JPH10290100A - Recognition method for pattern of electronic component - Google Patents
Recognition method for pattern of electronic componentInfo
- Publication number
- JPH10290100A JPH10290100A JP9093982A JP9398297A JPH10290100A JP H10290100 A JPH10290100 A JP H10290100A JP 9093982 A JP9093982 A JP 9093982A JP 9398297 A JP9398297 A JP 9398297A JP H10290100 A JPH10290100 A JP H10290100A
- Authority
- JP
- Japan
- Prior art keywords
- recognition
- element substrate
- pattern
- recognition pattern
- recognized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Image Processing (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Analysis (AREA)
- Electronic Switches (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、電子部品のパタ
ーン認識方法に関する。The present invention relates to a method for recognizing a pattern of an electronic component.
【0002】[0002]
【従来の技術】従来、サーマルプリンタ用のヘッドやそ
の他の電子製品に用いられる電子部品のうち、透光性素
材としてのガラスエポキシ素材の素子基板を使用したも
のがある。2. Description of the Related Art Conventionally, among electronic components used for a head for a thermal printer and other electronic products, there is an electronic component using a glass epoxy material substrate as a translucent material.
【0003】これらの電子部品の素子基板には、ダイボ
ンディングやワイヤーボンディング等の作業が自動化の
流れの中で行われる。[0003] Operations such as die bonding and wire bonding are performed on the element substrate of these electronic components in the flow of automation.
【0004】すなわち、素子基板が各種作業個所へ搬送
されていくと、当該作業個所で正確な位置決めがなされ
て、所要のロボットにより自動的にダイボンディングや
ワイヤーボンディング等の作業がなされることになる。[0004] That is, when the element substrate is transported to various work places, accurate positioning is performed at the work places, and operations such as die bonding and wire bonding are automatically performed by a required robot. .
【0005】このように、ロボットにより素子基板の正
確な位置に所定の作業が行われるためには、素子基板の
正確な位置決めが行われることが必要であるため、素子
基板の位置決め手段として、予め、素子基板の所要個所
に位置決め用の認識パターンを形成し、この認識パター
ンを所要の手段で認識して素子基板が正確な位置にある
か否かを判断している。As described above, in order for a robot to perform a predetermined operation at an accurate position on an element substrate, it is necessary to accurately position the element substrate. A recognition pattern for positioning is formed at a required position on the element substrate, and the recognition pattern is recognized by a required means to determine whether or not the element substrate is at a correct position.
【0006】かかる認識作業を多値化認識で行う場合
は、認識手段が正確に作動して、誤認識するおそれが少
ないが、現状ではコスト的な面などから、照明による明
暗を認識する2値化認識によるパターン認識方法を採用
している場合が多い。When such a recognition operation is performed by multi-valued recognition, the recognition means operates accurately and there is little possibility of erroneous recognition. In many cases, a pattern recognition method based on image recognition is used.
【0007】例えば、サーマルプリンタ用のヘッドに用
いる電子部品のガラスエポキシ素材の素子基板について
説明すると、図3に示すように、該素子基板XAの隅部に
は、中央に打抜孔Xmを設けた銅板の認識パターンXMが付
されており、図4に示すように、素子基板XAの斜め方向
より落斜照明をすることにより、図5に示すように認識
パターンXMの反射による明色認識XCと、素子基板地の暗
色認識XDとによる2値化認識により認識パターンXMを介
した素子基板の位置決め認識をしている。図4中、X1は
落射照明用の投光器、X2は認識手段としてのカメラであ
る。For example, an element substrate made of a glass epoxy material of an electronic component used for a head for a thermal printer will be described. As shown in FIG. 3, a punched hole Xm is provided at the center of the corner of the element substrate XA. The recognition pattern XM of the copper plate is attached, and as shown in FIG. 4, by performing the oblique illumination from the oblique direction of the element substrate XA, as shown in FIG. In addition, the position recognition of the element substrate through the recognition pattern XM is performed by the binarization recognition using the dark color recognition XD of the element substrate ground. In FIG. 4, X1 is a projector for epi-illumination, and X2 is a camera as recognition means.
【0008】[0008]
【発明が解決しようとする課題】ところが、上記2値化
認識方法では、認識パターンXMに対する投光器X1による
落斜照明の反射が不充分であると、カメラX2が認識パタ
ーンXMを正確に判別することができず、素子基板XAの位
置決めが不正確となり、位置決めエラーと誤検出して次
工程への流れの障害となっていた。However, in the above-described binarization recognition method, if the reflection of falling illumination by the projector X1 with respect to the recognition pattern XM is insufficient, the camera X2 can accurately determine the recognition pattern XM. However, the positioning of the element substrate XA became inaccurate, which was erroneously detected as a positioning error and hindered the flow to the next process.
