JPH10216554A - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPH10216554A JPH10216554A JP9028733A JP2873397A JPH10216554A JP H10216554 A JPH10216554 A JP H10216554A JP 9028733 A JP9028733 A JP 9028733A JP 2873397 A JP2873397 A JP 2873397A JP H10216554 A JPH10216554 A JP H10216554A
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- water
- polishing
- regenerated
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Separation Of Solids By Using Liquids Or Pneumatic Power (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、研磨方法に関す
る。[0001] The present invention relates to a polishing method.
【０００２】[0002]
【従来技術】従来、工場の研磨工程、洗浄工程等におけ
るスラリ等の固形沈殿物は、産業廃棄物として工場外に
排出して処理をしていた。また、スラリが混入した排水
の処理については、例えば、“公害防止の技術と法規
水質編”（社団法人産業環境管理協会、１９９５）の１
２３頁から２７６頁に記載される「２．汚水等処理技術
一般」、「３．水質関係有害物質処理技術」に述べてあ
る。2. Description of the Related Art Conventionally, solid precipitates such as slurries in a polishing step, a cleaning step, etc. of a factory have been discharged as industrial waste outside the factory for treatment. For the treatment of wastewater mixed with slurry, for example, see “Pollution Prevention Technology and Regulations”.
Water quality edition ”(Industrial Environmental Management Association, 1995)
It is described in “2. Wastewater treatment technology in general” and “3. Water quality-related toxic substance treatment technology” described on pages 23 to 276.
【０００３】上記に記載されている排水処理技術に関し
てまとめると、一般的な排水処理では、有機系排水と無
機系排水とを分けて処理を行う。有機系排水では、有機
物を分解処理するため、活性汚泥処理が一般的である
が、この方式は有機物の分解物から発生する汚泥が多量
にでるため、汚泥の処理も行なう必要が生じる。また、
無機系排水特に重金属を含有している排水については、
排水の水素イオン濃度（ＰＨ値）をアルカリ性にして重
金属を水酸化物として分離し処理するものであり、これ
も水酸化物となった重金属類の処理が必要となる。この
ため、どちらも固形の沈殿物は凝集沈殿処理により行っ
ている。これらの固形沈殿物の処理は、重力を用いてい
るので非常に大きな分離面積が必要であった。また、圧
力を用いた濾過では、一般に全量を濾過する方式とな
り、沈殿物による閉塞が早く、目づまり等によりメンテ
ナンス頻度が多くなり、実用的ではなかった。To summarize the wastewater treatment techniques described above, in general wastewater treatment, organic wastewater and inorganic wastewater are treated separately. In organic wastewater, activated sludge treatment is generally performed to decompose organic substances. However, in this method, a large amount of sludge generated from decomposed products of organic substances is generated, so that it is necessary to treat sludge. Also,
For inorganic wastewater, especially wastewater containing heavy metals,
The method is to separate and treat heavy metals as hydroxides by making the hydrogen ion concentration (PH value) of the wastewater alkaline, and this also requires treatment of heavy metals that have become hydroxides. For this reason, solid precipitates are formed by coagulation sedimentation. Processing of these solid precipitates required a very large separation area due to the use of gravity. In addition, filtration using pressure generally employs a method of filtering the entire amount, which is not practical because the clogging by sediment is fast, maintenance frequency is increased due to clogging and the like.
【０００４】このように、廃棄物として排出するにも何
らかの処理を行う必要があり、処理コストが高価とな
る。また、平坦化加工用研磨装置に使用するスラリはそ
の購入費が高価であるため、合わせて研磨加工コストが
より高価となっている。As described above, some processing must be performed to discharge the waste, and the processing cost is high. In addition, since the slurry used for the polishing apparatus for flattening is expensive to purchase, the polishing cost is also higher.
【０００５】[0005]
【発明が解決しようとする課題】以上のことから、平坦
化加工用研磨装置等から排出される使用済みのスラリ等
は、廃棄物として排出され、その処理コスト及び購入費
が高価であり、再利用できる処理方法が望まれていた。As described above, the used slurry and the like discharged from the polishing apparatus for flattening processing are discharged as waste, and the disposal cost and purchase cost are high. Available processing methods were desired.
【０００６】上記従来技術の問題点を解決するため、本
発明は、使用済みスラリ等が混入した排出水を回収し、
排出水から任意の粒径の研磨粒子と水のみを各々分離・
再生し、循環使用する研磨方法及び装置を提供すること
を第１の目的とした。[0006] In order to solve the above-mentioned problems of the prior art, the present invention recovers discharged water mixed with used slurry and the like,
Separation of only abrasive particles of arbitrary size and water from the discharged water
It is a first object to provide a polishing method and apparatus for regenerating and recycling.
