JPH10176971A - Apparatus for testing performance of electrostatic chuck - Google Patents
Apparatus for testing performance of electrostatic chuckInfo
- Publication number
- JPH10176971A JPH10176971A JP33793196A JP33793196A JPH10176971A JP H10176971 A JPH10176971 A JP H10176971A JP 33793196 A JP33793196 A JP 33793196A JP 33793196 A JP33793196 A JP 33793196A JP H10176971 A JPH10176971 A JP H10176971A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- electrostatic chuck
- pressure
- amount
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Examining Or Testing Airtightness (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は静電チャックの性能
試験機における吸着状態および吸着力を簡易的に且つ定
量的に検出する性能試験装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a performance test apparatus for simply and quantitatively detecting a suction state and a suction force in a performance test machine for an electrostatic chuck.
【０００２】[0002]
【従来の技術】従来は、静電チャックの吸着状態や吸着
力等の性能を簡易的且つ定量的に試験、検査するための
試験装置が存在せず入手不可能であったために、静電チ
ャックを使用する製品本体に静電チャックの性能未確認
状態での直接組み込みを余儀なくされており、製品組み
込み後に所定の性能を発揮しないことが発覚して、分解
と再組込みを繰り返し実施せざるを得ないこと、或は静
電チャックの不具合部分が特定できないために、同種ト
ラブルを繰り返すこと、等の不合理な状況となってい
た。2. Description of the Related Art Conventionally, there has been no test equipment for simply and quantitatively testing and inspecting the performance of an electrostatic chuck, such as the state of suction and the suction force, and it has not been available. It is inevitable to directly install the electrostatic chuck in the product body using the product without confirming the performance, and it has been found that the specified performance is not exhibited after the product is assembled, and it is necessary to repeatedly disassemble and reassemble That is, the problem is that it is not possible to identify a defective portion of the electrostatic chuck, so that the same kind of trouble is repeated.
【０００３】[0003]
【発明が解決しようとする課題】本発明の目的は、静電
チャックの用途に要求される性能を簡易的に且つ定量的
に組み込み前に良品と不良品の選別や、不良品の不良部
分の特定をすることにあり、製品が静電チャック以外の
多種多様な機能を保有しているが故に非常に複雑な機構
となっている場合の不良発覚に基づく分解、再組立等の
時間的浪費を排除すること、並びに、製品への組み込み
後では不良部分を定量的に検出出来ない事象の、吸着面
の部分からのガス漏れ量の検出や、吸着力の検出を可能
にして、その結果を解析することによって静電チャック
の技術的改良等の手段を提供することにある。SUMMARY OF THE INVENTION It is an object of the present invention to easily and quantitatively integrate the performance required for the use of an electrostatic chuck between a non-defective product and a defective product before assembling the same, and to detect a defective portion of the defective product. In order to specify, the product has various functions other than the electrostatic chuck, so if it has a very complicated mechanism, the time wasted in disassembling and reassembling based on the detection of defects. Eliminating and detecting the amount of gas leakage from the adsorption surface and the adsorption power of events where defective parts cannot be quantitatively detected after being incorporated into the product, and analyzing the results Accordingly, it is an object of the present invention to provide means for technical improvement of the electrostatic chuck.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
に、静電チャックの性能に影響する環境条件、即ち温度
環境や気圧環境及び電気環境を使用する製品の環境条件
に一致可能なように自在調整できる構造とし、且つ静電
チャックの着脱の容易性や、後述の他の目的が達成し易
いように真空室の内部を透視可能にしたものである。In order to achieve the above object, an environmental condition affecting the performance of an electrostatic chuck, that is, a temperature environment, a pressure environment, and an environment environment of a product using an electric environment can be matched. The inside of the vacuum chamber is made transparent so that the structure can be freely adjusted and the electrostatic chuck can be easily attached and detached and other objects described later can be easily achieved.
