JPH10247719A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH10247719A JPH10247719A JP4926097A JP4926097A JPH10247719A JP H10247719 A JPH10247719 A JP H10247719A JP 4926097 A JP4926097 A JP 4926097A JP 4926097 A JP4926097 A JP 4926097A JP H10247719 A JPH10247719 A JP H10247719A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit board
- semiconductor device
- leads
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 69
- 239000011347 resin Substances 0.000 claims abstract description 91
- 229920005989 resin Polymers 0.000 claims abstract description 91
- 238000002347 injection Methods 0.000 claims abstract description 28
- 239000007924 injection Substances 0.000 claims abstract description 28
- 238000004382 potting Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 35
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000000243 solution Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000009351 contact transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板と当該回
路基板上に実装された各種搭載部品とを一体に樹脂モー
ルドしてなる半導体装置に係り、特に、回路基板上に実
装される半導体チップ及びチップ部品の配列に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a circuit board and various mounting parts mounted on the circuit board are integrally resin-molded, and more particularly to a semiconductor chip mounted on the circuit board. And the arrangement of chip components.
【０００２】[0002]
【従来の技術】従来より、例えば特開平４−２８２２９
９号公報等に記載されているように、回路基板と当該回
路基板上に実装された各種搭載部品の周囲を一体に樹脂
モールドしてなる非接触伝送方式の半導体装置が知られ
ている。2. Description of the Related Art Conventionally, for example, Japanese Patent Application Laid-Open No. 4-28229
As described in, for example, Japanese Unexamined Patent Application Publication No. 9-209, there is known a non-contact transmission type semiconductor device in which a circuit board and various mounting components mounted on the circuit board are integrally resin-molded.
【０００３】この種の半導体装置は、端末機の外部記憶
装置やデータ処理装置として使用されるが、回路基板及
び搭載部品が一体に樹脂モールドされており、水分や腐
食性物質の侵入を完全に防止することができるので、清
浄でない環境下で長期間使用しても回路基板及び搭載部
品が破壊されにくく、耐久性に優れる。また、回路基板
及び搭載部品が一体に樹脂モールドされていることから
剛性が高く、不正な外力が作用した場合にも変形しにく
いので、回路基板と電子部品とを接続するリードが断線
しにくく、この点からも耐久性に優れる。[0003] This type of semiconductor device is used as an external storage device or data processing device for a terminal, but the circuit board and the mounted components are integrally molded with resin to completely prevent moisture and corrosive substances from entering. Since it can be prevented, the circuit board and the mounted components are not easily broken even when used for a long time in an unclean environment, and the durability is excellent. In addition, since the circuit board and the mounted components are integrally molded with resin, the rigidity is high, and it is difficult to deform even when an improper external force is applied, so that the lead connecting the circuit board and the electronic component is not easily broken, Also from this point, it is excellent in durability.
【０００４】従来より、この種の半導体装置において
は、回路基板に対する搭載部品の配列が、小型の回路基
板に対して多数の搭載部品を効率良く実装するという技
術的思想に基づいて行われており、回路基板と電子部品
とを接続するリードの向きについては、回路基板に形成
される回路パターンの設計上の必要から求められる関係
を除いて、ほとんど考慮されていない。したがって、従
来より知られているこの種の半導体装置においては、例
えば相対向する２辺にのみリードが接続された半導体チ
ップを例にとって説明すると、リードの接続辺が樹脂モ
ールドの樹脂注入部が設けられた辺と平行に向けて配置
されたものと、垂直に向けて配置されたものとが混在し
ている。Conventionally, in this type of semiconductor device, mounting components are arranged on a circuit board based on the technical idea of efficiently mounting many mounting components on a small circuit board. Almost no consideration is given to the orientation of the leads connecting the circuit board and the electronic components, except for the relationship required from the design needs of the circuit pattern formed on the circuit board. Therefore, in a semiconductor device of this type conventionally known, for example, a semiconductor chip in which leads are connected to only two opposing sides will be described as an example. Some are arranged parallel to the set side and some are arranged vertically.
