JPH0957942A - Squeegee device for screen printing machine - Google Patents
Squeegee device for screen printing machineInfo
- Publication number
- JPH0957942A JPH0957942A JP21863795A JP21863795A JPH0957942A JP H0957942 A JPH0957942 A JP H0957942A JP 21863795 A JP21863795 A JP 21863795A JP 21863795 A JP21863795 A JP 21863795A JP H0957942 A JPH0957942 A JP H0957942A
- Authority
- JP
- Japan
- Prior art keywords
- squeegee
- squeegee device
- screen
- solder
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はスクリーン印刷機用
スキージ装置に関し、詳しくは印刷配線基板にメタルス
クリーンを用いてクリーム状半田等を塗布する為のスキ
ージ装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a squeegee device for a screen printing machine, and more particularly to a squeegee device for applying cream solder or the like to a printed wiring board using a metal screen.
【０００２】[0002]
【従来の技術】従来より、印刷配線基板上にメタルスク
リーンとスキージ装置を用いて、クリーム状の半田を塗
布する印刷法が行われており、そこで生じる問題を図４
〜図６を参照して以下に説明する。図４は従来のスキー
ジ装置を示し、（ａ）は側面図、（ｂ）は正面図であ
る。図５はこのスキージ装置を用いて印刷配線基板上に
クリーム状半田を塗布する工程の正面図であり、図６は
このスキージ装置を用いて印刷配線基板上にクリーム状
半田を塗布した後の印刷配線基板の側断面図である。2. Description of the Related Art Conventionally, a printing method of applying cream-like solder on a printed wiring board by using a metal screen and a squeegee device has been performed.
~ It demonstrates below with reference to FIG. FIG. 4 shows a conventional squeegee device, (a) is a side view and (b) is a front view. FIG. 5 is a front view of a step of applying creamy solder onto a printed wiring board using this squeegee device, and FIG. 6 is a printing process after applying creamy solder onto a printed wiring board using this squeegee device. It is a sectional side view of a wiring board.
【０００３】図５に示す如く、ステンレス等から成るメ
タルスクリーン１には印刷配線基板２のクリーム状半田
を塗布する予定領域に対応して、複数の透孔１ａ〜１ｆ
が設けられ、さらに印刷配線基板２上に予めチップ部品
３が接着剤で固着されている場合には、これを逃げるべ
く膨出部４が設けられている。As shown in FIG. 5, the metal screen 1 made of stainless steel or the like has a plurality of through holes 1a to 1f corresponding to the areas of the printed wiring board 2 where the creamy solder is to be applied.
When the chip component 3 is previously fixed on the printed wiring board 2 with an adhesive, the bulging portion 4 is provided to escape this.
【０００４】従来のスキージ装置１０１は図４に示すご
とく、ゴムまたは合成樹脂から成り先端を先細にした平
板状のスキージ５をスキージホルダ６に固定して構成さ
れている。As shown in FIG. 4, a conventional squeegee device 101 is constructed by fixing a flat squeegee 5 made of rubber or synthetic resin and having a tapered tip to a squeegee holder 6.
【０００５】このスキージ装置１０１を用いて、クリー
ム状半田を塗布する際スキージ５の先端は膨出部４の近
傍において、逃げ７が生じる。この逃げ７の部分におい
ては、クリーム状半田が払拭できず多量のクリーム状半
田がメタルスクリーン１上に残存する。When the creamy solder is applied by using this squeegee device 101, the tip of the squeegee 5 has a clearance 7 near the bulging portion 4. In the portion of the escape 7, the creamy solder cannot be wiped off, and a large amount of the creamy solder remains on the metal screen 1.
【０００６】図６にメタルスクリーン１を取り去った後
の印刷配線基板２上のクリーム状半田８ａ〜８ｆの状態
を示すが、スキージに逃げ７が生じた部分においては、
メタルスクリーン１を取り去る際、半田を一緒に取り去
ってしまい予定した量の半田が塗布できない状態を生じ
る。半田量の不足が生じた領域は８ａ、８ｂ、８ｄ、８
ｅであり、膨出部４より離れた領域の８ｃ、８ｆでは予
定した量の半田が塗布されている。FIG. 6 shows the state of the creamy solders 8a to 8f on the printed wiring board 2 after the metal screen 1 is removed. At the portion where the escape 7 has occurred on the squeegee,
When the metal screen 1 is removed, the solder is also removed together, which causes a state in which a predetermined amount of solder cannot be applied. 8a, 8b, 8d, 8 are the areas where the amount of solder is insufficient.
e, and a predetermined amount of solder is applied to the regions 8c and 8f apart from the bulging portion 4.
