JPH10126021A - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPH10126021A
JPH10126021A JP8280906A JP28090696A JPH10126021A JP H10126021 A JPH10126021 A JP H10126021A JP 8280906 A JP8280906 A JP 8280906A JP 28090696 A JP28090696 A JP 28090696A JP H10126021 A JPH10126021 A JP H10126021A
Authority
JP
Japan
Prior art keywords
integrated circuit
flexible sheet
hybrid integrated
circuit board
conductive path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8280906A
Other languages
Japanese (ja)
Other versions
JP3957347B2 (en
Inventor
Susumu Ota
晋 太田
Takashi Shibazaki
孝 柴崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP28090696A priority Critical patent/JP3957347B2/en
Publication of JPH10126021A publication Critical patent/JPH10126021A/en
Application granted granted Critical
Publication of JP3957347B2 publication Critical patent/JP3957347B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To make not to influence a flexible sheet caused by heat generation by so providing the flexible sheet as to keep a constant space from a hybrid integrated circuit board. SOLUTION: A general purpose circuit is mounted on a hybrid integrated circuit board 10 and a custom circuit which enhances a function of the general purpose circuit is mounted on a flexible sheet 20. A projecting part 16 is provided on the hybrid integrated circuit board 10 and fixing holes 23 are provided on the flexible sheet 20, therefore fixing can be made by points without applying adhesive agent on the whole surface of the flexible sheet and the flexible sheet does not break because a difference of thermal expansions between the hybrid integrated circuit board and the flexible sheet does not directly influence.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は混成集積回路装置に
関し、特にフレキシブルシートを採用した多層基板に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly, to a multilayer substrate employing a flexible sheet.

【０００２】[0002]

【従来の技術】一般に多層基板を採用している混成集積
回路装置には、約１ｍｍ程度の厚さのガラスエポキシ基
板等が貼り付けられたものがあり、例えば特開平４−８
７３５８号にその構造が説明されており、図３がその一
例である。まずガラスエポキシ基板４０には、ゲートア
レイ、マイコンおよびメモリチップ等の半導体素子が露
出するように開口部４２が形成され、この開口部の周辺
およびガラスエポキシ基板４０の周辺には、導電パッド
４８，５０が設けられている。2. Description of the Related Art In general, there is a hybrid integrated circuit device employing a multilayer substrate on which a glass epoxy substrate or the like having a thickness of about 1 mm is attached.
No. 7358 describes the structure, and FIG. 3 shows one example. First, an opening 42 is formed in the glass epoxy substrate 40 so that semiconductor elements such as a gate array, a microcomputer, and a memory chip are exposed, and conductive pads 48, 50 are provided.

【０００３】図面では省略したが、このガラスエポキシ
基板４０を貼り付ける基板があり、このエポキシ基板が
貼り付けられる基板に設けられた導電ランドに前記半導
体素子が固着されており、この開口部４２から露出され
ている。従って、半導体素子の電極パッドと開口部４２
周辺の導電パッド５０が金属細線にて電気的に接続され
ている。Although not shown in the drawings, there is a substrate to which the glass epoxy substrate 40 is attached, and the semiconductor element is fixed to a conductive land provided on the substrate to which the epoxy substrate is attached. Is exposed. Therefore, the electrode pad of the semiconductor element and the opening 42
The peripheral conductive pads 50 are electrically connected by thin metal wires.

【０００４】また前記ガラスエポキシ基板を貼り付ける
基板は、そのサイズがガラスエポキシ基板よりも大きく
形成され、このサイズの大きい基板の上に形成されたＩ
Ｃ回路の一部から延在された導電パッドや半導体素子の
電極パッドが、ガラスエポキシ基板４０周辺に設けられ
た導電パッド４８と金属細線を介して電気的に接続さ
れ、結局２枚の基板により所定の回路が達成されてい
る。The size of the substrate on which the glass epoxy substrate is to be attached is larger than that of the glass epoxy substrate, and the size of the substrate formed on the large-sized substrate is larger than that of the glass epoxy substrate.
A conductive pad extending from a part of the C circuit and an electrode pad of a semiconductor element are electrically connected to a conductive pad 48 provided around the glass epoxy substrate 40 via a thin metal wire, and eventually the two substrates are used. Certain circuits have been achieved.