【０００５】[0005]
【発明が解決しようとする課題】ところが、半導体チッ
プのリード接続辺が、樹脂モールドの樹脂注入部が設け
られた辺に対して垂直に配置されていると、樹脂モール
ド時に、高温のモールド樹脂によってリードと回路パタ
ーンとを接続しているハンダが溶け、溶けたハンダがモ
ールド樹脂の注入圧力によってリードの配列方向に移動
するため、隣接するリード間にハンダブリッジを生じや
すく、良品を歩留良く製造することが難しいという不都
合がある。However, if the lead connection side of the semiconductor chip is arranged perpendicular to the side where the resin injection portion of the resin mold is provided, the high temperature molding resin causes Solder connecting the lead and the circuit pattern melts, and the molten solder moves in the direction of the lead arrangement due to the injection pressure of the mold resin, so solder bridges are likely to occur between adjacent leads, producing good products with good yields There is a disadvantage that it is difficult to do.
【０００６】この点について、図５を参照しつつさらに
詳細に説明すると、半導体チップ１のリード接続辺２
ａ，２ｂには多数のリード３が小さなピッチで設けられ
ており、当該リード３は、ハンダ４により、回路基板５
に形成された回路パターンの端子部６に接続されてい
る。半導体チップ１を含む所要の搭載部品が実装された
回路基板５は、金型キャビティ７内に収納され、金型キ
ャビティ７の一部に設けられたゲート８より溶融樹脂を
注入して樹脂モールドが行われるが、モールド樹脂の注
入温度は一般にハンダ４の溶融温度よりも高いので、ハ
ンダ４の溶融温度よりも高温のモールド樹脂と接触する
部分においては、ハンダ４の溶融が起こる。[0006] This point will be described in more detail with reference to FIG.
a and 2b are provided with a large number of leads 3 at a small pitch.
Is connected to the terminal portion 6 of the circuit pattern formed on the substrate. The circuit board 5 on which required mounting components including the semiconductor chip 1 are mounted is housed in a mold cavity 7, and molten resin is injected from a gate 8 provided in a part of the mold cavity 7 to form a resin mold. However, since the injection temperature of the molding resin is generally higher than the melting temperature of the solder 4, the melting of the solder 4 occurs at a portion which comes into contact with the molding resin which is higher than the melting temperature of the solder 4.
【０００７】ゲート８より金型キャビティ７内に注入さ
れたモールド樹脂は、図５に矢印Ａで表示するように、
金型キャビティ７の奥行き方向に流れるので、リード接
続辺２ａ，２ｂが樹脂注入部８に対して垂直、即ち金型
キャビティ７の奥行き方向に配置されていると、融けた
ハンダがモールド樹脂の注入圧力によってリード３の配
列方向に押し流され、隣接するリード間にハンダブリッ
ジを生じることになる。The molding resin injected into the mold cavity 7 from the gate 8 is, as shown by an arrow A in FIG.
Since the solder flows in the depth direction of the mold cavity 7, if the lead connection sides 2a and 2b are arranged perpendicular to the resin injection portion 8, that is, in the depth direction of the mold cavity 7, the molten solder is injected into the mold resin. The pressure causes the lead 3 to be swept away in the direction of arrangement, thereby causing a solder bridge between adjacent leads.
【０００８】なお、前記においては、相対向する２辺に
のみリードが接続された半導体チップを例にとって説明
したが、４辺の夫々にリードが接続される半導体チップ
についても、ゲート８に対して垂直に配置される２辺に
おいて必然的に前記の問題を生じる。また、相対向する
２辺に沿って裏面に電極が形成されたチップ部品につい
ても、電極が沿う辺をゲート８に対して垂直の方向に配
置すると、電極間にハンダブリッジが発生しやすくな
る。In the above description, a semiconductor chip in which leads are connected only to two opposing sides has been described as an example. However, a semiconductor chip in which leads are connected to each of the four sides is also provided with respect to the gate 8. The above-described problem necessarily occurs in two vertically arranged sides. Also, for a chip component having electrodes formed on the back surface along two opposing sides, if the sides along the electrodes are arranged in a direction perpendicular to the gate 8, a solder bridge is likely to be generated between the electrodes.
