JPH1032135A - Method of manufacturing chip-type electronic part - Google Patents

Method of manufacturing chip-type electronic part

Info

Publication number
JPH1032135A
JPH1032135A JP8203261A JP20326196A JPH1032135A JP H1032135 A JPH1032135 A JP H1032135A JP 8203261 A JP8203261 A JP 8203261A JP 20326196 A JP20326196 A JP 20326196A JP H1032135 A JPH1032135 A JP H1032135A
Authority
JP
Japan
Prior art keywords
electronic component
cut
mother substrate
base substrate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8203261A
Other languages
Japanese (ja)
Inventor
Morikazu Hirata
守一 平田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toko Inc
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toko Inc filed Critical Toko Inc
Priority to JP8203261A priority Critical patent/JPH1032135A/en
Publication of JPH1032135A publication Critical patent/JPH1032135A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

PROBLEM TO BE SOLVED: To eliminate the electrode forming steps after the separation from a base substrate by a method, wherein after the formation of straight line trenches on the surface of a base substrate made of insulators, the inner surface of the trenches is coated with conductor films which are conductive to the electrodes of electronic element assemblies, so as to cut off the inner part of these trenches in case of cut-off which separates the base substrate. SOLUTION: Numerous square through-holes 12 are regularly juxtaposed in the longitudinal and lateral directions, so as to form a plurality of straight line trenches 13 in the mutually parallel positions holding these through holes 12. Next, the inner surfaces of these straight line trenches 13 are coated with conductor films 14 conductive to the electrodes of electronic part element assemblies, to cut off the inner parts of the straight line trenches in case of cut-off which separates the base substrate 10. Through these procedures, most of the manufacturing steps can be eliminated for processing the substrate in the state left intact, thereby enabling eliminating the electrode forming steps after the separation from the base substrate 10.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、一枚の母基板に複
数の電子部品素体を形成してから母基板を切断分離して
個々の電子部品を得るチップ型電子部品の製造方法に係
り、特に電子部品の電極を形成する方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip-type electronic component in which a plurality of electronic component bodies are formed on a single motherboard, and then the motherboard is cut and separated to obtain individual electronic components. In particular, the present invention relates to a method for forming an electrode of an electronic component.

【０００２】[0002]

【従来の技術】図９は従来のチップ型電子部品をプリン
ト基板に取付けた状態を示している。電子部品本体１の
両端部には、銀ペーストを塗布して焼成するなどの方法
により電極２が設けられている。プリント基板３の導体
パターン４に電極２を半田５によって確実に接続固定す
るためには、電極２を電子部品本体１の下面だけでなく
側面にもわたって設けることが必要である。2. Description of the Related Art FIG. 9 shows a state in which a conventional chip-type electronic component is mounted on a printed circuit board. Electrodes 2 are provided on both ends of electronic component body 1 by a method such as applying a silver paste and baking. In order to securely connect and fix the electrode 2 to the conductor pattern 4 of the printed board 3 by the solder 5, it is necessary to provide the electrode 2 not only on the lower surface but also on the side surface of the electronic component body 1.

【０００３】[0003]

【発明が解決しようとする課題】チップ型電子部品は小
型で製造工程における取扱いが面倒であり、１個ずつの
電子部品に電極２を順次形成していたのでは生産性が悪
くなる。一枚の母基板に複数の電子部品素体を形成して
から母基板を切断分離して個々の電子部品を得る製造方
法も行われている。しかし、この方法で得られた電子部
品は側面が切断面となるので、電子部品本体１の側面に
電極２を設けるためには、母基板から分離した後の１個
ずつの電子部品に電極を形成しなければならず、やはり
生産性が悪い問題があった。本発明は母基板から分離し
た後のこの電極形成工程を不要とする製造方法を提供す
ることを目的としたものである。The chip-type electronic component is small and cumbersome to handle in the manufacturing process, and if the electrodes 2 are sequentially formed on each electronic component one by one, the productivity deteriorates. A manufacturing method is also known in which a plurality of electronic component bodies are formed on a single mother board, and then the mother board is cut and separated to obtain individual electronic components. However, since the side surface of the electronic component obtained by this method is a cut surface, in order to provide the electrode 2 on the side surface of the electronic component body 1, the electrode is attached to each of the electronic components separated from the mother board. It had to be formed, and again there was a problem of poor productivity. An object of the present invention is to provide a manufacturing method that eliminates the need for the electrode forming step after separation from the mother substrate.

