JPH10330984A - Production of electrolytic copper foil - Google Patents
Production of electrolytic copper foilInfo
- Publication number
- JPH10330984A JPH10330984A JP14359397A JP14359397A JPH10330984A JP H10330984 A JPH10330984 A JP H10330984A JP 14359397 A JP14359397 A JP 14359397A JP 14359397 A JP14359397 A JP 14359397A JP H10330984 A JPH10330984 A JP H10330984A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- polishing
- cathode drum
- electrolytic copper
- drum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電解銅箔の粗面の
粗さを増大させることなく粗面形状の均一性を向上させ
ることにより合成樹脂含浸基材との接着力を向上させる
と共に、該銅箔をエッチングした後の基板表面の粗さ、
形状の均一性にも寄与させた銅張積層板等に用いられる
電解銅箔の製造方法に関するものである。BACKGROUND OF THE INVENTION The present invention relates to a method for improving the adhesion of a copper foil to a synthetic resin-impregnated base material by improving the uniformity of the rough surface shape without increasing the roughness of the rough surface of the electrolytic copper foil. Roughness of the substrate surface after etching the copper foil,
The present invention relates to a method for producing an electrolytic copper foil used for a copper-clad laminate or the like which also contributes to uniformity of the shape.
【０００２】[0002]
【従来の技術】近年、電解銅箔を合成樹脂含浸基材（以
下、基材と言う。）に貼り合わせた銅張積層板は、各種
電子機器のプリント配線板として多用されている。従
来、電解銅箔の製造方法は硫酸銅および硫酸を主成分と
する酸性銅メッキ液に基材との接着力を向上させる目的
で、メッキ液に接する銅箔面（以下、粗面と言う。）の
コブの形状をピラミッド型に整える効果のあるにかわ、
ゼラチン等の有機添加剤が添加されている。そして、回
転するチタン等で作製された陰極ドラム上に銅を析出さ
せ、ひきはがし、銅箔を連続的に製造する方法がとられ
ている。（この工程を造箔工程と言う。）この造箔工程
において、チタン等で作製された陰極ドラム表面はメッ
キ液等による腐食のため定期的に研磨が実施されてい
る。従来、この研磨はナイロン不織布等に酸化アルミ、
シリコンカーバイト等の研磨砥粒を均一に接着含浸させ
た円筒型研磨バフ（以下円筒型研磨バフと言う。）によ
り行なわれ、陰極ドラムを回転させながら円筒型研磨バ
フを回転させて行なう。この場合、陰極ドラムの軸と円
筒型研磨バフの軸は、平行に配置して行われるため陰極
ドラムの円周方向に一方向の研磨跡を有した陰極ドラム
となる。また、特開平８−２４６１８３号に見られる様
な電解銅箔の製造方法が提案されている。この方法では
陰極ドラムを回転させながら、平板に貼り合わせた円筒
型研磨バフと同様の材質で作られたシート状の研磨パッ
ド（以下、シート状研磨パッドと言う。）を陰極ドラム
の軸に対し平行になるように往復運動させて研磨を行
う。この場合、少なくとも２方向以上の研磨跡を有した
陰極ドラムとなる。この様にして研磨した陰極ドラムを
用いて製造した電解銅箔は、銅箔の平滑面（陰極ドラム
に接した面）に縦方向に一方向の研磨跡、又は少なくと
も２方向以上の研磨跡を有した銅箔となる。2. Description of the Related Art In recent years, a copper-clad laminate obtained by laminating an electrolytic copper foil to a synthetic resin-impregnated base material (hereinafter referred to as a base material) has been widely used as a printed wiring board for various electronic devices. 2. Description of the Related Art Conventionally, a method for producing an electrolytic copper foil has a copper foil surface (hereinafter, referred to as a rough surface) in contact with a plating solution for the purpose of improving the adhesive strength of an acidic copper plating solution containing copper sulfate and sulfuric acid as a main component to a substrate. ) Has the effect of shaping the bumps into a pyramid shape.