【０００９】したがって、半導体装置の良品を歩留良く
製造するためには、このハンダブリッジを有効に防止可
能な技術の開発が不可欠である。Therefore, in order to manufacture a good semiconductor device with good yield, it is essential to develop a technique capable of effectively preventing the solder bridge.
【００１０】本発明は、かかる課題を解決するためにな
されたものであって、その目的は、樹脂モールド時に半
導体チップのリード間等に短絡を生じにくく、良品を歩
留良く製造可能な構造の半導体装置を提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor device having a structure which can prevent a short circuit from occurring between leads of a semiconductor chip at the time of resin molding and can produce a good product with a good yield. It is to provide a semiconductor device.
【００１１】[0011]
【課題を解決するための手段】本発明は、前記課題を解
決するため、第１に、回路基板と当該回路基板上に実装
された各種搭載部品とを一体に樹脂モールドしてなる半
導体装置において、前記回路基板に実装される搭載部品
のうち、相対向する２辺にのみリードが接続された半導
体チップについて、当該リードの接続辺を前記樹脂モー
ルドの樹脂注入部が設けられた辺と平行に向けて配置す
るという構成にした。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention firstly provides a semiconductor device in which a circuit board and various mounting parts mounted on the circuit board are integrally resin-molded. Of the mounted components mounted on the circuit board, for a semiconductor chip having leads connected only to two opposing sides, the connection side of the leads is set in parallel with the side on which the resin injection portion of the resin mold is provided. It was configured to be oriented toward.
【００１２】このようにすると、仮にモールド樹脂によ
って半導体チップのリードと回路基板の端子部とを接続
するハンダが溶けたとしても、モールド樹脂の流れ方向
とリードの配列方向とが直交するので、モールド樹脂の
流れによって溶融ハンダがリードの配列方向に押し流さ
れにくくなり、隣接するリード間におけるハンダブリッ
ジの発生が防止される。In this case, even if the solder for connecting the leads of the semiconductor chip and the terminals of the circuit board is melted by the mold resin, the flow direction of the mold resin is orthogonal to the arrangement direction of the leads. The flow of the resin makes it difficult for the molten solder to be swept away in the arrangement direction of the leads, thereby preventing the occurrence of a solder bridge between adjacent leads.
【００１３】第２に、前記と同種の半導体装置におい
て、前記回路基板に実装される搭載部品のうち、４辺の
夫々にリードが接続された半導体チップについて、一組
の相対向する２辺については、リードをポッティング樹
脂で封止することなく、前記樹脂モールドの樹脂注入部
が設けられた辺と平行に向けて配置し、他の相対向する
２辺については、リードをポッティング樹脂で封止した
上で、前記樹脂モールドの樹脂注入部が設けられた辺と
垂直に向けて配置するという構成にした。Secondly, in a semiconductor device of the same kind as the above, of a semiconductor chip having leads connected to each of four sides of a mounting component mounted on the circuit board, a set of two opposing sides is formed. Are arranged parallel to the side where the resin injection portion of the resin mold is provided without sealing the lead with the potting resin, and the lead is sealed with the potting resin for the other two opposite sides. Then, the resin mold is disposed so as to be perpendicular to the side where the resin injection portion is provided.
【００１４】このようにすると、樹脂モールドの樹脂注
入部が設けられた辺と平行に向けて配置された２辺につ
いては、前記と同様の作用のもとに隣接するリード間に
おけるハンダブリッジの発生が防止される。また、当該
２辺と直角をなす他の２辺については、リードをポッテ
ィング樹脂で封止するので、樹脂モールド時におけるハ
ンダの溶融と流れ出しが防止され、隣接するリード間に
おけるハンダブリッジの発生が防止される。With this arrangement, the two sides of the resin mold, which are arranged in parallel with the side where the resin injection portion is provided, have the same effect as described above, and the formation of the solder bridge between the adjacent leads is performed. Is prevented. In addition, the other two sides that are perpendicular to the two sides are sealed with the potting resin, so that the solder is prevented from melting and flowing out during resin molding, and the occurrence of a solder bridge between adjacent leads is prevented. Is done.
