JPH10149961A - Die for cutting layered ceramic capacitor and manufacture of the capacitor using it - Google Patents

Die for cutting layered ceramic capacitor and manufacture of the capacitor using it

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Publication number
JPH10149961A
JPH10149961A JP8323507A JP32350796A JPH10149961A JP H10149961 A JPH10149961 A JP H10149961A JP 8323507 A JP8323507 A JP 8323507A JP 32350796 A JP32350796 A JP 32350796A JP H10149961 A JPH10149961 A JP H10149961A
Authority
JP
Japan
Prior art keywords
cutting
punch
die
ceramic capacitor
layered body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8323507A
Other languages
Japanese (ja)
Inventor
Takashi Sato
崇 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP8323507A priority Critical patent/JPH10149961A/en
Publication of JPH10149961A publication Critical patent/JPH10149961A/en
Pending legal-status Critical Current

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  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

PROBLEM TO BE SOLVED: To make the formed density of a layered body uniform by attaching a top-side cutter to a punch elongated from the center of the upper surface of upper and lower press sections and a bottom-side cutter to a die and cutting the layered body with both cutters while a sparse part is pressed against a dense part by means of the press sections. SOLUTION: In a die for cutting a layered ceramic capacitor, projecting upper and lower pressurizing press sections 7a and 7a are respectively installed to a punch and die so as to prevent the formation of sparse sections B in internal and non-internal electrode layers 2 and 1a at the time of pressing a layered body and to form dense parts 8 by compressing the parts B. In the die composed of a punch and die, a top-side cutter 3b and a bottom-side cutter 4b are arranged so that their blades can face oppositely each other and the layered body containing no sparse part is obtained by cutting off the layers 1a and 2 from each other with a pressure of 300kgf/cm<2> at 200 deg.C. Therefore, the occurrence of a delamination trouble in a chip can be reduced by easily making the density distribution in the layered body uniform.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、積層セラミックコ
ンデンサの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic capacitor.

【０００２】[0002]

【従来の技術】従来の技術について説明する。2. Description of the Related Art A conventional technique will be described.

【０００３】従来、図４に示すように、内部電極層２を
印刷したセラミック誘電体１のシートを積層したグリー
ンシート積層体は、層間密着のため、熱プレスし、例え
ば、２点鎖線部３に沿って切断加工され焼成される。Conventionally, as shown in FIG. 4, a green sheet laminate obtained by laminating sheets of a ceramic dielectric 1 on which an internal electrode layer 2 is printed is hot-pressed for adhesion between layers. Is cut and fired along.

【０００４】積層シートの製造方法には、大別して乾式
法と湿式法による成膜が実施されている。ここでは、前
者の乾式法に係わるものである。[0004] As a method of manufacturing a laminated sheet, film formation is generally performed by a dry method and a wet method. Here, the former relates to the dry method.

【０００５】この乾式法の場合、ベースフィルムへドク
ターブレード法等により一度塗工したグリーンシート膜
に、Ａｇ−Ｐｄ系あるいはＮｉなどの内部電極層を印刷
し、ベースフィルムから剥離させ、シートを所定の位置
に切断し、コンデンサの容量に応じて数十〜数百層積層
させる。これを熱プレスしてダイシングソーあるいは刃
の押し切りにより所定のサイズに切断する。In the case of this dry method, an internal electrode layer of Ag-Pd or Ni is printed on a green sheet film once applied to the base film by a doctor blade method or the like, and the green sheet film is peeled off from the base film. And several tens to several hundreds of layers are laminated according to the capacity of the capacitor. This is hot-pressed and cut into a predetermined size by a dicing saw or a blade.

