JPH10256431A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPH10256431A
JPH10256431A JP9051235A JP5123597A JPH10256431A JP H10256431 A JPH10256431 A JP H10256431A JP 9051235 A JP9051235 A JP 9051235A JP 5123597 A JP5123597 A JP 5123597A JP H10256431 A JPH10256431 A JP H10256431A
Authority
JP
Japan
Prior art keywords
moisture
package
proof plate
board
package body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9051235A
Other languages
Japanese (ja)
Inventor
Masashi Okunaga
正志 奥長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP9051235A priority Critical patent/JPH10256431A/en
Publication of JPH10256431A publication Critical patent/JPH10256431A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To increase an adhesion strength between a moistureproof board and the main body of a package by burying the moistureproof board inside the main body of the package and forming an uneven section on at least one face of the board. SOLUTION: Between a bottom face of a recessed section 2 which will become a mounting face for a semiconductor element 2 and a bottom face of the main body 1 of a package, a moistureproof board 9 is buried. Due to the existence of the waterproof board 9, the penetration of water from a bottom face of the package through a resin bulk, through which water penetrates the package most easily, can be effectively prevented. The moistureproof board 9 is provided on its both faces with uneven sections 10 and thereby a contact area between the moistureproof board 9 and the main body 1 of the package increases and, at the same time, the adhesion between the moistureproof board 9 and the main body 1 of the package can be also increased due to an anchor effect of the uneven sections 10. By this method, an adhesion strength between the moistureproof board and the main body of the package can be increased without deteriorating the function of the moistureproof board and thereby a semiconductor device with an excellent moistureproof property can be realized.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、パッケージ本体に
半導体素子を収納して気密封止してなる半導体装置とそ
の製造方法に関するものである。The present invention relates to a semiconductor device in which a semiconductor element is housed in a package body and hermetically sealed, and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】一般に、半導体装置の封止方式は、気密
封止タイプと樹脂封止タイプとに大別され、特に、気密
封止タイプでは、これまでセラミック封止（セラミック
パッケージ）が多用されてきた。ところが最近では、高
価なセラミックスの代わりに、モールド樹脂をベースに
した気密封止タイプのプラスチックパッケージが開発さ
れ、実用化の域に達している。2. Description of the Related Art In general, the sealing method of a semiconductor device is roughly classified into a hermetic sealing type and a resin sealing type. In particular, in the hermetic sealing type, ceramic sealing (ceramic package) has been frequently used. Have been. However, recently, instead of expensive ceramics, a hermetically sealed plastic package based on a mold resin has been developed, and has reached the level of practical use.

【０００３】[0003]

【発明が解決しようとする課題】しかしながら、プラス
チックパッケージの多くは、エポキシ系樹脂等の熱硬化
性樹脂を主体としているため、セラミックパッケージに
比較して耐湿性に劣るという問題があった。この耐湿性
の問題に関しては、これまでに様々な検討が行われてお
り、最近の報告では、パッケージ内への水分の浸入経路
として、樹脂のバルクからの水分透過が顕著であり、な
かでもパッケージ底面からの水分透過が支配的である、
との知見が得られている。However, most plastic packages are mainly made of a thermosetting resin such as an epoxy resin, and therefore have a problem that they are inferior in moisture resistance as compared with a ceramic package. Various studies have been conducted on the problem of moisture resistance so far, and a recent report shows that moisture permeation from the bulk of the resin is remarkable as a route of moisture penetration into the package. Moisture transmission from the bottom is dominant,
Has been obtained.