【０００５】上記他の目的である静電チャックの不良部
分検出の第一点目の、ガス漏れ量の定量的な検出をする
ために、一般に用いられるガス流量計、例えばマスフロ
ーコントローラは、流量制御機能が流量指令によっての
定流量制御方式故に、本発明の目的とする未知の流量計
測には不適切であるが、マスフローコントローラの精密
に且つ安定したガス流量供給性能を巧みに利用、即ち流
量制御の目標値を流量とせずに、他の事象、即ちガスを
供給した場合に発生する圧力変動モードを目標値に置き
換えて、いわゆる閉回路自動制御動作（ＰＩＤ動作）の
機能を付加することによって、ガス漏れ量を定量的に計
測出来る用にしたものである。In order to quantitatively detect the amount of gas leakage, which is the first point in detecting a defective portion of the electrostatic chuck, which is another object, a gas flow meter generally used, for example, a mass flow controller, controls the flow rate. Since the function is a constant flow control method based on the flow command, it is not suitable for unknown flow measurement intended for the present invention. However, the precise and stable gas flow supply performance of the mass flow controller is skillfully used, that is, flow control. Instead of using the target value as a flow rate, by replacing another event, that is, a pressure fluctuation mode generated when gas is supplied, with a target value, and adding a function of a so-called closed-circuit automatic control operation (PID operation), It is intended to be able to quantitatively measure the amount of gas leakage.
【０００６】不良部分の検出の第二点目の、吸着力の定
量的な検出をするためには、例えば前記のマスフローコ
ントローラから 前記ガス漏れ量以上のガス量を吸着部
分に継続的に流し入れたとすると、ガス系内圧力が次第
に上昇して吸着物は吸着力に耐えきれずに剥離して圧力
は急降下するはずで、この剥離する瞬間の圧力が即ち吸
着力であるので この圧力を検知すればよく、吸着物が
剥離する前後の圧力の変動モードを検知しその最大圧力
に剥離面積を乗ずることによって吸着力を定量的に検出
するようにしたものである。In order to quantitatively detect the adsorbing force, which is the second point in detecting a defective portion, for example, it is assumed that a gas amount equal to or larger than the gas leakage amount is continuously flown into the adsorbing portion from the mass flow controller. Then, the pressure in the gas system gradually rises, and the adsorbate will not be able to withstand the adsorbing force and will peel off, and the pressure should drop sharply.Since the pressure at the moment of this peeling is the adsorbing force, if this pressure is detected, In this method, the pressure fluctuation mode before and after the adsorbate is separated is detected, and the adsorption force is quantitatively detected by multiplying the maximum pressure by the separation area.
【０００７】[0007]
【発明の実施の形態】以下、本発明の一実施例を図１、
図２、により説明する。BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described with reference to FIG.
【０００８】図１は静電チャックの全体の構成を示す図
で、同図において、真空容器１は台座２の上にＯリング
３を介して単に自重のみで据置してあり、台座２には被
試験体である静電チャック４が取付ネジ５によって取付
出来るようにしてあると同時に、冷却媒体ガス用の配管
６や真空室７を真空引きするための真空配管８が固定し
てとりつけてある。また台座２自体には冷却液槽９が設
けてあって冷却機１０からの冷却液が循環できるように
配管１１が固定して取り付けてある。また前記の配管６
にはガス量を制御して供給するマスフローコントローラ
（以下ＭＦＣと記す）１２に接続してあり その途中に
は配管６の管内圧力を検知するための電圧出力付きの真
空計１３が設けてあって、真空計１３から出力される電
圧は配線にてガス漏検出部１４に接続するとともにガス
漏検出部１４からＭＦＣ１２が制御できるように配線し
てある。尚、前記の静電チャック４には被吸着物の例え
ばウエハ１５が置けるようにしてあり、ウエハ１５の外
周には適当な隙間をもって数本の絶縁材の柱を立てたウ
エハガイド１６が設けてあって、後述の吸着力試験時等
に於けるウエハのずれを防止する役目する。真空室７の
真空引きは真空ポンプ１７によって行い、静電気の発生
用の電源は直流電源１８を用い、その電圧出力部の陽極
と陰極は片方はウエハ１５へ、一方は静電チャック４
へ、それぞれ配線の接続と切り放しが容易なようにワン
タッチ方式（例えば鰐口クリップを用いた接続）によっ
て接続してあり、この直流電源１８は出力電圧が任意に
設定出来るものにしてあり、且つ陽極と陰極の変更も自
由におこなえるものとしてある。FIG. 1 is a view showing the overall configuration of an electrostatic chuck. In FIG. 1, a vacuum vessel 1 is mounted on a pedestal 2 only by its own weight via an O-ring 3. At the same time, the electrostatic chuck 4 to be tested can be mounted with the mounting screw 5, and at the same time, a pipe 6 for cooling medium gas and a vacuum pipe 8 for evacuating the vacuum chamber 7 are fixedly attached. . Further, the base 2 itself is provided with a cooling liquid tank 9, and a pipe 11 is fixedly attached so that the cooling liquid from the cooling device 10 can be circulated. In addition, the aforementioned pipe 6
