JPH10107443A - Multi-layered printed wiring board and manufacture thereof - Google Patents

Multi-layered printed wiring board and manufacture thereof

Info

Publication number
JPH10107443A
JPH10107443A JP26288496A JP26288496A JPH10107443A JP H10107443 A JPH10107443 A JP H10107443A JP 26288496 A JP26288496 A JP 26288496A JP 26288496 A JP26288496 A JP 26288496A JP H10107443 A JPH10107443 A JP H10107443A
Authority
JP
Japan
Prior art keywords
electric wire
hole
connection hole
wiring board
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26288496A
Other languages
Japanese (ja)
Inventor
Satoshi Isoda
聡 磯田
Hiroyoshi Yokoyama
博義 横山
Yasuhiro Iwasaki
康弘 岩崎
Kenshirou Fukusato
健志郎 福里
Koichi Noguchi
浩一 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lincstech Circuit Co Ltd
Original Assignee
Hitachi AIC Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi AIC Inc filed Critical Hitachi AIC Inc
Priority to JP26288496A priority Critical patent/JPH10107443A/en
Publication of JPH10107443A publication Critical patent/JPH10107443A/en
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve a connecting reliability in a multi-wiring system. SOLUTION: Inner layer circuits 3a and 3b are formed on upper and lower surfaces of a copper-clad laminate 2, on which an adhesive insulating layer 4 is formed. Then electric wires are wired within the bond insulating layer 4. A non-through connecting hole 11 and a through connecting hole 12 are made in the laminate, and these non-through and through-connecting holes 11 and 12 are connected with a copper wires 5a of electric wires 5. Then a non-through connecting hole 8 is made therein by a laser beam, and insulating resin 5b of the electric wires 5 within the non-through hole 8 is removed to leave the copper wires 5a.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、埋設された電線と
貫通接続穴または非貫通接続穴とを電気的に接続するマ
ルチワイヤー方式よる多層プリント配線板およびその製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-wire multi-layer printed wiring board for electrically connecting a buried electric wire and a through connection hole or a non-through connection hole, and a method of manufacturing the same.

【０００２】[0002]

【従来の技術】一般に、この種の多層プリント配線板に
おいては、埋設された電線は絶縁樹脂で被覆されてお
り、貫通接続穴または非貫通接続穴によって、電線と電
線または電線と内層回路あるいは電線と外層回路とが相
互に接続されている。このように、絶縁樹脂で被覆され
た電線によって配線が行われるので、電気配線の論理回
路図をそのまま布線するすることができ、論理回路から
回路デザイン（アートワーク）の工程が不要となる、あ
るいは最短距離での接続が可能となるといった特長を有
している。2. Description of the Related Art In general, in a multilayer printed wiring board of this kind, a buried electric wire is covered with an insulating resin, and the electric wire and the electric wire or the electric wire and the inner layer circuit or the electric wire are formed by a through connection hole or a non-through connection hole. And the outer layer circuit are mutually connected. As described above, since the wiring is performed by the electric wires covered with the insulating resin, the logic circuit diagram of the electrical wiring can be laid as it is, and the process of circuit design (artwork) from the logic circuit becomes unnecessary. Alternatively, it has the feature that connection at the shortest distance is possible.

【０００３】このマルチワイヤー方式よる多層プリント
配線板の製造方法は、銅張積層板をエッチングして内層
回路を形成し、銅張積層板の両面に接着絶縁層を塗布す
ると同時に、この接着絶縁層内に絶縁樹脂で被覆された
電線（銅線）を布線する。そして、ドリルによって貫通
穴または非貫通穴を穿孔した後に、スミア除去処理、め
っき触媒付与を行い、銅めっき処理によって最外層およ
び貫通穴または非貫通穴に導体を形成して、貫通接続穴
または非貫通接続穴を形成し、最後にエッチングにより
外層回路を形成している。A method of manufacturing a multilayer printed wiring board by the multi-wire method is to form an inner layer circuit by etching a copper-clad laminate, apply an adhesive insulating layer to both sides of the copper-clad laminate, and simultaneously Inside, an electric wire (copper wire) covered with an insulating resin is laid. Then, after drilling a through hole or a non-through hole, a smear removal treatment and a plating catalyst are performed, and a conductor is formed in the outermost layer and the through hole or the non-through hole by a copper plating treatment to form a through connection hole or a non-through hole. A through connection hole is formed, and finally an outer layer circuit is formed by etching.

