JPH10189096A - Board junctioning film and its manufacture, multi-layer circuit board using it and its manufacture - Google Patents
Board junctioning film and its manufacture, multi-layer circuit board using it and its manufactureInfo
- Publication number
- JPH10189096A JPH10189096A JP35083496A JP35083496A JPH10189096A JP H10189096 A JPH10189096 A JP H10189096A JP 35083496 A JP35083496 A JP 35083496A JP 35083496 A JP35083496 A JP 35083496A JP H10189096 A JPH10189096 A JP H10189096A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- metal
- film
- resin
- resin material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacturing Of Electrical Connectors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は半導体装置等の電子
部品の製造で使用する基板接合用フィルム及びその製造
方法並びにこれを用いた多層回路基板及びその製造方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding film used in the manufacture of electronic components such as semiconductor devices, a method of manufacturing the same, and a multilayer circuit board using the same and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】多層回路基板は所定パターンに形成した
信号ライン、接地ライン等の配線を電気的絶縁層を介し
て多層に形成し、層間で配線を電気的に導通する導通部
を設けて形成したものである。多層回路基板にはセラミ
ックを電気的絶縁層として多層形成したもの、樹脂基板
を電気的絶縁層として多層形成したもの、あるいはポリ
イミド等の薄膜の電気的絶縁層を利用して多層形成した
もの等がある。2. Description of the Related Art A multilayer circuit board is formed by forming wirings such as signal lines and ground lines formed in a predetermined pattern in multiple layers via an electrically insulating layer, and providing a conductive portion for electrically connecting the wirings between the layers. It was done. The multilayer circuit board may be formed by forming a ceramic multilayer as an electrical insulating layer, by forming a multilayer resin substrate as an electrical insulating layer, or by forming a multilayer using a thin electrical insulating layer of polyimide or the like. is there.
【０００３】これら多層回路基板の製造方法には種々の
方法がある。たとえば、セラミックパッケージでは層間
接続用のビアを設けたグリーンシートを積層して多層形
成し、樹脂基板を使用するパッケージでは樹脂基板にス
ルーホールを設けて層間の配線を電気的に接続すること
によって多層形成し、薄膜の電気的絶縁層を介して多層
形成する場合はいわゆるビルドアップ法等により多層形
成する。There are various methods for manufacturing these multilayer circuit boards. For example, in a ceramic package, green sheets provided with vias for interlayer connection are laminated to form a multilayer, and in a package using a resin substrate, a through hole is provided in the resin substrate to electrically connect wiring between layers to form a multilayer. In the case of forming and forming a multilayer through a thin film electrically insulating layer, a multilayer is formed by a so-called build-up method or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
多層回路基板の製造方法は一般に工程が複雑であり、多
層になればなるほど、製品の歩留りが低下するという問
題点があった。また、最近の多層配線基板は半導体素子
の多ピン化とともに、極めて高密度に形成されるように
なってきたことから、製造工程がさらに複雑化するとと
もに、配線等を極めて微細に形成する必要があることか
ら困難さが一層増大している。However, the conventional method of manufacturing a multi-layer circuit board is generally complicated in its process, and the higher the number of layers, the lower the product yield. In addition, since recent multi-layer wiring boards have been formed with extremely high density as the number of pins of semiconductor elements has increased, the manufacturing process has become more complicated, and it is necessary to form wiring and the like very finely. The difficulty is compounded by the fact.
【０００５】これに対して、本発明はあらかじめ所定の
パターンで配線を形成した回路基板を使用して多層回路
基板を製造する方法に関するものであり、その目的とす
るところは、多層回路基板を歩留りよく確実に製造する
ことを可能とする基板接合用フィルムおよびこの基板接
合用フィルムの好適な製造方法、およびこの基板接合用
フィルムを用いて製造する多層回路基板およびこの多層
回路基板の好適な製造方法を提供しようとするものであ
る。On the other hand, the present invention relates to a method for manufacturing a multilayer circuit board using a circuit board on which wiring is formed in a predetermined pattern in advance. Substrate bonding film that enables reliable and reliable manufacturing, preferred method of manufacturing this substrate bonding film, multilayer circuit board manufactured using this substrate bonding film, and preferred method of manufacturing this multilayer circuit board It is intended to provide.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために次の構成を備える。すなわち、基板接合用
フィルムとして、電気的絶縁性及び加熱処理により接着
性を有するフィルム状に形成した樹脂材に、該樹脂材を
厚さ方向に貫通して形成した接合孔に融点４００℃以下
の接合用金属が充填されて形成された導電部が、所定間
隔で複数個設けられたことを特徴とする。また、前記導
電部が、接合孔の両端面に前記接合用金属が露出し、接
合孔の内部に銅層が充填して設けられたことを特徴とす
る。また、前記接合用金属が錫−鉛合金であることを特
徴とする。また、前記樹脂材が熱可塑性樹脂または半硬
化状態とした熱硬化性樹脂であることを特徴とする。The present invention has the following arrangement to achieve the above object. That is, as a substrate bonding film, a resin material formed into a film having electrical insulation and adhesiveness by heat treatment, and a bonding hole formed by penetrating the resin material in the thickness direction and having a melting point of 400 ° C. or less. A plurality of conductive portions formed by filling with a joining metal are provided at predetermined intervals. Further, the conductive portion is provided such that the bonding metal is exposed at both end surfaces of the bonding hole and a copper layer is filled inside the bonding hole. Further, the invention is characterized in that the joining metal is a tin-lead alloy. Further, the resin material is a thermoplastic resin or a thermosetting resin in a semi-cured state.
