JPH0955635A - Method for slitting piezoelectric devices - Google Patents

Method for slitting piezoelectric devices

Info

Publication number
JPH0955635A
JPH0955635A JP22758495A JP22758495A JPH0955635A JP H0955635 A JPH0955635 A JP H0955635A JP 22758495 A JP22758495 A JP 22758495A JP 22758495 A JP22758495 A JP 22758495A JP H0955635 A JPH0955635 A JP H0955635A
Authority
JP
Japan
Prior art keywords
groove
piezoelectric substrate
grooves
piezoelectric
recessed parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22758495A
Other languages
Japanese (ja)
Other versions
JP3650437B2 (en
Inventor
Kazutoshi Fujita
和俊 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Communication Equipment Co Ltd
Original Assignee
Toyo Communication Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Communication Equipment Co Ltd filed Critical Toyo Communication Equipment Co Ltd
Priority to JP22758495A priority Critical patent/JP3650437B2/en
Publication of JPH0955635A publication Critical patent/JPH0955635A/en
Application granted granted Critical
Publication of JP3650437B2 publication Critical patent/JP3650437B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Dicing (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve the yield by forming integrally a vibration part of an ultrathin part and a thick torus surrounding part supporting it and forming a groove around the thick torus surrounding part to easily slit individual vibrators. SOLUTION: Mnay recessed parts 11 are formed on one side of a crystal piezoelectric substrate 10 with etching, a maintenance use torus surrounding 12 is formed around them and grooves 13, 14 are formed as a grating to the circumferential ridges to surround the surrounding 12. The grooves 13, 14 may be formed by etching simultaneously when the recessed parts 11 are formed by machining, or after the recessed parts 11 are formed by machining, the grooves 13, 14 in a grating form are formed by machining so as to surround the thick circumferential ridge supporting the recessed parts 11. After the frequency adjustment, each vibrator is splitted easily by exerting a force from the opposite side of the grooves 13, 14 by a razor-like blade after frequency adjustment. Since no mechanical distortion is exerted to the vibrators, the frequency versus temperature characteristic of the vibrators is improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はバッチ処理により形成し
た複数の圧電デバイスを大型圧電基板から切り離す方法
に関し、例えば、基本波振動で数１０乃至数１００ＭＨ
ｚに及ぶ共振周波数を得ることの出来る超薄板圧電デバ
イスの基板からの分離方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a plurality of piezoelectric devices formed by batch processing from a large-sized piezoelectric substrate.
The present invention relates to a method for separating an ultrathin piezoelectric device from a substrate capable of obtaining a resonance frequency extending to z.

【０００２】[0002]

【従来技術】近年、各種通信機において、高周波化、高
安定化や小型化への要求が強まり、これに呼応すべく種
々の工夫がなされてきた。従来より圧電デバイス（振動
子、フィルタ）として多用されてきた一般のＡＴカット
水晶振動子は、周波数ー温度特性が極めて優れている
が、その共振周波数は板厚に反比例するため、製造技術
及び機械的強度の観点から４０から５０ＭＨｚ程度が限
界であった。上述の如き限界を解決するため、超高周波
圧電デバイスが既に、特開平３ー２３５４０８に開示さ
れている。即ち、図３（ａ）、（ｂ）に示すような圧電
共振子が研究され、実用に供されている。ここで、図３
（ｂ）は（ａ）のＡ−Ａにおける断面図である。該圧電
共振子は図１（ａ）に示す如く、ＡＴカット水晶板１の
片面の中央部に機械加工またはエッチング加工によって
凹陥部２を形成すると共に、超薄肉の振動部と凹陥部２
の周縁の厚肉部３とを一体的に構成する。凹陥部２の底
面に位置する超薄肉部である振動部４の厚さを、所望の
周波数の厚さ、例えば、約１７(mの超薄板とすれば１０
０Ｍｈｚの基本波共振周波数を得ることができる。2. Description of the Related Art In recent years, in various communication devices, there has been an increasing demand for higher frequency, higher stability, and smaller size, and various devices have been devised to meet these demands. A general AT-cut crystal unit, which has been widely used as a piezoelectric device (resonator, filter), has excellent frequency-temperature characteristics, but its resonance frequency is inversely proportional to the plate thickness. The limit is about 40 to 50 MHz from the viewpoint of dynamic strength. In order to solve the above-mentioned limitations, a super high frequency piezoelectric device has already been disclosed in Japanese Patent Application Laid-Open No. 3-235408. That is, a piezoelectric resonator as shown in FIGS. 3A and 3B has been studied and put into practical use. Here, FIG.
(B) is sectional drawing in AA of (a). As shown in FIG. 1A, the piezoelectric resonator has a concave portion 2 formed at the center of one surface of an AT-cut quartz crystal plate 1 by machining or etching, and also has an ultra-thin vibrating portion and a concave portion 2.
And the thick-walled portion 3 at the peripheral edge thereof are integrally formed. If the thickness of the vibrating portion 4 which is an ultra-thin portion located on the bottom surface of the recessed portion 2 is a thickness of a desired frequency, for example, an ultra-thin plate of about 17 (m) is 10
A fundamental resonance frequency of 0 Mhz can be obtained.

