JPH10335437A - Wafer processor - Google Patents
Wafer processorInfo
- Publication number
- JPH10335437A JPH10335437A JP13721797A JP13721797A JPH10335437A JP H10335437 A JPH10335437 A JP H10335437A JP 13721797 A JP13721797 A JP 13721797A JP 13721797 A JP13721797 A JP 13721797A JP H10335437 A JPH10335437 A JP H10335437A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- disk
- processing apparatus
- shaped member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板を水平に保持
して回転させながら基板に所定の処理を行う基板処理装
置に関する。[0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus for performing a predetermined process on a substrate while holding and rotating the substrate horizontally.
【０００２】[0002]
【従来の技術】半導体ウエハ、液晶表示装置用ガラス基
板、フォトマスク用ガラス基板、光ディスク用ガラス基
板等の基板に種々の処理を行うために基板処理装置が用
いられている。基板処理装置の一例として、基板を水平
に保持して回転させながら基板に所定の処理を行う回転
式塗布装置、回転式現像装置等の回転式基板処理装置が
ある。2. Description of the Related Art A substrate processing apparatus is used to perform various processes on substrates such as a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a photomask, and a glass substrate for an optical disk. As an example of a substrate processing apparatus, there is a rotary substrate processing apparatus such as a rotary coating apparatus or a rotary developing apparatus that performs a predetermined process on a substrate while holding and rotating the substrate horizontally.
【０００３】回転式基板処理装置においては、半導体ウ
エハ等の基板を水平姿勢に保持して回転させる必要があ
る。このため、基板の裏面を真空吸着により保持する吸
引式スピンチャックが一般的に用いられている。In a rotary substrate processing apparatus, it is necessary to rotate a substrate such as a semiconductor wafer while holding it in a horizontal position. For this reason, a suction-type spin chuck that holds the back surface of the substrate by vacuum suction is generally used.
【０００４】吸引式スピンチャックは、基板より小径の
円板の表面に吸着孔を設け、この吸着孔を通して基板の
裏面を真空吸着して基板を保持するものである。The suction-type spin chuck is provided with a suction hole on the surface of a disk smaller in diameter than the substrate, and holds the substrate by vacuum suction of the back surface of the substrate through the suction hole.
【０００５】しかしながら、吸引式スピンチャックで
は、基板の中央部分を吸着保持するために、基板の外周
部側で撓み易くなる。特に、近年では基板が大径化して
いる。このため、基板外周での撓み量が大きくなり、こ
の基板の撓みによって基板上に形成される膜の厚みが不
均一になるという不都合が生じる。また、基板の裏面中
央部を吸引式スピンチャックが吸着するために、基板裏
面の中央部分の洗浄が不完全になり、残余した汚染物が
他の基板の処理に悪影響を及ぼすという不都合もある。However, in the suction-type spin chuck, since the central portion of the substrate is held by suction, the substrate tends to be bent on the outer peripheral portion side of the substrate. Particularly, in recent years, the diameter of the substrate has been increased. For this reason, the amount of bending at the outer periphery of the substrate increases, and the inflection of the substrate causes a problem that the thickness of a film formed on the substrate becomes uneven. Further, since the suction-type spin chuck adsorbs the central portion of the back surface of the substrate, cleaning of the central portion of the back surface of the substrate is incomplete, and there is a disadvantage that residual contaminants adversely affect the processing of other substrates.
【０００６】また一方では、基板の裏面外周部および外
周端面をピン状部材で保持して基板に回転力を伝達する
メカ式スピンチャックが提案されている。On the other hand, there has been proposed a mechanical spin chuck which transmits a rotational force to a substrate by holding the outer peripheral portion and the outer peripheral end surface of the substrate with a pin-shaped member.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、メカ式
スピンチャックでは、高速回転時に、ピン状部材によっ
て風切り現象が生じ、基板の外周近傍で気流の乱れが生
じる。このため、基板上に処理液を回転塗布する場合に
は、ピン状部材による気流の乱れが塗布膜の表面に影響
を及ぼし、膜厚の不均一が生じるおそれがある。However, in the mechanical spin chuck, the pin-shaped member causes a wind-off phenomenon at the time of high-speed rotation, and turbulence of the air flow occurs near the outer periphery of the substrate. For this reason, when spin-coating the processing liquid on the substrate, the turbulence of the air flow due to the pin-shaped member may affect the surface of the coating film, and the thickness of the coating film may be uneven.
【０００８】本発明の目的は、風切り現象による基板の
処理むらを生じさせることなく基板を回転保持すること
が可能な基板処理装置を提供することである。An object of the present invention is to provide a substrate processing apparatus capable of rotating and holding a substrate without causing uneven processing of the substrate due to a wind-off phenomenon.
【０００９】[0009]
【課題を解決するための手段および発明の効果】第１の
発明に係る基板処理装置は、基板を保持して水平姿勢で
回転駆動される円板状部材を備え、基板を回転させなが
ら基板に所定の処理を行う基板処理装置であって、円板
状部材の上面に、基板の裏面の周縁部付近を部分的また
は全体的に吸引保持する吸引保持部を設けたものであ
る。Means for Solving the Problems and Effects of the Invention A substrate processing apparatus according to a first aspect of the present invention includes a disk-shaped member that holds a substrate and is driven to rotate in a horizontal posture. A substrate processing apparatus for performing a predetermined process, wherein a suction holding unit is provided on an upper surface of a disk-shaped member for partially or entirely sucking and holding a periphery of a rear surface of a substrate.