【０００７】また、基板接合用フィルムの製造方法とし
て、熱可塑性樹脂または半硬化状態にある熱硬化性樹脂
の樹脂材の片面に金属箔が被着された、電気的絶縁性及
び加熱処理により接着性を有する樹脂フィルムを作製
し、前記樹脂材に前記金属箔を底部とする接合孔を所定
配置で複数個形成し、前記金属箔をめっき給電層として
電解めっきを施すことにより、前記接合孔内に融点４０
０℃以下の接合用金属を盛り上げて前記接合孔が前記接
合用金属によって充填された導電部を形成し、前記金属
箔をエッチングにより溶解除去することを特徴とする。
また、熱可塑性樹脂または半硬化状態にある熱硬化性樹
脂の樹脂材の片面に金属箔が被着された、電気的絶縁性
及び加熱処理により接着性を有する樹脂フィルムを作製
し、前記樹脂材に前記金属箔を底部とする接合孔を所定
配置で複数個形成し、前記金属箔をめっき給電層とし
て、電解めっきを施すことにより前記接合孔に融点４０
０℃以下の接合用金属を盛り上げて充填し、次に、電解
銅めっきを施して、前記接合孔内の前記接合用金属の上
に銅層を盛り上げて形成し、さらに、電解めっきにより
前記銅層の上に前記接合用金属を盛り上げて形成するこ
とによって、接合孔の内部が銅層とし、接合孔の両端面
に接合用金属が配置された導電部を形成し、前記金属箔
をエッチングにより溶解除去することを特徴とする。ま
た、前記金属箔として銅箔を使用することを特徴とす
る。As a method of manufacturing a substrate bonding film, a metal foil is adhered to one surface of a resin material of a thermoplastic resin or a thermosetting resin in a semi-cured state, and is bonded by electrical insulation and heat treatment. By preparing a resin film having a property, forming a plurality of bonding holes with the metal foil as a bottom portion in the resin material in a predetermined arrangement, and performing electroplating with the metal foil as a plating power supply layer, the inside of the bonding hole is formed. Melting point 40
A metal for bonding at 0 ° C. or lower is raised to form a conductive portion in which the bonding holes are filled with the metal for bonding, and the metal foil is dissolved and removed by etching.
Further, a resin film having an electrical insulating property and an adhesive property by a heat treatment, in which a metal foil is adhered to one surface of a resin material of a thermoplastic resin or a thermosetting resin in a semi-cured state, is produced. A plurality of bonding holes having the metal foil as a bottom portion are formed in a predetermined arrangement, and the metal foil is used as a plating power supply layer.
The metal for joining at 0 ° C. or lower is raised and filled, and then, electrolytic copper plating is applied to form a copper layer on the bonding metal in the bonding hole by raising the copper layer. By forming the joining metal raised on the layer, the inside of the joining hole is a copper layer, and a conductive portion in which the joining metal is disposed on both end surfaces of the joining hole is formed, and the metal foil is etched by It is characterized by being dissolved and removed. Further, a copper foil is used as the metal foil.
【０００８】また、多層回路基板として、前記基板接合
用フィルムが回路基板間に介在して、前記回路基板に設
けた配線が前記導電部を介して層間で電気的に接続され
て成ることを特徴とする。また、多層回路基板の製造方
法として、前記基板接合用フィルムを回路基板間に配置
し、加熱・加圧することにより前記樹脂材を介して前記
回路基板を一体に接合するとともに、前記導電部を介し
て前記回路基板の配線を層間で電気的に接続して多層形
成することを特徴とする。[0008] Further, as the multilayer circuit board, the substrate bonding film is interposed between the circuit boards, and the wiring provided on the circuit board is electrically connected between the layers via the conductive portion. And Further, as a method of manufacturing a multilayer circuit board, the board bonding film is disposed between the circuit boards, and the circuit board is integrally bonded via the resin material by applying heat and pressure, and via the conductive portion. The wiring of the circuit board is electrically connected between layers to form a multilayer.
【０００９】[0009]
【発明の実施の形態】以下、本発明の好適な実施形態に
ついて、添付図面と共に詳細に説明する。図１は本発明
に係る基板接合用フィルムの一実施形態の斜視図を示
す。基板接合用フィルム１０は厚さ２００μｍ程度の薄
いフィルム体として形成するものであり、電気的絶縁性
を有するフィルム状の樹脂材１２を支持体とし、樹脂材
１２を厚さ方向に貫通して設けた接合孔１４内に接合用
金属１６を充填して成る多数個の導電部１８を平面配置
で縦横に配列して成る。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a perspective view of one embodiment of a film for bonding substrates according to the present invention. The substrate bonding film 10 is formed as a thin film having a thickness of about 200 μm, and is provided with a film-like resin material 12 having electrical insulation as a support and penetrating the resin material 12 in the thickness direction. A large number of conductive portions 18 formed by filling a joining metal 16 in the joining holes 14 are arranged vertically and horizontally in a planar arrangement.
【００１０】ここで、基板接合用フィルム１０を構成す
る電気的絶縁性を有する樹脂材１２は熱可塑性樹脂ある
いは半硬化状態で接着性を保持した状態（Ｂステージ）
に熱処理した熱硬化性樹脂であり、多層回路基板を形成
する際に加熱・加圧による接着性を保持していることが
特徴である。樹脂材１２の厚さもとくに限定されるもの
ではないが、一定の保形性を有するためある程度の厚さ
が必要であり、また、多層回路基板をコンパクトに形成
する目的から２００μｍ以下程度のものが有用である。Here, the resin material 12 having electrical insulating properties, which constitutes the substrate bonding film 10, is a thermoplastic resin or a state in which the adhesiveness is maintained in a semi-cured state (B stage).
