JPH10270617A - Cooler for semiconductor element - Google Patents
Cooler for semiconductor elementInfo
- Publication number
- JPH10270617A JPH10270617A JP9074956A JP7495697A JPH10270617A JP H10270617 A JPH10270617 A JP H10270617A JP 9074956 A JP9074956 A JP 9074956A JP 7495697 A JP7495697 A JP 7495697A JP H10270617 A JPH10270617 A JP H10270617A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling block
- groove
- block
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体素子から
発生する熱を外部に伝導し放散するための半導体素子用
冷却装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device cooling device for conducting and radiating heat generated from a semiconductor device to the outside.
【０００２】[0002]
【従来の技術】従来、大電力用の半導体素子として外形
が平形状に構成されたものがあり、この種の半導体素子
が通電中に発生する熱を効率よく放散させるべく、使用
時に半導体素子の平坦な放熱面部が圧接状態とされる水
冷方式の冷却装置があった。2. Description of the Related Art Conventionally, there has been a semiconductor device for high power, which has a flat outer shape. In order to efficiently dissipate heat generated during energization of this kind of semiconductor device, the semiconductor device is There has been a water-cooling type cooling device in which a flat heat radiating surface portion is brought into a pressure contact state.
【０００３】例えば、図８ないし図１０に示される如
く、この種の冷却装置１として、冷却ブロック本体３
と、該冷却ブロック本体３の下面側に接合された蓋ブロ
ック４とを備えた直方体形状に構成されたものがあっ
た。そして、これら冷却ブロック本体３や蓋ブロック４
の材質としては熱伝導性の観点から通常、銅材が使用さ
れている。For example, as shown in FIGS. 8 to 10, a cooling block body 3 is provided as a cooling device 1 of this type.
And a lid block 4 joined to the lower surface side of the cooling block main body 3 to form a rectangular parallelepiped. The cooling block body 3 and the lid block 4
A copper material is usually used as the material for the above in terms of thermal conductivity.
【０００４】前記冷却ブロック本体３には、その下面側
に適宜数の冷却フィン部５を構成すべく、適宜深さの溝
部６が縦横に形成されており、また、前記蓋ブロック４
は冷却ブロック本体３に対応する矩形の平板状に形成さ
れていた。The cooling block main body 3 is formed with grooves 6 of appropriate depth in the vertical and horizontal directions so as to form an appropriate number of cooling fins 5 on the lower surface thereof.
Was formed in a rectangular flat plate shape corresponding to the cooling block body 3.
【０００５】そして、溝部６開口側を閉塞状として、冷
却ブロック本体３の下面側に蓋ブロック４がろう付けさ
れており、冷却ブロック本体３下面と蓋ブロック４上面
とが液密状にシールされた接合構造とされていた。A lid block 4 is brazed to the lower surface side of the cooling block body 3 with the opening side of the groove 6 being closed, and the lower surface of the cooling block body 3 and the upper surface of the lid block 4 are liquid-tightly sealed. It had a junction structure.
【０００６】ここに、溝部６は冷却ブロック本体３およ
び蓋ブロック４を冷却するための冷却水を案内する水路
を構成する。Here, the groove 6 constitutes a water passage for guiding cooling water for cooling the cooling block main body 3 and the lid block 4.
【０００７】また、冷却ブロック本体３の一側面に、前
記溝部６に連通する流入管７が接続されると共に、冷却
ブロック本体３の他側面に、溝部６に連通する排出管８
が接続されており、冷却水が一側の流入管７を通じて溝
部６に案内され、他側の排出管８より排出されるように
構成されている。An inflow pipe 7 communicating with the groove portion 6 is connected to one side surface of the cooling block body 3, and an exhaust pipe 8 communicating with the groove portion 6 is connected to the other side surface of the cooling block body 3.
The cooling water is guided to the groove 6 through the inflow pipe 7 on one side, and is discharged from the discharge pipe 8 on the other side.
【０００８】そして、図９に示される如く、冷却ブロッ
ク本体３上面の平坦な圧接平面９に、仮想線で示される
半導体素子１０の平坦な放熱面部を圧接した状態で所定
位置にバネ材等を介してボルト止め等により固定するこ
とによって、放熱面部が圧接平面９に所定の加圧力によ
り圧接された状態で保持される。この状態で、冷却装置
１の溝部６に冷却水を流し、半導体素子１０に通電され
れば、通電中に発生する熱は、放熱面部から冷却ブロッ
ク本体３や蓋ブロック４側に伝導され、冷却水を通じて
外部に放熱される。Then, as shown in FIG. 9, a spring material or the like is placed at a predetermined position in a state where the flat heat radiating surface portion of the semiconductor element 10 indicated by a virtual line is in pressure contact with the flat pressure contact plane 9 on the upper surface of the cooling block body 3. By fixing with a bolt or the like through the heat radiation surface portion, the heat radiation surface portion is held in a state of being pressed against the pressing surface 9 by a predetermined pressing force. In this state, if cooling water is supplied to the groove 6 of the cooling device 1 and the semiconductor element 10 is energized, heat generated during energization is conducted from the heat radiating surface to the cooling block main body 3 and the lid block 4 side. Dissipated to the outside through water.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、上記従
来構造の冷却装置１によれば、図１０に示される如く、
冷却ブロック本体３の下面側と蓋ブロック４上面側とを
ろう付けにより接合する方法であり、また、この種のろ
う付けに際して、一般に銀ろう等のろう材が用いられて
いる。However, according to the cooling device 1 having the above-described conventional structure, as shown in FIG.
This is a method of joining the lower surface side of the cooling block main body 3 and the upper surface side of the lid block 4 by brazing. In this type of brazing, a brazing material such as silver brazing is generally used.
【００１０】従って、このろう付け時におけるろう材の
溶融温度は８００〜９００゜Ｃ程度となり、この熱が銅
製の冷却ブロック本体３と蓋ブロック４に伝わり、その
材料となっている銅の軟化によって変形が生じるおそれ
があった。Therefore, the melting temperature of the brazing material at the time of this brazing becomes about 800 to 900 ° C., and this heat is transmitted to the cooling block body 3 and the lid block 4 made of copper, and the copper as the material is softened. Deformation may occur.