【０００６】[0006]

【発明が解決しようとする課題】従来技術では、図５、
図６に示すように、積層体４を熱プレスする時、内部電
極層２と非内部電極層１ａでは積層後の厚みに差を生ず
る。すなわち、グリーンシートを温間加圧積層するとき
に、加圧時の圧力は内部電極層２の印刷されている部分
に集中する。このため、積層体４の内部電極層２の端部
に密な部分Ａが形成され、内部電極層２の中央部に粗な
部分Ｂが形成される。このため、電極の印刷されない部
分の非内部電極層１ａは、相対的に成形密度が粗にな
る。従って、 １）前記電極の印刷されない部分の非内部電極層１ａ
は、焼成後ポーラスになり易く、クラックなどデラミネ
ーション発生の起源となる可能性がある。 ２）また押し切りによる切断を行うと、チップの欠陥を
助長する可能性があるなどの問題があった。２）と同様
１）についても、切断加工時及び、ばり取り研磨時など
に欠陥が増幅する。In the prior art, FIG.
As shown in FIG. 6, when the laminate 4 is hot-pressed, the internal electrode layer 2 and the non-internal electrode layer 1a have a difference in thickness after lamination. That is, when green sheets are laminated under warm pressure, the pressure at the time of pressing is concentrated on the printed portion of the internal electrode layer 2. For this reason, a dense portion A is formed at the end of the internal electrode layer 2 of the laminate 4, and a coarse portion B is formed at the center of the internal electrode layer 2. For this reason, the non-inner electrode layer 1a in the portion where the electrode is not printed has a relatively low molding density. Therefore, 1) the non-internal electrode layer 1a in the unprinted portion of the electrode
Is likely to become porous after firing and may be a source of delamination such as cracks. 2) There is a problem that cutting by push-cutting may promote chip defects. As in the case of 2), also in the case of 1), defects are amplified at the time of cutting and deburring.

【０００７】本発明の課題は、簡便に積層体内の密度分
布を抑制し、デラミネーション不良を少なくし、均質な
信頼性の高い積層セラミックコンデンサの製造方法を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a monolithic ceramic capacitor having high reliability, which can easily suppress the density distribution in the laminated body, reduce the occurrence of delamination, and uniformly.

【０００８】[0008]

【課題を解決するための手段】本発明によれば、誘電体
粉末に有機物バインダを混入しシート化し、これに金属
粉末を混練したペーストを用いて電極パターンを印刷
し、このシートを積層した積層体の粗になる部分を加圧
する凸状の上加圧プレス部を上パンチに設け、同様に、
前記積層体の粗になる部分を加圧する凸状の下加圧プレ
ス部を下パンチに設け、前記上下加圧プレス部の上面中
央から伸びた上パンチには上側切断用カッターと、下パ
ンチには下側切断用カッターとをそれぞれ設けて、前記
上下加圧プレス部により粗になる部分を密な部分に加圧
成形しながら、前記積層体を前記上側・下側切断用カッ
ターにより切断することを特徴とする積層セラミックコ
ンデンサの切断用金型が得られる。According to the present invention, an organic binder is mixed into a dielectric powder to form a sheet, and an electrode pattern is printed using a paste obtained by kneading a metal powder into the sheet, and the sheet is laminated. A convex upper pressing portion for pressing a rough part of the body is provided on the upper punch, and similarly,
The lower punch is provided with a convex lower pressing portion for pressing the roughened portion of the laminate, and the upper punch extending from the center of the upper surface of the upper and lower pressing portions has an upper cutting cutter and a lower punch. Is provided with a lower cutting cutter, respectively, and cuts the laminated body with the upper and lower cutting cutters while press forming the roughened portion by the upper and lower pressing portions into a dense portion. Thus, a cutting die for a multilayer ceramic capacitor characterized by the following is obtained.

