JPH10253323A - Method for inspecting mounting state of electronic parts with bump - Google Patents
Method for inspecting mounting state of electronic parts with bumpInfo
- Publication number
- JPH10253323A JPH10253323A JP9051319A JP5131997A JPH10253323A JP H10253323 A JPH10253323 A JP H10253323A JP 9051319 A JP9051319 A JP 9051319A JP 5131997 A JP5131997 A JP 5131997A JP H10253323 A JPH10253323 A JP H10253323A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- bump
- bumps
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フリップチップな
どのバンプ付き電子部品の実装状態検査方法に関するも
のである。[0001] 1. Field of the Invention [0002] The present invention relates to a method for inspecting a mounted state of an electronic component having a bump such as a flip chip.
【０００２】[0002]
【従来の技術】電子部品の実装方法として、フリップチ
ップやＢＧＡ（Ｂａｌｌ ＧｒｉｄＡｒｒａｙ）などの
バンプ付きの電子部品を基板の回路パターンの電極に固
着する方法が知られている。この方法は、バンプを加熱
することにより、ハンダなどで形成されたバンプを回路
パターンの電極に固着するようになっている。2. Description of the Related Art As a mounting method of an electronic component, there is known a method of fixing an electronic component with a bump such as a flip chip or a BGA (Ball Grid Array) to an electrode of a circuit pattern on a substrate. In this method, a bump formed by solder or the like is fixed to an electrode of a circuit pattern by heating the bump.
【０００３】ところで電子部品を基板に実装した後は、
バンプは大部分が電子部品の下に隠された状態となり、
外部からバンプを観察することはできないので、外観検
査による方法では実装状態の検査を行うことができな
い。そこで従来は、Ｘ線によりバンプの固着状態を検査
することが知られている。この検査は、電子部品に垂直
にＸ線を照射し、この透過Ｘ線を画像に取り込んで実装
状態を判定するものである。すなわち、バンプは鉛（Ｐ
ｂ）を含んでいるためＸ線が透過しにく、画像上では影
となって現れることから、その画像からバンプの固着状
態の良否を判定するものである。After mounting electronic components on a board,
Most of the bumps are hidden under the electronic components,
Since the bump cannot be observed from the outside, the mounting state cannot be inspected by the method based on the appearance inspection. Therefore, conventionally, it is known to inspect the fixed state of the bumps by X-rays. In this inspection, an electronic component is irradiated with X-rays vertically, and the transmitted X-rays are captured in an image to determine a mounting state. That is, the bump is made of lead (P
Since the X-rays contain b), the X-rays are difficult to transmit and appear as a shadow on the image. Therefore, the quality of the fixed state of the bump is determined from the image.
【０００４】[0004]
【発明が解決しようとする課題】しかしながらＸ線によ
る検査方法では、たとえばバンプが基板の回路パターン
の電極と接触せずバンプと電極の間に隙間を生じてい
る、いわゆる「浮き」の状態は原理的に判定できないな
ど、検査の信頼性は低いものであった。また、Ｘ線検査
装置は放射線を使用するので、オペレータへの安全性に
も重大な問題があった。更にはＸ線装置は高価であるこ
とから、多大な設備費を要するという問題点があった。
以上のことから、Ｘ線による検査方法は汎用性のある適
切な方法とはいえないものであった。However, in the inspection method using X-rays, for example, the so-called "floating" state, in which a bump is not in contact with an electrode of a circuit pattern on a substrate and a gap is formed between the bump and the electrode, is a principle. The reliability of the inspection was low, for example, it was not possible to make a judgment. Further, since the X-ray inspection apparatus uses radiation, there is a serious problem in safety for an operator. Furthermore, since the X-ray apparatus is expensive, there is a problem that a large facility cost is required.
From the above, the inspection method using X-rays was not a versatile and appropriate method.
