JPH10182792A - Epoxy resin molding material for sealing electronic part and electronic part - Google Patents
Epoxy resin molding material for sealing electronic part and electronic partInfo
- Publication number
- JPH10182792A JPH10182792A JP34924096A JP34924096A JPH10182792A JP H10182792 A JPH10182792 A JP H10182792A JP 34924096 A JP34924096 A JP 34924096A JP 34924096 A JP34924096 A JP 34924096A JP H10182792 A JPH10182792 A JP H10182792A
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- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- component
- content
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体封止用エポ
キシ樹脂成形材料、特に環境対応の観点から要求される
ノンハロゲン系の電子部品封止用エポキシ樹脂成形材料
で、耐湿性、耐リフロークラック性など厳しい信頼性を
要求されるＶＬＳＩの封止用に好適な成形材料及びその
成形材料で素子を封止した電子部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin molding material for encapsulating semiconductors, particularly a non-halogen epoxy resin molding material for encapsulating electronic parts required from the viewpoint of environmental friendliness. The present invention relates to a molding material suitable for sealing a VLSI requiring strict reliability and an electronic component in which an element is sealed with the molding material.
【０００２】[0002]
【従来の技術】従来から、トランジスタ、ＩＣなどの電
子部品封止の分野ではエポキシ樹脂成形材料が広く用い
られている。この理由としては、エポキシ樹脂が電気特
性、耐湿性、耐熱性、機械特性、インサート品との接着
性などの諸特性にバランスがとれているためである。こ
れらのエポキシ樹脂成形材料の難燃化は主にテトラブロ
モビスフェノールＡのジグリシジルエーテル等のブロム
化樹脂と酸化アンチモンの組合せにより行われている。2. Description of the Related Art Epoxy resin molding materials have been widely used in the field of sealing electronic components such as transistors and ICs. The reason for this is that the epoxy resin is balanced in various properties such as electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesiveness to insert products. Flame retardation of these epoxy resin molding materials is mainly carried out by a combination of a brominated resin such as diglycidyl ether of tetrabromobisphenol A and antimony oxide.
【０００３】[0003]
【発明が解決しようとする課題】近年、環境保護の観点
からダイオキシンの問題に端を発し、デカブロムをはじ
めハロゲン化樹脂についても規制の動きがある。同様に
アンチモン化合物も毒性面から規制の動きがあり、電子
部品封止用エポキシ樹脂成形材料についても脱ハロゲン
化（脱ブロム化）、脱アンチモン化の要求が出てきてい
る。また、プラスチック封止ＩＣの高温放置特性にブロ
ムイオンが悪影響を及ぼすことが知られており、この観
点からもブロム化樹脂量の低減が望まれている。本発明
はかかる状況に鑑みなされたもので、高温保管特性の優
れた電子部品封止用エポキシ樹脂材料を提供しようとす
るものである。In recent years, the problem of dioxin originated from the viewpoint of environmental protection, and there has been a movement to regulate halogenated resins such as decabrom. Similarly, antimony compounds are being regulated from the viewpoint of toxicity, and there is a demand for dehalogenation (debromination) and deantimony of epoxy resin molding materials for encapsulating electronic components. It is also known that bromide ions have an adverse effect on the high-temperature storage characteristics of plastic-sealed ICs. From this viewpoint, it is desired to reduce the amount of brominated resin. The present invention has been made in view of such circumstances, and has as its object to provide an epoxy resin material for electronic component sealing having excellent high-temperature storage characteristics.
【０００４】[0004]
【課題を解決するための手段】発明者らは上記の課題を
解決するために鋭意検討を重ねた結果、特定の燐化合物
及び窒素化合物を配合することにより上記の目的を達成
しうることを見いだし、本発明を完成するに至った。Means for Solving the Problems As a result of intensive studies to solve the above problems, the inventors have found that the above objects can be achieved by blending specific phosphorus compounds and nitrogen compounds. Thus, the present invention has been completed.