【００１１】そして、冷却装置１の使用時においては、
冷却装置１の圧接平面９には半導体素子１０の放熱面部
が加圧状態で当接されており、冷却ブロック本体３およ
び蓋ブロック４を介して蓋ブロック４下面との間に垂直
方向の荷重が付与されることとなる。When the cooling device 1 is used,
The heat dissipating surface of the semiconductor element 10 is pressed against the press contact plane 9 of the cooling device 1 in a pressurized state, and a vertical load is applied between the cooling block body 3 and the lower surface of the lid block 4 via the lid block 4. Will be granted.
【００１２】この付与される荷重は４．５ｋＮ〜１１８
ｋＮにもなり、前記ろう付け時における銅の軟化によっ
て冷却ブロック本体３や蓋ブロック４に変形が生じてい
る場合、この荷重によって銅製である冷却ブロック本体
３の圧接平面９や蓋ブロック４の下面の平坦状態が変形
し、この変形によって圧接平面９に圧接されている半導
体素子１０の放熱面部に不均一の力が作用し、放熱面部
における圧力分布が不均一になるという事態を招いてい
た。The applied load is between 4.5 kN and 118 kN.
When the cooling block body 3 and the lid block 4 are deformed by the softening of the copper during the brazing, the load causes the pressure contact plane 9 of the cooling block body 3 and the lower surface of the lid block 4 to be made of copper. The flat state is deformed, and due to this deformation, a non-uniform force acts on the heat radiating surface portion of the semiconductor element 10 pressed against the pressure contact plane 9, resulting in a non-uniform pressure distribution on the heat radiating surface portion.
【００１３】そして、この放熱面部における不均一な圧
力分布は半導体素子１０の電気的特性を不安定にさせる
おそれがあった。また、半導体素子１０の通電中に発生
する熱が圧接平面９を介して冷却ブロック本体３側に十
分に熱が伝わらない部分が生じ、そのために熱が半導体
素子１０内の一部に集中し、この熱によって半導体素子
１０が破壊されるというおそれもあった。The non-uniform pressure distribution on the heat radiating surface may make the electrical characteristics of the semiconductor element 10 unstable. In addition, a portion where heat generated during energization of the semiconductor element 10 is not sufficiently transmitted to the cooling block main body 3 via the press-contact plane 9 occurs, so that heat concentrates on a part of the semiconductor element 10, There is also a fear that the semiconductor element 10 is destroyed by this heat.
【００１４】そこで、この発明は上記のような問題点を
解消するためになされたもので、半導体素子が均一に圧
接されて効率のよい冷却機能が発揮でき、半導体素子の
電気的特性の安定化や信頼度の向上が図れる半導体素子
用冷却装置を提供することを目的とする。Therefore, the present invention has been made in order to solve the above-mentioned problems, and the semiconductor elements can be uniformly pressed into contact with each other to exhibit an efficient cooling function, thereby stabilizing the electrical characteristics of the semiconductor elements. It is an object of the present invention to provide a semiconductor device cooling device capable of improving reliability.
【００１５】[0015]
【課題を解決するための手段】この発明の請求項１に係
る課題解決手段は、互いに接合された接合面部分に冷却
流体用の流路を形成してなる第１の冷却ブロックと第２
の冷却ブロックとを備え、半導体素子が通電中に発生す
る熱を外部に放散させるべく半導体素子が圧接状態とさ
れる圧接平面を、第１の冷却ブロックもしくは第２の冷
却ブロックの前記接合面部分と反対側の面に有してなる
半導体素子用冷却装置において、前記第１の冷却ブロッ
クもしくは第２の冷却ブロックのいずれか一方側の前記
接合面外周部に、周方向に沿って連続する凹溝部が設け
られると共に、他方側の前記接合面外周部に、前記凹溝
部に液密状に嵌合装着される周方向に沿って連続する突
条部が設けられてなる点にある。According to a first aspect of the present invention, there is provided a first cooling block and a second cooling block, each having a flow passage for a cooling fluid formed in a joining surface portion joined to each other.
A cooling block, wherein a pressing plane in which the semiconductor element is pressed to dissipate heat generated during energization of the semiconductor element to the outside is formed by the bonding surface portion of the first cooling block or the second cooling block. In a semiconductor device cooling device having a surface on the side opposite to the above, in the outer peripheral portion of the bonding surface on either side of the first cooling block or the second cooling block, a concave portion continuous along the circumferential direction is formed. A groove portion is provided, and a continuous ridge portion is provided in an outer peripheral portion of the joining surface on the other side and is continuous in a circumferential direction and fitted in the concave groove portion in a liquid-tight manner.
【００１６】この発明の請求項２に係る課題解決手段
は、前記第１の冷却ブロックと前記第２の冷却ブロック
とが、互いに硬度の異なる材料よりなると共に、前記突
条部の突出高さが前記凹溝部の溝深さより長く形成され
てなる点にある。According to a second aspect of the present invention, the first cooling block and the second cooling block are made of materials having different hardnesses, and the protrusion height of the ridge portion is reduced. There is a point that the groove is formed longer than the groove depth.
【００１７】この発明の請求項３に係る課題解決手段
は、前記凹溝部側と前記突条部とが互いに硬度の異なる
材料よりなると共に、前記突条部の突出高さが前記凹溝
部の溝深さより長く形成されてなる点にある。According to a third aspect of the present invention, the concave groove portion side and the ridge portion are made of materials having different hardness, and the protrusion height of the ridge portion is the groove of the concave groove portion. The point is that it is formed longer than the depth.
【００１８】この発明の請求項４に係る課題解決手段
は、前記凹溝部にシール材を介在させて、前記突条部を
嵌合装着してなる点にある。The means for solving the problem according to claim 4 of the present invention is that the protruding portion is fitted and mounted with the sealing material interposed in the concave groove portion.
