JPH10163588A - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH10163588A JPH10163588A JP32241996A JP32241996A JPH10163588A JP H10163588 A JPH10163588 A JP H10163588A JP 32241996 A JP32241996 A JP 32241996A JP 32241996 A JP32241996 A JP 32241996A JP H10163588 A JPH10163588 A JP H10163588A
- Authority
- JP
- Japan
- Prior art keywords
- alignment mark
- transparent
- color
- circuit board
- transparent film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板面にＩＣチッ
プ等の部品を実装する際に位置合せのために用いられる
画像認識用の位置合せマークを基板面に形成した回路基
板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board having an alignment mark for image recognition used for alignment when mounting a component such as an IC chip on a substrate surface. .
【０００２】[0002]
【従来の技術】画像認識装置を備えた自動部品搭載機を
用いて回路基板にＩＣチップをワイヤボンディングやフ
リップチップボンディング等で実装する場合には、基板
とＩＣチップとの位置合せを行うために、基板表面に画
像認識用の位置合せマークを形成し、この位置合せマー
クをＣＣＤカメラ等の画像認識装置で認識することで、
基板座標を検出し、これを基準にしてＩＣチップを位置
合せして実装するようにしている。ここで使用する位置
合せマークは、基板表面に印刷・焼成する表層導体パタ
ーンと同じ導体ペーストを用いて同時に印刷・焼成して
形成することで、工程数を増加させることなく、位置合
せマークを精度良く形成するようにしている。従って、
導体材料として例えばＡｇ系導体を使用する場合には、
位置合せマークの色がＡｇ系金属色（黒灰色）になるは
ずであるが、その表面には焼結により微細な金属の凹凸
が無数に出来るため、その表面で光が無数に乱反射し、
その散乱光によって位置合せマークの表面が白みがかっ
て見え、外観上は灰白色となってしまう。2. Description of the Related Art When an IC chip is mounted on a circuit board by wire bonding or flip chip bonding using an automatic component mounting machine equipped with an image recognition device, it is necessary to align the substrate with the IC chip. By forming alignment marks for image recognition on the substrate surface and recognizing the alignment marks with an image recognition device such as a CCD camera,
The substrate coordinates are detected, and the IC chip is aligned and mounted based on the detected coordinates. The alignment marks used here are formed by simultaneously printing and firing using the same conductive paste as the surface conductor pattern to be printed and fired on the substrate surface, so that the alignment marks can be accurately formed without increasing the number of processes. It is formed well. Therefore,
For example, when using an Ag-based conductor as the conductor material,
The color of the alignment mark should be an Ag-based metal color (black-gray), but the surface can countlessly have irregularities of fine metal by sintering.
The surface of the alignment mark looks whitish due to the scattered light, and the appearance becomes grayish white.
【０００３】一方、基板特性として、耐熱性、低熱膨張
率化等が要求される場合に用いられるセラミック回路基
板の色は、一般に白色系であるため、このセラミック回
路基板の表面に位置合せマークを形成する場合には、基
板表面と位置合せマークの双方の色が白色系となって、
両者間の色のコントラストが小さくなり、位置合せマー
クの画像を正確に認識できない場合がある。On the other hand, the color of a ceramic circuit board used when heat resistance, a low coefficient of thermal expansion or the like is required as a board characteristic is generally white, so that an alignment mark is provided on the surface of the ceramic circuit board. When forming, both the color of the substrate surface and the alignment mark become white,
In some cases, the color contrast between the two becomes small, and the image of the alignment mark cannot be accurately recognized.
【０００４】そこで、従来より、基板表面と位置合せマ
ークとの間の色のコントラストを大きくするために、次
の〜のいずれかの方法が採用されている。In order to increase the color contrast between the substrate surface and the alignment mark, any one of the following methods has conventionally been employed.
【０００５】図２に示すように、セラミック回路基板
１１の表面のうちの、位置合せマーク１２を形成する部
分に、予め位置合せマーク１２よりも大きい黒色の抵抗
体１３を印刷し、その上に位置合せマーク１２を導体ペ
ーストで印刷する。As shown in FIG. 2, a black resistor 13 larger than the alignment mark 12 is printed on a portion of the surface of the ceramic circuit board 11 where the alignment mark 12 is to be formed. The alignment mark 12 is printed with a conductive paste.
