JPH10200307A - Nonreversible circuit element - Google Patents
Nonreversible circuit elementInfo
- Publication number
- JPH10200307A JPH10200307A JP302597A JP302597A JPH10200307A JP H10200307 A JPH10200307 A JP H10200307A JP 302597 A JP302597 A JP 302597A JP 302597 A JP302597 A JP 302597A JP H10200307 A JPH10200307 A JP H10200307A
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- Prior art keywords
- connection
- welding
- port
- reliability
- input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Non-Reversible Transmitting Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、マイクロ波帯等の
高周波帯域で使用される非可逆回路素子、例えばアイソ
レータ、サーキュレータに関する。The present invention relates to a non-reciprocal circuit device used in a high frequency band such as a microwave band, for example, an isolator and a circulator.
【０００２】[0002]
【従来の技術】一般に、集中定数型のアイソレータ、サ
ーキュレータ等の非可逆回路素子は、信号の伝送方向に
は減衰量が極めて小さく、逆方向には極めて大きい特性
を有し、携帯電話等の送受信回路部に採用されている。2. Description of the Related Art Generally, non-reciprocal circuit devices such as lumped-constant isolators and circulators have characteristics in which the amount of attenuation is extremely small in the signal transmission direction and extremely large in the reverse direction, and transmission and reception of mobile phones and the like. Used in the circuit section.
【０００３】この種のアイソレータとして、従来、例え
ば図６に示すような構造のものがある。このアイソレー
タは、主として上ヨーク２と下ヨーク８とで構成される
磁気閉回路内に永久磁石３、３本の中心導体５１、５
２、５３及びフェライト５４とからなる磁性組立体５、
及び磁性組立体５や整合用コンデンサＣ１〜Ｃ３等を収
納する樹脂ケース７を配設した構造のものである。上記
中心導体５１、５２のポート部Ｐ１，Ｐ２は、上記樹脂
ケース７に配設された入出力端子７１、７２及び整合用
コンデンサＣ１，Ｃ２に接続され、中心導体５３のポー
ト部Ｐ３は整合用コンデンサＣ３及び終端抵抗Ｒに接続
され、各コンデンサＣ１〜Ｃ３及び終端抵抗Ｒの一端は
アース端子７３、７３に接続されている。このアイソレ
ータは、実装基板に表面実装されて使用される。As this type of isolator, there is a conventional isolator having a structure as shown in FIG. The isolator includes a permanent magnet 3, three center conductors 51, 5 in a magnetic closed circuit mainly composed of an upper yoke 2 and a lower yoke 8.
2, 53 and a ferrite 54;
And a resin case 7 for accommodating the magnetic assembly 5, the matching capacitors C1 to C3, and the like. The port portions P1 and P2 of the center conductors 51 and 52 are connected to input / output terminals 71 and 72 and matching capacitors C1 and C2 provided in the resin case 7, and the port portion P3 of the center conductor 53 is used for matching. One end of each of the capacitors C1 to C3 and the terminating resistor R is connected to the ground terminals 73 and 73. This isolator is used by being surface-mounted on a mounting board.
【０００４】このアイソレータを構成する上記各部品、
部材同士の電気的接続及び機械的接合は、従来、クリー
ム半田を一方または両方の部品、部材側の接続部または
接続面に塗布してはんだ付けすることにより行われてい
る。例えば、下ヨーク８と上ヨーク２との接合、各中心
導体５１、５２、５３のポート部Ｐ１〜Ｐ３と入出力端
子７１、７２との接続、樹脂ケース７の内部に露出する
アース端子７３とコンデンサＣ１〜Ｃ３，終端抵抗Ｒ等
の接続は、それぞれの接続部にクリーム半田を塗布し、
アイソレータを構成する他の部材や治具等により押え付
けた状態で高温雰囲気中にてリフロー半田付けすること
により行われている。なお、永久磁石３は接着剤で固
定、または上、下ヨーク２、８と樹脂ケース７等の構成
部材で押圧固定されている。Each of the above-mentioned components constituting the isolator,
Conventionally, electrical connection and mechanical joining between members are performed by applying cream solder to one or both components, a connection portion or a connection surface on the member side, and soldering. For example, the connection between the lower yoke 8 and the upper yoke 2, the connection between the port portions P1 to P3 of the respective center conductors 51, 52, 53 and the input / output terminals 71, 72, and the connection of the ground terminal 73 exposed inside the resin case 7 For connection of the capacitors C1 to C3 and the terminating resistor R, cream solder is applied to each connection part,
It is performed by reflow soldering in a high-temperature atmosphere while being held down by other members or jigs that constitute the isolator. The permanent magnet 3 is fixed with an adhesive or pressed and fixed with components such as the upper and lower yokes 2 and 8 and the resin case 7.
【０００５】[0005]
【発明が解決しようとする課題】ところで、近年、携帯
電話等の移動通信機器の小型化、低コスト化は急速に進
展し、これらに採用される非可逆回路素子には小型化か
つ表面実装可能なものが強く要請されている。In recent years, miniaturization and cost reduction of mobile communication devices such as mobile phones have been rapidly progressing, and the non-reciprocal circuit devices used in these devices can be miniaturized and surface-mounted. Is strongly demanded.
