JPH1041655A - Housing of apparatus - Google Patents
Housing of apparatusInfo
- Publication number
- JPH1041655A JPH1041655A JP18977596A JP18977596A JPH1041655A JP H1041655 A JPH1041655 A JP H1041655A JP 18977596 A JP18977596 A JP 18977596A JP 18977596 A JP18977596 A JP 18977596A JP H1041655 A JPH1041655 A JP H1041655A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- heat
- heat radiating
- device housing
- collectors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子機器や電気機器
等に用いられる機器用筐体に係り、特に、改良された放
熱構造を備えた機器用筐体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing for equipment used for electronic equipment, electric equipment, and the like, and more particularly, to a housing for equipment having an improved heat dissipation structure.
【０００２】[0002]
【従来の技術】各種の電子機器や電気機器などにおいて
は、その熱的負荷を軽減して信頼性高く動作させるため
に、内部の熱を効率良く外部に放出する必要となる。こ
のような放熱構造としては、例えば、特開昭６３−１０
５９５号公報に記載されたもの（以下、従来例と称す
る）が知られている。2. Description of the Related Art In various electronic devices and electric devices, it is necessary to efficiently discharge internal heat to the outside in order to reduce the thermal load and operate the device with high reliability. Such a heat dissipation structure is disclosed in, for example, JP-A-63-10
Japanese Unexamined Patent Application Publication No. 595 (hereinafter, referred to as a conventional example) is known.
【０００３】この従来例では、屋外の柱上などに設置さ
れるＣＡＴＶ用機器の筐体において、太陽光の殆ど当た
らない底面に凸凹の放熱部を形成することで、筐体内で
発生する熱を、底面の放熱部から大気中に効率良く放熱
する構成としている。また、この放熱部を黒色にすると
ともに、放熱部以外の部分を反射率の良好な色にするこ
とで、放熱性を高めるようにした構成も記載されてい
る。[0003] In this conventional example, in a case of a CATV device installed on a pole outdoors or the like, an uneven heat radiating portion is formed on a bottom surface which is hardly exposed to sunlight, so that heat generated in the case is reduced. In addition, the heat radiating portion on the bottom surface efficiently radiates heat to the atmosphere. In addition, there is also described a configuration in which the heat radiating portion is made black, and a portion other than the heat radiating portion is made to have a color having good reflectance, thereby improving heat radiating properties.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来例では、放熱は専ら底面の放熱部から行なわれるだけ
であり、底面付近以外の筐体内の上部や中央、あるいは
側壁面付近の放熱効率が悪いという問題があった。な
お、従来例の場合、屋外において自然空冷により底面か
ら大気中に放熱するようにしており、天候や気温などに
より放熱効果が左右されるため、汎用性に乏しく、野外
設置のＣＡＴＶ用機器などに適用が制限されるものであ
る。However, in the above-mentioned conventional example, the heat is radiated only from the heat radiating portion on the bottom surface, and the heat radiating efficiency at the upper portion, the center, or near the side wall surface other than near the bottom surface is poor. There was a problem. In the case of the conventional example, heat is radiated to the atmosphere from the bottom by natural air cooling outdoors, and since the heat radiation effect is affected by the weather and the temperature, the versatility is poor. Application is limited.
【０００５】そこで、本発明は、筐体内の各部から効率
良く放熱を行うことがでる、機器用筐体を提供すること
を課題としている。Accordingly, an object of the present invention is to provide a housing for equipment which can efficiently radiate heat from various parts in the housing.
【０００６】[0006]
【課題を解決するための手段】本発明の機器用筐体は、
機器の外側を覆うための機器用筐体において、前記機器
用筐体の内側に突出する集熱部と、その一部が前記機器
用筐体の外側に露出した放熱部とを備え、前記集熱部と
前記放熱部が熱的に連結されていることを特徴とする。Means for Solving the Problems A housing for an apparatus of the present invention comprises:
A device housing for covering the outside of the device, comprising: a heat collecting portion protruding inside the device housing; and a heat radiating portion partially exposed to the outside of the device housing. A heat part and the heat radiating part are thermally connected.
【０００７】好ましい実施の形態において、前記放熱部
は、前記機器用筐体の底面に当接して前記機器用筐体を
支持する放熱設置台である。または、前記放熱部は、前
記機器用筐体の底面の少なくとも一部を形成している。
さらに、前記放熱部は、前記筐体が設置される接地面に
当接している。また、前記集熱部は、前記筐体内におい
て上下方向に延在している。さらに、前記集熱部および
前記放熱部は熱伝導度の高い材料から構成される。In a preferred embodiment, the heat radiating section is a heat radiating base for supporting the device casing by contacting a bottom surface of the device casing. Alternatively, the heat radiating portion forms at least a part of a bottom surface of the device housing.