【０００５】そこで本発明は、信頼性が高く簡便安価
で、しかも安全にバンプ付き電子部品の実装状態の検査
ができるバンプ付き電子部品の実装状態検査方法を提供
することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for inspecting the mounting state of electronic components with bumps, which is highly reliable, simple and inexpensive, and can safely inspect the mounting state of electronic components with bumps.
【０００６】[0006]
【課題を解決するための手段】本発明のバンプ付き電子
部品の実装状態の検査方法は、バンプ付き電子部品を実
装した基板上において、基板の上面の複数点の高さと、
バンプ付き電子部品の上面の複数点の高さを高さ計測手
段により計測し、この計測結果から複数位置における基
板の上面とバンプ付き電子部品の上面との高低差を求
め、これらの高低差を予め設定された設定値と比較する
ことにより、バンプ付き電子部品のバンプの固着状態の
良否を判定する。According to the present invention, there is provided a method for inspecting a mounted state of an electronic component with bumps, the method comprising the steps of:
The heights of a plurality of points on the upper surface of the electronic component with bumps are measured by height measuring means, and the height difference between the upper surface of the substrate and the upper surface of the electronic component with bumps at a plurality of positions is determined from the measurement results, and the height difference is calculated. The quality of the fixed state of the bumps of the electronic component with bumps is determined by comparing the value with a preset value.
【０００７】[0007]
【発明の実施の形態】上記構成の本発明によれば、実装
後の基板上において基板上面とバンプ付き電子部品の上
面との高低差を求め、この高さをあらかじめ設定された
設定値と比較することにより、バンプ付き電子部品の実
装状態の良否を簡単・的確に判定することができる。According to the present invention having the above-described structure, the height difference between the upper surface of the board and the upper surface of the electronic component with bumps is determined on the board after mounting, and this height is compared with a preset set value. By doing so, the quality of the mounted state of the electronic component with bumps can be easily and accurately determined.
【０００８】次に、本発明の実施の形態を図面を参照し
て説明する。図１は、本発明の一実施の形態のバンプ付
き電子部品の実装状態検査装置の斜視図、図２は同基板
の平面図、図３は同基板の側断面図、図４（ａ）、
（ｂ）は同基板の側断面図、図５は同基板の側断面図、
図６は同基板の側断面図である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a mounting state inspection apparatus for an electronic component with bumps according to an embodiment of the present invention, FIG. 2 is a plan view of the same board, FIG. 3 is a side sectional view of the same board, FIG.
(B) is a side sectional view of the same substrate, FIG. 5 is a side sectional view of the same substrate,
FIG. 6 is a side sectional view of the same substrate.
【０００９】まず、図１を参照してバンプ付き電子部品
の実装状態検査装置の構成を説明する。図１において、
１は可動テーブルであり、Ｘ軸モータ２およびＹ軸モー
タ３が装着されている。可動テーブル１上には検査対象
である基板４が載置される。基板４上にはバンプ付き電
子部品５が実装されている。Ｘ軸モータ２とＹ軸モータ
３が駆動することにより、基板４はＸ方向やＹ方向に水
平移動し、その位置が調整される。First, the configuration of a mounting state inspection apparatus for an electronic component with bumps will be described with reference to FIG. In FIG.
Reference numeral 1 denotes a movable table on which an X-axis motor 2 and a Y-axis motor 3 are mounted. A substrate 4 to be inspected is placed on the movable table 1. Electronic components 5 with bumps are mounted on the substrate 4. When the X-axis motor 2 and the Y-axis motor 3 are driven, the substrate 4 moves horizontally in the X direction and the Y direction, and its position is adjusted.