【０００６】しかしながら、従来の非可逆回路素子は、
上記のように構成部材同士の接続部や接合部ははんだ付
けされており、実装基板へのリフロー半田付け時の熱に
より、各部材の接続部の半田が溶融し、接続部での接合
不良が生じるという問題があった。However, the conventional non-reciprocal circuit device is
As described above, the connection parts and the joint parts of the constituent members are soldered, and the heat at the time of reflow soldering to the mounting board melts the solder of the connection parts of each member, and the joint failure at the connection part is reduced. There was a problem that would occur.
【０００７】また、回路系に異常が発生し、アイソレー
タに定格を越える電力が加わり、中心導体や抵抗等の構
成部品が発熱し内部温度が接続に使用している半田の融
点を越えた場合にも、接続不良が生じる。[0007] Further, when an abnormality occurs in the circuit system, power exceeding the rating is applied to the isolator, components such as the center conductor and the resistor generate heat, and the internal temperature exceeds the melting point of the solder used for connection. Also, a connection failure occurs.
【０００８】このため、半田が溶融しても接合部材が動
かないように耐熱性接着剤で各部材を固定する、あるい
は、共晶半田の代わりに高温半田（融点２２０℃〜２４
０℃）を用いて半田の溶融そのものを抑制する等の対策
が取られている。しかし、接着剤で固定した場合には半
田の再溶融により半田の酸化（劣化）が進む等、接続の
信頼性が低下するという問題がある。また、高温半田を
用いてもリフロー半田付け時の熱（ピーク温度約２３５
℃）による半田の溶融は避けられず、十分な接続の信頼
性が得られないという問題があった。For this reason, each member is fixed with a heat-resistant adhesive so that the joining member does not move even if the solder melts, or a high-temperature solder (melting point 220 ° C. to 24 ° C.) is used instead of the eutectic solder.
(0 ° C.) to prevent the melting of the solder itself. However, in the case where the solder is fixed with an adhesive, there is a problem that the reliability of the connection is reduced, for example, oxidation (deterioration) of the solder proceeds due to re-melting of the solder. Further, even when high-temperature solder is used, heat during reflow soldering (peak temperature of about 235
C), there is a problem that the melting of the solder is inevitable and sufficient connection reliability cannot be obtained.
【０００９】また、環境問題から脱鉛化の動きもあり、
鉛を含有しない融点約２２０℃の半田を使用しなけらば
ならないという情勢もあり、リフロー半田付け時の熱に
よる半田溶融に起因する接続、接合の信頼性の問題は一
層顕在化すると考えられる。[0009] In addition, there has been a move to lead-free due to environmental problems.
There is also the situation that it is necessary to use solder containing no lead and having a melting point of about 220 ° C., and it is considered that the problem of the reliability of connection and joining caused by solder melting due to heat during reflow soldering becomes more apparent.
【００１０】最近の小型化された非可逆回路素子におい
て、このリフロー実装時の半田溶融に対する接続の信頼
性の確保が重要な課題となっている。特に、中心導体の
ポート部と入出力端子との接続部は接合面積も小さく、
半田溶融により接合不具合が起こりやすく、また、外部
ケースとしても機能する上，下ヨークの接合がずれる
と、磁性組立体に印加されるバイアス磁界が変化して電
気的特性が劣化する。In recent miniaturized non-reciprocal circuit devices, it is important to ensure the reliability of connection against solder melting during reflow mounting. In particular, the connection area between the port of the center conductor and the input / output terminal has a small joint area,
Bonding failure is likely to occur due to the melting of the solder, and also functions as an outer case. In addition, if the lower yoke is displaced, the bias magnetic field applied to the magnetic assembly changes and the electrical characteristics deteriorate.
【００１１】そこで、本発明の目的は、リフロー半田付
け等の高温が加えられても常に安定で確実な接続を維持
することができる信頼性の高い非可逆回路素子を提供す
ることにある。An object of the present invention is to provide a highly reliable non-reciprocal circuit device that can always maintain stable and reliable connection even when a high temperature such as reflow soldering is applied.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するため
に、請求項１に係る発明は、ヨーク内に、永久磁石を配
設するとともに、磁性体に複数の中心導体を互いに交差
させて配置した磁性組立体を収納してなる非可逆回路素
子において、非可逆回路素子を構成する部材同士の接続
部の少なくとも１つ箇所が溶接により接合されているこ
とを特徴とするものである。According to a first aspect of the present invention, a permanent magnet is provided in a yoke, and a plurality of central conductors are disposed on a magnetic body so as to intersect each other. In a non-reciprocal circuit device containing the magnetic assembly described above, at least one portion of a connection portion between members constituting the non-reciprocal circuit device is joined by welding.