Is connected to a mass flow controller (hereinafter referred to as MFC) 12 for controlling and supplying a gas amount. A vacuum gauge 13 with a voltage output for detecting the pressure in the pipe 6 is provided in the middle of the controller. The voltage output from the vacuum gauge 13 is connected to the gas leak detection unit 14 by wiring, and is wired so that the MFC 12 can be controlled from the gas leak detection unit 14. It is to be noted that the electrostatic chuck 4 is adapted to place an object to be attracted, for example, a wafer 15, and a wafer guide 16 having a plurality of columns of insulating material provided at an outer periphery of the wafer 15 with an appropriate gap. This serves to prevent the wafer from being displaced at the time of an attraction force test described later. The vacuum chamber 7 is evacuated by a vacuum pump 17, a DC power supply 18 is used as a power supply for generating static electricity, and one of an anode and a cathode of a voltage output portion thereof is connected to the wafer 15, and one is an electrostatic chuck 4.
Are connected by a one-touch method (for example, connection using a crocodile clip) so that connection and disconnection of wiring are easy. The cathode can be changed freely.
【０００９】以上の構成によって以下に動作機能を説明
する。尚、ガス漏検出部１４の動作機能については図２
に基いて説明する。The operation of the above configuration will be described below. The operation function of the gas leak detector 14 is shown in FIG.
It will be described based on FIG.
【００１０】図１の真空容器１は透明な硝子製であるの
で真空室７の内部の様子は目視にて十分に透視可能であ
るとともに、Ｏリング３の上に据置してあるので真空室
７が大気圧となっている時には人手によって容易に取り
外しが可能で、真空容器１を据置きした状態で真空ポン
プ１７を動作させて真空引きを開始すると、真空室７は
次第に負圧が大きくなって真空容器１は大気との差圧に
よって台座２に押しつけられ、Ｏリング３は圧縮され、
その圧縮量は真空度に比例して大きくなって気密性を増
すことになり、Ｏリング３の部分からの真空漏れはなく
目的の真空度を得ることができる。勿論、静電チャック
４の取付や取り外しは、真空室７を大気圧にして真空容
器１を取り除いて取付ネジ５により行える。静電チャッ
ク４を取り付けた後の動作は目的に応じてその操作手順
を選択して行うことになる（例えば、試験環境を大気圧
で常温としたときには真空ポンプ１７と冷却機１０は動
作させずに行う）が、以下では説明の便宜上真空中で且
つ氷点下の環境でのガス漏れ量と吸着力を検出する場合
の一連の動作の説明の中でそれぞれの動作の説明をす
る。Since the vacuum vessel 1 shown in FIG. 1 is made of transparent glass, the inside of the vacuum chamber 7 can be sufficiently seen through the naked eye, and the vacuum chamber 7 is mounted on the O-ring 3 so that the vacuum chamber 7 When the vacuum pressure is at atmospheric pressure, the vacuum chamber 7 can be easily removed by hand. When the vacuum pump 17 is operated and vacuum evacuation is started with the vacuum vessel 1 set, the vacuum pressure in the vacuum chamber 7 gradually increases. The vacuum vessel 1 is pressed against the pedestal 2 by a pressure difference from the atmosphere, and the O-ring 3 is compressed.
The amount of compression increases in proportion to the degree of vacuum, and the airtightness increases, so that a desired degree of vacuum can be obtained without vacuum leakage from the O-ring 3. Of course, the attachment and detachment of the electrostatic chuck 4 can be performed by using the attachment screws 5 with the vacuum chamber 7 at atmospheric pressure and the vacuum vessel 1 removed. The operation after attaching the electrostatic chuck 4 is performed by selecting the operation procedure according to the purpose (for example, when the test environment is at atmospheric pressure and normal temperature, the vacuum pump 17 and the cooler 10 are not operated. However, each operation will be described below in a series of operations for detecting a gas leakage amount and an adsorbing force in an environment under a vacuum and below freezing point for convenience of explanation.