【００１０】第１の発明に係る基板処理装置において
は、基板の裏面周縁部付近を吸引保持部により吸着保持
する。しかも、基板は円板状部材の上方に近接保持され
る。このため、基板の上面外周近傍に風切り現象を生じ
させる部材が存在せず、これにより、風切り現象に起因
する気流の乱れにより基板上に形成される膜の厚さが不
均一となることを防止することができる。また、基板の
外周部を吸着することにより、基板の中央部が自重によ
って撓むことを抑制することができる。これにより、基
板の撓みによる膜厚の不均一の発生を防止することがで
きる。In the substrate processing apparatus according to the first aspect of the present invention, the vicinity of the periphery of the back surface of the substrate is suction-held by the suction holding section. Moreover, the substrate is held close to and above the disk-shaped member. For this reason, there is no member that causes the wind-break phenomenon near the outer periphery of the upper surface of the substrate, thereby preventing the thickness of the film formed on the substrate from being uneven due to the turbulence of the airflow caused by the wind-break phenomenon. can do. Further, by adsorbing the outer peripheral portion of the substrate, it is possible to suppress the central portion of the substrate from being bent by its own weight. Accordingly, it is possible to prevent the film thickness from being uneven due to the bending of the substrate.
【００１１】第２の発明に係る基板処理装置は、第１の
発明に係る基板処理装置の構成において、吸引保持部
が、円板状保持部の上面にリング状に設けられたもので
ある。[0011] A substrate processing apparatus according to a second aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein the suction holding section is provided in a ring shape on the upper surface of the disc-shaped holding section.
【００１２】この場合、基板の裏面の周縁部付近を全周
にわたって吸着保持することができる。それゆえ、基板
の撓みを抑制し、基板上の膜に生じる膜厚の不均一を防
止することができる。In this case, the vicinity of the peripheral edge of the back surface of the substrate can be held by suction over the entire circumference. Therefore, it is possible to suppress the deflection of the substrate and prevent the film thickness on the substrate from being uneven.
【００１３】第３の発明に係る基板処理装置は、第１の
発明に係る基板処理装置の構成において、吸引保持部が
円板状部材の上面に複数箇所設けられたものである。こ
の場合においても、基板の外周部を吸着保持することに
より特に中央部における基板の撓みを抑制し、それによ
って基板の撓みに起因する膜厚の不均一の発生を防止す
ることができる。加えて、基板と吸引保持部との接触面
積を小さくすることにより、モータ等の発熱源からの熱
が基板に伝えられることを抑制し、それによって基板の
温度不均一に起因する膜厚の不均一の発生を防止するこ
とができる。A substrate processing apparatus according to a third aspect of the present invention is the substrate processing apparatus according to the first aspect, wherein a plurality of suction holding portions are provided on the upper surface of the disk-shaped member. In this case as well, by holding the outer peripheral portion of the substrate by suction, the bending of the substrate, particularly at the central portion, can be suppressed, thereby preventing the occurrence of uneven film thickness due to the bending of the substrate. In addition, by reducing the contact area between the substrate and the suction holding unit, heat from a heat source such as a motor is prevented from being transmitted to the substrate, thereby reducing the thickness of the film due to uneven temperature of the substrate. Uniform occurrence can be prevented.
【００１４】第４の発明に係る基板処理装置は、第１〜
第３のいずれかの発明に係る基板処理装置の構成におい
て、吸引保持部が、基板の裏面を吸引する吸引口を備
え、円板状部材が、吸引保持部の吸引口に連通する吸引
通路を備えたものである。According to a fourth aspect of the present invention, there is provided a substrate processing apparatus comprising:
In the configuration of the substrate processing apparatus according to any one of the third inventions, the suction holding unit includes a suction port that suctions a back surface of the substrate, and the disc-shaped member includes a suction passage that communicates with the suction port of the suction holding unit. It is provided.
【００１５】この場合、吸引通路を通して吸引口から真
空吸引することにより、基板の裏面外周部を吸引保持部
に吸着して保持することができる。In this case, the outer peripheral portion of the back surface of the substrate can be sucked and held by the suction holding section by vacuum suction from the suction port through the suction passage.
【００１６】第５の発明に係る基板処理装置は、第４の
発明に係る基板処理装置の構成において、中空の通路が
形成されかつ先端部に円板状部材が取り付けられた回転
軸を有するモータをさらに備え、円板状部材の吸引通路
が回転軸の中空の通路に連通されたものである。According to a fifth aspect of the present invention, in the substrate processing apparatus according to the fourth aspect of the present invention, there is provided a motor having a rotary shaft in which a hollow passage is formed and a disk-shaped member is attached at a tip end. And the suction passage of the disc-shaped member is communicated with the hollow passage of the rotating shaft.
