JPH10158884A - Electroplating method and device therefor - Google Patents

Electroplating method and device therefor

Info

Publication number
JPH10158884A
JPH10158884A JP31532096A JP31532096A JPH10158884A JP H10158884 A JPH10158884 A JP H10158884A JP 31532096 A JP31532096 A JP 31532096A JP 31532096 A JP31532096 A JP 31532096A JP H10158884 A JPH10158884 A JP H10158884A
Authority
JP
Japan
Prior art keywords
plating
plated
plating solution
tank
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31532096A
Other languages
Japanese (ja)
Inventor
Kaoru Tone
薫 戸根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP31532096A priority Critical patent/JPH10158884A/en
Publication of JPH10158884A publication Critical patent/JPH10158884A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electroplating method capable of partially executing plating only on the necessary prescribed positions without executing masking and a device therefor. SOLUTION: The surface to be plate of an object 1 to be plated is disposed to face the liquid surface of the plating liquid 3 stored in a plating cell 2 and the top ends of fine open cellular bodies 4 which are disposed to rise from the inside of the plating liquid 3 and suck the plating liquid 3 upward by capillarity are brought into contact only with the prescribed positions to be plated on the surface to be plated of the object 1 to be plated. Voltage is impressed on an anode 5 disposed in the plating liquid 3 with the object 1 to be plated as a cathode.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電気めっき方法、
及びその装置に関し、詳しくはプリント基板などの被め
っき物の所定の位置にのみ部分的にめっきを施すのに有
用な電気めっき方法、及びその装置に関するものであ
る。[0001] The present invention relates to an electroplating method,
More particularly, the present invention relates to an electroplating method useful for partially plating only a predetermined position on a plating target such as a printed circuit board, and an apparatus therefor.

【０００２】[0002]

【従来の技術】従来、電気めっきにおいては、被めっき
物を陰極としてめっき槽内のめっき液に浸漬し、めっき
槽内に設けられたアノードに電圧を印加することによ
り、被めっき物にめっきが施されている。このとき、被
めっき物にてめっき液に直接接触させた部分にはめっき
が行われるために、めっきが必要な所定位置にのみめっ
きを行う場合には、所定位置を除いてレジスト、テー
プ、フィルム等によりマスキングを行ってから電気めっ
きを行い、その後、マスキングを除去していた。このマ
スキング処理、及びその除去工程は煩雑であるため、マ
スキングを行うことなく、必要な所定位置にのみ部分的
にめっきが行える方法が望まれるものであった。2. Description of the Related Art Conventionally, in electroplating, the object to be plated is immersed in a plating solution in a plating tank with the object to be plated as a cathode, and a voltage is applied to an anode provided in the plating tank. It has been subjected. At this time, since plating is performed on a portion of the object to be plated which is brought into direct contact with the plating solution, when plating is performed only at a predetermined position where plating is required, a resist, a tape, a film, excluding the predetermined position, Electroplating was performed after masking by the method described above, and then the masking was removed. Since the masking process and the step of removing the masking are complicated, there has been a demand for a method capable of partially plating only a required predetermined position without performing masking.

【０００３】[0003]

【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、マスキングを行うことなく、
必要な所定位置にのみ部分的にめっきが行える電気めっ
き方法、及びその装置を提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has been made without masking.
An object of the present invention is to provide an electroplating method capable of partially plating only a necessary predetermined position and an apparatus therefor.

【０００４】[0004]

【課題を解決するための手段】上記課題を解決するため
に、本発明の請求項１に係る電気めっき方法は、めっき
槽内に貯留されためっき液の液面に被めっき物の被めっ
き面を対峙させ、上記めっき液内から立ち上がって設け
られ毛細管現象によりめっき液を上方へと吸い上げる微
細連続気孔体の上端を、上記被めっき物の被めっき面に
おけるめっきを施すべき所定位置にのみ接触させて、上
記被めっき物を陰極として上記めっき液内に設けられた
アノードに電圧を印加することを特徴とするものであ
る。In order to solve the above-mentioned problems, an electroplating method according to a first aspect of the present invention is directed to an electroplating method, wherein a surface of a plating object is plated on a surface of a plating solution stored in a plating tank. The upper end of the fine continuous pores which rises from the plating solution and is provided so as to suck up the plating solution by capillary action, is brought into contact only with a predetermined position on the plating surface of the plating object to be plated. And applying a voltage to an anode provided in the plating solution using the object to be plated as a cathode.

【０００５】請求項２に係る電気めっき方法は、請求項
１に係る電気めっき方法において、上記めっき槽を密閉
してめっき液を加圧しながらめっきを行うことを特徴と
するものである。According to a second aspect of the present invention, in the electroplating method according to the first aspect, the plating is performed while the plating bath is sealed and a plating solution is pressed.