【０００５】すなわち、本発明は、 （１）（Ａ）１分子中に２個以上のエポキシ基を持つエ
ポキシ樹脂、（Ｂ）１分子中に２個以上のフェノール性
水酸基を持つ化合物、（Ｃ）次式（Ｉ）That is, the present invention relates to (1) (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxyl groups in one molecule, (C) ) The following formula (I)
【化２】 （Ｒは炭素数１〜４のアルキル基、Ａｒは芳香族環を示
す）で示される化合物、（Ｄ）窒素原子を１０重量％以
上含有する化合物、（Ｅ）無機充填剤を必須成分とする
成形材料であって、（Ｃ）成分と（Ｄ）成分の含有量
が、充填剤を除く配合成分の合計量に対してそれぞれ、
燐原子の量が０．２〜３．０重量％となる量、窒素原子
の量が０．２〜１０．０重量％となる量であり、（Ｅ）
成分の含有量が成形材料全体に対して７０重量％以上で
あることを特徴とする電子部品封止用エポキシ樹脂成形
材料、 （２）（Ｄ）成分がメラミンまたはメラミン誘導体であ
る上記（１）記載の電子部品封止用エポキシ樹脂成形材
料、 （３）（Ａ）成分のエポキシ樹脂が４，４’−ビス
（２，３−エポキシプロポキシ）−３，３’，５，５’
−テトラメチルビフェニルである上記（１）または
（２）記載の電子部品封止用エポキシ樹脂成形材料、 （４）上記（１）〜（３）記載のいずれかの電子部品封
止用エポキシ樹脂成形材料を使用して得られる電子部
品、である。Embedded image (R represents an alkyl group having 1 to 4 carbon atoms, Ar represents an aromatic ring), (D) a compound containing 10% by weight or more of a nitrogen atom, and (E) an inorganic filler as essential components. In the molding material, the content of the component (C) and the content of the component (D) are each based on the total amount of the compounding components excluding the filler.
(E) an amount in which the amount of phosphorus atoms is 0.2 to 3.0% by weight and an amount of nitrogen atoms is 0.2 to 10.0% by weight;
An epoxy resin molding material for sealing electronic parts, wherein the content of the component is 70% by weight or more based on the whole molding material. (2) The component (D) wherein the component (D) is melamine or a melamine derivative. (3) The epoxy resin of (A) component is 4,4′-bis (2,3-epoxypropoxy) -3,3 ′, 5,5 ′.
-The epoxy resin molding material for sealing electronic components according to the above (1) or (2), which is tetramethylbiphenyl; (4) the epoxy resin molding material for sealing electronic components according to any one of the above (1) to (3). Electronic components obtained using materials.
【０００６】[0006]
【発明の実施の形態】本発明において用いられる（Ａ）
成分のエポキシ樹脂としては、電子部品封止用エポキシ
樹脂成形材料で一般に使用されているもので特に限定は
ないが、たとえば、フェノールノボラック型エポキシ樹
脂、オルソクレゾールノボラック型エポキシ樹脂をはじ
めとするフェノール類とアルデヒド類のノボラック樹脂
をエポキシ化したもの、ビスフェノールＡ、ビスフェノ
ールＦ、ビスフェノールＳ、アルキル置換ビフェノール
などのジグリシジルエーテル、ジアミノジフェニルメタ
ン、イソシアヌル酸などのポリアミンとエピクロルヒド
リンの反応により得られるグリシジルアミン型エポキシ
樹脂、オレフィン結合を過酢酸などの過酸で酸化して得
られる線状脂肪族エポキシ樹脂、及び脂環族エポキシ樹
脂などがあり、これらを適宜何種類でも併用することが
できる。DETAILED DESCRIPTION OF THE INVENTION (A) used in the present invention
The epoxy resin of the component is not particularly limited as it is generally used in an epoxy resin molding material for sealing electronic components, and examples thereof include phenols such as phenol novolak epoxy resins and orthocresol novolac epoxy resins. Glycidylamine epoxy resin obtained by the reaction of epichlorohydrin with polyamines such as diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, and alkyl-substituted biphenols, diaminodiphenylmethane, isocyanuric acid, etc. And linear aliphatic epoxy resins and alicyclic epoxy resins obtained by oxidizing olefin bonds with a peracid such as peracetic acid. Any of these may be used in combination.