【００１５】第３に、前記と同種の半導体装置におい
て、前記回路基板に実装される搭載部品のうち、相対向
する２辺に沿って電極が形成されたチップ部品につい
て、当該電極が沿う辺を前記樹脂モールドの樹脂注入部
が設けられた辺と垂直に向けて配置するという構成にし
た。Third, in a semiconductor device of the same type as the above, of the chip components having electrodes formed along two opposing sides among the mounted components mounted on the circuit board, the side along which the electrodes are arranged is defined as follows. The resin mold is arranged so as to be perpendicular to the side where the resin injection portion is provided.
【００１６】このようにすると、仮にモールド樹脂によ
ってチップ部品の電極と回路基板の端子部とを接続する
ハンダが溶けたとしても、モールド樹脂の流れ方向と電
極の配列方向とが直交するので、モールド樹脂の流れに
よって溶融ハンダが電極の配列方向に押し流されにくく
なり、相対向する電極間におけるハンダブリッジの発生
が防止される。In this case, even if the solder connecting the electrodes of the chip component and the terminals of the circuit board is melted by the mold resin, the flow direction of the mold resin is orthogonal to the arrangement direction of the electrodes. The flow of the resin makes it difficult for the molten solder to be washed away in the direction in which the electrodes are arranged, thereby preventing the occurrence of a solder bridge between opposing electrodes.
【００１７】[0017]
【発明の実施の形態】本発明に係る半導体装置の第１例
を、図１〜図３に基づいて説明する。図１は第１実施形
態例に係る半導体装置の透視図、図２はチップ部品の背
面図、図３は第１実施形態例に係る半導体装置の効果を
示す平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A first example of a semiconductor device according to the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the semiconductor device according to the first embodiment, FIG. 2 is a rear view of the chip component, and FIG. 3 is a plan view showing the effect of the semiconductor device according to the first embodiment.
【００１８】図１に示すように、本例の半導体装置は、
回路基板１１と、当該回路基板１１にパターン形成され
た３個の平面コイル１２ａ〜１２ｃと、前記回路基板１
１上に実装された２個の半導体チップ１３ａ，１３ｂ
と、同じく前記回路基板１１上に実装された５個のチッ
プ部品１４ａ〜１４ｅと、これら回路基板１１及び各種
搭載部品を一体にモールドする樹脂モールド１５とから
構成されている。As shown in FIG. 1, the semiconductor device of the present embodiment has
A circuit board 11, three planar coils 12a to 12c patterned on the circuit board 11, and the circuit board 1;
Two semiconductor chips 13a and 13b mounted on one
And five chip components 14a to 14e similarly mounted on the circuit board 11, and a resin mold 15 for integrally molding the circuit board 11 and various mounted components.
【００１９】半導体チップ１３ａ，１３ｂは、いずれ
も、相対向する２辺に外向きに延びる多数のリード１６
が接続されたものであって、図１及び図３に示すよう
に、当該リード１６の接続辺を、樹脂モールド１５の樹
脂注入部１５ａが設けられた辺、即ち樹脂モールド時に
金型キャビティに設けられたゲートの痕跡（本明細書に
おいては、これを「樹脂注入部」という。）が残る辺と
平行に向けて配置されている。金型キャビティに設けら
れたゲートは、樹脂モールド後に切断され、樹脂モール
ド１５の樹脂注入部１５ａとなる。前記リード１６の先
端は、ハンダ１７により、回路基板１１に形成された回
路パターンの電極部１８に接続される。Each of the semiconductor chips 13a and 13b has a large number of leads 16 extending outward on two opposite sides.