【０００３】この様な超薄板圧電デバイスにおいては、
図３（ａ）、（ｂ）に示す様に、凹陥部２周縁部のブロ
ック外周部の厚肉部３は超薄肉の振動部４の周縁部を機
械的に支持する上で不可欠部分である。上記ような構造
を有する圧電基板の凹陥部の内側壁全面に図３（ｂ）に
示すように導体膜５を付着すると共に、その反対面の表
面に、部分電極７および、これから素板の端縁に延びる
電極リード８を真空蒸着等の手法を用いて付着すれば、
共振周波数の極めて高い圧電振動子を得ることができ
る。図３（ｃ）は大型圧電基板１０上に上記超薄板振動
部４を多数バッチ処理で形成した平面図であり、そのＢ
ーＢ断面は図３（ｄ）のようになる。従来、この様にバ
ッチ処理にて同一基板上に多数形成した圧電デバイスを
個々に分離する方法としては、図３（ｃ）に示す点線９
に沿って大型圧電基板１０をダイシングで切断してい
た。通常上記点線は、フォトリソグラフィ手法で電極を
形成する際に、同時に形成され、ダイシング時の案内線
として利用していた。分離された各チップ振動子は、例
えば、フラット・パッケージに固定し、ボンディング等
の方法で電気的導通を図り、さらに、周波数の微調整を
行い、蓋を取り付けて振動子として完成する。In such an ultra-thin plate piezoelectric device,
As shown in FIGS. 3 (a) and 3 (b), the thick portion 3 on the outer peripheral portion of the block at the peripheral portion of the recessed portion 2 is an indispensable portion for mechanically supporting the peripheral portion of the ultra-thin vibrating portion 4. is there. As shown in FIG. 3B, the conductor film 5 is attached to the entire inner wall surface of the recessed portion of the piezoelectric substrate having the above structure, and the partial electrode 7 and the end of the bare plate are formed on the opposite surface. If the electrode lead 8 extending to the edge is attached using a technique such as vacuum deposition,
A piezoelectric vibrator having an extremely high resonance frequency can be obtained. FIG. 3C is a plan view in which the ultra-thin plate vibrating section 4 is formed on the large-sized piezoelectric substrate 10 by a large number of batch processes.
The −B cross section is as shown in FIG. Conventionally, as a method of individually separating a plurality of piezoelectric devices formed on the same substrate by batch processing in this way, a dotted line 9 shown in FIG.
The large piezoelectric substrate 10 was cut by dicing. Usually, the dotted line was formed at the same time when the electrodes were formed by the photolithography method, and was used as a guide line during dicing. Each of the separated chip oscillators is fixed to, for example, a flat package, electrically connected by a method such as bonding, finely adjusted in frequency, and a lid is attached to complete the oscillator.

【０００４】しかしながら、上述したような従来の大型
圧電基板から個々のデバイスの分離方法では、アルミニ
ュウム（Ａｌ）などの物質を蒸着して電極パターンを形
成し、必要ならば周波数調整を行った後、多量の水を供
給しながらダイシング等でチップ振動子に分離する工程
をとるため、該チップ振動子は多量の水を被り、あるい
は研削屑等が付着し、電極膜の酸化や汚染をもたらし、
結果として周波数ー温度特性や周波数エージングの劣化
を招くという欠陥があた。さらに、機械的に切断するた
め機械的歪みが残存することによる共振周波数の大幅な
ずれや、超薄板の破損を招く等による不良品の発生をき
たすという不具合もあった。However, in the conventional method for separating individual devices from a large-sized piezoelectric substrate as described above, a material such as aluminum (Al) is vapor-deposited to form an electrode pattern and, if necessary, frequency adjustment is performed. Since a step of separating into chip oscillators by dicing etc. while supplying a large amount of water is taken, the chip oscillators are exposed to a large amount of water, or grinding debris, etc. adhere, causing oxidation and contamination of the electrode film,
As a result, there is a defect that the frequency-temperature characteristics and frequency aging are deteriorated. In addition, there is a problem that a mechanical distortion remains due to mechanical cutting, resulting in a large shift of the resonance frequency and a defective product due to damage of the ultra-thin plate.