【０００７】上記に示したエポキシ樹脂の中で、４，
４’−ビス（２，３−エポキシプロポキシ）−３，
３’，５，５’−テトラメチルビフェニルなどのアルキ
ル置換ビフェノール型ジエポキシ樹脂を用いた場合、接
着性、吸湿性が良好であり、これにより耐リフロークラ
ック性及び耐湿性に優れた成形材料が得られる。このア
ルキル置換ビフェノール型ジエポキシ樹脂は、エポキシ
樹脂全量に対し６０重量％以上使用することが好まし
い。６０重量％未満では当該エポキシ樹脂の低吸湿性、
高接着性の特長が発揮されず、本発明の目的である耐は
んだ性に対して効果が小さいためである。当該エポキシ
樹脂としては、４，４’−ビスヒドロキシ３，３’，
５，５’−テトラメチルビフェニルをエピクロルヒドリ
ンを用いてエポキシ化して得られるものなどが上げられ
る。Among the epoxy resins shown above, 4,
4'-bis (2,3-epoxypropoxy) -3,
When an alkyl-substituted biphenol type diepoxy resin such as 3 ′, 5,5′-tetramethylbiphenyl is used, the adhesiveness and the hygroscopicity are good, whereby a molding material having excellent reflow crack resistance and moisture resistance is obtained. Can be The alkyl-substituted biphenol type diepoxy resin is preferably used in an amount of 60% by weight or more based on the total amount of the epoxy resin. If it is less than 60% by weight, the epoxy resin has low moisture absorption,
This is because the feature of high adhesiveness is not exhibited, and the effect of the present invention on the solder resistance is small. Examples of the epoxy resin include 4,4′-bishydroxy 3,3 ′,
Those obtained by epoxidizing 5,5′-tetramethylbiphenyl using epichlorohydrin, and the like can be mentioned.
【０００８】本発明において用いられる（Ｂ）成分の１
分子中に２個以上のフェノール性水酸基を有する化合物
としては、フェノール、クレゾール、キシレノール、レ
ゾルシン、カテコール、ビスフェノールＡ、ビスフェノ
ールＦなどのフェノール類又はα−ナフトール、β−ナ
フトール、ジヒドロキシナフタレン等のナフトール類と
ホルムアルデヒド、アセトアルデヒド、プロピオンアル
デヒド、ベンズアルデヒド、サリチルアルデヒド等のア
ルデヒド類とを酸性触媒下で縮合又は共縮合させて得ら
れる樹脂、ポリパラビニルフェノール樹脂、フェノール
類とジメトキシパラキシレンから合成されるキシリレン
基を有するフェノール・アラルキル樹脂などがあり、単
独又は２種類以上併用してもよい。[0008] One of the components (B) used in the present invention
Compounds having two or more phenolic hydroxyl groups in the molecule include phenols such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene and the like. Resin obtained by condensing or co-condensing aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde with an acidic catalyst, polyparavinylphenol resin, xylylene group synthesized from phenols and dimethoxyparaxylene And a phenol-aralkyl resin having the following formula. These may be used alone or in combination of two or more.
【０００９】（Ａ）成分のエポキシ樹脂と（Ｂ）成分の
フェノール化合物の当量比（（Ｂ）の水酸基数／（Ａ）
のエポキシ基数）は、特に限定はされないが、それぞれ
の未反応分を少なく抑えるために０．７〜１．３の範囲
に設定することが好ましい。The equivalent ratio of the epoxy resin (A) to the phenol compound (B) (the number of hydroxyl groups in (B) / (A))
Is not particularly limited, but is preferably set in the range of 0.7 to 1.3 in order to reduce the amount of each unreacted component.
【００１０】また、エポキシ樹脂とフェノール樹脂の硬
化反応を促進する硬化促進剤を必要に応じて使用するこ
とができる。この硬化促進剤としては、例えば、１，８
−ジアザビシクロ（５，４，０）ウンデセン−７などの
ジアザビシクロアルケン及びその誘導体、トリエチレン
ジアミン、ベンジルジメチルアミン、トリエタノールア
ミン、ジメチルアミノエタノール、トリス（ジメチルア
ミノメチル）フェノールなどの三級アミン類、２−メチ
ルイミダゾール、２−フェニルイミダゾール、２−フェ
ニル−４−メチルイミダゾール、２−ヘプタデシルイミ
ダゾールなどのイミダゾール類、トリブチルホスフィ
ン、メチルジフェニルホスフィン、トリフェニルホスフ
ィンなどの有機ホスフィン類、テトラフェニルホスホニ
ウム・テトラフェニルボレートなどのテトラ置換ホスホ
ニウム・テトラ置換ボレート、２−エチル−４−メチル
イミダゾール・テトラフェニルボレート、Ｎ−メチルモ
ルホリン・テトラフェニルボレートなどのテトラフェニ
ルボロン塩などがある。[0010] A curing accelerator for accelerating the curing reaction between the epoxy resin and the phenol resin can be used as required. As this curing accelerator, for example, 1,8
-Diazabicycloalkenes such as diazabicyclo (5,4,0) undecene-7 and derivatives thereof, and tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol and tris (dimethylaminomethyl) phenol Imidazoles such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole and 2-heptadecylimidazole; organic phosphines such as tributylphosphine, methyldiphenylphosphine and triphenylphosphine; and tetraphenylphosphonium. Tetra-substituted phosphonium / tetra-substituted borate such as tetraphenyl borate, 2-ethyl-4-methylimidazole / tetraphenyl borate, N-methylmorpholine / tetraf And the like tetraphenyl boron salts such as Niruboreto.