【０００９】又、本発明によれば、上記積層体を加圧密
着した後、上記上・下加圧プレス部により積層体の粗に
なる部分を密な部分に加圧・成形し、かつ、前記積層体
を前記上側・下側切断用カッターにより切断し、分離、
脱脂、焼成することを特徴とする積層セラミックコンデ
ンサの切断用金型を用いた製造方法が得られる。Further, according to the present invention, after the above-mentioned laminated body is pressed and adhered, a portion where the laminated body is roughened is pressed and formed into a dense portion by the above-mentioned upper and lower press parts, and The laminate is cut by the upper and lower cutting cutters, separated,
A method for manufacturing a multilayer ceramic capacitor using a cutting die, characterized by degreasing and firing, is obtained.

【００１０】本発明は、温間加圧積層したグリーンシー
ト積層体を再度加熱し、電極パターンの間の中央部分を
上下からくさび状の断面を有する刃を格子状に備えた金
型を用いて、前記中央部分を凸状の上下加圧プレス部に
より加圧すると同時に、切断分離する過程でくさびが発
生する水平方向への圧力を活用して、電極のない非内部
電極層の成形密度の粗の部分に各チップに側面から圧力
を加えて密度を上げる。上述のことで、チップの成形密
度の不均一性を改善し、焼成後のクラック、デラミネー
ション不良を減少させ、信頼性の向上をはかることがで
きる。According to the present invention, a green sheet laminate which has been subjected to warm pressure lamination is heated again, and a central portion between the electrode patterns is formed from above and below using a mold having a blade having a wedge-shaped cross section in a lattice shape. At the same time, the central portion is pressed by the convex upper and lower pressing portions, and at the same time, by utilizing the horizontal pressure at which wedges are generated in the process of cutting and separating, the forming density of the non-internal electrode layer without electrodes is reduced. Pressure is applied to each chip from the side to increase the density. As described above, it is possible to improve the non-uniformity of the molding density of the chip, to reduce cracks and delamination defects after firing, and to improve the reliability.

【００１１】[0011]

【発明の実施の形態】以下に本発明の積層セラミックコ
ンデンサの製造方法について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a multilayer ceramic capacitor according to the present invention will be described below.

【００１２】実験に用いた組成は、Ｐｂ［（Ｍｎ1/3Ｎ
ｂ2/3）x（Ｍｇ1/2Ｗ1/2）yＴｉZＺｒ1-x-y-z］０3で表
されるリラクサ系の酸化物セラミックスである。The composition used in the experiment was Pb [(Mn 1/3 N
b 2/3) x (Mg 1/2 W 1/2) y Ti Z Zr 1-xyz] a relaxer oxide ceramics represented by 0 3.

【００１３】原料として、試薬級の酸化鉛、水酸化マグ
ネシウム、二酸化チタン、酸化ニオブ、二酸化マンガ
ン、酸化タングステン各原料を所用の量だけ秤量し、ア
クリル製のポットに２５ｍｍφのジルコニアボールを用
いて、純水とともに２０〜４０時間混合した。As raw materials, reagent grade lead oxide, magnesium hydroxide, titanium dioxide, niobium oxide, manganese dioxide, and tungsten oxide raw materials were weighed in required amounts, and zirconia balls of 25 mmφ were used in acrylic pots. The mixture was mixed with pure water for 20 to 40 hours.

【００１４】次に、これを濾過乾燥し、更に解砕した粉
末を大気中に６００〜８００℃で仮焼成した。Next, this was filtered and dried, and the crushed powder was calcined at 600 to 800 ° C. in the air.

【００１５】次に、この粉末を再びアクリルポットに入
れ、２５ｍｍφのジルコニアボールを用いて、純水を媒
体として２０〜４０時間湿式粉砕、更に濾過乾燥した。Next, the powder was again put into an acrylic pot, and wet-pulverized using pure water as a medium for 20 to 40 hours using zirconia balls having a diameter of 25 mm, and further filtered and dried.