Organic additives such as gelatin are added. Then, a method is employed in which copper is deposited on a cathode drum made of rotating titanium or the like, peeled off, and a copper foil is continuously produced. (This step is called a foil making step.) In this foil making step, the surface of the cathode drum made of titanium or the like is periodically polished for corrosion by a plating solution or the like. Conventionally, this polishing has been performed on aluminum oxide,
The polishing is performed by a cylindrical polishing buff (hereinafter referred to as a cylindrical polishing buff) in which polishing abrasive grains such as silicon carbide are uniformly adhered and impregnated, and the cylindrical polishing buff is rotated while rotating the cathode drum. In this case, since the axis of the cathode drum and the axis of the cylindrical polishing buff are arranged in parallel, the cathode drum has a polishing mark in one direction in the circumferential direction of the cathode drum. Also, a method for producing an electrolytic copper foil as disclosed in Japanese Patent Application Laid-Open No. 8-246183 has been proposed. In this method, a sheet-like polishing pad (hereinafter, referred to as a sheet-like polishing pad) made of the same material as a cylindrical polishing buff bonded to a flat plate while rotating the cathode drum is attached to the axis of the cathode drum. Polishing is performed by reciprocating so as to be parallel. In this case, the cathode drum has polishing marks in at least two directions. The electrodeposited copper foil manufactured using the cathode drum polished in this manner has a polishing mark in one direction in the longitudinal direction or a polishing mark in at least two directions on the smooth surface (the surface in contact with the cathode drum) of the copper foil. Copper foil.
【０００３】次に、この造箔工程で作製された電解銅箔
の状態では基材との接着力が十分に得られないため、銅
箔粗面のコブに限界電流密度付近の電流密度で銅の粉末
とメッキの中間的な塊状のコブを析出させ、基材との接
着力を向上させる。これを投錨効果またはアンカー効果
と言う。(この工程を粗化処理工程と言う。)次に、耐熱
性、耐薬品性を付与する処理が行なわれ（この工程を最
終処理工程と言う。）プリント配線用の電解銅箔が製造
されている。基材との接着力を向上させるには、造箔工
程での銅箔粗面のコブの形状をピラミッド型形状に整
え、コブの均一性を向上させることが重要であると言わ
れており、粗化処理工程だけでは限度があると言われて
いる。[0003] Next, in the state of the electrolytic copper foil produced in this foil making step, the adhesive strength to the substrate is not sufficiently obtained, so that the copper bumps on the rough surface of the copper foil at the current density near the limit current density are removed. Lump, which is in the middle of the powder and the plating, is deposited to improve the adhesion to the substrate. This is called an anchor effect or an anchor effect. (This step is called a roughening treatment step.) Next, a treatment for imparting heat resistance and chemical resistance is performed (this step is called a final treatment step), and an electrolytic copper foil for printed wiring is manufactured. I have. In order to improve the adhesive strength with the substrate, it is said that it is important to improve the uniformity of the bump by adjusting the shape of the bump on the rough surface of the copper foil in the foil forming process to a pyramid shape, It is said that the roughening process alone has a limit.
【０００４】ところが最近では、電子機器の多機能化、
軽薄短小化に伴い多層プリント配線板の使用が広がり、
高い信頼性が要求され、多層プリント配線板に用いられ
る電解銅箔にも多層プリント配線板に適した特性が要求
される様になり、HTE 銅箔等が出現した。このHTE 銅箔
（High Temperature Elongation Electrodepositedの
略）は、高温加熱時の伸びが優れた銅箔で、特公平２−
２５９９５号に示す製造方法で製造することが出来る
が、高温加熱時の伸びを向上させるために、高温加熱時
の伸びを低下させる効果があるゼラチンの添加量を低く
抑える必要がある。その代わりに銅箔粗面のコブの形状
をピラミッド形状に整え、コブの均一性を整える目的
で、高温加熱時の伸びに影響を与えないイソプロパノー
ルアミンがゼラチンと併用して添加されていたが、十分
な効果が得られず、粗面形状の均一性も十分満足のいく
ものではなく、基材との接着力および該銅箔をエッチン
グした後の基板表面の粗さ、形状の均一性においても十
分なものとは言えなかった。それ故、基材との接着力を
向上させるために銅箔粗面のコブがピラミッド型形状
で、コブの均一性が高いHTE 銅箔が要望され、この課題
を解決するための手段として特開平８−２４６１８３号
に見られる様な電解銅箔の製造方法が提案され、効果は
認められるものの、近年、高密度化、薄物化進展の著し
い多層プリント配線板の高密度、高信頼性の要求に対し
て十分満足のいくものではなかった。Recently, however, multifunctional electronic devices have been developed.