【００１１】本発明において用いられる（Ｃ）成分の燐
化合物は次式（Ｉ）The phosphorus compound (C) used in the present invention has the following formula (I)
【化３】 （Ｒは炭素数１〜４のアルキル基、Ａｒは芳香族環を示
す）で示される化合物であり、たとえば、次の式（II）
〜（VI）Embedded image (R represents an alkyl group having 1 to 4 carbon atoms, Ar represents an aromatic ring), for example, the following formula (II)
~ (VI)
【化４】 Embedded image
【化５】 Embedded image
【化６】 Embedded image
【化７】 Embedded image
【化８】 で示される化合物などが上げられる。Embedded image And the like.
【００１２】これらの燐化合物の添加量は、充填剤を除
く他の全配合成分に対して、０．２〜３．０重量％の範
囲内であることが必要である。０．２重量％より少ない
場合は難燃効果が発揮されず、３．０重量％を超えた場
合は耐湿性の低下や、成形時にこれらの燐化合物がしみ
出し、外観を阻害する。The amount of the phosphorus compound to be added must be in the range of 0.2 to 3.0% by weight based on all other components except the filler. When the amount is less than 0.2% by weight, the flame retardant effect is not exhibited, and when the amount exceeds 3.0% by weight, the moisture resistance is reduced and these phosphorus compounds exude at the time of molding to impair the appearance.
【００１３】本発明の（Ｄ）成分である１０重量％以上
窒素原子を含む窒素化合物としては、特に限定するもの
ではないが、メラミンまたはメラミン誘導体が好まし
い。その他、トリアジン環を有する化合物、シアヌル酸
誘導体、イソシアヌル酸誘導体等が上げられる。これら
の窒素含有化合物の添加量は、充填剤を除く他の全配合
成分に対して、０．２〜１０．０重量％の範囲内である
ことが必要である。０．２重量％より少ない場合は難燃
効果が発揮されず、１０．０重量％を超えた場合は吸水
率の増加が顕著になり、耐湿性の低下を生じる。好まし
くは０．５〜７．０重量％である。The nitrogen compound containing 10% by weight or more of a nitrogen atom, which is the component (D) of the present invention, is not particularly limited, but melamine or a melamine derivative is preferable. Other examples include compounds having a triazine ring, cyanuric acid derivatives, isocyanuric acid derivatives, and the like. The addition amount of these nitrogen-containing compounds must be in the range of 0.2 to 10.0% by weight based on all the other components except the filler. When the amount is less than 0.2% by weight, the flame retardant effect is not exhibited, and when the amount exceeds 10.0% by weight, the water absorption rate is remarkably increased, and the moisture resistance is lowered. Preferably it is 0.5 to 7.0% by weight.
【００１４】本発明においては、（Ｃ）成分の特定の燐
化合物と（Ｄ）成分の特定の窒素化合物を併用すること
で信頼性、成形性の優れたノンハロゲン、ノンアンチモ
ンの難燃性電子部品封止用エポキシ樹脂成形材料を提供
するものである。燐化合物と窒素化合物の併用が難燃化
に良いことは一般的に知られているが、本発明は、特に
半導体封止用エポキシ樹脂成形材料として、優れた信頼
性を発揮できる特定の燐化合物と窒素化合物の組合せ及
び量比を提供するものである。In the present invention, a non-halogen and non-antimony flame-retardant electronic component excellent in reliability and moldability is obtained by using a specific phosphorus compound (C) and a specific nitrogen compound (D) in combination. An object of the present invention is to provide an epoxy resin molding material for sealing. It is generally known that the combined use of a phosphorus compound and a nitrogen compound is good for flame retardancy. However, the present invention particularly relates to a specific phosphorus compound which can exhibit excellent reliability as an epoxy resin molding material for semiconductor encapsulation. And the combination and amount ratio of nitrogen compounds.