【００１３】請求項２に係る発明は、請求項１に記載の
非可逆回路素子において、前記中心導体のうち少なくと
も１つの中心導体のポート部に外部接続用端子が接続さ
れ、このポート部と外部接続用端子との接続が溶接によ
り接合されていることを特徴とするものである。According to a second aspect of the present invention, in the non-reciprocal circuit device according to the first aspect, an external connection terminal is connected to a port of at least one of the central conductors, and the port and the external The connection with the connection terminal is joined by welding.
【００１４】請求項３に係る発明は、請求項１または請
求項２に記載の非可逆回路素子において、前記ヨークが
複数のヨーク部材で形成され、これら複数のヨーク部材
が溶接により接合されていることを特徴とするものであ
る。According to a third aspect of the present invention, in the nonreciprocal circuit device according to the first or second aspect, the yoke is formed by a plurality of yoke members, and the plurality of yoke members are joined by welding. It is characterized by the following.
【００１５】請求項４に係る発明は、請求項１から請求
項３のいずれかに記載の非可逆回路素子において、前記
溶接が、レーザー溶接、抵抗スポット溶接、または超音
波溶接であることを特徴とするものである。According to a fourth aspect of the present invention, in the non-reciprocal circuit device according to any one of the first to third aspects, the welding is laser welding, resistance spot welding, or ultrasonic welding. It is assumed that.
【００１６】請求項５に係る発明は、請求項２から請求
項４のいずれかに記載の非可逆回路素子において、前記
外部接続用端子が樹脂ケースに埋設され、この樹脂ケー
スに前記磁性組立体及び整合用コンデンサ等の部品が収
納されていることを特徴とするものである。According to a fifth aspect of the present invention, in the non-reciprocal circuit device according to any one of the second to fourth aspects, the external connection terminal is embedded in a resin case, and the magnetic assembly is mounted on the resin case. And components such as a matching capacitor are housed therein.
【００１７】上記の構成によれば、非可逆回路素子を構
成する各部材の接続部はレーザー溶接、抵抗スポット溶
接、超音波溶接等の溶接により接合されており、リフロ
ー半田付け等の高温が加えられても、この溶接による接
続部の接合は外れることがなく、常に安定で確実な接
続、接合を維持することができる。また、溶接による接
続部が安定に保持固定されることにより、溶接以外の接
続部の接続の信頼性も向上することができる。つまり、
半田による接続部を減らすことにより、はんだ付け接続
に起因する接続不具合を大幅に低減し、接続の信頼性を
向上することができる。According to the above configuration, the connecting portions of the members constituting the non-reciprocal circuit element are joined by welding such as laser welding, resistance spot welding, ultrasonic welding, etc., and high temperature such as reflow soldering is applied. Even if the connection is made, the joining of the connecting portions by this welding does not come off, and stable and reliable connection and joining can be always maintained. Further, since the connection portion by welding is stably held and fixed, the reliability of connection of the connection portion other than welding can be improved. That is,
By reducing the number of connection parts by soldering, connection defects caused by soldering connection can be significantly reduced, and the reliability of connection can be improved.
【００１８】特に、信号経路であり接合面積の小さな中
心導体のポート部と入出力端子との接続部、または外部
ケースとしても機能する上，下ヨークの接続部を溶接に
より接合すれば、より効果的に信頼性の向上を図ること
ができる。In particular, when the connection portion of the lower yoke is joined by welding, it also functions as a connection portion between the port portion of the center conductor having a small joining area and the input / output terminal or as an external case. Thus, the reliability can be improved.
【００１９】また、半田使用量が減少するので環境問題
の改善にも貢献することができ、リフロー温度のさらな
る上昇にも対応することができる。Further, since the amount of solder used is reduced, it is possible to contribute to improvement of environmental problems, and it is possible to cope with a further increase in reflow temperature.
【００２０】[0020]
【発明の実施の形態】以下、本発明をその実施例を示す
図面に基づいて説明する。本発明の一実施例の係るアイ
ソレータの構造を図１〜図３に示す。図１はアイソレー
タの外観斜視図、図２は図１の分解斜視図、図３は樹脂
ケース内に磁性組立体等の部品が配置された状態を示す
平面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings showing embodiments thereof. 1 to 3 show the structure of an isolator according to one embodiment of the present invention. 1 is an external perspective view of the isolator, FIG. 2 is an exploded perspective view of FIG. 1, and FIG. 3 is a plan view showing a state where components such as a magnetic assembly are arranged in a resin case.