【０００５】[0005]

【発明の目的】本発明は上記に鑑みてなされたものであ
り、大型圧電基板上に多数形成したデバイスを個々に分
離する際、水を必要とせず、しかも研削屑等の付着生ず
ることのない圧電デバイスの分離方法を提供することを
目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above, and when separating a large number of devices formed on a large-sized piezoelectric substrate individually, water is not required, and moreover, grinding dust or the like does not adhere. It is an object to provide a method for separating a piezoelectric device.

【０００６】[0006]

【発明の概要】上記目的を達成するために、本発明にお
いては大型圧電基板上にバッチ処理手法を用いて複数の
凹陥状超薄板デバイスを形成する際、該基板の分離が容
易に行えるように、超薄肉部とその周辺を保持する環状
囲繞部の周縁を囲むように格子状に溝を設け、または、
溝と該溝の破損を防ぐ補強部を併せ設けた溝をエッチン
グ等の手法で上記圧電基板上に形成し、該溝に基づいて
分離するようにしたことを特徴とする。SUMMARY OF THE INVENTION In order to achieve the above object, in the present invention, when a plurality of recessed ultra thin plate devices are formed on a large piezoelectric substrate by using a batch processing method, the substrates can be easily separated. A groove in a grid pattern so as to surround the periphery of the annular surrounding portion that holds the ultra-thin portion and its periphery, or
A groove having a groove and a reinforcing portion for preventing the groove from being damaged is formed on the piezoelectric substrate by a method such as etching, and the groove is separated based on the groove.

【０００７】[0007]

【発明の実施例】以下、添付した図面に示した実施例に
より本発明を詳細に説明する。実施例の説明に先立っ
て、本発明の理解を助けるため本発明の基礎となる超薄
板圧電振動子が何故にその凹陥部に全面電極を、その対
向面側に部分電極を設けるような電極構成を採用するか
について簡単に説明する。第一に真空蒸着技術の観点か
ら前述した如き圧電基板の凹陥部側振動部に部分電極
を、また該電極から前記凹陥部の内側壁および段差を越
えて幅の狭い電極リードを延長することは、圧電基板を
水平に対し傾けて蒸着を行う等の面倒な手法を用いれば
ともかく、極めて困難であって電極リードの導通確保に
不安があるため、該面を全面電極としいずれかの部分で
必ず電極リードを確保し得るようにしたものである。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in detail with reference to the embodiments shown in the accompanying drawings. Prior to the description of the embodiments, an electrode in which an ultra-thin plate piezoelectric vibrator, which is the basis of the present invention, is provided with a full-scale electrode in its concave portion and a partial electrode on its facing surface side in order to facilitate understanding of the present invention. A brief explanation will be given as to whether or not the configuration is adopted. First, from the viewpoint of vacuum deposition technology, it is not possible to extend a partial electrode in the recess side vibrating portion of the piezoelectric substrate as described above, and to extend a narrow electrode lead from the electrode across the inner wall of the recess and the step. However, even if a troublesome technique such as inclining the piezoelectric substrate with respect to the horizontal is used, it is extremely difficult and there is concern about ensuring the continuity of the electrode leads. The electrode lead can be secured.

【０００８】第二にこの様なタイプの振動子は元来、デ
バイスの超小型化を目的とし、圧電振動子のサイズは例
えば３ｍｍｘ３ｍｍ以下としたい。そうならば、一枚の
圧電ウェハー上にバッチ処理で一挙に多数のチップを形
成し、最後にこれを個々のチップに切断する方法を採用
できる。この場合、上述したタイプの電極構成を採用す
れば、ウェハーの一面には単に導体膜の全面蒸着を行え
ば足り、フォトマスクあるいはフォトリソグラフィ用マ
スクの微妙な位置合わせを要しないので、生産効率、歩
留まりを向上し、コスト低減することができる。以上の
如き理由により、超薄板圧電振動子は凹陥側に全面電極
を付着することを基本とするものである。Secondly, the vibrator of this type is originally intended for the miniaturization of the device, and the size of the piezoelectric vibrator is desired to be, for example, 3 mm × 3 mm or less. In that case, it is possible to adopt a method in which a large number of chips are formed all at once on a single piezoelectric wafer by batch processing, and the chips are finally cut into individual chips. In this case, if the electrode configuration of the above-mentioned type is adopted, it is sufficient to simply deposit the entire surface of the conductive film on one surface of the wafer, and the delicate alignment of the photomask or the photolithography mask is not required. It is possible to improve the yield and reduce the cost. For the reasons described above, the ultra-thin plate piezoelectric vibrator is based on the principle that the whole surface electrode is attached to the concave side.