【００１９】この発明の請求項５に係る課題解決手段
は、前記突条部が突出方向に漸次肉厚となる逆テーパ状
もしくは突出端に外方弧状に膨出する膨出部を有する形
状とされ、前記凹溝部が前記突条部に対応する内部で拡
開する溝形状とされてなる点にある。According to a fifth aspect of the present invention, there is provided a means for solving the above-mentioned problems, wherein the protrusion has a reverse taper shape in which the wall thickness gradually increases in the protruding direction, or the protruding end has a bulging portion bulging outward in an arc shape. The groove portion is formed in a groove shape that expands inside corresponding to the ridge portion.
【００２０】[0020]
実施の形態１．この発明の実施の形態１を図面に基づい
て説明すると、図１ないし図４において、２０は冷却装
置で、第１の冷却ブロックとしての銅製の冷却ブロック
本体２２と、第２の冷却ブロックとしての銅製の蓋ブロ
ック２３とから主構成されている。また、本実施の形態
においては、冷却ブロック本体２２と蓋ブロック２３と
は異なる種類の銅材が使用され、冷却ブロック本体２２
の方が蓋ブロック２３の方より硬度が高い銅材が使用さ
れている。Embodiment 1. A first embodiment of the present invention will be described with reference to the drawings. In FIGS. 1 to 4, reference numeral 20 denotes a cooling device, which is a cooling block body 22 made of copper as a first cooling block and a cooling block body as a second cooling block. It mainly comprises a lid block 23 made of copper. Further, in the present embodiment, different types of copper materials are used for the cooling block body 22 and the lid block 23.
A copper material having a higher hardness than that of the lid block 23 is used.
【００２１】前記冷却ブロック本体２２は、平面視矩形
の直方体形状に構成され、その下面側に適宜深さの溝部
２４が縦横に形成され、該溝部２４によって溝部２４間
に複数の冷却フィン部２５が下方突出状に備えられた構
造とされている。さらに、溝部２４外方に位置する冷却
ブロック本体２２下面外周部には、周方向に沿って連続
する環状の凹溝部２６が形成されている。また、凹溝部
２６は図２ないし図４に示される如く、下半部、即ち溝
開口側近くで幅狭とされ、上半部、即ち溝底部側で弧状
に膨出する幅広とされた内部で拡開する溝形状とされて
いる。The cooling block main body 22 is formed in a rectangular parallelepiped shape having a rectangular shape in a plan view, and has grooves 24 having appropriate depths formed on the lower surface side thereof, and a plurality of cooling fins 25 are formed between the grooves 24 by the grooves 24. Is provided so as to project downward. Further, an annular recessed groove portion 26 that is continuous along the circumferential direction is formed on the outer peripheral portion of the lower surface of the cooling block body 22 located outside the groove portion 24. As shown in FIGS. 2 to 4, the concave groove 26 has a narrow width near the lower half, that is, near the groove opening side, and a wide internal width that bulges in an arc shape near the upper half, that is, the groove bottom. The shape of the groove expands.
【００２２】前記蓋ブロック２３は冷却ブロック本体２
２に対応する平面視矩形の平板状に形成されており、冷
却ブロック本体２２の凹溝部２６に対応する蓋ブロック
２３上面側の外周部には、周方向に沿って連続する環状
の突条部２７が形成されている。また、突条部２７は図
３および図４に示される如く、下半部、即ち基部側近く
で幅狭とされ、上半部、即ち突出端部側で外方弧状に膨
出する膨出部２７ａを有する幅広とされたいわゆる突出
側で肉厚となる形状とされている。The lid block 23 is provided with the cooling block body 2.
2 is formed in the shape of a flat plate having a rectangular shape in a plan view, and has an annular protrusion that is continuous in the circumferential direction on the outer peripheral portion on the upper surface side of the lid block 23 corresponding to the concave groove portion 26 of the cooling block body 22. 27 are formed. Further, as shown in FIGS. 3 and 4, the ridge 27 is narrowed in the lower half, that is, near the base side, and bulges outwardly bulging in the upper half, that is, the protruding end side. It is shaped so that it is thick on the so-called protruding side that is wide and has the portion 27a.
【００２３】なお、膨出部２７ａの肉厚は凹溝部２６に
おける溝底部側の溝幅よりも若干狭く構成されており、
また、突条部２７の突出高さＨは凹溝部２６の溝深さＬ
よりも僅かに長く形成されている。The thickness of the bulging portion 27a is slightly smaller than the groove width of the concave groove portion 26 on the groove bottom side.
The protruding height H of the ridge portion 27 is the groove depth L of the concave groove portion 26.
It is formed slightly longer than that.
【００２４】そして、蓋ブロック２３の突条部２７を冷
却ブロック本体２２の凹溝部２６内に挿入し、図４に示
される挿入状態でさらに上下方向からプレス機等により
圧縮荷重を加えることにより、硬度の低い蓋ブロック２
３側の突条部２７先端部等が潰されて幅方向に広がる。
この突条部２７先端部の幅方向の広がりによって凹溝部
２６内の隙間部が埋められ、図２に示される如く、凹溝
部２６内に突条部２７が隙間無く嵌合された状態が得ら
れ、ここに、冷却ブロック本体２２下面側と蓋ブロック
２３上面側とが液密状にシールされた接合状態が得られ
る。Then, the protrusion 27 of the lid block 23 is inserted into the groove 26 of the cooling block body 22, and a compressive load is further applied from above and below by a pressing machine or the like in the inserted state shown in FIG. Lid block 2 with low hardness
The tip portion of the protruding portion 27 on the 3 side is crushed and spreads in the width direction.
The gap in the groove 26 is filled by the width of the tip of the protrusion 27 in the width direction, and a state in which the protrusion 27 is fitted into the groove 26 without a gap is obtained as shown in FIG. Thus, a joined state in which the lower surface side of the cooling block body 22 and the upper surface side of the lid block 23 are liquid-tightly sealed is obtained here.