【００２１】本実施例のアイソレータは、磁性体金属か
らなる箱状の上ヨーク２の内面に永久磁石３を配置する
とともに、上ヨーク２に同じく磁性体金属からなる略コ
字状の下ヨーク８を装着して磁気閉回路を形成し、下ヨ
ーク８内の底面８ａ上に樹脂ケース７を配設し、樹脂ケ
ース７内に磁性組立体５、整合用コンデンサＣ１〜Ｃ
３，終端抵抗Ｒを配設し、磁性組立体５に永久磁石３に
より直流磁界を印加するように構成されている。このア
イソレータの外径寸法は、略Ｗ７．０×Ｌ７．０×Ｈ
２．５ｍｍである。In the isolator of this embodiment, a permanent magnet 3 is arranged on the inner surface of a box-shaped upper yoke 2 made of a magnetic metal, and a substantially U-shaped lower yoke 8 also made of a magnetic metal is provided on the upper yoke 2. To form a magnetic closed circuit, a resin case 7 is disposed on a bottom surface 8a in a lower yoke 8, and a magnetic assembly 5 and matching capacitors C1 to C are provided in the resin case 7.
3, a terminating resistor R is provided, and a DC magnetic field is applied to the magnetic assembly 5 by the permanent magnet 3. The outer diameter of this isolator is approximately W7.0 × L7.0 × H
2.5 mm.
【００２２】磁性組立体５は、円板状のフェライト５４
の下面に薄板状の金属板からなる３本の中心導体５１〜
５３が連設されたアース部を当接し、フェライト５４の
上面に３本の中心導体５１〜５３を絶縁シート（不図
示）を介在させて互いに１２０度の角度なすように折り
曲げて配置した構造のものであり、各中心導体５１〜５
３の先端部であるポート部Ｐ１〜Ｐ３は外方に突出して
形成されている。The magnetic assembly 5 includes a disk-shaped ferrite 54.
Three central conductors 51 to 51 made of a thin metal plate
An earth portion provided with a series of 53 is in contact with each other, and three central conductors 51 to 53 are arranged on the upper surface of the ferrite 54 at an angle of 120 degrees with an insulating sheet (not shown) interposed therebetween. And each of the center conductors 51 to 5
Port portions P1 to P3, which are the distal end portions of 3, are formed to protrude outward.
【００２３】樹脂ケース７は、耐熱性、絶縁性を有する
樹脂材料からなり、矩形枠状の側壁に底壁７ａを一体形
成した構造のもので、入出力端子７１、７２及びアース
端子７３が設けられ、底壁７ａの略中央部に挿通孔７
ｂ、挿通孔７ｂの周縁部に３つのコンデンサ収納凹部７
ｃ，抵抗収納凹部７ｄが形成されている。The resin case 7 is made of a resin material having heat resistance and insulation properties, and has a structure in which a bottom wall 7a is integrally formed on a rectangular frame-shaped side wall, and is provided with input / output terminals 71 and 72 and a ground terminal 73. And a through hole 7 is provided in a substantially central portion of the bottom wall 7a.
b, three capacitor storage recesses 7 on the periphery of the insertion hole 7b
c, a resistance housing recess 7d is formed.
【００２４】外部接続端子である入出力端子７１、７２
及びアース端子７３は、金属導体板を所定の形状に打ち
抜き、曲げ加工されたものであり、その中央部が樹脂内
にモールドされて埋設され、一端側である外部接続部は
底壁７ａ及び側壁の外面に露出して設けられ、入出力端
子７１、７２の他端側７１ａ，７２ａは底壁７ａの内面
に露出して、また各アース端子７３の他端側７３ａはコ
ンデンサ収納凹部７ｃ及び抵抗収納凹部７ｄの内底面に
露出して設けられている。Input / output terminals 71 and 72 as external connection terminals
The ground terminal 73 is formed by punching a metal conductor plate into a predetermined shape and bending the metal conductor plate. The central portion of the ground terminal 73 is molded and embedded in a resin, and the external connection portion at one end is a bottom wall 7a and a side wall. The other end sides 71a, 72a of the input / output terminals 71, 72 are exposed on the inner surface of the bottom wall 7a, and the other end 73a of each ground terminal 73 is connected to the capacitor housing recess 7c and the resistor. It is provided to be exposed on the inner bottom surface of the storage recess 7d.
【００２５】挿通孔７ｂ内には磁性組立体５が挿入配置
され、磁性組立体５の下面の各中心導体５１〜５３のア
ース部は下ヨーク８の底面８ａに接続されている。コン
デンサ収納凹部７ｃには整合用コンデンサＣ１〜Ｃ３
が、抵抗収納凹部７ｄには終端抵抗であるチップ抵抗Ｒ
が配置されている。The magnetic assembly 5 is inserted and arranged in the insertion hole 7b. The ground portions of the center conductors 51 to 53 on the lower surface of the magnetic assembly 5 are connected to the bottom surface 8a of the lower yoke 8. Matching capacitors C1 to C3 are provided in the capacitor recess 7c.
However, a chip resistor R as a terminating resistor is provided in the resistor housing recess 7d.
Is arranged.