【０００９】図１に本発明に係わる一実施例を示す。図
１（ａ）は分離用溝を大型圧電基板上に如何に構成する
かを説明する平面図で、ＡＴカット水晶圧電基板１０の
片面上にフォトリソグラフィ技法を用いたエッチング加
工で多数の凹陥部１１を形成し、その周辺には保持用環
状囲繞部１２を残すように形成し、該環状囲繞部１２を
取り囲むように周縁に溝１３、１４を格子状に形成す
る。この溝１３、１４は凹陥部の形成と同時にエッチン
グによって形成してもよいが、凹陥部を機械加工で形成
した後、その凹陥部を保持する厚肉の周縁部を取り囲む
ように溝１３、１４を格子状に機械加工で構築してもよ
い。溝をエッチング加工で形成する場合は、溝の幅及び
深さは、エッチング量と結晶軸方向とに依存する。実験
による一例を挙げると、共振周波数９０ＭＨｚの超薄板
振動子では、一般に厚さ約８０(mの大型圧電基板を用
い、凹陥部の底面の振動部位では厚さは約１８(mとな
る。この時の溝の幅および深さに関するデータの一例を
示すと、図１（ａ）の左隅に示された軸方位にそって、
Ｚ’軸方向に溝を形成するする場合、溝用マスクパター
ンの幅を６０(mとすると、エッチング後の溝幅は８５
(m、溝の深さは約４０(mとなった。またＸ軸方向に沿っ
て溝を形成するする場合、マスクパターンの溝幅を７０
(mとした時、エッチング後の溝幅は８３(m、溝の深さは
約４３(mであった。また、エッチング後の溝は水晶の結
晶の特性上深さ方向に楔型状になり、この溝構造は溝の
反対側から力を加えて分離するのに、適した構造になっ
ている。FIG. 1 shows an embodiment according to the present invention. FIG. 1A is a plan view for explaining how the separation groove is formed on a large-sized piezoelectric substrate. A large number of concave portions are formed on one surface of an AT-cut quartz piezoelectric substrate 10 by etching using a photolithography technique. 11 is formed, and the holding annular surrounding portion 12 is formed in the periphery thereof, and grooves 13 and 14 are formed in a lattice shape on the peripheral edge so as to surround the annular surrounding portion 12. The grooves 13 and 14 may be formed by etching at the same time when the recesses are formed, but after the recesses are formed by machining, the grooves 13 and 14 are formed so as to surround the thick peripheral edge portion that holds the recesses. May be constructed by machining in a lattice shape. When the groove is formed by etching, the width and depth of the groove depend on the etching amount and the crystal axis direction. For example, an ultra-thin plate resonator having a resonance frequency of 90 MHz uses a large-sized piezoelectric substrate having a thickness of about 80 (m), and a vibration portion on the bottom surface of the recess has a thickness of about 18 (m). An example of the data on the width and depth of the groove at this time is shown as follows along the axis direction shown in the left corner of FIG.
When forming a groove in the Z′-axis direction, assuming that the width of the groove mask pattern is 60 (m, the groove width after etching is 85
(m, the depth of the groove is about 40 (m. Further, when forming the groove along the X-axis direction, the groove width of the mask pattern is 70
(When m, the groove width after etching was 83 (m, and the depth of the groove was about 43 (m. In addition, the groove after etching was wedge-shaped in the depth direction due to the characteristics of the crystal of quartz. This groove structure is suitable for separating by applying force from the opposite side of the groove.