【０００４】そこで従来においては、パッケージ底面か
らの水分透過を防止するために、パッケージ本体の内部
に金属製の防湿板を埋設した構造も提案されているが、
一般にエポキシ系の樹脂は金属との密着性が悪く、しか
も両者の熱膨張係数が大きく異なることから、互いの接
触界面で剥離が生じ、そこに水分が溜まるなどして、十
分に満足のいく防湿効果が得られるものではなかった。
この対策として従来では、防湿板に貫通孔を設けること
で密着性の向上を図った技術も提案されているが、この
対策案では所望の密着強度を得るために、防湿板に多数
の貫通孔を明けるか、貫通孔の孔径を大きくせざるを得
ないため、貫通孔からの水分透過が顕著になり、防湿板
自身の水分透過防止機能が低下するという問題があっ
た。In order to prevent moisture permeation from the package bottom surface, a structure in which a metal moisture-proof plate is buried inside the package body has been proposed.
In general, epoxy resins have poor adhesion to metals, and their thermal expansion coefficients are so different that they peel off at the contact interface with each other and accumulate moisture there. The effect was not obtained.
Conventionally, as a countermeasure, a technique for improving the adhesion by providing a through-hole in the moisture-proof plate has been proposed. However, in this measure, in order to obtain a desired adhesion strength, a large number of through-holes are formed in the moisture-proof plate. However, there is a problem that the permeation of water from the through-hole becomes remarkable, and the function of the moisture-proof plate itself to prevent water permeation is reduced.

【０００５】本発明は、上記課題を解決するためになさ
れたもので、その目的とするところは、防湿板の機能を
低下させることなく、防湿板とパッケージ本体との密着
強度を高めることができる半導体装置とその製造方法を
提供することにある。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to increase the adhesion strength between a moisture-proof plate and a package body without deteriorating the function of the moisture-proof plate. An object of the present invention is to provide a semiconductor device and a manufacturing method thereof.

【０００６】[0006]

【課題を解決するための手段】請求項１記載の発明は、
素子収納用の凹部を有するパッケージ本体と、このパッ
ケージ本体の凹部底面に実装された半導体素子と、その
凹部を閉塞する状態でパッケージ本体に接合された蓋体
とを備えた半導体装置において、パッケージ本体の内部
に防湿板を埋設するとともに、その防湿板の少なくとも
片面に凹凸部を設けた構成を採用した。According to the first aspect of the present invention,
In a semiconductor device comprising: a package body having a recess for accommodating an element, a semiconductor element mounted on a bottom surface of the recess of the package body, and a lid joined to the package body in a state of closing the recess. A moisture-proof plate was embedded in the inside of the device, and a configuration was provided in which unevenness was provided on at least one surface of the moisture-proof plate.

【０００７】この半導体装置においては、パッケージ本
体の内部に防湿板を埋設したことで、樹脂バルクからの
水分透過が防湿板で抑制される。また、防湿板に凹凸部
を設けたことで、パッケージ本体と防湿板との接触面積
が大きくなり、且つ凹凸部によるアンカ効果も付与され
るため、パッケージ本体と防湿板との密着性が高くな
る。In this semiconductor device, the moisture barrier from the resin bulk is suppressed by the moisture barrier because the moisture barrier is buried inside the package body. In addition, the provision of the uneven portion on the moisture-proof plate increases the contact area between the package body and the moisture-proof plate, and also provides an anchoring effect by the uneven portion, thereby increasing the adhesion between the package body and the moisture-proof plate. .

【０００８】請求項２記載の発明は、素子収納用の凹部
を有するパッケージ本体と、このパッケージ本体の凹部
底面に実装された半導体素子と、その凹部を閉塞する状
態でパッケージ本体に接合された蓋体と、パッケージ本
体に一体に組み込まれたリードフレームとを備えた半導
体装置において、パッケージ本体の内部に、上記リード
フレームと一体構造をなす防湿板を埋設してなる半導体
装置の製造方法であって、リードフレームの形状加工に
際し、上記防湿板の少なくとも片面にプレス加工によっ
て凹凸部を形成することとした。According to a second aspect of the present invention, there is provided a package body having a recess for accommodating an element, a semiconductor device mounted on a bottom surface of the recess of the package body, and a lid joined to the package body in a state of closing the recess. What is claimed is: 1. A method for manufacturing a semiconductor device, comprising: a body and a lead frame integrated with a package body, wherein a moisture-proof plate having an integral structure with the lead frame is embedded inside the package body. At the time of forming the lead frame, an uneven portion is formed on at least one surface of the moisture-proof plate by pressing.