As shown in FIGS. 1 and 3, the connection side of the lead 16 is provided in the side of the resin mold 15 where the resin injection portion 15a is provided, that is, in the mold cavity at the time of resin molding. The trace of the gate (in the present specification, this is referred to as a “resin injection portion”) is arranged parallel to the remaining side. The gate provided in the mold cavity is cut after the resin molding, and becomes the resin injection portion 15a of the resin mold 15. The tip of the lead 16 is connected by a solder 17 to an electrode portion 18 of a circuit pattern formed on the circuit board 11.
【００２０】また、チップ部品１４ａ〜１４ｅは、いず
れも図２に示すように、相対向する２辺に沿ってその裏
面に電極１９が形成されたものであって、図１及び図３
に示すように、当該電極１９が沿う辺を樹脂モールド１
５の樹脂注入部１５ａが設けられた辺と垂直に向けて配
置されている。当該電極１９と回路基板１１に形成され
た回路パターンともハンダ付けにより回路基板１１に形
成された回路パターンに接続される。As shown in FIG. 2, each of the chip parts 14a to 14e has an electrode 19 formed on the back surface thereof along two opposing sides.
As shown in FIG.
5 are arranged perpendicular to the side where the resin injection portion 15a is provided. The electrodes 19 and the circuit pattern formed on the circuit board 11 are also connected to the circuit pattern formed on the circuit board 11 by soldering.
【００２１】前記脂モールド１５は、所要の搭載部品が
実装された回路基板１１を金型キャビティ７に収納し、
金型キャビティの一部に設けられたゲートより溶融樹脂
を注入した後、固化した製品を金型キャビティより取り
出し、ゲート部分を切断することによって形成される。
ゲートより注入された溶融樹脂は、図３に矢印Ｂで表示
するように、金型キャビティの奥行き方向に流れ、ハン
ダ１７の溶融温度よりも高温の溶融樹脂と接触する部分
においては、ハンダ１７の溶融が起こる。The resin mold 15 accommodates the circuit board 11 on which required mounting components are mounted in the mold cavity 7,
After the molten resin is injected from a gate provided in a part of the mold cavity, the solidified product is taken out from the mold cavity and the gate portion is cut to form the product.
As indicated by an arrow B in FIG. 3, the molten resin injected from the gate flows in the depth direction of the mold cavity, and a portion of the molten resin that is higher than the melting temperature of the solder 17 is in contact with the molten resin. Melting occurs.
【００２２】しかし、前記実施例に係る半導体装置は、
半導体チップ１３ａ，１３ｂのリード接続辺を樹脂モー
ルド１５の樹脂注入部１５ａが設けられた辺と平行に向
けて配置したので、溶融樹脂の流れ方向とリード１６の
配列方向とが直角に近い角度で食い違うことになり、仮
にハンダ１７が溶融樹脂によって溶けたとしても、溶融
ハンダはリード１６の配列方向には流されにくく、リー
ド１６の軸線方向に主に流される。よって、隣接するリ
ード間におけるハンダブリッジの発生が防止され、良品
を高歩留で作製できる。However, the semiconductor device according to the above embodiment is
Since the lead connection sides of the semiconductor chips 13a and 13b are arranged parallel to the side where the resin injection portion 15a of the resin mold 15 is provided, the flow direction of the molten resin and the arrangement direction of the leads 16 are at an angle close to a right angle. Even if the solder 17 is melted by the molten resin, the molten solder is less likely to flow in the direction in which the leads 16 are arranged, but flows mainly in the axial direction of the leads 16. Therefore, occurrence of a solder bridge between adjacent leads is prevented, and a good product can be manufactured with a high yield.
【００２３】また、チップ部品１４ａ〜１４ｅについて
も同様であり、電極１９が沿う辺を樹脂モールド１５の
樹脂注入部１５ａが設けられた辺と垂直に向けて配置し
たので、溶融樹脂の流れ方向と電極１９の配列方向とが
直角に近い角度で食い違うことになり、仮に電極１９と
回路パターンとを接続するハンダが溶けたとしても、溶
融ハンダは電極１９の配列方向には流されにくく、電極
１９の軸線方向に主に流されるので、電極間におけるハ
ンダブリッジの発生が防止され、良品を高歩留で作製で
きる。The same applies to the chip components 14a to 14e. Since the side along which the electrode 19 extends is arranged perpendicular to the side of the resin mold 15 where the resin injection portion 15a is provided, the flow direction of the molten resin is The direction in which the electrodes 19 are arranged differs from each other at an angle close to a right angle. Even if the solder connecting the electrodes 19 and the circuit pattern is melted, the molten solder is hard to flow in the direction in which the electrodes 19 are arranged. Therefore, the occurrence of a solder bridge between the electrodes is prevented, and a good product can be manufactured at a high yield.