【００１５】また、充填剤としては吸湿性低減及び強度
向上の観点から無機充填剤を用いることが必要である。
本発明における（Ｅ）成分の無機質充填剤としては、溶
融シリカ、結晶シリカ、アルミナ、ジルコン、珪酸カル
シウム、炭酸カルシウム、炭化珪素、窒化ホウ素、ベリ
リア、ジルコニア、などの粉体、又はこれらを球形化し
たビーズ、チタン酸カリウム、炭化珪素、窒化珪素、ア
ルミナなどの単結晶繊維、ガラス繊維などを１種類以上
配合して用いることができる。さらに、難燃効果のある
無機充填剤としては水酸化アルミニウム、水酸化マグネ
シウム、硼酸亜鉛などが上げられ、これらを単独または
併用して用いることもできる。無機質充填剤の配合量と
しては、吸湿性、線膨張係数の低減及び強度向上の観点
から７０重量％以上が好ましい。上記の無機充填剤の中
で、線膨張係数低減の観点からは溶融シリカが、高熱伝
導性の観点からはアルミナが好ましく、充填剤形状は成
形時の流動性及び金型摩耗性の点から球形が好ましい。Further, it is necessary to use an inorganic filler as the filler from the viewpoint of reducing the hygroscopicity and improving the strength.
As the inorganic filler of the component (E) in the present invention, powders such as fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, boron nitride, beryllia, zirconia, and the like, or spherical particles thereof One or more kinds of beads, single crystal fibers such as potassium titanate, silicon carbide, silicon nitride, and alumina, and glass fibers can be used. Further, examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate and the like, and these can be used alone or in combination. The amount of the inorganic filler is preferably 70% by weight or more from the viewpoints of hygroscopicity, reduction of linear expansion coefficient and improvement of strength. Among the above-mentioned inorganic fillers, fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferred from the viewpoint of high thermal conductivity, and the filler shape is spherical from the viewpoint of fluidity during molding and mold abrasion. Is preferred.
【００１６】その他の添加剤として高級脂肪酸、高級脂
肪酸金属塩、エステル系ワックス、ポリオレフィン系ワ
ックスなどの離型剤、カーボンブラックなどの着色剤、
エポキシシラン、アミノシラン、ウレイドシラン、ビニ
ルシラン、アルキルシラン、有機チタネート、アルミニ
ウムアルコレートなどのカップリング剤などを用いるこ
とができる。Other additives include release agents such as higher fatty acids, metal salts of higher fatty acids, ester waxes, and polyolefin waxes; coloring agents such as carbon black;
Coupling agents such as epoxy silane, amino silane, ureido silane, vinyl silane, alkyl silane, organic titanate, and aluminum alcoholate can be used.
【００１７】本発明における成形材料は、各種原材料を
均一に分散混合できるのであれば、いかなる手法を用い
ても調製できるが、一般的な手法として、所定の配合量
の原材料をミキサー等によって十分混合した後、ミキシ
ングロール、押出機等によって溶融混練した後、冷却、
粉砕する方法を挙げることができる。The molding material in the present invention can be prepared by any method as long as the various raw materials can be uniformly dispersed and mixed. As a general method, the raw materials having a predetermined blending amount are sufficiently mixed by a mixer or the like. After mixing, melt-kneading with a mixing roll, extruder, etc., cooling,
A pulverizing method can be used.
【００１８】リードフレーム、配線済みのテープキャリ
ア、配線板、ガラス、シリコンウエハなどの支持部材
に、半導体チップ、トランジスタ、ダイオード、サイリ
スタなどの能動素子、コンデンサ、抵抗体、コイルなど
の受動素子等の素子を搭載し、必要な部分を本発明の封
止用成形材料で封止して、電子部品を製造することがで
きる。このような電子部品としては、たとえば、テープ
キャリアにバンプで接続した半導体チップを、本発明の
成形材料で封止したＴＣＰを挙げることができる。ま
た、配線板やガラス上に形成した配線に、ワイヤーボン
ディング、フリップチップボンディング、はんだなどで
接続した半導体チップ、トランジスタ、ダイオード、サ
イリスタなどの能動素子及び／又はコンデンサ、抵抗
体、コイルなどの受動素子を、本発明の成形材料で封止
したＣＯＢモジュール、ハイブリッドＩＣ、マルチチッ
プモジュールなどを挙げることができる。電子部品を封
止する方法としては、低圧トランスファー成形法が最も
一般的であるが、インジェクション成形法、圧縮成形法
等を用いてもよい。A support member such as a lead frame, a wired tape carrier, a wiring board, glass, or a silicon wafer is provided with active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils. An electronic component can be manufactured by mounting the element and sealing a necessary portion with the molding material for sealing of the present invention. An example of such an electronic component is a TCP in which a semiconductor chip connected to a tape carrier by a bump is sealed with the molding material of the present invention. Also, active elements such as semiconductor chips, transistors, diodes, thyristors, and / or passive elements such as capacitors, resistors, and coils are connected to wiring formed on a wiring board or glass by wire bonding, flip chip bonding, soldering, or the like. , A COB module, a hybrid IC, a multi-chip module, and the like, which are sealed with the molding material of the present invention. As a method of sealing the electronic component, a low-pressure transfer molding method is the most common, but an injection molding method, a compression molding method, or the like may be used.