【００１０】可動テーブル１の上方には、高さ計測手段
１０が配設されている。高さ計測手段１０はレーザ発生
器とＰＳＤ（位置検出素子）との組み合わせより成り、
以下その構成を説明する。１１はレーザ発生器であり、
計測用のレーザ光を発射する。レーザ発生器１１からの
レーザ光を反射する位置に２つのスキャンニング用のミ
ラー１２ａ、１２ｂが配設されている。２つのミラー１
２ａ，１２ｂは、それぞれを駆動するガルバノ１３と連
結されている。これらの２つのガルバノ１３の回転角を
制御することにより、レーザ発生器１１から照射された
レーザ光をＸ方向およびＹ方向にスキャンニングさせる
ことができる。Above the movable table 1, a height measuring means 10 is provided. The height measuring means 10 is composed of a combination of a laser generator and a PSD (position detecting element),
The configuration will be described below. 11 is a laser generator,
Emit a laser beam for measurement. Two mirrors 12 a and 12 b for scanning are arranged at positions where the laser light from the laser generator 11 is reflected. Two mirrors 1
2a and 12b are connected to a galvano 13 that drives each of them. By controlling the rotation angles of these two galvanometers 13, the laser light emitted from the laser generator 11 can be scanned in the X and Y directions.
【００１１】ミラー１２ｂからの反射光の経路にはｆθ
レンズ１４が配設されている。このｆθレンズ１４を透
過することにより、レーザ光は平行光線となる。ｆθレ
ンズ１４に隣接してハーフミラー１５が装着されてい
る。ハーフミラー１５はｆθレンズ１４を透過した光線
を反射させ、下の基板４上に照射する。また、ハーフミ
ラー１５の直上にはカメラ１６が備えられている。この
カメラ１６は基板４と電子部品５の位置をハーフミラー
１５を透過して認識する。基板４の上方には、基板４を
中心に平面視して９０度ごとの放射状に４個のＰＳＤ１
７が配設されている。これらのＰＳＤ１７は、基板４や
電子部品５からのレーザ光の反射光を受光する。この反
射光を４個のＰＳＤ１７で４方向から受光することによ
り、計測点の高さ位置を計測する。The path of the reflected light from the mirror 12b is fθ
A lens 14 is provided. By passing through the fθ lens 14, the laser beam becomes a parallel light beam. A half mirror 15 is mounted adjacent to the fθ lens 14. The half mirror 15 reflects the light beam transmitted through the fθ lens 14 and irradiates it on the substrate 4 below. A camera 16 is provided directly above the half mirror 15. The camera 16 recognizes the positions of the board 4 and the electronic component 5 through the half mirror 15. Above the substrate 4, four PSDs 1 are arranged radially at every 90 degrees when the substrate 4 is viewed in plan.
7 are provided. These PSDs 17 receive reflected light of laser light from the substrate 4 and the electronic component 5. The reflected light is received by the four PSDs 17 from four directions to measure the height position of the measurement point.
【００１２】次にバンプ付き電子部品の実装状態検査装
置の制御系を説明する。図１において、スキャナ制御部
２０はガルバノ１３に接続され、レーザ光線のＸ方向お
よびＹ方向へのスキャンニング制御を行う。レーザ制御
部２１はレーザ発生器１１に接続され、レーザ光の制御
を行う。判定部２２は、ＰＳＤ１７からの信号を受け計
測点の高さ求める。この高さに基づき、基板４と電子部
品５の高低差を計算し、この高低差を予め設定された設
定値すなわち許容範囲と比較して合否判定を行う。モー
タ制御部２３は可動テーブル１のＸ軸モータ２、Ｙ軸モ
ータ３の動作制御を行う。主制御部２４は判定部２２か
ら判定結果が入力され、また上記スキャナ制御部２０，
レーザ制御部２１，判定部２２，モータ制御部２３の全
体の制御を行う。Next, the control system of the device for inspecting the mounting state of electronic components with bumps will be described. In FIG. 1, a scanner control unit 20 is connected to the galvanometer 13 and controls scanning of a laser beam in the X and Y directions. The laser control unit 21 is connected to the laser generator 11 and controls a laser beam. The determination unit 22 receives the signal from the PSD 17 and obtains the height of the measurement point. Based on the height, a height difference between the substrate 4 and the electronic component 5 is calculated, and the height difference is compared with a preset set value, that is, an allowable range, and a pass / fail judgment is made. The motor control unit 23 controls the operation of the X-axis motor 2 and the Y-axis motor 3 of the movable table 1. The main control unit 24 receives the judgment result from the judgment unit 22, and inputs the judgment result to the scanner control unit 20.