【０００４】[0004]

【課題を解決するための手段】本発明は、一枚の母基板
に複数の電子部品素体を形成してから母基板を切断分離
して個々の電子部品を得るチップ型電子部品の製造方法
において、絶縁体からなる母基板の表面に直線溝を形成
した後、電子部品素体の電極に導通した導体膜を溝の内
部表面に被着し、母基板を切断分離する際にこの溝の中
を切断することを特徴とする。SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a chip-type electronic component in which a plurality of electronic component bodies are formed on a single mother substrate, and then the mother substrate is cut and separated to obtain individual electronic components. After forming a linear groove on the surface of a mother substrate made of an insulator, a conductive film conductive to the electrodes of the electronic component body is applied to the inner surface of the groove, and when the mother substrate is cut and separated, It is characterized by cutting the inside.

【０００５】[0005]

【実施例】チップ型電子部品がインダクタである場合を
例にとり、本発明の一実施例について図面と共に説明す
る。図１における10は、フェライト等の磁性体あるいは
セラミックや樹脂等の絶縁体からなる母基板である。母
基板10には角形の多数の貫通孔12が縦横に規則的に並ぶ
ように設けてあり、孔12を挟むような位置に互いに平行
な複数の直線溝13が形成してある。母基板10の表面全体
にはメッキや蒸着等の公知の手段で導体膜14を被着して
ある。この導体膜14は貫通孔12の中や溝13の内部にも被
着されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings, taking an example in which a chip-type electronic component is an inductor. Reference numeral 10 in FIG. 1 denotes a mother substrate made of a magnetic material such as ferrite or an insulator such as ceramic or resin. A large number of rectangular through-holes 12 are provided in the mother substrate 10 so as to be regularly arranged in the vertical and horizontal directions, and a plurality of parallel linear grooves 13 are formed at positions sandwiching the holes 12. The entire surface of the mother substrate 10 is covered with a conductive film 14 by a known means such as plating or vapor deposition. The conductor film 14 is also applied to the inside of the through hole 12 and the inside of the groove 13.

【０００６】このような母基板10の貫通孔12で挟まれた
ブリッジ部16に、図２のようにレーザー加工機のヘッド
20からレーザービーム25を照射してレーザー加工を施
す。ブリッジ部16は横断面が四角形で、ＡＢＣＤの四面
を備えている。図のレーザービーム25はヘッド20の真正
面に照射されたときのレーザービームを示している。ヘ
ッド20は基板10の上面に対して傾けて配置してあり、二
点鎖線で示す範囲をレーザービーム25で走査することに
より、ブリッジ部16のＡ面とＢ面に連続してレーザービ
ーム25を照射することができる。ブリッジ部16の幅は通
常１ｍｍ〜数ｍｍ程度なので、走査幅は僅かでよく、ヘ
ッド20の内部のミラーを動かすことで走査可能である。[0006] As shown in FIG. 2, a head of a laser processing machine is attached to the bridge portion 16 sandwiched between the through holes 12 of the mother substrate 10.
Laser processing is performed by irradiating a laser beam 25 from 20. The bridge section 16 has a rectangular cross section and four sides of ABCD. The laser beam 25 shown in the figure indicates a laser beam when irradiated directly in front of the head 20. The head 20 is arranged to be inclined with respect to the upper surface of the substrate 10, and scans the area indicated by the two-dot chain line with the laser beam 25 so that the laser beam 25 is continuously applied to the A surface and the B surface of the bridge portion 16. Can be irradiated. Since the width of the bridge portion 16 is usually about 1 mm to several mm, the scanning width may be small, and scanning is possible by moving a mirror inside the head 20.