【００１６】得られた粉末にバインダーとしてポリビニ
ルブチラール樹脂、溶剤としてエチルセロソルブ、可塑
剤としてブチルフタルグルコール酸ブチルを、それぞれ
所要量加えてホモジナイザー撹拌してスラリーを得た。To the obtained powder, polyvinyl butyral resin as a binder, ethyl cellosolve as a solvent, and butyl butyl phthalglycolate as a plasticizer were added in required amounts, and the mixture was stirred with a homogenizer to obtain a slurry.

【００１７】得られたスラリーをポリエチレン製フィル
ムにドクターブレード法により成膜し、さらに内部電極
層として銀−パラジウムを印刷し、１２０℃で乾燥後の
シートを１００枚積層した。The obtained slurry was formed into a film on a polyethylene film by a doctor blade method, silver-palladium was further printed as an internal electrode layer, and 100 sheets after drying at 120 ° C. were laminated.

【００１８】図２に示すように、金型は、上パンチ３ａ
と下パンチ４ａと上側切断用カッター３ｂと下側切断用
カッター４ｂとからなり、上側・下側切断用カッターの
保護のため、ストッパー５を設けている。As shown in FIG. 2, the die is provided with an upper punch 3a.
And a lower punch 4a, an upper cutting cutter 3b, and a lower cutting cutter 4b. A stopper 5 is provided for protecting the upper and lower cutting cutters.

【００１９】図１は、本発明の積層セラミックコンデン
サの製造方法に用いる下パンチの切断用金型である。図
１には、下パンチの切断用金型のみを示したが、実際に
は上パンチの切断用金型もあり、上パンチ切断用金型に
は上側切断用カッター３ｂ（図２参照）、下パンチ切断
用金型には下側切断用カッター４ｂとを有し、ともに前
記カッターの刃を保護するストッパー５とを有し、上パ
ンチ３ａ（図２参照）及び下パンチ４ａを形成する。FIG. 1 shows a lower punch cutting die used in the method for manufacturing a multilayer ceramic capacitor of the present invention. Although FIG. 1 shows only the lower punch cutting die, there is actually an upper punch cutting die, and the upper punch cutting die includes an upper cutting cutter 3b (see FIG. 2). The lower punch cutting die has a lower cutting cutter 4b, and also has a stopper 5 for protecting the blade of the cutter, and forms an upper punch 3a (see FIG. 2) and a lower punch 4a.

【００２０】さらに詳述すると、図３に示すように、プ
レス時に内部電極層２と非内部電極層１ａとの粗な部分
Ｂを形成しないように、各々の金型には凸状の上加圧プ
レス部７ａ、下加圧プレス部７ｂを設けて、粗になる部
分Ｂを圧縮し、密な部分を形成するように構成されてい
る。本発明によれば、上述したように、上下パンチから
なる金型に前記上側・下側切断用カッターの刃を上下対
向するように配し、非内部電極層１ａの内部電極層２と
の間を２００℃、３００ｋｇｆ／ｃｍ2で切断し、粗に
なる部分のない積層体を得るものである。More specifically, as shown in FIG. 3, each mold has a convex upper part so as not to form a rough portion B between the internal electrode layer 2 and the non-internal electrode layer 1a during pressing. A pressure press portion 7a and a lower pressure press portion 7b are provided to compress a roughened portion B to form a dense portion. According to the present invention, as described above, the blades of the upper and lower cutting cutters are disposed so as to face up and down in the mold formed by the upper and lower punches, and are arranged between the non-internal electrode layer 1a and the internal electrode layer 2. Is cut at 200 ° C. and 300 kgf / cm 2 to obtain a laminate having no roughened portion.

【００２１】比較のため、従来の加熱プレス方式だけの
積層体もあわせてダイシング装置で切断し、生チップを
得た。For comparison, a laminate obtained only by the conventional heating press method was cut together with a dicing machine to obtain a raw chip.

【００２２】次に、この各々の生チップを４５０℃まで
８０時間大気中で脱脂し、９００℃〜１０００℃で１０
時間焼結した。Next, each of the raw chips was degreased in the air to 450 ° C. for 80 hours, and then dried at 900 ° C. to 1000 ° C. for 10 hours.
Sintered for hours.