【０００７】また、排出水から任意の粒径の研磨粒子と
水のみを各々分離・再生し、循環使用することで被処理
品の平坦化を向上させる平坦化加工用研磨装置を提供す
ることを第２の目的とした。Another object of the present invention is to provide a polishing apparatus for flattening, which separates and regenerates only abrasive particles and water having an arbitrary particle size from the discharged water and recycles the same to improve the flattening of the workpiece. This was the second purpose.
【０００８】[0008]
【課題を解決するための手段】上記本発明第１の目的を
達成するため、任意の粒径の粒子が透過できる分離膜を
用い、スラリ含有廃水を該分離膜の表面と平行に流し、
膜の目詰まりや閉塞を起こさないようにしたクロスフロ
ー濾過方式により、分離、再生を行う。クロスフロー濾
過方式とは、膜表面に付着するスラリを該廃水の流れが
起こす乱流によって剥離されるため、膜表面の閉塞が少
なく安定した処理水量が得られ、また任意の粒径の粒子
のみを再生回収できる。再生回収したスラリは、本濾過
器内を循環しながら再利用時の使用組成に合わせて濃縮
率を調整した後、スラリ供給部に戻し循環使用する。Means for Solving the Problems In order to achieve the first object of the present invention, a separation membrane through which particles having an arbitrary particle size can pass is used, and slurry-containing wastewater is caused to flow in parallel with the surface of the separation membrane.
Separation and regeneration are performed by a cross-flow filtration method that prevents clogging and blockage of the membrane. With the cross-flow filtration method, the slurry adhering to the membrane surface is separated by the turbulent flow caused by the flow of the wastewater, so that the membrane surface is less blocked and a stable amount of treated water can be obtained. Can be recycled and collected. The recovered and recovered slurry is circulated in the present filter, and after adjusting the concentration ratio in accordance with the composition used at the time of reuse, is returned to the slurry supply unit and is recycled.
【０００９】また、任意の粒径の粒子のみを回収再生す
ることで、研磨材の粒子の形状が新品のスラリと同等以
上の品質に精製することができ、これにより被処理品の
平坦化を向上することにより、第２の目的を達成する。[0009] Further, by collecting and regenerating only particles having an arbitrary particle size, the shape of the abrasive particles can be refined to a quality equal to or higher than that of a new slurry, thereby flattening the article to be treated. The improvement achieves the second object.
【００１０】[0010]
【発明の実施の形態】図１は本発明の一実施例である基
板の平坦化加工用の研磨工程の説明図である。被処理品
を研磨や洗浄等の表面処理を行なう複数の研磨装置１〜
３から排出されるスラリ含有廃水４は廃水回収槽５に回
収され、次に、スラリ再生装置６に移送される。スラリ
再生装置６でスラリと水に分離・再生され、各々別々に
スラリ供給部７に供給され、規定のスラリ組成に調整さ
れた後、研磨用スラリ８として循環再利用される。FIG. 1 is an explanatory view of a polishing step for flattening a substrate according to an embodiment of the present invention. A plurality of polishing apparatuses 1 to perform a surface treatment such as polishing and cleaning of a workpiece.
Slurry-containing wastewater 4 discharged from 3 is collected in a wastewater recovery tank 5 and then transferred to a slurry regeneration device 6. Slurry and water are separated and regenerated by the slurry regenerating device 6, supplied separately to the slurry supply unit 7, adjusted to a specified slurry composition, and then circulated and reused as the polishing slurry 8.