It controls the entire laser control unit 21, determination unit 22, and motor control unit 23.
【００１３】このバンプ付き電子部品の実装状態検査装
置は上記のような構成より成り、以下、バンプ付き電子
部品の実装状態の検査方法について説明する。図１にお
いて、バンプ付きの電子部品５が実装された基板４は可
動テーブル１上に載置される。この基板４及び電子部品
５をカメラ１６が画像認識する。この認識結果に基づき
可動テーブル１が駆動され、基板４および電子分品５の
各計測対象点が位置決めされる。This device for inspecting the mounted state of an electronic component with bumps has the above-described configuration. Hereinafter, a method for inspecting the mounted state of an electronic component with bumps will be described. In FIG. 1, a substrate 4 on which electronic components 5 with bumps are mounted is placed on a movable table 1. The camera 16 recognizes the image of the board 4 and the electronic component 5. The movable table 1 is driven based on the recognition result, and the measurement target points of the substrate 4 and the electronic components 5 are positioned.
【００１４】次に高さ計測手段１０により高さの計測が
行われる。図２（ａ），（ｂ）において、ａｉ（ａ１、
ａ２、ａ３、ａ４）は基板４上の計測点、ｂｉ（ｂ１、
ｂ２、ｂ３、ｂ４）は電子部品５上の計測点を示す。図
２（ａ）では、電子部品５の４辺の中点に対応する４位
置について、また図２（ｂ）では、電子部品５の各角部
付近の４位置について計測が行われる例を示している。
計測は、スキャンニング用のミラー１２ａ，１２ｂをガ
ルバノ１３によって回転させることによりレーザ光を基
板４または電子部品５の上面のそれぞれの計測点ａｉ，
ｂｉに移動させて行われる。各計測点からの反射光はＰ
ＳＤ１７にて受光され、判定部２２にて、計測点の高さ
とそれぞれの計測位置に対応する高低差が計算される。Next, the height is measured by the height measuring means 10. In FIGS. 2A and 2B, ai (a1,
a2, a3, a4) are measurement points on the substrate 4, and bi (b1,
b2, b3, b4) indicate measurement points on the electronic component 5. 2A shows an example in which measurement is performed at four positions corresponding to the midpoint of the four sides of the electronic component 5, and FIG. 2B shows an example in which measurement is performed at four positions near each corner of the electronic component 5. ing.
The measurement is performed by rotating the mirrors 12a and 12b for scanning by the galvanometer 13 so that the laser light is applied to the respective measurement points ai and
bi. The reflected light from each measurement point is P
The light is received at SD17, and the determination unit 22 calculates the height of the measurement point and the height difference corresponding to each measurement position.
【００１５】次にこの高低差の計算方法について説明す
る。図３において、Ｈａｉ、Ｈｂｉは、各計測点ａｉ，
ｂｉでの高さ計測値を示す。従って高低差ｈｉは、基板
４と電子部品５の高さ計測値の差、すなわちｈｉ＝Ｈａ
ｉ−Ｈｂｉである。この高低差ｈｉが、設定された許容
範囲からはずれた場合に、実装状態は不良であると判定
される。Next, a method of calculating the height difference will be described. In FIG. 3, Hai and Hbi are measured points ai,
Shows the height measurement at bi. Therefore, the height difference hi is the difference between the height measurement values of the substrate 4 and the electronic component 5, that is, hi = Ha.
i-Hbi. If the height difference hi deviates from the set allowable range, the mounting state is determined to be defective.
【００１６】以下、バンプ付き電子部品の実装状態の検
査方法による判定例について説明する。まず、不良と判
定される実装状態の例を図４（ａ）、（ｂ）を参照して
説明する。図４（ａ）、（ｂ）において、５ａは電子部
品５のバンプを，４ａは基板４の電極を示す。Hereinafter, an example of the determination of the mounting state of the electronic component with bumps by the inspection method will be described. First, an example of a mounting state determined to be defective will be described with reference to FIGS. 4A and 4B, reference numeral 5a denotes a bump of the electronic component 5, and 4a denotes an electrode of the substrate 4.
