JPH10247758A - Light emitting module for optical communication - Google Patents

Light emitting module for optical communication

Info

Publication number
JPH10247758A
JPH10247758A JP9048800A JP4880097A JPH10247758A JP H10247758 A JPH10247758 A JP H10247758A JP 9048800 A JP9048800 A JP 9048800A JP 4880097 A JP4880097 A JP 4880097A JP H10247758 A JPH10247758 A JP H10247758A
Authority
JP
Japan
Prior art keywords
driver
emitting module
light emitting
semiconductor laser
optical communication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9048800A
Other languages
Japanese (ja)
Inventor
Haruhiko Ichino
晴彦 市野
Masaki Hirose
正樹 広瀬
Sadahisa Warashina
禎久 藁科
Mikio Kyomasu
幹雄 京増
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Nippon Telegraph and Telephone Corp
Original Assignee
Hamamatsu Photonics KK
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK, Nippon Telegraph and Telephone Corp filed Critical Hamamatsu Photonics KK
Priority to JP9048800A priority Critical patent/JPH10247758A/en
Priority to US09/034,348 priority patent/US6155724A/en
Publication of JPH10247758A publication Critical patent/JPH10247758A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4271—Cooling with thermo electric cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PROBLEM TO BE SOLVED: To realize a light emitting module which is processed of a built-in LD (semiconductor laser) driver IC, and where a Peltier device is restrained from increasing in power consumption while capable of operating at an ultra- high speed on a G bit/s band. SOLUTION: An LD 1 is arranged at the rear end of a Peltier device 3, a driver composed of an LD driver IC 4 and a substrate 9 is arranged outside the Peltier device 3 located at the rear of the LD 1, and the LD 1 and the LD driver IC 4 are connected together with a bonding wire. Furthermore, the LD 1 is mounted on the Peltier device 3 through the intermediary of a U-shaped sub-mount 2, and a lens unit 20 is arranged in the recessed part of the U-shaped sub-mount 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、超高速光伝送シス
テム用の光送信器として用いられ、小型で低消費電力な
ドライバ内蔵型の光通信用発光モジュールに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized and low-power-consumption light-emitting module for optical communication which is used as an optical transmitter for an ultra-high-speed optical transmission system and has a small power consumption.

【０００２】[0002]

【従来の技術】図２は、長距離伝送に使用され、かつＧ
bit/s 以上の超高速信号を電気・光変換する従来の光通
信用発光モジュールを示す。図において、半導体レーザ
（以下「ＬＤ」という。）１は、発振波長を安定化させ
るために温度を一定にするペルチェ素子３の上に配置さ
れる。また、レンズ２１、光アイソレータ２２、スリー
ブ２４等を含むレンズユニット２０がＬＤ１の前面に配
置される。なお、光アイソレータ２２は、反射光による
ＬＤ１の擾乱を除去するために設けられる。2. Description of the Related Art FIG.
This shows a conventional light-emitting module for optical communication that converts an ultra-high-speed signal of bit / s or more into electricity and light. In the figure, a semiconductor laser (hereinafter referred to as “LD”) 1 is arranged on a Peltier element 3 that stabilizes the temperature in order to stabilize the oscillation wavelength. Further, a lens unit 20 including a lens 21, an optical isolator 22, a sleeve 24 and the like is arranged on the front surface of the LD1. The optical isolator 22 is provided to remove disturbance of the LD 1 due to reflected light.

【０００３】この構造では、光軸調整の観点からＬＤ１
がペルチェ素子３の前面に配置されている。したがっ
て、このモジュール構造では、光出力モニタ用のフォト
ダイオード（以下「ＰＤ」という）５や変調電気信号の
ＬＤ側終端抵抗（図示せず）等をサブマウント（図示せ
ず）上に配置し、さらにそれをペルチェ素子３上に搭載
することにより小型化を図っている。In this structure, from the viewpoint of optical axis adjustment, LD1
Are arranged on the front surface of the Peltier element 3. Therefore, in this module structure, a photodiode (hereinafter, referred to as “PD”) 5 for monitoring an optical output, an LD-side terminating resistor (not shown) of a modulated electric signal, and the like are arranged on a submount (not shown). Further, by mounting it on the Peltier element 3, miniaturization is achieved.

【０００４】[0004]

【発明が解決しようとする課題】ところで、小型化の観
点からは、ペルチェ素子３上の空いたスペースにＰＤ５
や終端抵抗を搭載することは有効である。しかし、ペル
チェ素子３上に終端抵抗を配置すれば、終端抵抗で発生
する熱がペルチェ素子３の熱負荷となり、ペルチェ素子
の消費電力を増大させることになる。By the way, from the viewpoint of miniaturization, the PD 5 is placed in an empty space on the Peltier element 3.
And mounting a terminating resistor is effective. However, if the terminating resistor is arranged on the Peltier element 3, the heat generated by the terminating resistor becomes a thermal load on the Peltier element 3, and the power consumption of the Peltier element increases.