【０００７】レーザー加工機の図示しないＣＰＵにはレ
ーザービームを照射する範囲があらかじめプログラムさ
れる。そしてレーザービーム25は、図２に二点鎖線で示
すように、Ｄ面とＡ面の境界の角Ｘを外れる位置からＢ
面とＣ面の境界の角Ｙを外れる位置まで走査される。ヘ
ッド20はレーザービーム25をブリッジ部16の長さ方向に
対して斜め方向に走査して、ブリッジ部16のＡ面とＢ面
に照射する。レーザービーム25が当たったところの導体
膜14は除去され、図３に示すように母基板10の絶縁体部
分が露出した除去部18が形成される。１回の走査でＡ面
からＢ面にかけて繋がった１本の除去部18が形成され
る。A laser beam irradiation range is programmed in advance in a CPU (not shown) of the laser processing machine. Then, as shown by the two-dot chain line in FIG.
The scanning is performed to a position outside the corner Y of the boundary between the plane and the C plane. The head 20 scans the laser beam 25 in a direction oblique to the length direction of the bridge portion 16 and irradiates the surface A and the surface B of the bridge portion 16. The conductor film 14 where the laser beam 25 has been irradiated is removed, and a removed portion 18 where the insulator portion of the mother substrate 10 is exposed is formed as shown in FIG. One removal portion 18 connected from the surface A to the surface B in one scan is formed.

【０００８】ブリッジ部16の長手方向に僅かに照射位置
をずらした後、再びレーザービームを走査する。この操
作を数回繰り返すことにより、図３のようにブリッジ部
16のＡ面とＢ面に平行な複数本の除去部18を形成する。
除去部18はブリッジ部16の長さ方向に対して斜めに形成
される。除去部18は、図４に示すように母基板10の縦ま
たは横どちらか一方向に延びた多数のブリッジ部16に形
成される。After slightly shifting the irradiation position in the longitudinal direction of the bridge section 16, the laser beam is again scanned. By repeating this operation several times, as shown in FIG.
A plurality of removed portions 18 are formed parallel to the A and B surfaces of FIG.
The removing portion 18 is formed obliquely to the length direction of the bridge portion 16. As shown in FIG. 4, the removal portions 18 are formed in a number of bridge portions 16 extending in one of the vertical and horizontal directions of the mother substrate 10.

【０００９】各ブリッジ部16のＡ面とＢ面へのレーザー
加工を終えたら、母基板10を裏返して図５のようにＡ面
とＢ面に対して行ったと同様のレーザー加工をブリッジ
部16のＣ面とＤ面にも施す。このとき、レーザービーム
25を照射する位置をブリッジ部16の長さ方向に僅かにず
らして、角Ｘ及び角Ｙにおいて、それぞれＤ面とＡ面及
びＢ面とＣ面の１本ずつの除去部18が繋がるようにす
る。After the laser processing on the A and B surfaces of each bridge portion 16 is completed, the mother substrate 10 is turned over, and the same laser processing as performed on the A and B surfaces as shown in FIG. On the C and D surfaces. At this time, the laser beam
The position for irradiating 25 is slightly shifted in the length direction of the bridge portion 16 so that the removal portions 18 of the D surface and the A surface and the removal portions 18 of the B surface and the C surface are connected at the corners X and Y, respectively. I do.

【００１０】ブリッジ部16のＣ面とＤ面にも、平行な複
数本の除去部18がブリッジ部16の長さ方向に対して斜め
に形成され、それぞれの除去部18がＡ面とＢ面の除去部
18に繋がる。これにより、各ブリッジ部16には全体とし
て１本の連続した除去部18が螺旋状に形成され、同時に
導体膜14が１本の螺旋状のコイルの形に残ることにな
る。図５における二点鎖線もレーザービーム25の走査範
囲を示している。A plurality of parallel removed portions 18 are also formed on the C and D surfaces of the bridge portion 16 at an angle to the longitudinal direction of the bridge portion 16. Removal section
Connects to 18. As a result, one continuous removing portion 18 is spirally formed as a whole in each bridge portion 16, and at the same time, the conductor film 14 remains in the shape of one spiral coil. 5 also indicates the scanning range of the laser beam 25.