【０００６】図３に示すように、セラミック回路基板
１４を着色したセラミック材料で形成し、その表面に位
置合せマーク１５を導体ペーストで印刷する。As shown in FIG. 3, a ceramic circuit board 14 is formed of a colored ceramic material, and an alignment mark 15 is printed on the surface thereof with a conductive paste.
【０００７】特開昭６０−１２１７９３号公報に示す
ように、基板表面に導体ペーストで印刷した位置合せマ
ークの上とその周辺部分に半透明の有色誘電体ガラスを
印刷する。これにより、位置合せマークの周辺の基板
（白地）の色をガラス色に見せる共に、位置合せマーク
の色を、その地色（導体）とガラス色とを混合した黒色
系の濃い色に見せる。As shown in Japanese Patent Application Laid-Open No. Sho 60-121793, a semi-transparent colored dielectric glass is printed on an alignment mark printed with a conductive paste on the substrate surface and on the periphery thereof. As a result, the color of the substrate (white background) around the alignment mark looks like a glass color, and the color of the alignment mark looks like a dark black color that is a mixture of the ground color (conductor) and the glass color.
【０００８】自動部品搭載機では、透過光を使ってコ
ントラストを大きくしたり、位置合せマークの表面で反
射される外部光の影響を偏光フィルタを用いて少なくす
る。In an automatic component mounting machine, the contrast is increased by using transmitted light, and the influence of external light reflected on the surface of the alignment mark is reduced by using a polarizing filter.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、上記
，のように、位置合せマーク１２の下側に抵抗体１
３を印刷したり着色セラミック回路基板を使用すること
は、コストアップにつながる。また、上記のように、
位置合せマーク上に半透明有色の誘電体ガラスを印刷す
る方法では、ガラスの膜厚が厚くなったり、ガラスの着
色剤配合量が多くなると、ガラスの色が濃くなって位置
合せマーク自体がほやけてしまい、却って画像認識精度
が低下してしまう。従って、ガラスの膜厚のばらつきや
着色剤配合量のばらつきの影響を受けやすく、工程管理
が面倒である。However, as described above, the resistor 1 is located below the alignment mark 12.
Printing 3 or using a colored ceramic circuit board leads to an increase in cost. Also, as mentioned above,
In the method of printing a semi-transparent colored dielectric glass on the alignment mark, as the thickness of the glass increases or the amount of the coloring agent in the glass increases, the color of the glass becomes darker, and the alignment mark itself becomes almost invisible. It will burn out, and on the contrary, the image recognition accuracy will be reduced. Therefore, it is easily affected by variations in the thickness of the glass and variations in the compounding amount of the coloring agent, and the process management is troublesome.
【００１０】一方、上記のように、透過光を使用する
方法は、基板の多層化により光が基板を透過しにくくな
るため、積層数の多い多層基板には適用できない。しか
も、画像認識装置の偏光フィルタの感度調整が非常に微
妙であり、これを適正に調整するのが容易ではない。On the other hand, as described above, the method using transmitted light cannot be applied to a multi-layer substrate having a large number of stacked layers because light is difficult to transmit through the substrate due to the multi-layered substrate. Moreover, the sensitivity adjustment of the polarizing filter of the image recognition device is very delicate, and it is not easy to properly adjust the sensitivity.
【００１１】本発明はこのような事情を考慮してなされ
たものであり、従ってその目的は、低コスト化の要求を
満たしつつ、基板と位置合せマークとの間の色のコント
ラストを確実に大きくすることができると共に、製造ば
らつきによるコントラストの低下を回避できて、位置合
せマークの画像認識精度を確実に向上できる回路基板を
提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and accordingly, it is an object of the present invention to surely increase the color contrast between a substrate and an alignment mark while satisfying the demand for cost reduction. It is another object of the present invention to provide a circuit board which can avoid a decrease in contrast due to manufacturing variations and can surely improve the image recognition accuracy of the alignment mark.