【０００５】また、光送信回路全体の小型化を図り、か
つ良好な超高速変調特性を得るためには、モジュール内
にＬＤドライバＩＣも内蔵してＬＤ１の近傍に実装する
ことが必要になる。しかし、従来構造では、ＬＤドライ
バＩＣをペルチェ素子３上に配置せざるをえず、同様に
ペルチェ素子３の熱負荷となり、ペルチェ素子の消費電
力を増大させることになる。In order to reduce the size of the entire optical transmission circuit and obtain good ultrahigh-speed modulation characteristics, it is necessary to incorporate an LD driver IC in the module and mount it near the LD1. However, in the conventional structure, the LD driver IC has to be disposed on the Peltier element 3, and similarly becomes a thermal load on the Peltier element 3, thereby increasing the power consumption of the Peltier element.

【０００６】本発明は、ＬＤドライバＩＣをモジュール
内に内蔵し、かつＬＤの近傍に実装してＧbit/s 帯での
超高速動作を可能にするとともに、ペルチェ素子の消費
電力上昇を抑えることができる小型で低消費電力なドラ
イバ内蔵型の光通信用発光モジュールを提供することを
目的とする。According to the present invention, an LD driver IC is incorporated in a module and mounted near the LD to enable ultra-high-speed operation in the Gbit / s band and to suppress an increase in power consumption of a Peltier device. It is an object of the present invention to provide a small-sized and low-power-consumption light-emitting module for optical communication with a built-in driver.

【０００７】[0007]

【課題を解決するための手段】本発明の光通信用発光モ
ジュールは、ＬＤをペルチェ素子の後方端部に配置し、
ＬＤドライバＩＣと基板からなるドライバ部をＬＤの後
方のペルチェ素子の外側に配置し、ＬＤとＬＤドライバ
ＩＣを直接ワイヤボンディングし、さらにＬＤをペルチ
ェ素子上に設置するサブマウントの形を凹型にし、その
凹部にレンズユニットを配置できる形状とすることを特
徴とする。According to the light emitting module for optical communication of the present invention, the LD is arranged at the rear end of the Peltier element,
A driver unit including an LD driver IC and a substrate is arranged outside the Peltier element behind the LD, the LD and the LD driver IC are directly wire-bonded, and the submount for mounting the LD on the Peltier element is made concave, It is characterized in that it has a shape in which a lens unit can be arranged in the recess.

【０００８】ＬＤをペルチェ素子の後方端部に配置し、
ＬＤドライバＩＣと基板からなるドライバ部をペルチェ
素子の外側に配置することにより、ペルチェ素子の熱負
荷をＬＤのみとすることができる。ＬＤのサブマウント
を凹型にすることにより、レンズユニットをＬＤの近傍
に配置することができる。また、ＬＤとＬＤドライバＩ
Ｃが近接実装され、ダイレクトにワイヤボンディングさ
れることにより、超高速動作が可能となる。[0008] The LD is arranged at the rear end of the Peltier element,
By arranging the driver unit including the LD driver IC and the substrate outside the Peltier element, the thermal load of the Peltier element can be made only to the LD. By making the submount of the LD concave, the lens unit can be arranged near the LD. LD and LD driver I
Ultra-high-speed operation is possible by mounting C in close proximity and performing direct wire bonding.

【０００９】[0009]

【発明の実施の形態】図１は、本発明の光通信用発光モ
ジュールの実施形態を示す。(a) は平面図、(b) は一部
断面を含む側面図である。図において、ＬＤ１は、凹型
のサブマウント２とともにペルチェ素子３の後方端部上
に搭載される。サブマウント２の凹部には、レンズ２
１、光アイソレータ２２、レンズホルダ２３、スリーブ
２４等を一体化したレンズユニット２０がＬＤ１の前面
にくるように配置される。ＰＤ５とＬＤドライバＩＣ４
は、ＬＤ１の後方にあってヒートシンクかつ放熱フィン
である金属パッケージ１０上に直接設置される。ＬＤ１
とＬＤドライバＩＣ４は、ボンディングワイヤ１２を介
して直接接続される。その周辺には、容量や抵抗等（図
示せず）を実装した基板９が配置されている。ＰＤ５、
ＬＤドライバＩＣ４、基板９により、ドライバ部が形成
される。FIG. 1 shows an embodiment of a light emitting module for optical communication according to the present invention. (a) is a plan view, and (b) is a side view including a partial cross section. In the figure, an LD 1 is mounted on a rear end of a Peltier element 3 together with a concave submount 2. In the recess of the submount 2, the lens 2
1. A lens unit 20 in which an optical isolator 22, a lens holder 23, a sleeve 24, and the like are integrated is disposed so as to be in front of the LD1. PD5 and LD driver IC4
Is disposed directly on the metal package 10 which is a heat sink and a radiation fin behind the LD 1. LD1
And the LD driver IC 4 are directly connected via a bonding wire 12. A board 9 on which a capacitor, a resistor, and the like (not shown) are mounted is disposed around the board. PD5,
A driver unit is formed by the LD driver IC 4 and the substrate 9.