Further, the heat radiator is in contact with a ground plane on which the housing is installed. In addition, the heat collecting portion extends in the up-down direction in the housing. Further, the heat collecting section and the heat radiating section are made of a material having high thermal conductivity.
【０００８】本発明では、筐体内で発生する熱は筐体内
の集熱部により吸収され、また、放熱部から、筐体が設
置された接地面などを経てに放熱される。このため、集
熱部により筐体内部の熱を効率良く集めて外部に放出で
きる。In the present invention, the heat generated in the housing is absorbed by the heat collecting portion in the housing, and is radiated from the heat radiating portion via the ground plane on which the housing is installed. For this reason, the heat inside the housing can be efficiently collected by the heat collecting unit and released to the outside.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１０】図１は、本発明の一実施形態に係る機器用
筐体１の部分切欠図である。この機器用筐体１は、略立
方体形の箱状のものであり、その内部には、図示しない
電気機器ないし電子機器が収容されている。FIG. 1 is a partially cutaway view of an apparatus housing 1 according to an embodiment of the present invention. The device housing 1 has a substantially cubic box shape, and accommodates an electric device or an electronic device (not shown) therein.
【００１１】機器用筐体１の内側には、その下面が機器
用筐体１の底面３に当接した集熱部２が設けられてい
る。集熱部２は、図示した例では、機器用筐体１の上下
方向に延在している。また、集熱部２は、その外周に、
多数の集熱用フィン７を有している。そして、このよう
な集熱部２が機器用筐体１の内側において両端にそれぞ
れ位置している。Inside the housing 1 for the equipment, there is provided a heat collector 2 whose lower surface is in contact with the bottom surface 3 of the housing 1 for the equipment. The heat collecting section 2 extends in the up and down direction of the device housing 1 in the illustrated example. In addition, the heat collecting section 2
It has a number of heat collecting fins 7. Such heat collecting sections 2 are located at both ends inside the housing 1 for the device.
【００１２】さらに、機器用筐体１は、放熱設置台４の
上に載置されており、機器用筐体１の底面３は放熱設置
台４の上面に当接している。放熱設置台４は、その底面
側が凹凸面となっており、この凹凸面は接地部において
接地面６に接触している。なお、接地面６は、具体的に
は、機器ないし機器用筐体１が載置される机や床などで
ある。また、集熱部２や設置台４は、熱伝導度の高い材
料、例えば、銅、アルミニュームなど形成される。Further, the equipment casing 1 is mounted on a heat radiating installation table 4, and the bottom surface 3 of the equipment housing 1 is in contact with the upper surface of the heat radiating installation table 4. The bottom surface side of the heat sink 4 has an uneven surface, and the uneven surface is in contact with the ground surface 6 at the ground portion. The ground plane 6 is specifically a desk or floor on which the device or the device housing 1 is placed. The heat collecting section 2 and the mounting table 4 are formed of a material having high thermal conductivity, for example, copper, aluminum, or the like.
【００１３】上記構成である本実施形態の機器用筐体１
では、機器用筐体１内で発生した熱が、まず、集熱部２
により吸収される。次いで、集熱部２で吸収された熱
が、集熱部２の下面から底面３を経て、底面３に接触し
ている放熱設置台４に伝導する。そして、放熱設置台４
から、接地部５を介して、接地面６に放熱される。な
お、放熱設置台４の熱の一部は上記の凹凸面を含むその
外面から外気中にも放出される。The device housing 1 of the present embodiment having the above-described configuration.
Then, the heat generated in the equipment casing 1 is firstly transmitted to the heat collecting section 2.
Is absorbed by Next, the heat absorbed by the heat collecting unit 2 is conducted from the lower surface of the heat collecting unit 2 via the bottom surface 3 to the radiator mounting table 4 in contact with the bottom surface 3. And the heat sink 4
Then, heat is dissipated to the ground plane 6 via the ground section 5. In addition, a part of the heat of the heat radiating installation table 4 is also released into the outside air from the outer surface including the uneven surface.
【００１４】以上のように、本実施形態では、機器用筐
体１の内側に設けた集熱部２によって筐体内の熱を吸収
し、これを設置台に伝導させているため、筐体内の上部
や中央部、あるいは側壁面などの放熱を効率良く行うこ
とができて、筐体内の熱溜りを解消できる。そして、最
終的には機器用筐体１が設置される接地面に放熱するの
で、安定的な放熱を行うことができる。As described above, in the present embodiment, the heat in the housing is absorbed by the heat collecting portion 2 provided inside the housing 1 for equipment, and the heat is transmitted to the installation table. The heat can be efficiently radiated from the upper portion, the central portion, the side wall surface, and the like, and the heat accumulation in the housing can be eliminated. Finally, heat is radiated to the ground plane on which the device housing 1 is installed, so that stable heat radiation can be performed.