It is a thermosetting resin that has been heat treated to a certain degree, and is characterized by maintaining adhesiveness by heating and pressing when forming a multilayer circuit board. The thickness of the resin material 12 is not particularly limited. However, a certain thickness is required for having a certain shape retention property, and a thickness of about 200 μm or less for the purpose of compactly forming a multilayer circuit board. Useful.
【００１１】基板接合用フィルム１０の導電部１８の寸
法および配置間隔、配置パターンは適宜設定することが
できるが、本実施形態の基板接合用フィルム１０では径
寸法５０μｍ、配置間隔１００μｍとしている。また、
導電部１８に使用する接合用金属１６は多層回路基板を
形成する際に隣接する回路基板の配線を電気的に接続す
るもので、この実施形態では低温で接続可能な錫−鉛合
金を使用している。接合用金属１６としては４００℃以
下程度の融点を有するものが有用である。Although the dimensions, arrangement intervals, and arrangement patterns of the conductive portions 18 of the substrate bonding film 10 can be set as appropriate, the substrate bonding film 10 of this embodiment has a diameter of 50 μm and an arrangement interval of 100 μm. Also,
The bonding metal 16 used for the conductive portion 18 electrically connects the wiring of the adjacent circuit boards when forming the multilayer circuit board. In this embodiment, a tin-lead alloy which can be connected at a low temperature is used. ing. A metal having a melting point of about 400 ° C. or less is useful as the bonding metal 16.
【００１２】基板接合用フィルム１０はあらかじめ配線
を形成した回路基板間に挟み、導電部１８を介して隣接
する回路基板の配線間を電気的に接続する。したがっ
て、導電部１８の配置位置は基板接合用フィルム１０を
介して接合する回路基板に設けた配線と位置合わせして
形成したものであっても良いし、図１に示すような所定
間隔で縦横配置したものを汎用的に使用することも可能
である。The substrate bonding film 10 is sandwiched between circuit boards on which wirings have been formed in advance, and electrically connects wirings of adjacent circuit boards via conductive portions 18. Therefore, the conductive portion 18 may be disposed at a position aligned with the wiring provided on the circuit board to be bonded via the substrate bonding film 10 or at a predetermined interval as shown in FIG. The arrangement can be used for general purposes.
【００１３】図２は基板接合用フィルム１０を用いて多
層回路基板を作製する方法を示す説明図である。図２
(a) は回路基板２０ａ、２０ｂの中間に基板接合用フィ
ルム１０を位置合わせして配置した状態を示す。この基
板接合用フィルム１０は隣接する回路基板２０ａ、２０
ｂに設けた配線２２の配置位置に合わせあらかじめ導電
部１８が形成されている。本実施形態の回路基板２０
ａ、２０ｂは基材として樹脂基板を使用し、樹脂基板の
両面に配線２２を設けたものである。基板の両面の配線
２２はスルーホール２４の内面に施しためっき導通部を
介して電気的に接続されている。FIG. 2 is an explanatory view showing a method of manufacturing a multilayer circuit board using the film 10 for bonding substrates. FIG.
(a) shows a state where the substrate bonding film 10 is positioned and arranged in the middle of the circuit boards 20a and 20b. This substrate bonding film 10 is connected to the adjacent circuit boards 20a, 20a.
The conductive portion 18 is formed in advance in accordance with the arrangement position of the wiring 22 provided in b. Circuit board 20 of the present embodiment
Reference numerals a and 20b denote resin substrates used as base materials and wirings 22 provided on both surfaces of the resin substrate. The wirings 22 on both sides of the substrate are electrically connected via a plating conductive portion provided on the inner surface of the through hole 24.
【００１４】回路基板２０ａ、２０ｂを一体化する際
は、基板接合用フィルム１０を回路基板２０ａ、２０ｂ
で挟圧し、加熱・加圧して樹脂材１２により回路基板２
０ａ、２０ｂを一体に接合するとともに、導電部１８を
溶融して対向する回路基板２０ａ、２０ｂの配線２２を
電気的に接続する。これによって、回路基板２０ａと回
路基板２０ｂの所要の配線２２が電気的に接続され、基
板全体として一体化された多層回路基板が得られる。図
２(b) が基板接合用フィルム１０によって形成された多
層回路基板である。When the circuit boards 20a and 20b are integrated, the board bonding film 10 is
And heat and pressurize the circuit board 2 with the resin material 12.
0a and 20b are integrally joined, and the conductive portion 18 is melted to electrically connect the wiring 22 of the opposing circuit boards 20a and 20b. As a result, the required wirings 22 of the circuit board 20a and the circuit board 20b are electrically connected, and a multilayer circuit board integrated as a whole board is obtained. FIG. 2B shows a multilayer circuit board formed by the substrate bonding film 10.
【００１５】このように基板接合用フィルム１０を用い
て多層回路基板を作製する方法は、基板間での電気的接
続が確実にかつ容易にできること、基板接合用フィルム
１０とは別体で形成した回路基板を使用するから、回路
基板の製法自体の困難性がなく、製造コストを低く抑え
ることができること、またきわめて信頼性の高い回路基
板として得られるから、多層形成した多層基板全体とし
ての歩留りを向上させることができるという利点があ
る。As described above, the method of manufacturing a multilayer circuit board using the substrate bonding film 10 is that the electrical connection between the substrates can be surely and easily performed, and that the substrate is formed separately from the substrate bonding film 10. Since a circuit board is used, there is no difficulty in the method of manufacturing the circuit board itself, and the manufacturing cost can be kept low.In addition, since a highly reliable circuit board can be obtained, the yield of the multilayer board formed as a whole is improved. There is an advantage that it can be improved.