【0009】すなわち、認識パターンXMは幾層にも重ね
塗られて形成されるているため面精度がなく、認識パタ
ーンXMが正確に反射せず、明色認識をすべき位置で明色
反射しない場合があり、認識パターンXMの認識位置に検
出ずれを生起し、正規の位置に素子基板XAがあるにもか
かわらず、位置決めエラーを検出し、素子加工作業が緊
急停止して作業工程に支障を生起していたものである。That is, since the recognition pattern XM is formed by being applied in multiple layers, there is no surface accuracy, the recognition pattern XM does not accurately reflect, and does not reflect bright colors at the position where bright color recognition is required. In some cases, a detection error occurs in the recognition position of the recognition pattern XM, and a positioning error is detected even though the element substrate XA is at the correct position, and the element processing operation is stopped urgently, hindering the work process. It is what has occurred.
【0010】[0010]
【課題を解決するための手段】この発明は、電子部品に
用いる透光性素材の素子基板に付した認識パターンを認
識するために行う照明を、該素子基板の側端面より投光
し、認識パターンの個所を暗色とし、その他の個所を明
色として2値化認識のもとでパターン位置の正確な認識
を行うことを特徴とする電子部品のパターン認識方法を
提供せんとするものである。SUMMARY OF THE INVENTION According to the present invention, an illumination for recognizing a recognition pattern attached to an element substrate made of a light-transmitting material used for an electronic component is projected from a side end face of the element substrate. An object of the present invention is to provide a pattern recognition method for an electronic component, wherein a pattern portion is darkened and other portions are lightened to accurately recognize a pattern position under binarization recognition.
【0011】[0011]
【発明の実施の形態】この発明では、サーマルプリンタ
のヘッド等に用いられる透光性素材としてのガラスエポ
キシ樹脂素材の素子基板に素子加工を行うために素子基
板の位置決めを行う場合、素子基板の所定個所に設けら
れた認識パターンに照明により投光し、光の透過の有無
により認識パターンをカメラで2値化認識し、所定の位
置に素子基板が位置しているか否かを認識するものであ
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the present invention, when positioning an element substrate for processing an element substrate made of a glass epoxy resin material as a light-transmitting material used for a head of a thermal printer, etc. Light is projected onto a recognition pattern provided at a predetermined location by illumination, and the recognition pattern is binarized and recognized by a camera based on the presence or absence of light transmission, and whether or not the element substrate is located at a predetermined position is recognized. is there.
【0012】すなわち、2値化認識のために、照明によ
り投光する場合、素子基板の側端面より投光し、ガラス
エポキシ樹脂に光を透過させると、認識パターンは光の
透過しないか或は透過しにくいため認識パターンの部分
はカメラには暗色で認識され、素子基板から透過する光
は明色で認識され、認識パターンの2値化認識を確実に
行い、素子基板の位置の正誤を正確に検出できるもので
ある。That is, when light is projected by illumination for binary recognition, if the light is projected from the side end face of the element substrate and the light is transmitted through the glass epoxy resin, the recognition pattern does not transmit the light. Because it is difficult to transmit, the part of the recognition pattern is recognized by the camera in dark color, the light transmitted from the element substrate is recognized in bright color, and the binary recognition of the recognition pattern is performed reliably, and the correctness of the position of the element substrate is accurately determined. Can be detected.
【0013】[0013]
【実施例】この発明の実施例を図面に基づき詳説する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.
【0014】図1に示すものは、本発明方法の実施状態
を示すものであり、ガラスエポキシ樹脂素材の素子基板
Aの認識パターンMに対し、投光器1による照明で該素
子基板Aの側端面aより投光し、認識パターンMの真上
方に位置した認識カメラ2により2値化認識のもとに認
識パターンMの位置認識をしている状態である。FIG. 1 shows an embodiment of the method according to the present invention, in which a recognition pattern M of an element substrate A made of glass epoxy resin is applied to a side end face a In this state, the light is further projected, and the position of the recognition pattern M is recognized by the recognition camera 2 located directly above the recognition pattern M under the binarization recognition.
【0015】投光器1は、光ファイバー先端に設けたレ
ンズにより光を集合して集光し投射するように構成され
ている。The light projector 1 is configured to collect light by a lens provided at the tip of an optical fiber, collect the light, and project the light.