The use of multi-layer printed wiring boards has expanded with the trend toward lighter and smaller,
High reliability is required, and the characteristics suitable for multilayer printed wiring boards are also required for electrolytic copper foil used for multilayer printed wiring boards, and HTE copper foil and the like have emerged. This HTE copper foil (short for High Temperature Elongation Electrodeposited) is a copper foil with excellent elongation when heated at high temperatures.
Although it can be produced by the production method described in No. 25995, it is necessary to suppress the addition amount of gelatin having an effect of decreasing the elongation at the time of high-temperature heating in order to improve the elongation at the time of high-temperature heating. Instead, isocopanolamine, which does not affect the elongation during high-temperature heating, was added in combination with gelatin for the purpose of adjusting the shape of the bump on the rough surface of the copper foil into a pyramid shape and adjusting the uniformity of the bump, Sufficient effects are not obtained, and the uniformity of the rough surface shape is not sufficiently satisfactory, and the adhesive strength to the substrate and the roughness of the substrate surface after etching the copper foil, the uniformity of the shape It was not enough. Therefore, there is a demand for an HTE copper foil having a pyramid-shaped bump on the rough surface of the copper foil and a high bump uniformity in order to improve the adhesive strength to the substrate. A method for producing an electrolytic copper foil as disclosed in Japanese Patent Application Laid-Open No. 8-246183 has been proposed, and although its effect has been recognized, in recent years, there has been a demand for high density and high reliability of a multilayer printed wiring board in which densification and thinning are remarkably progressing. It was not satisfactory enough.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は、従来
の電解銅箔では得られなかった電解銅箔の粗面の粗さを
増大させることなく粗面形状の均一性を向上させること
により合成樹脂含浸基材との接着力を向上させると共
に、該銅箔をエッチングした後の基板表面の粗さ、形状
の均一性にも寄与させた銅張積層板等に用いられる電解
銅箔を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to improve the uniformity of the rough surface shape without increasing the roughness of the rough surface of the electrolytic copper foil which cannot be obtained by the conventional electrolytic copper foil. Provided is an electrolytic copper foil used for copper-clad laminates and the like, which has improved adhesion to a synthetic resin-impregnated base material and has contributed to the roughness and shape uniformity of the substrate surface after etching the copper foil. Is to do.
【０００６】[0006]
【課題を解決するための手段】本発明は、電解銅箔の粗
面粗さを増大させることなく粗面のコブの形状をピラミ
ッド型形状に整え、コブの均一性を向上させたHTE 銅箔
を検討した結果、発明したもので、円筒型陰極ドラムに
対向するように陽極を配置し陰極ドラム上に銅を析出さ
せた後、引き剥がし連続的に電解銅箔を製造する方法に
おいて、陰極ドラムを回転させながら、研磨体を陰極ド
ラム表面に接触、加圧させた状態で、研磨体を陰極ドラ
ムの軸に対し平行方向に往復運動をさせると同時に、該
ドラム表面に対して垂直方向（Ｚ軸方向）に動かし表面
の研磨を行った陰極ドラムを用いることを特徴とする電
解銅箔の製造方法である。DISCLOSURE OF THE INVENTION The present invention relates to an HTE copper foil in which the roughness of the roughened surface is adjusted to a pyramid shape without increasing the roughened surface roughness of the electrolytic copper foil, and the uniformity of the roughened surface is improved. As a result of studying the above, in the method of producing an electrolytic copper foil by peeling and continuously producing an electrolytic copper foil after depositing copper on the cathode drum by disposing the anode so as to face the cylindrical cathode drum, While rotating the polishing body, the polishing body is reciprocated in a direction parallel to the axis of the cathode drum while the polishing body is in contact with and pressed against the surface of the cathode drum, and at the same time, in a direction perpendicular to the drum surface (Z This is a method for producing an electrolytic copper foil, characterized by using a cathode drum whose surface has been polished by moving in the axial direction).