【００１６】なお、図２に示した例では２枚の回路基板
２０ａ、２０ｂによって多層回路基板を構成している
が、基板接合用フィルム１０を使用して多層形成する方
法は、２枚の回路基板を使用する場合に限定されるもの
ではなく、３枚以上の多層に回路基板を積層し、回路基
板間に基板接合用フィルム１０を配置して、全体を加熱
・加圧することにより、さらに多層に形成することがで
きる。このように、多層に積層する場合は、各回路基板
間の電気的導通の確実性がより重要になるが、基板接合
用フィルム１０を用いて一体化する方法は歩留りの点で
とくに優れている。In the example shown in FIG. 2, a multilayer circuit board is constituted by two circuit boards 20a and 20b. The present invention is not limited to the case where a substrate is used, and a circuit board is laminated in three or more layers, a substrate bonding film 10 is arranged between the circuit boards, and the whole is heated and pressed to form a multilayer. Can be formed. As described above, in the case of laminating in multiple layers, the reliability of electrical conduction between the circuit boards becomes more important, but the method of integrating using the substrate bonding film 10 is particularly excellent in terms of yield. .
【００１７】次に、上記基板接合用フィルム１０の製造
方法について説明する。図３は基板接合用フィルム１０
の製造方法の一実施形態を示す説明図である。この実施
形態では、まず、図３(a) に示すように、銅箔３０の片
面に熱可塑性樹脂あるいはエポキシ樹脂等の熱硬化性樹
脂の樹脂材１２を所定の厚さに塗布し、片面が銅箔層の
樹脂フィルム３２を形成する。銅箔３０は電解めっきを
施す際のめっき給電層として使用するもので、後工程で
エッチングにより溶解除去するものである。したがっ
て、銅箔３０に限らず、容易にエッチング除去できる金
属であれば使用することができる。銅箔３０の厚さもエ
ッチングによって除去することを考慮して適宜設定す
る。Next, a method of manufacturing the film 10 for bonding a substrate will be described. FIG. 3 shows a film 10 for bonding substrates.
FIG. 4 is an explanatory view showing one embodiment of the manufacturing method of FIG. In this embodiment, first, as shown in FIG. 3 (a), a resin material 12 of a thermosetting resin such as a thermoplastic resin or an epoxy resin is applied to one side of a copper foil 30 to a predetermined thickness. A resin film 32 of a copper foil layer is formed. The copper foil 30 is used as a plating power supply layer when performing electrolytic plating, and is dissolved and removed by etching in a later step. Therefore, not only the copper foil 30 but also any metal that can be easily removed by etching can be used. The thickness of the copper foil 30 is also appropriately set in consideration of removal by etching.
【００１８】なお、この実施形態のように銅箔３０に樹
脂材１２を塗布するかわりに、既成の片面が金属箔であ
る樹脂フィルムを用いることもできる。樹脂材１２は基
板接合用フィルム１０の支持体となるものであるから、
一定の保形性が要請される。実施形態では１００μｍ程
度の厚さに設定した。また、樹脂材１２の機能として、
加熱・加圧によって回路基板を接合するための接着性が
要請される。エポキシ樹脂等の熱硬化性樹脂の場合に
は、熱処理により接着性を有する半硬化状態（Ｂステー
ジ）とする。Instead of applying the resin material 12 to the copper foil 30 as in this embodiment, an existing resin film having one surface made of a metal foil can be used. Since the resin material 12 serves as a support for the substrate bonding film 10,
A certain shape retention is required. In the embodiment, the thickness is set to about 100 μm. Also, as a function of the resin material 12,
Adhesiveness for joining circuit boards by heating and pressing is required. In the case of a thermosetting resin such as an epoxy resin, a semi-cured state (B stage) having adhesiveness by heat treatment is used.
【００１９】次に、上記樹脂フィルム３２の樹脂材１２
にレーザ光を照射し、前述した導電部１８を形成する部
位に接合孔１４を形成する（図３(b))。レーザ光を使用
して接合孔１４を形成する場合は、樹脂材１２の上方に
マスクを配置し、樹脂材１２にレーザ光を照射して銅箔
３０にまで達するように接合孔１４を形成する。なお、
接合孔１４を形成する方法としてレーザ光を使用する方
法の他に、化学的エッチング法によることも可能であ
る。化学的エッチング法による場合は、樹脂材１２の表
面を感光性レジストで被覆し、形成すべき接合孔１４の
パターンに従って露光・現像して接合孔１４を形成する
ことができる。Next, the resin material 12 of the resin film 32 is formed.
Is irradiated with a laser beam to form a bonding hole 14 at a position where the above-described conductive portion 18 is to be formed (FIG. 3B). When forming the bonding hole 14 using a laser beam, a mask is arranged above the resin material 12, and the resin material 12 is irradiated with laser light to form the bonding hole 14 so as to reach the copper foil 30. . In addition,
As a method for forming the bonding hole 14, a chemical etching method can be used instead of a method using laser light. In the case of using the chemical etching method, the surface of the resin material 12 is coated with a photosensitive resist, and the bonding hole 14 can be formed by exposing and developing according to the pattern of the bonding hole 14 to be formed.