【０００４】[0004]

【発明が解決しようとする課題】上述した従来のマルチ
ワイヤー方式よる多層プリント配線板においては、貫通
穴または非貫通穴をドリルによって穿孔しているため
に、穿孔する際に貫通穴または非貫通穴と交叉する電線
は同時に切削される。したがって、貫通接続穴または非
貫通接続穴と電線との電気的接続は、電線の切断面のみ
を介して行われるために、貫通接続穴または非貫通接続
穴との接続面積が小さい。また、ドリルによって切削す
る際に電線の切断面に樹脂が残る、いわゆるスミア残り
が発生する。このため、電線と貫通接続穴または非貫通
接続穴との接続信頼性が低く、電線を用いずに内層回路
によって貫通接続穴または非貫通接続穴との接続を行う
一般的な多層プリント配線板と比較して、マルチワイヤ
ー方式の場合には接続信頼性が劣るといった問題があっ
た。In the above-described conventional multi-wire multi-layer printed wiring board, a through hole or a non-through hole is formed by drilling. The wires crossing with are cut at the same time. Therefore, since the electrical connection between the through connection hole or the non-through connection hole and the electric wire is performed only through the cut surface of the electric wire, the connection area with the through connection hole or the non-through connection hole is small. Further, when cutting with a drill, resin remains on the cut surface of the electric wire, that is, so-called smear residue occurs. For this reason, the connection reliability between the electric wire and the through connection hole or the non-through connection hole is low, and a general multilayer printed wiring board that connects the through connection hole or the non-through connection hole by the inner layer circuit without using the electric wire. In comparison, in the case of the multi-wire system, there is a problem that connection reliability is inferior.

【０００５】したがって、本発明は上記した従来の問題
を解決するためになされたもので、その目的とするとこ
ろは、マルチワイヤー方式における接続信頼性の向上を
図った多層プリント配線板およびその製造方法を提供す
ることにある。Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a multi-layer printed wiring board with improved connection reliability in a multi-wire system and a method of manufacturing the same. Is to provide.

【０００６】[0006]

【課題を解決するための手段】この目的を達成するため
に、本発明に係る多層プリント配線板は、内層回路と外
層回路との間に埋設された電線と、この電線が接続され
る貫通接続穴または非貫通接続穴とを備えた多層プリン
ト配線板であって、前記貫通接続穴または非貫通接続穴
内の電線を被覆を除去した状態で残存させたものであ
る。したがって、貫通接続穴または非貫通接続穴と電線
との接続は、残存させた電線の外周面全体によって行わ
れる。In order to achieve this object, a multilayer printed wiring board according to the present invention comprises a wire embedded between an inner layer circuit and an outer layer circuit, and a through connection to which the wire is connected. A multilayer printed wiring board provided with a hole or a non-through connection hole, wherein an electric wire in the through connection hole or the non-through connection hole is left in a state where a coating is removed. Therefore, the connection between the through connection hole or the non-through connection hole and the electric wire is performed by the entire outer peripheral surface of the remaining electric wire.