【００２５】なお、この接合状態において、接合面を構
成する冷却ブロック本体２２下面側、即ち冷却ブロック
本体２２下面周縁部および各冷却フィン部２５下面と、
蓋ブロック２３上面側とが互いに密接するように、凹溝
部２６の溝深さＬおよび突条部２７の突出高さＨ等が適
宜設定されている。In this joint state, the lower surface side of the cooling block main body 22 constituting the joint surface, that is, the lower peripheral edge of the cooling block main body 22 and the lower surface of each cooling fin portion 25,
The groove depth L of the concave groove portion 26, the protruding height H of the protruding portion 27, and the like are appropriately set so that the upper surface side of the lid block 23 is in close contact with each other.
【００２６】また、冷却ブロック本体２２の一側面に、
前記溝部２４に連通する流入管２９が接続されると共
に、冷却ブロック本体２２の他側面に、溝部２４に連通
する排出管３０が接続されており、冷却流体の一例とし
ての冷却水が一側の流入管２９を通じて溝部２４に案内
され、溝部２４内を通じて他側の排出管３０より排出さ
れるように構成されている。ここに、溝部２４は冷却水
を案内する流路としての水路を構成する。On one side of the cooling block body 22,
An inflow pipe 29 communicating with the groove 24 is connected, and an exhaust pipe 30 communicating with the groove 24 is connected to the other side surface of the cooling block main body 22. Cooling water as an example of a cooling fluid is provided on one side. It is configured to be guided into the groove 24 through the inflow pipe 29 and to be discharged from the discharge pipe 30 on the other side through the inside of the groove 24. Here, the groove 24 constitutes a water passage as a flow passage for guiding the cooling water.
【００２７】そして、図２に示される如く、冷却ブロッ
ク本体２２上面の平坦な圧接平面３２に、従来同様、仮
想線で示される半導体素子３４の平坦な放熱面部を圧接
した状態で所定位置にバネ材等を介してボルト止め等に
より固定することによって、放熱面部が圧接平面３２に
所定の加圧力により圧接された状態で保持される。この
状態で、流入管２９側より冷却装置２０の溝部２４内に
冷却水を流し、半導体素子３４に通電されれば、通電中
に発生する熱は、放熱面部から圧接平面３２を通じて冷
却ブロック本体３や蓋ブロック４側に伝導され、冷却水
を通じて外部に放熱される。As shown in FIG. 2, the flat heat-dissipation plane 32 on the upper surface of the cooling block body 22 is pressed against the flat heat-dissipation surface portion of the semiconductor element 34, which is shown by an imaginary line, in the same manner as in the prior art. By fixing with a bolt or the like via a material or the like, the heat radiating surface portion is held in a state of being pressed against the pressing surface 32 by a predetermined pressing force. In this state, if cooling water is caused to flow from the side of the inflow pipe 29 into the groove 24 of the cooling device 20 and the semiconductor element 34 is energized, the heat generated during energization causes the heat generated during the energization to pass through the pressure contact plane 32 to the cooling block main body 3 And the heat is transmitted to the lid block 4 side and is radiated to the outside through the cooling water.
【００２８】以上のように、本実施の形態によれば、冷
却ブロック本体２２と蓋ブロック２３との接合が、凹溝
部２６内に突条部２７を挿入して、加圧し、液密状に接
合する構造であり、従来のようなろう付け時における熱
による冷却ブロック本体２２や蓋ブロック２３自体の軟
化が防止でき、ここに材質の軟化による変形が有効に防
止できる。As described above, according to the present embodiment, the cooling block main body 22 and the lid block 23 are joined to each other by inserting the ridge 27 into the groove 26 and applying pressure to make it liquid-tight. Since the structure is such that the cooling block body 22 and the lid block 23 themselves can be prevented from softening due to heat during brazing, deformation due to softening of the material can be effectively prevented.
【００２９】そして、冷却ブロック本体２２の圧接平面
３２に半導体素子３４の放熱面部が圧接されて、冷却ブ
ロック本体２２および蓋ブロック２３を介して圧接平面
３２と蓋ブロック２３下面との間に垂直方向の荷重が付
与された場合であっても、圧接平面３２や蓋ブロック２
３下面の変形が防止でき、それらの面の平坦状態が維持
できる。ここに、圧接平面３２に圧接されている半導体
素子３４の放熱面部には均一な荷重が作用し、放熱面部
における面内の圧力分布が均一となる。The heat dissipating surface of the semiconductor element 34 is pressed against the press contact plane 32 of the cooling block main body 22, and the vertical direction is formed between the press contact plane 32 and the lower surface of the lid block 23 via the cooling block main body 22 and the cover block 23. Even when a load of 1 is applied, the pressure contact plane 32 and the lid block 2
The deformation of the lower surface 3 can be prevented, and the flat state of those surfaces can be maintained. Here, a uniform load acts on the heat dissipation surface of the semiconductor element 34 that is in pressure contact with the pressure contact surface 32, and the in-plane pressure distribution in the heat dissipation surface becomes uniform.
【００３０】従って、半導体素子３４の電気的特性が安
定し、また通電中に半導体素子３４から発生する熱は圧
接平面３２を介して冷却ブロック本体２２側に均一に伝
わり、効率のよい冷却機能が発揮でき、半導体素子３４
内の一部に熱が集中することもなくなり、熱の集中によ
る半導体素子３４の破損も有効に防止できる。ここに、
品質的にもより安定し、通電能力の向上した信頼度の高
い半導体装置を提供できることとなる。Therefore, the electrical characteristics of the semiconductor element 34 are stable, and the heat generated from the semiconductor element 34 during energization is evenly transferred to the cooling block body 22 side through the pressure contact plane 32, thus providing an efficient cooling function. Can be demonstrated, semiconductor element 34
Heat does not concentrate on a part of the inside, and damage of the semiconductor element 34 due to the heat concentration can be effectively prevented. here,
It is possible to provide a highly reliable semiconductor device which is more stable in terms of quality and has improved current carrying capability.