【００１１】次に、スラリ再生装置６におけるスラリ再
生（精製）方法について説明する。研磨装置１〜３から
排出されたスラリ含有廃水４は、廃水回収槽５に回収後
スラリ再生装置６に移送され１段目の処理塔6-1に流入
される。この１段目の処理塔6-1は、研磨装置１〜３で
使用されるスラリ８中の研磨材９等よりも大きな粒子
（不純物）を除去するため、研磨材９の最大粒径より小
さな粒子のみを透過する濾過膜により構成されたクロス
フロー方式の濾過塔である。研磨材９より大きな粒子を
含有した廃水4-1は１段目処理塔6-1の膜内を循環濃縮さ
れ、所定の濃度以上となった時点で一般廃水処理設備２
１に排出される。また、研磨材９の最大粒径より小さい
粒子を含有する処理水4-2は１段目処理塔6-1の膜外に排
出され２段目処理塔6-2に移送される。２段目処理塔6-2
は、研磨材９の最小粒径より小さな粒子のみを透過する
濾過膜により構成されたクロスフロー方式の濾過塔で研
磨材９等が破損して小さくなった粒子や重金属イオン等
の不純物等を除去するようになっている。研磨材９の最
小粒径より大きな粒子は処理塔6-2の膜内を循環濃縮
し、所定の濃度以上となった時点で処理水１０として研
磨装置１〜３のスラリ供給部７に戻され、規定のスラリ
組成に調整され研磨用スラリ８として再利用される。研
磨材９の最小粒径より小さい粒子を含有した廃水4-3は
処理塔6-2の膜外に排出し、再生水製造装置２０に移送
され、逆浸透20-1、イオン交換20-2、酸化分解処理20-3
を行い、重金属イオン、溶解性有機物等を除去した超純
水並の水質の水11に再生され研磨装置１〜３のスラリ供
給部７に戻され、規定のスラリ組成に調整された後、研
磨用スラリ８として再利用される。また、水質のレベル
が12、13、14により他の半導体製造装置等の冷却水や部品
等の洗浄にも使用する。Next, a method of regenerating (purifying) the slurry in the slurry regenerating apparatus 6 will be described. The slurry-containing wastewater 4 discharged from the polishing apparatuses 1 to 3 is collected in a wastewater recovery tank 5 and then transferred to a slurry regeneration apparatus 6 to flow into a first-stage processing tower 6-1. The first-stage processing tower 6-1 removes particles (impurities) larger than the abrasive 9 in the slurry 8 used in the polishing apparatuses 1 to 3, and is therefore smaller than the maximum particle diameter of the abrasive 9. This is a cross-flow type filtration tower constituted by a filtration membrane that allows only particles to pass through. The wastewater 4-1 containing particles larger than the abrasive 9 is circulated and concentrated in the membrane of the first-stage treatment tower 6-1.
It is discharged to 1. Further, the treated water 4-2 containing particles smaller than the maximum particle size of the abrasive 9 is discharged out of the film of the first-stage treatment tower 6-1 and transferred to the second-stage treatment tower 6-2. Second stage treatment tower 6-2
Is a cross-flow type filtration tower composed of a filtration membrane that allows only particles smaller than the minimum particle size of the abrasive 9 to remove the particles such as the abrasive 9 and the like, which are damaged and reduced, and impurities such as heavy metal ions. It is supposed to. Particles larger than the minimum particle size of the abrasive 9 are circulated and concentrated in the membrane of the processing tower 6-2, and when the concentration becomes equal to or higher than a predetermined concentration, returned to the slurry supply unit 7 of the polishing apparatuses 1 to 3 as treated water 10. The slurry is adjusted to a specified slurry composition and reused as the polishing slurry 8. Wastewater 4-3 containing particles smaller than the minimum particle size of the abrasive 9 is discharged out of the membrane of the treatment tower 6-2, transferred to the reclaimed water production apparatus 20, and subjected to reverse osmosis 20-1, ion exchange 20-2, Oxidative decomposition treatment 20-3
Is carried out, and is regenerated into water 11 of the same quality as ultrapure water from which heavy metal ions, soluble organic substances, etc. have been removed, returned to the slurry supply unit 7 of the polishing apparatuses 1 to 3, and adjusted to a specified slurry composition, and then polished. Is reused as the slurry 8 for use. In addition, depending on the water quality level of 12, 13, and 14, it is also used for cleaning cooling water and parts of other semiconductor manufacturing equipment.
【００１２】次ぎに、スラリ再生装置６より一般廃水処
理設備２０に排出された濃縮廃水4-1は更に加熱等によ
り水分を除去し無害な固形物として処理し、セメント材
料等に再利用する。Next, the concentrated wastewater 4-1 discharged from the slurry regeneration device 6 to the general wastewater treatment equipment 20 is further removed of water by heating or the like, treated as harmless solids, and reused as a cement material or the like.
【００１３】[0013]
【発明の効果】本発明により、スラリ及び廃水の再利用
が可能となり、再生したスラリにより被処理品の平坦化
処理が向上する。また、廃棄物量の減量化もでき、スラ
リの再生によりスラリ購入量の削減ができる。According to the present invention, the slurry and the wastewater can be reused, and the flattening treatment of the article to be treated is improved by the regenerated slurry. In addition, the amount of waste can be reduced, and the amount of slurry purchased can be reduced by regenerating the slurry.