【００１７】図４（ａ）は、この高低差ｈｉが許容範囲
を超える場合の不良例を示す。この例では電子部品５は
基板４に対して十分に圧着されておらず、電子部品５の
バンプ５ａは部分的に基板４の電極４ａから浮き上がっ
た状態にある（図４（ａ）において、左側から２番目の
バンプ５ａを参照）。このような不良は、高低差ｈｉが
バンプ５ａの高さのばらつきよりも大きい場合に発生す
る。FIG. 4A shows an example of a defect when the height difference hi exceeds an allowable range. In this example, the electronic component 5 is not sufficiently pressed against the substrate 4, and the bump 5 a of the electronic component 5 is partially lifted from the electrode 4 a of the substrate 4 (in FIG. 4A, the left side). From the second bump 5a). Such a defect occurs when the height difference hi is larger than the variation in the height of the bump 5a.
【００１８】図４（ｂ）は、高低差ｈｉが許容範囲未満
である場合の不良例を示す。このような例は、バンプ５
ａの高さが基準以下であるか、または上からの荷重によ
りつぶされて横方向に変形し隣接したバンプ５ａ同士が
接触しているようなときに生じる（図４（ｂ）におい
て、右側の２個のバンプ５ａを参照）。また、図４
（ｂ）に示す電子部品５の下面と基板４の上面との隙間
Ｇが小さすぎると、実装後にこの部分に注入されるアン
ダーフィル２５の注入不良の原因ともなる。なおアンダ
ーフィル２５は、基板４と電子部品５の熱膨張率の差に
より発生するせん断力によってバンプ５ａの固着面が剥
離するのを防ぐ補強のために注入される。FIG. 4B shows an example of a defect when the height difference hi is less than an allowable range. An example of this is bump 5
This occurs when the height of a is lower than a reference or when the bumps 5a are crushed by a load from above and deformed in the lateral direction so that adjacent bumps 5a are in contact with each other (in FIG. 4B, the right side of FIG. 4B). See two bumps 5a). FIG.
If the gap G between the lower surface of the electronic component 5 and the upper surface of the substrate 4 shown in (b) is too small, it may cause poor injection of the underfill 25 injected into this portion after mounting. The underfill 25 is injected for the purpose of preventing the fixed surface of the bump 5a from peeling off due to a shear force generated due to a difference in thermal expansion coefficient between the substrate 4 and the electronic component 5.
【００１９】次に、図５および図６を参照して、その他
の判定例について説明する。図５は電子部品５が基板４
上で傾いている例を示す。図５において、Ｈｂ１，Ｈｂ
２は電子部品５の上面の高さ計測値である。また基板４
は水平である。この例では一方の高低差ｈ１は許容範囲
を越えており、また他方の高低差ｈ２は許容範囲未満で
ある。従って電子部品５は基板４に対して設定値以上に
傾いており、実装状態は不良と判定される。Next, another example of the determination will be described with reference to FIGS. FIG. 5 shows that the electronic component 5 is
Here is an example of tilting up. In FIG. 5, Hb1, Hb
2 is a height measurement value of the upper surface of the electronic component 5. Substrate 4
Is horizontal. In this example, one height difference h1 is outside the allowable range, and the other height difference h2 is below the allowable range. Therefore, the electronic component 5 is inclined with respect to the substrate 4 at a set value or more, and the mounting state is determined to be defective.