【０００９】この半導体装置の製造方法においては、防
湿板の少なくとも片面にプレス加工によって凹凸部を形
成することから、リードフレームの形状加工をプレス法
で行う場合にあっては、リードフレームの形状加工と同
時に防湿板への凹凸形成を行うことができる。また、防
湿板の板厚方向に対しても十分な凹凸寸法をもって凹凸
部を形成できるうえ、所望の平面形状及び断面形状をな
す凹凸部を容易に得ることが可能となる。In this method of manufacturing a semiconductor device, the unevenness is formed by press working on at least one surface of the moisture-proof plate. At the same time, unevenness can be formed on the moisture-proof plate. In addition, the uneven portion can be formed with a sufficient uneven size in the thickness direction of the moisture-proof plate, and the uneven portion having a desired planar shape and cross-sectional shape can be easily obtained.

【００１０】[0010]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しつつ詳細に説明する。図１は本発明に係
る半導体装置の一実施形態を示す断面図である。図１に
おいては、エポキシ系樹脂等から成るパッケージ本体１
に、素子収納用の凹部２が一体形成されている。また、
パッケージ本体１の凹部２底面には、ダイボンド剤３を
用いてチップ状の半導体素子４が実装されている。さら
にパッケージ本体１には、銅合金系やニッケル合金系か
らなる金属製のリードフレーム５が一体に組み込まれて
いる。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a sectional view showing one embodiment of a semiconductor device according to the present invention. In FIG. 1, a package body 1 made of an epoxy resin or the like is shown.
A recess 2 for accommodating the element is formed integrally therewith. Also,
A chip-shaped semiconductor element 4 is mounted on the bottom surface of the concave portion 2 of the package body 1 using a die bonding agent 3. Further, a metal lead frame 5 made of a copper alloy or a nickel alloy is integrally incorporated in the package body 1.

【００１１】リードフレーム５は、パッケージ本体１の
内方に延出したインナーリード部５ａと、パッケージ本
体１の外方に延出したアウターリード部５ｂとを有して
いる。このうち、インナーリード部５ａは半導体素子４
の周囲に近接して配置され、アウターリード部５ｂはパ
ッケージ下方に向けて略直角に曲げ加工されている。そ
して、リードフレーム５のインナーリード部５ａとこれ
に対応する半導体素子４上の電極部（不図示）とが金線
等のボンディングワイヤ６によって結線されている。さ
らに、パッケージ本体１の上端部にはシーリング剤７に
よって板状の蓋体８が接合され、この蓋体８により、パ
ッケージ本体１の凹部２が閉塞され且つ半導体素子４が
気密封止されている。The lead frame 5 has an inner lead portion 5a extending inside the package body 1 and an outer lead portion 5b extending outside the package body 1. Of these, the inner lead portion 5a is the semiconductor element 4
And the outer lead portion 5b is bent substantially at right angles toward the lower part of the package. The inner lead portions 5a of the lead frame 5 and the corresponding electrode portions (not shown) on the semiconductor element 4 are connected by bonding wires 6 such as gold wires. Further, a plate-shaped lid 8 is joined to the upper end of the package main body 1 by a sealing agent 7, and the lid 8 closes the concave portion 2 of the package main body 1 and hermetically seals the semiconductor element 4. .

【００１２】ここで本実施形態においては、パッケージ
本体１の内部で且つ凹部２底面（半導体素子４が実装さ
れる面）よりも下方位置に金属製の防湿板９を埋設する
とともに、この防湿板９の両面に凹凸部１０を設けた構
成を採用している。防湿板９の大きさ（平面的な大き
さ）としては、半導体素子４の底面以上、好ましくは凹
部２底面と同等のものとし、パッケージ厚み方向（図中
上下方向）における凹凸部１０の寸法としては、防湿板
９の板厚を１００％とした場合、その５〜９０％程度の
寸法とする。また、図示のごとく防湿板９の両面に凹凸
部１０を設けて、それぞれの凹凸部１０の寸法を防湿板
９の板厚の半分（５０％）以上に設定する場合は、双方
の凹凸部１０の位置を互い違いに配置することで防湿板
９を貫通しないように配慮する。In this embodiment, a metal moisture-proof plate 9 is buried inside the package body 1 and below the bottom of the recess 2 (the surface on which the semiconductor element 4 is mounted). 9 has a configuration in which the concave and convex portions 10 are provided on both surfaces. The size (planar size) of the moisture-proof plate 9 is equal to or larger than the bottom surface of the semiconductor element 4, preferably equal to the bottom surface of the recess 2, and the size of the uneven portion 10 in the package thickness direction (vertical direction in the drawing). Is about 5 to 90% of the thickness of the moisture-proof plate 9 when the thickness is 100%. Further, as shown in the figure, the uneven portions 10 are provided on both surfaces of the moisture-proof plate 9, and when the size of each uneven portion 10 is set to be equal to or more than half (50%) of the thickness of the moisture-proof plate 9, both the uneven portions 10 are required. Are arranged alternately so as not to penetrate the moisture-proof plate 9.