【００３１】また、蓋ブロック２３側を冷却ブロック本
体２２側より硬度の低い銅材で形成しているため、突条
部２７と凹溝部２６との嵌合装着時に突条部２７側が容
易に潰れて変形し、目的とする良好な液密状態を容易に
得ることができ、さらに、凹溝部２６は内部で拡開する
溝形状であり、凹溝部２６からの突条部２７の不用意な
離脱も有効に防止できる。Further, since the lid block 23 is formed of a copper material having a lower hardness than the cooling block main body 22, the projection 27 is easily crushed when the projection 27 and the concave groove 26 are fitted. It is possible to easily obtain a desired good liquid-tight state, and further, the concave groove portion 26 has a groove shape that expands inside, and the ridge portion 27 is inadvertently detached from the concave groove portion 26. Can be effectively prevented.
【００３２】実施の形態２．この発明の実施の形態２を
図５および図６に基づいて説明する。なお、実施の形態
１と同様構成部分は同一符号を付し、その説明を省略す
る。Embodiment 2. Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
【００３３】この実施の形態においては、予め、冷却ブ
ロック本体２２の凹溝部２６における溝底部に沿って所
定量のシール材３６が装着された状態で、蓋ブロック２
３の突条部２７を冷却ブロック本体２２の凹溝部２６内
に挿入し、前記実施の形態１と同様、上下方向から加圧
することにより、硬度の低い蓋ブロック２３側の突条部
２７先端部等が潰されて幅方向に広がり、この突条部２
７先端部の幅方向の広がりとシール材３６の広がりによ
って凹溝部２６内の隙間部が埋められ、図６に示される
如く、凹溝部２６内に突条部２７が嵌合された状態が得
られ、ここに、冷却ブロック本体２２下面側と蓋ブロッ
ク２３上面側とが液密状にシールされた接合状態が得ら
れる。In this embodiment, the lid block 2 is mounted in a state in which a predetermined amount of the sealing material 36 is mounted along the groove bottom of the concave groove 26 of the cooling block main body 22 in advance.
3 is inserted into the concave groove 26 of the cooling block main body 22 and pressurized in the vertical direction in the same manner as in the first embodiment, so that the tip of the ridge 27 on the side of the lid block 23 having a low hardness. Are crushed and spread in the width direction.
The gap in the groove 26 is filled by the width of the tip 7 in the width direction and the spread of the sealing material 36, and a state in which the ridge 27 is fitted in the groove 26 as shown in FIG. Thus, a joined state in which the lower surface side of the cooling block body 22 and the upper surface side of the lid block 23 are liquid-tightly sealed is obtained here.
【００３４】なお、この接合状態においても、冷却ブロ
ック本体２２下面側、即ち冷却ブロック本体２２下面周
縁部および各冷却フィン部２５下面と、蓋ブロック２３
上面側とが密接するように、凹溝部２６の溝深さＬおよ
び突条部２７の突出高さＨ等が適宜設定されている。Even in this joined state, the lower surface side of the cooling block body 22, that is, the peripheral portion of the lower surface of the cooling block body 22 and the lower surface of each cooling fin portion 25, and the lid block 23.
The groove depth L of the concave groove portion 26, the protrusion height H of the ridge portion 27, and the like are appropriately set so that the upper surface side is in close contact.
【００３５】また、冷却ブロック本体２２の一側面に、
前記溝部２４に連通する流入管２９が接続されると共
に、冷却ブロック本体２２の他側面に、溝部２４に連通
する排出管３０が接続され、冷却流体の一例としての冷
却水が一側の流入管２９を通じて溝部２４に案内され、
溝部２４内を通じて他側の排出管３０より排出されるよ
うに構成される。On one side of the cooling block body 22,
An inflow pipe 29 communicating with the groove 24 is connected, and a discharge pipe 30 communicating with the groove 24 is connected to the other side surface of the cooling block main body 22. Is guided to the groove 24 through 29,
It is configured to be discharged from the discharge pipe 30 on the other side through the inside of the groove 24.
【００３６】本実施の形態によっても、冷却ブロック本
体２２や蓋ブロック２３の前記軟化による変形が防止で
き、実施の形態１と同様の効果が得られる。また、冷却
ブロック本体２２と蓋ブロック２３との接合に際して、
シール材３６を介在させる方式であり、接合部分におけ
る凹溝部２６側と突条部２７側とのより高い密着性が得
られ、より高いシール効果が得られる。Also in this embodiment, the deformation of the cooling block body 22 and the lid block 23 due to the softening can be prevented, and the same effect as that of the first embodiment can be obtained. In joining the cooling block body 22 and the lid block 23,
This is a method in which the sealing material 36 is interposed, and higher adhesion between the concave groove portion 26 side and the ridge portion 27 side in the joint portion can be obtained, and a higher sealing effect can be obtained.
【００３７】実施の形態３．この発明の実施の形態３を
図７に基づいて説明する。なお、実施の形態１と同様構
成部分は同一符号を付し、その説明を省略する。Embodiment 3. Third Embodiment A third embodiment of the present invention will be described with reference to FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.
【００３８】この実施の形態においては、蓋ブロック２
３の突条部２７が突出方向に漸次肉厚となる逆テーパ状
に形成され、対応する冷却ブロック本体２２側の凹溝部
２６は溝底部方向に漸次拡開する溝形状に形成されてい
る。In this embodiment, the lid block 2
The third protruding portion 27 is formed in a reverse taper shape having a gradually increasing thickness in the protruding direction, and the corresponding concave groove portion 26 on the cooling block main body 22 side is formed in a groove shape gradually expanding in the groove bottom direction.