【００２３】次に、このチップをバレル研磨した後、両
端に外部電極として銀ペーストを塗布した後、７００
℃、０.５時間の条件で焼き付けて形成し、積層セラミ
ックコンデンサを得た。Next, after this chip is barrel-polished, silver paste is applied to both ends as external electrodes,
It was formed by baking at 0.5 ° C. for 0.5 hours to obtain a multilayer ceramic capacitor.

【００２４】デラミネーションの検査は、超音波深傷機
を用いて１個ずつ検査した。The inspection of delamination was performed one by one using an ultrasonic deep wound machine.

【００２５】以上のように、本発明の積層セラミックコ
ンデンサの製造方法と従来の製造方法によって得られた
試料、各２０００個を検査した。その結果、本発明の積
層セラミックコンデンサの製造方法によって作製された
積層セラミックコンデンサのデラミネーションの発生率
が、０.０２％であった。As described above, 2000 samples each of the multilayer ceramic capacitor manufacturing method of the present invention and the samples obtained by the conventional manufacturing method were inspected. As a result, the rate of occurrence of delamination of the multilayer ceramic capacitor manufactured by the method for manufacturing a multilayer ceramic capacitor of the present invention was 0.02%.

【００２６】一方、従来の製造方法によって作製された
積層セラミックコンデンサの場合、デラミネーションの
発生率は０.５％であり、明らかに本発明の優位性が確
認できた。On the other hand, in the case of the multilayer ceramic capacitor manufactured by the conventional manufacturing method, the rate of occurrence of delamination was 0.5%, which clearly confirmed the superiority of the present invention.

【００２７】[0027]

【発明の効果】以上、本発明により、簡便に積層体内の
密度分布を抑制し、積層セラミックコンデンサのチップ
のデラミネーション不良を大幅に削減させることが可能
であり、均質で信頼性の高い積層セラミックコンデンサ
の製造方法が提供でき、その産業的価値は非常に大きい
ものである。As described above, according to the present invention, it is possible to easily suppress the density distribution in the laminated body and to greatly reduce the delamination failure of the chip of the laminated ceramic capacitor. A method for manufacturing a capacitor can be provided, and its industrial value is very large.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の積層セラミックコンデンサの製造方法
に用いる下パンチを示し、積層体を切断する格子状の刃
を示す説明図。FIG. 1 is an explanatory view showing a lower punch used in a method for manufacturing a multilayer ceramic capacitor of the present invention, and showing a lattice-like blade for cutting a laminate.

【図２】本発明の積層セラミックコンデンサの製造方法
に用いられる上下パンチによって積層体を切断すること
を示す説明図。FIG. 2 is an explanatory view showing that a laminate is cut by upper and lower punches used in the method for manufacturing a multilayer ceramic capacitor of the present invention.

【図３】図２の拡大図。FIG. 3 is an enlarged view of FIG. 2;

【図４】積層セラミックコンデンサの切断加工前の積層
体を示し、２点鎖線部が切断される箇所を示す説明図。FIG. 4 is an explanatory view showing a laminated body of the multilayer ceramic capacitor before cutting, and showing a portion where a two-dot chain line portion is cut;

【図５】積層体の正面の切断面を示す断面図。FIG. 5 is a cross-sectional view showing a cut surface at the front of the laminate.

【図６】積層体の側面の切断面を示す断面図。FIG. 6 is a cross-sectional view showing a cut surface of a side surface of the laminate.