【００２０】図６は、基板４がいわゆる「そり」もしく
は厚さのばらつきを有する場合の例を示す。図６におい
て、Ｈｂ１，Ｈｂ２は電子部品５の上面の高さ計測値で
ある。また基板４は「そり」のため、部分的に電子部品
５の傾斜角とほぼ等しい角度で傾斜している。この例で
は、電子部品５は水平面に対しては傾いているが、基板
４との関係でみれば、高低差ｈ１，ｈ２ともに許容範囲
内にある。従って実装状態は良好と判定される。FIG. 6 shows an example in which the substrate 4 has a so-called "warp" or a variation in thickness. In FIG. 6, Hb1 and Hb2 are height measurement values of the upper surface of the electronic component 5. Further, the substrate 4 is partially inclined at an angle substantially equal to the inclination angle of the electronic component 5 due to the “warp”. In this example, the electronic component 5 is inclined with respect to the horizontal plane, but the height differences h1 and h2 are within the allowable range in view of the relationship with the substrate 4. Therefore, the mounting state is determined to be good.
【００２１】図５及び図６の例で示すように、電子部品
５が同様に傾いていても、基板４の状態によっては良否
の判定が分かれるものであるが、本方法は電子部品５と
基板４との相対的な高低差に基づいて良否の判定を行う
ため、電子部品５が傾いている場合でも、的確な良否の
判定を行うことができる。このように電子部品５が傾い
ている場合は、従来のＸ線検査や外観検査では検査でき
なかったものである。なお図５，図６では、これらの傾
きは誇張して示されているが、実際の傾きは微少であ
り、上述の高低差ｈで数十ミクロンのオーダーの値が良
否を左右する。As shown in the examples of FIGS. 5 and 6, even if the electronic component 5 is similarly inclined, the judgment of good or bad depends on the state of the substrate 4. However, the present method uses the electronic component 5 and the substrate. Since the quality is determined based on the relative height difference between the electronic component 5 and the electronic component 5, even if the electronic component 5 is inclined, the quality can be determined accurately. When the electronic component 5 is tilted as described above, it cannot be inspected by the conventional X-ray inspection or appearance inspection. In FIGS. 5 and 6, these inclinations are exaggerated, but the actual inclination is small, and the value of the order of several tens of microns depends on the above-mentioned height difference h.
【００２２】本発明は上記実施の形態には限定されない
のであって、例えば高さ計測手段として本実施の形態で
はＰＳＤ１７を用いているが、この方法に変えて接触式
の高さ計測手段などを用いてもよい。The present invention is not limited to the above embodiment. For example, in this embodiment, the PSD 17 is used as the height measuring means. Instead of this method, a contact type height measuring means and the like are used. May be used.
【００２３】[0023]
【発明の効果】本発明によれば、バンプ付き電子部品を
実装した後の基板上において基板上面とバンプ付き電子
部品の上面との高低差を求め、この値を予め設定された
設定値と比較することにより、従来のＸ線検査や外観検
査では不可能であった検査対象をも含めて、バンプ付き
電子部品の実装状態の良否を簡単・的確に判定すること
ができる。According to the present invention, the height difference between the upper surface of the substrate and the upper surface of the electronic component with bumps is determined on the substrate after mounting the electronic component with bumps, and this value is compared with a preset value. By doing so, it is possible to easily and accurately determine whether or not the mounted state of the electronic component with bumps is included, including the inspection target that has been impossible with the conventional X-ray inspection and appearance inspection.
【図１】本発明の一実施の形態のバンプ付き電子部品の
実装状態検査装置の斜視図FIG. 1 is a perspective view of a mounting state inspection apparatus for an electronic component with bumps according to an embodiment of the present invention.
【図２】本発明の一実施の形態の基板の平面図FIG. 2 is a plan view of a substrate according to an embodiment of the present invention.
【図３】本発明の一実施の形態の基板の側断面図FIG. 3 is a side sectional view of a substrate according to an embodiment of the present invention.
【図４】（ａ）本発明の一実施の形態の基板の側断面図
（ｂ）本発明の一実施の形態の基板の側断面図4A is a side sectional view of a substrate according to an embodiment of the present invention. FIG. 4B is a side sectional view of a substrate according to an embodiment of the present invention.
【図５】本発明の一実施の形態の基板の側断面図FIG. 5 is a side sectional view of a substrate according to an embodiment of the present invention.