【００１０】図１（ｂ）は、同図（ａ）のＡ−Ａにおけ
る断面図で凹陥部１１とＺ’軸方向の溝１４を示し、ま
た、図１（ｃ）は同図（ａ）のＢ−Ｂにおける断面図で
凹陥部１１とＸ軸方向の溝１３を示している。さらに、
上記凹陥部１１、環状囲繞部１２および分離用溝１３、
１４を詳しく図示すれば、図１（ｄ）、（ｅ）に示す如
くなり、（ｄ）は平面図、（ｅ）は（ｄ）のＣ−Ｃにお
ける断面図である。図１（ｄ）、（ｅ）において１１は
凹陥部、１２は環状囲繞部、１３はＸ軸方向の分離用
溝、１４はＺ’軸方向の分離用溝、１５は凹陥部の底面
の振動部位を表す。また、１６は凹陥部の対向面の平坦
部にフォトリソグラフィ技術で形成された部分電極、１
７は該部分電極から周縁部に延びた電極リード、１８は
外部端子と電気的導通を図るボンディング用パッドを表
す。図１（ｄ）の凹陥部側の全面にはＡｌの導体膜が蒸
着され電極となっている。同様に図１（ｅ）は（ｄ）の
横断面を表し、圧電基板の厚さおよび電極膜厚を拡大し
て表しており、凹陥部の振動部１５、Ｘ軸方向の溝１
３、部分電極１６及び凹陥部側および凹陥内側壁にもＡ
ｌの導体膜１９が全面に、蒸着等の方法で形成されてい
る。超薄肉の振動部を平坦部の部分電極と凹陥部側の全
面電極で挟んで振動子が構成される。FIG. 1 (b) is a sectional view taken along the line AA in FIG. 1 (a), showing the concave portion 11 and the groove 14 in the Z'-axis direction, and FIG. 1 (c) is the same figure (a). The cross-sectional view taken along the line BB of FIG. 11 shows the recess 11 and the groove 13 in the X-axis direction. further,
The recessed portion 11, the annular surrounding portion 12 and the separation groove 13,
14 is shown in detail in FIGS. 1 (d) and 1 (e), where (d) is a plan view and (e) is a cross-sectional view taken along the line CC of (d). In FIGS. 1D and 1E, 11 is a recessed portion, 12 is an annular surrounding portion, 13 is a separation groove in the X-axis direction, 14 is a separation groove in the Z′-axis direction, and 15 is vibration of the bottom surface of the recessed portion. Indicates a part. Further, 16 is a partial electrode formed by a photolithography technique on the flat portion of the facing surface of the recessed portion, 1
Reference numeral 7 denotes an electrode lead extending from the partial electrode to the peripheral portion, and 18 denotes a bonding pad for electrically connecting with an external terminal. A conductor film of Al is vapor-deposited on the entire surface of the recessed portion side of FIG. 1D to form an electrode. Similarly, FIG. 1E shows the cross section of FIG. 1D in which the thickness of the piezoelectric substrate and the electrode film thickness are enlarged, and the vibrating portion 15 of the concave portion and the groove 1 in the X-axis direction are shown.
3, A also on the partial electrode 16 and the concave side and the concave inner side wall
The conductor film 19 of 1 is formed on the entire surface by a method such as vapor deposition. The vibrator is formed by sandwiching the ultra-thin vibrating portion between the partial electrode on the flat portion and the entire surface electrode on the concave portion side.

【００１１】上記のように、大型圧電基板上に形成され
た超薄板の凹陥部側表面および側壁面の全面に蒸着等の
手法で全面電極を、対向面に部分電極を付着し、周波数
調整した後、上記分離用溝１３、１４の対向面側からカ
ミソリ状のブレードで力を加えれば、容易に個片に分離
することが出来る。本発明の分離法を採用すれば、従来
のダイシングによる切断のように水を使うこともなく、
研削屑が電極部等を汚染する事もない。また機械的歪み
も加わらないため、振動子としての周波数ー温度特性、
エージング等が良くなるのみならず圧電基板の分離工数
が大幅に短縮され、コスト低減にも充分に貢献する。分
離された超薄板振動子の斜視図及び断面図は図３
（ａ）、（ｂ）と同様の構造となるが、若干溝部分に割
り残しが生じる。もし、それが邪魔になる場合は、簡単
に削り落とせばよい。As described above, the entire surface of the recessed portion side surface and the side wall surface of the ultra-thin plate formed on the large-sized piezoelectric substrate is attached with a full surface electrode by a technique such as vapor deposition, and the partial electrode is attached to the opposite surface to adjust the frequency. After that, if a force is applied with a razor blade from the facing surface side of the separation grooves 13 and 14, the pieces can be easily separated into individual pieces. By adopting the separation method of the present invention, there is no need to use water as in the conventional cutting by dicing,
The grinding dust does not contaminate the electrode part or the like. Also, since no mechanical strain is applied, the frequency-temperature characteristics of the oscillator,
Not only is aging improved, the number of steps for separating the piezoelectric substrate is greatly reduced, which contributes to cost reduction. A perspective view and a sectional view of the separated ultra-thin plate vibrator are shown in FIG.
The structure is the same as that of (a) and (b), but some uncut portions are left in the groove portions. If it gets in the way, you can easily scrape it off.

