JPH10303517A - Printed wiring board and electronic component connection method using the printed wiring board - Google Patents
Printed wiring board and electronic component connection method using the printed wiring boardInfo
- Publication number
- JPH10303517A JPH10303517A JP10748097A JP10748097A JPH10303517A JP H10303517 A JPH10303517 A JP H10303517A JP 10748097 A JP10748097 A JP 10748097A JP 10748097 A JP10748097 A JP 10748097A JP H10303517 A JPH10303517 A JP H10303517A
- Authority
- JP
- Japan
- Prior art keywords
- side groove
- wiring board
- conductive adhesive
- printed wiring
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は各種電子部品の組み
立てなどに使用される導電性接着剤の塗布および各種電
子部品の実装基板への接合に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the application of a conductive adhesive used for assembling various electronic components and the like and the joining of various electronic components to a mounting board.
【０００２】[0002]
【従来の技術】一般に各種電子部品の実装基板への接合
は、粒径約２０mmのはんだ粉末とロジン系のフラックス
からなるソルダーペストを用いて行っている。例えば、
回路形成されたガラスエポキシ基板などのプリント配線
板上に、、配線の電極端子用ランド（以下、単に「電極
端子」と記す。）部を除きソルダーレジストを設け、次
いで電極端子部にメタルマスクを用いて約１５０mmの厚
みにソルダーペーストを印刷し、電子部品を電極端子上
に搭載しする。そして、約２４０℃でリフローし、はん
だを溶融して各種電子部品とをプリント配線板とを接合
している。2. Description of the Related Art In general, various electronic components are bonded to a mounting board by using a solder paste made of a rosin-based flux and a solder powder having a particle size of about 20 mm. For example,
A solder resist is provided on a printed wiring board such as a glass epoxy substrate on which a circuit is formed, except for a land for an electrode terminal of wiring (hereinafter, simply referred to as an “electrode terminal”), and then a metal mask is formed on the electrode terminal part. A solder paste is printed to a thickness of about 150 mm using the electronic component, and electronic components are mounted on the electrode terminals. Then, reflow is performed at about 240 ° C., the solder is melted, and various electronic components are joined to the printed wiring board.
【０００３】この工程で銅などの金属からなる電極端子
には溶融したはんだは良いぬれ性を示すが、プリント配
線板上に布設されるソルダーレジストにはぬれ性を示さ
ない。したがって、はんだ電極端子上に止まり電極端子
間に流れ出すことはなく、電極端子同士は良好な電気絶
縁が保たれている。[0003] In this process, molten solder shows good wettability to the electrode terminals made of metal such as copper, but does not show wettability to the solder resist laid on the printed wiring board. Therefore, it does not stop on the solder electrode terminals and does not flow out between the electrode terminals, and good electrical insulation is maintained between the electrode terminals.
【０００４】しかし最近になって環境保護の観点から、
工業製品の鉛使用が規制されるようになり、ソルダーペ
ーストによる各種電子部品の接合法も脱鉛化が求められ
ている。これに答えるものの一つとして、導電性接着剤
をソルダーペーストの代替材料として用いることが提案
されている。However, recently, from the viewpoint of environmental protection,
The use of lead in industrial products has been regulated, and lead-free soldering methods for various electronic components are also required. As one of the answers to this, it has been proposed to use a conductive adhesive as a substitute for the solder paste.
【０００５】一般に、導電性接着剤はエポキシ樹脂等の
有機バインダー、導電性粉末、反応性希釈剤および若干
の溶剤から構成されている。より具体的にはエポキシ
系、フェノール系、メラミン系、セルロース系、アクリ
ル系、ポリイミド系およびこれらの混合変性樹脂系等が
有機バインダーとして用いられ、導電性フィラーとして
銀系粉末が使用される。溶剤または反応性希釈剤は導電
性接着剤は導電性接着剤の粘度を調整するために有機バ
インダー用の樹脂を溶解することができるものが用いら
れる。[0005] Generally, the conductive adhesive is composed of an organic binder such as an epoxy resin, a conductive powder, a reactive diluent, and some solvent. More specifically, epoxy-based, phenol-based, melamine-based, cellulose-based, acrylic-based, polyimide-based and mixed modified resin-based resins thereof are used as the organic binder, and silver-based powder is used as the conductive filler. As the solvent or the reactive diluent, a conductive adhesive that can dissolve a resin for an organic binder in order to adjust the viscosity of the conductive adhesive is used.