【００１９】[0019]
【実施例】次に実施例により本発明を説明するが、本発
明の範囲はこれらの実施例に限定されるものではない。Next, the present invention will be described with reference to examples, but the scope of the present invention is not limited to these examples.
【００２０】実施例１〜１７ エポキシ当量２００、軟化点６７℃のクレゾールノボラ
ック型エポキシ樹脂、エポキシ当量１８８、融点１０６
℃のビフェニル骨格型エポキシ樹脂（油化シェルエポキ
シ製；エピコートＹＸ−４０００Ｈ）、エポキシ当量３
７５、軟化点８０℃、臭素含量４８重量％の臭素化ビス
フェノールＡ型エポキシ樹脂、水酸基当量１０６、軟化
点８３℃のフェノールノボラック樹脂、水酸基当量１６
７、軟化点７０℃のフェノール・アラルキル樹脂（三井
東圧製；ミレックスＸＬ−２２５）、トリフェニルホス
フィン、カルナバワックス、三酸化アンチモン、カーボ
ンブラック、カップリング剤としてγ−グリシドキシプ
ロピルトリメトキシシラン、溶融シリカ及び本発明の
（Ｃ）成分として表１に示す燐化合物１〜５、本発明の
（Ｄ）成分として窒素含有量６７重量％のメラミン（窒
素化合物１）と窒素含有量１４重量％の１，３，５−ト
リグリシジルイソシアヌレート（窒素化合物２）を、表
２、表３に示す重量比で配合し、混練温度８０〜９０
℃、混練時間１０分の条件でロール混練を行い、実施例
１〜１７の成形材料を作製した。Examples 1 to 17 Cresol novolak type epoxy resin having an epoxy equivalent of 200 and a softening point of 67 ° C., an epoxy equivalent of 188 and a melting point of 106
Biphenyl skeleton type epoxy resin (manufactured by Yuka Shell Epoxy; Epicoat YX-4000H), epoxy equivalent 3
75, a brominated bisphenol A type epoxy resin having a softening point of 80 ° C and a bromine content of 48% by weight, a hydroxyl equivalent of 106, a phenol novolak resin having a softening point of 83 ° C, and a hydroxyl equivalent of 16
7. A phenol aralkyl resin having a softening point of 70 ° C. (Mitsui Toatsu; Millex XL-225), triphenylphosphine, carnauba wax, antimony trioxide, carbon black, γ-glycidoxypropyltrimethoxysilane as a coupling agent , Fused silica and phosphorus compounds 1 to 5 shown in Table 1 as component (C) of the present invention, melamine (nitrogen compound 1) having a nitrogen content of 67% by weight as component (D) of the present invention, and a nitrogen content of 14% by weight Of 1,3,5-triglycidyl isocyanurate (nitrogen compound 2) at a weight ratio shown in Tables 2 and 3 and a kneading temperature of 80 to 90
Roll kneading was performed at 10 ° C. and a kneading time of 10 minutes to produce molding materials of Examples 1 to 17.
【００２１】[0021]
【表１】 [Table 1]
【００２２】[0022]
【表２】 [Table 2]
【００２３】[0023]
【表３】 [Table 3]
【００２４】比較例１〜７ 難燃剤として、従来積層板等で用いられているトリフェ
ニルホスフェートと本発明の（Ｄ）成分に相当する窒素
化合物１、あるいは、ブロム化エポキシ樹脂と三酸化ア
ンチモンを組合せて用い、実施例と同様に表４に示す配
合で、比較例１〜７の成形材料を作製した。Comparative Examples 1 to 7 Triphenyl phosphate and nitrogen compound 1 corresponding to the component (D) of the present invention, or a brominated epoxy resin and antimony trioxide were used as flame retardants. The molding materials of Comparative Examples 1 to 7 were produced in the same manner as in the examples and with the formulations shown in Table 4 in combination.