【００２４】次に、本発明に係る半導体装置の第２例
を、図４に基づいて説明する。図４は第２実施形態例に
係る半導体装置の透視図である。Next, a second example of the semiconductor device according to the present invention will be described with reference to FIG. FIG. 4 is a perspective view of a semiconductor device according to the second embodiment.
【００２５】図４に示すように、本例の半導体装置に
は、相対向する２辺にのみリード１６が接続された半導
体チップ１３と、４辺の夫々にリード１６が接続された
半導体チップ２０とが実装されている。その他の部分に
ついては、前出の図１と同じであるので、対応する部分
に同一の符号を付して説明を省略する。As shown in FIG. 4, the semiconductor device of this embodiment has a semiconductor chip 13 having leads 16 connected to only two opposing sides and a semiconductor chip 20 having leads 16 connected to each of four sides. And have been implemented. Other parts are the same as those in FIG. 1 described above, and corresponding parts are denoted by the same reference numerals and description thereof will be omitted.
【００２６】相対向する２辺にのみリード１６が接続さ
れた半導体チップ１３は、第１実施形態例に係る半導体
装置と同様に、リード１６の接続辺が樹脂モールド１５
の樹脂注入部１５ａが設けられた辺と平行に向けて配置
される。一方、４辺の夫々にリード１６が接続された半
導体チップ２０は、一組の相対向する２辺が、リードを
ポッティング樹脂で封止することなく、樹脂モールド１
５の樹脂注入部１５ａが設けられた辺と平行に向けて配
置され、他の相対向する２辺が、リードをポッティング
樹脂２１で封止した上で、樹脂モールド１５の樹脂注入
部１５ａが設けられた辺と垂直に向けて配置される。In the semiconductor chip 13 in which the leads 16 are connected to only two opposing sides, the connection sides of the leads 16 are made of the resin mold 15 similarly to the semiconductor device according to the first embodiment.
Are arranged in parallel with the side where the resin injection portion 15a is provided. On the other hand, in the semiconductor chip 20 in which the leads 16 are connected to each of the four sides, the pair of opposed two sides has the resin mold 1 without sealing the leads with potting resin.
5 is disposed parallel to the side where the resin injection portion 15a is provided, and the other two opposite sides are provided with the resin injection portion 15a of the resin mold 15 after sealing the lead with the potting resin 21. Placed perpendicular to the side that was set.
【００２７】相対向する２辺にのみリード１６が接続さ
れた半導体チップ１３については、第１実施形態例の半
導体装置と同様の理由によってハンダブリッジの発生が
防止される。また、４辺の夫々にリード１６が接続され
た半導体チップ２０のうち、樹脂注入部１５ａが設けら
れた辺と平行に向けて配置されたリード接続辺について
は、第１実施形態例の半導体装置と同様の理由によって
ハンダブリッジの発生が防止される。一方、４辺の夫々
にリード１６が接続された半導体チップ２０のうち、樹
脂注入部１５ａが設けられた辺と垂直に向けて配置され
たリード接続辺については、リード１６をポッティング
樹脂２１で封止するので、樹脂モールド時におけるハン
ダの溶融と流れ出しが防止され、隣接するリード間にお
けるハンダブリッジの発生が防止される。この場合、ポ
ッティング樹脂２１を施すリード接続辺を、樹脂注入部
１５ａが設けられた辺と垂直に向けて配置されるリード
接続辺に限定することができるので、半導体装置の製造
を容易化でき、製造コストの低減が図れる。In the semiconductor chip 13 in which the leads 16 are connected to only two opposing sides, the occurrence of a solder bridge is prevented for the same reason as in the semiconductor device of the first embodiment. Further, of the semiconductor chip 20 in which the leads 16 are connected to each of the four sides, the lead connection side arranged parallel to the side on which the resin injection portion 15a is provided is the semiconductor device of the first embodiment. For the same reason as above, the occurrence of a solder bridge is prevented. On the other hand, of the semiconductor chip 20 in which the leads 16 are connected to each of the four sides, the leads 16 are sealed with the potting resin 21 on the lead connection sides that are arranged vertically to the side where the resin injection portion 15a is provided. This prevents the solder from melting and flowing out during resin molding, and prevents the occurrence of a solder bridge between adjacent leads. In this case, the lead connection side on which the potting resin 21 is applied can be limited to the lead connection side arranged vertically to the side where the resin injection portion 15a is provided, so that the manufacture of the semiconductor device can be simplified, Manufacturing cost can be reduced.