【００１２】[0012]
【課題を解決するための手段】上記目的を達成するため
に、本発明の請求項１の回路基板は、位置合せマーク
を、基板面に導体で形成すると共に、該位置合せマーク
の表面に透明被膜を形成したものである。このもので
は、位置合せマークの表面での光の乱反射が該表面を覆
う透明被膜によって効果的に抑えられる。これにより、
位置合せマークの真上から画像認識装置で認識される位
置合せマークの色が導体の金属そのものの色となり、位
置合せマークと基板面との色のコントラストが大きくな
る。このような透明被膜による光学的な効果は、透明被
膜の膜厚のばらつきの影響を受けず、安定して得られ
る。In order to achieve the above object, a circuit board according to a first aspect of the present invention has an alignment mark formed of a conductor on a substrate surface and a transparent mark formed on a surface of the alignment mark. A film was formed. In this case, irregular reflection of light on the surface of the alignment mark is effectively suppressed by the transparent coating covering the surface. This allows
The color of the alignment mark recognized by the image recognition device from directly above the alignment mark becomes the color of the conductor metal itself, and the color contrast between the alignment mark and the substrate surface increases. The optical effect of such a transparent film can be stably obtained without being affected by variations in the thickness of the transparent film.
【００１３】この場合、請求項２のように、透明被膜を
透明ガラス又は透明樹脂により形成すると良い。透明ガ
ラスや透明樹脂は、従来コントラストを大きくするため
に用いられていた抵抗体材料や着色セラミックと比較し
て安価であるため、低コスト化の要求も満たされる。In this case, it is preferable that the transparent film is formed of transparent glass or transparent resin. Transparent glass and transparent resin are inexpensive as compared with resistor materials and colored ceramics which have been conventionally used to increase contrast, so that the requirement for cost reduction is also satisfied.
【００１４】[0014]
【発明の実施の形態】以下、本発明の一実施形態を図１
に基づいて説明する。セラミック回路基板２１の表面、
即ちＩＣチップ等の部品を実装する側の基板面には、表
層導体パターン（図示せず）が例えばＡｇ、Ａｇ／Ｐ
ｔ、Ａｇ／Ｐｄ、Ａｕ等の導体ペーストを用いて印刷・
焼成され、該基板面の所定位置に表層導体パターンと同
じ導体ペーストを用いて位置合せマーク２２が印刷・焼
成されている。更に、この位置合せマーク２２の表面に
は、該表面全体を覆うようにほぼ無色の透明被膜２３が
透明ガラス又は透明樹脂によりマット状に形成されてい
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG.
It will be described based on. The surface of the ceramic circuit board 21,
That is, a surface conductor pattern (not shown) is formed of, for example, Ag, Ag / P
Printing using conductive paste such as t, Ag / Pd, Au, etc.
The alignment mark 22 is printed and fired at a predetermined position on the substrate surface using the same conductive paste as the surface conductive pattern. Further, on the surface of the alignment mark 22, a substantially colorless transparent film 23 is formed in a mat shape using transparent glass or transparent resin so as to cover the entire surface.
【００１５】ここで、透明ガラスを用いる場合には、例
えばホウケイ酸鉛ガラス系（ＰｂＯ−Ｂ2 Ｏ3 −ＳｉＯ
2 系）、ホウケイ酸ガラス系（Ｂ2 Ｏ3 −ＳｉＯ2 系）
等の透明ガラス材料を使用すれば良い。この透明ガラス
材料のペーストを焼成済みの位置合せマーク２２上に印
刷して５００℃〜９００℃で焼成したり、或は、Ａｇ、
Ａｇ／Ｐｔ、Ａｇ／Ｐｄ、Ａｕ等の低融点導体で位置合
せマーク２２を形成する場合には、透明ガラス材料のペ
ーストを焼成前の位置合せマーク２２上に印刷して両者
を８００℃前後で同時焼成するようにしても良い。Here, when a transparent glass is used, for example, a lead borosilicate glass (PbO—B 2 O 3 —SiO
2 system), borosilicate glass system (B 2 O 3 -SiO 2 system)
Or the like may be used. This transparent glass material paste is printed on the fired alignment mark 22 and fired at 500 ° C. to 900 ° C., or Ag,
When the alignment mark 22 is formed of a low-melting conductor such as Ag / Pt, Ag / Pd, or Au, a paste of a transparent glass material is printed on the alignment mark 22 before firing, and both are heated at about 800 ° C. You may make it co-fire.