【００２０】接合孔１４を形成した後、銅箔３０をめっ
き給電層として電解めっきを施すことにより、接合孔１
４内に接合用金属１６を盛り上げ、接合孔１４を接合用
金属１６で充填する（図３(c))。接合用金属１６として
は、前述したように、錫−鉛合金等の４００℃程度以下
で溶融する低融点金属を使用する。電解めっきにより接
合用金属１６を接合孔１４内に充填する場合は、図３
(c) に示すように樹脂材１２の上面と同一高さ位置、す
なわち接合孔１４の上端まで充填する。After the formation of the bonding hole 14, the copper foil 30 is used as a plating power supply layer and is subjected to electrolytic plating to thereby form the bonding hole 1
The joining metal 16 is raised in the inside 4 and the joining hole 14 is filled with the joining metal 16 (FIG. 3C). As described above, a low melting point metal such as a tin-lead alloy that melts at about 400 ° C. or less is used as the joining metal 16. In the case where the joining metal 16 is filled into the joining hole 14 by electrolytic plating, FIG.
As shown in (c), the resin material 12 is filled to the same height position as the upper surface, that is, to the upper end of the joining hole 14.
【００２１】次に、銅箔３０のみを選択的にエッチング
するエッチング液を使用して樹脂材１２の片面に被着し
ている銅箔３０のみを溶解除去する（図３(d))。こうし
て、接合孔１４の両端面で接合用金属１６が露出した導
電部１８が形成された基板接合用フィルム１０が得られ
る。本実施形態の製造方法によって得られた基板接合用
フィルム１０は接合孔１４内に接合用金属１６が充填さ
れて成る導電部１８が樹脂材１２によって支持されたも
のとなる。Next, only the copper foil 30 adhered to one surface of the resin material 12 is dissolved and removed using an etching solution for selectively etching only the copper foil 30 (FIG. 3 (d)). In this manner, the substrate bonding film 10 having the conductive portions 18 in which the bonding metal 16 is exposed at both end surfaces of the bonding hole 14 is obtained. The substrate bonding film 10 obtained by the manufacturing method of the present embodiment has a conductive portion 18 in which the bonding metal 16 is filled in the bonding hole 14 and is supported by the resin material 12.
【００２２】本実施形態の製造方法によって得られた基
板接合用フィルム１０はその製法上、導電部１８を微細
にかつ高密度に形成することが容易であり、微細な配線
を有する回路基板の接合にも好適に使用できること、製
造方法が容易でかつ確実であり、信頼性の高い基板接合
用フィルムとして提供できるといった利点を有してい
る。The substrate bonding film 10 obtained by the manufacturing method of this embodiment is easy to form the conductive portions 18 finely and densely because of its manufacturing method, and is suitable for bonding a circuit board having fine wiring. It is advantageous in that it can be suitably used, and that the production method is easy and reliable, and that it can be provided as a highly reliable substrate bonding film.
【００２３】図４は基板接合用フィルム１０の他の製造
方法を示す説明図である。この図４で示す基板接合用フ
ィルム１０は、導電部１８を構成する接合用金属１６を
上記実施形態のように錫−鉛合金といった１種類の接合
用金属１６によって構成するかわりに、導電部１８の芯
部分を銅材で構成したことを特徴とする。FIG. 4 is an explanatory view showing another method of manufacturing the film 10 for bonding substrates. The substrate bonding film 10 shown in FIG. 4 is different from the above-described embodiment in that the bonding metal 16 forming the conductive portion 18 is formed of one type of bonding metal 16 such as a tin-lead alloy as in the above-described embodiment. Is characterized in that the core portion is made of a copper material.
【００２４】図４(a) は樹脂材１２の片面に銅箔３０を
被着した樹脂フィルム３２を示す。図４(b) は樹脂フィ
ルム３２にレーザ光を照射する等の方法により樹脂材１
２に接合孔１４を形成した状態を示す。図４(c) は銅箔
３０をめっき給電層として電解めっき法により、接合孔
１４内に接合用金属１６を盛り上げ形成した状態を示
す。この電解めっきによる接合用金属１６を形成する操
作は、接合孔１４の深さ方向で底部部分近傍にのみ接合
用金属１６を盛り上げ形成する操作である。接合用金属
１６は前述した錫−鉛合金等の低融点金属による。FIG. 4A shows a resin film 32 in which a copper foil 30 is adhered to one surface of the resin material 12. FIG. 4B shows the resin material 1 formed by irradiating the resin film 32 with a laser beam or the like.
FIG. 2 shows a state in which the bonding holes 14 are formed. FIG. 4C shows a state in which the joining metal 16 is raised in the joining hole 14 by electrolytic plating using the copper foil 30 as a plating power supply layer. The operation of forming the joining metal 16 by the electrolytic plating is an operation of forming the joining metal 16 only near the bottom in the depth direction of the joining hole 14. The joining metal 16 is made of a low melting point metal such as the above-described tin-lead alloy.
【００２５】次いで、銅箔３０をめっき給電層として電
解銅めっきを施し、前記接合用金属１６の上に銅層３４
を盛り上げて形成する（図４(d))。この操作の際には、
銅層３４は接合孔１４の上端縁までは充填せず、接合用
金属１６を充填する空隙を設ける。図４(e) は、さらに
電解めっき法により銅層３４の上層に接合用金属１６を
形成した状態を示す。これにより、接合孔１４内の充填
金属は銅層３４が接合用金属１６によって挟まれた形態
となる。Next, electrolytic copper plating is performed using the copper foil 30 as a plating power supply layer, and a copper layer 34 is formed on the joining metal 16.