【００２６】信号入出力側の中心導体５１、５２のポー
ト部Ｐ１，Ｐ２はコンデンサＣ１，Ｃ２の上面電極及び
入出力端子であって、底壁７ａの内面に露出した部分７
１ａ，７２ａに接続され、中心導体５３のポート部Ｐ３
はコンデンサＣ３の上面電極及び終端抵抗Ｒの一端側の
電極に接続されている。各コンデンサＣ１〜Ｃ３の下面
電極、及び終端抵抗Ｒの他端側の電極はそれぞれアース
端子７３のコンデンサ収納凹部７ｃ、抵抗収納凹部７ｄ
の内面に露出した部分７３ａにそれぞれ接続されてい
る。すなわち、外部接続用端子である各端子７１、７
２、７３の樹脂ケース７の内底面に露出する部分７１
ａ，７２ａ，７３ａは樹脂ケース７の内部に配置される
部品との接続部となっている。Port portions P1 and P2 of the central conductors 51 and 52 on the signal input / output side are upper surface electrodes and input / output terminals of the capacitors C1 and C2, and are portions 7 exposed on the inner surface of the bottom wall 7a.
1a, 72a, and the port P3 of the center conductor 53
Is connected to the upper electrode of the capacitor C3 and the electrode on one end of the terminating resistor R. The lower surface electrodes of the capacitors C1 to C3 and the electrode on the other end side of the terminating resistor R are connected to the capacitor housing recess 7c and the resistor housing recess 7d of the ground terminal 73, respectively.
Are respectively connected to the portions 73a exposed on the inner surface. That is, each of the terminals 71 and 7 serving as external connection terminals
2 and 73, the portion 71 exposed on the inner bottom surface of the resin case 7
Reference numerals a, 72a, and 73a serve as connection portions with components arranged inside the resin case 7.
【００２７】そして、本実施例のアイソレータでは、入
出力側の中心導体５１、５２のポート部Ｐ１，Ｐ２と入
出力端子７１（７１ａ）、７２（７２ａ）、及び下ヨー
ク８と上ヨーク２とはレーザー溶接により接合されてい
る。このため、図１〜図３に示すように、ポート部Ｐ
１，Ｐ２と入出力端子７１、７２との接続部、及び下ヨ
ーク８と上ヨーク２との嵌合面の境界部にはそれぞれレ
ーザー溶接により溶融した溶接痕ＡまたはＢが形成され
ている。上記以外の接続部は、従来例と同様にはんだ付
けされて接続されている。In the isolator of this embodiment, the ports P1, P2 of the center conductors 51, 52 on the input / output side, the input / output terminals 71 (71a), 72 (72a), the lower yoke 8, the upper yoke 2, Are joined by laser welding. For this reason, as shown in FIGS.
1, welding marks A or B formed by laser welding are formed at the connection between the P1, P2 and the input / output terminals 71, 72, and at the boundary between the fitting surfaces of the lower yoke 8 and the upper yoke 2, respectively. The other connection parts are connected by soldering as in the conventional example.
【００２８】次に、本実施例の製造方法について説明す
る。図４は図３のＸ−Ｘ線断面図であり、中心導体と入
出力端子とのレーザー溶接を説明する図である。本実施
例の樹脂ケース７には、図４に示すように、入出力端子
７１が配置された底壁７ａの箇所に貫通穴７ｅが設けら
れている。中心導体７１のポート部Ｐ１と入出力端子７
１（７１ａ）とが押圧接触して配置された状態で、樹脂
ケース７の下方より貫通穴７ｅを通して、入出力端子７
１ａにレーザービームＬＢを照射して、入出力端子７１
ａ及び中心導体５１のポート部Ｐ１のレーザービーム照
射部分を加熱溶融させて、入出力端子７１とポート部Ｐ
１とを一体に接合する。中心導体７２のポート部Ｐ２と
入出力端子７２との接合も同様の方法で行われる。な
お、この溶接の前に、他の接続部にはクリーム半田が塗
布されている。Next, the manufacturing method of this embodiment will be described. FIG. 4 is a cross-sectional view taken along the line XX of FIG. 3 and is a diagram illustrating laser welding between the center conductor and the input / output terminal. In the resin case 7 of this embodiment, as shown in FIG. 4, a through hole 7e is provided at the bottom wall 7a where the input / output terminal 71 is arranged. Port portion P1 of central conductor 71 and input / output terminal 7
1 (71a) is arranged in a pressing contact with the input / output terminal 7 through the through hole 7e from below the resin case 7.
1a is irradiated with a laser beam LB, and input / output terminals 71
a and the laser beam-irradiated portion of the port portion P1 of the central conductor 51 is heated and melted, so that the input / output terminal 71
And 1 are integrally joined. The connection between the port portion P2 of the center conductor 72 and the input / output terminal 72 is performed in the same manner. Before this welding, cream solder is applied to the other connection parts.
【００２９】また、図示は省略するが、下ヨーク８と上
ヨーク２との接合は、下ヨーク８上に上記樹脂ケース７
を中心導体のアース部にクリーム半田を塗布して載置
し、その上から上ヨーク２を被せ押圧した状態で、下ヨ
ーク８と上ヨーク２との嵌合面の境界部の４箇所にレー
ザービームを照射して、下ヨーク８及び上ヨーク２のレ
ーザービーム照射部分を加熱溶融させて行われる。Although not shown, the lower yoke 8 and the upper yoke 2 are joined together by the resin case 7 on the lower yoke 8.