【００１６】また、透明樹脂を用いて透明被膜２３を形
成する場合には、透明樹脂の溶融液を焼成済みの位置合
せマーク２２上に印刷して乾燥する。透明ガラス、透明
樹脂のいずれを用いる場合でも、透明被膜２３を位置合
せマーク２２よりも広範囲に印刷し、位置合せマーク２
２の表面全体及び全周縁部を透明被膜２３で確実に覆う
と共に、該透明被膜２３の全周部を位置合せマーク２２
の周囲の基板面に密着させる。尚、透明樹脂の場合は透
明ガラスのような焼成工程が省けるので、より簡単な工
程で済む。When the transparent film 23 is formed using a transparent resin, a melt of the transparent resin is printed on the fired alignment marks 22 and dried. Regardless of whether transparent glass or transparent resin is used, the transparent coating 23 is printed over a wider area than the alignment mark 22, and the alignment mark 2
2 is completely covered with the transparent coating 23, and the entire periphery of the transparent coating 23 is aligned with the alignment mark 22.
In close contact with the surrounding substrate surface. In the case of a transparent resin, a baking process such as a transparent glass can be omitted, so that a simpler process is required.
【００１７】以上説明した実施形態によれば、セラミッ
ク回路基板２１の表面に導体で形成した位置合せマーク
２２の表面に透明被膜２３を形成したので、位置合せマ
ーク２２の表面に焼結により微細な金属の凹凸が無数に
出来るという事情があっても位置合せマーク２２の表面
での光の乱反射が該表面を覆う透明被膜２３によって効
果的に抑えられる。これにより、位置合せマーク２２の
真上から画像認識装置で認識される位置合せマーク２２
の色が導体の金属そのものの色（Ａｇ系導体の場合には
黒灰色）となり、位置合せマーク２２と基板面の色（白
色）とのコントラストを大きくできる。このため、透過
光を使用しなくても、位置合せマーク２２を容易に且つ
正確に認識でき、積層数の多い多層基板であっても、位
置合せマーク２２による正確な位置合せが可能となる。According to the embodiment described above, since the transparent film 23 is formed on the surface of the alignment mark 22 formed of a conductor on the surface of the ceramic circuit board 21, the surface of the alignment mark 22 is finely sintered by sintering. Even if there is a situation in which metal irregularities can be formed innumerably, irregular reflection of light on the surface of the alignment mark 22 can be effectively suppressed by the transparent coating 23 covering the surface. Thus, the alignment mark 22 recognized by the image recognition device from directly above the alignment mark 22
Is the color of the metal of the conductor itself (black-gray in the case of an Ag-based conductor), and the contrast between the alignment mark 22 and the color of the substrate surface (white) can be increased. For this reason, the alignment marks 22 can be easily and accurately recognized without using transmitted light, and accurate alignment using the alignment marks 22 is possible even for a multilayer substrate having a large number of stacked layers.
【００１８】しかも、前述した特開昭６０−１２１７９
３号公報の技術とは異なり、位置合せマーク２２を覆う
透明被膜２３が着色されていないため、透明被膜２３の
膜厚にばらつきがあっても、透明被膜２３の色変化や透
明度低下は起こらず、また、従来のような着色剤配合量
のばらつきによる色変化や透明度低下の問題も起こら
ず、透明被膜２３の製造ばらつきによるコントラストの
低下を回避することができる。Moreover, the above-mentioned Japanese Patent Application Laid-Open No. Sho 60-12179
Unlike the technique disclosed in Japanese Patent Publication No. 3 (1993) -1995, the transparent coating 23 covering the alignment mark 22 is not colored, so that even if the thickness of the transparent coating 23 varies, the color change and the transparency of the transparent coating 23 do not occur. In addition, there is no problem of color change and decrease in transparency due to the variation in the amount of the coloring agent as in the related art, and it is possible to avoid a decrease in contrast due to manufacturing variation of the transparent film 23.