【０００６】請求項３に係る電気めっき方法は、請求項
１又は請求項２に係る電気めっき方法において、上記微
細連続気孔体が、樹脂材料からなる弾性を有するスポン
ジ体であることを特徴とするものである。According to a third aspect of the present invention, there is provided an electroplating method according to the first or second aspect, wherein the fine continuous pores are elastic sponges made of a resin material. Things.

【０００７】請求項４に係る電気めっき装置は、めっき
槽の上部又は上方に、該めっき槽内に貯留されためっき
液の液面に被めっき物の被めっき面を対峙させた状態で
該被めっき物を支持する支持手段を設け、めっき槽内に
貯留されためっき液から立ち上がって毛細管現象により
めっき液を上方へと吸い上げる微細連続気孔体を、その
上端が上記支持手段により支持された被めっき物の被め
っき面におけるめっきを施すべき所定位置にのみ接触す
るように設けたことを特徴とするものである。According to a fourth aspect of the present invention, there is provided an electroplating apparatus, wherein the surface of the object to be plated is opposed to the surface of the plating solution stored in the plating tank above or above the plating tank. Providing a supporting means for supporting a plating object, a fine continuous pore body which rises from the plating solution stored in the plating tank and sucks the plating solution upward by capillary action, the upper end of which is supported by the supporting means, The present invention is characterized in that it is provided so as to come into contact only with a predetermined position on the surface to be plated of an object to be plated.

【０００８】請求項５に係る電気めっき装置は、請求項
４に係る電気めっき装置において、上記支持手段とし
て、上記めっき槽の上部内周部に被めっき物を支持する
段部を設けたことを特徴とするものである。According to a fifth aspect of the present invention, there is provided the electroplating apparatus according to the fourth aspect, wherein a step portion for supporting an object to be plated is provided on an upper inner peripheral portion of the plating tank as the support means. It is a feature.

【０００９】請求項６に係る電気めっき装置は、請求項
４又は請求項５に係る電気めっき装置において、上記め
っき槽を密閉可能として、その内部に貯留されるめっき
液に加圧できるようにしたことを特徴とするものであ
る。According to a sixth aspect of the present invention, in the electroplating apparatus according to the fourth or fifth aspect, the plating tank can be hermetically sealed so that the plating solution stored therein can be pressurized. It is characterized by the following.

【００１０】請求項７に係る電気めっき装置は、請求項
４乃至請求項６いずれかに係る電気めっき装置におい
て、微細連続気孔体が、樹脂材料からなる弾性を有する
スポンジ体であることを特徴とするものである。The electroplating apparatus according to a seventh aspect is the electroplating apparatus according to any one of the fourth to sixth aspects, wherein the fine continuous pores are elastic sponges made of a resin material. Is what you do.

【００１１】[0011]

【発明の実施の形態】以下、本発明の実施形態について
図面に基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.

【００１２】図１は本発明の電気めっき方法を実施する
ための電気めっき装置の一実施形態を示す概略側断面図
である。図２は同上実施形態に係る電気めっき装置のめ
っき槽の斜視図である。FIG. 1 is a schematic sectional side view showing an embodiment of an electroplating apparatus for carrying out the electroplating method of the present invention. FIG. 2 is a perspective view of a plating tank of the electroplating apparatus according to the embodiment.

【００１３】図示の如く、該電気めっき装置は、内部に
めっき液３が貯留されためっき槽２の上部に、めっき液
３の液面に被めっき面を対峙させた状態で被めっき物１
を支持できるようになっており、めっき槽２内にはめっ
き液３から立ち上がって毛細管現象によりめっき液３を
上方へと吸い上げる微細連続気孔体４が、その上端が上
記めっき槽２上部にて支持された被めっき物１の被めっ
き面におけるめっきを施すべき所定位置にのみ接触する
ように設けられている。As shown in the drawing, the electroplating apparatus includes an object 1 to be plated on an upper surface of a plating tank 2 in which a plating solution 3 is stored with the surface of the plating solution 3 facing the surface of the plating solution 3.
In the plating tank 2, fine continuous pores 4 rising from the plating solution 3 and sucking the plating solution 3 upward by capillary action, the upper end of which is supported in the upper part of the plating tank 2. The plating target 1 is provided so as to contact only a predetermined position on the plating target surface on which plating is to be performed.