【０００６】導電性接着剤はソルダーペースト同様にガ
ラエポ基板などに印刷することができ、熱硬化性樹脂で
あるエポキシ樹脂を用いているため、電子部品搭載後約
２００℃で硬化させ接合させることができる。The conductive adhesive can be printed on a glass epoxy substrate or the like in the same manner as the solder paste. Since the epoxy resin which is a thermosetting resin is used, it can be cured at about 200 ° C. after the electronic components are mounted and joined. it can.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、ソルダ
ーペーストと大きく異なる点は導電性接着剤は電極端子
ばかりでなくソルダーレジストとも良いぬれ性を示し、
各種電子部品を電極端子に搭載する際部品の自重や接合
のための加圧で導電性接着剤が電極端子部より流れ出
し、電極間距離が短い場合には短絡を引起こす可能性が
高くなる。However, a major difference from the solder paste is that the conductive adhesive exhibits good wettability not only with the electrode terminals but also with the solder resist.
When mounting various electronic components on the electrode terminals, the conductive adhesive flows out of the electrode terminals due to the weight of the components and the pressure for bonding, and when the distance between the electrodes is short, the possibility of causing a short circuit increases.
【０００８】これを防止すべく低粘度の導電性接着剤を
用いてガラエポ基板などの実装基板に印刷しても、マス
クの開口面積より形成された導電性接着剤のパターンが
広がり易く、微細パターンではやはり電極間で短絡が生
じる。[0008] Even if printing is performed on a mounting substrate such as a glass epoxy substrate using a low-viscosity conductive adhesive to prevent this, the pattern of the conductive adhesive formed tends to spread from the opening area of the mask, and the fine pattern In this case, a short circuit still occurs between the electrodes.
【０００９】本発明は、上記の欠点を補うために容易に
かつ確実に電極間の電気絶縁を保つことを可能とする実
装用基板を提供しようとするものである。An object of the present invention is to provide a mounting substrate which can easily and surely maintain electrical insulation between electrodes in order to compensate for the above-mentioned disadvantages.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決する本発
明の実装用基板は、基板上の電極端子間に導電性接着剤
の流れ防止側溝を設置したものであり、この側溝の幅を
電極端子間距離に対して０．１から１．０倍とし、長さ
を電極端子長さに対して１．０から３．０倍とし、深さ
を２０から５００ミクロンとするものである。A mounting substrate according to the present invention for solving the above-mentioned problems is provided with a side groove for preventing the flow of a conductive adhesive between electrode terminals on the substrate. The distance between the terminals is 0.1 to 1.0 times, the length is 1.0 to 3.0 times the electrode terminal length, and the depth is 20 to 500 microns.
【００１１】[0011]
【発明の実施の形態】本発明で用いる実装用基板は紙基
材片面板、紙基材両面板、ガラスエポキシ系基材片面
板、ガラスエポキシ系材両面板などが挙げられ、これは
単層もしくは多層板として使用することができる。さら
にアルミナ基板も使用することができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The mounting substrate used in the present invention includes a single-sided paper substrate, a double-sided paper substrate, a single-sided glass epoxy-based substrate, and a double-sided glass epoxy-based material. Alternatively, it can be used as a multilayer board. Further, an alumina substrate can also be used.
【００１２】本発明の基板に設ける側溝の容積は、基本
的には電極端子部よりあふれ出す導電性接着剤の量を考
慮して決めることになる。本発明で規定した大きさは通
常使用される量を考慮したものである。The volume of the side groove provided on the substrate of the present invention is basically determined in consideration of the amount of the conductive adhesive overflowing from the electrode terminal portion. The size specified in the present invention takes into account the amount normally used.
【００１３】本発明の代替法として電極端子の高さを高
くし、実質的に電極端子間の容積を増加させる方法も考
えられる。しかし、この場合、電極端子を構成する金属
層の厚い基板を用いて加工しなければならず、コストが
高くなる。また、実装の小型化に反することとなり、市
場に受け入れがたくなる。As an alternative to the present invention, a method of increasing the height of the electrode terminals and substantially increasing the volume between the electrode terminals is also conceivable. However, in this case, processing must be performed using a substrate having a thick metal layer that forms the electrode terminals, which increases the cost. In addition, this is contrary to the miniaturization of the mounting, and is not easily accepted by the market.
【００１４】また、基板の不導体部を薄くし、電極端子
部の高さを高くし、全体の厚みを同じにする方法も考え
られるが、これも上記と同様にコストが高くなる。It is also conceivable to reduce the thickness of the non-conductor portion of the substrate, increase the height of the electrode terminal portion, and make the entire thickness the same, but this also increases the cost as in the above case.