【００１３】上記構成からなる半導体装置においては、
半導体素子４の実装面となる凹部２底面とパッケージ本
体１の底面との間に防湿板９が介在することから、パッ
ケージ内への水分透過率が最も高いとされる、樹脂バル
クを通したパッケージ底面からの水分透過を防湿板９に
よって効果的に防止することができる。また、防湿板９
の両面に凹凸部１０を設けたことにより、防湿板９とパ
ッケージ本体１との接触面積が大きくなり、且つ凹凸部
１０によるアンカ効果も付与されることから、防湿板９
とパッケージ本体１との密着性も格段に向上したものと
なる。In the semiconductor device having the above configuration,
Since the moisture-proof plate 9 is interposed between the bottom surface of the concave portion 2 serving as the mounting surface of the semiconductor element 4 and the bottom surface of the package body 1, the package through which the moisture is transmitted into the package is considered to be the highest and the resin bulk is passed. The permeation of water from the bottom surface can be effectively prevented by the moisture-proof plate 9. Also, the moisture-proof plate 9
By providing the concave and convex portions 10 on both surfaces, the contact area between the moisture proof plate 9 and the package body 1 is increased, and the anchor effect by the concave and convex portion 10 is also provided.
The adhesion between the package body 1 and the package body 1 is also significantly improved.

【００１４】特に、半導体素子４がＣＣＤ(Charge Coup
led Device) 等の固体撮像素子で且つ蓋体８がシールガ
ラス等の透明板から成る固体撮像装置に適用した場合
は、半導体素子４が気密封止されている凹部２空間への
水分の浸入が大幅に減少することから、蓋体８内面への
結露に起因した画像不良等を防止することができる。In particular, when the semiconductor element 4 is a CCD (Charge Coup)
If the lid 8 is applied to a solid-state imaging device such as a solid-state imaging device such as a led device), and the lid 8 is formed of a transparent plate such as a seal glass, moisture infiltration into the recess 2 space in which the semiconductor element 4 is hermetically sealed. Since it is greatly reduced, it is possible to prevent an image defect or the like due to dew condensation on the inner surface of the lid 8.

【００１５】ところで一般に、リードフレーム５は、銅
合金系やニッケル合金系に代表される帯状金属をプレス
法又はエッチング法によって所定の形状に加工すること
で得られる。その際、リードフレーム５を形状加工する
うえで、図２に示すように、上記インナーリード部５ａ
の内側に所定の大きさのアイランド部１１を矩形状に区
画形成するとともに、そのアイランド部１１をディプレ
ス加工によってインナーリード部５ａよりも沈めてお
く。そして、パッケージ本体１の樹脂成形に際して、モ
ールド金型にリードフレーム５をセットし、この状態で
金型キャビティ内にエポキシ系樹脂等の樹脂成形材料を
注入することにより、パッケージ本体１の内部に上記ア
イランド部１１を埋設させ、そのアイランド部１１を防
湿板９として機能させることができる。In general, the lead frame 5 is obtained by processing a band-shaped metal represented by a copper alloy or a nickel alloy into a predetermined shape by a pressing method or an etching method. At this time, in processing the shape of the lead frame 5, as shown in FIG.
A rectangular island 11 having a predetermined size is formed in the inside, and the island 11 is sunk below the inner lead 5a by depressing. Then, at the time of resin molding of the package body 1, the lead frame 5 is set in a mold, and a resin molding material such as an epoxy resin is injected into the mold cavity in this state, so that the above-described inside of the package body 1 is obtained. The island portion 11 can be buried, and the island portion 11 can function as the moisture-proof plate 9.