【００１７】これにより、回転軸の中空の通路の一端を
外部の真空吸引手段に接続することにより、吸引保持部
の吸引口、円板状部材の吸引通路および回転軸の中空通
路を通して吸引することが可能となり、基板を吸引保持
部上に真空吸着して保持することができる。By connecting one end of the hollow passage of the rotary shaft to the external vacuum suction means, suction is performed through the suction port of the suction holding portion, the suction passage of the disk-shaped member, and the hollow passage of the rotary shaft. This makes it possible to hold the substrate by vacuum suction on the suction holding unit.
【００１８】第６の発明に係る基板処理装置は、第５の
発明に係る基板処理装置の構成において、円板状部材
が、モータの回転軸に取り付けられる円板状の底板と、
底板の上面に接合される上板とを有し、吸引通路が底板
と上板との接合部に形成されたものである。A substrate processing apparatus according to a sixth aspect of the present invention is the substrate processing apparatus according to the fifth aspect, wherein the disk-shaped member has a disk-shaped bottom plate attached to a rotating shaft of a motor;
It has an upper plate joined to the upper surface of the bottom plate, and the suction passage is formed at a joint between the bottom plate and the upper plate.
【００１９】これにより、吸引通路が円板状部材の内部
に形成されることになり、円板状部材の外形が簡素化さ
れる。このため、円板状部材の回転によって風切り現象
が生じることが防止され、基板の外周上面に円板状部材
の風切り現象による膜厚の不均一等の悪影響が生じるこ
とを防止することができる。As a result, the suction passage is formed inside the disc-shaped member, and the outer shape of the disc-shaped member is simplified. For this reason, it is possible to prevent the occurrence of a wind-break phenomenon due to the rotation of the disc-shaped member, and to prevent an adverse effect such as a nonuniform film thickness due to the wind-break phenomenon of the disc-shaped member on the outer peripheral upper surface of the substrate.
【００２０】第７の発明に係る基板処理装置は、第１〜
第６のいずれかの発明に係る基板処理装置の構成におい
て、基板の裏面を支持して昇降する複数の昇降部材をさ
らに備え、円板状部材が、複数の昇降部材を通過させる
複数の孔と、孔を覆って閉塞するとともに、孔を通過す
る昇降部材の昇降動作に伴って伸縮するシート部材とを
備えたものである。According to a seventh aspect of the present invention, there is provided a substrate processing apparatus comprising:
In the configuration of the substrate processing apparatus according to any one of the sixth aspects of the present invention, the substrate processing apparatus may further include a plurality of elevating members that support the back surface of the substrate and move up and down. And a sheet member that covers and closes the hole, and that expands and contracts with the elevating operation of the elevating member that passes through the hole.
【００２１】シート部材は昇降部材の昇降動作に係わら
ず、常時円板状部材の孔を閉塞する。このため、円板状
部材の孔を通り基板の裏面側にミストやパーティクルが
侵入することが防止される。このため、円板状部材の上
方に保持された基板の裏面が清浄な状態に保たれ、基板
の裏面洗浄を不要にすることができる。また、シート部
材が伸縮自在であることにより、昇降部材が孔を通過し
て上昇する場合にも昇降部材の上昇動作を阻害すること
が防止される。The sheet member always closes the hole of the disc-shaped member regardless of the elevating operation of the elevating member. Therefore, mist and particles are prevented from entering the back surface of the substrate through the holes of the disk-shaped member. For this reason, the back surface of the substrate held above the disk-shaped member is kept in a clean state, and the back surface cleaning of the substrate can be eliminated. In addition, since the sheet member is expandable and contractible, it is possible to prevent the lifting member from obstructing the lifting operation even when the lifting member rises through the hole.
【００２２】[0022]
【発明の実施の形態】以下では、基板処理装置として回
転式塗布装置を例に説明する。図１は、本発明の第１の
実施例による回転式塗布装置の断面図である。図２は、
回転保持部の半断面を示す平面図であり、図３は図２中
のＡ−Ａ線断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a rotary coating apparatus will be described as an example of a substrate processing apparatus. FIG. 1 is a sectional view of a rotary coating apparatus according to a first embodiment of the present invention. FIG.
FIG. 3 is a plan view showing a half section of the rotation holding section, and FIG. 3 is a sectional view taken along line AA in FIG. 2.
【００２３】図１〜図３において、回転式塗布装置は、
モータ１の回転軸２の先端に水平に取り付けられた回転
保持部１０を備える。回転保持部１０は基板Ｗを水平姿
勢で保持して回転する。回転保持部１０の周囲には中空
のカップ３が配置されている。カップ３は基板Ｗから飛
散する処理液が外方へ拡散することを防止する。In FIG. 1 to FIG. 3, the rotary coating device is
The motor 1 includes a rotation holding unit 10 horizontally attached to a tip of a rotation shaft 2 of the motor 1. The rotation holding unit 10 rotates while holding the substrate W in a horizontal posture. A hollow cup 3 is arranged around the rotation holding unit 10. The cup 3 prevents the processing liquid scattered from the substrate W from diffusing outward.
【００２４】カップ３の下方には、３本の昇降ピン４が
配置されている。３本の昇降ピン４はピン支持フレーム
５に固定されており、ピン支持フレーム５の一端がエア
シリンダ６のロッドに連結されている。昇降ピン４はエ
アシリンダ６の伸縮動作に応じて昇降移動する。Below the cup 3, three lifting pins 4 are arranged. The three lifting pins 4 are fixed to a pin support frame 5, and one end of the pin support frame 5 is connected to a rod of an air cylinder 6. The lifting pin 4 moves up and down in accordance with the expansion and contraction operation of the air cylinder 6.