Is coated with cream solder on the ground portion of the center conductor, placed on the upper yoke 2 from above, pressed, and the laser is applied to four places at the boundary between the fitting surfaces of the lower yoke 8 and the upper yoke 2. The irradiation is performed by irradiating a laser beam to heat and melt the laser beam irradiated portions of the lower yoke 8 and the upper yoke 2.
【００３０】本実施例においてはＹＡＧレーザーが用い
られ、さらに光ファイバを利用することで溶接に必要な
光エネルギーを所望の部分に自在に導くことができ、ま
た同時多点加工により、１台のレーザ溶接機で中心導体
と入出力端子との２箇所の溶接、または下ヨークと上ヨ
ークとの４箇所の溶接を同時に行うことができる。つま
り、レーザー溶接では、複雑な部分を非接触で精度よく
溶接することができ、かつ多数の箇所を同時に溶接する
ことができる。In the present embodiment, a YAG laser is used, and the optical energy required for welding can be freely guided to a desired portion by using an optical fiber. The laser welding machine can simultaneously perform welding at two places between the center conductor and the input / output terminal or welding at four places between the lower yoke and the upper yoke. That is, in laser welding, a complicated portion can be welded accurately without contact, and a large number of portions can be welded simultaneously.
【００３１】このヨークの溶接の後に、高温雰囲気（リ
フロー炉）中にてリフロー半田付けすることにより他の
接続部がはんだ付けされる。After the yoke is welded, the other connecting portions are soldered by reflow soldering in a high-temperature atmosphere (reflow furnace).
【００３２】上記のように、本実施例のアイソレータ
は、特性及び信頼性のうえで重要な箇所である、中心導
体７１、７２のポート部Ｐ１，Ｐ２と入出力端子７１，
７２との接続及び上下ヨーク２，８の接合がレーザー溶
接により接合されており、実装基板へのリフロー半田付
け時の熱により、これらの接続部の接合が外れたり、ず
れたりすることはない。したがって、従来のもので発生
したこれら接続部でのリフローはんだ付け時の半田溶融
による接続不具合を解消することができ、信頼性を大幅
に向上することができる。As described above, the isolator according to the present embodiment has the ports P1, P2 and the input / output terminals 71, 72 of the center conductors 71, 72, which are important parts in terms of characteristics and reliability.
The connection with the base 72 and the joining of the upper and lower yokes 2 and 8 are joined by laser welding, and the joining of these joints does not come off or shift due to heat during reflow soldering to the mounting board. Therefore, it is possible to eliminate the connection failure due to the melting of the solder at the time of reflow soldering at these connection portions, which has occurred in the conventional device, and it is possible to greatly improve the reliability.
【００３３】また、中心導体７１、７２のポート部Ｐ
１，Ｐ２はコンデンサＣ１，Ｃ２にもはんだ付けされて
おり、ポート部Ｐ１，Ｐ２が浮くことなく常に安定に固
定されるので、このポート部Ｐ１，Ｐ２とコンデンサＣ
１，Ｃ２との接続の信頼性も向上される。The port portions P of the center conductors 71 and 72
1 and P2 are also soldered to the capacitors C1 and C2, and the port portions P1 and P2 are always stably fixed without floating, so that the port portions P1 and P2 and the capacitor C
1, the reliability of the connection with C2 is also improved.
【００３４】また、回路系に異常が発生し、アイソレー
タに定格を越える電力が加わり、内部温度が上昇した場
合にも、溶接による接合部は接続不良を起こすことがな
く、回路系が正常状態に復帰すれば、アイソレータも引
き続き機能を維持することができる。Further, even when an abnormality occurs in the circuit system, the power exceeding the rating is applied to the isolator, and the internal temperature rises, the joint by welding does not cause a connection failure and the circuit system is in a normal state. Upon recovery, the isolator can continue to function.
【００３５】また、はんだ付け箇所を少なくすること
で、半田使用量を減少させ環境問題の改善にも貢献する
ことができる。Further, by reducing the number of soldering points, it is possible to reduce the amount of solder used and contribute to improvement of environmental problems.
【００３６】上記実施例ではレーザー溶接による接合で
説明したが、溶接による接合はレーザー溶接に限定され
るものではなく、抵抗スポット溶接や超音波溶接等の他
の溶接方法を用いるようにしてもよい。Although the above embodiment has been described with reference to the joining by laser welding, the joining by welding is not limited to laser welding, and other welding methods such as resistance spot welding and ultrasonic welding may be used. .