【００１１】次に、図４に示す一点鎖線の位置で母基板
10を縦横に切断して、各ブリッジ部16を母基板10から切
り離す。このとき、横方向の切断位置は溝13の中となる
ようにする。すると、図６のように中央に螺旋状の導体
膜14からなるコイルが形成された巻線部14ａを有し、巻
線部14ａのコイルの両端が導体膜14からなる電極部14ｂ
に繋がるとともに、電極部14ｂが側面の一部まで延びて
形成されたインダクタが多数得られる。この後、図７の
ように巻線部14ａに絶縁材30をコーティングして絶縁性
を高めるとともに、電極部14ｂに半田メッキ層40を被着
するなどして、チップインダクタとして完成させる。こ
のチップインダクタは倒置した状態でプリント基板に半
田付けされる。Next, at the position of the dashed line shown in FIG.
10 is cut lengthwise and crosswise to separate each bridge portion 16 from the mother board 10. At this time, the cutting position in the horizontal direction is set in the groove 13. Then, as shown in FIG. 6, there is provided a winding part 14a in which a coil made of a spiral conductive film 14 is formed in the center, and both ends of the coil of the winding part 14a are electrode parts 14b made of the conductive film 14.
And a large number of inductors formed by extending the electrode portion 14b to a part of the side surface. Thereafter, as shown in FIG. 7, the winding portion 14a is coated with an insulating material 30 to enhance the insulation, and the electrode portion 14b is coated with a solder plating layer 40, thereby completing the chip inductor. This chip inductor is soldered to a printed circuit board in a state where it is inverted.

【００１２】なお、絶縁材30のコーティング及び半田メ
ッキ層40の被着は、個々のインダクタに切り離す前の母
基板10の段階で行ってもよい。また、溝13を母基板10の
上下面に互いに対向させて形成することにより、図８の
ように側面まで延びた電極55を電子部品50の上下面に設
け、電子部品50をプリント基板に実装するときの上下の
方向性を無くしてもよい。実施例はインダクタの例で説
明したが、本発明はコンデンサその他の電子部品にも適
用することができる。The coating of the insulating material 30 and the deposition of the solder plating layer 40 may be performed at the stage of the mother substrate 10 before being separated into individual inductors. Further, by forming the grooves 13 on the upper and lower surfaces of the mother substrate 10 so as to face each other, electrodes 55 extending to the side surfaces are provided on the upper and lower surfaces of the electronic component 50 as shown in FIG. The upper and lower directions at the time of performing may be eliminated. Although the embodiment has been described with reference to the example of the inductor, the present invention can be applied to a capacitor and other electronic components.

【００１３】[0013]

【発明の効果】本発明によれば、側面にも電極が形成さ
れたチップ型電子部品を製造するにあたり、製造工程の
大部分を多数個取り母基板の状態で扱えるので、複雑な
設備が不要であり、生産性が向上する効果がある。According to the present invention, when manufacturing a chip-type electronic component having electrodes formed on the side surfaces, a large part of the manufacturing process can be handled in the state of a mother board, so that complicated equipment is not required. This has the effect of improving productivity.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明の一実施例における母基板の斜視図FIG. 1 is a perspective view of a mother board according to an embodiment of the present invention.

【図２】 本発明の製造工程を示す一部断面正面図FIG. 2 is a partial cross-sectional front view showing a manufacturing process of the present invention.

【図３】 製造工程における母基板の部分斜視図FIG. 3 is a partial perspective view of a mother board in a manufacturing process.

【図４】 製造工程における母基板の平面図FIG. 4 is a plan view of a mother substrate in a manufacturing process.