【００１１】先ず、真空室７を真空引きするために真空
ポンプ１７を動作させて目的の真空度に到達させ、次い
で静電チャック４を冷却するために冷却機１０を動作さ
せて目的の温度に設定して冷却を開始する。尚、前記の
設定温度が氷点以下では静電チャック４および冷却液槽
９内は当然氷点以下の温度になるが、真空室７は真空で
あるので真空室７を経由しての温度伝達はされず、また
台座１は断熱に有効な樹脂材を使用してＯリング３も断
熱性の高いゴム製のものを使用してあるので真空容器１
の温度は氷点以下には至らず、透視性を阻害する結氷現
象は発生しない。勿論、真空室７が大気圧で冷却した場
合には結氷することになるが、この場合は真空にする必
要がないので、真空容器１を取り除いた状態にしておけ
ばよい。前記冷却開始後、静電チャックの温度が設定温
度に到達したら、直流電源１８を動作させて目的とする
電圧値に設定してウエハ１５と静電チャック４に電圧を
印加する。電圧を印加すると静電チャック４の所定の機
能の吸着力が発生してウエハ１５は吸着されるはずであ
る。ウエハ１５が吸着されたかどうかの目視確認はこの
ままではできないが、後述の吸着力の検出時に可能であ
る。First, a vacuum pump 17 is operated to evacuate the vacuum chamber 7 to reach a desired degree of vacuum, and then a cooler 10 is operated to cool the electrostatic chuck 4 to a desired temperature. Set and start cooling. When the set temperature is below the freezing point, the temperature inside the electrostatic chuck 4 and the cooling liquid tank 9 is naturally below the freezing point. However, since the vacuum chamber 7 is a vacuum, the temperature is transmitted through the vacuum chamber 7. The base 1 is made of a resin material effective for heat insulation, and the O-ring 3 is made of rubber having high heat insulation.
Does not fall below the freezing point, and the freezing phenomenon that hinders transparency does not occur. Of course, if the vacuum chamber 7 is cooled at atmospheric pressure, ice will form. However, in this case, there is no need to apply a vacuum, so that the vacuum vessel 1 may be removed. When the temperature of the electrostatic chuck reaches the set temperature after the start of the cooling, the DC power supply 18 is operated to set a target voltage value, and a voltage is applied to the wafer 15 and the electrostatic chuck 4. When a voltage is applied, a suction force of a predetermined function of the electrostatic chuck 4 is generated, and the wafer 15 should be sucked. Visual confirmation of whether or not the wafer 15 has been sucked cannot be made as it is, but it can be made at the time of detecting a sucking force described later.
【００１２】上記静電吸着状態にしておいてガス漏れ検
出をおこなうことになるが、ガス漏れ量の検出は前述し
たように、ガス供給手段として一般に使用されるＭＦＣ
の機能の定流量制御機能に新たな機能を付加することに
よって目的を達成するようにしたもので、図２を用いて
その動作を説明する。図２に示した部品のうち、図１と
同じ部品には同じ名称が記してある。まず説明の便宜上
一般のＭＦＣの機能を説明すると、供給を得たいガス流
量ＱとＭＦＣに指令する指令電圧Ｖとの相関関係が予め
明らかにして、Ｖ＝Ｑとなるような制御で、 Ｑ ＝−Ｋｐ（Ｖ＋１／Ｔ１∫Ｖｄｔ＋Ｔｄ ｄｖ／ｄ
ｔ） と表され（但し Ｋｐ．Ｔ１．Ｔｄ は常数）、この制
御はいわゆる閉回路自動制御（以下ＰＩＤ制御と記す）
と称される公知の制御であるが、ＰＩＤ制御は制御の目
標値Ｑが定まった値であるのに対して本発明の対象とす
るガス漏れ量Ｑｑは定まった値ではないので、当然なが
ら指令電圧Ｖを定めることは出来ず、従ってＭＦＣの制
御機能のみでは使用には不適切ということになる。然る
に、求めたいガス漏れ量Ｑｑは未知量なるも、静電チャ
ック４の物理的変化がない限り一定であるはずで、例え
ばガス供給量Ｑとガス漏れ量Ｑｑとの関係が Ｑ＞Ｑｑ
のときガス供給系の圧力Ｐは次第に上昇し、逆に Ｑ
＜Ｑｑ のときには圧力Ｐは次第に減少することにな
り、言い替えれば、Ｑ＝Ｑｑ を継続して維持し続けた
ときの流量Ｑが求める漏れ量Ｑｑということになる。更
に言い替えると、ガス供給経路内の圧力Ｐが維持継続し
たときの流量Ｑが求めるガス漏れ量Ｑｑということにな
り、圧力Ｐを検知しながら指令電圧Ｖを変化させて圧力
Ｐの継続変化しない状態を見いだすような制御機能を設
けたものが制御部１９である。従ってガス漏検出部１４
はＭＦＣ１２の機能である定流量制御機能に新たに定圧
力制御機能を付加した制御部１９を設けたことになり、
目標とする圧力をガス漏検出部１４に設定して動作させ
れば、設定圧力におけるガス漏れ量を検出することがで
きる。勿論、設定圧力の大きさによって検出するガス漏
れ量は異なるので、目的に応じた圧力を設定することに
なる。Gas leak detection is performed in the above-mentioned electrostatic adsorption state. As described above, the gas leak amount is detected by the MFC which is generally used as a gas supply means.
The purpose is achieved by adding a new function to the constant flow control function of the above function. The operation of the function will be described with reference to FIG. 2, the same components as those in FIG. 1 have the same names. First, the function of a general MFC will be described for convenience of explanation. The correlation between the gas flow rate Q to be supplied and the command voltage V for commanding the MFC is clarified in advance, and the control is performed so that V = Q. −Kp (V + 1 / T1∫Vdt + Td dv / d