【００１０】このように、レンズ２１、光アイソレータ
２２、レンズホルダ２３、スリーブ２４等のユニット化
と、サブマウント２の凹形状化により、ＬＤ１をペルチ
ェ素子３の後方端部に配置することができる。また、そ
れによりＬＤ１はペルチェ素子３の上、ＬＤドライバＩ
Ｃ４はペルチェ素子３の外にありながら、両者を 2.5ｍ
ｍ程度以下の近接配置させることができる。また、本実
施形態では、ＬＤドライバＩＣ４とＬＤ１をダイレクト
ボンディングしているので終端抵抗を用いる必要がな
く、発熱源の１つをペルチェ素子３上から排除すること
ができる。As described above, the LD 1 can be arranged at the rear end of the Peltier element 3 by unitizing the lens 21, the optical isolator 22, the lens holder 23, the sleeve 24, and the like and forming the submount 2 into a concave shape. . In addition, the LD 1 is placed on the Peltier element 3 and the LD driver I
C4 is outside of Peltier device 3, but both are 2.5m
m or less. In the present embodiment, since the LD driver IC 4 and the LD 1 are directly bonded, it is not necessary to use a terminating resistor, and one of the heat sources can be eliminated from the Peltier device 3.

【００１１】なお、何らかの理由により、ＬＤドライバ
ＩＣ４をＬＤ１から離す必要が生じた場合でも、終端抵
抗をペルチェ素子３と分離された基板９上に配置するこ
とにより、終端抵抗で発生する熱がペルチェ素子３の熱
負荷にならないようにすることができる。また、ＬＤ１
と終端抵抗は、 2.5ｍｍ程度以下のダイレクトボンディ
ング接続することにより、超高速動作が可能になる。Even if the LD driver IC 4 needs to be separated from the LD 1 for some reason, by disposing the terminating resistor on the substrate 9 separated from the Peltier element 3, the heat generated by the terminating resistor can be reduced. The heat load of the element 3 can be prevented. LD1
Ultra-high-speed operation can be achieved by connecting the terminator and the terminating resistor by direct bonding of about 2.5 mm or less.

【００１２】[0012]

【発明の効果】以上説明したように、本発明の光通信用
発光モジュールは次の効果を有している。第１は、ＬＤ
ドライバＩＣをモジュール内に内蔵しているにも関わら
ず、ＬＤドライバＩＣや終端抵抗をペルチェ素子の外に
配置できるので、これらの発生する熱が直接ペルチェ素
子の熱負荷になることはない。また、これらの発生する
熱がＬＤへ流入することもないので、ＬＤの特性変動を
低減しかつ寿命を延ばし、またペルチェ素子の消費電力
の低減を図ることができる。As described above, the light emitting module for optical communication of the present invention has the following effects. The first is LD
Although the driver IC is built in the module, the LD driver IC and the terminating resistor can be arranged outside the Peltier element, so that the heat generated from these elements does not directly become a thermal load on the Peltier element. In addition, since the heat generated does not flow into the LD, it is possible to reduce fluctuations in the characteristics of the LD, extend the life, and reduce the power consumption of the Peltier device.

【００１３】第２は、ＬＤとＬＤドライバＩＣの距離を
2.5ｍｍ以下にすることができるので、10Ｇbit/s 程度
までの超高速特性を保証することができる。さらに、通
常ＬＤ側に設置される50Ω程度の終端抵抗を省くことが
可能となり、終端抵抗で発生する消費電力と熱を削減す
ることができる。以上により、ドライバ内蔵型の光通信
用発光モジュールの高性能化、低電力化、品質向上およ
び信頼性向上を図ることができる。Second, the distance between the LD and the LD driver IC is increased.
Since the thickness can be reduced to 2.5 mm or less, an ultra-high speed characteristic up to about 10 Gbit / s can be guaranteed. Further, it is possible to omit the terminating resistor of about 50Ω which is usually provided on the LD side, and it is possible to reduce power consumption and heat generated by the terminating resistor. As described above, it is possible to improve the performance, reduce the power, improve the quality, and improve the reliability of the light-emitting module for optical communication with a built-in driver.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の光通信用発光モジュールの実施形態を
示す図。FIG. 1 is a diagram showing an embodiment of a light emitting module for optical communication of the present invention.