【０００５】[0005]

【発明が解決しようとする課題】一般にＩＣは、一般ユ
ーザー向けに作られた汎用ＩＣと特定ユーザー向けに作
られたカスタムＩＣの２種類に分けられる。しかしこれ
らの回路を混成集積回路基板に形成する場合、それぞれ
の回路のパターン設計を行い、このパターンに従って回
路素子を配置して混成集積回路装置を実現していた。特
にカスタムＩＣは、最初から設計を行わなければ成ら
ず、ユーザへの納品期間が非常にかかる問題があった。Generally, ICs are classified into two types: general-purpose ICs made for general users and custom ICs made for specific users. However, when these circuits are formed on a hybrid integrated circuit board, a pattern design of each circuit is performed, and circuit elements are arranged according to the pattern to realize a hybrid integrated circuit device. Particularly, a custom IC has to be designed from the beginning, and there is a problem that a delivery period to a user is very long.

【０００６】一方、金属基板やセラミツク基板に前記ガ
ラスエポキシ基板を貼り合わせた場合、実装される雰囲
気温度や基板に実装される半導体素子の発熱により、２
枚の基板に反りが発生する問題があった。そのため、上
層に形成されるガラスエポキシ基板を、歪みが吸収でき
るフレキシブルシートで代用する構成が考えられてい
る。しかしフレキシブルシートも基板に接着剤を塗って
貼り合わせるため、温度変化の大きな雰囲気内で使用す
ると、フレキシブルシート自身にヒビが入り、フレキシ
ブルシート上の配線が断線する問題があった。On the other hand, when the above-mentioned glass epoxy substrate is bonded to a metal substrate or a ceramic substrate, the ambient temperature at which the substrate is mounted or the heat generated by a semiconductor element mounted at the substrate causes heat generation.
There is a problem that warpage occurs in one substrate. Therefore, a configuration in which the glass epoxy substrate formed in the upper layer is replaced with a flexible sheet capable of absorbing distortion has been considered. However, since the flexible sheet is also coated with an adhesive and adhered thereto, when used in an atmosphere having a large temperature change, there is a problem that the flexible sheet itself is cracked and the wiring on the flexible sheet is disconnected.

【０００７】[0007]

【課題を解決するための手段】本発明は前述の課題に鑑
みて成され、第１に、フレキシブルシート上に前記カス
タム回路を形成することで解決するものである。前記第
１の回路を、一般ユーザー向けに回路設計しておけば、
この第１の回路は汎用性が効く。また一旦特定ユーザー
から注文依頼が有れば、その後は第１の回路設計を必要
とせず、単にフレキシブルシートにカスタム回路を設計
すれば良い。従って短時間で、カスタムＩＣを製造で
き、特定ユーザーに短期間で納品できる。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and is first solved by forming the custom circuit on a flexible sheet. If the first circuit is designed for general users,
This first circuit is effective in versatility. Further, once an order is requested by a specific user, the first circuit design is not required thereafter, and a custom circuit may be simply designed on the flexible sheet. Therefore, a custom IC can be manufactured in a short time and can be delivered to a specific user in a short time.