【００３９】そして、蓋ブロック２３の突条部２７を冷
却ブロック本体２２の凹溝部２６内に挿入し、前期実施
の形態１と同様、上下方向から加圧することにより、硬
度の低い蓋ブロック２３側の突条部２７先端部等が潰さ
れて幅方向に広がり、この突条部２７先端部の幅方向の
広がりによって凹溝部２６内の隙間部が埋められ、凹溝
部２６内に突条部２７が隙間無く嵌合された状態が得ら
れる。ここに、冷却ブロック本体２２下面側と蓋ブロッ
ク２３上面側とが液密状にシールされた接合状態が得ら
れる。Then, the protrusions 27 of the lid block 23 are inserted into the concave grooves 26 of the cooling block main body 22 and, similarly to the first embodiment, are pressed from above and below to form the lid block 23 having a lower hardness. The tip end portion of the ridge 27 is crushed and spread in the width direction, and the width of the tip end of the ridge portion 27 in the width direction fills the gap in the concave groove portion 26, so that the ridge portion 27 is inserted in the concave groove portion 26. Can be obtained without any gap. Here, a joined state is obtained in which the lower surface side of the cooling block main body 22 and the upper surface side of the lid block 23 are sealed in a liquid-tight manner.
【００４０】なお、この接合状態においても、冷却ブロ
ック本体２２下面側、即ち冷却ブロック本体２２下面周
縁部および各冷却フィン部２５下面と、蓋ブロック２３
上面側とが密接するように、凹溝部２６の溝深さＬおよ
び突条部２７の突出高さＨ等が適宜設定されている。It should be noted that, even in this joined state, the lower surface side of the cooling block main body 22, that is, the lower peripheral portion of the lower surface of the cooling block main body 22 and the lower surface of each cooling fin portion 25, and the lid block 23
The groove depth L of the concave groove portion 26, the protrusion height H of the ridge portion 27, and the like are appropriately set so that the upper surface side is in close contact.
【００４１】また、冷却ブロック本体２２の一側面に、
前記溝部２４に連通する流入管２９が接続されると共
に、冷却ブロック本体２２の他側面に、溝部２４に連通
する排出管３０が接続され、冷却流体の一例としての冷
却水が一側の流入管２９を通じて溝部２４に案内され、
溝部２４内を通じて他側の排出管３０より排出されるよ
うに構成される。On one side of the cooling block body 22,
An inflow pipe 29 communicating with the groove portion 24 is connected, and a discharge pipe 30 communicating with the groove portion 24 is connected to the other side surface of the cooling block main body 22, so that cooling water as an example of the cooling fluid is on one side. Is guided to the groove 24 through 29,
It is configured to be discharged from the discharge pipe 30 on the other side through the inside of the groove 24.
【００４２】本実施の形態によっても、冷却ブロック本
体２２や蓋ブロック２３の前記軟化による変形が防止で
き、実施の形態１と同様の効果が得られる。Also according to this embodiment, the deformation of the cooling block body 22 and the lid block 23 due to the softening can be prevented, and the same effect as that of the first embodiment can be obtained.
【００４３】なお、上記各実施の形態において、蓋ブロ
ック２３に突条部２７が一体に具備された構造を示して
いるが、蓋ブロック２３を冷却ブロック本体２２と同じ
銅材で構成し、蓋ブロック２３の上面外周部に、該蓋ブ
ロック２３の銅材より硬度の低い別の種類の銅材で構成
された突条部２７を別途、装着した構造であってもよ
い。さらには、冷却ブロック本体２２側と蓋ブロック２
３側とを同じ銅材で構成し、突条部２７側が変形容易な
薄肉状に形成し、凹溝部２６を構成する周囲の冷却ブロ
ック本体２２側をより厚肉状に構成してもよい。In each of the above embodiments, the structure in which the ridge portion 27 is integrally provided on the lid block 23 is shown. However, the lid block 23 is made of the same copper material as the cooling block main body 22, and A structure in which a ridge 27 made of another type of copper material having a hardness lower than that of the copper material of the lid block 23 is separately mounted on the outer peripheral surface of the upper surface of the block 23 may be used. Further, the cooling block body 22 side and the lid block 2
The three sides may be made of the same copper material, the protrusions 27 side may be formed in a thin shape that is easily deformable, and the surrounding cooling block main body 22 side that forms the concave groove portion 26 may be formed in a thicker shape.
【００４４】また、冷却ブロック本体２２側に凹溝部２
６を設け、蓋ブロック２３側に突条部２７を設けた構造
を示しているが、冷却ブロック本体２２側に突条部２７
を設け、蓋ブロック２３側に凹溝部２６を設ける構造と
してもよい。さらには、凹溝部２６や突条部２７の形状
も上記各実施の形態に限られず、良好な接合状態が確保
できる形状であればよい。Further, the groove 2 is formed in the cooling block body 22 side.
6 shows the structure in which the ridge 27 is provided on the lid block 23 side, the ridge 27 is provided on the cooling block main body 22 side.
May be provided, and the groove 26 may be provided on the lid block 23 side. Further, the shapes of the concave groove portion 26 and the protruding ridge portion 27 are not limited to those in the above-described embodiments, and may be any shape as long as a favorable bonding state can be ensured.
【００４５】さらに、冷却ブロック本体２２や蓋ブロッ
ク２３が銅材で構成されたものを例示しているが、銅材
に限らず、熱伝導性に優れるその他の金属等で冷却ブロ
ック本体２２や蓋ブロック２３を形成してもよい。Further, although the cooling block body 22 and the lid block 23 are illustrated as being made of a copper material, the cooling block body 22 and the lid are not limited to the copper material but may be made of other metal having excellent heat conductivity. The block 23 may be formed.
【００４６】また、流入管２９や排出管３０の接続位置
も各実施の形態に示されるような冷却ブロック本体２２
の側面に限られず、支障のない位置に適宜接続すればよ
い。Further, the connection positions of the inflow pipe 29 and the exhaust pipe 30 are also the cooling block main body 22 as shown in each embodiment.
It is not limited to the side surface, and may be appropriately connected to a position where there is no hindrance.