t) (where Kp.T1.Td is a constant), and this control is so-called automatic closed-circuit control (hereinafter referred to as PID control).
Although the PID control is a known control, the target value Q of the control is a fixed value, whereas the gas leakage amount Qq targeted by the present invention is not a fixed value. The voltage V cannot be determined, so that the use of only the control function of the MFC is inappropriate for use. Although the gas leakage amount Qq to be obtained is unknown, it should be constant unless there is a physical change in the electrostatic chuck 4. For example, the relationship between the gas supply amount Q and the gas leakage amount Qq is Q> Qq.
, The gas supply system pressure P gradually increases, and conversely Q
When <Qq, the pressure P gradually decreases. In other words, the flow rate Q when Q = Qq is continuously maintained is the required leakage amount Qq. In other words, the flow rate Q when the pressure P in the gas supply path continues to be maintained is the required gas leakage amount Qq, and the command voltage V is changed while the pressure P is being detected so that the pressure P does not change continuously. The control unit 19 is provided with a control function for finding such a function. Therefore, the gas leak detector 14
Means that a control unit 19 in which a constant pressure control function is newly added to the constant flow rate control function, which is a function of the MFC 12, is provided.
If the target pressure is set in the gas leak detector 14 and operated, the gas leak amount at the set pressure can be detected. Of course, the amount of gas leakage to be detected varies depending on the magnitude of the set pressure, so that the pressure should be set according to the purpose.
【００１３】次ぎに、吸着力の検出の動作について説明
する。ガス漏検出部１４の機能は上述したように、設定
圧力Ｐが継続的に変化しない状態を見い出す機能である
ので、設定圧力Ｐの値をガス漏れ量Ｑｑを検出するとき
の圧力より比較的に大きく設定して動作させると、設定
圧力Ｐを目標にしてガス供給し続けてガス供給経路内の
圧力が次第に高くなり、もし静電チャックの吸着力以上
の圧力に到達したとすると、設定圧力Ｐに到達すること
なくウエハ１５は剥離することになる。ウエハ１５が剥
離するとガス供給経路内のガスは瞬時に真空室７に放出
されると同時に、圧力も瞬時に降下するので、このウエ
ハ１５が剥離する前後の圧力変動状態を認識して、その
最大値を検出すれば吸着力は容易に求めることができ
る。即ち、検出した最大圧力値にウエハ１５の接ガス部
分の面積を乗ずればその結果が求める静電チャックの吸
着力である。Next, the operation of detecting the attraction force will be described. As described above, the function of the gas leak detection unit 14 is a function of finding a state in which the set pressure P does not continuously change. Therefore, the value of the set pressure P is set to be relatively larger than the pressure at which the gas leak amount Qq is detected. When the operation is performed with a large setting, the gas in the gas supply path continues to be supplied with the set pressure P as a target, and the pressure in the gas supply path gradually increases. , The wafer 15 is peeled off. When the wafer 15 peels off, the gas in the gas supply path is instantaneously released into the vacuum chamber 7 and the pressure also drops instantaneously. If the value is detected, the attraction force can be easily obtained. That is, if the detected maximum pressure value is multiplied by the area of the gas contact portion of the wafer 15, the result is the suction force of the electrostatic chuck.