【０００８】また、第１の回路を、大信号系と小信号系
に分けて混成集積回路基板に配置すれば、大きく発熱す
る部分と比較的発熱しない部分に振り分けられる。従っ
てこの比較的発熱しない部分にフレキシブルシートを配
置すれば、フレキシブルシートには基板からの熱の影響
を無くせ、カスタム回路の誤動作を防止できる。また基
板に突出部を設け、この突出部が挿入される固定穴をフ
レキシブルシートに設ければ、フレキシブルシートは、
この突出部と固定穴で固定できる。従ってフレキシブル
シートを全面に渡り接着する必要が無く、熱膨張による
影響を受けない。また突出部にステップを設け、このス
テップにかかるように固定穴を設ければ、フレキシブル
シートは混成集積回路基板から一定のスペースをもって
設けられる。従って小信号系の回路素子から発熱があっ
ても、スペースが設けられているために、発熱による影
響をフレキシブルシート上に与えることがない。Further, if the first circuit is divided into a large signal system and a small signal system and arranged on the hybrid integrated circuit board, the first circuit is divided into a large heat generating portion and a relatively low heat generating portion. Therefore, if a flexible sheet is disposed in a portion that does not relatively generate heat, the influence of heat from the substrate can be eliminated on the flexible sheet, and malfunction of the custom circuit can be prevented. Also, if a protrusion is provided on the substrate and a fixing hole for inserting the protrusion is provided in the flexible sheet, the flexible sheet is
It can be fixed by this protrusion and the fixing hole. Therefore, there is no need to bond the flexible sheet over the entire surface, and the flexible sheet is not affected by thermal expansion. If a step is provided on the protruding portion and a fixing hole is provided so as to cover this step, the flexible sheet is provided with a certain space from the hybrid integrated circuit board. Therefore, even if heat is generated from the small-signal circuit elements, the space does not affect the flexible sheet because the space is provided.

【０００９】[0009]

【発明の実施の形態】以下に本発明の実施の形態を図１
および図２を参照しながら説明する。混成集積回路基板
１０上には、導電路１１、導電パッド１２、導電ランド
１３および外部リード用パッド１４等が例えばＣｕ等の
金属材料により形成されている。ここで導電ランド１２
は、トランジスタ、パワーモストランジスタやダイオー
ド等の半導体素子１５を固着する部分であり、外部リー
ド用パッド１４は、基板１０の少なくとも一側辺に複数
個設けられ、例えば半田を介して外部リードを固着する
部分である。また導電路１１は、印刷抵抗、チップ抵
抗、チップコンデンサおよび半導体素子等の回路素子が
電気的に接続されている。またここで外部リードの代わ
りに、金属細線でボンディングしても良い。この場合、
Ｃｕの外部リードパッドの上には、ボンディング性が考
慮されてニッケルが被着される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. A conductive path 11, a conductive pad 12, a conductive land 13, an external lead pad 14, and the like are formed on the hybrid integrated circuit board 10 by a metal material such as Cu. Here, the conductive land 12
Is a portion to which a semiconductor element 15 such as a transistor, a power MOS transistor or a diode is fixed, and a plurality of external lead pads 14 are provided on at least one side of the substrate 10, and the external lead is fixed through, for example, solder. This is the part to do. The conductive path 11 is electrically connected to circuit elements such as a print resistor, a chip resistor, a chip capacitor, and a semiconductor element. Here, instead of the external leads, bonding may be performed with a thin metal wire. in this case,
Nickel is deposited on the Cu external lead pad in consideration of bonding properties.