【００１５】ここで、機器用筐体内の発熱量に応じて集
熱部の形状や設置ないし材質、あるいは設置台の形状な
どを適宜変更することで、筐体内に実装される電気ない
し電子機器に応じた効率的な放熱設定が行える。Here, by appropriately changing the shape and installation or material of the heat collecting portion or the shape of the installation base in accordance with the amount of heat generated in the housing for the device, the electrical or electronic device mounted in the housing can be used. Efficient heat radiation setting can be performed accordingly.
【００１６】なお、以上は、放熱部としての放熱設置台
を機器用筐体の底面に当接した場合の例であるが、その
他、例えば、この放熱設置台により機器用筐体の底面の
一部ないし全部を形成する構成としても良い。The above is an example of the case where the heat dissipating base as the heat dissipating part is in contact with the bottom surface of the equipment casing. A configuration in which a part or the whole is formed may be adopted.
【００１７】[0017]
【発明の効果】以上の通り、本発明によれば、筐体内の
各部から効率良く放熱を行うことができる器用筐体を提
供することができる。As described above, according to the present invention, it is possible to provide a container housing capable of efficiently dissipating heat from various parts in the housing.
【図１】本発明の実施の形態の機器用筐体を示した説明
図。FIG. 1 is an explanatory diagram showing a device housing according to an embodiment of the present invention.
【図２】図１におけるＡ-Ａ線断面図。FIG. 2 is a sectional view taken along line AA in FIG.
１ 筐体 ２ 集熱部 ３ 底面 ４ 放熱設置台 ５ 接地部 DESCRIPTION OF SYMBOLS 1 Housing 2 Heat collection part 3 Bottom surface 4 Heat sink 5 Grounding part
Claims (6)
いて、 前記機器用筐体の内側に突出する集熱部と、前記機器用
筐体の外側に位置する放熱部とを備え、 前記集熱部と前記放熱部が熱的に連結されていることを
特徴とする機器用筐体。1. A device housing for covering the outside of a device, comprising: a heat collecting portion projecting inside the device housing; and a heat radiating portion located outside the device housing. A housing for an apparatus, wherein a heat collecting part and the heat radiating part are thermally connected.
当接して前記機器用筐体を支持する放熱設置台であるこ
とを特徴とする請求項１記載の機器用筐体。2. The device housing according to claim 1, wherein the heat radiating section is a heat radiating installation table that contacts the bottom surface of the device housing to support the device housing.
少なくとも一部を形成していることを特徴とする請求項
１記載の機器用筐体。3. The device housing according to claim 1, wherein the heat radiating portion forms at least a part of a bottom surface of the device housing.
れる接地面に当接していることを特徴とする請求項１な
いし３のいずれかの項記載の機器用筐体。4. The device housing according to claim 1, wherein the heat radiating portion is in contact with a ground plane on which the device housing is installed.
上下方向に延在していることを特徴とする請求項１ない
し４のいずれかの項記載の機器用筐体。5. The housing for an apparatus according to claim 1, wherein the heat collecting portion extends vertically in the housing for the equipment.
の高い材料から構成されるものであることを特徴とする
請求項１ないし５のいずれかの項記載の機器用筐体。6. The housing for an apparatus according to claim 1, wherein said heat collecting portion and said heat radiating portion are made of a material having high thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18977596A JPH1041655A (en) | 1996-07-18 | 1996-07-18 | Housing of apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18977596A JPH1041655A (en) | 1996-07-18 | 1996-07-18 | Housing of apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1041655A true JPH1041655A (en) | 1998-02-13 |
Family
ID=16246998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18977596A Pending JPH1041655A (en) | 1996-07-18 | 1996-07-18 | Housing of apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1041655A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215741A (en) * | 2003-01-10 | 2004-08-05 | Toshiba Medical System Co Ltd | X-ray ct equippment and heat dissipation system thereof |
| JP2010088949A (en) * | 2010-01-26 | 2010-04-22 | Toshiba Medical System Co Ltd | X-ray ct apparatus and heat dissipation system of x-ray ct apparatus |
-
1996
- 1996-07-18 JP JP18977596A patent/JPH1041655A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004215741A (en) * | 2003-01-10 | 2004-08-05 | Toshiba Medical System Co Ltd | X-ray ct equippment and heat dissipation system thereof |
| JP4551621B2 (en) * | 2003-01-10 | 2010-09-29 | 株式会社東芝 | X-ray CT system heat release system |
| JP2010088949A (en) * | 2010-01-26 | 2010-04-22 | Toshiba Medical System Co Ltd | X-ray ct apparatus and heat dissipation system of x-ray ct apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20031021 |