(FIG. 4D). During this operation,
The copper layer 34 does not fill up to the upper end edge of the bonding hole 14, but provides a gap for filling the bonding metal 16. FIG. 4E shows a state in which the bonding metal 16 is further formed on the copper layer 34 by electrolytic plating. As a result, the filling metal in the joining hole 14 has a form in which the copper layer 34 is sandwiched between the joining metals 16.
【００２６】次いで、銅箔３０のみを選択的にエッチン
グして溶解除去することにより基板接合用フィルム１０
を得る（図４(f))。得られた基板接合用フィルム１０
は、導電部１８が接合孔１４の内部が銅層３４によって
充填され接合孔１４の両端面に接合用金属１６が露出し
て形成されたものとなる。導電部１８の両端部に接合用
金属１６が設けられていることから、回路基板間にこの
基板接合用フィルム１０を配置して加熱・加圧すること
により接合用金属１６が溶融して配線間の電気的接続が
なされると同時に、導電部１８の銅層３４によって配線
間の電気的導通特性が向上するという利点と、銅層３４
は加熱・加圧の際に変形して流動したりすることがない
ことから、電気的接続部の保形性、接続信頼性を向上さ
せることができるという利点がある。Next, only the copper foil 30 is selectively etched to be dissolved and removed, thereby forming the substrate bonding film 10.
(FIG. 4 (f)). Obtained film 10 for bonding substrates
The conductive portion 18 is formed by filling the inside of the bonding hole 14 with the copper layer 34 and exposing the bonding metal 16 to both end surfaces of the bonding hole 14. Since the bonding metal 16 is provided at both ends of the conductive portion 18, the bonding metal 16 is melted by disposing the substrate bonding film 10 between the circuit boards and applying heat and pressure to melt the bonding metal 16 between the wirings. At the same time as the electrical connection is made, the copper layer 34 of the conductive portion 18 has the advantage of improving the electrical conduction characteristics between the wirings.
Since it does not deform and flow when heated and pressed, there is an advantage that the shape retention and connection reliability of the electrical connection can be improved.
【００２７】なお、本製造方法で接合孔１４の両端面に
形成する接合用金属１６は回路基板の配線と確実な電気
的接続を行うためのものであるから、電気的接続が確実
になされる厚さに設定すればよい。銅層３４はその目的
からはできるだけ厚い方が好ましいが、接合用金属１６
の接合性を考慮して設定することになる。Since the bonding metal 16 formed on both end surfaces of the bonding hole 14 in the present manufacturing method is for making a reliable electrical connection with the wiring of the circuit board, the electrical connection is made reliably. What is necessary is just to set to thickness. The copper layer 34 is preferably as thick as possible for the purpose.
Will be set in consideration of the joining properties of the two.
【００２８】[0028]
【実施例】以下、本発明に係る基板接合用フィルムの製
造方法の実施例について説明する。 （実施例１）１２μｍの厚さの銅箔上に約８０μｍの厚
さにエポキシ樹脂を塗布し、熱処理して接着性を有する
半硬化状態とすることにより、電気的絶縁性を有する樹
脂材の片面に銅箔を被着した樹脂フィルムを得た。この
樹脂フィルムの樹脂材に向けて紫外線レーザ光を照射
し、前記銅箔面まで達する径約８０μｍの接合孔を約１
００μｍの間隔で形成した。次いで、銅箔層をめっき給
電層として電解めっき法により錫−鉛共晶組成の合金を
接合孔内に盛り上げ形成し、接合孔を合金で充填した。EXAMPLES Examples of the method for producing a film for bonding substrates according to the present invention will be described below. Example 1 An epoxy resin is applied to a thickness of about 80 μm on a copper foil having a thickness of 12 μm, and is heat-treated to be in a semi-cured state having an adhesive property. A resin film having a copper foil adhered to one side was obtained. The resin material of the resin film is irradiated with an ultraviolet laser beam to form a bonding hole having a diameter of about 80 μm reaching the copper foil surface by about 1 μm.
It was formed at intervals of 00 μm. Next, an alloy of a tin-lead eutectic composition was raised in the joining hole by electrolytic plating using the copper foil layer as a plating power supply layer, and the joining hole was filled with the alloy.
【００２９】次に、アンモニウムイオン、塩素イオンお
よび銅錯体を主成分とするエッチング液で樹脂フィルム
を処理することにより、銅箔層を完全に溶解除去し、洗
浄、乾燥して基板接合用フィルムを得た。得られた基板
接合用フィルムは、Ｂステージの樹脂材に錫−鉛共晶合
金が接合孔内に充填されてなる導電部が支持されたフィ
ルム体として得られる。Next, the copper foil layer is completely dissolved and removed by treating the resin film with an etching solution containing ammonium ions, chloride ions and copper complexes as main components, and the film for substrate bonding is washed. Obtained. The obtained substrate bonding film is obtained as a film body in which a conductive portion formed by filling a bonding material with a tin-lead eutectic alloy in a resin material of the B stage in a bonding hole is supported.
【００３０】（実施例２）１２μｍの厚さの銅箔上に、
アルミナ粉を５０体積％混合したエポキシ樹脂を約５０
μｍの厚さで塗布し、樹脂層をＢステージ化（半硬化状
態）して片面が銅箔層の樹脂フィルムを作製する。この
樹脂フィルムの樹脂層にＣＯ2 レーザを使用して銅箔層
まで達する径約１００μｍの接合孔を形成する。(Example 2) On a copper foil having a thickness of 12 µm,
About 50% by volume of epoxy resin mixed with 50% alumina powder
It is applied in a thickness of μm, and the resin layer is B-staged (semi-cured state) to produce a resin film having a copper foil layer on one side. Using a CO 2 laser, a bonding hole having a diameter of about 100 μm reaching the copper foil layer is formed in the resin layer of the resin film.