【００２８】なお、本発明は、回路基板に実装される半
導体チップ及びチップ部品の配列に関するものであっ
て、回路基板の形状や実装される搭載部品の種類並びに
数量等については、前記実施形態例に明示されたものに
限定されるものではない。例えば、前記各実施形態例に
おいては、回路基板上に平面コイルがパターン形成され
た非接触伝送方式の半導体装置を例にとって説明した
が、回路基板の端辺に樹脂モールドされた多チャンネル
磁気結合式コネクタを備えた半導体装置にも応用でき
る。また、前記各実施形態例においては、カード状の半
導体装置を図面に例示したが、コイン状など他の形状の
半導体装置にも応用できることは勿論である。The present invention relates to the arrangement of semiconductor chips and chip components mounted on a circuit board. The shape of the circuit board, the type and the number of mounted components, etc. However, the present invention is not limited to those specified in the above. For example, in each of the above embodiments, a non-contact transmission type semiconductor device in which a planar coil is patterned on a circuit board has been described as an example. It can be applied to a semiconductor device having a connector. In each of the above embodiments, a card-shaped semiconductor device is illustrated in the drawings, but it is needless to say that the present invention can be applied to a semiconductor device having another shape such as a coin shape.
【００２９】[0029]
【発明の効果】以上説明したように、本発明によると、
樹脂モールド時において半導体チップのリード間に発生
するハンダブリッジ、あるいはチップ部品の電極間に発
生するハンダブリッジが防止されるので、良品を歩留良
く製造することができ、半導体装置の製造コストを低減
できると共に、半導体装置の信頼性を高めることができ
る。また、４辺の夫々にリードが接続された半導体チッ
プについては、相対向に配置された一組のリードについ
てのみポッティング樹脂による封止を行えば良いので、
この点からも半導体装置の製造コストを低減できる。As described above, according to the present invention,
Solder bridges that occur between the leads of the semiconductor chip or between the electrodes of the chip components during resin molding are prevented, so non-defective products can be manufactured with good yield and semiconductor device manufacturing costs are reduced. And the reliability of the semiconductor device can be improved. In addition, for a semiconductor chip having leads connected to each of the four sides, only one set of leads arranged opposite to each other needs to be sealed with a potting resin.
From this point as well, the manufacturing cost of the semiconductor device can be reduced.
【図１】第１実施形態例に係る半導体装置の透視図であ
る。FIG. 1 is a perspective view of a semiconductor device according to a first embodiment.
【図２】チップ部品の背面図である。FIG. 2 is a rear view of the chip component.
【図３】第１実施形態例に係る半導体装置の効果を示す
平面図である。FIG. 3 is a plan view illustrating an effect of the semiconductor device according to the first embodiment.
【図４】第２実施形態例に係る半導体装置の透視図であ
る。FIG. 4 is a perspective view of a semiconductor device according to a second embodiment.
【図５】従来技術の不都合を示す平面図である。FIG. 5 is a plan view showing a disadvantage of the related art.