【００２５】回転保持部１０は円板状部材９と吸引保持
部１３とから構成され、円板状部材９はさらに底板１１
と上板１２とから構成される。底板１１は、基板Ｗとほ
ぼ同径の円板状の底部１１ａと、底部１１ａの外周上面
から上方に突出した周壁部１１ｂと、モータの回転軸２
の先端に嵌合固定される軸取付け部１１ｃとから構成さ
れる。また、図２に示すように、底板１１の上面には、
外周部に沿った凹溝からなる環状通路１４ａと、底板１
１ａの中心から放射状に延びる複数の凹溝からなる放射
状通路１４ｂが形成されている。この底板１１の上面に
は、環状通路１４ａの内径にほぼ等しい外径を有する円
板状の上板１２が溶接や溶着により接合される。上板１
２の下面は平坦に形成されている。このため、底板１１
上に上板１２を接合すると、凹溝からなる放射状通路１
４ｂが中空の通路となる。The rotation holder 10 comprises a disk-shaped member 9 and a suction holder 13, and the disk-shaped member 9 further includes a bottom plate 11.
And the upper plate 12. The bottom plate 11 has a disk-shaped bottom portion 11a having substantially the same diameter as the substrate W, a peripheral wall portion 11b protruding upward from the outer peripheral upper surface of the bottom portion 11a, and a rotating shaft 2 of the motor.
And a shaft mounting portion 11c fitted and fixed to the end of the shaft. As shown in FIG. 2, on the upper surface of the bottom plate 11,
An annular passage 14a formed of a concave groove along the outer peripheral portion;
A radial passage 14b composed of a plurality of concave grooves extending radially from the center of 1a is formed. A disk-shaped upper plate 12 having an outer diameter substantially equal to the inner diameter of the annular passage 14a is joined to the upper surface of the bottom plate 11 by welding or welding. Upper plate 1
The lower surface of 2 is formed flat. For this reason, the bottom plate 11
When the upper plate 12 is joined to the upper surface,
4b becomes a hollow passage.
【００２６】また、底板１１の周壁部１１ｂの内周面と
上板１２の外周端面との間の環状の空間には吸引保持部
１３が挿入される。吸引保持部１３の上面は上板１２の
上面よりも僅かに高くなるように形成されている。これ
により、吸引保持部１３の上面が基板Ｗの裏面外周部を
支持する。吸引保持部１３の幅は例えば５ｍｍ程度に設
定されている。吸引保持部１３には環状吸引口１３ａが
形成されており、環状吸引口１３ａは環状通路１４ａに
連通している。環状吸引口１３ａは基板外周のオリフラ
部（直線切欠部）やノッチ部に掛らない程度に基板外周
部より少し内側に設けられている。A suction holding portion 13 is inserted into an annular space between the inner peripheral surface of the peripheral wall portion 11b of the bottom plate 11 and the outer peripheral end surface of the upper plate 12. The upper surface of the suction holding section 13 is formed to be slightly higher than the upper surface of the upper plate 12. Thus, the upper surface of the suction holding unit 13 supports the outer peripheral portion of the back surface of the substrate W. The width of the suction holding unit 13 is set to, for example, about 5 mm. An annular suction port 13a is formed in the suction holding unit 13, and the annular suction port 13a communicates with an annular passage 14a. The annular suction port 13a is provided slightly inside the outer peripheral portion of the substrate so as not to cover the orientation flat portion (straight cutout portion) or the notch portion on the outer peripheral portion of the substrate.
【００２７】モータの回転軸２の内部には、中空部１４
ｃが形成されており、中空部１４ｃの上端は底板１１の
放射状通路１４ｂに連通している。また、中空部１４ｃ
の下端は、連結部１５を介して吸引管路１６に接続され
ている。さらに、吸引管路１６は外部の真空吸引装置
（図示せず）に接続されている。また、吸引管路１６の
途中には、開閉弁１７が配置されている。開閉弁１７は
基板Ｗの吸引保持のオンオフ動作を制御する。Inside the rotating shaft 2 of the motor, a hollow portion 14 is provided.
c is formed, and the upper end of the hollow portion 14c communicates with the radial passage 14b of the bottom plate 11. The hollow portion 14c
Is connected to a suction conduit 16 via a connecting portion 15. Further, the suction line 16 is connected to an external vacuum suction device (not shown). Further, an on-off valve 17 is arranged in the suction pipe 16. The on-off valve 17 controls the on / off operation of the suction holding of the substrate W.
【００２８】上記の構成により、吸引保持部１３の環状
吸引口１３ａ、底板１１の環状通路１４ａ、放射状通路
１４ｂ、回転軸の中空部１４ｃが回転塗布装置における
真空経路を構成している。With the above configuration, the annular suction port 13a of the suction holding portion 13, the annular passage 14a and the radial passage 14b of the bottom plate 11, and the hollow portion 14c of the rotating shaft constitute a vacuum path in the rotary coating device.