【００１６】このようにパッケージ本体１の内部にリー
ドフレーム５と一体構造をなす防湿板９を埋設してなる
半導体装置の製造方法として、本実施形態では、上記リ
ードフレーム５の形状加工に際し、上記防湿板９（アイ
ランド部１１）の両面にプレス加工によって上記凹凸部
１０を形成することとした。As described above, in the present embodiment, as a method of manufacturing a semiconductor device in which the moisture-proof plate 9 having an integral structure with the lead frame 5 is buried inside the package body 1, in the embodiment, The uneven portions 10 are formed on both surfaces of the moisture-proof plate 9 (the island portion 11) by press working.

【００１７】これにより、リードフレーム５の形状加工
をプレス法で行う場合は、一連のプレス加工の中でリー
ドフレーム５の形状加工と同時に、防湿板９への凹凸形
成を行うことができる。したがって、別途、凹凸部１０
を形成するための装置及び工程を新設する必要がない。
また、プレス加工の採用により、防湿板９の板厚に対し
て十分な凹凸寸法をもって凹凸部１０を形成できるう
え、金型形状を変えるだけで所望の平面形状及び断面形
状をなす凹凸部１０を容易に得ることが可能となる。Thus, when the lead frame 5 is shaped by a press method, the unevenness on the moisture-proof plate 9 can be formed simultaneously with the shape processing of the lead frame 5 in a series of press working. Therefore, the uneven portion 10 is separately provided.
It is not necessary to newly provide an apparatus and a process for forming the semiconductor device.
In addition, by employing the press working, the uneven portion 10 can be formed with a sufficient uneven size with respect to the thickness of the moisture-proof plate 9, and the uneven portion 10 having a desired plane shape and cross-sectional shape can be formed only by changing the mold shape. It can be easily obtained.

【００１８】さらに、モールド金型にリードフレーム５
をセットするのに先立ち、そのフレーム表面、特に防湿
板９の両面を、例えば加熱洗浄、紫外線オゾン洗浄、蒸
気洗浄等によって清浄化しておくことにより、防湿板９
とパッケージ本体１との密着性をより一層向上させるこ
とができる。Further, a lead frame 5 is attached to the mold.
Prior to setting, the surface of the frame, in particular, both surfaces of the moisture-proof plate 9 is cleaned by, for example, heating cleaning, ultraviolet ozone cleaning, steam cleaning, or the like, so that the moisture-proof plate 9 is cleaned.
And the package body 1 can be further improved in adhesion.

【００１９】ここで、防湿板９に設けられる凹凸部１０
の具体的な形状例につき、図３（ａ）〜（ｇ）を用いて
説明する。先ず、図３（ａ）は直線状をなす複数本の溝
１０ａを防湿板９の一方の辺と平行に形成したもので、
その断面形状がＶ字形のもの、図３（ｂ）は直線状をな
す複数本の溝１０ｂを互いに交差させて格子状に形成し
たもので、その断面形状が半円状のもの、さらに図３
（ｃ）は直線状をなす複数本の溝１０ｃを所定の角度
（図例では４５°）で斜めに形成したもので、その断面
形状が凹形状のものである。Here, the uneven portion 10 provided on the moisture-proof plate 9
A specific example of the shape will be described with reference to FIGS. First, FIG. 3A shows a plurality of linear grooves 10a formed in parallel with one side of the moisture-proof plate 9.
FIG. 3 (b) shows a V-shaped cross section, and FIG. 3 (b) shows a cross-sectional shape in which a plurality of linear grooves 10b are formed in a lattice shape by crossing each other.
(C) is a cross-sectional shape in which a plurality of linear grooves 10c are formed obliquely at a predetermined angle (45 ° in the illustrated example) and have a concave cross section.