【００１４】上記めっき槽２について説明すると、めっ
き液３が貯留される内部の底側位置にはめっき材料から
なるアノード５が設けられており、また、貯留されるめ
っき液２の液面よりも上位の内周部には被めっき物１の
外周縁部が載る支持段部６が設けられている。また、該
めっき槽２には、側壁下部にめっき液供給口１０が設け
られ、且つ側壁における上記支持段部の下側部にはめっ
き液排出口１２が設けられている。上記めっき液供給口
１０には、他に設置され補給用めっき液が貯留されてい
る予備槽８から液送ポンプ１３を備えたメッキ液供給管
９が配管されていて、めっき槽２内にめっき液３を補充
できるようになっており、一方、上記めっき液排出口１
２には先端部が上記予備槽８へと導入されているめっき
液排出管１１が接続されていて、めっき槽２内の余分な
めっき液３を排出して液面の高さが上昇しすぎるのを防
止している。The plating tank 2 will be described. An anode 5 made of a plating material is provided at a bottom position inside the plating bath 3 where the plating bath 3 is stored. A support step 6 on which the outer peripheral edge of the object to be plated 1 is mounted is provided on the upper inner peripheral portion. The plating bath 2 is provided with a plating solution supply port 10 at a lower portion of a side wall, and a plating solution discharge port 12 is provided at a lower portion of the side wall of the support step. A plating solution supply pipe 9 provided with a solution feed pump 13 is connected to the plating solution supply port 10 from a preparatory tank 8 which is additionally provided and stores a replenishing plating solution. Solution 3 can be replenished, while plating solution outlet 1
A plating solution discharge pipe 11 whose leading end is introduced into the preliminary tank 8 is connected to 2 so that the excess plating solution 3 in the plating tank 2 is discharged and the level of the solution rises too high. Is prevented.

【００１５】上記めっき槽２は密閉して槽内のめっき液
３に加圧できるようになっていると好ましく、この場
合、めっき液３を加圧することにより上記微細連続気孔
体４に毛細管現象によるめっき液３の吸い上げを促進さ
せることができる。このとき、めっき槽２を密閉する手
段としては、例えばめっき槽２の上方開口部に蓋を設け
て密閉しても、あるいは上記支持段部６に載置された被
めっき物１を密閉用の蓋代わりにしてもよい。また、め
っき槽２内のめっき液３を加圧する手段としては、例え
ば加圧ポンプ等で内部の気圧を上昇させるなどすること
ができる。It is preferable that the plating tank 2 is sealed so that the plating solution 3 in the tank can be pressurized. In this case, the plating solution 3 is pressurized to cause the fine continuous pores 4 to be capillarized. The absorption of the plating solution 3 can be promoted. At this time, as a means for sealing the plating tank 2, for example, a lid may be provided at the upper opening of the plating tank 2 to seal the plating tank 2, or the plating object 1 placed on the support step 6 may be sealed. A lid may be used instead. As a means for pressurizing the plating solution 3 in the plating tank 2, for example, the internal pressure can be increased by a pressure pump or the like.

【００１６】なお、本発明においては、被めっき物１を
支持する手段としては、めっき液３の液面に対峙させて
支持できれば上記支持段部６に限らず、例えばめっき槽
２の上方から吊り下げるようにしても構わない。In the present invention, the means for supporting the object to be plated 1 is not limited to the support step 6 as long as it can support the object to be plated 1 so as to face the liquid surface of the plating solution 3. You may make it lower.

【００１７】上記被めっき物１としては被めっき面の所
定箇所に部分的にめっきを施したいものであれば、特に
指定されるものではなく、例えば、プリント回路板など
が例示される。The object to be plated 1 is not particularly specified as long as it is desired to partially apply plating to a predetermined portion of the surface to be plated, and examples thereof include a printed circuit board.

【００１８】微細連続気孔体４は、めっき槽２内に貯留
されためっき液３内から立ち上がって、その先端が被め
っき物１の被めっき面におけるめっきを施すべき所定位
置にのみ接触するように支持されたものであって、毛細
管現象によりめっき液を上方へと吸い上げる機能を有し
ている。この微細連続気孔体４は、絶縁材料から形成さ
れるものであって、例えばポリプロピレン、ポリエチレ
ン、ナイロン、ポリウレタンなどの弾性を有する樹脂製
のスポンジ体が使用される。この微細連続気孔体４は、
被めっき物１におけるめっきを施すべき所定位置に応じ
て、その数及び形状が適宜設計されればよく、上端面と
下端面戸を除く外周表面をプラスチック材等で被覆して
毛細管現象によりめっき液を上方へと吸い上げやすくす
ることもできる。The fine continuous pores 4 rise from the plating solution 3 stored in the plating tank 2 so that their tips contact only predetermined positions on the surface of the workpiece 1 to be plated. It is supported and has a function of sucking up the plating solution by capillary action. The fine continuous pores 4 are formed of an insulating material, and for example, a sponge made of an elastic resin such as polypropylene, polyethylene, nylon, or polyurethane is used. The fine continuous pores 4 are
The number and shape may be appropriately designed according to the predetermined position of the plating target 1 on which plating is to be performed. The outer peripheral surface excluding the upper and lower end doors is covered with a plastic material or the like, and the plating solution is formed by capillary action. Can be easily sucked upward.