【００２５】[0025]
【表４】 [Table 4]
【００２６】表５〜７に実施例及び比較例で得られた成
形材料の特性を、表８に特性評価法の詳細を示す。Tables 5 to 7 show the properties of the molding materials obtained in Examples and Comparative Examples, and Table 8 shows details of the property evaluation method.
【００２７】[0027]
【表５】 [Table 5]
【００２８】[0028]
【表６】 [Table 6]
【００２９】[0029]
【表７】 [Table 7]
【００３０】[0030]
【表８】 [Table 8]
【００３１】本発明における（Ｃ）成分を含有しない比
較例２〜４では、外観、熱時硬度、耐湿性が劣り、
（Ｃ）成分と（Ｄ）成分をともに含まない比較例５〜７
では、高温放置特性が劣っている。両者をともに含むが
（Ｃ）成分の含有量が本発明の限定からはずれる比較例
１では、外観、熱時硬度、耐湿性、高温放置特性の全て
が悪い。In Comparative Examples 2 to 4 which do not contain the component (C) in the present invention, the appearance, the hardness when heated and the moisture resistance are inferior.
Comparative Examples 5 to 7 containing neither component (C) nor component (D)
Are inferior in high-temperature storage characteristics. In Comparative Example 1, which contains both, but the content of the component (C) is out of the limitation of the present invention, all of the appearance, the hardness at the time of heating, the moisture resistance, and the high-temperature storage characteristics are poor.
【００３２】これに対して、（Ａ）〜（Ｅ）成分を全て
含み、すなわち、難燃剤として特定の燐化合物（Ｃ）及
び窒素化合物（Ｄ）を配合し、成分含量が本発明の限定
を満たす実施例１〜１７は、外観、熱時硬度、耐湿性、
高温放置特性のいずれも良好であり、難燃性も全てＶ−
０と良好である。On the other hand, all of the components (A) to (E) are contained, that is, a specific phosphorus compound (C) and a nitrogen compound (D) are blended as a flame retardant, and the content of the components limits the present invention. Examples 1 to 17 satisfying are appearance, hardness when heated, moisture resistance,
All of high temperature storage characteristics are good, and all flame retardancy is V-
0 and good.
【００３３】[0033]
【発明の効果】本発明によって得られる電子部品封止用
エポキシ樹脂成形材料は実施例で示したようにノンハロ
ゲン、ノンアンチモンで難燃化を達成でき、これを用い
てＩＣ、ＬＳＩなどの電子部品を封止すれば成形性が良
好であり、耐湿性、高温放置特性などの信頼性に優れた
製品を得ることができ、その工業的価値は大である。The epoxy resin molding material for encapsulating electronic parts obtained by the present invention can achieve flame retardancy with non-halogen and non-antimony as shown in the examples, and is used for electronic parts such as ICs and LSIs. Is sealed, the product is excellent in moldability, and a product having excellent reliability such as moisture resistance and high-temperature storage characteristics can be obtained, and its industrial value is great.
Claims (4)
持つエポキシ樹脂 （Ｂ）１分子中に２個以上のフェノール性水酸基を持つ
化合物 （Ｃ）次式（Ｉ） 【化１】 （Ｒは炭素数１〜４のアルキル基、Ａｒは芳香族環を示
す）で示される化合物 （Ｄ）窒素原子を１０重量％以上含有する化合物 （Ｅ）無機充填剤 を必須成分とする成形材料であって、（Ｃ）成分と
（Ｄ）成分の含有量が、充填剤（Ｅ）を除く配合成分の
合計量に対してそれぞれ、燐原子の量が０．２〜３．０
重量％となる量、窒素原子の量が０．２〜１０．０重量
％となる量であり、（Ｅ）成分の含有量が成形材料全体
に対して７０重量％以上であることを特徴とする電子部
品封止用エポキシ樹脂成形材料。(A) an epoxy resin having two or more epoxy groups in one molecule; (B) a compound having two or more phenolic hydroxyl groups in one molecule; and (C) a compound having the following formula (I). ] (R represents an alkyl group having 1 to 4 carbon atoms, Ar represents an aromatic ring) (D) a compound containing 10% by weight or more of a nitrogen atom (E) an inorganic filler Wherein the content of the component (C) and the content of the component (D) are each such that the amount of the phosphorus atom is 0.2 to 3.0 with respect to the total amount of the components except the filler (E).