【００３１】次いで、銅箔層をめっき給電層として電解
めっき法により錫−鉛共晶組成の合金を接合孔内に盛り
上げて形成し、接合孔を錫−鉛共晶合金で充填して導電
部を形成する。次いで、銅箔層のみをエッチング除去す
ることにより、電気的絶縁性を有する樹脂材を厚さ方向
に貫通して形成した導電部が所定間隔で設けられた基板
接合用フィルムを得た。Next, an alloy having a tin-lead eutectic composition is formed in the joining hole by electroplating using a copper foil layer as a plating power supply layer, and the joining hole is filled with a tin-lead eutectic alloy to form a conductive portion. To form Next, only the copper foil layer was removed by etching to obtain a substrate bonding film in which conductive portions formed by penetrating a resin material having electrical insulation in the thickness direction were provided at predetermined intervals.
【００３２】（実施例３）１８μｍの厚さの銅箔上に、
接着性を有する熱可塑性ポリイミドを約４０μｍの厚さ
に形成した片面が銅箔層の樹脂フィルムを作製する。こ
の樹脂フィルムの樹脂層に紫外線レーザを照射して銅箔
層まで達する径約５０μｍの孔を形成した。次いで、銅
箔層をめっき給電層として電解めっき法により錫鉛
（１：９）組成の合金を接合孔内に盛り上げて形成し、
接合孔を合金で充填して導電部を形成する。次いで、銅
箔層のみをエッチング除去することにより、電気的絶縁
性を有する樹脂層を厚さ方向に貫通した導電部が所定間
隔で設けられた基板接合用フィルムを得た。Example 3 On a copper foil having a thickness of 18 μm,
A resin film having a copper foil layer on one side, in which a thermoplastic polyimide having adhesiveness is formed to a thickness of about 40 μm, is prepared. The resin layer of the resin film was irradiated with an ultraviolet laser to form a hole having a diameter of about 50 μm reaching the copper foil layer. Next, an alloy having a tin-lead (1: 9) composition is formed in the joining hole by electroplating using the copper foil layer as a plating power supply layer,
The conductive hole is formed by filling the bonding hole with an alloy. Then, only the copper foil layer was removed by etching to obtain a substrate bonding film in which conductive portions penetrating a resin layer having electrical insulation in the thickness direction were provided at predetermined intervals.
【００３３】[0033]
【発明の効果】本発明に係る基板接合用フィルムは、層
間での電気的接続に好適に使用することができ、層間の
導体パターンを電気的に接続するフィルムとして好適に
使用することができる。また、本発明に係る基板接合用
フィルムの製造方法によれば、接合用フィルムの製造が
容易であり、高密度の配線に容易に対応した接合用フィ
ルムを得ることができる。また、本発明に係る多層回路
基板及び多層回路基板の製造方法によれば、信頼性の高
い製品として確実に提供することができ、製品製造の歩
留りを向上させることができる等の著効を奏する。The film for bonding a substrate according to the present invention can be suitably used for electrical connection between layers, and can be suitably used as a film for electrically connecting conductor patterns between layers. Further, according to the method for producing a film for bonding a substrate according to the present invention, the production of a film for bonding is easy, and a film for bonding which can easily cope with high-density wiring can be obtained. Further, according to the multilayer circuit board and the method of manufacturing the multilayer circuit board according to the present invention, it is possible to reliably provide a highly reliable product and to achieve a remarkable effect such as an improvement in product manufacturing yield. .
【図１】本発明に係る基板接合用フィルムの斜視図であ
る。FIG. 1 is a perspective view of a film for bonding substrates according to the present invention.
【図２】基板接合用フィルムを用いて多層回路基板を形
成する方法を示す説明図である。FIG. 2 is an explanatory view showing a method of forming a multilayer circuit board using a substrate bonding film.
【図３】基板接合用フィルムの製造方法を示す説明図で
ある。FIG. 3 is an explanatory view showing a method for producing a substrate bonding film.
【図４】基板接合用フィルムの製造方法を示す説明図で
ある。FIG. 4 is an explanatory view showing a method for producing a substrate bonding film.
１０ 基板接合用フィルム １２ 樹脂材 １４ 接合孔 １６ 接合用金属 １８ 導電部 ２０ａ、２０ｂ 回路基板 ２２ 配線 ２４ スルーホール ３０ 銅箔 ３２ 樹脂フィルム ３４ 銅層 REFERENCE SIGNS LIST 10 board bonding film 12 resin material 14 bonding hole 16 bonding metal 18 conductive part 20 a, 20 b circuit board 22 wiring 24 through hole 30 copper foil 32 resin film 34 copper layer
Claims (9)
を有するフィルム状に形成した樹脂材に、該樹脂材を厚
さ方向に貫通して形成した接合孔に融点４００℃以下の
接合用金属が充填されて形成された導電部が、所定間隔
で複数個設けられたことを特徴とする基板接合用フィル
ム。1. A bonding metal having a melting point of 400 ° C. or less in a bonding hole formed by penetrating the resin material in a thickness direction into a resin material formed into a film having adhesiveness by electrical insulation and heat treatment. A plurality of conductive portions formed by filling a plurality of conductive portions are provided at predetermined intervals.
合用金属が露出し、接合孔の内部に銅層が充填して設け
られたことを特徴とする請求項１記載の基板接合用フィ
ルム。2. The substrate bonding method according to claim 1, wherein the conductive portion is provided by exposing the bonding metal to both end surfaces of the bonding hole and filling a copper layer inside the bonding hole. For film.