【００１９】また、透明被膜２３に入射した外部光が位
置合せマーク２２の表面で反射されても、その反射光が
透明被膜２３の上面を透過する際に斜め方向に屈折され
ると共に、反射光の一部が透明被膜２３の上面で斜め下
方に反射されて透明被膜２３内に戻されるため、透明被
膜無しの場合と比較して、画像認識装置側に向けて反射
される外部光が少なくなり、外部光の反射の影響も少な
くすることができ、上述した位置合せマーク２２の高コ
ントラスト化と相俟って、位置合せマーク２２の画像認
識精度を向上することができる。Further, even if external light incident on the transparent film 23 is reflected on the surface of the alignment mark 22, the reflected light is refracted obliquely when passing through the upper surface of the transparent film 23, and is reflected. Is reflected obliquely downward on the upper surface of the transparent film 23 and returned to the inside of the transparent film 23, so that external light reflected toward the image recognition device side is reduced as compared with the case without the transparent film. In addition, the influence of the reflection of the external light can be reduced, and the image recognition accuracy of the alignment mark 22 can be improved in combination with the high contrast of the alignment mark 22 described above.
【００２０】ちなみに、本発明者が行った試験結果によ
れば、Ａｇ／Ｐｄで形成した位置合せマークの画像認識
成功率は、透明被膜無しの場合には９８％であったのに
対し、透明ガラスの透明被膜を形成した場合には、９
９．９％の画像認識成功率が得られた。また、透明被膜
を形成することで、前述したように位置合せマーク２２
の表面での外部光の反射の影響を少なくすることができ
て、画像認識装置の偏光フィルタの感度調整範囲を２倍
程度に拡大でき、偏光フィルタの感度調整も容易になっ
た。Incidentally, according to the test results performed by the present inventor, the success rate of image recognition of the alignment mark formed of Ag / Pd was 98% without the transparent film, whereas it was 98%. When a transparent glass coating is formed, 9
An image recognition success rate of 9.9% was obtained. Further, by forming a transparent film, the alignment marks 22 can be formed as described above.
The influence of the reflection of external light on the surface of the image recognition device can be reduced, the sensitivity adjustment range of the polarizing filter of the image recognition device can be expanded to about twice, and the sensitivity adjustment of the polarizing filter can be easily performed.
【００２１】また、従来より、基板表面の導体にＡｕめ
っきを施すことがあり、この場合には、位置合せマーク
の表面にもＡｕめっきが施されるが、Ａｕめっきの色は
Ａｇ系の導体よりも更に基板面の色（白）に近付いて見
えるため、透明被膜無しの場合には両者の色のコントラ
ストが非常に小さくなり、画像認識はほとんど不可能で
あった。Conventionally, the conductor on the surface of the substrate is sometimes plated with Au. In this case, the surface of the alignment mark is also plated with Au, but the color of the Au plating is Ag-based conductor. Since it looks even closer to the color of the substrate surface (white) than in the case without a transparent coating, the contrast between the two colors becomes very small, making image recognition almost impossible.
【００２２】この場合でも、位置合せマークの表面のＡ
ｕめっき被膜上に透明被膜を形成することで、位置合せ
マークのＡｕめっき被膜と基板面との色のコントラスト
を大きくすることができ、本発明者が行った試験結果に
よれば、Ａｕめっき無しの場合と同じ９９．９％の画像
認識成功率を得ることができた。Even in this case, A on the surface of the alignment mark
By forming a transparent film on the u-plated film, the color contrast between the Au-plated film of the alignment mark and the substrate surface can be increased. According to the test results performed by the inventor, there was no Au plating. The same 99.9% image recognition success rate as in the case of was obtained.