【００２０】ちなみに、各々の溝１０ａ〜１０ｃのパタ
ーンと断面形状については特に関連性はなく、いずれの
組み合わせ（例えば、斜めの溝１０ｃで断面形状がＶ字
形のものなど）も考えられる。また、溝のパターン自体
も、防湿板９の中心から放射状に延びる直線パターン
や、直線パターン以外にも、円形パターン、三角形パタ
ーン、四角形パターン、波形パターン、又はこれらの組
み合わせなど、種々の形状パターンが考えられる。Incidentally, there is no particular relation between the pattern and the cross-sectional shape of each of the grooves 10a to 10c, and any combination (for example, a diagonal groove 10c with a V-shaped cross-sectional shape) can be considered. In addition, the groove pattern itself also has various shape patterns such as a circular pattern, a triangular pattern, a square pattern, a waveform pattern, or a combination thereof in addition to a linear pattern extending radially from the center of the moisture-proof plate 9 and a linear pattern. Conceivable.

【００２１】一方、図３（ｄ）は平面視円形の凹み１０
ｄをマトリクス状に配置形成したもので、その断面形状
が凹形状のもの、図３（ｅ）は同じく平面視円形の凹み
１０ｅをマトリクス状に配置形成したもので、その断面
形状がＶ字形のものである。さらに、図３（ｆ）は平面
視四角形の凹み１０ｆをマトリクス状に配置形成したも
ので、その断面形状が凹形状のもの、図３（ｇ）は同じ
く平面視四角形の凹み１０ｇをマトリクス状に配置形成
したもので、その断面形状がＶ字形のものである。On the other hand, FIG. 3D shows a circular recess 10 in plan view.
d are arranged in a matrix and have a concave cross-sectional shape. FIG. 3 (e) is a diagram in which concaves 10e also having a circular shape in a plan view are arranged and formed in a matrix and have a V-shaped cross-sectional shape. Things. Further, FIG. 3 (f) is a diagram in which rectangular recesses 10f in plan view are arranged and formed in a matrix, and the cross-sectional shape thereof is concave, and FIG. They are arranged and formed, and have a V-shaped cross section.

【００２２】これらの凹み１０ｄ〜１０ｇについても、
例えば平面視三角形のものなど、他の形状例が考えら
れ、その配置状態についても上記マトリクス状以外に、
例えば互いに隣接する列の凹み１０ｄ〜１０ｇを千鳥状
に配置したり、平面視三角形の凹みを採用した場合に
は、４つ凹みを１組として互いの頂部を突き合わせるよ
うに配置するなど、種々の配置例が考えられる。For these recesses 10d to 10g,
For example, other shape examples such as a triangular shape in a plan view are conceivable.
For example, the dents 10d to 10g in rows adjacent to each other are arranged in a zigzag pattern, or when a triangular dent is used in plan view, four dents are arranged as a set so that the tops of the dents abut each other. An example of the arrangement can be considered.

【００２３】ちなみに、図３（ａ）〜（ｇ）の中で、い
ずれの平面形状の溝又は凹みをもって防湿板９に凹凸部
１０を形成するにしても、その断面形状が図３（ａ），
（ｅ），（ｇ）のようなＶ字形のものを採用し、それに
合わせて先端が尖ったプレス金型（パンチ等）を用いる
ことにより、きわめて小さなプレス圧で所望の凹凸形状
を得ることができる。3 (a) to 3 (g), no matter which plane-shaped groove or recess is used to form the concavo-convex portion 10 on the moisture-proof plate 9, the cross-sectional shape is as shown in FIG. 3 (a). ,
By adopting a V-shaped one as shown in (e) and (g) and using a press die (punch etc.) with a sharp tip in accordance with it, it is possible to obtain a desired uneven shape with an extremely small press pressure. it can.

【００２４】なお、上記実施形態においては、特に好適
な例として防湿板９の両面に凹凸部１０を設けた場合に
ついて説明したが、防湿板９の片面だけに凹凸部１０を
設けることでも従来に比して密着性の向上が図られるこ
とは言うまでもない。In the above-described embodiment, the case where the uneven portions 10 are provided on both surfaces of the moisture-proof plate 9 has been described as a particularly preferable example. However, it is conventionally possible to provide the uneven portions 10 on only one surface of the moisture-proof plate 9. Needless to say, the adhesion can be improved.