【００１２】なお、図１（ａ）に示す如き分離用溝を構
築すると、大型圧電基板の取り扱いにおいて僅かの衝撃
が加わってだけで該基板の一部が不用意に割れ分離する
場合が考えられ、バッチ処理を本来の流れとする工程に
問題を生じる虞れがある。これを改善する目的でなされ
たのが、図２（ａ）に示す本発明の第二の実施例であ
る。同図は、凹陥部１１、その周辺を保持する環状囲繞
部１２、分離用溝１３、１４を示したもので、この実施
例ではＸ軸方向の溝１３とＺ’方向の溝１４が交叉する
部分にエッチングせず元の圧電板の厚さのまま残した溝
の補強部２０を設けた点が特徴である。図２（ｂ）は、
同（ａ）のＡ−Ａにおける断面図である。１３はＸ軸方
向の分離溝、１４はＺ’軸方向の溝、２０は補強部を表
す。即ち、図１に示す如く分離用溝を連続して構成する
ことなく例えば、Ｘ軸、Ｚ’軸方向の溝が交叉する部分
の溝を除去し、補強部２０を設けた構造とした。当該溝
構造とすれば、基板に加わる衝撃による基板の破損等は
大幅に低減され、大型圧電基板の取り扱いがはるかに容
易になり、実験によってもその効果が確認された。When the separation groove as shown in FIG. 1 (a) is constructed, a part of the substrate may be inadvertently cracked and separated by a slight impact when handling a large piezoelectric substrate. However, there is a possibility that a problem may occur in the process in which batch processing is the original flow. The second embodiment of the present invention shown in FIG. 2 (a) was made to improve this. The figure shows the recessed portion 11, the annular surrounding portion 12 that holds the periphery thereof, and the separation grooves 13 and 14, and in this embodiment, the groove 13 in the X-axis direction and the groove 14 in the Z'direction intersect. It is characterized in that a reinforcing portion 20 of the groove which is not etched and remains in the original thickness of the piezoelectric plate is provided in the portion. 2 (b) is
It is sectional drawing in AA of the same (a). 13 is a separation groove in the X-axis direction, 14 is a groove in the Z′-axis direction, and 20 is a reinforcing portion. That is, the structure is such that, for example, the groove at the intersection of the grooves in the X-axis and Z'-axis directions is removed and the reinforcing portion 20 is provided without continuously forming the separation groove as shown in FIG. With the groove structure, damage to the substrate due to impact applied to the substrate is significantly reduced, handling of a large piezoelectric substrate becomes much easier, and the effect was confirmed by experiments.

【００１３】さらに、本発明に係わる第三の実施例の平
面図を図２（ｃ）に示す。本実施例は図２（ａ）の補強
部付き溝構成を更に改良した別の実施例で、凹陥部の周
辺の環状囲繞部１２を取り囲んで、Ｘ軸に沿った分離用
溝１３およびＺ’軸に沿った分離用溝１４を、格子状に
配置された環状囲繞部１２の角毎に補強部２１を４カ所
設ける構造とし、大型圧電基板を取り扱う際の衝撃によ
る該基板の破損を極力減少させる構造としたものであ
る。大型圧電基板を個片振動子に分離するに際し、溝が
構築されている対向面から溝に沿って、カミソリ状のブ
レードを用い僅かの力を加えるだけで容易に分離するこ
とができる。上記に詳述したように、大型基板にエッチ
ング手法を用いて凹陥状の振動部を形成する際に、本発
明に係わる分離用溝を同時に形成すれば、上記したよう
な振動子の特性改善のみならず工数を大幅に削減でき、
コスト低減に大いに貢献できる。Further, a plan view of the third embodiment according to the present invention is shown in FIG. 2 (c). This embodiment is another embodiment in which the configuration of the groove with a reinforcing portion of FIG. 2A is further improved, and surrounds the annular surrounding portion 12 around the recessed portion, and separates the groove 13 and Z ′ along the X axis. The separation groove 14 along the axis has a structure in which four reinforcing portions 21 are provided at each corner of the annular surrounding portion 12 arranged in a lattice shape, and the damage of the large piezoelectric substrate due to the impact is reduced as much as possible. It has a structure that allows it. When the large piezoelectric substrate is separated into individual oscillators, it can be easily separated from the facing surface where the groove is formed along the groove by using a razor blade and applying a slight force. As described above in detail, when the recessed vibrating portion is formed on the large-sized substrate by using the etching method, if the separation groove according to the present invention is formed at the same time, only the characteristic improvement of the vibrator as described above is achieved. Without a lot of effort,
It can greatly contribute to cost reduction.