１１ 回路基板 １２ａ〜１２ｃ 平面コイル １３ａ，１３ｂ 半導体チップ １４ａ〜１４ｅ チップ部品 １５ 樹脂モールド １５ａ 樹脂注入部 １６ リード １７ ハンダ １８ 回路パターンの電極部 １９ チップ部品の電極 DESCRIPTION OF SYMBOLS 11 Circuit board 12a-12c Planar coil 13a, 13b Semiconductor chip 14a-14e Chip part 15 Resin mold 15a Resin injection part 16 Lead 17 Solder 18 Electrode part of circuit pattern 19 Electrode of chip part
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大道 和彦 大阪府茨木市丑寅一丁目１番88号 日立マ クセル株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuhiko Omichi 1-88 Ushitora, Ibaraki-shi, Osaka Inside Hitachi Maxell Co., Ltd.
Claims (3)
各種搭載部品とを一体に樹脂モールドしてなる半導体装
置において、前記回路基板に実装される搭載部品のう
ち、相対向する２辺にのみリードが接続された半導体チ
ップについて、当該リードの接続辺を前記樹脂モールド
の樹脂注入部が設けられた辺と平行に向けて配置したこ
とを特徴とする半導体装置。In a semiconductor device in which a circuit board and various mounting parts mounted on the circuit board are integrally molded with a resin, two opposite sides of the mounting parts mounted on the circuit board are provided. A semiconductor device comprising: a semiconductor chip to which only leads are connected, wherein the connection sides of the leads are arranged so as to be parallel to the sides of the resin mold where the resin injection portion is provided.
各種搭載部品とを一体に樹脂モールドしてなる半導体装
置において、前記回路基板に実装される搭載部品のう
ち、４辺の夫々にリードが接続された半導体チップにつ
いて、一組の相対向する２辺については、リードをポッ
ティング樹脂で封止することなく、前記樹脂モールドの
樹脂注入部が設けられた辺と平行に向けて配置し、他の
相対向する２辺については、リードをポッティング樹脂
で封止した上で、前記樹脂モールドの樹脂注入部が設け
られた辺と垂直に向けて配置したことを特徴とする半導
体装置。2. A semiconductor device in which a circuit board and various mounting parts mounted on the circuit board are integrally resin-molded, wherein a lead is mounted on each of four sides of the mounting parts mounted on the circuit board. With respect to the semiconductor chip to which is connected, a pair of opposing two sides are arranged parallel to the side where the resin injection portion of the resin mold is provided without sealing the lead with a potting resin, A semiconductor device characterized in that the other two opposite sides are sealed with a lead potting resin and then arranged vertically to the side where the resin injection portion of the resin mold is provided.
各種搭載部品とを一体に樹脂モールドしてなる半導体装
置において、前記回路基板に実装される搭載部品のう
ち、相対向する２辺に沿って裏面に電極が形成されたチ
ップ部品について、当該電極が沿う辺を前記樹脂モール
ドの樹脂注入部が設けられた辺と垂直に向けて配置した
ことを特徴とする半導体装置。3. A semiconductor device in which a circuit board and various mounting components mounted on the circuit board are integrally resin-molded, wherein two opposing sides of the mounting components mounted on the circuit board are provided. A semiconductor device comprising: a chip component having an electrode formed on a back surface thereof, wherein a side along which the electrode is arranged is oriented perpendicular to a side of the resin mold where a resin injection portion is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926097A JPH10247719A (en) | 1997-03-04 | 1997-03-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4926097A JPH10247719A (en) | 1997-03-04 | 1997-03-04 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10247719A true JPH10247719A (en) | 1998-09-14 |
Family
ID=12825867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4926097A Pending JPH10247719A (en) | 1997-03-04 | 1997-03-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10247719A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012023390A (en) * | 2011-09-22 | 2012-02-02 | Renesas Electronics Corp | Electronic device |
-
1997
- 1997-03-04 JP JP4926097A patent/JPH10247719A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012023390A (en) * | 2011-09-22 | 2012-02-02 | Renesas Electronics Corp | Electronic device |
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