【００３７】図５は中心導体と入出力端子との抵抗スポ
ット溶接を説明する図である。本実施例では、図５に示
すように、中心導体７１のポート部Ｐ１と入出力端子７
１（７１ａ）とを接触配置し、抵抗スポット溶接機の溶
接棒１１、１２でポート部Ｐ１と入出力端子７１ａとを
上下から加圧すると同時に大電流を流して、中心導体と
入出力端子の両金属を加熱溶融させて両金属を一体に接
合する。FIG. 5 is a view for explaining resistance spot welding between the center conductor and the input / output terminal. In this embodiment, as shown in FIG. 5, the port portion P1 of the center conductor 71 and the input / output terminal 7
1 (71a) in contact with each other, pressurize the port portion P1 and the input / output terminal 71a from above and below with the welding rods 11 and 12 of the resistance spot welding machine, and at the same time, apply a large current to the central conductor and the input / output terminal. The two metals are heated and melted to join the two metals together.
【００３８】このように、抵抗スポット溶接により接合
しても、接合部はリフロー半田時の熱で外れたり、ずれ
たりすることはなく、常に安定で確実な接続を得ること
ができる。As described above, even when joined by resistance spot welding, the joint does not come off or shift due to heat during reflow soldering, and a stable and reliable connection can always be obtained.
【００３９】また、超音波振動エネルギーで金属同士の
接合を行う超音波溶接を用いれば、金属の溶融温度より
低い温度で両金属を接合することができ、接合時の熱に
よる特性劣化への影響を大幅に軽減するとできる。ま
た、超音波溶接によれば、材質が大きく異なる金属間の
接合を容易に行うことができ、さらにアルミとセラミッ
クス間の接合をも行うことができる。In addition, if ultrasonic welding is used to join metals with ultrasonic vibration energy, the two metals can be joined at a temperature lower than the melting temperature of the metals, and the influence of heat during joining on the deterioration of characteristics. Can be greatly reduced. In addition, according to the ultrasonic welding, it is possible to easily perform joining between metals having greatly different materials, and also to join between aluminum and ceramics.
【００４０】本発明の溶接による構成部材間の接合は、
特に最近の小形化された非可逆回路素子において、リフ
ロー実装時の接続不具合にたいして効果的な対策とな
る。The joining between the components by the welding of the present invention is as follows.
In particular, in recent miniaturized non-reciprocal circuit devices, this is an effective countermeasure against connection failure during reflow mounting.
【００４１】なお、上記実施例では、アイソレータを例
にとって説明したが、これに限るものではなく、ポート
部Ｐ３に終端抵抗Ｒを接続することなくポート部Ｐ３を
第３の入出力部として構成したサーキュレータであって
もよい。In the above embodiment, an isolator was described as an example. However, the present invention is not limited to this, and the port P3 is configured as a third input / output unit without connecting the terminating resistor R to the port P3. It may be a circulator.
【００４２】また、全体の構成も上記実施例の図１〜図
３に示すものに限定されるものではない。例えば、金属
板からなる接続端子板を用いて離れた箇所を電気的に接
続する場合に、この接続端子との接続部に上記各溶接を
適用することができる。また、誘電体からなる多層基板
の内部に中心導体を積層して配置した構造、あるいは磁
性体からなる多層基板の内部に中心導体を積層して配置
した構造の非可逆回路素子にも本発明を適用することが
できる。Further, the overall configuration is not limited to those shown in FIGS. For example, in the case where a distant portion is electrically connected using a connection terminal plate made of a metal plate, each of the above-described weldings can be applied to a connection portion with the connection terminal. The present invention is also applied to a non-reciprocal circuit device having a structure in which a central conductor is laminated and arranged inside a multilayer substrate made of a dielectric or a structure in which a central conductor is laminated and arranged inside a multilayer substrate made of a magnetic material. Can be applied.
【００４３】[0043]
【発明の効果】以上説明したように、本発明に係る非可
逆回路素子によれば、リフロー半田付け等の高温が加え
られても、溶接による接続部の接合は外れることがな
く、常に安定で確実な接続、接合を維持することがで
き、また、溶接による接続部が安定に保持固定されるこ
とにより、溶接以外の接続部の接続の信頼性をも向上す
ることができる。特に、信号経路であり接合面積の小さ
な中心導体のポート部と入出力端子との接続部、または
外部ケースとしても機能する上，下ヨークの接続部を溶
接により接合すれば、より効果的に信頼性の向上を図る
ことができる。As described above, according to the non-reciprocal circuit device according to the present invention, even when a high temperature such as reflow soldering is applied, the joining of the connection portion by welding does not come off and is always stable. Reliable connection and joining can be maintained, and the reliability of the connection of the connection portion other than the welding can be improved by stably holding and fixing the connection portion by welding. In particular, it functions as a connection between the port of the central conductor and the input / output terminal, which is a signal path and a small joint area, or as an outer case. Performance can be improved.
【００４４】また、半田使用量が減少するので環境問題
の改善にも貢献することができ、リフロー温度のさらな
る上昇にも対応することができる。Further, since the amount of solder used is reduced, it is possible to contribute to improvement of environmental problems, and it is possible to cope with a further increase in reflow temperature.
【図１】本発明の一実施例に係るアイソレータの外観斜
視図である。FIG. 1 is an external perspective view of an isolator according to one embodiment of the present invention.