【００２３】このように、位置合せマーク２２の表面に
透明被膜２３を形成して位置合せマーク２２を高コント
ラスト化する方法は、従来の抵抗体材料や着色セラミッ
クを用いる高コントラスト化方法と比較して、使用材料
（透明ガラス、透明樹脂）が安価である上に、セラミッ
クグリーンシートの製造から位置合せマーク２２の形成
（表層導体パターン）までの生産工程に新たな工程を追
加する必要がなく、実用化が容易であり、生産性向上に
よる低コスト化も期待できる。As described above, the method of forming the transparent film 23 on the surface of the alignment mark 22 to increase the contrast of the alignment mark 22 is in comparison with the conventional method of increasing the contrast using a resistor material or a colored ceramic. In addition, the materials used (transparent glass, transparent resin) are inexpensive, and there is no need to add a new process to the production process from the production of the ceramic green sheet to the formation of the alignment mark 22 (surface conductor pattern). It is easy to put into practical use and cost reduction can be expected by improving productivity.
【００２４】尚、上記実施形態では、セラミック回路基
板２１の片面のみにＩＣチップ等の部品を実装するた
め、セラミック回路基板２１の片面のみに位置合せマー
ク２２を形成したが、基板両面に部品を実装する場合に
は、基板両面に位置合せマークと透明被膜を形成するよ
うにしても良い。In the above embodiment, the alignment marks 22 are formed only on one side of the ceramic circuit board 21 in order to mount components such as IC chips on only one side of the ceramic circuit board 21. When mounting, an alignment mark and a transparent film may be formed on both surfaces of the substrate.
【００２５】その他、本発明は、位置合せマーク２２の
形状は四角形に限定されず、円形、三角形等、他の形状
であっても良く、また、位置合せマークの表面をＮｉめ
っきで仕上げてその上に透明被膜を形成するようにして
も良い等、種々の変形が可能である。In addition, according to the present invention, the shape of the alignment mark 22 is not limited to a quadrangle, but may be other shapes such as a circle, a triangle, or the like. Various modifications are possible, for example, a transparent film may be formed thereon.
【００２６】[0026]
【発明の効果】以上の説明から明らかなように、本発明
の請求項１の回路基板によれば、基板面に導体で形成し
た位置合せマークの表面に透明被膜を形成したので、位
置合せマークの表面での光の乱反射を防いで位置合せマ
ークを高コントラスト化できると共に、従来の着色半透
明被膜を用いる場合とは異なり、その被膜の製造ばらつ
きによるコントラストの低下を回避でき、しかも外部光
の反射の影響も少なくすることができて、位置合せマー
クの画像認識精度を向上できる。しかも、位置合せマー
ク（表層導体パターン）の形成までの生産工程に新たな
工程を追加する必要がなく、生産性向上による低コスト
化も期待できる。As is apparent from the above description, according to the circuit board of the first aspect of the present invention, since the transparent film is formed on the surface of the alignment mark formed of the conductor on the substrate surface, the alignment mark is formed. In addition to preventing the irregular reflection of light on the surface, the alignment mark can have a high contrast and, unlike the case of using a conventional colored translucent film, a decrease in contrast due to manufacturing variations of the film can be avoided, and external light can be prevented. The influence of reflection can be reduced, and the image recognition accuracy of the alignment mark can be improved. Moreover, there is no need to add a new process to the production process up to the formation of the alignment mark (surface layer conductor pattern), and cost reduction can be expected by improving productivity.
【００２７】更に、請求項２では、透明被膜は、透明ガ
ラス又は透明樹脂により形成したので、材料コストも低
減することができる。Further, in the second aspect, since the transparent film is formed of transparent glass or transparent resin, the material cost can be reduced.
【図１】本発明の一実施形態を示すもので、（ａ）は位
置合せマーク部分の平面図、（ｂ）は同部分の側面図1A and 1B show an embodiment of the present invention, wherein FIG. 1A is a plan view of an alignment mark portion, and FIG. 1B is a side view of the same.
【図２】（ａ）は従来の位置合せマーク部分の平面図、
（ｂ）は同部分の側面図FIG. 2A is a plan view of a conventional alignment mark portion,
(B) is a side view of the same part.
【図３】従来の他の例の位置合せマーク部分の側面図FIG. 3 is a side view of another conventional example of an alignment mark portion.