【０００７】本発明について図１に基づき説明する。図
１は本発明の電解銅箔の製造方法である陰極ドラムの研
磨装置の一例を示す概略図である。陰極ドラム１を回転
させながら、平板３に貼り合わせたシート状研磨パッド
２を陰極ドラム表面に接触、加圧させた状態で、陰極ド
ラムの軸に対し平行方向に往復運動させて研磨を行うと
同時に、陰極ドラム表面に対して垂直方向（Ｚ軸方向）
に研磨出来るように平板３に垂直方向に振動を与えるバ
イブレータ４（シャフトにアンバランスウエイトを取り
付けることにより振動を発生するモータ）を固定する構
造になっている。従来の研磨方法は、陰極ドラム表面に
対し水平方向（ＸＹ軸方向）であったため小さな凹凸が
ある陰極ドラム表面の凹部を十分に研磨出来ず酸化被膜
等が十分取りきれず残っていると考えられ、清浄に研磨
された表面との間にメッキ液中で電位差を生じ、銅が陰
極ドラム表面において均一に初期の析出を開始しないた
め所定の厚さに生長する過程でも均一に生長出来ず、コ
ブが大小不均一で形状もピラミッド型形状にならないと
考えられる。本発明の研磨方法は、従来の研磨方法に比
べ陰極ドラム表面に対して垂直方向（Ｚ軸方向）にも研
磨出来るように平板３に垂直方向に振動を与えるバイブ
レータ４を固定する構造になっているため、陰極ドラム
表面の凹部まで十分に研磨せしめることによって、全体
が清浄な表面となり銅が陰極ドラム表面において均一に
初期の析出を開始し、所定の厚さに生長する過程でも均
一に生長し、コブの形状がピラミッド型でコブが均一な
粗面形状を得ることが出来ると考えられる。この様にし
て研磨した陰極ドラムを用いて製造した電解銅箔は、銅
箔粗面の粗さを増大させることなく、コブの形状をピラ
ミッド型形状に整え、コブの均一性を向上させ基材との
接着力を向上させた。The present invention will be described with reference to FIG. FIG. 1 is a schematic view showing one example of a polishing apparatus for a cathode drum which is a method for producing an electrolytic copper foil of the present invention. When the polishing is performed by rotating the cathode drum 1 and reciprocating in a direction parallel to the axis of the cathode drum while the sheet-like polishing pad 2 bonded to the flat plate 3 is in contact with and pressed against the surface of the cathode drum. At the same time, perpendicular to the cathode drum surface (Z-axis direction)
The vibrator 4 (a motor that generates vibration by attaching an unbalanced weight to a shaft) that applies vibration to the flat plate 3 in the vertical direction so that the plate 3 can be polished is fixed. In the conventional polishing method, since it is in the horizontal direction (XY axis direction) with respect to the cathode drum surface, it is considered that a concave portion on the cathode drum surface having small irregularities cannot be sufficiently polished, and an oxide film or the like cannot be sufficiently removed and remains. A potential difference occurs in the plating solution between the cleanly polished surface and the copper, which does not start the initial deposition on the surface of the cathode drum uniformly. However, it is considered that the shape is not uniform and the shape does not become a pyramid shape. The polishing method of the present invention has a structure in which a vibrator 4 that applies vibration to the flat plate 3 in the vertical direction is fixed so that the polishing can be performed in the vertical direction (Z-axis direction) with respect to the cathode drum surface as compared with the conventional polishing method. Therefore, by thoroughly polishing the recesses on the surface of the cathode drum, the entire surface becomes a clean surface, and the copper starts to precipitate at the initial stage uniformly on the surface of the cathode drum and grows evenly in the process of growing to a predetermined thickness. It is considered that the shape of the bump can be obtained as a pyramid-shaped rough bump having a uniform bump. Electrodeposited copper foil manufactured using the cathode drum polished in this way, without increasing the roughness of the copper foil rough surface, adjust the shape of the bump into a pyramid shape, improve the uniformity of the bump, And improved the adhesion.