【００１４】[0014]
【発明の効果】本発明の効果は、静電チャックを用途先
の複雑な部分に取り付けることなく、事前静電チャック
の性能を把握出来ることにより、用途先での性能に関し
ての不具合が発生しないので、その不具合に基ずく分解
や再組立等の不合理な作業およびその時間浪費を解消で
きる。また、上記性能に関しては定量的に把握すること
ができるので、不具合の再発防止や静電チャックの技術
的な改良或いは研究に寄与することができる。The effect of the present invention is that since the performance of the electrostatic chuck can be grasped in advance without attaching the electrostatic chuck to a complicated portion of the application destination, there is no problem regarding the performance at the application destination. In addition, irrational work such as disassembly and reassembly based on the defect and wasted time can be eliminated. Further, since the above performance can be quantitatively grasped, it is possible to prevent a recurrence of a defect and to contribute to technical improvement or research of the electrostatic chuck.
【００１５】技術的な改良或いは研究への寄与は、上述
のガス漏れ量の検出や吸着力の検出のほかに、例えば供
給ガスに有色ガスを用いればガス漏れの部分を特定する
ことができるし、真空容器の上方に例えば非接触式の赤
外線温度計を設置すれば、ウエハの冷却温度分布を把握
することができる等の寄与効果が挙げられる。A technical improvement or contribution to research is that, in addition to the above-described detection of the amount of gas leakage and detection of the adsorption force, for example, if a colored gas is used as a supply gas, a portion of the gas leakage can be specified. If, for example, a non-contact type infrared thermometer is installed above the vacuum vessel, a contribution effect such as the ability to grasp the cooling temperature distribution of the wafer can be obtained.
【図１】静電チャックの簡易性能試験機の全体構成図。FIG. 1 is an overall configuration diagram of a simple performance tester for an electrostatic chuck.
【図２】ガス漏検出部の機能図。FIG. 2 is a functional diagram of a gas leak detection unit.
１…真空容器、２…台座、３…Ｏリング、４…静電チャ
ック、５…取付ネジ、６…配管、７…真空室、８…真空
配管、９…冷却液槽、１０…冷却器、１１…配管、１２
…マスフローコントローラ、１３…真空計、１４…ガス
漏検出部、１５…ウエハ、１６…ウエハガイド、１７…
真空ポンプ、１８…直流電源、１９…制御部、Ｖ…指令
電圧、Ｑ…ガス流量、Ｑｑ…ガス漏れ量、Ｐ…圧力。DESCRIPTION OF SYMBOLS 1 ... Vacuum container, 2 ... Pedestal, 3 ... O ring, 4 ... Electrostatic chuck, 5 ... Mounting screw, 6 ... Piping, 7 ... Vacuum chamber, 8 ... Vacuum piping, 9 ... Coolant tank, 10 ... Cooler, 11 ... piping, 12
... Mass flow controller, 13 ... Vacuum gauge, 14 ... Gas leak detector, 15 ... Wafer, 16 ... Wafer guide, 17 ...
Vacuum pump, 18 DC power supply, 19 control unit, V command voltage, Q gas flow rate, Qq gas leakage amount, P pressure.