２１…セラミック回路基板、２２…位置合せマーク、２
３…透明被膜。21: ceramic circuit board, 22: alignment mark, 2
3: Transparent coating.
Claims (2)
形成した回路基板において、前記位置合せマークを導体
で形成すると共に、該位置合せマークの表面に透明被膜
を形成したことを特徴とする回路基板。1. A circuit board having an alignment mark for image recognition formed on a substrate surface, wherein the alignment mark is formed of a conductor, and a transparent film is formed on a surface of the alignment mark. Circuit board.
脂により形成されていることを特徴とする請求項１に記
載の回路基板。2. The circuit board according to claim 1, wherein the transparent film is made of transparent glass or transparent resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32241996A JPH10163588A (en) | 1996-12-03 | 1996-12-03 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32241996A JPH10163588A (en) | 1996-12-03 | 1996-12-03 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10163588A true JPH10163588A (en) | 1998-06-19 |
Family
ID=18143460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32241996A Pending JPH10163588A (en) | 1996-12-03 | 1996-12-03 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10163588A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003088724A1 (en) * | 2002-04-12 | 2003-10-23 | Shindo Company, Ltd. | Circuit board and method for manufacturing the same |
| KR100708364B1 (en) | 2004-03-30 | 2007-04-17 | 샤프 가부시키가이샤 | Semiconductor device and manufacturing method thereof, semiconductor module device using the semiconductor device, and wiring substrate used for the semiconductor device |
| WO2009011337A1 (en) * | 2007-07-18 | 2009-01-22 | Showa Denko K.K. | Resin composition and its use |
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
| JP2011044547A (en) * | 2009-08-20 | 2011-03-03 | Murata Mfg Co Ltd | Substrate for mounting electronic part |
| CN102636962A (en) * | 2011-12-12 | 2012-08-15 | 北京京东方光电科技有限公司 | Aerial image overlay test method and array base plate |
| JP2015211134A (en) * | 2014-04-25 | 2015-11-24 | 新光電気工業株式会社 | Wiring board and manufacturing method for the same |
| JP2017167643A (en) * | 2016-03-14 | 2017-09-21 | 双葉電子工業株式会社 | Board for electronic elements |
-
1996
- 1996-12-03 JP JP32241996A patent/JPH10163588A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003088724A1 (en) * | 2002-04-12 | 2003-10-23 | Shindo Company, Ltd. | Circuit board and method for manufacturing the same |
| CN1309281C (en) * | 2002-04-12 | 2007-04-04 | 新藤电子工业株式会社 | Circuit board and method for manufacturing the same |
| KR100708364B1 (en) | 2004-03-30 | 2007-04-17 | 샤프 가부시키가이샤 | Semiconductor device and manufacturing method thereof, semiconductor module device using the semiconductor device, and wiring substrate used for the semiconductor device |
| JP2009026823A (en) * | 2007-07-17 | 2009-02-05 | Toshiba Corp | Printed wiring board, and electronic device |
| WO2009011337A1 (en) * | 2007-07-18 | 2009-01-22 | Showa Denko K.K. | Resin composition and its use |
| JPWO2009011337A1 (en) * | 2007-07-18 | 2010-09-24 | 昭和電工株式会社 | Resin composition and use thereof |
| JP5615545B2 (en) * | 2007-07-18 | 2014-10-29 | 昭和電工株式会社 | Resin composition and use thereof |
| JP2011044547A (en) * | 2009-08-20 | 2011-03-03 | Murata Mfg Co Ltd | Substrate for mounting electronic part |
| CN102636962A (en) * | 2011-12-12 | 2012-08-15 | 北京京东方光电科技有限公司 | Aerial image overlay test method and array base plate |
| US9127934B2 (en) | 2011-12-12 | 2015-09-08 | Beijing Boe Optoelectronics Technology Co., Ltd. | Space imaging overlay inspection method and array substrate |
| JP2015211134A (en) * | 2014-04-25 | 2015-11-24 | 新光電気工業株式会社 | Wiring board and manufacturing method for the same |
| JP2017167643A (en) * | 2016-03-14 | 2017-09-21 | 双葉電子工業株式会社 | Board for electronic elements |
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