【００１４】なお、本発明の実施例としてＡＴカット振
動子を例示したが、これは一例に過ぎず、本発明の実施
に際しては、振動子に限定する必要はなく、例えば超薄
板を用いた高周波二重モードフィルタに適用できること
は当然である。ただ異なる点は凹陥部の底面の振動部に
全面電極を、対向面側の平坦面に所定の間隙を隔して分
割した部分電極を付着するとすると共に、各電極から電
極リードを厚肉の環状囲繞部まで延長し、該環状囲繞部
にボンディング用のパッドを形成し、３端子構成とする
点である。このように構成することによって分割電極上
に対称振動と反対称振動を励起させ、且つ２つのモード
を結合させてフィルタを構成するものである。また圧電
基板も水晶に限定する必要はなくエッチングが可能な圧
電基板、例えばリン酸アルミ（ＡｌＰＯ３）あるいは四
ホウ酸リチウム（Ｌｉ２Ｂ４Ｏ７）の如き圧電材料を用
いて超薄板の圧電デバイスを形成するに当たっても、本
発明が適用できることは自明である。Although the AT-cut oscillator is illustrated as an example of the present invention, this is merely an example, and it is not necessary to limit the oscillator to the practice of the present invention. For example, an ultrathin plate was used. Naturally, it can be applied to a high frequency dual mode filter. The only difference is that the entire surface electrode is attached to the vibrating portion on the bottom surface of the recessed portion, and the partial electrodes divided with a predetermined gap are attached to the flat surface on the opposing surface side. The point is that it extends to the surrounding portion and a pad for bonding is formed on the annular surrounding portion to form a three-terminal structure. With such a configuration, a symmetric vibration and an antisymmetric vibration are excited on the split electrode, and two modes are coupled to form a filter. Further, the piezoelectric substrate is not limited to quartz, and a piezoelectric substrate that can be etched, for example, an ultra-thin piezoelectric device is formed using a piezoelectric material such as aluminum phosphate (AlPO3) or lithium tetraborate (Li2B4O7). However, it is obvious that the present invention can be applied.

【００１５】[0015]

【発明の効果】以上のように本発明によれば、エッチン
グ手法で超薄肉の振動部とそれを保持する厚肉の環状囲
繞部とを一体的に形成すると同時に、厚肉の環状囲繞部
の周囲に溝を構成したので、大型圧電基板より個片振動
子を分離する方法として、従来のダイシングによる分離
法から、該溝の対向面側からブレード状のもので力を加
えることによって、容易に個片振動子に分離できる。従
って、水分や研削屑による電極膜の酸化あるいは劣化を
防止することができ、またダイシングによる機械的歪み
を受けることがないため、振動子の周波数ー温度特性や
周波数エージング特性を大幅に改善することができる。
また、ダイシングによる切断加工時間および洗浄時間に
比べ本発明の溝による分離方法は、フォトリソグラフィ
用マスクが少しく複雑化することのみではるかに効率的
で、コスト低減と歩留まり向上を図る上で著しい効果が
ある。As described above, according to the present invention, the ultra-thin wall vibrating portion and the thick annular surrounding portion holding the vibrating portion are integrally formed by the etching method, and at the same time, the thick annular surrounding portion is formed. Since a groove is formed around the groove, it is easy to separate individual vibrators from a large piezoelectric substrate by applying a blade-like force from the facing surface side of the groove, rather than the conventional dicing separation method. It can be separated into individual vibrators. Therefore, it is possible to prevent the oxidation or deterioration of the electrode film due to moisture or grinding dust, and to avoid mechanical strain due to dicing, so it is possible to greatly improve the frequency-temperature characteristics and frequency aging characteristics of the vibrator. You can
Further, compared with the cutting processing time by dicing and the cleaning time, the separation method by the groove of the present invention is much more efficient only by slightly complicating the photolithographic mask, and is significantly effective in reducing the cost and improving the yield. There is.

