-27 | Tokyo Electron Ltd | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| US7875420B2 (en) | 2003-06-06 | 2011-01-25 | Tokyo Electron Limited | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| US8646403B2 (en) | 2003-06-06 | 2014-02-11 | Tokyo Electron Limited | Method for improving surface roughness of processed film of substrate and apparatus for processing substrate |
| US7819076B2 (en) | 2004-04-20 | 2010-10-26 | Tokyo Electron Limited | Substrate treatment method and substrate treatment apparatus |
| US7989156B2 (en) | 2004-04-20 | 2011-08-02 | Tokyo Electron Limited | Substrate treatment method and substrate treatment apparatus |
| WO2010053125A1 (en) * | 2008-11-05 | 2010-05-14 | 株式会社 東芝 | Film-forming apparatus, film-forming method and semiconductor device |
| JP5132781B2 (en) * | 2008-11-05 | 2013-01-30 | 株式会社東芝 | Film forming apparatus and film forming method |
| US8614500B2 (en) | 2008-11-05 | 2013-12-24 | Kabushiki Kaisha Toshiba | Film forming apparatus, film forming method, and semiconductor device |
| JP2010186929A (en) * | 2009-02-13 | 2010-08-26 | Tokyo Electron Ltd | Substrate processing apparatus and substrate processing method |
| JP4748742B2 (en) * | 2009-02-13 | 2011-08-17 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
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