【０００７】[0007]

【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。図１は本発明に係る多層プリント配
線板の製造方法を説明するための断面図、図２はレーザ
で穿孔した状態とドリルで穿孔した状態とを示したもの
で、（ａ）は図１（ｄ）におけるII（ａ）部を拡大して
示す電線のモデル図、（ｂ）は図１（ｄ）におけるII
（ｂ）部を拡大して示す電線のモデル図である。図１に
基づいて本発明の多層プリント配線板の製造方法を説明
する。同図（ａ）において、符号２で示すものは、めっ
き触媒入りガラスエポキシ樹脂からなる銅張積層板であ
って、上下の表面に接着された銅箔にエッチングを施す
ことによって内層回路３ａ，３ｂが形成される。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view for explaining a method for manufacturing a multilayer printed wiring board according to the present invention, and FIG. 2 shows a state in which laser drilling and a state in which drilling is performed. FIG. 1 (d) is a model diagram of an electric wire showing an enlarged part II (a), and FIG.
It is a model figure of the electric wire which expands and shows (b) part. A method for manufacturing a multilayer printed wiring board according to the present invention will be described with reference to FIG. In FIG. 1A, reference numeral 2 denotes a copper-clad laminate made of a glass epoxy resin containing a plating catalyst, and inner layers 3a and 3b are formed by etching a copper foil bonded to upper and lower surfaces. Is formed.

【０００８】同図（ｂ）において、銅張積層板２の上下
および内層回路３ａ，３ｂの上下に接着絶縁層４を塗布
し、銅線５ａを絶縁樹脂５ｂで被覆した電線５を接着絶
縁層４中に布線する。次に、同図（ｃ）に示すように、
プリプレグ６と銅箔７とを重ねてプレス加工によって接
着絶縁層４上に多層化する。そして、同図（ｄ）におい
て、レーザビーム光を銅箔７側から一方の内層回路３ａ
方向に照射して、銅箔７、プリプレグ６および接着剤層
４を貫通する非貫通穴８を凹設する。In FIG. 1B, an adhesive insulating layer 4 is applied to the upper and lower portions of the copper-clad laminate 2 and the upper and lower portions of the inner layer circuits 3a and 3b, and the electric wire 5 in which the copper wire 5a is covered with the insulating resin 5b is bonded to the adhesive insulating layer. Wire inside 4. Next, as shown in FIG.
The prepreg 6 and the copper foil 7 are stacked and multilayered on the adhesive insulating layer 4 by press working. Then, in FIG. 3D, the laser beam is applied from the copper foil 7 side to one of the inner layer circuits 3a.
A non-through hole 8 penetrating through the copper foil 7, the prepreg 6, and the adhesive layer 4 is formed by irradiating in the direction.

【０００９】このとき、電線５を被覆している絶縁樹脂
５ｂが熱によって除去されるが、電線５の導体部として
の銅線５ａは除去されずに、図２（ａ）に示すように非
貫通穴８内に残存する。また、このとき、接着絶縁層４
のうち、電線５の下方側に位置する接着絶縁層４ａは、
レーザビーム光を照射した際の影となり、除去されにく
いが、単に非貫通穴８を穿孔するときよりも照射時間を
多くかけることにより、照射量が多くなり、これによっ
て接着絶縁層４ａを熱によって除去することができる。At this time, the insulating resin 5b covering the electric wire 5 is removed by heat, but the copper wire 5a as a conductor of the electric wire 5 is not removed, and the non-conductive resin 5b as shown in FIG. It remains in the through hole 8. At this time, the adhesive insulating layer 4
Among them, the adhesive insulating layer 4a located below the electric wire 5 is:
Although it becomes a shadow when the laser beam is irradiated and is not easily removed, the irradiation amount is increased by increasing the irradiation time as compared with the case where the non-penetrating hole 8 is simply drilled, so that the adhesive insulating layer 4a is heated by the heat. Can be removed.