【図面の簡単な説明】[Brief description of drawings]

【図１】（ａ）、（ｂ）、（ｃ）、（ｄ）、および
（ｅ）は本発明の一実施例を示す図で、（ａ）は大型圧
電基板上に形成した凹陥部とそれを取り囲む格子状の分
離用溝を表す図、（ｂ）及び（ｃ）は夫々Ｘ軸および
Ｚ’軸方向の断面図、（ｄ）は凹陥部とそれを囲む分離
用溝を拡大した平面図、（ｅ）はその断面図である。1 (a), (b), (c), (d), and (e) are views showing an embodiment of the present invention, wherein (a) shows a recess formed on a large piezoelectric substrate. The figure showing the lattice-shaped separation groove surrounding it, (b) and (c) are cross-sectional views in the X-axis and Z'-axis directions, respectively, and (d) is an enlarged plan view of the recess and the separation groove surrounding it. FIG. 1E is a sectional view thereof.

【図２】（ａ）は本発明の第二の実施例を示す図で、補
強部を付加した分離用溝の構成を示す図、（ｂ）は
（ａ）の断面図、（ｃ）は第三の実施例で補強部を付加
した分離用溝構成を示す図である。2A is a diagram showing a second embodiment of the present invention, showing the structure of a separation groove having a reinforcing portion added thereto, FIG. 2B is a sectional view of FIG. 2A, and FIG. It is a figure which shows the groove | channel structure for separation which added the reinforcement part in 3rd Example.

【図３】（ａ）、（ｂ）、（ｃ）及び（ｄ）は従来の超
薄板振動子を説明する図で、（ａ）は超薄板振動子の斜
視図、（ｂ）は断面図、（ｃ）は大型圧電基板上に超薄
板振動子を形成しダイシングで切断するための案内線を
示した図、（ｄ）はその断面図である。3 (a), (b), (c) and (d) are views for explaining a conventional ultra-thin plate oscillator, (a) is a perspective view of the ultra-thin plate oscillator, and (b) is a diagram. A cross-sectional view, (c) is a view showing a guide line for forming an ultra-thin plate vibrator on a large-sized piezoelectric substrate and cutting it by dicing, and (d) is a cross-sectional view thereof.

【符号の説明】[Explanation of symbols]

１ 水晶板（ブロック） ２、１１ 凹陥部 ３、１２ 環状囲繞部 ４、１５ 振動部 ５、１９ 全面電極 ７、１６ 部分電極 ８、１７ 電極リード ９ ダイシング用案内線 １０ 大型圧電基板 １３、１４ 分離用溝 ２０、２１ 補強部 2 DESCRIPTION OF SYMBOLS 1 Quartz plate (block) 2, 11 Recessed part 3, 12 Annular surrounding part 4, 15 Vibrating part 5, 19 Full surface electrode 7, 16 Partial electrode 8, 17 Electrode lead 9 Dicing guide line 10 Large piezoelectric substrate 13, 14 Separation Grooves 20, 21 Reinforcement part 2

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 バッチ処理手法を用い大型圧電基板上に
複数の圧電デバイスを形成し、該圧電デバイスを個片に
分離する方法において、大型圧電基板に分離用の溝を形
成し、該溝に基づいて分離したことを特徴とする大型圧
電基板の分離方法。1. A method for forming a plurality of piezoelectric devices on a large-sized piezoelectric substrate using a batch processing method and separating the piezoelectric devices into individual pieces, wherein a groove for separation is formed on the large-sized piezoelectric substrate, and the groove is formed in the groove. A method for separating a large piezoelectric substrate, characterized in that it is separated based on the above. 【請求項２】 前記溝をエッチングにより形成したこと
を特徴とする、請求項１の大型圧電基板の分離方法。2. The method for separating a large piezoelectric substrate according to claim 1, wherein the groove is formed by etching. 【請求項３】 前記溝に補強部を設けたことを特徴とす
る、請求項１または２記載の大型圧電基板の分離方法。3. The method for separating a large piezoelectric substrate according to claim 1, wherein a reinforcing portion is provided in the groove. 【請求項４】 前記大型圧電基板がＡＴカット圧電材料
あることを特徴とする、請求項１または２または３記載
の大型圧電基板の分離方法。4. The method for separating a large piezoelectric substrate according to claim 1, 2 or 3, wherein the large piezoelectric substrate is an AT cut piezoelectric material.
JP22758495A 1995-08-11 1995-08-11 Piezoelectric device separation method Expired - Lifetime JP3650437B2 (en)

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JP22758495A JP3650437B2 (en) 1995-08-11 1995-08-11 Piezoelectric device separation method

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JP22758495A JP3650437B2 (en) 1995-08-11 1995-08-11 Piezoelectric device separation method

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JPH0955635A true JPH0955635A (en) 1997-02-25
JP3650437B2 JP3650437B2 (en) 2005-05-18

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