【００２５】また、防湿板９に凹凸部１０を形成する加
工方法としても、特に好適な例としてプレス加工を例に
挙げたが、これ以外にも、エッチング法（ハーフエッチ
ング）やサンドブラストによる粗面化加工によって凹凸
部１０を形成するようにしてもかまわない。As a processing method for forming the concavo-convex portion 10 on the moisture-proof plate 9, press working is mentioned as a particularly preferred example. In addition to this, a rough surface formed by etching (half etching) or sand blasting is used. The concave and convex portion 10 may be formed by chemical processing.

【００２６】さらに、現状では樹脂バルクからの水分透
過のうち、特にパッケージ底面からの水分透過が支配的
である、との知見が得られていることから、本実施形態
においても、パッケージ底面からの水分透過を効果的に
防止すべく、半導体素子４が実装される凹部２底面より
も下方位置に防湿板９を埋設した構成を採用している
が、今後パッケージサイズの縮小化が進むと、パッケー
ジ側面からの水分透過も重要視されることが予想され
る。そこで、将来的な対応として、例えば防湿板９の周
縁部をパッケージ上方に向けて屈曲させた構成を採用す
れば、その屈曲部分でパッケージ側面からの水分透過も
防止することができ、これによって樹脂バルクからの水
分透過をより広範囲にわたって防止することが可能とな
る。Further, at present, it has been found that among the moisture permeation from the resin bulk, the moisture permeation particularly from the package bottom is dominant. In order to effectively prevent moisture permeation, a configuration is employed in which a moisture-proof plate 9 is buried below the bottom of the recess 2 in which the semiconductor element 4 is mounted. It is expected that the permeation of moisture from the side is also important. Therefore, as a future measure, for example, by adopting a configuration in which the peripheral portion of the moisture-proof plate 9 is bent toward the upper side of the package, it is possible to prevent moisture permeation from the side surface of the package at the bent portion. Moisture permeation from the bulk can be prevented over a wider range.

【００２７】[0027]

【発明の効果】以上説明したように、本発明の半導体装
置によれば、パッケージ本体の内部に防湿板を埋設した
ことで、樹脂バルクからの水分透過を防湿板で効果的に
防止することができる。また、防湿板の少なくも片面に
凹凸部を設けたことで、パッケージ本体と防湿板との密
着性を向上させることができる。その結果、防湿板の機
能を何ら低下させることなく、防湿板とパッケージ本体
との密着強度を高めることができるため、耐湿性に優れ
た半導体装置を提供することが可能となる。As described above, according to the semiconductor device of the present invention, the moisture barrier from the resin bulk can be effectively prevented by the moisture barrier by burying the moisture barrier in the package body. it can. In addition, the provision of the concavo-convex portion on at least one surface of the moisture-proof plate can improve the adhesion between the package body and the moisture-proof plate. As a result, the adhesion strength between the moisture-proof plate and the package body can be increased without any reduction in the function of the moisture-proof plate, so that a semiconductor device with excellent moisture resistance can be provided.

【００２８】また、本発明の半導体装置の製造方法によ
れば、防湿板の少なくとも片面にプレス加工によって凹
凸部を形成するようにしたので、リードフレームの形状
加工と同時に防湿板への凹凸形成を行うことができる。
また、防湿板の板厚方向に対しても十分な凹凸寸法をも
って凹凸部を形成できるうえ、所望の平面形状及び断面
形状をなす凹凸部を容易に得ることが可能となる。その
結果、耐湿性に優れた半導体装置をきわめて安価に提供
することが可能となる。Further, according to the method of manufacturing a semiconductor device of the present invention, the unevenness is formed on at least one surface of the moisture-proof plate by press working. It can be carried out.
In addition, the uneven portion can be formed with a sufficient uneven size in the thickness direction of the moisture-proof plate, and the uneven portion having a desired planar shape and cross-sectional shape can be easily obtained. As a result, a semiconductor device having excellent moisture resistance can be provided at extremely low cost.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明に係る半導体装置の一実施形態を示す断
面図である。FIG. 1 is a sectional view showing one embodiment of a semiconductor device according to the present invention.