【００１０】この混成集積回路基板は、例えばセラミッ
ク等の絶縁基板、表面が絶縁性を有する金属基板であ
り、前述したＣｕ配線は、例えば絶縁樹脂により被着さ
れている。ここで混成集積回路基板に配置される回路
は、一般ユーザー向けの汎用回路が実装され、左斜め上
の領域には大信号系の回路素子が配置されている。また
右斜め下の領域には、小信号系の回路素子が配置されて
いる。また小信号系の回路素子が配置される領域には、
例えば突出部１６が４つ設けられている。この位置は、
後述するフレキシブルシートの形状により異なることも
あり、また突出部の数も異なる場合がある。また図面で
は、混成集積回路基板の右と左で大信号系の配置領域と
小信号系の配置領域に分けられているが、この限りでな
い。つまり混成集積回路基板の中央に大信号系の素子が
配置され、この周囲に小信号系の回路素子が配置されて
も良い。また中央に小信号系の回路素子が配置され、周
囲に大信号系の回路素子が配置されても良い。前者の場
合、フレキシブルシートは、基板の周囲に、後者の場合
フレキシブルシートの中央には位置されることになる。
また突出部は、混成集積回路基板がセラミックの場合、
基板の成型の際に一緒に形成される。また混成集積回路
基板が金属より成る場合は、プレスにより或いはピンの
打ち込みにより形成される。This hybrid integrated circuit board is an insulating board made of, for example, ceramic or the like, and a metal board having an insulating surface, and the above-mentioned Cu wiring is covered with, for example, an insulating resin. Here, a circuit arranged on the hybrid integrated circuit board is a general-purpose circuit for general users, and a large-signal circuit element is arranged in an upper left area. In the lower right region, small-signal circuit elements are arranged. In the area where small-signal circuit elements are arranged,
For example, four protrusions 16 are provided. This position is
It may differ depending on the shape of the flexible sheet described later, and the number of protrusions may also differ. In the drawings, the right and left sides of the hybrid integrated circuit board are divided into a large-signal arrangement area and a small-signal arrangement area, but this is not limitative. That is, a large signal element may be arranged at the center of the hybrid integrated circuit board, and a small signal circuit element may be arranged around the large signal element. Alternatively, a small-signal circuit element may be arranged at the center, and a large-signal circuit element may be arranged around the small-signal circuit element. In the former case, the flexible sheet is located around the substrate, and in the latter case, it is located at the center of the flexible sheet.
Also, if the hybrid integrated circuit board is made of ceramic,
They are formed together during the molding of the substrate. When the hybrid integrated circuit board is made of metal, it is formed by pressing or driving pins.

【００１１】続いて、フレキシブルシート２０がある。
このフレキシブルシート２０は、例えばポリイミド系の
樹脂シートにより成り、この上には、導電路２１、導電
パッド２２および導電ランド等が例えばＣｕ等の金属材
料により被着されている。導電路２１は、印刷抵抗、チ
ップ抵抗、チップコンデンサおよび半導体素子等の回路
素子が電気的に接続されている。また、導電パッド２２
は、混成集積回路基板との接続を金属細線で達成する領
域であり、また半導体素子上の電極と導電路２１との電
気的接続を金属細線により達成する領域である。更に導
電ランドは、半導体素子の固着領域である。またフレキ
シブルシートには、前記突出部１６が挿入される固定穴
２３が設けられている。ここではフレキシブルシートの
形状が矩形であるため、４つのコーナーに１こづつ設け
られている。従って、この４つの固定穴２３に前記突出
部１６が挿入され固定されている。また突出部が固定穴
から外れないように、接着剤を塗布したり、また突出部
が金属である場合は、この突出部を潰すことにより固定
される。Subsequently, there is a flexible sheet 20.
The flexible sheet 20 is made of, for example, a polyimide-based resin sheet, on which the conductive paths 21, the conductive pads 22, the conductive lands, and the like are adhered by a metal material such as Cu. The conductive path 21 is electrically connected to circuit elements such as a print resistor, a chip resistor, a chip capacitor, and a semiconductor element. The conductive pad 22
Is a region where the connection with the hybrid integrated circuit substrate is achieved by a thin metal wire, and the region where an electrode on the semiconductor element is electrically connected to the conductive path 21 by a thin metal wire. Further, the conductive land is a fixing region of the semiconductor element. The flexible sheet is provided with a fixing hole 23 into which the protrusion 16 is inserted. Here, since the shape of the flexible sheet is rectangular, one is provided at each of the four corners. Therefore, the protrusions 16 are inserted and fixed in the four fixing holes 23. An adhesive is applied so that the projecting portion does not come off the fixing hole, and when the projecting portion is made of metal, the projecting portion is fixed by crushing the projecting portion.