【０００８】[0008]
【実施例】以下、本発明を実施例に基づき具体的に説明
するが、本発明はこれに限定されるものではない。 実施例(1) 直径1515mmのチタン製陰極ドラムを用い、陰極ドラムを
回転させ、陰極ドラムの表面速度を300mm/sec、シート
状研磨パッド(#1500)を貼り合わせた平板を陰極ドラム
の軸に対して平行方向に50mmの振幅で往復運動をさせ、
平板の速度を150mm/sec、接触圧力を50gf/cm2に設定し
研磨を行うと同時に、陰極ドラム表面に対して垂直方向
（Ｚ軸方向）にバイブレータ（村上精機製 ユーラスバ
イブレータＫＥＥ−１０−２Ｂ 振動力１００％設定 ３
６００回転／分）で振動を与え、30分間表面の研磨を行
った陰極ドラムを用い、電解液として硫酸銅 250g/ｌ、
硫酸130g/ｌを含む液にトリイソプロパノールアミンを1
0ppm、ゼラチンを0.15ppm添加した電解液を用いて、液
温45℃、電流密度40A/dm2で厚さ35μｍの電解銅箔を製
造した。 実施例(2) 回転する陰極ドラムの表面速度を150mm/secから600mm/s
ecの間で変化させ、シート状研磨パッド(#1500)を貼り
合わせた平板の速度を25mm/secから100mm/secの間で変
化させ、他の条件は実施例１と同じ条件で35μｍ銅箔の
製造を行なった。 実施例(3) 実施例(2)において、トリイソプロパノールアミン10ppm
、ゼラチン0.15ppmを添加する代わりに、ゼラチン2ppm
を添加し、35μｍ銅箔の製造を行なった。 比較例(1) 実施例(1)においてバイブレータを停止し研磨を行い、
他の条件は実施例(1)と同じ条件で35μｍ銅箔の製造を
行なった。 比較例(2) 実施例(2)においてバイブレータを停止し研磨を行い、
他の条件は実施例(2)と同じ条件で35μｍ銅箔の製造を
行なった。 比較例(3) 実施例(3)においてバイブレータを停止し研磨を行い、
他の条件は実施例(3)と同じ条件で35μｍ銅箔の製造を
行なった。 比較例(4) 回転する陰極ドラムの表面速度を 300mm/secとし円筒型
研磨バフを回転させ表面速度を15000mm/secに設定し一
方向に30分間研磨を行い、他の条件は実施例(1)と同じ
条件で35μｍ銅箔の製造を行なった。EXAMPLES Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples. Example (1) Using a titanium cathode drum having a diameter of 1515 mm, rotating the cathode drum, the surface speed of the cathode drum was 300 mm / sec, and a flat plate on which a sheet-like polishing pad (# 1500) was attached was attached to the axis of the cathode drum. Reciprocating with an amplitude of 50 mm in the parallel direction,
Polishing is performed while setting the speed of the flat plate at 150 mm / sec and the contact pressure at 50 gf / cm 2 , and at the same time, vibrator (Eurus vibrator KEE-10-2B manufactured by Murakami Seiki) in a direction perpendicular to the surface of the cathode drum (Z axis direction). Vibration force 100% setting 3
(600 rpm), using a cathode drum whose surface was polished for 30 minutes, and copper sulfate 250 g / l as an electrolytic solution.
Triisopropanolamine in a solution containing 130 g / l sulfuric acid
Using an electrolytic solution containing 0 ppm and 0.15 ppm of gelatin, an electrolytic copper foil having a liquid temperature of 45 ° C., a current density of 40 A / dm 2 and a thickness of 35 μm was produced. Example (2) The surface speed of the rotating cathode drum was increased from 150 mm / sec to 600 mm / s.
ec, and the speed of the flat plate on which the sheet-like polishing pad (# 1500) was bonded was changed between 25 mm / sec and 100 mm / sec. Was manufactured. Example (3) In Example (2), triisopropanolamine 10 ppm
Instead of adding 0.15 ppm of gelatin, 2 ppm of gelatin
Was added to produce a 35 μm copper foil. Comparative Example (1) Polishing with stopping the vibrator in Example (1),
Other conditions were the same as those in Example (1) to produce a 35 μm copper foil. Comparative Example (2) Polishing was performed by stopping the vibrator in Example (2),
Other conditions were the same as those in Example (2) to produce a 35 μm copper foil. Comparative Example (3) Polishing with stopping the vibrator in Example (3),
Other conditions were the same as those in Example (3) to produce a 35 μm copper foil. Comparative Example (4) The surface speed of the rotating cathode drum was set to 300 mm / sec, the cylindrical polishing buff was rotated to set the surface speed to 15000 mm / sec, and polishing was performed in one direction for 30 minutes. ) Was manufactured under the same conditions as in the above.