【００１５】本発明の基板において側溝を設ける手段の
一つとして、不導体部の最上層を形成する際にあらかじ
め穴のあいたシートを張り合わせ、その上に金属層を設
け、パターニングして配線を形成する方法を用いればよ
い。また、配線形成後にエッチング等により側溝を設け
てもよい。As one of means for providing a side groove in the substrate of the present invention, a sheet having a hole is bonded in advance when forming the uppermost layer of the nonconductor portion, a metal layer is provided thereon, and a wiring is formed by patterning. Method may be used. Further, a side groove may be provided by etching or the like after the wiring is formed.
【００１６】なお、本発明では側溝の形状を矩形とした
が、下記の実施例でわかるように、側溝の容量は、配線
板に電子部品を実装する際に、配線板の電極よりあふれ
出た導電性接着剤を収納できる容量であればよく、その
形状は本質的に問われるものではないことは言うまでも
ない。In the present invention, the shape of the side groove is rectangular, but as will be understood from the following embodiments, the capacity of the side groove overflows from the electrode of the wiring board when the electronic component is mounted on the wiring board. It is needless to say that the capacity is sufficient as long as the conductive adhesive can be accommodated, and the shape is not essential.
【００１７】[0017]
【実施例】次に実施例を用いて本発明をさらに説明す
る。Next, the present invention will be further described with reference to examples.
【００１８】（実施例１）フェーノルノボラック型エポ
キシ樹脂および潜在性アミン化合物と反応性希釈剤とし
てｔ―ブチルフェニルグリシジル―テル、フェニルグリ
シジエーテル、銀粉末として粒径が０．２から５．０ミ
クロンのフレーク状および球状の銀粉を７０〜８０重量
％となるように配合し、三本ロールで混練して導電性接
着剤樹脂を得た。(Example 1) t-butylphenylglycidyl-ter, phenylglycidiether as a phenol-novolak type epoxy resin and a latent amine compound and a reactive diluent, and a silver powder having a particle size of 0.2 to 5. A flake-like and spherical silver powder of 0 micron was blended in an amount of 70 to 80% by weight and kneaded with a three-roll mill to obtain a conductive adhesive resin.
【００１９】次に、幅０．３ｍｍ、長さ２ｍｍ、高さ１
５ミクロンの電極端子部を０．３ｍｍ間隔で設け、電極
端子部との間に、幅が電極端子部間隔の０．９倍で、長
さが電極端子部の２倍で、深さが１００ミクロンの側溝
が設けられたガラスエボキシ基板を準備した。Next, width 0.3 mm, length 2 mm, height 1
5 μm electrode terminal portions are provided at 0.3 mm intervals, and the width between the electrode terminal portions is 0.9 times the width of the electrode terminal portions, the length is twice the electrode terminal portions, and the depth is 100 mm. A glass epoxy substrate provided with micron side grooves was prepared.
【００２０】厚さ１５０ミクロンのメタルマスクを用い
て電極端子部に導電性接着剤樹脂層を印刷し、チップ抵
抗を乗せ、気泡除去のために加圧し、その後１５０℃で
３０分間保持し、導電性接着剤を硬化させた。その後、
チップ抵抗を剥離し、端子間の電気抵抗を測定した。測
定は市販のデジタルマルチメータで行った。その結果、
端子間の絶縁抵抗は１０8オーム以上であった。端子間
の絶縁抵抗が１０8オーム以上あった場合に良好な絶縁
状態が実現できていると判定できることから、本実施例
では側溝が有効に機能していることがわかる。A conductive adhesive resin layer is printed on the electrode terminals using a 150-μm-thick metal mask, a chip resistor is placed on the electrode terminal, pressure is applied to remove air bubbles, and the pressure is maintained at 150 ° C. for 30 minutes. The adhesive was cured. afterwards,
The chip resistance was peeled off, and the electric resistance between the terminals was measured. The measurement was performed with a commercially available digital multimeter. as a result,
The insulation resistance between the terminals was 10 8 ohms or more. When the insulation resistance between the terminals is equal to or greater than 10 8 ohms, it can be determined that a good insulation state has been achieved. This indicates that the side grooves function effectively in this embodiment.
【００２１】（実施例２）幅が電極端子部間隔の０．１
倍で、長さが電極端子部の３倍で、深さが５００ミクロ
ンの側溝が設けられたガラスエボキシ基板を用いた以外
は実施例１と同様にして端子間の絶縁抵抗を測定した。
その結果、端子間の絶縁抵抗は１０8オーム以上であっ
た。(Embodiment 2) The width is 0.1 of the electrode terminal interval.