【符号の説明】[Explanation of symbols]

１ セラミック誘電体 １ａ 非内部電極層 ２ 内部電極層 ３ 点線部 ３ａ 上パンチ ３ｂ 上側切断用カッター ４ 積層体 ４ａ 下パンチ ４ｂ 下側切断用カッター ５ ストッパー ６ 切断時の力の方向 ７ａ 上加圧プレス部 ７ｂ 下加圧プレス部 ８ 上下加圧プレス部によって圧縮される密になる部
分 Ａ 密な部分 Ｂ 粗な部分DESCRIPTION OF SYMBOLS 1 Ceramic dielectric 1a Non-internal electrode layer 2 Internal electrode layer 3 Dotted part 3a Upper punch 3b Upper cutting cutter 4 Laminated body 4a Lower punch 4b Lower cutting cutter 5 Stopper 6 Force direction at cutting 7a Upper press press Part 7b Lower pressing part 8 Part to be compressed by upper and lower pressing part A Dense part B Coarse part

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 誘電体粉末に有機物バインダを混入しシ
ート化し、これに金属粉末を混練したペーストを用いて
電極パターンを印刷し、このシートを積層した積層体の
粗になる部分を加圧する凸状の上加圧プレス部を上パン
チに設け、同様に、前記積層体の粗になる部分を加圧す
る凸状の下加圧プレス部を上パンチに対向するように下
パンチに設け、前記上下加圧プレス部の上面中央から伸
びた上パンチには上側切断用カッターと、同様に、下パ
ンチには下側切断用カッターとをそれぞれ設けて、前記
上下加圧プレス部により粗になる部分を密な部分に加圧
成形しながら、前記積層体を前記上側・下側切断用カッ
ターにより切断することを特徴とする積層セラミックコ
ンデンサの切断用金型。An electrode pattern is printed using a paste in which an organic binder is mixed with a dielectric powder, and a metal powder is kneaded into the sheet, and an electrode pattern is printed. An upper pressing portion is provided on the upper punch. Similarly, a convex lower pressing portion for pressing a roughened portion of the laminate is provided on the lower punch so as to face the upper punch. The upper punch extending from the center of the upper surface of the pressure press unit is provided with an upper cutting cutter, and the lower punch is also provided with a lower cutting cutter, and a portion roughened by the upper and lower press units is provided. A cutting die for a multilayer ceramic capacitor, wherein the laminate is cut by the upper and lower cutting cutters while being pressed into a dense portion. 【請求項２】 請求項１記載の積層体を加圧密着した
後、上記上・下加圧プレス部により積層体の粗になる部
分を密な部分に加圧・成形し、かつ、前記積層体を前記
上側・下側切断用カッターにより切断し、分離、脱脂、
焼成することを特徴とする積層セラミックコンデンサの
切断用金型を用いた製造方法。2. The laminated body according to claim 1, wherein said laminated body is pressed and adhered, and said upper and lower pressing parts press and form a coarse part of said laminated body into a dense part, and said laminating is performed. The body is cut by the upper and lower cutters, separated, degreased,
A method of manufacturing a multilayer ceramic capacitor using a cutting die, characterized by firing.
JP8323507A 1996-11-18 1996-11-18 Die for cutting layered ceramic capacitor and manufacture of the capacitor using it Pending JPH10149961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8323507A JPH10149961A (en) 1996-11-18 1996-11-18 Die for cutting layered ceramic capacitor and manufacture of the capacitor using it

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8323507A JPH10149961A (en) 1996-11-18 1996-11-18 Die for cutting layered ceramic capacitor and manufacture of the capacitor using it

Publications (1)

Publication Number Publication Date
JPH10149961A true JPH10149961A (en) 1998-06-02

Family

ID=18155470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8323507A Pending JPH10149961A (en) 1996-11-18 1996-11-18 Die for cutting layered ceramic capacitor and manufacture of the capacitor using it

Country Status (1)

Country Link
JP (1) JPH10149961A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7468112B2 (en) 2001-04-18 2008-12-23 Denso Corporation Method of producing a ceramic laminate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7468112B2 (en) 2001-04-18 2008-12-23 Denso Corporation Method of producing a ceramic laminate

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