【0016】認識カメラ2は、モニター(図示せず)に
接続されて認識パターンの位置の正確を視認することが
できると共に、素子加工機に認識信号を送って加工機の
作動停止を制御することができるようにしている。The recognition camera 2 is connected to a monitor (not shown) so that the position of the recognition pattern can be visually recognized accurately and sends a recognition signal to the element processing machine to control the stop of the processing machine. I can do it.
【0017】素子基板Aは、一実施例としてサーマルプ
リンタのヘッドに用いられる電子部品素子基板であり、
素材はガラスエポキシ樹脂としており、透光性の素材で
あれば、いかなる素子基板にも本発明の実施例を応用で
きる。The element substrate A is an electronic component element substrate used for a thermal printer head as one embodiment.
The material is glass epoxy resin, and the embodiment of the present invention can be applied to any element substrate as long as the material is translucent.
【0018】かかる該素子基板Aの一隅には認識パター
ンMが設けられている。A recognition pattern M is provided at one corner of the element substrate A.
【0019】認識パターンMは、中央に方形状の中央孔
mを設けた一定大きさの矩形に形成されている。The recognition pattern M is formed in a rectangular shape having a predetermined size with a square central hole m at the center.
【0020】認識パターンMの素材は、銅材を使用して
おり、銅粉末を塗布して焼付けをしたり、銅板をエッチ
ングして形成しており、このパターンMの上表面部分は
幾層にも重ねて塗布して焼付けされているため、表面の
面精度はよくない。The material of the recognition pattern M is a copper material, which is formed by applying and baking copper powder or etching a copper plate. Are also applied and baked, so the surface accuracy of the surface is not good.
【0021】中央の中央孔mには、該素子基板Aの地肌
が露出しており、この中央孔m内部表面と、矩形の認識
パターンMの外側方表面とは、同一のガラスエポキシ素
材の素子基板Aの表面が露出している。The background of the element substrate A is exposed in the central hole m at the center, and the inner surface of the central hole m and the outer surface of the rectangular recognition pattern M are the same glass epoxy material element. The surface of the substrate A is exposed.
【0022】かかる素子基板Aの認識パターンMの必要
性を述べると、素子基板A上にダイボンディングしたり
電極にワイヤボンディングをしたりする素子製造工程に
おいて、素子基板Aは搬送ルートで搬送されていく途中
で所定の素子加工工程個所で停止し、正確な位置決めが
なされた上で、ロボットによる素子加工がなされる。こ
の時に認識パターンMは、素子基板Aの位置決めを行う
ために必要なものであり、認識パターンMの位置を正し
く認識することにより素子基板Aの正確な位置設定がな
されたことになり、かかる正位置設定の信号をロボット
に送って素子加工作業が行われる。The necessity of the recognition pattern M of the element substrate A will be described. In the element manufacturing process of die bonding on the element substrate A and wire bonding to the electrodes, the element substrate A is transported along the transport route. The robot stops at a predetermined element processing step on the way, performs accurate positioning, and performs element processing by a robot. At this time, the recognition pattern M is necessary for positioning the element substrate A. By correctly recognizing the position of the recognition pattern M, the correct position setting of the element substrate A has been performed. The element setting operation is performed by sending a position setting signal to the robot.
【0023】なお、認識パターンMは、位置認識するた
めのマークや表示印等を含むものである。The recognition pattern M includes a mark and a display mark for position recognition.
【0024】かかる認識パターンMの認識は、該素子基
板Aの側端面aより投光器1から該素子基板A内部に照
明することにより、認識カメラ2によって認識パターン
Mの認識を行う。The recognition pattern M is recognized by the recognition camera 2 by illuminating the inside of the element substrate A from the projector 1 from the side end face a of the element substrate A.
【0025】すなわち、投光器1からの照明は該素子基
板A直上方からみると、図2に示すように方形状の認識
パターンM部分が遮光されて暗色Dとなり、中央孔mと
認識パターンMの外側方は透光して明色Cとなり、この
明暗の2値化認識をもとにして認識パターンMの位置を
認識カメラ2で検出して該素子基板Aの位置の正誤を認
識する。That is, when the illumination from the light projector 1 is viewed from directly above the element substrate A, the rectangular recognition pattern M is shaded as shown in FIG. The outer side transmits light to become a bright color C. Based on the binary recognition of the light and dark, the position of the recognition pattern M is detected by the recognition camera 2 and the correctness of the position of the element substrate A is recognized.
【0026】従って、その後、認識パターンMの中央孔
mを基準として次工程であるダイボンディングのための
座標設定を行うことが可能となる。Therefore, after that, it is possible to set the coordinates for the next step, die bonding, based on the central hole m of the recognition pattern M.