【００１９】該実施形態では、被めっき物１を陰極とし
て、該被めっき物１とめっき槽２内のアノード５とを直
流電源７に接続することにより、被めっき物１の所定位
置に電気めっきを行うことができる。すなわち、直流電
源７によりアノード５に電圧を印加すると、アノード５
を構成するめっき材料が金属陽イオンとなってめっき液
３内に溶出し、電流は微細連続気孔体４により吸い上げ
られためっき液３を通って微細連続気孔体４の上端が接
触する被めっき物１の所定位置に流れ、これにより該被
めっき物１の所定位置にめっき液３内の金属陽イオンが
めっき層となって析出する。このように、この手法によ
ればマスキングを施すことなく被めっき物１の所定位置
に電気めっきを行うことができるので、部分めっき品の
生産性に優れたものである。In this embodiment, the object 1 to be plated is used as a cathode, and the object 1 to be plated and the anode 5 in the plating tank 2 are connected to a DC power source 7 so that the electroplating is performed at a predetermined position on the object 1 to be plated. It can be performed. That is, when a voltage is applied to the anode 5 by the DC power supply 7, the anode 5
Is eluted into the plating solution 3 as a metal cation as a metal cation, and a current flows through the plating solution 3 sucked up by the fine continuous pores 4 and the upper end of the fine continuous pores 4 comes into contact with the object to be plated. 1, the metal cations in the plating solution 3 are deposited as plating layers at the predetermined positions of the workpiece 1. As described above, according to this method, electroplating can be performed at a predetermined position of the workpiece 1 without performing masking, so that the productivity of the partially plated product is excellent.

【００２０】また、本発明の電気めっき方法では、毛細
管現象によりめっき液３を微細連続気孔体４内を通じて
吸い上げて被めっき物１の所定位置に接触させることか
ら、めっき液３が過剰に流れ出して被めっき物１のめっ
きが不要な部分にめっきされることもないという効果も
ある。さらに、該電気めっき方法では、めっき処理後の
被めっき物１を次のものと取り替えて連続的に部分めっ
き処理を行うこともできるものである。また、被めっき
物１の被めっき面が凹凸を有し、該被めっき面にめっき
を行うべき所定位置が設定されている場合でも、微細連
続気孔体４の上端を各所定位置に追従させて接触させる
ことにより、部分めっきが行える。Further, in the electroplating method of the present invention, the plating solution 3 is sucked up through the fine continuous pores 4 by capillary action and brought into contact with a predetermined position of the workpiece 1, so that the plating solution 3 flows out excessively. There is also an effect that plating of the object to be plated 1 is not performed on unnecessary portions. Furthermore, in the electroplating method, the plated object 1 after the plating process can be replaced with the next one to continuously perform the partial plating process. Further, even when the surface to be plated of the object to be plated 1 has irregularities and a predetermined position for plating is set on the surface to be plated, the upper end of the fine continuous pores 4 is made to follow each predetermined position. By making contact, partial plating can be performed.

【００２１】[0021]

【発明の効果】以上説明したように、本発明に係る電気
めっき方法によると、マスキングを施すことなく被めっ
き物１の所定位置に電気めっきを行うことができるの
で、生産性に優れる。As described above, according to the electroplating method according to the present invention, it is possible to perform electroplating at a predetermined position on the workpiece 1 without performing masking, so that the productivity is excellent.

【００２２】また、本発明に係る電気めっき装置による
と、上記電気めっき方法を実施することができる。Further, according to the electroplating apparatus according to the present invention, the above-described electroplating method can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の電気めっき方法を実施するための電気
めっき装置の一実施形態を示す概略側断面図である。FIG. 1 is a schematic sectional side view showing an embodiment of an electroplating apparatus for performing an electroplating method of the present invention.

【図２】同上実施形態に係る電気めっき装置のめっき槽
の斜視図である。FIG. 2 is a perspective view of a plating tank of the electroplating apparatus according to the embodiment.