【００１０】このようにして、レーザビーム光の照射に
より接着絶縁層４のみが除去されるので、非貫通穴８内
に残存した電線５の銅線５ａの表面には、接着絶縁層４
の残り、いわゆるスミア残りが発生しない。この非貫通
穴８を穿孔した後に、ドリルによって、他方の内層回路
３ｂに対応した位置に貫通穴９を穿孔する。ドリルによ
って穿孔されるため、電線５は貫通穴９と同様にドリル
によって切削され、図２（ｂ）に示すように切断面５ｃ
のみが貫通穴９の壁面から露呈する。In this way, only the adhesive insulating layer 4 is removed by the irradiation of the laser beam, so that the surface of the copper wire 5a of the electric wire 5 remaining in the non-through hole 8 is
No smear remains. After drilling the non-through hole 8, a through hole 9 is drilled at a position corresponding to the other inner layer circuit 3b by a drill. Since the electric wire 5 is drilled by the drill, the electric wire 5 is cut by the drill in the same manner as the through hole 9, and as shown in FIG.
Only the wall is exposed from the wall of the through hole 9.

【００１１】このようにドリルによって接着絶縁層４と
電線５とを同時に切削するため、切削時に発生する熱に
よって、接着絶縁層４の切削屑が断面５ｃに付着し易
く、このため断面５ｃにスミア残りが発生し易い。次
に、同図（ｅ）に示すように、スミア除去処理、無電解
めっき用触媒付与処理後、無電解銅めっき処理を施し、
エッチングによって、外層回路１０、非貫通接続穴１１
および貫通接続穴１２を形成する。Since the adhesive insulating layer 4 and the electric wire 5 are simultaneously cut by the drill as described above, heat generated at the time of cutting easily causes cutting chips of the adhesive insulating layer 4 to adhere to the cross section 5c. Remains easily occur. Next, as shown in FIG. 3E, after the smear removing treatment and the catalyst applying treatment for the electroless plating, an electroless copper plating treatment is performed.
The outer layer circuit 10 and the non-through connection hole 11 are etched by etching.
And a through connection hole 12 is formed.

【００１２】このとき、非貫通接続穴１１内には、電線
５の銅線５ａが露呈した状態で残存しているので、銅線
５ａの表面全体に銅めっき１１ａが析出され、この析出
された銅めっき１１ａを介して電線５と非貫通接続穴１
１とが接続されるため、接続面積が大きくなる。一方、
貫通接続穴１２内の電線５は切削されるので、電線５と
貫通接続穴１２との接続は、従来技術と同様に電線５の
切断面５ｃを介して行われるため、接続面積が小さい。At this time, since the copper wire 5a of the electric wire 5 remains exposed in the non-through connection hole 11, the copper plating 11a is deposited on the entire surface of the copper wire 5a, and the deposited copper plating 11a is formed. Non-penetrating connection hole 1 with electric wire 5 via copper plating 11a
1 is connected, the connection area is increased. on the other hand,
Since the electric wire 5 in the through connection hole 12 is cut, the connection between the electric wire 5 and the through connection hole 12 is made through the cut surface 5c of the electric wire 5 as in the related art, so that the connection area is small.

【００１３】表１は、非貫通接続穴１１と電線５の銅線
５ａ間（本実施の形態）の導通接続信頼性と、貫通接続
穴１２と電線５の切断面５ｃ間（従来技術）の導通接続
信頼性を比較したものである。この表から明らかなよう
に、本実施の形態の方が従来技術よりも導通接続信頼性
が高いことがわかる。Table 1 shows the reliability of the continuity between the non-through connection hole 11 and the copper wire 5a of the electric wire 5 (this embodiment) and the relationship between the through connection hole 12 and the cut surface 5c of the electric wire 5 (prior art). It is a comparison of conduction connection reliability. As is clear from this table, the present embodiment has higher conduction connection reliability than the prior art.

【００１４】[0014]