【００２９】図４は、図２中のＢ−Ｂ線断面図である。
回転保持部１０には、昇降ピン４を通過させる貫通孔２
２が形成されている。貫通孔２２は、底板１１および上
板１２を貫通して設けられている。上板１２の上面に
は、貫通孔２２の孔径よりも大きい閉塞用シート部材２
１が配置されている。閉塞用シート用部材２１は、ゴム
等の伸縮自在な弾性材料からなり、その外周部は上板１
２の上面に接着等により強固に固定されている。FIG. 4 is a sectional view taken along line BB in FIG.
The rotation holding unit 10 has a through hole 2 through which the lifting pin 4 passes.
2 are formed. The through hole 22 is provided through the bottom plate 11 and the upper plate 12. On the upper surface of the upper plate 12, a closing sheet member 2 larger than the hole diameter of the through hole 22 is provided.
1 is arranged. The closing sheet member 21 is made of a stretchable elastic material such as rubber.
2 is firmly fixed to the upper surface by bonding or the like.
【００３０】また、昇降ピン４が通過するカップ３の孔
７の上面側には、開閉自在な蓋８が設けられている。蓋
８の一端は回動自在にカップ３の内面に固定されてい
る。そして、常時孔７を閉塞する方向にばねによって付
勢されている。A lid 8 is provided on the upper surface side of the hole 7 of the cup 3 through which the lifting pin 4 passes. One end of the lid 8 is rotatably fixed to the inner surface of the cup 3. And it is always urged by a spring in a direction to close the hole 7.
【００３１】基板Ｗの搬入搬出時には、モータ１が、回
転保持部１０の貫通孔２２と昇降ピン４とが一致する位
置に回転保持部１０を停止させる。そして、昇降ピン４
が上昇する。昇降ピン４は、カップ３の蓋８を押し上げ
て孔７を通過し、さらに回転保持部１０の貫通孔２２内
を上昇する。そして、閉塞用シート部材２１を上方に引
き伸ばし、閉塞用シート部材２１を介して基板Ｗの裏面
を支持して上方へ移動する。昇降ピン４の先端は平坦に
形成され、これによって基板Ｗを安定に支持する。At the time of loading / unloading the substrate W, the motor 1 stops the rotation holding unit 10 at a position where the through hole 22 of the rotation holding unit 10 and the lifting pin 4 coincide. And the lifting pin 4
Rises. The lifting pin 4 pushes up the lid 8 of the cup 3, passes through the hole 7, and further rises in the through hole 22 of the rotation holding unit 10. Then, the closing sheet member 21 is stretched upward, and moves upward while supporting the back surface of the substrate W via the closing sheet member 21. The tips of the lifting pins 4 are formed flat, thereby stably supporting the substrate W.
【００３２】昇降ピン４が下降する場合には、上記と逆
に、昇降ピン４の下降に伴い閉塞用シート部材２１が元
の平坦な状態に復元する。さらに、蓋８がカップ３の孔
７を閉塞する。When the lifting pins 4 are lowered, the closing sheet member 21 is restored to its original flat state as the lifting pins 4 are lowered. Further, the lid 8 closes the hole 7 of the cup 3.
【００３３】上記構成を有する回転式塗布装置では、回
転保持部１０に基板Ｗを載置すると、基板Ｗの下面が吸
引保持部１３のみによって支持される。そして、開閉弁
１７を開いて真空引きを開始すると、吸引保持部１３は
環状吸引口１３ａを通して基板Ｗの下面外周部を吸引し
て基板Ｗを吸着保持する。これにより、基板Ｗの中央部
における自重による撓みが抑制される。また、回転保持
部１０は基板Ｗの外径とほぼ同径の周壁部１１ｂを有し
ている。このため、周壁部１１ｂによる回転時の風切り
現象がほとんど生じない。これにより、基板Ｗ上に塗布
膜を均一な膜厚に形成することができる。In the rotary coating apparatus having the above configuration, when the substrate W is placed on the rotation holding unit 10, the lower surface of the substrate W is supported only by the suction holding unit 13. Then, when the evacuation is started by opening the on-off valve 17, the suction holding unit 13 sucks and holds the substrate W by sucking the outer peripheral portion of the lower surface of the substrate W through the annular suction port 13 a. Thereby, the bending of the central portion of the substrate W due to its own weight is suppressed. In addition, the rotation holding unit 10 has a peripheral wall 11b having substantially the same diameter as the outer diameter of the substrate W. For this reason, the wind breaking phenomenon at the time of rotation by the peripheral wall portion 11b hardly occurs. Thereby, a coating film can be formed on the substrate W to have a uniform thickness.
【００３４】また、基板Ｗの下面側には、上板１２との
間に密閉された空間が構成される。しかも、円板状部材
９の貫通孔２２は閉塞用シート部材２１により常に閉塞
されている。これにより、貫通孔２２を通して処理液の
ミスト（液状粒子）が侵入して基板Ｗの裏面に付着する
ことが防止される。それゆえ、基板Ｗの裏面洗浄を不要
とすることができる。On the lower surface side of the substrate W, a closed space is formed between the substrate W and the upper plate 12. Moreover, the through hole 22 of the disc-shaped member 9 is always closed by the closing sheet member 21. This prevents mist (liquid particles) of the processing liquid from entering through the through-hole 22 and attaching to the back surface of the substrate W. Therefore, cleaning of the back surface of the substrate W can be omitted.