【００１２】本発明の第１の特徴は、混成集積回路基板
には、例えばオーディオアンプの汎用部分を配置し、こ
のオーディオアンプの機能を高める特定ユーザの回路を
フレキシブルシート２０上に設けることにある。例え
ば、特定ユーザーからオーディオＩＣの注文が有れば、
汎用回路は予め設計されているので、別途設計する必要
はなく、フレキシブルシートの特定ユーザー向けの回路
設計のみを行えばよい。従って、設計時間の短縮がはか
れ、ユーザには短期間で納入できる。A first feature of the present invention is that, for example, a general-purpose portion of an audio amplifier is disposed on a hybrid integrated circuit board, and a circuit for a specific user that enhances the function of the audio amplifier is provided on the flexible sheet 20. . For example, if there is an audio IC order from a specific user,
Since the general-purpose circuit is designed in advance, there is no need to separately design it, and only the circuit design for a specific user of the flexible sheet need be performed. Therefore, the design time can be reduced, and the product can be delivered to the user in a short time.

【００１３】また第２の特徴は、汎用回路を大信号系の
回路部分と小信号系の回路部分に割け、大信号系の回路
素子と小信号系の回路素子の配置領域を混成集積回路基
板上に分けて配置することにある。一般に大信号系の回
路素子は、発熱量が大きく、小信号系の回路素子は比較
的発熱量が少ない。従って、発熱量の少ない小信号系の
回路素子の配置領域にフレキシブルシート２０を配置す
れば、フレキシブルシート２０は、基板から発生する熱
の影響を最小限にとどめることができる。A second feature is that a general-purpose circuit is divided into a large signal system circuit portion and a small signal system circuit portion, and the arrangement area of the large signal system circuit element and the small signal system circuit element is divided into a hybrid integrated circuit board. It is to arrange it on the top. In general, large-signal circuit elements generate a large amount of heat, and small-signal circuit elements generate a relatively small amount of heat. Therefore, by arranging the flexible sheet 20 in the arrangement area of the small-signal circuit elements that generate less heat, the flexible sheet 20 can minimize the influence of heat generated from the substrate.

【００１４】更に第３として、フレキシブルシート２０
の固定穴２３に突出部１６を挿入して、フレキシブルシ
ート２０を混成集積回路基板１０に固定している。従っ
て、この固定部以外のフレキシブルシート２０はフリー
であり、混成集積回路基板からの熱の影響を更に少なく
している。また突出部１６をステップ状に形成すれば、
フレキシブルシート２０は、混成集積回路基板１０と一
定の間隔を持って配置できる。このステップとは、或る
径の円柱が一定の距離で若干小さな径に成っているもの
を示す。つまりこの小さな径の突出部が挿入できる固定
穴を設ければ、フレキシブルシートは、一定の距離を持
って配置できる。Third, the flexible sheet 20
The flexible sheet 20 is fixed to the hybrid integrated circuit board 10 by inserting the protruding portion 16 into the fixing hole 23. Therefore, the flexible sheet 20 other than the fixed portion is free, and the influence of heat from the hybrid integrated circuit board is further reduced. Also, if the protrusion 16 is formed in a step shape,
The flexible sheet 20 can be arranged at a fixed distance from the hybrid integrated circuit board 10. This step means that a cylinder of a certain diameter has a slightly smaller diameter at a certain distance. That is, if a fixing hole into which the small-diameter protrusion is inserted is provided, the flexible sheet can be arranged at a fixed distance.

【００１５】従って、フレキシブルシート２０と混成集
積回路基板１０は、スペースを開けて配置できるため、
たとえ小信号系の回路素子から発熱しても、フレキシブ
ルシートはその熱による影響を受けない。最後に図面で
は省略したが、多層基板は、例えばケースに覆われて封
止される。Accordingly, since the flexible sheet 20 and the hybrid integrated circuit board 10 can be arranged with a large space,
Even if heat is generated from the small signal circuit elements, the flexible sheet is not affected by the heat. Finally, although omitted in the drawings, the multilayer substrate is sealed, for example, by covering it with a case.

【００１６】[0016]

【発明の効果】以上の説明から明らかなように、第１に
混成集積回路基板には汎用回路を配置し、フレキシブル
シート上にはこの汎用回路の機能向上に使われる特定回
路を設ければ、色々なユーザーに対して、フレキシブル
シートだけを変えれば良く、設計期間の短縮が可能とな
る。そのためユーザーへの納期も短くすることができ
る。As is clear from the above description, first, a general-purpose circuit is arranged on the hybrid integrated circuit board, and a specific circuit used for improving the function of the general-purpose circuit is provided on the flexible sheet. For various users, only the flexible sheet needs to be changed, and the design period can be shortened. Therefore, the delivery date to the user can be shortened.