【００４７】[0047]
【発明の効果】この発明における請求項１に係る半導体
素子用冷却装置によれば、第１の冷却ブロックもしくは
第２の冷却ブロックのいずれか一方側の接合面外周部
に、周方向に沿って連続する凹溝部が設けられると共
に、他方側の接合面外周部に、前記凹溝部に液密状に嵌
合装着される周方向に沿って連続する突条部が設けられ
てなるものであり、従来のようなろう付けが不要となる
ため、ろう材の溶融による熱の影響が皆無となり、各冷
却ブロックの熱による軟化が防止できて変形が有効に防
止でき、半導体素子が圧接状態で使用される場合におい
ても、均一な圧力分布状態が有効に確保でき、電気的特
性が安定する利点がある。また、半導体素子の通電中に
発生する熱は各冷却ブロックを通じて一部に集中するこ
となく均一に伝導、放散されるので品質的にもより安定
し、信頼度も高い半導体素子を提供できるという利点が
ある。According to the cooling device for a semiconductor device according to the first aspect of the present invention, an outer peripheral portion of a joining surface on one of the first cooling block and the second cooling block is formed along the circumferential direction. A continuous groove portion is provided, and on the outer peripheral portion of the bonding surface on the other side, a continuous ridge portion is provided along the circumferential direction that is fitted and mounted in the groove portion in a liquid-tight manner. Since there is no need for conventional brazing, there is no effect of heat due to melting of the brazing material, it is possible to prevent softening due to heat of each cooling block and effectively prevent deformation, and the semiconductor element is used in a pressure contact state. Even in such a case, there is an advantage that a uniform pressure distribution state can be effectively secured and the electrical characteristics are stabilized. In addition, the heat generated during energization of the semiconductor element is conducted and dissipated uniformly without concentrating through each cooling block, thereby providing a semiconductor element that is more stable in quality and has higher reliability. There is.
【００４８】この発明における請求項２に係る半導体素
子用冷却装置によれば、第１の冷却ブロックと第２の冷
却ブロックとが、互いに硬度の異なる材料よりなると共
に、突条部の突出高さが凹溝部の溝深さより長く形成さ
れてなるものであり、突条部と凹溝部との嵌合装着時に
硬度の低い側が容易に潰れて変形し、良好な液密状態が
容易に得られるという利点がある。According to the cooling device for a semiconductor device according to the second aspect of the present invention, the first cooling block and the second cooling block are made of materials having different hardness from each other, and the height of the projection is increased. Is formed so as to be longer than the groove depth of the concave groove portion, and the side having low hardness is easily crushed and deformed when fitting and mounting the ridge portion and the concave groove portion, and a good liquid-tight state can be easily obtained. There are advantages.
【００４９】この発明における請求項３に係る半導体素
子用冷却装置によれば、凹溝部側と突条部とが互いに硬
度の異なる材料よりなると共に、突条部の突出高さが凹
溝部の溝深さより長く形成されてなるものであり、この
場合にも突条部と凹溝部との嵌合装着時に硬度の低い側
が容易に潰れて変形し、良好な液密状態が容易に得られ
るという利点がある。According to the cooling device for a semiconductor element according to the third aspect of the present invention, the concave groove portion and the ridge portion are made of materials having different hardness from each other, and the protrusion height of the ridge portion is smaller than that of the groove. It is formed to be longer than the depth, and in this case also, the advantage is that the lower side of hardness is easily crushed and deformed at the time of fitting and mounting the ridge and the concave groove, and a good liquid-tight state can be easily obtained. There is.
【００５０】この発明における請求項４に係る半導体素
子用冷却装置によれば、凹溝部にシール材を介在させ
て、突条部を嵌合装着してなるものであり、接合部分に
おける凹溝部側と突条部側とのより高い密着性が得ら
れ、より高いシール効果が得られるという利点がある。According to the cooling device for a semiconductor element according to a fourth aspect of the present invention, the ridge portion is fitted and mounted with the sealing material interposed in the concave groove portion. There is an advantage that a higher adhesiveness with the ridge portion side can be obtained and a higher sealing effect can be obtained.
【００５１】この発明における請求項５に係る半導体素
子用冷却装置によれば、突条部が突出方向に漸次肉厚と
なる逆テーパ状もしくは突出端に外方弧状に膨出する膨
出部を有する形状とされ、凹溝部が前記突条部に対応す
る内部で拡開する溝形状とされてなるものであり、凹溝
部と突条部との液密状の嵌合装着状態において、不用意
な離脱が有効に防止できるという利点がある。According to the fifth aspect of the cooling device for a semiconductor element of the present invention, the protruding portion has a reverse taper shape in which the wall thickness gradually increases in the protruding direction or a bulging portion bulging outward in an outward arc shape at the protruding end. And the concave groove portion is formed to have a groove shape which expands inside corresponding to the ridge portion, and in a liquid-tight fitting mounting state of the concave groove portion and the ridge portion, careless There is an advantage that a proper separation can be effectively prevented.
【図１】 本発明の実施の形態１における平面図であ
る。FIG. 1 is a plan view according to Embodiment 1 of the present invention.
【図２】 図１におけるＩＩ−ＩＩ線断面矢視図であ
る。FIG. 2 is a sectional view taken along the line II-II in FIG.
【図３】 本発明の実施の形態１における製造工程説明
図である。FIG. 3 is an explanatory diagram of a manufacturing process according to the first embodiment of the present invention.
【図４】 本発明の実施の形態１における製造工程説明
図である。FIG. 4 is an explanatory diagram of a manufacturing process according to the first embodiment of the present invention.
【図５】 本発明の実施の形態２における製造工程説明
図である。FIG. 5 is an explanatory diagram of manufacturing process according to the second embodiment of the present invention.
【図６】 本発明の実施の形態２における製造工程説明
図である。FIG. 6 is an explanatory diagram of manufacturing process according to the second embodiment of the present invention.
【図７】 本発明の実施の形態３における製造工程説明
図である。FIG. 7 is an explanatory diagram of a manufacturing process according to a third embodiment of the present invention.
【図８】 従来例を示す平面図である。FIG. 8 is a plan view showing a conventional example.
【図９】 図８におけるＩＸ−ＩＸ線断面矢視図であ
る。9 is a sectional view taken along the line IX-IX in FIG.
【図１０】 従来例における製造工程説明図である。FIG. 10 is an explanatory view of a manufacturing process in a conventional example.