【０００９】以上の実施例 (1)〜(3)、比較例 (1)〜(4)
の各銅箔を下記の特性について測定し、結果を表１に示
す。 (1) 粗面形状の均一性 銅箔粗面側の電析状態を走査型顕微鏡を用い1000倍で観
察を行なった。近年プリント配線板の回路幅が狭くな
り、銅箔と基材との接着性が高く、安定していることが
望まれ、銅箔粗面の電析状態が、ピラミッド型をしたコ
ブが均一に電析している時、接着力も高く安定してい
る。評価は、ピラミッド型のコブが均一に析出している
場合を◎、ピラミッド型のコブではあるがやや不均一に
析出している場合を○、ピラミッド型のコブではあるが
不均一に析出している場合を△、ピラミッド型のコブで
はなく不規則なコブが不均一に析出している場合を×と
した。 (2) 高温(180℃) における伸び率 高温(180℃)における伸び率をIPC規格のIPC-TM-650に基
づき測定した。 (3) 粗面粗さ 銅箔粗面粗さをJIS B 0601, JIS B 0651に基づき十点平
均粗さ（ＲZ）の測定を行なった。 (4) 粗化処理後の粗面粗さおよび引きはがし強さ 実施例 (1)〜(3)、比較例 (1)〜(4)の各銅箔を公知の粗
化処理法を用い同一条件で粗化処理を行ない粗化処理後
の銅箔粗面粗さをJIS B 0601, JIS B 0651に基づき十点
平均粗さ（ＲZ）の測定を行なった。また、粗化処理後
の銅箔をFR-4基材(ガラスエポキシ基材)に成形後、JIS
C 6481に基づき引きはがし強さを測定した。The above Examples (1) to (3) and Comparative Examples (1) to (4)
Were measured for the following properties, and the results are shown in Table 1. (1) Uniformity of Rough Surface Shape The electrodeposited state on the copper foil rough surface side was observed at a magnification of 1000 using a scanning microscope. In recent years, the circuit width of printed wiring boards has become narrower, and it is desired that the adhesion between the copper foil and the base material is high and stable, and the electrodeposition of the copper foil rough surface is uniform with pyramid-shaped bumps. During electrodeposition, the adhesive strength is high and stable. In the evaluation, ピ ラ indicates that pyramid-shaped bumps are uniformly deposited, を indicates that pyramid-shaped bumps are slightly non-uniformly deposited, and 、 indicates that pyramid-shaped bumps are unevenly deposited. The case where い る was present, and the case where irregular bumps were unevenly deposited instead of pyramid-shaped bumps were marked as ×. (2) Elongation at high temperature (180 ° C) The elongation at high temperature (180 ° C) was measured based on IPC-TM-650 of the IPC standard. (3) Roughness Roughness The ten-point average roughness (R Z ) of copper foil rough surface roughness was measured based on JIS B 0601 and JIS B 0651. (4) Rough surface roughness and peel strength after roughening treatment Examples (1) to (3), Comparative Examples (1) to (4) were the same using a known roughening treatment method for each copper foil. Roughening treatment was performed under the conditions, and the ten-point average roughness (R Z ) of the copper foil roughened surface roughness after the roughening treatment was measured based on JIS B 0601 and JIS B 0651. In addition, after forming the copper foil after roughening treatment on FR-4 base material (glass epoxy base material), JIS
Peel strength was measured according to C 6481.
【００１０】[0010]
【表１】 [Table 1]
【００１１】[0011]
【発明の効果】表１より明らかなように、本発明の製造
方法によって得られた電解銅箔は、粗面の粗さを増大さ
せることなく、粗面形状の均一性を向上させることによ
り合成樹脂含浸基材との接着力を向上させると共に、該
銅箔をエッチングした後の基板表面の粗さ、形状の均一
性にも寄与させたものである。従って、本発明の方法に
よって得られる電解銅箔は、プリント配線板に用いた場
合、接着力に優れたものである。As is clear from Table 1, the electrolytic copper foil obtained by the production method of the present invention is synthesized by improving the uniformity of the rough surface shape without increasing the roughness of the rough surface. This not only improves the adhesive strength with the resin-impregnated base material, but also contributes to the roughness and shape uniformity of the substrate surface after etching the copper foil. Therefore, the electrolytic copper foil obtained by the method of the present invention has excellent adhesive strength when used for a printed wiring board.