【００１７】第２に、混成集積回路基板において、大信
号系の回路素子配置領域と小信号系の回路素子配置領域
に分け、小信号系の回路素子配置領域上にフレキシブル
シートを設ければ、混成集積回路基板から発生する熱、
特にパワー素子から発生する熱の影響を少なくすること
ができる。またフレキシブルシートは、全面ではなく、
ポイントで固定され、殆どがフリーな状態に成っている
ので、たとえ混成集積回路基板から発生する熱がフレキ
シブルシートに伝わっても、混成集積回路基板とフレキ
シブルシートとの熱膨張係数の違いによる影響を受けな
い。Second, in the hybrid integrated circuit board, if a flexible signal sheet is provided on the small signal system circuit element arranging area by dividing into a large signal system circuit element arranging area and a small signal system circuit element arranging area. Heat generated from the hybrid integrated circuit board,
In particular, the effect of heat generated from the power element can be reduced. Also, the flexible sheet is not the whole surface,
It is fixed at a point and is mostly in a free state, so even if the heat generated from the hybrid integrated circuit board is transmitted to the flexible sheet, the influence of the difference in the thermal expansion coefficient between the hybrid integrated circuit board and the flexible sheet I do not receive.

【００１８】第３に、突出部にステップを形成すること
で、フレキシブルシートと混成集積回路基板との間にス
ペースを形成でき、フレキシブルシートの下に高さのあ
る回路素子を配置できると共に、混成集積回路基板から
発生する熱の影響を少なくすることができる。Third, by forming a step in the protruding portion, a space can be formed between the flexible sheet and the hybrid integrated circuit board, and a high circuit element can be arranged under the flexible sheet, and the hybrid can be formed. The effect of heat generated from the integrated circuit substrate can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施の形態を説明する混成集積回路基
板の斜視図である。FIG. 1 is a perspective view of a hybrid integrated circuit board illustrating an embodiment of the present invention.

【図２】本発明の実施の形態を説明する混成集積回路装
置の斜視図である。FIG. 2 is a perspective view of a hybrid integrated circuit device illustrating an embodiment of the present invention.

【図３】従来の混成集積回路装置を説明する平面図であ
る。FIG. 3 is a plan view illustrating a conventional hybrid integrated circuit device.

【符号の説明】[Explanation of symbols]

１０ 混成集積回路基板 １１ 導電路 １２ 導電パッド １３ 導電ランド １４ 外部リード用パッド １６ 突出部 ２０ フレキシブルシート ２３ 固定穴 DESCRIPTION OF SYMBOLS 10 Hybrid integrated circuit board 11 Conductive path 12 Conductive pad 13 Conductive land 14 Pad for external lead 16 Projection 20 Flexible sheet 23 Fixing hole