%, The amount of nitrogen atoms is 0.2 to 10.0% by weight, and the content of the component (E) is 70% by weight or more based on the whole molding material. Epoxy resin molding materials for encapsulating electronic components.
体である請求項１記載の電子部品封止用エポキシ樹脂成
形材料。2. The epoxy resin molding material for sealing electronic parts according to claim 1, wherein the component (D) is melamine or a melamine derivative.
ス（２，３−エポキシプロポキシ）−３，３’，５，
５’−テトラメチルビフェニルである請求項１または請
求項２記載の電子部品封止用エポキシ樹脂成形材料。3. The epoxy resin as component (A) is 4,4'-bis (2,3-epoxypropoxy) -3,3 ', 5.
The epoxy resin molding material for sealing electronic parts according to claim 1 or 2, which is 5'-tetramethylbiphenyl.
品封止用エポキシ樹脂成形材料を使用して得られる電子
部品。4. An electronic component obtained by using the epoxy resin molding material for sealing electronic components according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34924096A JP3257426B2 (en) | 1996-12-27 | 1996-12-27 | Epoxy resin molding material for sealing electronic parts and electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34924096A JP3257426B2 (en) | 1996-12-27 | 1996-12-27 | Epoxy resin molding material for sealing electronic parts and electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10182792A true JPH10182792A (en) | 1998-07-07 |
| JP3257426B2 JP3257426B2 (en) | 2002-02-18 |
Family
ID=18402434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34924096A Expired - Lifetime JP3257426B2 (en) | 1996-12-27 | 1996-12-27 | Epoxy resin molding material for sealing electronic parts and electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3257426B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000026318A1 (en) * | 1998-10-30 | 2000-05-11 | Mitsui Chemicals Inc. | Adhesive composition |
| JP2000290470A (en) * | 1999-04-05 | 2000-10-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP2001164094A (en) * | 1999-12-08 | 2001-06-19 | Fujitsu Ltd | Halogen-free flame retardant insulating epoxy resin composition and circuit board comprising insulating layer formed from the same |
| WO2002024808A1 (en) * | 2000-09-25 | 2002-03-28 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing |
| WO2002090439A1 (en) * | 2001-05-02 | 2002-11-14 | Daihachi Chemical Industry Co., Ltd. | Flame-retardant resin composition |
| JP2011246545A (en) * | 2010-05-25 | 2011-12-08 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8159442B2 (en) | 2005-09-16 | 2012-04-17 | Sharp Kabushiki Kaisha | Liquid crystal display device |
-
1996
- 1996-12-27 JP JP34924096A patent/JP3257426B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000026318A1 (en) * | 1998-10-30 | 2000-05-11 | Mitsui Chemicals Inc. | Adhesive composition |
| JP2000290470A (en) * | 1999-04-05 | 2000-10-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
| JP4513136B2 (en) * | 1999-04-05 | 2010-07-28 | 住友ベークライト株式会社 | Epoxy resin composition and semiconductor device |
| JP2001164094A (en) * | 1999-12-08 | 2001-06-19 | Fujitsu Ltd | Halogen-free flame retardant insulating epoxy resin composition and circuit board comprising insulating layer formed from the same |
| US6486235B2 (en) * | 1999-12-08 | 2002-11-26 | Fujitsu Limited | Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH) |
| US6916539B2 (en) | 1999-12-08 | 2005-07-12 | Fujitsu Limited | Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| JP4633214B2 (en) * | 1999-12-08 | 2011-02-16 | 富士通株式会社 | Epoxy resin composition |
| WO2002024808A1 (en) * | 2000-09-25 | 2002-03-28 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing |
| US7544727B2 (en) | 2000-09-25 | 2009-06-09 | Hitachi Chemical Co., Ltd. | Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate |
| WO2002090439A1 (en) * | 2001-05-02 | 2002-11-14 | Daihachi Chemical Industry Co., Ltd. | Flame-retardant resin composition |
| JP2011246545A (en) * | 2010-05-25 | 2011-12-08 | Hitachi Chem Co Ltd | Epoxy resin composition for sealing and electronic part device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3257426B2 (en) | 2002-02-18 |
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