【図６】本発明の一実施の形態の基板の側断面図FIG. 6 is a side sectional view of a substrate according to an embodiment of the present invention.
１ 可動テーブル ４ 基板 ５ 電子部品 ５ａ バンプ １０ 高さ計測手段 １１ レーザ発生器 １４ ｆθレンズ １７ ＰＤＳ ２２ 判定部 ２４ 主制御部 Reference Signs List 1 movable table 4 board 5 electronic component 5a bump 10 height measuring means 11 laser generator 14 fθ lens 17 PDS 22 determination unit 24 main control unit
Claims (1)
いて、基板の上面の複数点の高さと、バンプ付き電子部
品の上面の複数点の高さを高さ計測手段により計測し、
この計測結果から複数位置における基板の上面とバンプ
付き電子部品の上面との高低差を求め、これらの高低差
を予め設定された設定値と比較することにより、バンプ
付き電子部品のバンプの固着状態の良否を判定すること
を特徴とするバンプ付き電子部品の実装状態検査方法。1. A height measuring means for measuring the height of a plurality of points on an upper surface of a substrate and the heights of a plurality of points on an upper surface of an electronic component with bumps on a substrate on which electronic components with bumps are mounted,
The height difference between the upper surface of the substrate and the upper surface of the electronic component with bumps at a plurality of positions is determined from the measurement results, and the height difference is compared with a preset value to determine the bonding state of the bumps of the electronic component with bumps. A method for inspecting the mounting state of an electronic component with bumps, characterized in that the quality of the electronic component is determined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9051319A JPH10253323A (en) | 1997-03-06 | 1997-03-06 | Method for inspecting mounting state of electronic parts with bump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9051319A JPH10253323A (en) | 1997-03-06 | 1997-03-06 | Method for inspecting mounting state of electronic parts with bump |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10253323A true JPH10253323A (en) | 1998-09-25 |
Family
ID=12883607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9051319A Pending JPH10253323A (en) | 1997-03-06 | 1997-03-06 | Method for inspecting mounting state of electronic parts with bump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10253323A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176292A (en) * | 2000-12-05 | 2002-06-21 | Juki Corp | Electronic part mounting device |
| JP2007071824A (en) * | 2005-09-09 | 2007-03-22 | Tokyo Electron Ltd | Method for adjusting parallelism of probe card and mounting base, inspection program storage medium, and inspection device |
| GB2468957A (en) * | 2009-03-24 | 2010-09-29 | Tbg Solutions | Testing the mounting of an electronic component on a substrate by comparing before and after reflow height measurements |
| JP2012013568A (en) * | 2010-07-01 | 2012-01-19 | Mitsubishi Electric Corp | Device and method for inspecting soldering of electronic component |
-
1997
- 1997-03-06 JP JP9051319A patent/JPH10253323A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002176292A (en) * | 2000-12-05 | 2002-06-21 | Juki Corp | Electronic part mounting device |
| JP2007071824A (en) * | 2005-09-09 | 2007-03-22 | Tokyo Electron Ltd | Method for adjusting parallelism of probe card and mounting base, inspection program storage medium, and inspection device |
| GB2468957A (en) * | 2009-03-24 | 2010-09-29 | Tbg Solutions | Testing the mounting of an electronic component on a substrate by comparing before and after reflow height measurements |
| WO2010108905A1 (en) * | 2009-03-24 | 2010-09-30 | Tbg Solutions Limited | Improvements in or relating to pcb-mounted integrated circuits |
| GB2468957B (en) * | 2009-03-24 | 2012-02-08 | Twenty Twenty Vision Ltd | Improvements in or relating to pcb-mounted integrated circuits |
| US8574932B2 (en) | 2009-03-24 | 2013-11-05 | Twenty Twenty Vision Limited | PCB-mounted integrated circuits |
| JP2012013568A (en) * | 2010-07-01 | 2012-01-19 | Mitsubishi Electric Corp | Device and method for inspecting soldering of electronic component |
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