を特徴とする請求項１または２記載の基板接合用フィル
ム。3. The film according to claim 1, wherein the bonding metal is a tin-lead alloy.
状態とした熱硬化性樹脂であることを特徴とする請求項
１、２または３記載の基板接合用フィルム。4. The substrate bonding film according to claim 1, wherein the resin material is a thermoplastic resin or a thermosetting resin in a semi-cured state.
硬化性樹脂の樹脂材の片面に金属箔が被着された、電気
的絶縁性及び加熱処理により接着性を有する樹脂フィル
ムを作製し、 前記樹脂材に前記金属箔を底部とする接合孔を所定配置
で複数個形成し、 前記金属箔をめっき給電層として電解めっきを施すこと
により、前記接合孔内に融点４００℃以下の接合用金属
を盛り上げて前記接合孔が前記接合用金属によって充填
された導電部を形成し、 前記金属箔をエッチングにより溶解除去することを特徴
とする基板接合用フィルムの製造方法。5. A resin film having an electrical insulating property and an adhesive property by heat treatment, wherein a metal foil is adhered to one side of a resin material of a thermoplastic resin or a thermosetting resin in a semi-cured state, A plurality of bonding holes having the metal foil as a bottom portion are formed in the resin material in a predetermined arrangement, and the metal foil is subjected to electrolytic plating as a plating power supply layer, so that a bonding metal having a melting point of 400 ° C. or less is formed in the bonding holes. Forming a conductive portion in which the bonding holes are filled with the bonding metal, and dissolving and removing the metal foil by etching.
硬化性樹脂の樹脂材の片面に金属箔が被着された、電気
的絶縁性及び加熱処理により接着性を有する樹脂フィル
ムを作製し、 前記樹脂材に前記金属箔を底部とする接合孔を所定配置
で複数個形成し、 前記金属箔をめっき給電層として、電解めっきを施すこ
とにより前記接合孔に融点４００℃以下の接合用金属を
盛り上げて充填し、 次に、電解銅めっきを施して、前記接合孔内の前記接合
用金属の上に銅層を盛り上げて形成し、 さらに、電解めっきにより前記銅層の上に前記接合用金
属を盛り上げて形成することによって、接合孔の内部が
銅層とし、接合孔の両端面に接合用金属が配置された導
電部を形成し、 前記金属箔をエッチングにより溶解除去することを特徴
とする基板接合用フィルムの製造方法。6. A resin film having an electrical insulating property and an adhesive property by heat treatment, wherein a metal foil is adhered to one surface of a resin material of a thermoplastic resin or a thermosetting resin in a semi-cured state, A plurality of bonding holes having the metal foil as a bottom portion are formed in the resin material in a predetermined arrangement, and the metal bonding foil having a melting point of 400 ° C. or less is formed by electroplating using the metal foil as a plating power supply layer. Next, electrolytic copper plating is performed to form a raised copper layer on the joining metal in the joining hole. Further, the joining metal is formed on the copper layer by electrolytic plating. By forming a conductive layer in which the inside of the bonding hole is a copper layer and the bonding metal is disposed on both end surfaces of the bonding hole, and dissolving and removing the metal foil by etching. Board bonding Manufacturing method of Lum.
特徴とする請求項５または６記載の基板接合用フィルム
の製造方法。7. The method according to claim 5, wherein a copper foil is used as the metal foil.
合用フィルムが回路基板間に介在して、前記回路基板に
設けた配線が前記導電部を介して層間で電気的に接続さ
れて成ることを特徴とする多層回路基板。8. The substrate bonding film according to claim 1, 2, 3 or 4, wherein the wiring provided on the circuit board is electrically connected between the layers via the conductive portion. A multilayer circuit board, comprising:
合用フィルムを回路基板間に配置し、 加熱・加圧することにより前記樹脂材を介して前記回路
基板を一体に接合するとともに、前記導電部を介して前
記回路基板の配線を層間で電気的に接続して多層形成す
ることを特徴とする多層回路基板の製造方法。9. The substrate bonding film according to claim 1, 2, 3, or 4, which is disposed between circuit boards, and the circuit boards are integrally bonded via the resin material by heating and pressing. A method for manufacturing a multilayer circuit board, comprising: forming a multilayer by electrically connecting wirings of the circuit board between layers through the conductive portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35083496A JPH10189096A (en) | 1996-12-27 | 1996-12-27 | Board junctioning film and its manufacture, multi-layer circuit board using it and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35083496A JPH10189096A (en) | 1996-12-27 | 1996-12-27 | Board junctioning film and its manufacture, multi-layer circuit board using it and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10189096A true JPH10189096A (en) | 1998-07-21 |
Family
ID=18413208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35083496A Pending JPH10189096A (en) | 1996-12-27 | 1996-12-27 | Board junctioning film and its manufacture, multi-layer circuit board using it and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10189096A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111202A (en) * | 2000-09-27 | 2002-04-12 | Ibiden Co Ltd | Interlayer connecting structure and its manufacturing method |
| WO2003007430A1 (en) * | 2001-07-09 | 2003-01-23 | Tokyo Electron Limited | Feed-through manufacturing method and feed-through |
-
1996
- 1996-12-27 JP JP35083496A patent/JPH10189096A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002111202A (en) * | 2000-09-27 | 2002-04-12 | Ibiden Co Ltd | Interlayer connecting structure and its manufacturing method |
| WO2003007430A1 (en) * | 2001-07-09 | 2003-01-23 | Tokyo Electron Limited | Feed-through manufacturing method and feed-through |
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