【０００７】[0007]
【発明が解決しようとする課題】そこで本発明の課題は
かかるスクリーン印刷機用スキージ装置を改良し、スク
リーンに膨出部が存在しても、スクリーン上のクリーム
状半田等の払拭を完全に行えるスキージ装置を提供する
ことである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to improve such a squeegee device for a screen printing machine so that even if there is a bulging portion on the screen, creamy solder or the like on the screen can be completely wiped off. A squeegee device is provided.
【０００８】[0008]
【課題を解決するための手段】かかる課題を解決するた
めに請求項１の発明に係るスクリーン印刷機用スキージ
装置は先細の弾性体から成る第１のスキージと、第１の
スキージに貼り合わせた軟質材から成り、その先端部を
第１のスキージより突き出した突出部を設けた第２のス
キージと、、第１、第２のスキージの他端を取り付けた
スキージホルダより成る構成とし、スクリーン上を払拭
した際、スクリーンの膨出部の近辺を第２のスクリーン
が払拭を行う。In order to solve the above problems, a squeegee device for a screen printing machine according to the invention of claim 1 is attached to a first squeegee and a first squeegee made of a tapered elastic body. On the screen, a second squeegee made of a soft material, the tip of which is provided with a protrusion protruding from the first squeegee, and a squeegee holder to which the other ends of the first and second squeegees are attached, When the second screen is wiped, the second screen wipes the vicinity of the bulging portion of the screen.
【０００９】[0009]
【発明の実施の形態】以下、図１ないし図３を参照し
て、本発明のスクリーン印刷機用のスキージ装置の構造
とその作用について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure and operation of a squeegee device for a screen printing machine according to the present invention will be described below with reference to FIGS.
【００１０】図１は本発明の実施の形態を示すスキージ
装置で、（ａ）は側面図、（ｂ）は正面図である。本発
明においては、通常の弾性を有する第１のスキージ５ａ
に対し、軟質のゴム又は合成樹脂から成る第２のスキー
ジ５ｂを貼り合わせ、第２のスキージ５ｂの先端部を第
１のスキージより突き出し、突出部５ｃを設け、これら
をスキージホルダ６に取り付けた構成とした。FIG. 1 is a squeegee device showing an embodiment of the present invention, (a) is a side view and (b) is a front view. In the present invention, the first squeegee 5a having ordinary elasticity is used.
On the other hand, a second squeegee 5b made of soft rubber or synthetic resin was attached, the tip of the second squeegee 5b was projected from the first squeegee, and a protrusion 5c was provided, which was attached to the squeegee holder 6. It was configured.
【００１１】このスキージ装置９を用いて、クリーム状
半田を印刷配線基板上に塗布する状態を図２に示して説
明すると、ステンレス等から成るメタルスクリーン１に
は印刷配線基板２のクリーム状半田を塗布する予定領域
に対応して、複数の透孔１ａ〜１ｆが設けられ、さらに
印刷配線基板２上に予めチップ部品３が接着剤で固着さ
れている場合には、これを逃げるべく膨出部４が設けら
れている。A state in which the creamy solder is applied onto the printed wiring board by using the squeegee device 9 will be described with reference to FIG. 2, and the creamy solder of the printed wiring board 2 is applied to the metal screen 1 made of stainless steel or the like. When a plurality of through holes 1a to 1f are provided corresponding to the area to be applied and the chip component 3 is previously fixed on the printed wiring board 2 with an adhesive, the bulging portion is to escape this. 4 are provided.
【００１２】このスキージ装置９を用いて、クリーム状
半田を塗布すると、第１のスキージ５ａの先端は膨出部
４の近傍において、従来と同様に逃げ７が生じる。しか
しながら、第１のスキージ５ａの裏に貼着された軟質材
から成る第２のスキージ５ｂが逃げ７の部分に追従して
入り込み、逃げ７の部分のクリーム状半田を完全に払拭
する。When creamy solder is applied by using this squeegee device 9, the tip of the first squeegee 5a has a relief 7 in the vicinity of the bulge 4 as in the conventional case. However, the second squeegee 5b made of a soft material, which is attached to the back of the first squeegee 5a, follows the portion of the escape 7 and enters and completely wipes out the creamy solder in the portion of the escape 7.
【００１３】その結果、図３に示す如く塗布後のクリー
ム状半田１０ａ〜１０ｆは、メタルスクリーン１に設け
た透孔１ａ〜１ｆの容積によって、決められた予定量が
塗布される。As a result, as shown in FIG. 3, the creamy solder 10a to 10f after application is applied in a predetermined amount determined by the volume of the through holes 1a to 1f provided in the metal screen 1.