【図２】本発明の一実施例に係るアイソレータの分解斜
視図である。FIG. 2 is an exploded perspective view of the isolator according to one embodiment of the present invention.
【図３】本発明の一実施例に係る樹脂ケース内に部品が
配置された状態を示す平面図である。FIG. 3 is a plan view showing a state where components are arranged in a resin case according to one embodiment of the present invention.
【図４】本発明の中心導体と入出力端子とのレーザー溶
接を説明するための断面図である。FIG. 4 is a cross-sectional view for explaining laser welding of the center conductor and the input / output terminal according to the present invention.
【図５】本発明の中心導体と入出力端子との抵抗スポッ
ト溶接を説明するための断面図である。FIG. 5 is a cross-sectional view for explaining resistance spot welding between the center conductor and the input / output terminal according to the present invention.
【図６】従来のアイソレータの分解斜視図である。FIG. 6 is an exploded perspective view of a conventional isolator.
２ 上ヨーク ３ 永久磁石 ５ 磁性組立体 ５１〜５３ 中心導体 Ｐ１〜Ｐ３ ポート部 ７ 樹脂ケース ７１、７２ 入出力端子（外部接続用端子） ７３ アース端子（外部接続用端子） ８ 下ヨーク Ｃ１〜Ｃ３ 整合用コンデンサ Ｒ 終端抵抗 2 Upper yoke 3 Permanent magnet 5 Magnetic assembly 51 to 53 Center conductor P1 to P3 Port portion 7 Resin case 71, 72 Input / output terminal (terminal for external connection) 73 Earth terminal (terminal for external connection) 8 Lower yoke C1 to C3 Matching capacitor R terminator
Claims (5)
に、磁性体に複数の中心導体を互いに交差させて配置し
た磁性組立体を収納してなる非可逆回路素子において、 非可逆回路素子を構成する部材同士の接続部の少なくと
も１つ箇所が溶接により接合されていることを特徴とす
る非可逆回路素子。1. A non-reciprocal circuit device comprising: a yoke in which a permanent magnet is disposed and a magnetic assembly in which a plurality of central conductors are arranged to cross each other in a magnetic body. A non-reciprocal circuit device, wherein at least one of connection portions of constituent members is joined by welding.
心導体のポート部に外部接続用端子が接続され、このポ
ート部と外部接続用端子との接続が溶接により接合され
ていることを特徴とする請求項１に記載の非可逆回路素
子。2. An external connection terminal is connected to a port of at least one of the central conductors, and the connection between the port and the external connection terminal is welded. The non-reciprocal circuit device according to claim 1.
れ、これら複数のヨーク部材が溶接により接合されてい
ることを特徴とする請求項１または請求項２に記載の非
可逆回路素子。3. The non-reciprocal circuit device according to claim 1, wherein the yoke is formed of a plurality of yoke members, and the plurality of yoke members are joined by welding.
ト溶接、または超音波溶接であることを特徴とする請求
項１から請求項３のいずれかに記載の非可逆回路素子。4. The non-reciprocal circuit device according to claim 1, wherein the welding is laser welding, resistance spot welding, or ultrasonic welding.
され、この樹脂ケースに前記磁性組立体及び整合用コン
デンサ等の部品が収納されていることを特徴とする請求
項２から請求項４のいずれかに記載の非可逆回路素子。5. The semiconductor device according to claim 2, wherein said external connection terminal is buried in a resin case, and said resin case houses components such as said magnetic assembly and a matching capacitor. The non-reciprocal circuit device according to any one of the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP302597A JPH10200307A (en) | 1997-01-10 | 1997-01-10 | Nonreversible circuit element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP302597A JPH10200307A (en) | 1997-01-10 | 1997-01-10 | Nonreversible circuit element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10200307A true JPH10200307A (en) | 1998-07-31 |
Family
ID=11545792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP302597A Pending JPH10200307A (en) | 1997-01-10 | 1997-01-10 | Nonreversible circuit element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10200307A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6657511B2 (en) | 2000-05-17 | 2003-12-02 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication apparatus including the same |
| US6880227B2 (en) | 2001-01-11 | 2005-04-19 | Murata Manufacturing Co., Ltd. | Method for manufacturing nonreciprocal circuit device, nonreciprocal circuit device, and communication apparatus incorporating the same |
| US6968609B2 (en) | 2001-03-01 | 2005-11-29 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device, communication device, and method of manufacturing nonreciprocal circuit device |
-
1997
- 1997-01-10 JP JP302597A patent/JPH10200307A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6657511B2 (en) | 2000-05-17 | 2003-12-02 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device and communication apparatus including the same |
| US6880227B2 (en) | 2001-01-11 | 2005-04-19 | Murata Manufacturing Co., Ltd. | Method for manufacturing nonreciprocal circuit device, nonreciprocal circuit device, and communication apparatus incorporating the same |
| US6968609B2 (en) | 2001-03-01 | 2005-11-29 | Murata Manufacturing Co., Ltd. | Nonreciprocal circuit device, communication device, and method of manufacturing nonreciprocal circuit device |
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