【図１】本発明の電解銅箔の製造方法である陰極ドラム
の研磨装置の一例を示す概略図FIG. 1 is a schematic diagram showing an example of a polishing apparatus for a cathode drum which is a method for producing an electrolytic copper foil of the present invention.
(1) 陰極ドラム (2) シート状研磨パッド (3) 平板 (4) バイブレータ (1) Cathode drum (2) Sheet polishing pad (3) Flat plate (4) Vibrator
Claims (1)
を配置し陰極ドラム上に銅を析出させた後、引き剥がし
連続的に電解銅箔を製造する方法において、陰極ドラム
を回転させながら、研磨体を陰極ドラム表面に接触、加
圧させた状態で、研磨体を陰極ドラムの軸に対し平行方
向に往復運動をさせると同時に、該ドラム表面に対して
垂直方向（Ｚ軸方向）に動かし表面の研磨を行った陰極
ドラムを用いることを特徴とする電解銅箔の製造方法。1. A method for producing an electrolytic copper foil by continuously arranging an anode so as to face a cylindrical cathode drum and depositing copper on the cathode drum, and then peeling the copper, while rotating the cathode drum. While the polishing body is in contact with and pressed against the surface of the cathode drum, the polishing body is reciprocated in a direction parallel to the axis of the cathode drum, and at the same time, is moved in a direction perpendicular to the surface of the drum (Z-axis direction). A method for producing an electrolytic copper foil, comprising using a cathode drum having a polished surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14359397A JPH10330984A (en) | 1997-06-02 | 1997-06-02 | Production of electrolytic copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14359397A JPH10330984A (en) | 1997-06-02 | 1997-06-02 | Production of electrolytic copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10330984A true JPH10330984A (en) | 1998-12-15 |
Family
ID=15342339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14359397A Pending JPH10330984A (en) | 1997-06-02 | 1997-06-02 | Production of electrolytic copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10330984A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103097592A (en) * | 2011-08-30 | 2013-05-08 | 西工业株式会社 | Holed foil electrolytic precipitation device |
| JP2015227060A (en) * | 2014-05-09 | 2015-12-17 | Jx日鉱日石金属株式会社 | Copper foil with carrier, printed wiring board, copper-clad laminate, electronic apparatus, manufacturing method of copper foil with carrier, and manufacturing method of printed wiring board |
| JP2016074960A (en) * | 2014-10-08 | 2016-05-12 | 日鉄住金工材株式会社 | Polishing support member |
| KR20180003575U (en) * | 2017-06-12 | 2018-12-20 | 케이씨에프테크놀로지스 주식회사 | Apparatus for Electrodeposition of Electrolytic Copper Foil and Apparatus for Manufacturing of Electrolytic Copper Foil |
-
1997
- 1997-06-02 JP JP14359397A patent/JPH10330984A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103097592A (en) * | 2011-08-30 | 2013-05-08 | 西工业株式会社 | Holed foil electrolytic precipitation device |
| CN103097592B (en) * | 2011-08-30 | 2015-06-03 | 西工业株式会社 | Holed foil electrolytic precipitation device |
| JP2015227060A (en) * | 2014-05-09 | 2015-12-17 | Jx日鉱日石金属株式会社 | Copper foil with carrier, printed wiring board, copper-clad laminate, electronic apparatus, manufacturing method of copper foil with carrier, and manufacturing method of printed wiring board |
| JP2016074960A (en) * | 2014-10-08 | 2016-05-12 | 日鉄住金工材株式会社 | Polishing support member |
| KR20180003575U (en) * | 2017-06-12 | 2018-12-20 | 케이씨에프테크놀로지스 주식회사 | Apparatus for Electrodeposition of Electrolytic Copper Foil and Apparatus for Manufacturing of Electrolytic Copper Foil |
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