【００３５】図５は、本発明の第２の実施例による回転
式塗布装置の回転保持部の平面図であり、図６は図５中
のＣ−Ｃ線断面図である。FIG. 5 is a plan view of a rotation holding section of a rotary coating apparatus according to a second embodiment of the present invention, and FIG. 6 is a sectional view taken along line CC in FIG.
【００３６】第２の実施例では、基板Ｗの外周部付近が
部分的に吸引保持される。すなわち、回転保持部３０は
円板状部材３９、吸引保持部３３および支持部材３４か
ら構成される。さらに、円板状部材３９は底板引と上板
３２とから構成される。底板３１は、基板Ｗとほぼ同径
の円板状の底部３１ａと、回転軸２の先端部に嵌合固定
される軸取付け部３１ｃとからなる。底部３１ａの上面
側には、底板３１の中心から外周側に放射状に延びる３
本の凹溝からなる放射状通路１４ｅと、放射状通路１４
ｅに連通する円弧状の凹溝からなる中空部１４ｄが形成
されている。底板３１の上面には、ほぼ円板状の上板１
２が接合される。上板１２が接合された状態で凹溝から
なる放射状通路１４ｅが中空の通路となる。In the second embodiment, the vicinity of the outer peripheral portion of the substrate W is partially held by suction. That is, the rotation holding unit 30 includes the disk-shaped member 39, the suction holding unit 33, and the support member 34. Further, the disc-shaped member 39 is composed of a bottom plate and an upper plate 32. The bottom plate 31 includes a disk-shaped bottom portion 31 a having substantially the same diameter as the substrate W, and a shaft mounting portion 31 c fitted and fixed to the tip of the rotating shaft 2. On the upper surface side of the bottom portion 31a, 3 extends radially from the center of the bottom plate 31 to the outer peripheral side.
A radial passage 14e comprising a plurality of grooves;
A hollow portion 14d composed of an arc-shaped concave groove communicating with e is formed. On the upper surface of the bottom plate 31, a substantially disk-shaped upper plate 1 is provided.
2 are joined. When the upper plate 12 is joined, the radial passage 14e formed of a concave groove becomes a hollow passage.
【００３７】円板状部材３９の外周上面には３つの吸引
保持部３３が等間隔に配置されている。吸引保持部材３
３は底板３１上に固定された支持部材３４の上面に嵌入
固定されている。吸引保持部３３は複数（図示の例では
３個）の吸引口３３ａが形成されている。吸引口３３ａ
は中空部１４ｄに連通している。On the outer peripheral upper surface of the disk-shaped member 39, three suction holding portions 33 are arranged at equal intervals. Suction holding member 3
Reference numeral 3 is fitted and fixed on the upper surface of a support member 34 fixed on the bottom plate 31. The suction holding section 33 has a plurality of (three in the illustrated example) suction ports 33a. Suction port 33a
Communicates with the hollow portion 14d.
【００３８】この回転式塗布装置では、吸引保持部３３
の吸引口３３ａ、支持部材３４の中空部１４ｄ、放射状
通路１４ｅおよび回転軸２の中空部１４ｃにより真空経
路が構成されている。In this rotary coating apparatus, the suction holding section 33
A vacuum path is constituted by the suction port 33a, the hollow portion 14d of the support member 34, the radial passage 14e, and the hollow portion 14c of the rotating shaft 2.
【００３９】第２の実施例による回転式塗布装置の回転
保持部３０は、３つの吸引保持部３３により基板Ｗの裏
面外周を吸引して吸着保持する。これにより、第１の実
施例と同様に、基板Ｗの自重による撓みを抑制して保持
することができる。したがって、基板Ｗの撓みに起因す
る塗布膜の膜厚不均一を防止することができる。The rotary holding section 30 of the rotary coating apparatus according to the second embodiment sucks and holds the outer periphery of the back surface of the substrate W by three suction holding sections 33. Thereby, similarly to the first embodiment, the bending of the substrate W due to its own weight can be suppressed and held. Accordingly, it is possible to prevent the thickness of the coating film from being uneven due to the bending of the substrate W.
【００４０】また、吸引保持部３３および支持部材３４
は基板Ｗの下面側に配置されている。このため、吸引保
持部３３および支持部材３４による風切りの影響は基板
Ｗの上面側にほとんど及ばない。これにより、風切り現
象による膜厚の不均一を防止することができる。The suction holding section 33 and the supporting member 34
Are arranged on the lower surface side of the substrate W. For this reason, the influence of wind breaking by the suction holding unit 33 and the support member 34 hardly reaches the upper surface side of the substrate W. Thereby, it is possible to prevent the film thickness from being uneven due to the wind-off phenomenon.
【００４１】さらに、本実施例の回転保持部３０では、
基板Ｗと吸引保持部３３との接触面積が極めて小さい。
このため、モータ１で発生した熱が回転保持部３０を通
って基板Ｗに伝わることを防止することができる。これ
により、基板Ｗの温度不均一に起因する塗布膜の膜厚の
不均一を防止することができる。Further, in the rotation holding section 30 of this embodiment,
The contact area between the substrate W and the suction holding section 33 is extremely small.