２０ 冷却装置、２２ 冷却ブロック本体、２３ 蓋ブ
ロック、２４ 溝部、２５ 冷却フィン部、２６ 凹溝
部、２７ 突条部、３２ 圧接平面、３４ 半導体素
子、３６ シール材。20 cooling device, 22 cooling block main body, 23 lid block, 24 groove part, 25 cooling fin part, 26 concave groove part, 27 ridge part, 32 pressure contact plane, 34 semiconductor element, 36 sealing material.
Claims (5)
用の流路を形成してなる第１の冷却ブロックと第２の冷
却ブロックとを備え、半導体素子が通電中に発生する熱
を外部に放散させるべく半導体素子が圧接状態とされる
圧接平面を、第１の冷却ブロックもしくは第２の冷却ブ
ロックの前記接合面部分と反対側の面に有してなる半導
体素子用冷却装置において、 前記第１の冷却ブロックもしくは第２の冷却ブロックの
いずれか一方側の前記接合面外周部に、周方向に沿って
連続する凹溝部が設けられると共に、他方側の前記接合
面外周部に、前記凹溝部に液密状に嵌合装着される周方
向に沿って連続する突条部が設けられてなることを特徴
とする半導体素子用冷却装置。1. A semiconductor device comprising: a first cooling block and a second cooling block each having a flow path for a cooling fluid formed at a joint surface portion joined to each other; In the cooling device for a semiconductor element, a pressure-contact plane on which the semiconductor element is brought into a pressure-contact state so as to be diffused into the first cooling block or the second cooling block is provided on a surface opposite to the joint surface portion. A concave groove is provided in the outer peripheral portion of the joining surface on one side of the first cooling block or the second cooling block, and the concave portion is provided in the outer peripheral portion of the joining surface on the other side. A cooling device for a semiconductor element, characterized in that a protrusion is provided in a groove that is fitted and mounted in a liquid-tight manner and is continuous along the circumferential direction.
却ブロックとが、互いに硬度の異なる材料よりなると共
に、前記突条部の突出高さが前記凹溝部の溝深さより長
く形成されてなることを特徴とする請求項１記載の半導
体素子用冷却装置。2. The method according to claim 1, wherein the first cooling block and the second cooling block are made of materials having different hardnesses, and the protrusion height of the ridge is longer than the groove depth of the concave groove. The cooling device for a semiconductor device according to claim 1, wherein
度の異なる材料よりなると共に、前記突条部の突出高さ
が前記凹溝部の溝深さより長く形成されてなることを特
徴とする請求項１記載の半導体素子用冷却装置。3. The concave groove portion side and the ridge portion are made of materials different in hardness from each other, and the protrusion height of the ridge portion is formed to be longer than the groove depth of the concave groove portion. The cooling device for a semiconductor element according to claim 1.
記突条部を嵌合装着してなることを特徴とする請求項
１、２または３記載の半導体素子用冷却装置。4. The cooling device for a semiconductor element according to claim 1, wherein the protruding portion is fitted and mounted with a sealing material interposed in the recessed groove portion.
逆テーパ状もしくは突出端に外方弧状に膨出する膨出部
を有する形状とされ、前記凹溝部が前記突条部に対応す
る内部で拡開する溝形状とされてなることを特徴とする
請求項１、２、３または４記載の半導体素子用冷却装
置。5. The projection has a reverse taper shape that gradually becomes thicker in the projecting direction, or a shape having a bulge that bulges outward in an arc shape at the projecting end, and the groove is formed in the projection. 5. The cooling device for a semiconductor device according to claim 1, wherein said cooling device has a groove shape which expands in a corresponding inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7495697A JP3577192B2 (en) | 1997-03-27 | 1997-03-27 | Cooling device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7495697A JP3577192B2 (en) | 1997-03-27 | 1997-03-27 | Cooling device for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10270617A true JPH10270617A (en) | 1998-10-09 |
| JP3577192B2 JP3577192B2 (en) | 2004-10-13 |
Family
ID=13562293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7495697A Expired - Fee Related JP3577192B2 (en) | 1997-03-27 | 1997-03-27 | Cooling device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3577192B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003007376A1 (en) * | 2001-07-09 | 2003-01-23 | Daikin Industries, Ltd. | Power module and air conditioner |
| JP2009147107A (en) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | Cooling fin and manufacturing method of the cooling fin |
| KR100967254B1 (en) * | 2007-04-06 | 2010-07-01 | 미츠비시 쥬고교 가부시키가이샤 | A heat exchanging plate |
| CN112775003A (en) * | 2019-11-05 | 2021-05-11 | 鸿劲精密股份有限公司 | Sorting equipment and temperature control device and crimping device thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241956A (en) * | 1987-03-30 | 1988-10-07 | Toshiba Corp | Cooler for semiconductor device |
| JPH0919728A (en) * | 1995-07-05 | 1997-01-21 | Atsushi Terada | Mutual extrusion material joining method and liquid cooling heat sink |
-
1997
- 1997-03-27 JP JP7495697A patent/JP3577192B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241956A (en) * | 1987-03-30 | 1988-10-07 | Toshiba Corp | Cooler for semiconductor device |
| JPH0919728A (en) * | 1995-07-05 | 1997-01-21 | Atsushi Terada | Mutual extrusion material joining method and liquid cooling heat sink |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003007376A1 (en) * | 2001-07-09 | 2003-01-23 | Daikin Industries, Ltd. | Power module and air conditioner |
| US7003970B2 (en) | 2001-07-09 | 2006-02-28 | Daikin Industries, Ltd. | Power module and air conditioner |
| KR100967254B1 (en) * | 2007-04-06 | 2010-07-01 | 미츠비시 쥬고교 가부시키가이샤 | A heat exchanging plate |
| JP2009147107A (en) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | Cooling fin and manufacturing method of the cooling fin |
| CN112775003A (en) * | 2019-11-05 | 2021-05-11 | 鸿劲精密股份有限公司 | Sorting equipment and temperature control device and crimping device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3577192B2 (en) | 2004-10-13 |
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