【表１】 ※：ＪＩＳ Ｃ５０１２ 両面プリント板用複合テスト
パターン付図1.1,1.2 試料Ｄを片側に形成した多層板を
作成。ただし、電線の径φ０．１５mm、非貫通接続穴径
φ０．４mmに変更し、１層〜２層間距離８０μｍ、めっ
き厚さ３０μｍで作成。 ※※：ＪＩＳ Ｃ５０１２ 熱衝撃（高温浸せき）試験
の条件で２００サイクル処理。処理後の導通抵抗値を測
定。ＪＩＳ Ｃ５０１４の規定により、初期値に対する
導通抵抗値変化率が±１０％以下であれば合格となる。[Table 1] *: JIS C5012 Double-sided printed board with composite test pattern Figures 1.1, 1.2 Multi-layer board with sample D formed on one side. However, the diameter of the electric wire was changed to φ0.15 mm and the diameter of the non-through connection hole was changed to φ0.4 mm. **: 200 cycles under JIS C5012 thermal shock (high temperature immersion) test conditions. Measure the conduction resistance after processing. According to the provisions of JIS C5014, if the rate of change of the conduction resistance value with respect to the initial value is ± 10% or less, the test passes.

【００１５】[0015]

【実施例】電線５は、厚さ０．０７mmのポリイミド樹脂
５ｂで被覆された径０．１５mmの銅線５ａを使用した。
銅箔７の厚さは、１８μｍである。レーザビーム光は、
発信波長１０4〜１０8ヘルツの短パルスＣＯ2レーザを
用いた。スミア除去処理は、３８℃の無水クロム酸（９
５０ｇ／ｌ）で１８分間行う。DESCRIPTION OF THE PREFERRED EMBODIMENTS As the electric wire 5, a copper wire 5a having a diameter of 0.15 mm and coated with a polyimide resin 5b having a thickness of 0.07 mm was used.
The thickness of the copper foil 7 is 18 μm. Laser beam light is
A short pulse CO 2 laser with an emission wavelength of 10 4 to 10 8 Hertz was used. The smear removal treatment is performed at 38 ° C. with chromic anhydride (9
50 g / l) for 18 minutes.

【００１６】図３は本発明の第２の実施の形態を示す断
面図である。この第２の実施の形態では、貫通穴を形成
する部位に内層回路が配置されていない場合であって、
この場合には、貫通穴の形成をドリルでなく、非貫通穴
と同様にレーザビーム光で形成したものである。この場
合には、貫通穴内の電線５の銅線５ａは除去されずに、
貫通穴内に残存するので、貫通接続穴１２と電線５との
間の導通接続信頼性が高くなる。FIG. 3 is a sectional view showing a second embodiment of the present invention. In the second embodiment, the case where the inner layer circuit is not arranged at the portion where the through hole is formed,
In this case, the through hole is formed not by a drill but by a laser beam in the same manner as a non-through hole. In this case, the copper wire 5a of the electric wire 5 in the through hole is not removed,
Since it remains in the through hole, the reliability of the conductive connection between the through connection hole 12 and the electric wire 5 increases.

【００１７】なお、本実施の形態では、外層回路１０、
非貫通接続穴１１、貫通接続穴１１をサブトラクティブ
法によって形成したが、フルアディティブ法で形成して
もよい。In the present embodiment, the outer circuit 10,
Although the non-through connection holes 11 and the through connection holes 11 are formed by a subtractive method, they may be formed by a full additive method.

【００１８】[0018]

【発明の効果】以上説明したように本発明によれば、内
層回路と外層回路との間に埋設された電線と、この電線
が接続される貫通接続穴または非貫通接続穴とを備え、
貫通接続穴または非貫通接続穴内の電線を被覆を除去し
た状態で残存させたことにより、貫通接続穴または非貫
通接続穴と電線との接続を電線の銅線の表面を介して行
うことができるので、接続面積が大きくなり、このため
貫通接続穴または非貫通接続穴と電線との間の接導通接
続信頼性が向上する。As described above, according to the present invention, there is provided an electric wire buried between an inner layer circuit and an outer layer circuit, and a through connection hole or a non-through connection hole to which the electric wire is connected.
By leaving the wire in the through connection hole or the non-through connection hole with the coating removed, the connection between the through connection hole or the non-through connection hole and the wire can be performed through the surface of the copper wire of the wire. Therefore, the connection area is increased, and the reliability of the connection between the through connection hole or the non-through connection hole and the electric wire is improved.