【図１】本発明の一実施例のブロック図。FIG. 1 is a block diagram of one embodiment of the present invention.
１〜３…研磨装置、 ４…スラリ含有廃水、 ５…廃水回収槽、 ６…スラリ再生装置、 ７…スラリ供給部、 ８…スラリ、 ９…研磨材、 10…処理水、 11…超純水並みの水、 12、13、14…水質のレベル、 15…再生水製造装置、 16…一般廃水処理設備。 1-3: Polishing device, 4: Slurry-containing wastewater, 5: Wastewater recovery tank, 6: Slurry regeneration device, 7: Slurry supply unit, 8: Slurry, 9: Abrasive, 10: Treated water, 11: Ultrapure water Medium water, 12, 13, 14 ... water quality level, 15 ... reclaimed water production equipment, 16 ... general wastewater treatment equipment.
Claims (4)
液を用いて研磨や洗浄等の表面処理を行なう方法におい
て、上記被処理品の表面処理工程から排出される研磨材
等が混入した排出水を回収し、該排出水から任意の粒径
の研磨粒子と水とを各々分離・再生する手段を具備し、
各々再生した該任意の粒径の研磨材と該再生水を該ポリ
シング装置の表面処理液供給部に戻し、適正な表面処理
液組成に調整後循環使用することを特徴とする研磨方
法。In a method of performing a surface treatment such as polishing or cleaning on a substrate to be processed by using a processing solution containing an abrasive or the like, the abrasive or the like discharged from the surface treatment step of the substrate is processed. Recovering the mixed effluent, comprising means for separating and regenerating abrasive particles and water of any particle size from the effluent,
A polishing method, characterized by returning the regenerated abrasive having an arbitrary particle size and the regenerated water to a surface treatment liquid supply section of the polishing apparatus, adjusting the composition to an appropriate surface treatment liquid composition, and then circulating the same.
を各々回収・分離・再生する手段が、クロスフロー方式
による濾過処理による請求項１に記載の研磨方法。2. The polishing method according to claim 1, wherein the means for collecting, separating, and regenerating solid particles having an arbitrary particle size and water from the discharged water, respectively, is a filtration treatment by a cross flow method.
を各々回収・分離・再生することにより、廃棄物が排出
しない請求項１に記載の研磨方法。3. The polishing method according to claim 1, wherein wastes are not discharged by collecting, separating and regenerating water and solid particles having an arbitrary particle size from the discharged water.
を各々回収・分離・再生し、循環使用することにより、
該研磨材の粒子径が均一となり、該処理品の研磨による
平坦化を向上させる請求項１に記載の研磨方法。4. By collecting, separating and regenerating solid particles and water having an arbitrary particle size from the discharged water, and circulating them,
The polishing method according to claim 1, wherein the abrasive has a uniform particle diameter, and improves flattening of the processed product by polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9028733A JPH10216554A (en) | 1997-02-13 | 1997-02-13 | Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9028733A JPH10216554A (en) | 1997-02-13 | 1997-02-13 | Polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10216554A true JPH10216554A (en) | 1998-08-18 |
Family
ID=12256644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9028733A Pending JPH10216554A (en) | 1997-02-13 | 1997-02-13 | Polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10216554A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6866784B2 (en) * | 2000-06-27 | 2005-03-15 | Nymtech, Co., Ltd. | Slurry recycling system and method for CMP apparatus |
| JP2011502054A (en) * | 2007-10-30 | 2011-01-20 | ポール・コーポレーション | Method for treating spent abrasive slurry |
| WO2012018175A3 (en) * | 2010-08-03 | 2012-04-12 | 주식회사 랜코 | Method for regenerating ceria-based abrasive |
-
1997
- 1997-02-13 JP JP9028733A patent/JPH10216554A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6866784B2 (en) * | 2000-06-27 | 2005-03-15 | Nymtech, Co., Ltd. | Slurry recycling system and method for CMP apparatus |
| JP2011502054A (en) * | 2007-10-30 | 2011-01-20 | ポール・コーポレーション | Method for treating spent abrasive slurry |
| US8940174B2 (en) | 2007-10-30 | 2015-01-27 | Pall Corporation | Method for treating spent abrasive slurry |
| WO2012018175A3 (en) * | 2010-08-03 | 2012-04-12 | 주식회사 랜코 | Method for regenerating ceria-based abrasive |
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