Claims (2)
と、真空容器とＯリングを介して組み合わせることによ
って真空室を形成できるようにした被試験品としての静
電チャックの取付用の台座と、静電チャックの冷却配管
系および冷却機と、静電チャックの吸着物を冷却するた
めに静電チャックと吸着物の吸着面間に冷却媒体ガスを
封入するためのガス配管系およびガス流量制御器とから
成る静電チャック性能試験装置において、冷却媒体ガス
が漏洩する量を検知するためにガスの流量を制御するマ
スフローコントローラの流量指定に応じたガス供給量を
制御する手段と、不確定のガス漏洩量を検出する手段と
を有することによって冷却媒体ガスの漏洩量を計測する
ことを特徴とする静電チャックの性能試験装置。A pedestal for mounting an electrostatic chuck as a device under test, wherein a vacuum chamber made of glass having a transparent lower opening and a vacuum chamber can be formed by combining the vacuum vessel with an O-ring. A cooling piping system and a cooling device for the electrostatic chuck, and a gas piping system and a gas flow rate for filling a cooling medium gas between the electrostatic chuck and the suction surface of the suction object for cooling the suction object of the electrostatic chuck. A controller for controlling a gas supply amount according to a flow rate designation of a mass flow controller for controlling a gas flow rate in order to detect a leakage amount of a coolant gas in an electrostatic chuck performance test apparatus comprising a controller; A means for detecting the amount of gas leakage of the cooling medium, thereby measuring the amount of leakage of the cooling medium gas.
物を吸着する力を定量的に把握するために、冷却媒体ガ
スを封入することによって生ずるガス圧力変動の変動モ
ードを認識することによって吸着力を検出する手段を設
けたことを特徴とする静電チャックの性能試験装置。2. The tester according to claim 1, wherein the electrostatic chuck chucks a cooling medium gas to recognize a suction mode by quantitatively determining a suction force of the electrostatic chuck. An electrostatic chuck performance test apparatus, comprising: means for detecting a force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33793196A JPH10176971A (en) | 1996-12-18 | 1996-12-18 | Apparatus for testing performance of electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33793196A JPH10176971A (en) | 1996-12-18 | 1996-12-18 | Apparatus for testing performance of electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10176971A true JPH10176971A (en) | 1998-06-30 |
Family
ID=18313352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33793196A Pending JPH10176971A (en) | 1996-12-18 | 1996-12-18 | Apparatus for testing performance of electrostatic chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10176971A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184850A (en) * | 2000-12-19 | 2002-06-28 | Rohm Co Ltd | Method for controlling wafer temperature in processing system |
| US6695946B2 (en) * | 2001-04-18 | 2004-02-24 | Applied Materials Inc. | Cooling system |
| US6913670B2 (en) | 2002-04-08 | 2005-07-05 | Applied Materials, Inc. | Substrate support having barrier capable of detecting fluid leakage |
| JP2006086301A (en) * | 2004-09-15 | 2006-03-30 | Ngk Insulators Ltd | System and method for valuation of electrostatic chuck |
| KR100829391B1 (en) | 2003-12-31 | 2008-05-13 | 동부일렉트로닉스 주식회사 | Gas pressure manintainer for semiconductor process |
| CN100416252C (en) * | 2005-12-09 | 2008-09-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for detecting leak rate of air passage cabinet of etching machine |
| JP2013124994A (en) * | 2011-12-16 | 2013-06-24 | Als Technology Co Ltd | Glove box device |
-
1996
- 1996-12-18 JP JP33793196A patent/JPH10176971A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184850A (en) * | 2000-12-19 | 2002-06-28 | Rohm Co Ltd | Method for controlling wafer temperature in processing system |
| US6695946B2 (en) * | 2001-04-18 | 2004-02-24 | Applied Materials Inc. | Cooling system |
| US6913670B2 (en) | 2002-04-08 | 2005-07-05 | Applied Materials, Inc. | Substrate support having barrier capable of detecting fluid leakage |
| KR100829391B1 (en) | 2003-12-31 | 2008-05-13 | 동부일렉트로닉스 주식회사 | Gas pressure manintainer for semiconductor process |
| JP2006086301A (en) * | 2004-09-15 | 2006-03-30 | Ngk Insulators Ltd | System and method for valuation of electrostatic chuck |
| CN100416252C (en) * | 2005-12-09 | 2008-09-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for detecting leak rate of air passage cabinet of etching machine |
| JP2013124994A (en) * | 2011-12-16 | 2013-06-24 | Als Technology Co Ltd | Glove box device |
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