Therefore, it is possible to prevent the heat generated by the motor 1 from being transmitted to the substrate W through the rotation holding unit 30. Accordingly, it is possible to prevent the thickness of the coating film from being uneven due to the uneven temperature of the substrate W.
【００４２】さらに、本実施例の回転保持部３０におい
て、支持部材３４の高さを大きくし、基板Ｗと円板状部
材３９との隙間を大きくすることができる。この場合に
は、基板Ｗの受渡しを行う基板搬送装置の基板保持アー
ムを基板Ｗと円板状部材３９との間に挿入して基板Ｗを
受渡すことができる。それにより、第１の実施例におけ
る昇降ピン４およびこれに関連する構成が不要となる。
また、支持部材３４の高さを小さくし、基板Ｗと円板状
部材３９との隙間を小さくした場合には、第１の実施例
と同様に、基板Ｗの昇降用の昇降ピン４、ピン支持フレ
ーム５、エアシリンダ６、カップ３の孔７、円板状部材
３９の貫通孔２２および閉塞用シート部材２１を設けれ
ばよい。Further, in the rotation holding section 30 of the present embodiment, the height of the support member 34 can be increased, and the gap between the substrate W and the disk-shaped member 39 can be increased. In this case, the substrate W can be transferred by inserting the substrate holding arm of the substrate transfer device that transfers the substrate W between the substrate W and the disc-shaped member 39. This eliminates the need for the lifting pins 4 and the configuration related thereto in the first embodiment.
When the height of the support member 34 is reduced and the gap between the substrate W and the disk-shaped member 39 is reduced, the lifting pins 4 and the pins 4 for lifting the substrate W are used as in the first embodiment. What is necessary is just to provide the support frame 5, the air cylinder 6, the hole 7 of the cup 3, the through-hole 22 of the disc-shaped member 39, and the closing sheet member 21.
【００４３】図７は、本発明の第３の実施例による回転
式塗布装置の回転保持部の部分断面図である。第３の実
施例による回転保持部は、基板Ｗの裏面を吸引する吸引
保持部４３が上板１２と底板１１とから構成され、上板
１２の周壁外面と底板１１の周壁内面との間に吸引口４
３ａが形成されている。吸引保持部４３および吸引口４
３ａは第１の実施例における吸引保持部１３および環状
吸引口１３ａと同様に形成されてもよく、また第２の実
施例における吸引保持部３３および吸引口３３ａと同様
に形成されてもよい。FIG. 7 is a partial cross-sectional view of a spin holder of a spin coater according to a third embodiment of the present invention. In the rotation holding unit according to the third embodiment, the suction holding unit 43 for sucking the back surface of the substrate W is composed of the upper plate 12 and the bottom plate 11, and is located between the outer peripheral surface of the upper plate 12 and the inner surface of the peripheral wall of the bottom plate 11. Suction port 4
3a are formed. Suction holding section 43 and suction port 4
3a may be formed similarly to the suction holding section 13 and the annular suction port 13a in the first embodiment, or may be formed similarly to the suction holding section 33 and the suction port 33a in the second embodiment.
【００４４】なお、上記実施例においては回転式塗布装
置を例に説明したが、本発明による回転保持部１０，３
０は回転式現像装置、回転式洗浄装置等の回転式の基板
処理装置に適用することができる。In the above embodiment, the rotary type coating apparatus has been described as an example, but the rotary holding units 10 and 3 according to the present invention are used.
0 can be applied to a rotary substrate processing apparatus such as a rotary developing apparatus and a rotary cleaning apparatus.
【図１】本発明の第１の実施例による回転式塗布装置の
断面図である。FIG. 1 is a sectional view of a rotary coating apparatus according to a first embodiment of the present invention.
【図２】図１の回転保持部の平面図である。FIG. 2 is a plan view of the rotation holding unit of FIG.
【図３】図２中のＡ−Ａ線断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】図２中のＢ−Ｂ線断面図である。FIG. 4 is a sectional view taken along line BB in FIG. 2;
【図５】本発明の第２の実施例による回転式塗布装置の
回転保持部の平面図である。FIG. 5 is a plan view of a rotation holding unit of a rotary coating device according to a second embodiment of the present invention.
【図６】図５のＣ−Ｃ線断面図である。FIG. 6 is a sectional view taken along line CC of FIG. 5;
【図７】本発明の第３の実施例による回転式塗布装置の
回転保持部の部分断面図である。FIG. 7 is a partial cross-sectional view of a rotation holding unit of a rotary coating device according to a third embodiment of the present invention.