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 表面が絶縁性を有する混成集積回路基板
と、前記混成集積回路基板に被着された第１の導電路
と、前記混成集積回路基板に実装され、前記第１の導電
路と電気的に接続された第１の回路素子と、前記混成集
積回路基板上に配置されたフレキシブルシートと、前記
フレキシブルシートに被着された第２の導電路と、前記
フレキシブルシートに実装され、前記第２の導電路と電
気的に接続された第２の回路素子とを有する混成集積回
路装置に於いて、 前記第１の導電路と前記第１の回路素子で実質的に構成
される第１の回路は、前記混成集積回路基板に振り分け
られ、前記混成集積回路基板上には、前記フレキシブル
シートが配置され、前記第２の導電路と前記第２の回路
素子で前記第１の回路に接続されるカスタム回路が設け
られることを特徴とした混成集積回路装置。A first integrated circuit board having an insulating surface; a first conductive path attached to the hybrid integrated circuit board; a first conductive path mounted on the hybrid integrated circuit board; A first circuit element electrically connected thereto, a flexible sheet disposed on the hybrid integrated circuit board, a second conductive path adhered to the flexible sheet, and mounted on the flexible sheet; In a hybrid integrated circuit device having a second circuit element electrically connected to a second conductive path, a first circuit substantially constituted by the first conductive path and the first circuit element Is distributed to the hybrid integrated circuit board, and the flexible sheet is disposed on the hybrid integrated circuit board, and is connected to the first circuit by the second conductive path and the second circuit element. Custom circuit provided Hybrid integrated circuit device wherein Rukoto. 【請求項２】 表面が絶縁性を有する混成集積回路基板
と、前記混成集積回路基板に被着された第１の導電路
と、前記混成集積回路基板に実装され、前記第１の導電
路と電気的に接続された第１の回路素子と、前記混成集
積回路基板上に配置されたフレキシブルシートと、前記
フレキシブルシートに被着された第２の導電路と、前記
フレキシブルシートに実装され、前記第２の導電路と電
気的に接続された第２の回路素子とを有する混成集積回
路装置に於いて、 前記第１の導電路と前記第１の回路素子で実質的に構成
される第１の回路は、前記混成集積回路基板上で大信号
系の回路配置領域と小信号系の回路配置領域に振り分け
られ、前記小信号系の回路配置領域上には、前記フレキ
シブルシートが配置され、前記第２の導電路と前記第２
の回路素子で前記第１の回路に接続されるカスタム回路
が設けられることを特徴とした混成集積回路装置。2. A hybrid integrated circuit board having an insulating surface, a first conductive path attached to the hybrid integrated circuit board, and a first conductive path mounted on the hybrid integrated circuit board, A first circuit element electrically connected thereto, a flexible sheet disposed on the hybrid integrated circuit board, a second conductive path adhered to the flexible sheet, and mounted on the flexible sheet; In a hybrid integrated circuit device having a second circuit element electrically connected to a second conductive path, a first circuit substantially constituted by the first conductive path and the first circuit element The circuit is divided into a large signal circuit arrangement area and a small signal circuit arrangement area on the hybrid integrated circuit board, and the flexible sheet is arranged on the small signal circuit arrangement area, A second conductive path and the second conductive path;
A hybrid circuit provided with a custom circuit connected to the first circuit. 【請求項３】 前記フレキシブルシートの端部には固定
穴が設けられ、この固定穴に対応する混成集積回路基板
上には、この固定穴に挿入可能な突出部が設けられ、前
記固定穴に前記突出部が挿入されて前記フレキシブルシ
ートが前記混成集積回路基板に固定される請求項１また
は請求項２記載の混成集積回路装置。3. A fixing hole is provided at an end portion of the flexible sheet, and a protrusion which can be inserted into the fixing hole is provided on a hybrid integrated circuit board corresponding to the fixing hole. The hybrid integrated circuit device according to claim 1, wherein the protrusion is inserted to fix the flexible sheet to the hybrid integrated circuit board.
JP28090696A 1996-10-23 1996-10-23 Hybrid integrated circuit device Expired - Fee Related JP3957347B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28090696A JP3957347B2 (en) 1996-10-23 1996-10-23 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28090696A JP3957347B2 (en) 1996-10-23 1996-10-23 Hybrid integrated circuit device

Publications (2)

Publication Number Publication Date
JPH10126021A true JPH10126021A (en) 1998-05-15
JP3957347B2 JP3957347B2 (en) 2007-08-15

Family

ID=17631599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28090696A Expired - Fee Related JP3957347B2 (en) 1996-10-23 1996-10-23 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JP3957347B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311205A (en) * 2004-04-23 2005-11-04 Nec Corp Semiconductor device
JP2011086948A (en) * 2010-11-24 2011-04-28 Nec Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311205A (en) * 2004-04-23 2005-11-04 Nec Corp Semiconductor device
JP2011086948A (en) * 2010-11-24 2011-04-28 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JP3957347B2 (en) 2007-08-15

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