【図２】従来のドライバ内蔵型の光通信用発光モジュー
ルの構造を示す図。FIG. 2 is a diagram showing a structure of a conventional light emitting module for optical communication with a built-in driver.

【符号の説明】[Explanation of symbols]

１ 半導体レーザ（ＬＤ） ２ サブマウント ３ ペルチェ素子 ４ ＬＤドライバＩＣ ５ フォトダイオード（ＰＤ） ６ サブキャリア ９ 基板 １０ 金属パッケージ １２ ボンディングワイヤ ２０ レンズユニット ２１ レンズ ２２ 光アイソレータ ２３ レンズホルダ ２４ スリーブ Reference Signs List 1 semiconductor laser (LD) 2 submount 3 Peltier device 4 LD driver IC 5 photodiode (PD) 6 subcarrier 9 substrate 10 metal package 12 bonding wire 20 lens unit 21 lens 22 optical isolator 23 lens holder 24 sleeve

フロントページの続き (72)発明者 藁科 禎久 静岡県浜松市市野町1126番地の１ 浜松ホ トニクス株式会社内 (72)発明者 京増 幹雄 静岡県浜松市市野町1126番地の１ 浜松ホ トニクス株式会社内Continuation of the front page (72) Inventor Yoshihisa Strashina 1126, Nomachi, Hamamatsu-shi, Shizuoka Prefecture Inside Hamamatsu Photonics Co., Ltd.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 ペルチェ素子上にサブマウントとともに
搭載された半導体レーザと、半導体レーザの出力光を光
ファイバに結合するレンズと光アイソレータとスリーブ
等からなるレンズユニットと、半導体レーザドライバＩ
Ｃと基板からなるドライバ部と、これらを搭載する筐体
とを備えた光通信用発光モジュールにおいて、 前記半導体レーザを光の出力方向に対してペルチェ素子
の後方端部に配置し、前記半導体レーザドライバＩＣを
その後方のペルチェ素子の外に配置し、前記サブマウン
トは前記レンズユニットが前記半導体レーザの前面に配
置されるように凹型であることを特徴とする光通信用発
光モジュール。1. A semiconductor laser mounted on a Peltier device together with a submount, a lens unit including a lens for coupling output light of the semiconductor laser to an optical fiber, an optical isolator, a sleeve, and the like;
A light emitting module for optical communication, comprising: a driver unit including a C and a substrate; and a housing for mounting the driver unit, wherein the semiconductor laser is disposed at a rear end of a Peltier element with respect to a light output direction. A light emitting module for optical communication, wherein a driver IC is disposed outside a Peltier element behind the driver IC, and the submount is concave so that the lens unit is disposed on a front surface of the semiconductor laser. 【請求項２】 請求項１に記載の光通信用発光モジュー
ルにおいて、 半導体レーザと半導体レーザドライバＩＣは、終端抵抗
を用いずワイヤボンディング等で直接接続する構成であ
ることを特徴とする光通信用発光モジュール。2. The light emitting module for optical communication according to claim 1, wherein the semiconductor laser and the semiconductor laser driver IC are directly connected by wire bonding or the like without using a terminating resistor. Light emitting module.
JP9048800A 1997-03-04 1997-03-04 Light emitting module for optical communication Pending JPH10247758A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9048800A JPH10247758A (en) 1997-03-04 1997-03-04 Light emitting module for optical communication
US09/034,348 US6155724A (en) 1997-03-04 1998-03-04 Light transmitting module for optical communication and light transmitting unit thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9048800A JPH10247758A (en) 1997-03-04 1997-03-04 Light emitting module for optical communication

Publications (1)

Publication Number Publication Date
JPH10247758A true JPH10247758A (en) 1998-09-14

Family

ID=12813306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9048800A Pending JPH10247758A (en) 1997-03-04 1997-03-04 Light emitting module for optical communication

Country Status (1)

Country Link
JP (1) JPH10247758A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237436A (en) * 2005-02-28 2006-09-07 Opnext Japan Inc Light emitting element module
JP2011204799A (en) * 2010-03-24 2011-10-13 Nippon Telegr & Teleph Corp <Ntt> Optical transmission module, optical transmitter, and wavelength selection type optical transmitter
CN114815091A (en) * 2022-04-27 2022-07-29 湖南光智通信技术有限公司 Light emitter capable of quickly radiating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237436A (en) * 2005-02-28 2006-09-07 Opnext Japan Inc Light emitting element module
JP2011204799A (en) * 2010-03-24 2011-10-13 Nippon Telegr & Teleph Corp <Ntt> Optical transmission module, optical transmitter, and wavelength selection type optical transmitter
CN114815091A (en) * 2022-04-27 2022-07-29 湖南光智通信技术有限公司 Light emitter capable of quickly radiating
CN114815091B (en) * 2022-04-27 2023-11-03 湖南光智通信技术有限公司 Light emitter capable of rapidly radiating

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