２ 回転軸 ４ 昇降ピン ９，３９ 円板状部材 １０，３０ 回転保持部 １１，３１ 底板 １２，３２ 上板 １３，３３，４３ 吸引保持部 １３ａ 環状吸引口 １４ａ 環状通路 １４ｂ，３４ｂ 放射状通路 １４ｃ，１４ｄ，３４ｄ 中空部 ２１ 閉塞用シート部材 ２２ 貫通孔 ３３ａ，４３ａ 吸引口 ３４ 支持部材 2 Rotating shaft 4 Lifting pin 9, 39 Disc-shaped member 10, 30 Rotation holding part 11, 31 Bottom plate 12, 32 Upper plate 13, 33, 43 Suction holding part 13a Annular suction port 14a Annular passage 14b, 34b Radial passage 14c, 14d, 34d Hollow part 21 Closure sheet member 22 Through hole 33a, 43a Suction port 34 Support member
Claims (7)
る円板状部材を備え、前記基板を回転させながら前記基
板に所定の処理を行う基板処理装置であって、 前記円板状部材の上面に、前記基板の裏面の周縁部付近
を部分的または全体的に吸引保持する吸引保持部を設け
たことを特徴とする基板処理装置。1. A substrate processing apparatus comprising: a disk-shaped member that holds a substrate and is driven to rotate in a horizontal posture, and performs a predetermined process on the substrate while rotating the substrate; A substrate holding apparatus provided on an upper surface of the substrate with a suction holding portion for partially or entirely sucking and holding the vicinity of a peripheral portion of the back surface of the substrate.
面にリング状に設けられたことを特徴とする請求項１記
載の基板処理装置。2. The substrate processing apparatus according to claim 1, wherein the suction holding unit is provided in a ring shape on an upper surface of the disk-shaped member.
面に複数箇所設けられたことを特徴とする請求項１記載
の基板処理装置。3. The substrate processing apparatus according to claim 1, wherein a plurality of the suction holding units are provided on an upper surface of the disk-shaped member.
引する吸引口を備え、 前記円板状部材は、前記吸引保持部の前記吸引口に連通
する吸引通路を備えたことを特徴とする請求項１〜３の
いずれかに記載の基板処理装置。4. The suction holding section includes a suction port for sucking a back surface of the substrate, and the disc-shaped member includes a suction passage communicating with the suction port of the suction holding section. The substrate processing apparatus according to claim 1.
円板状部材が取り付けられた回転軸を有するモータをさ
らに備え、 前記円板状部材の前記吸引通路が前記回転軸の前記中空
の通路に連通されたことを特徴とする請求項４記載の基
板処理装置。5. A motor having a rotary shaft having a hollow passage formed therein and having the disk-shaped member attached to a distal end thereof, wherein the suction passage of the disk-shaped member has the hollow shaft of the rotary shaft. The substrate processing apparatus according to claim 4, wherein the substrate processing apparatus is connected to the passage.
転軸に取り付けられる円板状の底板と、 前記底板の上面に接合される上板とを有し、 前記吸引通路は前記底板と前記上板との接合部に形成さ
れたことを特徴とする請求項５記載の基板処理装置。6. The disk-shaped member has a disk-shaped bottom plate attached to the rotating shaft of the motor, and an upper plate joined to an upper surface of the bottom plate, and the suction passage is provided between the bottom plate and the bottom plate. The substrate processing apparatus according to claim 5, wherein the substrate processing apparatus is formed at a joint portion with the upper plate.
の昇降部材をさらに備え、 前記円板状部材は、前記複数の昇降部材を通過させる複
数の孔と、前記孔を覆って閉塞するとともに、前記孔を
通過する前記昇降部材の昇降動作に伴って伸縮するシー
ト部材とを備えたことを特徴とする請求項１〜６のいず
れかに記載の基板処理装置。7. A plurality of elevating members for supporting and lowering the back surface of the substrate, wherein the disc-shaped member covers a plurality of holes through which the plurality of elevating members pass, and covers the holes. The substrate processing apparatus according to any one of claims 1 to 6, further comprising: a sheet member that expands and contracts in accordance with an elevating operation of the elevating member that passes through the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13721797A JPH10335437A (en) | 1997-05-27 | 1997-05-27 | Wafer processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13721797A JPH10335437A (en) | 1997-05-27 | 1997-05-27 | Wafer processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10335437A true JPH10335437A (en) | 1998-12-18 |
Family
ID=15193531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13721797A Pending JPH10335437A (en) | 1997-05-27 | 1997-05-27 | Wafer processor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10335437A (en) |
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| WO2005013334A3 (en) * | 2003-08-01 | 2007-08-09 | Sgl Carbon Ag | Holder for supporting wafers during semiconductor manufacture |
| JP2009111024A (en) * | 2007-10-26 | 2009-05-21 | Applied Materials Inc | Substrate support member for chemical and mechanical polishing apparatus, and chemical mechanical polishing apparatus |
| CN101829647A (en) * | 2009-03-11 | 2010-09-15 | 东丽工程株式会社 | Decompression drying device |
| JP2010219190A (en) * | 2009-03-16 | 2010-09-30 | Dainippon Printing Co Ltd | Thin film forming apparatus and thin film forming method |
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| JP2020031150A (en) * | 2018-08-23 | 2020-02-27 | 日本特殊陶業株式会社 | Vacuum chuck and manufacturing method thereof |
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| WO2022153774A1 (en) * | 2021-01-15 | 2022-07-21 | 東レエンジニアリング株式会社 | Wafer holding device |
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1997
- 1997-05-27 JP JP13721797A patent/JPH10335437A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005013334A3 (en) * | 2003-08-01 | 2007-08-09 | Sgl Carbon Ag | Holder for supporting wafers during semiconductor manufacture |
| JP2009111024A (en) * | 2007-10-26 | 2009-05-21 | Applied Materials Inc | Substrate support member for chemical and mechanical polishing apparatus, and chemical mechanical polishing apparatus |
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