【図面の簡単な説明】[Brief description of the drawings]

【図１】 本発明に係る多層プリント配線板の製造方法
を説明するための断面図である。FIG. 1 is a cross-sectional view for explaining a method for manufacturing a multilayer printed wiring board according to the present invention.

【図２】 （ａ）は図１（ｄ）におけるII（ａ）部を拡
大して示す電線のモデル図、（ｂ）は図１（ｄ）におけ
るII（ｂ）部を拡大して示す電線のモデル図である。2 (a) is a model diagram of an electric wire showing an enlarged part II (a) in FIG. 1 (d), and FIG. 2 (b) is an electric wire showing an enlarged part II (b) in FIG. 1 (d). FIG.

【図３】 本発明に係る多層プリント配線板の第２の実
施の形態を示す断面図である。FIG. 3 is a sectional view showing a second embodiment of the multilayer printed wiring board according to the present invention.

【符号の説明】[Explanation of symbols]

１…多層プリント配線板、３ａ，３ｂ…内層回路、４…
接着絶縁層、５…電線、５ａ…銅線、５ｂ…絶縁樹脂、
５ｃ…切断面、８…非貫通穴、９…貫通穴、１０…外層
回路、１１…非貫通接続穴、１２…貫通接続穴。DESCRIPTION OF SYMBOLS 1 ... Multilayer printed wiring board, 3a, 3b ... Inner layer circuit, 4 ...
Adhesive insulating layer, 5: electric wire, 5a: copper wire, 5b: insulating resin,
5c: cut surface, 8: non-through hole, 9: through hole, 10: outer layer circuit, 11: non-through connection hole, 12: through connection hole.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 福里 健志郎 栃木県芳賀郡二宮町大字久下田1065番地 日立エーアイシー株式会社内 (72)発明者 野口 浩一 栃木県芳賀郡二宮町大字久下田1065番地 日立エーアイシー株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kenshiro Fukusato 1065 Kusita, Ninomiya-cho, Haga-gun, Tochigi Prefecture Inside Hitachi AIC Co., Ltd. Sea Corporation

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 内層回路と外層回路との間に埋設された
電線と、この電線が接続される貫通接続穴または非貫通
接続穴とを備えた多層プリント配線板において、前記貫
通接続穴または非貫通接続穴内の電線を被覆を除去した
状態で残存させたことを特徴とする多層プリント配線
板。1. A multilayer printed wiring board comprising an electric wire buried between an inner layer circuit and an outer layer circuit, and a through connection hole or a non-through connection hole to which the electric wire is connected. A multilayer printed wiring board wherein an electric wire in a through connection hole is left in a state where a coating is removed. 【請求項２】 内層回路と外層回路との間に埋設された
電線と、この電線が接続される貫通接続穴または非貫通
接続穴とを備えた多層プリント配線板において、前記貫
通接続穴または非貫通接続穴をレーザによって穿孔した
ことを特徴とする多層プリント配線板の製造方法。2. A multilayer printed wiring board comprising an electric wire buried between an inner layer circuit and an outer layer circuit, and a through connection hole or a non-through connection hole to which the electric wire is connected. A method for manufacturing a multilayer printed wiring board, characterized in that a through connection hole is formed by a laser.
JP26288496A 1996-10-03 1996-10-03 Multi-layered printed wiring board and manufacture thereof Pending JPH10107443A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26288496A JPH10107443A (en) 1996-10-03 1996-10-03 Multi-layered printed wiring board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26288496A JPH10107443A (en) 1996-10-03 1996-10-03 Multi-layered printed wiring board and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH10107443A true JPH10107443A (en) 1998-04-24

Family

ID=17381969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26288496A Pending JPH10107443A (en) 1996-10-03 1996-10-03 Multi-layered printed wiring board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH10107443A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014168050A (en) * 2013-01-30 2014-09-11 Hitachi Chemical Co Ltd Multilayer wiring board and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014168050A (en) * 2013-01-30 2014-09-11 Hitachi Chemical Co Ltd Multilayer wiring board and method for manufacturing the same

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