【００１４】[0014]
【発明の効果】以上の説明から明らかなように、本発明
によるスクリーン印刷機用スキージ装置によれば、クリ
ーム状半田等の塗布が、メタルスクリーンの膨出部によ
る払拭の残りがなく実行できる。As is apparent from the above description, according to the squeegee device for a screen printing machine of the present invention, the application of cream-like solder or the like can be performed without leaving the wiping by the bulging portion of the metal screen.
【図１】 本発明のスキージ装置を示し、（ａ）は側面
図、（ｂ）は正面図である。1 shows a squeegee device of the present invention, (a) is a side view and (b) is a front view.
【図２】 本発明のスキージ装置を用いて、印刷配線基
板上にクリーム状半田を塗布している状態の正面図であ
る。FIG. 2 is a front view showing a state in which cream solder is applied on a printed wiring board using the squeegee device of the present invention.
【図３】 本発明のスキージ装置を用いて、クリーム状
半田を塗布した状態の印刷配線基板の側断面図である。FIG. 3 is a side sectional view of the printed wiring board in a state where creamy solder is applied using the squeegee device of the present invention.
【図４】 従来のスキージ装置を示し、（ａ）は側面
図、（ｂ）は正面図である。FIG. 4 shows a conventional squeegee device, (a) is a side view and (b) is a front view.
【図５】 従来のスキージ装置を用いて、印刷配線基板
上にクリーム状半田を塗布している状態の正面図であ
る。FIG. 5 is a front view of a conventional squeegee device in which creamy solder is applied onto a printed wiring board.
【図６】 従来のスキージ装置を用いて、クリーム状半
田を塗布した状態の印刷配線基板の側断面図である。FIG. 6 is a side sectional view of a printed wiring board in a state where creamy solder is applied using a conventional squeegee device.
１ メタルスクリーン １ａ〜１ｆ 透孔 ２ 印刷配線基板 ３ チップ部品 ４ 膨出部 ５ スキージ ５ａ 第１のスキージ ５ｂ 第２のスキージ ５ｃ 突出部 ６ スキージホルダ ７ 逃げ ８ａ、〜８ｆ クリーム状半田 ９ 本発明のスキージ装置 １０ａ〜１０ｆ クリーム状半田 １０１ 従来のスキージ装置 DESCRIPTION OF SYMBOLS 1 Metal screen 1a-1f Through hole 2 Printed wiring board 3 Chip component 4 Bulging part 5 Squeegee 5a 1st squeegee 5b 2nd squeegee 5c Projection part 6 Squeegee holder 7 Relief 8a, ~ 8f Creamy solder 9 of this invention Squeegee device 10a to 10f Creamy solder 101 Conventional squeegee device
Claims (1)
と、 前記第１のスキージに貼り合わせた軟質材から成り、先
端部を第１のスキージより突き出した突出部を設けた第
２のスキージと、 前記第１、第２のスキージの他端を取り付けたスキージ
ホルダより成る、スクリーン印刷機用スキージ装置。1. A second squeegee comprising a first squeegee made of a tapered elastic body and a soft material bonded to the first squeegee, and having a protruding portion whose tip portion protrudes from the first squeegee. And a squeegee holder to which the other ends of the first and second squeegees are attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21863795A JPH0957942A (en) | 1995-08-28 | 1995-08-28 | Squeegee device for screen printing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21863795A JPH0957942A (en) | 1995-08-28 | 1995-08-28 | Squeegee device for screen printing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0957942A true JPH0957942A (en) | 1997-03-04 |
Family
ID=16723074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21863795A Pending JPH0957942A (en) | 1995-08-28 | 1995-08-28 | Squeegee device for screen printing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0957942A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2765813A1 (en) * | 1997-07-11 | 1999-01-15 | Novatec | SQUEEGEE FOR APPLICATION OF PRODUCTS PRESENTING A HIGH DEGREE OF VISCOSITY AND THIXOTROPIC CHARACTERISTICS ON A SUBSTRATE WHICH MAY PRESENT VARIATIONS IN HEIGHT, THROUGH A STENCIL, APPLIED TO SAID SUBSTRATE |
-
1995
- 1995-08-28 JP JP21863795A patent/JPH0957942A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2765813A1 (en) * | 1997-07-11 | 1999-01-15 | Novatec | SQUEEGEE FOR APPLICATION OF PRODUCTS PRESENTING A HIGH DEGREE OF VISCOSITY AND THIXOTROPIC CHARACTERISTICS ON A SUBSTRATE WHICH MAY PRESENT VARIATIONS IN HEIGHT, THROUGH A STENCIL, APPLIED TO SAID SUBSTRATE |
| WO1999002346A1 (en) * | 1997-07-11 | 1999-01-21 | Societe Novatec S.A. | Doctor blade for applying products with high degree of viscosity and thixotropic properties on a substrate varying in height, through a stencil, applied to said substrate |
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