【0027】なお、認識パターンMを明暗の2値化認識
をする場合、その明と暗の部分はスポット認識をするよ
うに構成されており、明と暗の部分、すなわち、中央孔
m及び矩形の認識パターンMの外側方部分の明部分を複
数個のスポットで認識し、矩形の認識パターンMの暗部
分を同じくスポットで認識する。When the recognition pattern M is subjected to light / dark binarization recognition, the light and dark portions are configured to perform spot recognition, and the light and dark portions, that is, the center hole m and the rectangle are formed. The bright part of the outer part of the recognition pattern M is recognized by a plurality of spots, and the dark part of the rectangular recognition pattern M is recognized by the same spot.
【0028】[0028]
【発明の効果】この発明によれば、ガラスエポキシ樹脂
素材の電子部品素子基板を、素子製造工程において、停
止のために位置決めする場合、認識パターンを付した該
素子基板の側端面から投光し、認識パターンの直上方か
ら該パターンを暗色認識し、それ以外を明色認識する2
値化認識によって該素子基板の位置認識をして、該素子
基板が正確な素子製造をするに支障のない位置に設定さ
れているか否かを認識することができるため、正確な位
置認識が可能となる効果を有する。According to the present invention, when an electronic component element substrate made of a glass epoxy resin material is positioned for stopping in an element manufacturing process, light is projected from a side end face of the element substrate provided with a recognition pattern. The pattern is recognized as a dark color from immediately above the recognition pattern, and the other pattern is recognized as a bright color 2
By recognizing the position of the element substrate by value recognition, it is possible to recognize whether or not the element substrate is set at a position that does not hinder accurate element manufacturing, so that accurate position recognition is possible. Has the effect of
【図1】本発明方法の実施状態を示す説明図。FIG. 1 is an explanatory view showing an embodiment of a method of the present invention.
【図2】照明を素子基板側端面より投光した状態の認識
パターンの明暗状態を示す説明図。FIG. 2 is an explanatory diagram showing a bright and dark state of a recognition pattern in a state where illumination is projected from an element substrate side end surface.
【図3】認識対象たる素子基板に設けた従来の認識パタ
ーンの平面図。FIG. 3 is a plan view of a conventional recognition pattern provided on an element substrate to be recognized.
【図4】従来の電子部品のパターン認識方法の実施状態
を示す説明図。FIG. 4 is an explanatory diagram showing an implementation state of a conventional electronic component pattern recognition method.
【図5】図2の認識パターンに照明を上方より投光した
状態の説明図。FIG. 5 is an explanatory diagram of a state in which illumination is projected onto the recognition pattern of FIG. 2 from above.
M 認識パターン A 素子基板 1 投光器 2 カメラ m 中央孔 M recognition pattern A element substrate 1 floodlight 2 camera m central hole
Claims (1)
に付した認識パターンを認識するために行う照明を、該
素子基板の側端面より投光し、認識パターンの個所を暗
色とし、その他の個所を明色として2値化認識のもとで
パターン位置の正確な認識を行うことを特徴とする電子
部品のパターン認識方法。1. An illumination for recognizing a recognition pattern attached to an element substrate made of a translucent material used for an electronic component is projected from a side end face of the element substrate to darken a portion of the recognition pattern. A pattern position of the electronic component, which is a bright color, and accurately recognizes a pattern position under binarization recognition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093982A JPH10290100A (en) | 1997-04-11 | 1997-04-11 | Recognition method for pattern of electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9093982A JPH10290100A (en) | 1997-04-11 | 1997-04-11 | Recognition method for pattern of electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10290100A true JPH10290100A (en) | 1998-10-27 |
Family
ID=14097620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9093982A Pending JPH10290100A (en) | 1997-04-11 | 1997-04-11 | Recognition method for pattern of electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10290100A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1048473A1 (en) * | 1998-09-09 | 2000-11-02 | Rohm Co., Ltd. | Thermal printhead |
WO2017037949A1 (en) * | 2015-09-04 | 2017-03-09 | 富士機械製造株式会社 | Operation machine |
-
1997
- 1997-04-11 JP JP9093982A patent/JPH10290100A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1048473A1 (en) * | 1998-09-09 | 2000-11-02 | Rohm Co., Ltd. | Thermal printhead |
EP1048473A4 (en) * | 1998-09-09 | 2002-01-16 | Rohm Co Ltd | Thermal printhead |
WO2017037949A1 (en) * | 2015-09-04 | 2017-03-09 | 富士機械製造株式会社 | Operation machine |
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