The insulation resistance between the terminals was measured in the same manner as in Example 1 except that a glass oxy substrate, which was twice as long as the electrode terminal portion and had a depth of 500 μm, was provided.
As a result, the insulation resistance between the terminals was 10 8 ohm or more.
【００２２】（実施例３）幅が電極端子部間隔の１倍
で、長さが電極端子部の１倍で、深さが１５０ミクロン
の側溝が設けられたガラスエボキシ基板を用いた以外は
実施例１と同様にして端子間の絶縁抵抗を測定した。そ
の結果、端子間の絶縁抵抗は１０8オーム以上であっ
た。(Example 3) The embodiment was carried out except that a glass epoxy substrate having a width of one time of the electrode terminal part interval, a length of one time of the electrode terminal part and a depth of 150 μm was provided. The insulation resistance between the terminals was measured in the same manner as in Example 1. As a result, the insulation resistance between the terminals was 10 8 ohm or more.
【００２３】（実施例４）幅が電極端子部間隔の１倍
で、長さが電極端子部の３倍で、深さが２０ミクロンの
側溝が設けられたガラスエボキシ基板を用いた以外は実
施例１と同様にして端子間の絶縁抵抗を測定した。その
結果、端子間の絶縁抵抗は１０8オームであった。(Example 4) The procedure was performed except that a glass epoxy substrate provided with a side groove having a width of 1 times the electrode terminal interval, a length of 3 times the electrode terminal, and a depth of 20 µm was used. The insulation resistance between the terminals was measured in the same manner as in Example 1. As a result, the insulation resistance between terminals was 10 8 ohms.
【００２４】以上のことから、側溝の容積は塗布された
導電性接着剤の容積の７０％程度以上であれば十分な効
果が得られることがわかった。From the above, it has been found that a sufficient effect can be obtained if the volume of the side groove is about 70% or more of the volume of the applied conductive adhesive.
【００２５】[0025]
【発明の効果】本発明の基板を用いて導電性接着剤によ
り電子部品を搭載すれば、電極端子より流れ出した導電
性接着剤が側溝にためられ、導電性接着剤と電極端子と
の縁が切れる。この結果、電極端子間に良好な絶縁性が
確保できる。According to the present invention, when an electronic component is mounted on the substrate of the present invention using a conductive adhesive, the conductive adhesive flowing out of the electrode terminal is accumulated in the side groove, and the edge between the conductive adhesive and the electrode terminal is formed. Expires. As a result, good insulation between the electrode terminals can be ensured.
【００２６】よって、得られる基板の信頼性も確保でき
る。Therefore, the reliability of the obtained substrate can be ensured.
Claims (3)
流れ防止側溝を設置したことを特徴とするプリント配線
板。1. A printed wiring board having a groove for preventing flow of a conductive adhesive between electrode terminals on a substrate.
０．１から１．０倍であり、長さが電極端子長さに対し
て１．０から３．０倍であり、深さが２０から５００ミ
クロンである請求項１記載の配線板。2. The width of the side groove is 0.1 to 1.0 times the distance between the electrode terminals, the length is 1.0 to 3.0 times the length of the electrode terminal, and the depth is 2. The wiring board according to claim 1, wherein the thickness is 20 to 500 microns.
るに際し、導電性接着剤と請求項１または２記載のプリ
ント配線板を用いることを特徴とする電子部品の接合方
法。3. A method of joining an electronic component, comprising: using a conductive adhesive and the printed wiring board according to claim 1 when joining the electronic component and the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10748097A JPH10303517A (en) | 1997-04-24 | 1997-04-24 | Printed wiring board and electronic component connection method using the printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10748097A JPH10303517A (en) | 1997-04-24 | 1997-04-24 | Printed wiring board and electronic component connection method using the printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10303517A true JPH10303517A (en) | 1998-11-13 |
Family
ID=14460294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10748097A Pending JPH10303517A (en) | 1997-04-24 | 1997-04-24 | Printed wiring board and electronic component connection method using the printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10303517A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7922304B2 (en) | 2007-10-31 | 2011-04-12 | Brother Kogyo Kabushiki Kaisha | Liquid droplet jetting head |
-
1997
- 1997-04-24 JP JP10748097A patent/JPH10303517A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7922304B2 (en) | 2007-10-31 | 2011-04-12 | Brother Kogyo Kabushiki Kaisha | Liquid droplet jetting head |
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