【符号の説明】[Explanation of symbols]

１ 被めっき物 ２ めっき槽 ３ めっき液 ４ 微細連続気孔体 ５ アノード ６ 支持段部 DESCRIPTION OF SYMBOLS 1 To-be-plated object 2 Plating tank 3 Plating solution 4 Fine continuous pore body 5 Anode 6 Support step part

Claims (7)

【特許請求の範囲】[Claims] 【請求項１】 めっき槽内に貯留されためっき液の液面
に被めっき物の被めっき面を対峙させ、上記めっき液内
から立ち上がって設けられ毛細管現象によりめっき液を
上方へと吸い上げる微細連続気孔体の上端を、上記被め
っき物の被めっき面におけるめっきを施すべき所定位置
にのみ接触させて、上記被めっき物を陰極として上記め
っき液内に設けられたアノードに電圧を印加することを
特徴とする電気めっき方法。1. A fine continuum in which a plating surface of an object to be plated is opposed to a liquid surface of a plating solution stored in a plating tank, and the plating solution is provided rising from the plating solution and sucks up the plating solution by a capillary phenomenon. The upper end of the porous body is brought into contact with only a predetermined position on the surface to be plated of the object to be plated, and a voltage is applied to an anode provided in the plating solution using the object to be plated as a cathode. Characteristic electroplating method. 【請求項２】 上記めっき槽を密閉してめっき液を加圧
しながらめっきを行うことを特徴とする請求項１記載の
電気めっき方法。2. The electroplating method according to claim 1, wherein the plating is performed while pressurizing a plating solution by sealing the plating tank. 【請求項３】 上記微細連続気孔体が、樹脂材料からな
る弾性を有するスポンジ体であることを特徴とする請求
項１又は請求項２記載の電気めっき方法。3. The electroplating method according to claim 1, wherein the fine continuous pores are elastic sponges made of a resin material. 【請求項４】 めっき槽の上部又は上方に、該めっき槽
内に貯留されためっき液の液面に被めっき物の被めっき
面を対峙させた状態で該被めっき物を支持する支持手段
を設け、めっき槽内に貯留されためっき液から立ち上が
って毛細管現象によりめっき液を上方へと吸い上げる微
細連続気孔体を、その上端が上記支持手段により支持さ
れた被めっき物の被めっき面におけるめっきを施すべき
所定位置にのみ接触するように設けたことを特徴とする
電気めっき装置。4. A supporting means for supporting the object to be plated in a state where the surface of the object to be plated faces the surface of the plating solution stored in the plating tank, at the upper part or above the plating tank. The fine continuous pores rising from the plating solution stored in the plating tank and sucking the plating solution upward by capillary action, the upper end of which is plated on the surface of the object to be plated, which is supported by the support means. An electroplating apparatus provided so as to contact only a predetermined position to be applied. 【請求項５】 上記支持手段として、上記めっき槽の上
部内周部に被めっき物を支持する段部を設けたことを特
徴とする請求項４記載の電気めっき装置。5. The electroplating apparatus according to claim 4, wherein a step for supporting the object to be plated is provided at an upper inner peripheral portion of the plating tank as the supporting means. 【請求項６】 上記めっき槽を密閉可能として、その内
部に貯留されるめっき液に加圧できるようにしたことを
特徴とする請求項４又は請求項５記載の電気めっき装
置。6. The electroplating apparatus according to claim 4, wherein the plating tank is hermetically sealable so that the plating solution stored in the plating tank can be pressurized. 【請求項７】 微細連続気孔体が、樹脂材料からなる弾
性を有するスポンジ体であることを特徴とする請求項４
乃至請求項６いずれか記載の電気めっき装置。7. The fine continuous porous body is an elastic sponge made of a resin material.
The electroplating apparatus according to claim 6.
JP31532096A 1996-11-26 1996-11-26 Electroplating method and device therefor Pending JPH10158884A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31532096A JPH10158884A (en) 1996-11-26 1996-11-26 Electroplating method and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31532096A JPH10158884A (en) 1996-11-26 1996-11-26 Electroplating method and device therefor

Publications (1)

Publication Number Publication Date
JPH10158884A true JPH10158884A (en) 1998-06-16

Family

ID=18063991

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31532096A Pending JPH10158884A (en) 1996-11-26 1996-11-26 Electroplating method and device therefor

Country Status (1)

Country Link
JP (1) JPH10158884A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013063505A (en) * 2011-09-19 2013-04-11 Fei Co Localized, in-vacuum modification of small structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013063505A (en) * 2011-09-19 2013-04-11 Fei Co Localized, in-vacuum modification of small structure
US9812286B2 (en) 2011-09-19 2017-11-07 Fei Company Localized, in-vacuum modification of small structures

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