【図５】 製造工程における母基板の一部の正面断面図FIG. 5 is a front sectional view of a part of a mother substrate in a manufacturing process.

【図６】 本発明の一実施例における電子部品の斜視図FIG. 6 is a perspective view of an electronic component according to one embodiment of the present invention.

【図７】 加工後の同電子部品の正面断面図FIG. 7 is a front sectional view of the electronic component after processing.

【図８】 本発明の他の実施例における電子部品の斜視
図FIG. 8 is a perspective view of an electronic component according to another embodiment of the present invention.

【図９】 従来のチップ型電子部品の実装状態を示す一
部断面正面図FIG. 9 is a partial cross-sectional front view showing a mounted state of a conventional chip-type electronic component.

【符号の説明】[Explanation of symbols]

10 母基板 12 貫通孔 13 溝 14 導体膜 14ｂ 電極 16 ブリッジ部 18 除去部 10 Mother board 12 Through hole 13 Groove 14 Conductor film 14b Electrode 16 Bridge section 18 Removal section

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】一枚の母基板に複数の電子部品素体を形成
してから該母基板を切断分離して個々の電子部品を得る
チップ型電子部品の製造方法において、絶縁体からなる
母基板の表面に直線溝を形成した後、電子部品素体の電
極に導通した導体膜を該溝の内部表面に被着し、母基板
を切断分離する際に該溝の中を切断することを特徴とす
るチップ部品の製造方法。1. A method of manufacturing a chip-type electronic component in which a plurality of electronic component bodies are formed on one mother substrate and then the mother substrate is cut and separated to obtain individual electronic components. After forming a straight groove on the surface of the substrate, a conductive film conductive to the electrode of the electronic component body is applied to the inner surface of the groove, and the inside of the groove is cut when the mother substrate is cut and separated. Characteristic chip component manufacturing method. 【請求項２】互いに平行な複数の直線溝を母基板の表面
に形成する請求項１のチップ型電子部品の製造方法。2. The method for manufacturing a chip-type electronic component according to claim 1, wherein a plurality of linear grooves parallel to each other are formed on the surface of the mother substrate. 【請求項３】電子部品がインダクタであり、少なくとも
二つの貫通孔を有する絶縁体からなる母基板の表面全体
に導体膜を被着し、該貫通孔で挟まれたブリッジ部に、
導体膜が除去された除去部を螺旋状に形成することによ
って、該除去部で区分された導体膜からなるコイルをブ
リッジ部に形成する請求項２のチップ型電子部品の製造
方法。3. The electronic component is an inductor, a conductor film is applied to the entire surface of a mother substrate made of an insulator having at least two through holes, and a bridge portion sandwiched between the through holes is
3. The method for manufacturing a chip-type electronic component according to claim 2, wherein the coil formed of the conductor film divided by the removed portion is formed in the bridge portion by forming the removed portion from which the conductive film has been removed in a spiral shape.
JP8203261A 1996-07-12 1996-07-12 Method of manufacturing chip-type electronic part Pending JPH1032135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8203261A JPH1032135A (en) 1996-07-12 1996-07-12 Method of manufacturing chip-type electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8203261A JPH1032135A (en) 1996-07-12 1996-07-12 Method of manufacturing chip-type electronic part

Publications (1)

Publication Number Publication Date
JPH1032135A true JPH1032135A (en) 1998-02-03

Family

ID=16471111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8203261A Pending JPH1032135A (en) 1996-07-12 1996-07-12 Method of manufacturing chip-type electronic part

Country Status (1)

Country Link
JP (1) JPH1032135A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111799057A (en) * 2019-04-05 2020-10-20 株式会社村田制作所 Electronic component, electronic component mounting substrate, and method for manufacturing electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111799057A (en) * 2019-04-05 2020-10-20 株式会社村田制作所 Electronic component, electronic component mounting substrate, and method for manufacturing electronic component
CN111799057B (en) * 2019-04-05 2023-09-19 株式会社村田制作所 Electronic component, electronic component mounting board, and method for manufacturing electronic component

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