【図２】リードフレームの形状例を示す平面図である。FIG. 2 is a plan view showing a shape example of a lead frame.

【図３】防湿板の凹凸形状の具体例を説明する図であ
る。FIG. 3 is a diagram illustrating a specific example of a concave-convex shape of a moisture-proof plate.

【符号の説明】[Explanation of symbols]

１ パッケージ本体 ２ 凹部 ４ 半導体素子
５ リードフレーム ８ 蓋体 ９ 防湿板 １０ 凹凸部DESCRIPTION OF SYMBOLS 1 Package main body 2 Depression 4 Semiconductor element
5 Lead frame 8 Lid 9 Moisture proof plate 10 Uneven part

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 素子収納用の凹部を有するパッケージ本
体と、このパッケージ本体の凹部底面に実装された半導
体素子と、前記凹部を閉塞する状態で前記パッケージ本
体に接合された蓋体とを備えた半導体装置において、 前記パッケージ本体の内部に防湿板を埋設するととも
に、該防湿板の少なくとも片面に凹凸部を設けてなるこ
とを特徴とする半導体装置。1. A package body having a recess for accommodating an element, a semiconductor element mounted on a bottom surface of the recess of the package body, and a lid joined to the package body in a state of closing the recess. In a semiconductor device, a moisture-proof board is embedded in the inside of the package main part, and an uneven part is provided in at least one side of the moisture-proof board. 【請求項２】 素子収納用の凹部を有するパッケージ本
体と、このパッケージ本体の凹部底面に実装された半導
体素子と、前記凹部を閉塞する状態で前記パッケージ本
体に接合された蓋体と、前記パッケージ本体に一体に組
み込まれたリードフレームとを備えた半導体装置におい
て、 前記パッケージ本体の内部に、前記リードフレームと一
体構造をなす防湿板を埋設してなる半導体装置の製造方
法であって、 前記リードフレームの形状加工に際し、前記防湿板の少
なくとも片面にプレス加工によって凹凸部を形成するこ
とを特徴とする半導体装置の製造方法。2. A package body having a recess for accommodating an element, a semiconductor element mounted on a bottom surface of the recess of the package body, a lid joined to the package body in a state of closing the recess, and the package. A semiconductor device comprising: a lead frame integrated with a main body; a method for manufacturing a semiconductor device, comprising: burying a moisture-proof plate having an integral structure with the lead frame inside the package main body; A method of manufacturing a semiconductor device, comprising: forming a concave and convex portion on at least one surface of the moisture-proof plate by pressing when forming a frame.
JP9051235A 1997-03-06 1997-03-06 Semiconductor device and manufacture thereof Pending JPH10256431A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9051235A JPH10256431A (en) 1997-03-06 1997-03-06 Semiconductor device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9051235A JPH10256431A (en) 1997-03-06 1997-03-06 Semiconductor device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH10256431A true JPH10256431A (en) 1998-09-25

Family

ID=12881297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9051235A Pending JPH10256431A (en) 1997-03-06 1997-03-06 Semiconductor device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH10256431A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849760B2 (en) * 2000-04-28 2012-01-11 セル インパクト エービー Plate manufacturing method including intermediate roughing and final forming
JP2012033626A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Film for flip-chip type semiconductor rear face, and use thereof
WO2014069171A1 (en) * 2012-10-30 2014-05-08 Nok株式会社 Method for machining seal-mounting groove in metal plate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849760B2 (en) * 2000-04-28 2012-01-11 セル インパクト エービー Plate manufacturing method including intermediate roughing and final forming
JP2012033626A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Film for flip-chip type semiconductor rear face, and use thereof
US10211083B2 (en) 2010-07-29 2019-02-19 Nitto Denko Corporation Film for flip chip type semiconductor back surface and its use
WO2014069171A1 (en) * 2012-10-30 2014-05-08 Nok株式会社 Method for machining seal-mounting groove in metal plate
US9592617B2 (en) 2012-10-30 2017-03-14 Nok Corporation Method for machining seal-mounting groove in metal plate

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